CA2367318C - Filling device and method for filling balls in the apertures of a ball-receiving element - Google Patents

Filling device and method for filling balls in the apertures of a ball-receiving element Download PDF

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Publication number
CA2367318C
CA2367318C CA002367318A CA2367318A CA2367318C CA 2367318 C CA2367318 C CA 2367318C CA 002367318 A CA002367318 A CA 002367318A CA 2367318 A CA2367318 A CA 2367318A CA 2367318 C CA2367318 C CA 2367318C
Authority
CA
Canada
Prior art keywords
ball
filling device
housing
balls
receiving element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CA002367318A
Other languages
English (en)
French (fr)
Other versions
CA2367318A1 (en
Inventor
Francis Bourrieres
Clement Kaiser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Novatec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR9903284A external-priority patent/FR2791046B1/fr
Priority claimed from FR9911349A external-priority patent/FR2798309B1/fr
Application filed by Novatec SA filed Critical Novatec SA
Publication of CA2367318A1 publication Critical patent/CA2367318A1/en
Application granted granted Critical
Publication of CA2367318C publication Critical patent/CA2367318C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/02—Devices for feeding articles or materials to conveyors
    • B65G47/04—Devices for feeding articles or materials to conveyors for feeding articles
    • B65G47/12—Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles
    • B65G47/14—Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles arranging or orientating the articles by mechanical or pneumatic means during feeding
    • B65G47/1407—Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles arranging or orientating the articles by mechanical or pneumatic means during feeding the articles being fed from a container, e.g. a bowl
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01204—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Basic Packing Technique (AREA)
  • Pinball Game Machines (AREA)
  • Pens And Brushes (AREA)
  • Spinning Or Twisting Of Yarns (AREA)
CA002367318A 1999-03-17 2000-03-17 Filling device and method for filling balls in the apertures of a ball-receiving element Expired - Lifetime CA2367318C (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
FR9903284A FR2791046B1 (fr) 1999-03-17 1999-03-17 Procede et dispositif de distribution unitaire de billes solides et identiques sur un substrat par serigraphie
FR99/03284 1999-03-17
FR99/11349 1999-09-10
FR9911349A FR2798309B1 (fr) 1999-09-10 1999-09-10 Dispositif de remplissage de billes des ouvertures d'un masque ou d'un gabarit
PCT/IB2000/000373 WO2000054921A1 (en) 1999-03-17 2000-03-17 Filling device and method for filling balls in the apertures of a ball-receiving element

Publications (2)

Publication Number Publication Date
CA2367318A1 CA2367318A1 (en) 2000-09-21
CA2367318C true CA2367318C (en) 2008-09-09

Family

ID=26234863

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002367318A Expired - Lifetime CA2367318C (en) 1999-03-17 2000-03-17 Filling device and method for filling balls in the apertures of a ball-receiving element

Country Status (8)

Country Link
US (2) US6604673B1 (https=)
EP (1) EP1163080B1 (https=)
JP (2) JP4959056B2 (https=)
AT (1) ATE295244T1 (https=)
CA (1) CA2367318C (https=)
DE (1) DE60020090T2 (https=)
HK (1) HK1043081B (https=)
WO (1) WO2000054921A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106743387A (zh) * 2016-12-17 2017-05-31 大连运明自动化技术有限公司 一种球供料装置

