AU2003254227A1 - Integrated circuit devices and methods and apparatuses for designing integrated circuit devices - Google Patents

Integrated circuit devices and methods and apparatuses for designing integrated circuit devices

Info

Publication number
AU2003254227A1
AU2003254227A1 AU2003254227A AU2003254227A AU2003254227A1 AU 2003254227 A1 AU2003254227 A1 AU 2003254227A1 AU 2003254227 A AU2003254227 A AU 2003254227A AU 2003254227 A AU2003254227 A AU 2003254227A AU 2003254227 A1 AU2003254227 A1 AU 2003254227A1
Authority
AU
Australia
Prior art keywords
integrated circuit
circuit devices
apparatuses
methods
designing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003254227A
Other languages
English (en)
Other versions
AU2003254227A8 (en
Inventor
Kenneth S. Mcelvain
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Synplicity LLC
Original Assignee
Synplicity LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Synplicity LLC filed Critical Synplicity LLC
Publication of AU2003254227A8 publication Critical patent/AU2003254227A8/xx
Publication of AU2003254227A1 publication Critical patent/AU2003254227A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/394—Routing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/423—Shielding layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
AU2003254227A 2002-07-29 2003-07-24 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices Abandoned AU2003254227A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US39976002P 2002-07-29 2002-07-29
US60/399,760 2002-07-29
PCT/US2003/023559 WO2004012107A2 (en) 2002-07-29 2003-07-24 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices

Publications (2)

Publication Number Publication Date
AU2003254227A8 AU2003254227A8 (en) 2004-02-16
AU2003254227A1 true AU2003254227A1 (en) 2004-02-16

Family

ID=31188615

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003254227A Abandoned AU2003254227A1 (en) 2002-07-29 2003-07-24 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices

Country Status (6)

Country Link
US (3) US7943436B2 (https=)
EP (1) EP1546946A2 (https=)
JP (1) JP5281731B2 (https=)
KR (4) KR101160857B1 (https=)
AU (1) AU2003254227A1 (https=)
WO (1) WO2004012107A2 (https=)

