DE602004030085D1 - Verfahren zur Herstellung eines mehrschichtigen elektronischen Bauelementes und mehrschichtiges Bauelement - Google Patents

Verfahren zur Herstellung eines mehrschichtigen elektronischen Bauelementes und mehrschichtiges Bauelement

Info

Publication number
DE602004030085D1
DE602004030085D1 DE602004030085T DE602004030085T DE602004030085D1 DE 602004030085 D1 DE602004030085 D1 DE 602004030085D1 DE 602004030085 T DE602004030085 T DE 602004030085T DE 602004030085 T DE602004030085 T DE 602004030085T DE 602004030085 D1 DE602004030085 D1 DE 602004030085D1
Authority
DE
Germany
Prior art keywords
ceramic layers
multilayer
coil
component
connection electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004030085T
Other languages
English (en)
Inventor
Tomoyuki Maeda
Hideaki Matsushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of DE602004030085D1 publication Critical patent/DE602004030085D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/02—Fixed inductances of the signal type  without magnetic core
    • H01F17/03—Fixed inductances of the signal type  without magnetic core with ceramic former
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/002—Details of via holes for interconnecting the layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49071—Electromagnet, transformer or inductor by winding or coiling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49073—Electromagnet, transformer or inductor by assembling coil and core
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49075—Electromagnet, transformer or inductor including permanent magnet or core
    • Y10T29/49078—Laminated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
DE602004030085T 2003-12-05 2004-12-03 Verfahren zur Herstellung eines mehrschichtigen elektronischen Bauelementes und mehrschichtiges Bauelement Active DE602004030085D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003407266A JP4211591B2 (ja) 2003-12-05 2003-12-05 積層型電子部品の製造方法および積層型電子部品

Publications (1)

Publication Number Publication Date
DE602004030085D1 true DE602004030085D1 (de) 2010-12-30

Family

ID=34464020

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004030085T Active DE602004030085D1 (de) 2003-12-05 2004-12-03 Verfahren zur Herstellung eines mehrschichtigen elektronischen Bauelementes und mehrschichtiges Bauelement

Country Status (8)

Country Link
US (2) US7375977B2 (de)
EP (1) EP1538638B1 (de)
JP (1) JP4211591B2 (de)
KR (1) KR100627700B1 (de)
CN (1) CN1291426C (de)
AT (1) ATE488844T1 (de)
DE (1) DE602004030085D1 (de)
TW (1) TWI244661B (de)

