ATE492147T1 - Verfahren zur herstellung eines keramischen, mehrschichtsubstrats - Google Patents

Verfahren zur herstellung eines keramischen, mehrschichtsubstrats

Info

Publication number
ATE492147T1
ATE492147T1 AT07744760T AT07744760T ATE492147T1 AT E492147 T1 ATE492147 T1 AT E492147T1 AT 07744760 T AT07744760 T AT 07744760T AT 07744760 T AT07744760 T AT 07744760T AT E492147 T1 ATE492147 T1 AT E492147T1
Authority
AT
Austria
Prior art keywords
ceramic
firing
green ceramic
green
ceramic laminate
Prior art date
Application number
AT07744760T
Other languages
English (en)
Inventor
Akiyoshi Kawamura
Takayuki Tsukizawa
Tetsuya Ikeda
Osamu Chikagawa
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Application granted granted Critical
Publication of ATE492147T1 publication Critical patent/ATE492147T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
AT07744760T 2006-08-07 2007-06-06 Verfahren zur herstellung eines keramischen, mehrschichtsubstrats ATE492147T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006215046 2006-08-07
JP2007064173 2007-03-13
PCT/JP2007/061415 WO2008018227A1 (en) 2006-08-07 2007-06-06 Method of producing multilayer ceramic substrate

Publications (1)

Publication Number Publication Date
ATE492147T1 true ATE492147T1 (de) 2011-01-15

Family

ID=39032765

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07744760T ATE492147T1 (de) 2006-08-07 2007-06-06 Verfahren zur herstellung eines keramischen, mehrschichtsubstrats

Country Status (8)

Country Link
US (1) US7833370B2 (de)
EP (1) EP2051570B1 (de)
JP (1) JP5090185B2 (de)
KR (1) KR101011196B1 (de)
CN (1) CN101347058B (de)
AT (1) ATE492147T1 (de)
DE (1) DE602007011286D1 (de)
WO (1) WO2008018227A1 (de)

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WO2009050974A1 (ja) * 2007-10-17 2009-04-23 Murata Manufacturing Co., Ltd. キャビティ付きセラミック多層基板の製造方法
KR100887127B1 (ko) * 2007-11-23 2009-03-04 삼성전기주식회사 적층 세라믹 기판의 제조방법
JP4873379B2 (ja) * 2008-03-31 2012-02-08 Ｔｄｋ株式会社 積層セラミック電子部品の製造方法
KR101004843B1 (ko) 2008-09-05 2010-12-28 삼성전기주식회사 세라믹 다층 회로 기판 및 그의 제조 방법
JP5197407B2 (ja) * 2009-01-28 2013-05-15 京セラ株式会社 多数個取り配線基板
JP5777997B2 (ja) * 2011-03-07 2015-09-16 日本特殊陶業株式会社 電子部品検査装置用配線基板およびその製造方法
JP5798435B2 (ja) 2011-03-07 2015-10-21 日本特殊陶業株式会社 電子部品検査装置用配線基板およびその製造方法
JP5921074B2 (ja) * 2011-03-17 2016-05-24 株式会社村田製作所 積層基板の製造方法
JP2012227306A (ja) * 2011-04-19 2012-11-15 Ngk Insulators Ltd セラミック基板の製造方法
JP5945099B2 (ja) 2011-04-20 2016-07-05 日本特殊陶業株式会社 配線基板、多数個取り配線基板、およびその製造方法
US9779874B2 (en) 2011-07-08 2017-10-03 Kemet Electronics Corporation Sintering of high temperature conductive and resistive pastes onto temperature sensitive and atmospheric sensitive materials
CN102271456B (zh) * 2011-07-13 2013-05-01 东北大学 一种导热陶瓷基印刷电路板及其制备方法
CN103050281A (zh) * 2011-10-12 2013-04-17 李文熙 利用抑制收缩烧结改善积层陶瓷组件电极连续性
KR20140039736A (ko) * 2012-09-25 2014-04-02 삼성전자주식회사 스택 패키지 및 그 제조 방법
SG11201609223XA (en) 2014-05-07 2016-12-29 Morgan Advanced Ceramics Inc Method for manufacturing large ceramic co-fired articles
US9583426B2 (en) 2014-11-05 2017-02-28 Invensas Corporation Multi-layer substrates suitable for interconnection between circuit modules
CN104640344A (zh) * 2015-02-16 2015-05-20 上海贺鸿电子有限公司 镀铜的陶瓷线路板及其制造方法
US10283492B2 (en) 2015-06-23 2019-05-07 Invensas Corporation Laminated interposers and packages with embedded trace interconnects
CN105098300A (zh) * 2015-09-11 2015-11-25 禾邦电子（中国）有限公司 共模滤波器及其制造方法
US9852994B2 (en) 2015-12-14 2017-12-26 Invensas Corporation Embedded vialess bridges
US10763031B2 (en) 2016-08-30 2020-09-01 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing an inductor
JP7173298B2 (ja) 2019-03-29 2022-11-16 株式会社村田製作所 セラミック基板の製造方法
WO2020202943A1 (ja) 2019-03-29 2020-10-08 株式会社村田製作所 セラミック基板の製造方法及びセラミック基板
JP6962501B2 (ja) * 2019-03-29 2021-11-05 株式会社村田製作所 セラミック基板の製造方法及びセラミック基板
CN114245926B (zh) * 2019-08-23 2024-04-19 株式会社村田制作所 片状电子部件用夹具
JP7180619B2 (ja) * 2020-01-10 2022-11-30 Tdk株式会社 電子部品及びその製造方法
JP7427966B2 (ja) * 2020-01-16 2024-02-06 Tdk株式会社 電子部品
CN114364141A (zh) * 2022-01-04 2022-04-15 深圳中富电路股份有限公司 一种厚铜陶瓷基板及其制作方法
CN115475797B (zh) * 2022-09-30 2024-04-05 肇庆绿宝石电子科技股份有限公司 一种叠层电容器及其制造方法、载条清洗液及制备方法

