MY165894A - Epoxy resin molding material for encapsulation and electronic component device including element encapsulated with same - Google Patents

Epoxy resin molding material for encapsulation and electronic component device including element encapsulated with same

Info

Publication number
MY165894A
MY165894A MYPI2013700814A MYPI2013700814A MY165894A MY 165894 A MY165894 A MY 165894A MY PI2013700814 A MYPI2013700814 A MY PI2013700814A MY PI2013700814 A MYPI2013700814 A MY PI2013700814A MY 165894 A MY165894 A MY 165894A
Authority
MY
Malaysia
Prior art keywords
epoxy resin
encapsulation
molding material
resin molding
electronic component
Prior art date
Application number
MYPI2013700814A
Inventor
Kenji Tanaka
Mitsuyoshi Hamada
Fumio Furusawa
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of MY165894A publication Critical patent/MY165894A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

EPOXY RESIN MOLDING MATERIAL FOR ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE INCLUDING ELEMENT ENCAPSULATED WITH SAME The invention provides an epoxy resin molding material for encapsulation, including (A) an epoxy resin having at least two epoxy groups in one molecule thereof, (B) a curing agent, and (C) a monovalent or divalent phenol derivative having at least one nitrile group in a molecular structure thereof. Preferably, the content of (C) the monovalent or divalent phenol derivative having at least one nitrile group in the molecular structure thereof is from 0.1% mass to 1.0% by mass. Further, the epoxy resin molding material for encapsulation preferably includes (D) a silane compound, (E) a curing accelerator, and (F) an inorganic filler. An electronic component device including an element encapsulated with the epoxy resin molding material for encapsulation is also provided.
MYPI2013700814A 2010-11-26 2011-11-10 Epoxy resin molding material for encapsulation and electronic component device including element encapsulated with same MY165894A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010263558 2010-11-26
JP2011240690A JP5906673B2 (en) 2010-11-26 2011-11-01 Epoxy resin molding material for sealing, and electronic component device provided with element sealed with this molding material

Publications (1)

Publication Number Publication Date
MY165894A true MY165894A (en) 2018-05-18

Family

ID=46145750

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013700814A MY165894A (en) 2010-11-26 2011-11-10 Epoxy resin molding material for encapsulation and electronic component device including element encapsulated with same

Country Status (5)

Country Link
JP (1) JP5906673B2 (en)
CN (1) CN103221452B (en)
MY (1) MY165894A (en)
TW (1) TWI568788B (en)
WO (1) WO2012070402A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6291742B2 (en) * 2013-08-12 2018-03-14 日立化成株式会社 Resin composition, adhesion auxiliary layer for plating process, adhesion auxiliary layer for plating process with support, laminated board for wiring board, method for producing laminated board for wiring board, multilayer wiring board, and method for producing multilayer wiring board
CN106553350A (en) * 2015-09-30 2017-04-05 明光市奇美橡塑有限公司 A kind of production method of high intensity oil sealing
CN105419232A (en) * 2015-12-03 2016-03-23 佛山市顺德区创格电子实业有限公司 Epoxy resin composition for capacitor
JP6916997B2 (en) * 2016-03-17 2021-08-11 富士電機株式会社 Semiconductor device
TWI724162B (en) * 2016-04-28 2021-04-11 日商昭和電工材料股份有限公司 Epoxy resin composition and electronic component apparatus
JP6520872B2 (en) * 2016-09-01 2019-05-29 信越化学工業株式会社 Thermosetting resin composition for semiconductor encapsulation
KR102450897B1 (en) * 2017-03-31 2022-10-04 쇼와덴코머티리얼즈가부시끼가이샤 Protective material for electronic circuit, protective sealing material for electronic circuit, sealing method, and method for manufacturing semiconductor device
KR20200094221A (en) * 2017-12-28 2020-08-06 히타치가세이가부시끼가이샤 Epoxy resin composition for sealing a ball grid array package, cured epoxy resin, and electronic component device
WO2021020081A1 (en) * 2019-07-26 2021-02-04 富士フイルム株式会社 Composition for forming heat-conducting material, heat-conducting material, heat-conducting sheet, and device with heat-conducting layer
CN113201302B (en) * 2021-05-06 2023-03-03 黑龙江省科学院石油化学研究院 Diamino bisphthalonitrile modified epoxy resin adhesive and preparation method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0780435A1 (en) * 1995-12-21 1997-06-25 National Starch and Chemical Investment Holding Corporation Flexible epoxy adhesives with low bleeding tendency
JPH09302070A (en) * 1996-05-20 1997-11-25 Sumitomo Metal Ind Ltd Thermosetting epoxy resin composition, its use, and its curative
JPH10130189A (en) * 1996-10-25 1998-05-19 Sumitomo Chem Co Ltd Polyhydric phenol compound, and resin composition using the same
JP4572522B2 (en) * 2003-07-31 2010-11-04 Ｄｉｃ株式会社 Epoxy resin composition, cured epoxy resin, and novolac resin
EP2237110B1 (en) * 2008-01-30 2018-07-18 Nissan Chemical Industries, Ltd. Sulfur atom-containing composition for resist underlayer film formation and method for resist pattern formation

Also Published As

Publication number Publication date
TW201229124A (en) 2012-07-16
CN103221452A (en) 2013-07-24
WO2012070402A1 (en) 2012-05-31
JP2012126891A (en) 2012-07-05
JP5906673B2 (en) 2016-04-20
CN103221452B (en) 2016-06-22
TWI568788B (en) 2017-02-01

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