ATE410484T1 - Härtbare silikonzusammensetzung und elektronische komponenten - Google Patents

Härtbare silikonzusammensetzung und elektronische komponenten

Info

Publication number
ATE410484T1
ATE410484T1 AT06746051T AT06746051T ATE410484T1 AT E410484 T1 ATE410484 T1 AT E410484T1 AT 06746051 T AT06746051 T AT 06746051T AT 06746051 T AT06746051 T AT 06746051T AT E410484 T1 ATE410484 T1 AT E410484T1
Authority
AT
Austria
Prior art keywords
silicone composition
curable silicone
exhibits excellent
electronic components
represented
Prior art date
Application number
AT06746051T
Other languages
English (en)
Inventor
Yoshitsugu Morita
Minoru Isshiki
Tomoko Kato
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Application granted granted Critical
Publication of ATE410484T1 publication Critical patent/ATE410484T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
AT06746051T 2005-04-27 2006-04-27 Härtbare silikonzusammensetzung und elektronische komponenten ATE410484T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005129442A JP4931366B2 (ja) 2005-04-27 2005-04-27 硬化性シリコーン組成物および電子部品

Publications (1)

Publication Number Publication Date
ATE410484T1 true ATE410484T1 (de) 2008-10-15

Family

ID=36791664

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06746051T ATE410484T1 (de) 2005-04-27 2006-04-27 Härtbare silikonzusammensetzung und elektronische komponenten

Country Status (9)

Country Link
US (1) US8338527B2 (de)
EP (1) EP1874870B1 (de)
JP (1) JP4931366B2 (de)
KR (1) KR101187601B1 (de)
CN (1) CN101166792B (de)
AT (1) ATE410484T1 (de)
DE (1) DE602006003085D1 (de)
TW (1) TWI386461B (de)
WO (1) WO2006118335A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4931366B2 (ja) 2005-04-27 2012-05-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5207591B2 (ja) * 2006-02-23 2013-06-12 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
JP5285846B2 (ja) 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5306592B2 (ja) * 2006-12-04 2013-10-02 東レ・ダウコーニング株式会社 硬化性エポキシ樹脂組成物、硬化物、およびその用途
JP5238157B2 (ja) * 2006-12-25 2013-07-17 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5248012B2 (ja) 2006-12-25 2013-07-31 東レ・ダウコーニング株式会社 硬化性シリコーン組成物
JP5547369B2 (ja) * 2007-09-28 2014-07-09 東レ・ダウコーニング株式会社 硬化性液状エポキシ樹脂組成物およびその硬化物
JP5251919B2 (ja) * 2009-05-08 2013-07-31 信越化学工業株式会社 光半導体素子封止用樹脂組成物
JP5761647B2 (ja) 2010-01-25 2015-08-12 エルジー・ケム・リミテッド 光電池モジュール
KR101133061B1 (ko) * 2010-01-25 2012-04-04 주식회사 엘지화학 광전지용 시트
CN102812562B (zh) * 2010-01-25 2016-02-24 Lg化学株式会社 光伏组件
KR101556274B1 (ko) 2012-12-28 2015-09-30 제일모직 주식회사 봉지재 조성물, 봉지재 및 전자 소자
JP6342485B2 (ja) * 2013-06-19 2018-06-13 アクゾ ノーベル コーティングス インターナショナル ビー ヴィ 耐高温性粉体被覆の組成物、その調製方法、及びその使用
CN104830024B (zh) 2014-01-15 2018-02-06 财团法人工业技术研究院 有机无机混成树脂、包含其的模塑组合物、以及光电装置
WO2015186744A1 (ja) * 2014-06-04 2015-12-10 日立化成株式会社 フィルム状エポキシ樹脂組成物、フィルム状エポキシ樹脂組成物の製造方法、及び半導体装置の製造方法
CN105219097B (zh) * 2014-06-30 2017-12-08 广州慧谷化学有限公司 一种可固化的硅橡胶组合物及半导体器件
US20220049100A1 (en) * 2018-12-27 2022-02-17 Dow Toray Co., Ltd. Curable silicone composition for transfer molding, cured product thereof, and production method thereof