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6268275B1 (en) * 1998-10-08 2001-07-31 Micron Technology, Inc. Method of locating conductive spheres utilizing screen and hopper of solder balls
WO2000054921A1 (en) * 1999-03-17 2000-09-21 Novatec Sa Filling device and method for filling balls in the apertures of a ball-receiving element
US6766938B2 (en) 2002-01-08 2004-07-27 Asm Assembly Automation Ltd. Apparatus and method of placing solder balls onto a substrate
TWI272708B (en) 2002-10-14 2007-02-01 Aurigin Technology Pte Ltd Apparatus and method for filling a ball grid array template
US6769596B1 (en) * 2002-11-15 2004-08-03 Qlogic Corporation Method and system for reworking ball grid arrays
JP3793969B2 (ja) * 2002-12-17 2006-07-05 千住金属工業株式会社 カラム整列装置
KR20040092064A (ko) * 2003-04-24 2004-11-03 (주) 에스에스피 볼그리드어레이 패키지용 솔더볼 안착장치
EP1776004A4 (en) * 2004-08-04 2009-09-02 Ibiden Co Ltd METHOD AND DEVICE FOR ATTACHING A LOT BALL
US8223840B2 (en) * 2005-04-27 2012-07-17 Nec Corporation Image decoding method of decoding hierarchy-encoded image data in respective hierarchies, and a device thereof
JP4560682B2 (ja) 2005-04-28 2010-10-13 澁谷工業株式会社 導電性ボール搭載装置
DE102007019568B4 (de) * 2006-04-28 2015-08-13 Shibuya Kogyo Co., Ltd. Leitkugel-Anordnungsvorrichtung
JP4503053B2 (ja) * 2007-07-24 2010-07-14 新光電気工業株式会社 導電性ボールの搭載装置および搭載方法
WO2009102281A1 (en) * 2008-02-14 2009-08-20 Aurigin Technology Pte Ltd Apparatus and method for solder ball filing
JP2010050410A (ja) * 2008-08-25 2010-03-04 Shibuya Kogyo Co Ltd 微小ボール配列装置
JP2010225680A (ja) * 2009-03-19 2010-10-07 Panasonic Corp 半田ボール搭載装置及び半田ボール搭載方法
KR101128645B1 (ko) * 2010-07-01 2012-03-26 삼성전기주식회사 솔더 볼 실장용 마스크 프레임 장치
KR101508039B1 (ko) * 2012-05-17 2015-04-06 삼성전기주식회사 솔더볼 공급장치
KR102034820B1 (ko) * 2012-11-30 2019-11-08 삼성전자주식회사 반도체 칩 실장장치 및 이를 이용한 반도체 칩의 실장방법
CN103287844B (zh) * 2013-06-03 2016-05-11 无锡明珠钢球有限公司 一种钢球上料机
JP2015073032A (ja) * 2013-10-03 2015-04-16 株式会社日立製作所 電極形成装置及び電極形成方法
US9120170B2 (en) * 2013-11-01 2015-09-01 Zen Voce Corporation Apparatus and method for placing and mounting solder balls on an integrated circuit substrate
CN103971771B (zh) * 2014-01-03 2016-07-06 中国科学院上海应用物理研究所 用于球床反应堆燃料球的装载装置及装载方法
KR102307528B1 (ko) * 2014-07-21 2021-10-05 삼성전자주식회사 솔더 볼 흡착 장치
WO2016181502A1 (ja) * 2015-05-12 2016-11-17 富士機械製造株式会社 はんだボール供給装置
FR3043995B1 (fr) * 2015-11-19 2017-12-22 Imv Tech Dispositif d'alimentation et de positionnement de paillettes de conditionnement de semence animale et installation de traitement comportant un tel dispositif
US10369648B2 (en) * 2017-01-13 2019-08-06 Horng Terng Automation Co., Ltd. Guiding board for a ball placement machine
DE102017121560A1 (de) * 2017-09-18 2019-03-21 Nils Dickfeld Aufgabeeinrichtung zur Aufgabe von Produkten auf ein Förderband
JP2022514137A (ja) * 2018-09-28 2022-02-10 ボストン プロセス テクノロジーズ，インコーポレイテッド 複数のモジュールチップ製造構成
KR102078936B1 (ko) * 2018-11-07 2020-02-19 주식회사 프로텍 도전성 볼 탑재 방법
KR102078935B1 (ko) * 2018-11-07 2020-02-19 주식회사 프로텍 도전성 볼 탑재 장치
US11247285B1 (en) * 2020-04-03 2022-02-15 Seagate Technology Llc Fluidization of agglomerated solder microspheres
CN113829017B (zh) * 2021-08-31 2023-04-25 歌尔股份有限公司 投料工装和组装设备
CN119694907B (zh) * 2025-02-24 2025-05-23 湖南健坤精密科技有限公司 一种植球机