Families Citing this family (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7943436B2 (en) 2002-07-29 2011-05-17 Synopsys, Inc. Integrated circuit devices and methods and apparatuses for designing integrated circuit devices
US7739624B2 (en) * 2002-07-29 2010-06-15 Synopsys, Inc. Methods and apparatuses to generate a shielding mesh for integrated circuit devices
US7197738B1 (en) * 2002-08-09 2007-03-27 Cadence Design Systems, Inc. Method and apparatus for routing
US7624367B2 (en) 2002-11-18 2009-11-24 Cadence Design Systems, Inc. Method and system for routing
US7480885B2 (en) * 2002-11-18 2009-01-20 Cadence Design Systems, Inc. Method and apparatus for routing with independent goals on different layers
JP3781736B2 (ja) * 2003-05-09 2006-05-31 ローム株式会社 半導体装置及びこれを用いたオーディオ機器
US7131084B2 (en) * 2003-12-09 2006-10-31 International Business Machines Corporation Method, apparatus and computer program product for implementing automated detection excess aggressor shape capacitance coupling in printed circuit board layouts
US7448012B1 (en) 2004-04-21 2008-11-04 Qi-De Qian Methods and system for improving integrated circuit layout
JP2005347591A (ja) * 2004-06-04 2005-12-15 Matsushita Electric Ind Co Ltd スタンダードセル、スタンダードセル方式の半導体集積回路装置および半導体集積回路装置のレイアウト設計方法
US7571408B1 (en) * 2005-03-09 2009-08-04 Cadence Design Systems, Inc. Methods and apparatus for diagonal route shielding
US7472368B2 (en) * 2005-03-24 2008-12-30 International Business Machines Corporation Method for implementing vertically coupled noise control through a mesh plane in an electronic package design
US7472366B1 (en) * 2005-08-01 2008-12-30 Cadence Design Systems, Inc. Method and apparatus for performing a path search
US7694258B1 (en) 2005-08-01 2010-04-06 Cadence Design Systems, Inc. Method and apparatus for inserting metal fill in an integrated circuit (“IC”) layout
US7299446B2 (en) * 2005-08-16 2007-11-20 Lsi Corporation Enabling efficient design reuse in platform ASICs
JP2007194496A (ja) 2006-01-20 2007-08-02 Toshiba Corp 半導体集積回路
US8368676B2 (en) * 2007-05-18 2013-02-05 Sharp Kabushiki Kaisha Display device with light shield
JP5073741B2 (ja) * 2007-05-18 2012-11-14 シャープ株式会社 表示装置
US8309901B2 (en) * 2007-05-18 2012-11-13 Sharp Kabushiki Kaisha Display device adjusting luminance of display based at least on detections by ambient light sensors
JP2009054760A (ja) * 2007-08-27 2009-03-12 Nec Electronics Corp 半導体装置、配線設計方法、配線設計装置、及びプログラム
JP2009123993A (ja) * 2007-11-16 2009-06-04 Nec Electronics Corp 半導体集積回路装置
JP2009231513A (ja) * 2008-03-21 2009-10-08 Elpida Memory Inc 半導体装置
JP2009245961A (ja) * 2008-03-28 2009-10-22 Nec Electronics Corp 半導体集積回路
JP5350681B2 (ja) * 2008-06-03 2013-11-27 ルネサスエレクトロニクス株式会社 半導体装置
US8566776B2 (en) * 2008-11-13 2013-10-22 Qualcomm Incorporated Method to automatically add power line in channel between macros
JP2011100989A (ja) * 2009-10-09 2011-05-19 Renesas Electronics Corp 半導体装置
US8288657B2 (en) * 2009-10-12 2012-10-16 International Business Machines Corporation Noise coupling reduction and impedance discontinuity control in high-speed ceramic modules
JP6066542B2 (ja) 2010-11-18 2017-01-25 ピーエスフォー ルクスコ エスエイアールエルＰＳ４ Ｌｕｘｃｏ Ｓ．ａ．ｒ．ｌ． 半導体装置
US8927879B2 (en) * 2010-11-22 2015-01-06 International Business Machines Corporation Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures
