ATE553636T1 - Leiterplattentopologie für eine hochfrequenzschaltung - Google Patents

Leiterplattentopologie für eine hochfrequenzschaltung

Info

Publication number
ATE553636T1
ATE553636T1 AT05714491T AT05714491T ATE553636T1 AT E553636 T1 ATE553636 T1 AT E553636T1 AT 05714491 T AT05714491 T AT 05714491T AT 05714491 T AT05714491 T AT 05714491T AT E553636 T1 ATE553636 T1 AT E553636T1
Authority
AT
Austria
Prior art keywords
metal layer
ground
grounded metal
signal conductor
conductive traces
Prior art date
Application number
AT05714491T
Other languages
English (en)
Inventor
Gilbert Brunette
Eric Johnson
Stephen Rayment
Colin Soul
Original Assignee
Belair Networks Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Belair Networks Inc filed Critical Belair Networks Inc
Application granted granted Critical
Publication of ATE553636T1 publication Critical patent/ATE553636T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
    • H01L2223/6622—Coaxial feed-throughs in active or passive substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1903—Structure including wave guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09718—Clearance holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
AT05714491T 2004-03-01 2005-02-24 Leiterplattentopologie für eine hochfrequenzschaltung ATE553636T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/790,336 US7030712B2 (en) 2004-03-01 2004-03-01 Radio frequency (RF) circuit board topology
PCT/CA2005/000249 WO2005084089A1 (en) 2004-03-01 2005-02-24 A radio frequency circuit board topology

Publications (1)

Publication Number Publication Date
ATE553636T1 true ATE553636T1 (de) 2012-04-15

Family

ID=34887452

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05714491T ATE553636T1 (de) 2004-03-01 2005-02-24 Leiterplattentopologie für eine hochfrequenzschaltung

Country Status (6)

Country Link
US (2) US7030712B2 (de)
EP (2) EP1723836B1 (de)
AT (1) ATE553636T1 (de)
CA (2) CA2600894C (de)
HK (1) HK1165932A1 (de)
WO (1) WO2005084089A1 (de)

