ATE520290T1 - Mehrschichtige leiterplatte und verfahren zur herstellung dazu - Google Patents

Mehrschichtige leiterplatte und verfahren zur herstellung dazu

Info

Publication number
ATE520290T1
ATE520290T1 AT06256011T AT06256011T ATE520290T1 AT E520290 T1 ATE520290 T1 AT E520290T1 AT 06256011 T AT06256011 T AT 06256011T AT 06256011 T AT06256011 T AT 06256011T AT E520290 T1 ATE520290 T1 AT E520290T1
Authority
AT
Austria
Prior art keywords
layers
circuit board
producing
resin
layer circuit
Prior art date
Application number
AT06256011T
Other languages
English (en)
Inventor
Kenichi Kawabata
Takaaki Morita
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005343062A external-priority patent/JP4835124B2/ja
Priority claimed from JP2006004378A external-priority patent/JP2007188986A/ja
Application filed by Tdk Corp filed Critical Tdk Corp
Application granted granted Critical
Publication of ATE520290T1 publication Critical patent/ATE520290T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H10W70/614—
    • H10W70/685—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H05K2201/09518—Deep blind vias, i.e. blind vias connecting the surface circuit to circuit layers deeper than the first buried circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H05K2201/09527—Inverse blind vias, i.e. bottoms outwards in multilayer PCB; Blind vias in centre of PCB having opposed bottoms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H10W70/093—
    • H10W70/099—
    • H10W70/60—
    • H10W72/073—
    • H10W90/00—
    • H10W99/00—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
AT06256011T 2005-11-29 2006-11-23 Mehrschichtige leiterplatte und verfahren zur herstellung dazu ATE520290T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005343062A JP4835124B2 (ja) 2005-11-29 2005-11-29 半導体ｉｃ内蔵基板及びその製造方法
JP2006004378A JP2007188986A (ja) 2006-01-12 2006-01-12 多層回路基板及びその製造方法

Publications (1)

Publication Number Publication Date
ATE520290T1 true ATE520290T1 (de) 2011-08-15

Family

ID=37708169

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06256011T ATE520290T1 (de) 2005-11-29 2006-11-23 Mehrschichtige leiterplatte und verfahren zur herstellung dazu

Country Status (3)

Country Link
US (2) US8188375B2 (de)
EP (1) EP1791409B1 (de)
AT (1) ATE520290T1 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI455672B (zh) * 2007-07-06 2014-10-01 村田製作所股份有限公司 A method for forming a hole for connecting a conductor for a layer, a method for manufacturing a resin substrate and a component-mounted substrate, and a method of manufacturing a resin substrate and a component
KR100841987B1 (ko) * 2007-07-10 2008-06-27 삼성전기주식회사 다층 인쇄회로기판 제조방법
JP4337950B2 (ja) * 2007-09-06 2009-09-30 株式会社村田製作所 回路基板の製造方法
JP4888736B2 (ja) * 2008-08-29 2012-02-29 Ｔｄｋ株式会社 配線基板の製造方法
US8041160B2 (en) * 2009-04-15 2011-10-18 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optical communications device having a mounting core and method
TWI469289B (zh) * 2009-12-31 2015-01-11 矽品精密工業股份有限公司 半導體封裝結構及其製法
JP2011165741A (ja) 2010-02-05 2011-08-25 Renesas Electronics Corp 半導体装置およびその製造方法
KR101109190B1 (ko) * 2010-06-04 2012-01-30 삼성전기주식회사 인쇄회로기판 및 그 제조방법
TW201235402A (en) * 2011-01-07 2012-09-01 Ajinomoto Kk Resin composition for release film
US20150257281A1 (en) * 2014-03-10 2015-09-10 Marvell World Trade Ltd. Method for forming a via structure using a double-side laser process
US9691699B2 (en) * 2015-11-03 2017-06-27 Unimicron Technology Corp. Circuit structure and method for manufacturing the same
US10070536B2 (en) * 2016-07-05 2018-09-04 Unimicron Technology Corp. Manufacturing method of circuit board structure
JP2018018936A (ja) * 2016-07-27 2018-02-01 イビデン株式会社 配線基板
US10312174B2 (en) * 2016-08-29 2019-06-04 Apple Inc. Thermal management system
CN109716871B (zh) 2016-10-06 2023-02-17 三井金属矿业株式会社 多层布线板的制造方法
KR102179806B1 (ko) 2016-10-06 2020-11-17 미쓰이금속광업주식회사 다층 배선판의 제조 방법
JP6496882B2 (ja) * 2016-11-28 2019-04-10 三井金属鉱業株式会社 粘着シート及びその剥離方法
US11527415B2 (en) * 2016-11-28 2022-12-13 Mitsui Mining & Smelting Co., Ltd. Multilayer circuit board manufacturing method
KR102596788B1 (ko) * 2016-12-30 2023-10-31 인텔 코포레이션 팬 아웃 스케일링을 위한 필러 및 비아 접속부를 구비한 고밀도 상호접속 층을 가진 패키지 기판
US10624213B1 (en) 2018-12-20 2020-04-14 Intel Corporation Asymmetric electronic substrate and method of manufacture
US10790241B2 (en) * 2019-02-28 2020-09-29 Advanced Semiconductor Engineering, Inc. Wiring structure and method for manufacturing the same
US11277917B2 (en) 2019-03-12 2022-03-15 Advanced Semiconductor Engineering, Inc. Embedded component package structure, embedded type panel substrate and manufacturing method thereof
JP7238548B2 (ja) * 2019-03-29 2023-03-14 Tdk株式会社 多層基板用絶縁シート、多層基板および多層基板の製造方法
US11296030B2 (en) 2019-04-29 2022-04-05 Advanced Semiconductor Engineering, Inc. Embedded component package structure and manufacturing method thereof
US10950551B2 (en) 2019-04-29 2021-03-16 Advanced Semiconductor Engineering, Inc. Embedded component package structure and manufacturing method thereof
JP2021022615A (ja) * 2019-07-25 2021-02-18 イビデン株式会社 プリント配線板
JP2021022614A (ja) * 2019-07-25 2021-02-18 イビデン株式会社 プリント配線板
KR102880997B1 (ko) * 2020-03-02 2025-11-04 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 모듈
KR20240079782A (ko) * 2022-11-29 2024-06-05 삼성전기주식회사 인쇄회로기판