JP5603768B2 (ja) * 2010-12-28 2014-10-08 株式会社東芝 半導体集積回路の配線方法、半導体回路配線装置および半導体集積回路
US8847393B2 (en) * 2011-02-28 2014-09-30 Freescale Semiconductor, Inc. Vias between conductive layers to improve reliability
KR101128063B1 (ko) 2011-05-03 2012-04-23 테세라, 인코포레이티드 캡슐화 층의 표면에 와이어 본드를 구비하는 패키지 적층형 어셈블리
US8423940B2 (en) * 2011-08-15 2013-04-16 International Business Machines Corporation Early noise detection and noise aware routing in circuit design
US8404520B1 (en) 2011-10-17 2013-03-26 Invensas Corporation Package-on-package assembly with wire bond vias
US8832632B1 (en) * 2011-10-27 2014-09-09 Synopsys Taiwan Co., LTD. Compact routing
JP6015018B2 (ja) * 2012-02-07 2016-10-26 株式会社リコー 製品全体エレキ仕様の編集・検証システム
US8601425B2 (en) * 2012-04-12 2013-12-03 International Business Machines Corporation Solving congestion using net grouping
US9003349B1 (en) 2013-06-28 2015-04-07 Cadence Design Systems, Inc. Methods, systems, and articles of manufacture for implementing a physical electronic design with area-bounded tracks
US8984465B1 (en) 2013-06-28 2015-03-17 Cadence Design Systems, Inc. Methods, systems, and articles of manufacture for automatically assigning track patterns to regions for physical implementation of an electronic design
US9251299B1 (en) 2013-06-28 2016-02-02 Cadence Design Systems, Inc. Methods, systems, and articles of manufacture for associating track patterns with rules for electronic designs
US9117052B1 (en) 2012-04-12 2015-08-25 Cadence Design Systems, Inc. Methods, systems, and articles of manufacture for interactively implementing physical electronic designs with track patterns
US8835228B2 (en) 2012-05-22 2014-09-16 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US8964453B2 (en) 2012-06-28 2015-02-24 Synopsys, Inc. SRAM layouts
US9213793B1 (en) 2012-08-31 2015-12-15 Cadence Design Systems, Inc. Methods, systems, and articles of manufacture for implementing electronic designs using flexible routing tracks
US9104830B1 (en) * 2013-06-28 2015-08-11 Cadence Design Systems, Inc. Methods, systems, and articles of manufacture for assigning track patterns to regions of an electronic design
US8949761B2 (en) * 2012-11-30 2015-02-03 International Business Machines Corporation Techniques for routing signal wires in an integrated circuit design
US8866306B2 (en) * 2013-01-02 2014-10-21 International Business Machines Corporation Signal path and method of manufacturing a multiple-patterned semiconductor device
US9026973B2 (en) * 2013-03-14 2015-05-05 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for arbitrary metal spacing for self-aligned double patterning
US8843869B1 (en) * 2013-03-15 2014-09-23 Globalfoundries Inc. Via insertion in integrated circuit (IC) designs
US9190392B1 (en) * 2013-05-20 2015-11-17 Sandia Corporation Three-dimensional stacked structured ASIC devices and methods of fabrication thereof
US9165103B1 (en) 2013-06-28 2015-10-20 Cadence Design Systems, Inc. Methods, systems, and articles of manufacture for tessellating and labeling routing space for routing electronic designs
US9167710B2 (en) 2013-08-07 2015-10-20 Invensas Corporation Embedded packaging with preformed vias