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3534964A (en) * 1968-12-09 1970-10-20 Charles W Guill Mixing and dispensing marble game
JPS503280U (https=) * 1973-05-10 1975-01-14
US4487370A (en) * 1981-07-15 1984-12-11 Speicher Paul L Seed and fertilizer spreader
JPS5922391A (ja) 1982-07-29 1984-02-04 東京生産技研株式会社 プリント基板のハンダ付け方法およびその装置
US4611555A (en) * 1983-03-29 1986-09-16 Burford Corp. Spreader for particulate material
JPS60122726U (ja) * 1984-01-26 1985-08-19 株式会社　協豊製作所 球状部材供給装置
EP0263221A1 (en) 1986-10-08 1988-04-13 International Business Machines Corporation Method of forming solder bumps on metal contact pads of a substrate
JPH0243818U (https=) * 1988-09-19 1990-03-27
US5279045A (en) * 1990-01-31 1994-01-18 Hitachi, Ltd. Minute particle loading method and apparatus
GB9024731D0 (en) * 1990-11-14 1991-01-02 Giles Alan F Particle weighing apparatus and method
US5088639A (en) * 1991-01-25 1992-02-18 Motorola, Inc. Soldering process
SG54297A1 (en) 1992-09-15 1998-11-16 Texas Instruments Inc Ball contact for flip-chip devices
DE4239224C1 (de) * 1992-11-21 1994-03-03 Ibm Verfahren und Vorrichtung zur Erfassung von strukturellen Veränderungen in festen Körpern
JPH0828583B2 (ja) 1992-12-23 1996-03-21 インターナショナル・ビジネス・マシーンズ・コーポレイション 多層プリント回路基板およびその製作方法、およびボール・ディスペンサ
JPH0675747U (ja) * 1993-04-09 1994-10-25 オリンパス光学工業株式会社 ハンダ印刷用スキージ
DE4320055A1 (de) * 1993-06-17 1994-12-22 Ghassem Dipl Ing Azdasht Belötungsvorrichtung
US5431332A (en) 1994-02-07 1995-07-11 Motorola, Inc. Method and apparatus for solder sphere placement using an air knife
TW250620B (en) 1994-05-31 1995-07-01 At & T Corp Method for interconnecting an electronic device using a transferable soldercarrying medium
US5861323A (en) * 1994-06-06 1999-01-19 Microfab Technologies, Inc. Process for manufacturing metal ball electrodes for a semiconductor device
US5539153A (en) 1994-08-08 1996-07-23 Hewlett-Packard Company Method of bumping substrates by contained paste deposition
JP3528264B2 (ja) * 1994-08-19 2004-05-17 ソニー株式会社 ソルダーボールのマウント装置
US5655704A (en) * 1994-08-30 1997-08-12 Matsushita Electric Industrial Co., Ltd. Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component
JP3271482B2 (ja) * 1994-08-30 2002-04-02 松下電器産業株式会社 半田ボール搭載装置及び半田ボール搭載方法
JP3013528U (ja) * 1995-01-09 1995-07-18 ミスズエフエイ 株式会社 ボール・グリッド・アレイ供給装置
JPH08236916A (ja) * 1995-03-01 1996-09-13 Fujitsu Ltd 半田ボール搭載方法及び装置
JPH08300613A (ja) * 1995-05-12 1996-11-19 Nec Corp 半田ボール印刷装置及び半田ボール印刷方法
JP3371182B2 (ja) * 1995-07-13 2003-01-27 ソニー株式会社 ソルダーボールの補給装置
JP2744940B2 (ja) * 1995-10-11 1998-04-28 有限会社山口電子研究所 球体払出し装置
JPH09162533A (ja) * 1995-12-04 1997-06-20 Sony Corp はんだ供給装置
JPH10126048A (ja) * 1996-10-23 1998-05-15 Seiko Seiki Co Ltd 半田ボール処理システム
JP3053168B2 (ja) 1996-11-07 2000-06-19 河村電器産業株式会社 キャビネットラック
JP3803439B2 (ja) * 1996-11-27 2006-08-02 松下電器産業株式会社 導電性ボールの搭載装置および搭載方法