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5103293A (en) * 1990-12-07 1992-04-07 International Business Machines Corporation Electronic circuit packages with tear resistant organic cores
US5471017A (en) * 1994-05-31 1995-11-28 Texas Instruments Incorporated No fixture method to cure die attach for bonding IC dies to substrates
JP2842378B2 (ja) 1996-05-31 1999-01-06 日本電気株式会社 電子回路基板の高密度実装構造
SG86345A1 (en) 1998-05-14 2002-02-19 Matsushita Electric Industrial Co Ltd Circuit board and method of manufacturing the same
US6127728A (en) * 1999-06-24 2000-10-03 Lsi Logic Corporation Single reference plane plastic ball grid array package
JP4282161B2 (ja) 1999-07-02 2009-06-17 イビデン株式会社 多層プリント配線板及び多層プリント配線板の製造方法
JP4854845B2 (ja) 2000-02-25 2012-01-18 イビデン株式会社 多層プリント配線板
JP4854847B2 (ja) 2000-02-25 2012-01-18 イビデン株式会社 多層プリント配線板および多層プリント配線板の製造方法
JP4427874B2 (ja) 2000-07-06 2010-03-10 住友ベークライト株式会社 多層配線板の製造方法および多層配線板
US6518514B2 (en) * 2000-08-21 2003-02-11 Matsushita Electric Industrial Co., Ltd. Circuit board and production of the same
JP4931283B2 (ja) 2000-09-25 2012-05-16 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
JP4601158B2 (ja) 2000-12-12 2010-12-22 イビデン株式会社 多層プリント配線板およびその製造方法
JP4934900B2 (ja) 2000-12-15 2012-05-23 イビデン株式会社 多層プリント配線板の製造方法
JP2002185139A (ja) 2000-12-15 2002-06-28 Ibiden Co Ltd プリント配線板及びその製造方法
JP4243922B2 (ja) 2001-06-26 2009-03-25 イビデン株式会社 多層プリント配線板
JP3861669B2 (ja) 2001-11-22 2006-12-20 ソニー株式会社 マルチチップ回路モジュールの製造方法
JP4056256B2 (ja) 2002-01-15 2008-03-05 日東電工株式会社 熱剥離型粘着シートを用いた易損傷性被加工物の両面加工方法
JP2003218490A (ja) 2002-01-24 2003-07-31 Sharp Corp プリント配線板およびその製造方法
US7394663B2 (en) * 2003-02-18 2008-07-01 Matsushita Electric Industrial Co., Ltd. Electronic component built-in module and method of manufacturing the same
US6905589B2 (en) * 2003-02-24 2005-06-14 Endicott Interconnect Technologies, Inc. Circuitized substrate and method of making same
US7122404B2 (en) 2003-03-11 2006-10-17 Micron Technology, Inc. Techniques for packaging a multiple device component
JP4362607B2 (ja) 2003-03-12 2009-11-11 旭精工株式会社 紙幣収納装置における紙幣移動装置
JP2004343021A (ja) 2003-03-17 2004-12-02 Matsushita Electric Ind Co Ltd 部品内蔵モジュールの製造方法及び製造装置
JP4016340B2 (ja) 2003-06-13 2007-12-05 ソニー株式会社 半導体装置及びその実装構造、並びにその製造方法
JP2005050997A (ja) 2003-07-28 2005-02-24 Matsushita Electric Ind Co Ltd 半導体素子分離方法
JP3938921B2 (ja) 2003-07-30 2007-06-27 Ｔｄｋ株式会社 半導体ｉｃ内蔵モジュールの製造方法
US7547975B2 (en) * 2003-07-30 2009-06-16 Tdk Corporation Module with embedded semiconductor IC and method of fabricating the module
JP3918803B2 (ja) 2003-11-17 2007-05-23 株式会社トッパンＮｅｃサーキットソリューションズ 半導体装置用基板及びその製造方法
JP2005217372A (ja) 2004-02-02 2005-08-11 Sony Corp 電子部品を内蔵する基板、基板およびそれらの製造方法
JP4565861B2 (ja) 2004-02-27 2010-10-20 日本特殊陶業株式会社 配線基板の製造方法
US20090061245A1 (en) * 2006-03-31 2009-03-05 Fuji Seal International, Inc. Shrink Film