US9583456B2 (en) 2013-11-22 2017-02-28 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US20150186586A1 (en) * 2013-12-30 2015-07-02 Samsung Electronics Co., Ltd. Integrated circuit layouts and methods to improve performance
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
JP2016012903A (ja) 2014-06-02 2016-01-21 ソニー株式会社 撮像素子、撮像方法、および電子機器
JP6384210B2 (ja) * 2014-09-02 2018-09-05 株式会社ソシオネクスト 半導体装置
US11239154B2 (en) 2015-01-20 2022-02-01 Taiwan Semiconductor Manufacturing Company Ltd. Fishbone structure enhancing spacing with adjacent conductive line in power network
US9490222B1 (en) 2015-10-12 2016-11-08 Invensas Corporation Wire bond wires for interference shielding
US10002100B2 (en) * 2016-02-02 2018-06-19 Xilinx, Inc. Active-by-active programmable device
US10042806B2 (en) * 2016-02-02 2018-08-07 Xilinx, Inc. System-level interconnect ring for a programmable integrated circuit
WO2017139241A1 (en) 2016-02-08 2017-08-17 Chaologix, Inc. Side channel aware automatic place and route
JP6599813B2 (ja) 2016-04-12 2019-10-30 三重富士通セミコンダクター株式会社 半導体集積回路及び半導体集積回路の設計方法
US10516396B2 (en) * 2016-04-29 2019-12-24 University Of Florida Research Foundation, Incorporated Overlay architecture for programming FPGAs
US9754872B1 (en) 2016-05-16 2017-09-05 Micron Technology, Inc. Assemblies having shield lines of an upper wiring level electrically coupled with shield lines of a lower wiring level
US10304771B2 (en) 2017-03-10 2019-05-28 Micron Technology, Inc. Assemblies having shield lines of an upper wiring layer electrically coupled with shield lines of a lower wiring layer
KR102105785B1 (ko) * 2016-05-16 2020-06-29 마이크론 테크놀로지, 인크 하측 배선 레벨의 실드 라인에 전기적으로 결합된 상측 배선 레벨의 실드 라인을 갖는 어셈블리
KR102636095B1 (ko) * 2016-12-16 2024-02-13 삼성전자주식회사 쿼드러플 패터닝 리소그래피를 위한 집적 회로, 상기 집적 회로의 설계를 위한 컴퓨팅 시스템 및 컴퓨터 구현 방법
US10923425B2 (en) * 2017-01-20 2021-02-16 Arm Limited Power distribution
US10417371B2 (en) * 2017-01-27 2019-09-17 Arm Limited Power grid healing techniques
US10438636B2 (en) * 2017-12-07 2019-10-08 Advanced Micro Devices, Inc. Capacitive structure for memory write assist
US10943045B2 (en) 2018-01-31 2021-03-09 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device including standard-cell-adapted power grid arrangement and method for generating layout diagram of same
JP2020043219A (ja) * 2018-09-11 2020-03-19 ソニーセミコンダクタソリューションズ株式会社 回路基板、半導体装置、および、電子機器
US11074390B2 (en) 2018-09-28 2021-07-27 Taiwan Semiconductor Manufacturing Company Ltd. Method of designing an integrated circuit and integrated circuit
CN109543309B (zh) * 2018-11-23 2023-01-06 珠海一微半导体股份有限公司 一种基于版图关键信号的干扰排查方法
US11011459B1 (en) * 2020-02-06 2021-05-18 Qualcomm Incorporated Back-end-of-line (BEOL) on-chip sensor
KR102878480B1 (ko) 2020-10-27 2025-10-30 삼성전자주식회사 클럭 트리의 배치 방법, 집적 회로 및 집적 회로의 설계 방법
US11182530B1 (en) 2020-11-03 2021-11-23 Dialog Semiconductor (Uk) Limited Automatic routing system workflow
US11921559B2 (en) * 2021-05-03 2024-03-05 Groq, Inc. Power grid distribution for tensor streaming processors
KR102459919B1 (ko) 2022-05-04 2022-10-27 주식회사 송산특수엘리베이터 출입문이 탑승카 진행방향과 직각으로 구비된 경사형 엘리베이터의 도어 개폐 및 잠금장치
KR102640248B1 (ko) * 2023-06-16 2024-02-27 주식회사 하이퍼엑셀 생성형 거대 인공지능 모델의 효율적인 하드웨어 매핑을 위한 방법 및 시스템
CN117172193B (zh) * 2023-10-19 2024-09-24 合芯科技(苏州)有限公司 标准单元金属层的版图结构及其设计方法