Families Citing this family (126)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020121707A1 (en) * 2001-02-27 2002-09-05 Chippac, Inc. Super-thin high speed flip chip package
US8143108B2 (en) 2004-10-07 2012-03-27 Stats Chippac, Ltd. Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate
CN1784807B (zh) 2003-03-04 2013-03-20 诺福特罗尼有限公司 同轴波导微结构及其形成方法
US7239526B1 (en) * 2004-03-02 2007-07-03 Xilinx, Inc. Printed circuit board and method of reducing crosstalk in a printed circuit board
US7470864B2 (en) * 2004-03-02 2008-12-30 Via Technologies, Inc. Multi-conducting through hole structure
WO2006009274A1 (en) * 2004-07-23 2006-01-26 Nec Corporation Composite via structures and filters in multilayer printed circuit boards
SG135065A1 (en) * 2006-02-20 2007-09-28 Micron Technology Inc Conductive vias having two or more elements for providing communication between traces in different substrate planes, semiconductor device assemblies including such vias, and accompanying methods
DE102004060962A1 (de) 2004-12-17 2006-07-13 Advanced Micro Devices, Inc., Sunnyvale Mehrlagige gedruckte Schaltung mit einer Durchkontaktierung für Hochfrequenzanwendungen
US20060151869A1 (en) * 2005-01-10 2006-07-13 Franz Gisin Printed circuit boards and the like with improved signal integrity for differential signal pairs
TWI248330B (en) * 2005-01-14 2006-01-21 Ind Tech Res Inst High frequency and wide band impedance matching via
US7348667B2 (en) * 2005-03-22 2008-03-25 International Business Machines Corporation System and method for noise reduction in multi-layer ceramic packages
US7485966B2 (en) * 2005-04-11 2009-02-03 Via Technologies, Inc. Via connection structure with a compensative area on the reference plane
US20060244124A1 (en) * 2005-04-27 2006-11-02 Teradyne, Inc. Reduced cost printed circuit board
US7492146B2 (en) * 2005-05-16 2009-02-17 Teradyne, Inc. Impedance controlled via structure
US7430800B2 (en) * 2005-06-06 2008-10-07 International Business Machines Corporation Apparatus and method for far end noise reduction using capacitive cancellation by offset wiring
US20070018752A1 (en) * 2005-07-20 2007-01-25 Efficere, Llc Optimization of through plane transitions
US7361994B2 (en) * 2005-09-30 2008-04-22 Intel Corporation System to control signal line capacitance
US7457132B2 (en) * 2005-10-20 2008-11-25 Sanmina-Sci Corporation Via stub termination structures and methods for making same
JP2007180292A (ja) 2005-12-28 2007-07-12 Fujitsu Ltd 回路基板
CN101043788A (zh) * 2006-03-21 2007-09-26 鸿富锦精密工业（深圳）有限公司 印刷电路板
TWI286049B (en) * 2006-04-04 2007-08-21 Advanced Semiconductor Eng Circuit substrate
US9172145B2 (en) 2006-09-21 2015-10-27 Raytheon Company Transmit/receive daughter card with integral circulator
US9019166B2 (en) 2009-06-15 2015-04-28 Raytheon Company Active electronically scanned array (AESA) card
US7671696B1 (en) * 2006-09-21 2010-03-02 Raytheon Company Radio frequency interconnect circuits and techniques
US8279131B2 (en) * 2006-09-21 2012-10-02 Raytheon Company Panel array
CN101166401B (zh) * 2006-10-16 2011-11-30 辉达公司 用于在高速系统中放置多个负载的方法和系统
US7676920B2 (en) * 2006-10-16 2010-03-16 Dell Products L.P. Method of processing a circuit board
TWI364399B (en) 2006-12-30 2012-05-21 Rohm & Haas Elect Mat Three-dimensional microstructures and methods of formation thereof
KR101335987B1 (ko) * 2007-01-11 2013-12-04 삼성전자주식회사 다층 인쇄회로기판
JP4755209B2 (ja) * 2007-02-01 2011-08-24 サムソン エレクトロ−メカニックス カンパニーリミテッド． 電磁気バンドギャップ構造物及び印刷回路基板
EP1973190A1 (de) 2007-03-20 2008-09-24 Rohm and Haas Electronic Materials LLC Integrierte elektronische Komponenten und Herstellungsverfahren dafür
KR101472134B1 (ko) 2007-03-20 2014-12-15 누보트로닉스, 엘.엘.씨 동축 전송선 마이크로구조물 및 그의 형성방법
JP2008262989A (ja) * 2007-04-10 2008-10-30 Toshiba Corp 高周波回路基板
US7645943B2 (en) * 2007-07-11 2010-01-12 Delphi Technologies, Inc. Configurable printed circuit board
US20090085200A1 (en) * 2007-09-28 2009-04-02 Raviprakash Nagaraj Low loss radio frequency signal communication within a package, a board and/or a wave guide
US20090101402A1 (en) * 2007-10-19 2009-04-23 Advantest Corporation Circuit board, and electronic device
US7996806B2 (en) * 2008-02-06 2011-08-09 Electronics For Imaging, Inc. Methods and apparatus for layout of multi-layer circuit substrates
FR2928066A1 (fr) * 2008-02-27 2009-08-28 Thomson Licensing Sas Systeme d'interconnexion de deux substrats comportant chacun au moins une ligne de transmission
US7733265B2 (en) * 2008-04-04 2010-06-08 Toyota Motor Engineering & Manufacturing North America, Inc. Three dimensional integrated automotive radars and methods of manufacturing the same