Also Published As

Publication number Publication date
US8188375B2 (en) 2012-05-29
US20070119541A1 (en) 2007-05-31
EP1791409A1 (de) 2007-05-30
EP1791409B1 (de) 2011-08-10
US20100083490A1 (en) 2010-04-08
US8530752B2 (en) 2013-09-10

Similar Documents

Publication Publication Date Title
ATE520290T1 (de) Mehrschichtige leiterplatte und verfahren zur herstellung dazu
ATE523331T1 (de) Bauplatte und verfahren zur herstellung einer bauplatte
WO2008105828A3 (en) Composite laminate and method of manufacture
EP3572223A3 (de) Verfahren und vorrichtung zur herstellung von laminatbodenplatten mit einem kern mit holz/kunststoff-verbundstoff sowie solche platten
ATE497880T1 (de) Antistatisches mehrschichtpaneel und verfahren zur herstellung
ATE533621T1 (de) Verbundbauteil aus wärmehärtenden harzen und elastomeren, verfahren zur herstellung und verwendung eines solchen verbundteils
DE602004030085D1 (de) Verfahren zur Herstellung eines mehrschichtigen elektronischen Bauelementes und mehrschichtiges Bauelement
WO2009062516A3 (en) Photocatalytic boards or panels and a method of manufacturing thereof
EP1729552A3 (de) Leiterplatte und Verfahren zu deren Herstellung
DE69907907D1 (de) Verbundgegenstände insbesondere prepregs, vorformlinge, laminate und sandwich formteile, und verfahren zu deren herstellung
ATE372208T1 (de) Verfahren zur herstellung von dekorativem verbundschichtstoff
FI20060447A7 (fi) Menetelmä elektronisilla komponenteilla upotetun piirilevyn valmistamiseksi
DE502005002884D1 (de) Verfahren zur Herstellung von Laminatbodenplatten mit einem Ausgleichelement, insbesondere mit einem Gegenzugimprägnat, und Vorrichtung zur Herstellung eines Ausgleichelements
DE602005016069D1 (de) Methode zur Herstellung von Fussbodenplatten mit komprimierten Kanten
TWI367908B (en) Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate
IL191870A0 (en) Composite material structure having an embedded optical fibre in one of the surface layers thereof and method for connecting and repairing same
EP2546073A3 (de) Verfahren zur Herstellung von Laminatpaneelen mittels Heisspressung
EP1928646A4 (de) Thermoplastische harzfolie und verfahren zu ihrer herstellung
DE602005014250D1 (de) Mehrlagenschaltung mit variablem Induktor sowie Verfahren zu ihrer Herstellung
DE60319870D1 (de) Verfahren zur herstellung eines wärmehärtbaren laminats
TW200709751A (en) Polyimide copper foil laminate and method of producing the same
WO2006011864A3 (en) Multi-layer polyolefin film
TW200634999A (en) Multilayer wiring board and its manufacturing method
TW200606194A (en) Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and method for manufacturing multi-layer printed wiring board
TW200721935A (en) Multilayered wiring substrate and manufacturing method thereof

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties