CN104640344A - 镀铜的陶瓷线路板及其制造方法 - Google Patents

镀铜的陶瓷线路板及其制造方法 Download PDF

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CN104640344A
CN104640344A CN201510086386.7A CN201510086386A CN104640344A CN 104640344 A CN104640344 A CN 104640344A CN 201510086386 A CN201510086386 A CN 201510086386A CN 104640344 A CN104640344 A CN 104640344A
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copper
layer
ceramic circuit
plated
circuit board
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刘统发
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SHANGHAI H-FAST ELECTRONIC Co Ltd
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SHANGHAI H-FAST ELECTRONIC Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

本发明涉及一种镀铜的陶瓷线路板，其特征在于，由陶瓷基板层、印刷层和铜厚层自内向外层叠而成。本发明还提供了上述镀铜的陶瓷线路板的制备方法，采用本发明的镀铜的陶瓷线路板及其制造方法，其采用陶瓷作为基板，在表面印刷上印刷层后再采用化学沉厚铜工艺形成铜厚层，可以制造线宽和间隙较为精密的陶瓷线路板，且加工流程短，只需几步就能制造，且其可以制造出任意满足客户需要的厚度的铜厚层，且制备简单，成本低廉，十分符合大规模生产需求。

Description

镀铜的陶瓷线路板及其制造方法
技术领域
本发明涉及电气领域，特别涉及LED灯和大功率电器线路板，具体涉一种耐高温和高导热的镀铜的陶瓷线路板及其制造方法。
背景技术
现有技术中，陶瓷线路板的应用已经十分广泛，目前陶瓷板主要有两种加工方法：
第一种是铜箔和陶瓷烧结技术，是指将铜在高温下直接键合到陶瓷材料上，然后通过加成法蚀刻发形成线路板。DBC板主要是采用Al2O3、AIN、BeO等导热绝缘陶瓷基片。其存在的技术缺点为：
烧结用的铜箔必须大于0.1mm，对于需要铜箔厚度小于0.1mm产品无能为力。由于铜箔太厚，蚀刻出的线路宽度和间隙必须大于0.2mm，对于线宽和间隙较为精密的陶瓷线路板无法加工。且后续需要增加抗蚀剂、曝光、显影、蚀刻的制程才能形成所需要线路，加工流程长。
第二种是印刷铜浆(银浆)印刷加成技术，其通过在陶瓷上印刷烧结铜浆(银浆)，并烧结形成线路。存在以下技术缺点：
由于铜浆(银浆)为流体，当印刷厚度超过10Um时，在线路边沿由于浆料向间隙流动而形成梯形结构，俗称塌陷，所以只能加工铜厚或银厚小于10um的线路图形，多次印刷则存在对位精度，和浆料流动问题，对需要厚度要求达到20um以上导电图形则无法加工。
所以一种线宽和间隙较为精密的、具有较大厚度的导电图形的陶瓷线路板是十分具有实用价值的。
发明内容
本发明的目的是为了克服上述现有技术中的缺点，提供一种线宽和间隙较为精密的、具有较大厚度的导电图形的镀铜的陶瓷线路板及其制造方法。
为了实现上述目的，本发明一方面提供了一种镀铜的陶瓷线路板，其特征在于，由陶瓷基板层、印刷层和铜厚层自内向外层叠而成。
较佳地，所述的陶瓷基板层的双面均层叠有印刷层和铜厚层。
较佳地，所述的印刷层为烧结铜层或烧结银层。
更佳地，所述的陶瓷基板层上设有导通孔。
更佳地，所述的导通孔里填充有印刷铜浆或印刷银浆。
较佳地，所述的陶瓷基板层为氧化铝陶瓷层或氮化铝陶瓷层。
本发明另一方面提供了一种上述所述的镀铜的陶瓷线路板的制备方法，其特征在于，包括以下步骤：
步骤(1)：在陶瓷基板层上采用烧结铜浆和烧结银浆印刷出所需图形后烧结，得到带有烧结铜层或烧结银层的陶瓷基板层；
步骤(2)：在所述的带有烧结铜层或烧结银层的陶瓷基板层表面采用化学沉厚铜工艺镀上铜厚层。根据沉铜浸泡时间不一样，铜层的厚度可以是5～100um。
较佳地，在进行印刷之前，采用印刷铜浆或印刷银浆填充导通孔。
采用本发明的镀铜的陶瓷线路板及其制造方法，其采用陶瓷作为基板，在表面印刷上印刷层后再采用化学沉厚铜工艺形成铜厚层，可以制造线宽和间隙较为精密的陶瓷线路板，且加工流程短，只需几步就能制造，且其可以制造出任意满足客户需要的厚度的铜厚层，且制备简单，成本低廉，十分符合大规模生产需求。
附图说明
图1为本发明实施例1中单面陶瓷线路板的结构图。
图2为本发明实施例2中的双面陶瓷线路板的结构图。
具体实施方式
为了能够更清楚地理解本发明的技术内容，下面对本发明的具体实施方法作进一步说明。
实施例1
如图1所示，本实施例的镀铜的陶瓷线路板由陶瓷基板层1、印刷层2和铜厚层3自内向外层叠而成。该印刷层2为烧结铜层，陶瓷基板层1为氧化铝陶瓷层，其制备方法如下：
步骤(1)：在陶瓷基板层上采用烧结铜浆印刷出所需图形后烧结，得到带有烧结铜层的陶瓷基板层；
步骤(2)：在带有烧结铜层的陶瓷基板层表面采用化学沉厚铜工艺镀上铜厚层。根据沉铜浸泡时间不一样，铜层的厚度可以是5～100um。
实施例2
如图2所示，本实施例的陶瓷线路板为双面陶瓷线路板，其双面均层叠有印刷层和铜厚层，其双面陶瓷基板层4上设有导通孔7。在对其进行印刷之前，采用印刷银浆填充导通孔7。其上堆叠有双面印刷层5和双面铜厚层6。
采用本发明的镀铜的陶瓷线路板及其制造方法，其采用陶瓷作为基板，在表面印刷上印刷层后再采用化学沉厚铜工艺形成铜厚层，可以制造线宽和间隙较为精密的陶瓷线路板，且加工流程短，只需几步就能制造，且其可以制造出任意满足客户需要的厚度的铜厚层，且制备简单，成本低廉，十分符合大规模生产需求。
在此说明书中，本发明已参照其特定的实施例作了描述。但是，很显然仍可以做出各种修改和变换而不背离本发明的精神和范围。因此，说明书应被认为是说明性的而非限制性的。