Family Cites Families (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3168405A (en) 1962-12-28 1965-02-02 Procter & Gamble Culinary composition containing edible acidic lipid anhydrides
US3410820A (en) 1966-08-01 1968-11-12 Gen Electric Room temperature vulcanizing compositions
JPH0617458B2 (ja) 1987-03-16 1994-03-09 信越化学工業株式会社 エポキシ樹脂組成物
PH27310A (en) * 1988-05-13 1993-05-28 M & T Chemicals Inc Epoxy-aromatic polysiloxane compositions
JPH0297559A (ja) 1988-10-03 1990-04-10 Toshiba Silicone Co Ltd 熱伝導性シリコーン組成物
US5206312A (en) 1989-11-20 1993-04-27 The Dow Chemical Company Aromatic hydroxyl-containing compounds containing organosiloxane moieties, epoxy compounds and cured products thereof
MY107113A (en) 1989-11-22 1995-09-30 Sumitomo Bakelite Co Epoxy resin composition for semiconductor sealing.
JP2712093B2 (ja) 1990-06-29 1998-02-10 東芝シリコーン株式会社 紫外線硬化性シリコーン組成物
JP2511348B2 (ja) 1991-10-17 1996-06-26 東レ・ダウコーニング・シリコーン株式会社 オルガノポリシロキサンおよびその製造方法
JP3161786B2 (ja) * 1991-11-20 2001-04-25 東レ・ダウコーニング・シリコーン株式会社 オルガノポリシロキサンおよびその製造方法
US5319005A (en) 1992-01-27 1994-06-07 Hitachi Chemical Co., Ltd. Epoxy resin molding material for sealing of electronic component
JP3193106B2 (ja) 1992-03-05 2001-07-30 日東電工株式会社 エポキシ樹脂組成物の硬化方法および硬化物
JP3367964B2 (ja) 1992-04-21 2003-01-20 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
JP3786139B2 (ja) 1992-05-26 2006-06-14 東レ・ダウコーニング株式会社 硬化性シリコーン組成物
JP3251655B2 (ja) * 1992-08-05 2002-01-28 東レ・ダウコーニング・シリコーン株式会社 ジオルガノポリシロキサンおよびその製造方法
US5645941A (en) 1992-11-19 1997-07-08 Shin-Etsu Chemical Co., Ltd. Silicone resin/silicone rubber composite material
EP0620242B1 (de) * 1993-04-15 1998-08-19 Dow Corning Toray Silicone Company, Limited Epoxygruppen enthaltendes Siliconharz und Massen auf seiner Basis
US5952439A (en) 1993-04-15 1999-09-14 Dow Corning Toray Silicone Co., Ltd. Epoxy group-containing silicone resin and compositions based thereon
JP2781799B2 (ja) 1993-04-20 1998-07-30 信越ポリマー株式会社 硬質キートップ押釦スイッチ用カバー部材
JP2812139B2 (ja) 1993-04-27 1998-10-22 信越化学工業株式会社 エポキシ樹脂組成物
JP2695598B2 (ja) 1993-06-30 1997-12-24 住友ベークライト株式会社 ダイボンディング材
JP3466239B2 (ja) 1993-08-18 2003-11-10 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
DE69407137T2 (de) 1993-10-06 1998-04-09 Dow Corning Toray Silicone Mit Silber gefüllte, elektrisch leitfähige Organosiloxan-Zusammensetzungen
JP3035135B2 (ja) 1993-10-25 2000-04-17 住友ベークライト株式会社 ダイボンディング材
JPH07133351A (ja) 1993-11-08 1995-05-23 Shin Etsu Chem Co Ltd エポキシ変性シリコーンの製造方法
JP2834658B2 (ja) 1993-12-02 1998-12-09 住友ベークライト株式会社 半導体用導電性樹脂ペースト
TW343218B (en) 1994-03-25 1998-10-21 Shinetsu Chem Ind Co Integral composite consisted of polysiloxane rubber and epoxy resin and process for producing the same
DE4424105A1 (de) 1994-07-08 1996-01-11 Bayer Ag Epoxigruppen enthaltende Siloxane und ihre Mischungen mit Polycarbonaten
JP3574226B2 (ja) 1994-10-28 2004-10-06 東レ・ダウコーニング・シリコーン株式会社 硬化性シリコーン組成物およびその硬化物
TW296400B (de) 1994-11-17 1997-01-21 Shinetsu Chem Ind Co
JP3516764B2 (ja) 1995-03-08 2004-04-05 アピックヤマダ株式会社 リリースフィルムを用いる樹脂モールド装置及び樹脂モールド方法
US5575956A (en) 1995-07-19 1996-11-19 Hughes Aircraft Company Room-temperature stable, one-component, electrically-conductive, flexible epoxy adhesives
JP3313267B2 (ja) 1995-09-28 2002-08-12 住友ベークライト株式会社 導電性樹脂ペースト
JPH1036510A (ja) 1996-07-26 1998-02-10 Toray Dow Corning Silicone Co Ltd 電気部品およびその製造方法
JP3411164B2 (ja) 1996-10-31 2003-05-26 住友ベークライト株式会社 ダイアタッチペースト
JPH10147764A (ja) 1996-11-20 1998-06-02 Sumitomo Bakelite Co Ltd ダイアタッチペースト及び半導体装置
US5859127A (en) 1996-11-29 1999-01-12 Shin-Etsu Polymer Co., Ltd. Thermosetting resin composition and two-parts composite body thereof with silcone rubber
US5998509A (en) * 1996-11-29 1999-12-07 Kabushiki Kaisha Toshiba Resin composition and semiconductor device employing the same
JP3313292B2 (ja) 1996-12-04 2002-08-12 住友ベークライト株式会社 ダイアタッチペースト
JP3420473B2 (ja) 1997-04-30 2003-06-23 東レ・ダウコーニング・シリコーン株式会社 シリコーン系接着性シート、その製造方法、および半導体装置
JPH1177733A (ja) 1997-09-01 1999-03-23 Apic Yamada Kk 樹脂モールド方法及び樹脂モールド装置