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US6252761B1 (en) * 1999-09-15 2001-06-26 National Semiconductor Corporation Embedded multi-layer ceramic capacitor in a low-temperature con-fired ceramic (LTCC) substrate
JP2001332857A (ja) * 2000-05-22 2001-11-30 Kyocera Corp 配線基板の製造方法
JP2002270459A (ja) * 2001-03-06 2002-09-20 Taiyo Yuden Co Ltd 積層セラミック電子部品の製造方法
JP4610114B2 (ja) 2001-03-28 2011-01-12 京セラ株式会社 セラミック配線基板の製造方法
JP2003017851A (ja) * 2001-06-29 2003-01-17 Murata Mfg Co Ltd 多層セラミック基板の製造方法
TWI345938B (en) 2003-10-17 2011-07-21 Hitachi Metals Ltd Multi-layered ceramic substrate and its production method, and electronic device comprising same
JP4470158B2 (ja) * 2003-10-24 2010-06-02 日立金属株式会社 多層セラミック基板の製造方法および多層セラミック基板
JP4291187B2 (ja) * 2004-03-24 2009-07-08 Ｔｄｋ株式会社 外部電極内蔵層の形成方法およびそれを使用する積層型電子部品の製造方法
JP4639801B2 (ja) * 2004-04-14 2011-02-23 株式会社デンソー セラミック板及びその製造方法
JP2005311225A (ja) 2004-04-26 2005-11-04 Tdk Corp 積層型電子部品の製造方法
KR100989342B1 (ko) * 2006-05-29 2010-10-25 가부시키가이샤 무라타 세이사쿠쇼 세라믹 다층기판의 제조 방법

Also Published As

Publication number Publication date
KR101011196B1 (ko) 2011-01-26
DE602007011286D1 (de) 2011-01-27
EP2051570A1 (de) 2009-04-22
CN101347058A (zh) 2009-01-14
CN101347058B (zh) 2010-09-22
US7833370B2 (en) 2010-11-16
JPWO2008018227A1 (ja) 2009-12-24
JP5090185B2 (ja) 2012-12-05
KR20080037041A (ko) 2008-04-29
WO2008018227A1 (en) 2008-02-14
EP2051570A4 (de) 2009-11-25
US20080142147A1 (en) 2008-06-19
EP2051570B1 (de) 2010-12-15

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Legal Events

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