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2940593A1 (de) 1979-10-06 1981-04-16 Ibm Deutschland Gmbh, 7000 Stuttgart Mehrlagen-modul mit konstantem wellenwiderstand
JPS61129847A (ja) 1984-11-29 1986-06-17 Toshiba Corp 半導体装置の金属配線パタ−ン形成方法
JPH01152642A (ja) 1987-12-09 1989-06-15 Nec Corp 半導体集積回路
JPH07105445B2 (ja) 1988-08-15 1995-11-13 株式会社東芝 集積回路の配線構造
JP2580301B2 (ja) 1988-12-27 1997-02-12 株式会社日立製作所 半導体集積回路装置
JPH03120743A (ja) 1989-10-03 1991-05-22 Nec Corp 半導体装置
JPH03120743U (https=) 1990-03-23 1991-12-11
KR940008132B1 (ko) 1991-11-28 1994-09-03 삼성전자 주식회사 신호선간의 잡음을 억제하는 메모리 소자
US5288949A (en) 1992-02-03 1994-02-22 Ncr Corporation Connection system for integrated circuits which reduces cross-talk
CA2154156C (en) * 1993-02-02 2005-04-26 Edward D. Suski A circuit board arrangement including shielding grids, and constructing thereof
US5410107A (en) 1993-03-01 1995-04-25 The Board Of Trustees Of The University Of Arkansas Multichip module
US5723908A (en) 1993-03-11 1998-03-03 Kabushiki Kaisha Toshiba Multilayer wiring structure
JPH06291256A (ja) 1993-04-01 1994-10-18 Nec Ic Microcomput Syst Ltd 半導体集積回路
US5334800A (en) * 1993-07-21 1994-08-02 Parlex Corporation Flexible shielded circuit board
JP2921463B2 (ja) * 1996-01-30 1999-07-19 日本電気株式会社 半導体集積回路チップ
TW399319B (en) 1997-03-19 2000-07-21 Hitachi Ltd Semiconductor device
JP3687041B2 (ja) 1997-04-16 2005-08-24 大日本印刷株式会社 配線基板、配線基板の製造方法、および半導体パッケージ
JP4109340B2 (ja) 1997-12-26 2008-07-02 株式会社ルネサステクノロジ 半導体集積回路装置
DK0970386T3 (da) * 1998-01-23 2006-11-13 Tokyo Electron Ltd Impedans-til-spænding-konverter
US5999440A (en) 1998-03-30 1999-12-07 Lsi Logic Corporation Embedded DRAM with noise-protecting substrate isolation well
US6180998B1 (en) * 1998-03-30 2001-01-30 Lsi Logic Corporation DRAM with built-in noise protection
US6218631B1 (en) * 1998-05-13 2001-04-17 International Business Machines Corporation Structure for reducing cross-talk in VLSI circuits and method of making same using filled channels to minimize cross-talk
TW462214B (en) 1999-07-14 2001-11-01 Mitac Int Corp A method and structure of four layer circuit board improving circuit performance and avoiding electromagnetic interference
JP3398693B2 (ja) 1999-08-24 2003-04-21 エヌイーシーマイクロシステム株式会社 半導体記憶装置
JP2001093982A (ja) * 1999-09-22 2001-04-06 Hitachi Ltd 配線容量計算方法、クロストークディレイ計算方法、およびそれらのデータを記憶したコンピュータ読み取り可能な記憶媒体
JP2001127162A (ja) 1999-10-25 2001-05-11 Matsushita Electric Ind Co Ltd 半導体集積回路
US6510545B1 (en) 2000-01-19 2003-01-21 Sun Microsystems, Inc. Automated shielding algorithm for dynamic circuits
JP2001345385A (ja) * 2000-06-02 2001-12-14 Nec Corp 半導体集積回路の配線方法
JP4558172B2 (ja) * 2000-10-16 2010-10-06 ルネサスエレクトロニクス株式会社 消費電力低減回路
US6750396B2 (en) 2000-12-15 2004-06-15 Di/Dt, Inc. I-channel surface-mount connector
JP4083977B2 (ja) 2000-12-20 2008-04-30 富士通株式会社 半導体集積回路及び配線決定方法
US6426890B1 (en) * 2001-01-26 2002-07-30 International Business Machines Corporation Shared ground SRAM cell
US6622294B2 (en) 2001-09-28 2003-09-16 Intel Corporation Adaptive power routing and shield sharing to reduce shield count
JP3842111B2 (ja) 2001-11-13 2006-11-08 富士通株式会社 半導体装置及びその製造方法
US6650010B2 (en) 2002-02-15 2003-11-18 International Business Machines Corporation Unique feature design enabling structural integrity for advanced low K semiconductor chips
EP1339082A1 (en) 2002-02-25 2003-08-27 Asahi Glass Company Ltd. Impact-resistant film for flat display panel, and flat display panel
US6734472B2 (en) * 2002-04-25 2004-05-11 Synplicity, Inc. Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device
US7943436B2 (en) * 2002-07-29 2011-05-17 Synopsys, Inc. Integrated circuit devices and methods and apparatuses for designing integrated circuit devices
US7409662B1 (en) 2008-02-19 2008-08-05 International Business Machines Corporation Systems and methods involving designing shielding profiles for integrated circuits

Also Published As

Publication number Publication date
KR101100049B1 (ko) 2011-12-29
KR20110119712A (ko) 2011-11-02
AU2003254227A8 (en) 2004-02-16
KR20050048594A (ko) 2005-05-24
US20110214100A1 (en) 2011-09-01
US7943436B2 (en) 2011-05-17
EP1546946A2 (en) 2005-06-29
KR20100112636A (ko) 2010-10-19
JP2005535118A (ja) 2005-11-17
KR101278434B1 (ko) 2013-06-24
KR101160857B1 (ko) 2012-07-02
US8881086B2 (en) 2014-11-04
JP5281731B2 (ja) 2013-09-04
KR101100048B1 (ko) 2011-12-29
KR20110039573A (ko) 2011-04-19
WO2004012107A2 (en) 2004-02-05
WO2004012107A3 (en) 2004-10-21
US20040145033A1 (en) 2004-07-29
US20130043569A1 (en) 2013-02-21
US8286118B2 (en) 2012-10-09

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