US6117953A (en) 1998-01-22 2000-09-12 Shin-Etsu Chemical Co., Ltd. Liquid epoxy resin composition for ball grid array package
JP2000198929A (ja) 1998-10-30 2000-07-18 Dow Corning Toray Silicone Co Ltd 複合成形用シリコーンゴム組成物
JP2000230039A (ja) 1998-12-08 2000-08-22 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
JP3494586B2 (ja) 1999-03-26 2004-02-09 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
US6512031B1 (en) 1999-04-15 2003-01-28 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition, laminate film using the same, and semiconductor device
US6861482B2 (en) 1999-05-18 2005-03-01 General Electric Company Weatherable, thermostable polymers having improved flow composition
US7169859B2 (en) 1999-05-18 2007-01-30 General Electric Company Weatherable, thermostable polymers having improved flow composition
TW521256B (en) * 2000-05-18 2003-02-21 Semiconductor Energy Lab Electronic device and method of driving the same
JP4646357B2 (ja) 2000-06-08 2011-03-09 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP2002020719A (ja) 2000-07-11 2002-01-23 Shin Etsu Chem Co Ltd シリコーンゴム接着剤組成物及び該接着剤組成物と熱可塑性樹脂との一体成形体
JP4278309B2 (ja) * 2001-01-24 2009-06-10 ニチアス株式会社 シリコーン表面層を有するフッ素ゴム成形体及びフッ素ゴム成形体の表面処理法
US6709756B2 (en) 2001-05-21 2004-03-23 Shin-Etsu Chemical Co., Ltd. Optical device-related adhesive and optical device
US7074936B2 (en) 2001-05-29 2006-07-11 Vanderbilt University Cleavable surfactants and methods of use thereof
JP4948716B2 (ja) 2001-06-29 2012-06-06 東レ・ダウコーニング株式会社 硬化性エポキシ樹脂組成物
US6632892B2 (en) 2001-08-21 2003-10-14 General Electric Company Composition comprising silicone epoxy resin, hydroxyl compound, anhydride and curing catalyst
JP3803058B2 (ja) 2001-12-11 2006-08-02 信越化学工業株式会社 熱伝導性シリコーン組成物、その硬化物及び敷設方法並びにそれを用いた半導体装置の放熱構造体
JP4050070B2 (ja) * 2002-02-28 2008-02-20 東レ・ダウコーニング株式会社 シリコーンレジン組成物、硬化性樹脂組成物、および硬化物
JP4663969B2 (ja) 2002-07-09 2011-04-06 東レ・ダウコーニング株式会社 硬化性シリコーンレジン組成物およびその硬化物
JP2004043814A (ja) 2002-07-15 2004-02-12 Dow Corning Toray Silicone Co Ltd シリコーン系接着性シート、半導体チップと該チップ取付部の接着方法、および半導体装置
JP4409160B2 (ja) * 2002-10-28 2010-02-03 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP4607429B2 (ja) 2003-03-25 2011-01-05 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
US7116948B2 (en) * 2003-04-25 2006-10-03 Broadcom Corporation High-speed signal power detection circuit
JP2004352947A (ja) 2003-05-30 2004-12-16 Shin Etsu Chem Co Ltd 室温硬化型熱伝導性シリコーンゴム組成物
KR100517075B1 (ko) 2003-08-11 2005-09-26 삼성전자주식회사 반도체 소자 제조 방법
JP2005075959A (ja) 2003-09-01 2005-03-24 Dow Corning Toray Silicone Co Ltd 粘着性シリコーンエラストマーシート
US20050267286A1 (en) 2003-10-20 2005-12-01 Shinya Nakamura Curing accelerator for curing resin, curing resin composition, electronic component device and method for producing phosphine derivative
TWI345576B (en) 2003-11-07 2011-07-21 Dow Corning Toray Silicone Curable silicone composition and cured product thereof
JP4803339B2 (ja) 2003-11-20 2011-10-26 信越化学工業株式会社 エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
JP5101788B2 (ja) 2003-12-22 2012-12-19 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
JP4903987B2 (ja) 2004-03-19 2012-03-28 東レ・ダウコーニング株式会社 半導体装置の製造方法
JP2006063092A (ja) 2004-07-29 2006-03-09 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン組成物、その硬化方法、光半導体装置および接着促進剤
CN1737072B (zh) 2004-08-18 2011-06-08 播磨化成株式会社 导电粘合剂及使用该导电粘合剂制造物件的方法
JP5166677B2 (ja) * 2005-03-15 2013-03-21 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP4931366B2 (ja) 2005-04-27 2012-05-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5004433B2 (ja) 2005-04-27 2012-08-22 東レ・ダウコーニング株式会社 硬化性シリコーン組成物およびその硬化物
JP4017645B2 (ja) 2005-12-22 2007-12-05 横浜ゴム株式会社 湿気硬化性樹脂組成物
JP5207591B2 (ja) * 2006-02-23 2013-06-12 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
JP5285846B2 (ja) * 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5238157B2 (ja) * 2006-12-25 2013-07-17 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5248012B2 (ja) * 2006-12-25 2013-07-31 東レ・ダウコーニング株式会社 硬化性シリコーン組成物