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US20090139759A1 (en) * 2004-12-20 2009-06-04 Murata Manufacturing Co., Ltd. Laminated ceramic electronic component and manufacturing method therefor
US7474539B2 (en) * 2005-04-11 2009-01-06 Intel Corporation Inductor
JP5076909B2 (ja) * 2006-01-24 2012-11-21 日本電気株式会社 集積回路装置
US7768117B2 (en) * 2007-05-30 2010-08-03 Tessera, Inc. Microelectronic package having interconnected redistribution paths
US8212155B1 (en) * 2007-06-26 2012-07-03 Wright Peter V Integrated passive device
JP5262775B2 (ja) * 2008-03-18 2013-08-14 株式会社村田製作所 積層型電子部品及びその製造方法
WO2010010799A1 (ja) * 2008-07-22 2010-01-28 株式会社村田製作所 電子部品及びその製造方法
CN102301436B (zh) * 2009-01-30 2013-12-25 株式会社村田制作所 电子部件及其制造方法
WO2010092861A1 (ja) * 2009-02-13 2010-08-19 株式会社村田製作所 電子部品
CN102362320B (zh) * 2009-03-26 2014-07-30 株式会社村田制作所 电子部件及其制造方法
JP4893773B2 (ja) * 2009-04-02 2012-03-07 株式会社村田製作所 電子部品及びその製造方法
WO2010150602A1 (ja) 2009-06-24 2010-12-29 株式会社村田製作所 電子部品及びその製造方法
CN101819853B (zh) * 2010-04-29 2012-05-09 深圳顺络电子股份有限公司 一种叠层线圈元器件的制作方法
KR101153507B1 (ko) * 2010-05-24 2012-06-11 삼성전기주식회사 적층형 인덕터
CN102971809B (zh) * 2010-06-28 2016-02-17 株式会社村田制作所 层叠型陶瓷电子部件及其制造方法
KR20120050837A (ko) * 2010-11-11 2012-05-21 삼성전기주식회사 전도성 필름 및 그 제조방법
KR101153557B1 (ko) 2010-11-23 2012-06-11 삼성전기주식회사 적층형 인덕터 및 적층형 인덕터 제조 방법
US9113569B2 (en) 2011-03-25 2015-08-18 Ibiden Co., Ltd. Wiring board and method for manufacturing same
KR101218985B1 (ko) * 2011-05-31 2013-01-04 삼성전기주식회사 칩형 코일 부품
JP5459327B2 (ja) * 2012-01-24 2014-04-02 株式会社村田製作所 電子部品
CN203982942U (zh) * 2012-02-29 2014-12-03 株式会社村田制作所 层叠型电感器以及电源电路模块
KR20140080019A (ko) * 2012-12-20 2014-06-30 삼성전기주식회사 적층 세라믹 커패시터 및 적층 세라믹 커패시터의 실장 기판
CN106024327B (zh) 2015-03-27 2019-07-19 株式会社村田制作所 层叠线圈部件
JP6508126B2 (ja) * 2016-05-26 2019-05-08 株式会社村田製作所 コイル部品
US10923259B2 (en) * 2016-07-07 2021-02-16 Samsung Electro-Mechanics Co., Ltd. Coil component
JP6569654B2 (ja) * 2016-12-14 2019-09-04 株式会社村田製作所 チップインダクタ
JP6780589B2 (ja) * 2017-06-02 2020-11-04 株式会社村田製作所 電子部品
JP6962129B2 (ja) * 2017-10-20 2021-11-05 Tdk株式会社 積層コイル部品及びその製造方法
JP2019096818A (ja) 2017-11-27 2019-06-20 株式会社村田製作所 積層型コイル部品
JP6954217B2 (ja) * 2018-04-02 2021-10-27 株式会社村田製作所 積層型コイル部品
JP6954216B2 (ja) * 2018-04-02 2021-10-27 株式会社村田製作所 積層型コイル部品
JP7222217B2 (ja) * 2018-10-30 2023-02-15 Tdk株式会社 積層コイル部品
JP7180329B2 (ja) * 2018-11-30 2022-11-30 Tdk株式会社 積層コイル部品
JP7092070B2 (ja) * 2019-03-04 2022-06-28 株式会社村田製作所 積層型コイル部品
JP7215326B2 (ja) * 2019-05-24 2023-01-31 株式会社村田製作所 積層型コイル部品
JP7260015B2 (ja) * 2019-05-24 2023-04-18 株式会社村田製作所 積層型コイル部品及びバイアスティー回路
JP7260016B2 (ja) * 2019-05-24 2023-04-18 株式会社村田製作所 積層型コイル部品
JP7215327B2 (ja) * 2019-05-24 2023-01-31 株式会社村田製作所 積層型コイル部品
JP7020455B2 (ja) * 2019-05-24 2022-02-16 株式会社村田製作所 積層型コイル部品
KR20210019844A (ko) * 2019-08-13 2021-02-23 엘지이노텍 주식회사 손떨림 보정을 위한 코일 부재 및 이를 포함하는 카메라 모듈

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JP3097569B2 (ja) * 1996-09-17 2000-10-10 株式会社村田製作所 積層チップインダクタの製造方法
JP3307307B2 (ja) * 1997-12-19 2002-07-24 株式会社村田製作所 多層型高周波電子部品
JP3500319B2 (ja) * 1998-01-08 2004-02-23 太陽誘電株式会社 電子部品
JP3351738B2 (ja) * 1998-05-01 2002-12-03 太陽誘電株式会社 積層インダクタ及びその製造方法
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JP3571247B2 (ja) * 1999-03-31 2004-09-29 太陽誘電株式会社 積層電子部品
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JP2002015918A (ja) 2000-06-28 2002-01-18 Tdk Corp 積層型電子部品
JP2002134321A (ja) 2000-10-23 2002-05-10 Tdk Corp 高周波コイル及びその製造方法
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JP3890953B2 (ja) 2001-10-26 2007-03-07 株式会社村田製作所 積層型電子部品の製造方法
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Also Published As

Publication number Publication date
TWI244661B (en) 2005-12-01
ATE488844T1 (de) 2010-12-15
EP1538638B1 (de) 2010-11-17
KR100627700B1 (ko) 2006-09-25
KR20050054832A (ko) 2005-06-10
JP4211591B2 (ja) 2009-01-21
EP1538638A2 (de) 2005-06-08
US7375977B2 (en) 2008-05-20
JP2005167130A (ja) 2005-06-23
TW200522104A (en) 2005-07-01
US20080250628A1 (en) 2008-10-16
EP1538638A3 (de) 2006-06-28
CN1291426C (zh) 2006-12-20
CN1624826A (zh) 2005-06-08
US20050122699A1 (en) 2005-06-09
US7694414B2 (en) 2010-04-13

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