JPH10211688A (ja) * 1997-01-30 1998-08-11 Matsushita Electric Ind Co Ltd スクリーン印刷装置と印刷方法
JP3039412B2 (ja) * 1997-01-31 2000-05-08 株式会社日立製作所 半導体装置の製造装置
JPH10229090A (ja) * 1997-02-14 1998-08-25 Ricoh Co Ltd 粒子配列装置
JP3255071B2 (ja) * 1997-02-19 2002-02-12 松下電器産業株式会社 導電性ボールの半田付け用フラックスの塗布装置
US5918792A (en) 1997-04-04 1999-07-06 Rvsi Vanguard, Inc. Apparatus and method for filling a ball grid array
US6003753A (en) * 1997-07-14 1999-12-21 Motorola, Inc. Air-blow solder ball loading system for micro ball grid arrays
JPH1143218A (ja) * 1997-07-25 1999-02-16 Nec Corp 部品整列装置
DE19838532B4 (de) 1997-08-28 2005-09-22 Pac Tech - Packaging Technologies Gmbh Verfahren und Vorrichtung zum Plazieren und Umschmelzen von Lotmaterialformstücken
IT1296027B1 (it) 1997-09-10 1999-06-04 Sgs Thomson Microelectronics Sistema di disposizione di uno schieramento ordinato di sfere di lega eutectica di saldatura su una scheda-supporto di un circuito
US6182356B1 (en) * 1997-11-24 2001-02-06 International Business Machines Corporation Apparatus for solder ball mold loading
US6253992B1 (en) * 1998-03-18 2001-07-03 Tessera, Inc. Solder ball placement fixtures and methods
FR2798309B1 (fr) * 1999-09-10 2001-11-09 Novatec Sa Soc Dispositif de remplissage de billes des ouvertures d'un masque ou d'un gabarit
WO2000054921A1 (en) * 1999-03-17 2000-09-21 Novatec Sa Filling device and method for filling balls in the apertures of a ball-receiving element
FR2791046B1 (fr) * 1999-03-17 2001-05-11 Novatec Sa Soc Procede et dispositif de distribution unitaire de billes solides et identiques sur un substrat par serigraphie
US6386433B1 (en) * 1999-08-24 2002-05-14 Kulicke & Soffa Investments, Inc. Solder ball delivery and reflow apparatus and method
US6227437B1 (en) * 1999-08-24 2001-05-08 Kulicke & Soffa Industries Inc. Solder ball delivery and reflow apparatus and method of using the same
JP3296343B2 (ja) * 1999-09-27 2002-06-24 株式会社日立製作所 半導体装置の製造方法及び装置
US6336581B1 (en) * 2000-06-19 2002-01-08 International Business Machines Corporation Solder ball connection device and capillary tube thereof
US6830175B2 (en) * 2003-02-05 2004-12-14 Carl T. Ito Solder ball dispenser

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106743387A (zh) * 2016-12-17 2017-05-31 大连运明自动化技术有限公司 一种球供料装置

Also Published As

Publication number Publication date
EP1163080A1 (en) 2001-12-19
ATE295244T1 (de) 2005-05-15
DE60020090T2 (de) 2006-01-19
EP1163080B1 (en) 2005-05-11
JP2002538970A (ja) 2002-11-19
WO2000054921A1 (en) 2000-09-21
JP4959056B2 (ja) 2012-06-20
US7455209B2 (en) 2008-11-25
JP2011109107A (ja) 2011-06-02
HK1043081B (en) 2005-10-07
HK1043081A1 (en) 2002-09-06
US6604673B1 (en) 2003-08-12
US20040035908A1 (en) 2004-02-26
DE60020090D1 (de) 2005-06-16
CA2367318A1 (en) 2000-09-21

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