Also Published As

Publication number Publication date
EP1874870B1 (de) 2008-10-08
JP2006306954A (ja) 2006-11-09
TW200708566A (en) 2007-03-01
TWI386461B (zh) 2013-02-21
US8338527B2 (en) 2012-12-25
DE602006003085D1 (de) 2008-11-20
KR101187601B1 (ko) 2012-10-11
KR20070122512A (ko) 2007-12-31
CN101166792A (zh) 2008-04-23
US20090203837A1 (en) 2009-08-13
JP4931366B2 (ja) 2012-05-16
CN101166792B (zh) 2011-07-20
WO2006118335A1 (en) 2006-11-09
EP1874870A1 (de) 2008-01-09

Similar Documents

Publication Publication Date Title
ATE410484T1 (de) Härtbare silikonzusammensetzung und elektronische komponenten
ATE408649T1 (de) Härtbare silikonzusammensetzung und daraus hergestellte elektronische vorrichtung
ATE441687T1 (de) Durch hydrosilylierung gehärtetes silikonharz mit hoher bruchzähigkeit
DE602007003724D1 (de) Härtbare organopolysiloxan-zusammensetzung und halbleiterbauelement
ATE547481T1 (de) Härtbare silikonzusammensetzung und härteprodukt daraus
DE602007006345D1 (de) Härtbare silikonzusammensetzung und elektronikbauteil
DE602004026456D1 (de) Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung
MY148272A (en) Curable silicone composition
ATE463536T1 (de) Silikonelastomerklebefolie
DE602007002402D1 (de) Haftvermittler, härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung
TW200738828A (en) Curable silicone rubber compositions and cured products thereof
MY156257A (en) Curable organopolysiloxane composition and semiconductor device
TW200736342A (en) Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones
MY143836A (en) Adhesive composition and ahdesive film therefrom
TW200734377A (en) Phenol resin and resin composition
DE602007005661D1 (de) Härtbare silikonzusammensetzung und elektronikbauteil
EP2557103A4 (de) Epoxidverbindung, härtbare zusammensetzung und gehärtetes produkt daraus
WO2009072632A1 (ja) 硬化性組成物、光学素子コーティング用組成物、およびｌｅｄ封止用材料ならびにその製造方法
MY165894A (en) Epoxy resin molding material for encapsulation and electronic component device including element encapsulated with same
TW200734403A (en) Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element
DE602006003433D1 (de) Härtbare organopolysiloxanzusammensetzung
JP2009138166A5 (de)
EP2033984A3 (de) Wärmehärtbare Polyimidsilikonzusammensetzung und gehärtete Folie daraus
JP2017500394A5 (de)
MY156450A (en) Curable resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties