FR2798309B1 - Dispositif de remplissage de billes des ouvertures d'un masque ou d'un gabarit - Google Patents

Dispositif de remplissage de billes des ouvertures d'un masque ou d'un gabarit

Info

Publication number
FR2798309B1
FR2798309B1 FR9911349A FR9911349A FR2798309B1 FR 2798309 B1 FR2798309 B1 FR 2798309B1 FR 9911349 A FR9911349 A FR 9911349A FR 9911349 A FR9911349 A FR 9911349A FR 2798309 B1 FR2798309 B1 FR 2798309B1
Authority
FR
France
Prior art keywords
template
mask
openings
filling balls
balls
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9911349A
Other languages
English (en)
Other versions
FR2798309A1 (fr
Inventor
Francis Bourrieres
Clement Kaiser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novatec SA
Original Assignee
Novatec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR9911349A priority Critical patent/FR2798309B1/fr
Application filed by Novatec SA filed Critical Novatec SA
Priority to EP00911179A priority patent/EP1163080B1/fr
Priority to US09/936,734 priority patent/US6604673B1/en
Priority to JP2000604982A priority patent/JP4959056B2/ja
Priority to PCT/IB2000/000373 priority patent/WO2000054921A1/fr
Priority to AT00911179T priority patent/ATE295244T1/de
Priority to DE60020090T priority patent/DE60020090T2/de
Priority to CA002367318A priority patent/CA2367318C/fr
Publication of FR2798309A1 publication Critical patent/FR2798309A1/fr
Application granted granted Critical
Publication of FR2798309B1 publication Critical patent/FR2798309B1/fr
Priority to HK02104472.7A priority patent/HK1043081B/zh
Priority to US10/637,497 priority patent/US7455209B2/en
Priority to JP2010259559A priority patent/JP2011109107A/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR9911349A 1999-03-17 1999-09-10 Dispositif de remplissage de billes des ouvertures d'un masque ou d'un gabarit Expired - Lifetime FR2798309B1 (fr)

Priority Applications (11)

Application Number Priority Date Filing Date Title
FR9911349A FR2798309B1 (fr) 1999-09-10 1999-09-10 Dispositif de remplissage de billes des ouvertures d'un masque ou d'un gabarit
CA002367318A CA2367318C (fr) 1999-03-17 2000-03-17 Dispositif de remplissage et procede de remplissage de boules dans les ouvertures d'un element recepteur de boules
JP2000604982A JP4959056B2 (ja) 1999-03-17 2000-03-17 ボールをボール受容要素中のアパーチャに充填するための充填デバイスおよび方法
PCT/IB2000/000373 WO2000054921A1 (fr) 1999-03-17 2000-03-17 Dispositif de remplissage et procede de remplissage de boules dans les ouvertures d'un element recepteur de boules
AT00911179T ATE295244T1 (de) 1999-03-17 2000-03-17 Verfahren und vorrichtung zum auftragen von kugeln in die öffnungen eines kugelbehälters
DE60020090T DE60020090T2 (de) 1999-03-17 2000-03-17 Verfahren und vorrichtung zum auftragen von kugeln in die öffnungen eines kugelbehälters
EP00911179A EP1163080B1 (fr) 1999-03-17 2000-03-17 Dispositif de remplissage et procede de remplissage de boules dans les ouvertures d'un element recepteur de boules
US09/936,734 US6604673B1 (en) 1999-03-17 2000-03-17 Filling device and method for filling balls in the apertures of a ball-receiving element
HK02104472.7A HK1043081B (zh) 1999-03-17 2002-06-17 一種使球狀物注入接收球狀物構件之開孔的注入裝置及方法
US10/637,497 US7455209B2 (en) 1999-03-17 2003-08-11 Filling device and method for filling balls in the apertures of a ball-receiving element
JP2010259559A JP2011109107A (ja) 1999-03-17 2010-11-19 ボールをボール受容要素中のアパーチャに充填するための充填デバイスおよび方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9911349A FR2798309B1 (fr) 1999-09-10 1999-09-10 Dispositif de remplissage de billes des ouvertures d'un masque ou d'un gabarit

Publications (2)

Publication Number Publication Date
FR2798309A1 FR2798309A1 (fr) 2001-03-16
FR2798309B1 true FR2798309B1 (fr) 2001-11-09

Family

ID=9549724

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9911349A Expired - Lifetime FR2798309B1 (fr) 1999-03-17 1999-09-10 Dispositif de remplissage de billes des ouvertures d'un masque ou d'un gabarit

Country Status (1)

Country Link
FR (1) FR2798309B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4959056B2 (ja) * 1999-03-17 2012-06-20 ノバテック エスア ボールをボール受容要素中のアパーチャに充填するための充填デバイスおよび方法
JP4560682B2 (ja) 2005-04-28 2010-10-13 澁谷工業株式会社 導電性ボール搭載装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58168880A (ja) * 1982-03-30 1983-10-05 株式会社栗本鉄工所 伝導受熱型撹拌乾燥機
US5861323A (en) * 1994-06-06 1999-01-19 Microfab Technologies, Inc. Process for manufacturing metal ball electrodes for a semiconductor device
DE19838532B4 (de) * 1997-08-28 2005-09-22 Pac Tech - Packaging Technologies Gmbh Verfahren und Vorrichtung zum Plazieren und Umschmelzen von Lotmaterialformstücken

Also Published As

Publication number Publication date
FR2798309A1 (fr) 2001-03-16

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