Claims (8)

1.一种镀铜的陶瓷线路板，其特征在于，由陶瓷基板层、印刷层和铜厚层自内向外层叠而成。
2.根据权利要求1所述的镀铜的陶瓷线路板，其特征在于，所述的陶瓷基板层的双面均层叠有印刷层和铜厚层。
3.根据权利要求1所述的镀铜的陶瓷线路板，其特征在于，所述的印刷层为烧结铜层或烧结银层。
4.根据权利要求2所述的镀铜的陶瓷线路板，其特征在于，所述的陶瓷基板层上设有导通孔。
5.根据权利要求4所述的镀铜的陶瓷线路板，其特征在于，所述的导通孔里填充有印刷铜浆或印刷银浆。
6.根据权利要求1所述的镀铜的陶瓷线路板，其特征在于，所述的陶瓷基板层为氧化铝陶瓷层或氮化铝陶瓷层。
7.一种权利要求1～6中任一项所述的镀铜的陶瓷线路板的制造方法，其特征在于，包括以下步骤：
步骤(1)：在陶瓷基板层上采用烧结铜浆和烧结银浆印刷出所需图形后烧结，得到带有烧结铜层或烧结银层的陶瓷基板层；
步骤(2)：在所述的带有烧结铜层或烧结银层的陶瓷基板层表面采用化学沉厚铜工艺镀上铜厚层。
8.根据权利要求7所述的镀铜的陶瓷线路板的制造方法，其特征在于，在进行印刷之前，采用印刷铜浆或印刷银浆填充导通孔。
CN201510086386.7A 2015-02-16 2015-02-16 镀铜的陶瓷线路板及其制造方法 Pending CN104640344A (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109195346A (zh) * 2018-10-15 2019-01-11 安徽银点电子科技有限公司 一种印制电路板的制备方法
CN117069517A (zh) * 2023-08-16 2023-11-17 山东厚发芯源科技有限公司 一种陶瓷基板多层同时双面烧结覆铜的方法

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US20060172533A1 (en) * 2005-01-28 2006-08-03 Samsung Electro-Mechanics Co., Ltd. Method of fabricating printed circuit board
CN101347058A (zh) * 2006-08-07 2009-01-14 株式会社村田制作所 陶瓷多层基板的制造方法
CN201888020U (zh) * 2010-05-25 2011-06-29 景德镇正宇奈米科技有限公司 陶瓷印刷电路板结构
CN103369851A (zh) * 2012-04-09 2013-10-23 戴培钧 一种印刷线路板及其制造方法
CN103533765A (zh) * 2012-08-07 2014-01-22 立诚光电股份有限公司 改善陶瓷贯孔基板上金属表面粗糙度的方法及陶瓷基板
CN204598451U (zh) * 2015-02-16 2015-08-26 上海贺鸿电子有限公司 镀铜的陶瓷线路板

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Publication number Priority date Publication date Assignee Title
US20060172533A1 (en) * 2005-01-28 2006-08-03 Samsung Electro-Mechanics Co., Ltd. Method of fabricating printed circuit board
CN101347058A (zh) * 2006-08-07 2009-01-14 株式会社村田制作所 陶瓷多层基板的制造方法
CN201888020U (zh) * 2010-05-25 2011-06-29 景德镇正宇奈米科技有限公司 陶瓷印刷电路板结构
CN103369851A (zh) * 2012-04-09 2013-10-23 戴培钧 一种印刷线路板及其制造方法
CN103533765A (zh) * 2012-08-07 2014-01-22 立诚光电股份有限公司 改善陶瓷贯孔基板上金属表面粗糙度的方法及陶瓷基板
CN204598451U (zh) * 2015-02-16 2015-08-26 上海贺鸿电子有限公司 镀铜的陶瓷线路板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109195346A (zh) * 2018-10-15 2019-01-11 安徽银点电子科技有限公司 一种印制电路板的制备方法
CN117069517A (zh) * 2023-08-16 2023-11-17 山东厚发芯源科技有限公司 一种陶瓷基板多层同时双面烧结覆铜的方法

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