US8022861B2 (en) 2008-04-04 2011-09-20 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for mm-wave imager and radar
US7830301B2 (en) * 2008-04-04 2010-11-09 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for automotive radars
KR20090118747A (ko) * 2008-05-14 2009-11-18 삼성전자주식회사 관통 전극을 가지는 반도체 칩 패키지 및 인쇄회로기판
WO2009144829A1 (en) * 2008-05-26 2009-12-03 Nec Corporation Multilayer substrate
CN101309559B (zh) * 2008-06-16 2010-07-21 华为终端有限公司 多层印刷电路板及其设计方法和终端产品主板
US7847654B2 (en) * 2008-07-28 2010-12-07 Bosch Security Systems, Inc. Multilayer microstripline transmission line transition
KR20100042021A (ko) * 2008-10-15 2010-04-23 삼성전자주식회사 반도체 칩, 스택 모듈, 메모리 카드 및 반도체 칩의 제조 방법
US20100134376A1 (en) * 2008-12-01 2010-06-03 Toyota Motor Engineering & Manufacturing North America, Inc. Wideband rf 3d transitions
US7990237B2 (en) * 2009-01-16 2011-08-02 Toyota Motor Engineering & Manufacturing North America, Inc. System and method for improving performance of coplanar waveguide bends at mm-wave frequencies
US7859835B2 (en) * 2009-03-24 2010-12-28 Allegro Microsystems, Inc. Method and apparatus for thermal management of a radio frequency system
CN101945537A (zh) * 2009-07-10 2011-01-12 英华达(上海)电子有限公司 一种具有过孔结构的印刷电路板及其制造方法
US8537552B2 (en) * 2009-09-25 2013-09-17 Raytheon Company Heat sink interface having three-dimensional tolerance compensation
US8242384B2 (en) 2009-09-30 2012-08-14 International Business Machines Corporation Through hole-vias in multi-layer printed circuit boards
US8508943B2 (en) 2009-10-16 2013-08-13 Raytheon Company Cooling active circuits
US8432027B2 (en) * 2009-11-11 2013-04-30 International Business Machines Corporation Integrated circuit die stacks with rotationally symmetric vias
US8315068B2 (en) 2009-11-12 2012-11-20 International Business Machines Corporation Integrated circuit die stacks having initially identical dies personalized with fuses and methods of manufacturing the same
US8310841B2 (en) 2009-11-12 2012-11-13 International Business Machines Corporation Integrated circuit die stacks having initially identical dies personalized with switches and methods of making the same
US8258619B2 (en) 2009-11-12 2012-09-04 International Business Machines Corporation Integrated circuit die stacks with translationally compatible vias
US8878652B2 (en) * 2009-11-13 2014-11-04 Zih Corp. Encoding module, associated encoding element, connector, printer-encoder and access control system
US20110121656A1 (en) 2009-11-20 2011-05-26 Freescale Semiconductor, Inc. Systems and methods for delivering power in response to a connection event
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
US8664537B2 (en) * 2009-12-21 2014-03-04 Trw Automotive U.S. Llc Method and apparatus for reducing signal noise
US9646947B2 (en) * 2009-12-22 2017-05-09 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Integrated circuit with inductive bond wires
US8427371B2 (en) 2010-04-09 2013-04-23 Raytheon Company RF feed network for modular active aperture electronically steered arrays
US8558637B2 (en) * 2010-05-12 2013-10-15 Mediatek Inc. Circuit device with signal line transition element
US8786496B2 (en) 2010-07-28 2014-07-22 Toyota Motor Engineering & Manufacturing North America, Inc. Three-dimensional array antenna on a substrate with enhanced backlobe suppression for mm-wave automotive applications
US8363413B2 (en) 2010-09-13 2013-01-29 Raytheon Company Assembly to provide thermal cooling
US8810448B1 (en) 2010-11-18 2014-08-19 Raytheon Company Modular architecture for scalable phased array radars
US8355255B2 (en) 2010-12-22 2013-01-15 Raytheon Company Cooling of coplanar active circuits
KR20120080923A (ko) * 2011-01-10 2012-07-18 삼성전자주식회사 반도체 패키지 및 이의 제조 방법
US9270005B2 (en) 2011-02-21 2016-02-23 Siklu Communication ltd. Laminate structures having a hole surrounding a probe for propagating millimeter waves
US9496593B2 (en) 2011-02-21 2016-11-15 Siklu Communication ltd. Enhancing operation of laminate waveguide structures using an electrically conductive fence
CN102686011A (zh) * 2011-03-15 2012-09-19 鸿富锦精密工业（深圳）有限公司 印刷电路板
US8866300B1 (en) 2011-06-05 2014-10-21 Nuvotronics, Llc Devices and methods for solder flow control in three-dimensional microstructures
US8814601B1 (en) * 2011-06-06 2014-08-26 Nuvotronics, Llc Batch fabricated microconnectors
KR101982887B1 (ko) 2011-07-13 2019-05-27 누보트로닉스, 인크. 전자 및 기계 구조체들을 제조하는 방법들
US9124361B2 (en) 2011-10-06 2015-09-01 Raytheon Company Scalable, analog monopulse network
US9204533B2 (en) * 2011-10-31 2015-12-01 Samsung Electro-Mechanics Co., Ltd. Asymmetrical multilayer substrate, RF module, and method for manufacturing asymmetrical multilayer substrate
US9035197B2 (en) 2011-11-04 2015-05-19 International Business Machines Corporation Circuit boards with vias exhibiting reduced via capacitance
US8918991B2 (en) * 2011-11-04 2014-12-30 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Process for providing electrical connections with reduced via capacitance on circuit boards
US8885357B2 (en) * 2012-01-06 2014-11-11 Cray Inc. Printed circuit board with reduced cross-talk
US9054403B2 (en) * 2012-06-21 2015-06-09 Raytheon Company Coaxial-to-stripline and stripline-to-stripline transitions including a shorted center via
US8890302B2 (en) * 2012-06-29 2014-11-18 Intel Corporation Hybrid package transmission line circuits
KR101365281B1 (ko) 2012-09-18 2014-02-19 삼성전기주식회사 오픈 스터브를 갖는 비아 구조 및 이를 구비한 인쇄회로기판
US8957325B2 (en) 2013-01-15 2015-02-17 Fujitsu Limited Optimized via cutouts with ground references
US9325044B2 (en) 2013-01-26 2016-04-26 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
US9024208B2 (en) 2013-02-27 2015-05-05 Dell Products L.P. Systems and methods for frequency shifting resonance of an unused via in a printed circuit board
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
US10310009B2 (en) 2014-01-17 2019-06-04 Nuvotronics, Inc Wafer scale test interface unit and contactors
TWI504320B (zh) 2014-06-17 2015-10-11 矽品精密工業股份有限公司 線路結構及其製法
US10110178B2 (en) 2014-08-20 2018-10-23 Nxp Usa, Inc. Frequency selective isolation circuit and method for suppressing parametric oscillation
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
US10511073B2 (en) 2014-12-03 2019-12-17 Cubic Corporation Systems and methods for manufacturing stacked circuits and transmission lines
JP6451943B2 (ja) * 2015-02-23 2019-01-16 パナソニックＩｐマネジメント株式会社 高周波モジュール
US20170005416A1 (en) * 2015-06-30 2017-01-05 Raytheon Company Multi-beam phased array antenna
JP2017121032A (ja) * 2015-06-30 2017-07-06 住友電気工業株式会社 高周波装置
US9936571B2 (en) * 2015-09-02 2018-04-03 Sae Magnetics (H.K.) Ltd. Printed circuit board
US9659847B2 (en) * 2015-09-18 2017-05-23 Nxp Usa, Inc. Terminal structure for active power device
CN105891740B (zh) * 2016-04-08 2018-08-31 北京航空航天大学 一种宽频带近场磁场探头的阻抗补偿结构及其构建方法
US10396432B2 (en) * 2017-01-23 2019-08-27 Samsung Electro-Mechanics Co., Ltd. Antenna-integrated radio frequency module
KR102410197B1 (ko) * 2017-06-13 2022-06-17 삼성전자주식회사 전송 손실을 줄이기 위한 회로 기판 및 이를 구비한 전자 장치
EP3631894B1 (de) 2017-06-20 2022-03-02 Viasat, Inc. Antennenarray-strahlungsabschirmung
US20190021163A1 (en) * 2017-07-11 2019-01-17 Robert C. Shelsky Z-axis guardbanding using vertical ground conductors for crosstalk mitigation
WO2019064510A1 (ja) * 2017-09-29 2019-04-04 三菱電機株式会社 高周波フィルタ
KR102362243B1 (ko) * 2017-10-18 2022-02-11 삼성전자주식회사 Rf 패키지 모듈 및 rf 패키지 모듈을 포함하는 전자 장치
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
KR102442620B1 (ko) * 2018-01-02 2022-09-13 삼성전자 주식회사 반도체 메모리 패키지
US10477672B2 (en) * 2018-01-29 2019-11-12 Hewlett Packard Enterprise Development Lp Single ended vias with shared voids
CN111801841A (zh) * 2018-03-09 2020-10-20 古河电气工业株式会社 高频传输线路、具备该高频传输线路的雷达装置及无线设备
EP3758136B1 (de) * 2018-03-30 2022-12-14 Mitsubishi Electric Corporation Elektronische schaltung
US10999923B2 (en) * 2018-04-26 2021-05-04 Juniper Networks, Inc. Structure for circuit interconnects
WO2020095092A1 (en) * 2018-11-06 2020-05-14 Aesa Sa Electromagnetic waveguide and microwave-frequency circuit
US11564316B2 (en) 2018-11-29 2023-01-24 Lockheed Martin Corporation Apparatus and method for impedance balancing of long radio frequency (RF) via
KR102620865B1 (ko) * 2018-12-03 2024-01-04 에스케이하이닉스 주식회사 반도체 패키지
KR102538705B1 (ko) * 2018-12-04 2023-06-01 에스케이하이닉스 주식회사 반도체 패키지
US20220015221A1 (en) * 2018-12-19 2022-01-13 Sony Group Corporation Substrate and electronic device
US11604261B2 (en) 2019-02-06 2023-03-14 Lockeed Martin Corporation Extended laser active ranging system, method and computer readable program product
CN110167261A (zh) * 2019-06-26 2019-08-23 京信通信技术(广州)有限公司 毫米波有源天线单元及pcb板间互连结构
US10912199B1 (en) * 2019-10-03 2021-02-02 Kioxia Corporation Resistive PCB traces for improved stability
US11864315B2 (en) * 2019-11-29 2024-01-02 Mediatek Inc. Vertical interconnection structure of a multi-layer substrate
US10952313B1 (en) * 2020-01-22 2021-03-16 Arista Networks, Inc. Via impedance matching
WO2021158358A1 (en) * 2020-02-03 2021-08-12 Commscope Technologies Llc Systems for electrostatic discharge protection
CN112652872B (zh) * 2020-12-03 2021-10-15 北京工业大学 一种微带扇形组阵级联去耦电路
KR20220111555A (ko) * 2021-02-02 2022-08-09 삼성전자주식회사 안테나 모듈 및 이를 포함하는 전자 장치
CN114006139B (zh) * 2021-10-22 2022-08-05 成都西科微波通讯有限公司 一种基于htcc的超宽带毫米波垂直互联结构
JP7245947B1 (ja) * 2022-08-15 2023-03-24 Ｆｃｎｔ株式会社 印刷配線基板及び無線通信端末

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5651588B2 (de) * 1974-09-20 1981-12-07
US4023125A (en) 1975-10-17 1977-05-10 General Electric Company Printed broadband rf bias circuits
SE426894B (sv) 1981-06-30 1983-02-14 Ericsson Telefon Ab L M Impedansriktig koaxialovergang for mikrovagssignaler
JPH04802A (ja) * 1990-04-17 1992-01-06 Mitsubishi Electric Corp トリプレート線路形基板間接続素子
US5401912A (en) * 1993-06-07 1995-03-28 St Microwave Corp., Arizona Operations Microwave surface mount package
US5920242A (en) * 1997-06-09 1999-07-06 Ngk Spark Plug Co., Ltd. Multielement-type piezoelectric filter with through-hole connection of resonators to a base substrate circuit
JP3732927B2 (ja) * 1997-07-31 2006-01-11 京セラ株式会社 多層配線基板
US6031188A (en) * 1998-04-30 2000-02-29 Lockheed Martin Corp. Multi-circuit RF connections using molded and compliant RF coaxial interconnects
DE69938271T2 (de) * 1998-05-29 2009-03-19 Kyocera Corp. Hochfrequenzmodul
US6154176A (en) * 1998-08-07 2000-11-28 Sarnoff Corporation Antennas formed using multilayer ceramic substrates
US6388206B2 (en) * 1998-10-29 2002-05-14 Agilent Technologies, Inc. Microcircuit shielded, controlled impedance “Gatling gun”via
US6184477B1 (en) * 1998-12-02 2001-02-06 Kyocera Corporation Multi-layer circuit substrate having orthogonal grid ground and power planes
JP3669219B2 (ja) * 1999-08-10 2005-07-06 日本電気株式会社 多層プリント配線板
SE518181C2 (sv) * 1999-12-10 2002-09-03 Ericsson Telefon Ab L M Förfarande och anordning vid elektroniska kretsarrangemang
US6614325B1 (en) * 2000-08-31 2003-09-02 Northrop Grumman Corporation RF/IF signal distribution network utilizing broadside coupled stripline
JP4462758B2 (ja) * 2000-12-27 2010-05-12 京セラ株式会社 高周波用配線基板
ATE323978T1 (de) * 2001-03-02 2006-05-15 Fuba Automotive Gmbh Diversity-anlage zum empfang digitaler terrestrischer und/oder satelliten-funksignale für fahrzeuge
US6617943B1 (en) * 2001-07-27 2003-09-09 Applied Micro Circuits Corporation Package substrate interconnect layout for providing bandpass/lowpass filtering
US6417747B1 (en) 2001-08-23 2002-07-09 Raytheon Company Low cost, large scale RF hybrid package for simple assembly onto mixed signal printed wiring boards
US6541712B1 (en) * 2001-12-04 2003-04-01 Teradyhe, Inc. High speed multi-layer printed circuit board via
US6949992B2 (en) * 2002-03-20 2005-09-27 Powerwave Technologies, Inc. System and method of providing highly isolated radio frequency interconnections

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CA2712949C (en) 2011-11-15
EP2451254B1 (de) 2013-04-17
CA2600894C (en) 2011-02-01
US20050190614A1 (en) 2005-09-01
EP1723836B1 (de) 2012-04-11
US20060125573A1 (en) 2006-06-15
WO2005084089A1 (en) 2005-09-09
HK1165932A1 (en) 2012-11-09
CA2600894A1 (en) 2005-09-09
EP1723836A1 (de) 2006-11-22
EP2451254A1 (de) 2012-05-09
EP1723836A4 (de) 2007-04-25
US7154356B2 (en) 2006-12-26
CA2712949A1 (en) 2005-09-09

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