CN105419232A - Epoxy resin composition for capacitor - Google Patents
Epoxy resin composition for capacitor Download PDFInfo
- Publication number
- CN105419232A CN105419232A CN201510874821.2A CN201510874821A CN105419232A CN 105419232 A CN105419232 A CN 105419232A CN 201510874821 A CN201510874821 A CN 201510874821A CN 105419232 A CN105419232 A CN 105419232A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- resin composition
- capacitor
- calcium carbonate
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/022—Electrolytes; Absorbents
- H01G9/025—Solid electrolytes
Abstract
The invention relates to an epoxy resin composition for a capacitor. The epoxy resin composition comprises the following components by percentage: 36.44% of epoxy resin, 7% of dioctyl phthalate, 1.9% of red phosphorus, 0.44% of a toner, 40% of aluminum hydroxide, 14% of calcium carbonate and 0.22% of a defoaming agent. Sediments can be reduced; the viscosity is increased; and corrosion to an internal metal layer in a core are completely eradicated, and the like.
Description
Technical field
The present invention relates to a kind of Epoxy Resin Technology field of electrical condenser, especially a kind of capacitor epoxy resin composition improving formula.
Background technology
At present, the epoxy resin of traditional capacitor encapsulation, containing thinner, make in resin more containing throw out, thus reduce overall viscosity, easy appearance does not solidify phenomenon, thus the electrical property under reducing Working environment; And the metal layer strip of thinner meeting corrosion capacitance device fuse inside.
In addition, the epoxy resin of traditional electrical condenser, the silicon powder containing HG-600 type, it has the hexagonal prism crystalline structure of 3D shape, easily the rifle head of wearing and tearing automatic filling and sealing machine.
Summary of the invention
The object of the invention is to solve above-mentioned the deficiencies in the prior art, and a kind of new capacitor epoxy resin composition is provided, can throw out be reduced, add bounding force (viscosity), stop the corrosion etc. of the inner metal layer to fuse inside.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of capacitor epoxy resin composition, is characterized in that, comprise following percent composition: 36.44% epoxy resin, 7% dibutyl ester, 1.9% red phosphorus, 0.44% toner, 40% aluminium hydroxide, 14% calcium carbonate and 0.22% defoamer.
The present invention can also adopt following technical measures to solve:
Described calcium carbonate is HD-600 type.
The invention has the beneficial effects as follows:
(1) capacitor epoxy resin composition of the present invention, adds aluminium hydroxide ratio, increases the ratio of dibutyl ester, thus adds viscosity; Eliminate thinner, thus decrease precipitation, improve the bounding force problem of epoxy resin and the plastic capacitor shell prepared, make epoxy resin and shell bounding force stronger, thus improve the electrical property of electrical condenser under two 85 environment of humidity RH85% and temperature 85 DEG C.
(2) capacitor epoxy resin composition of the present invention, compared to existing technology, eliminates the effect of thinner, can stop the corrosive nature of the metal level to capacitor body inside, effectively extends the work-ing life of fuse.
(3) capacitor epoxy resin composition of the present invention, dibutyl ester is added while cancelling thinner, its effect is: the epoxy resin viscosity prepared is increased, and prevents precipitation (lack of proper care than regular meeting after precipitation causes epoxy resin to mix with epoxy hardener in prior art thus cause epoxy not solidify phenomenon and occur)
(4) capacitor epoxy resin composition of the present invention, the performances such as aluminium hydroxide is wherein sheet structure, and oilness is good, instead of silicon powder of the prior art thus are applicable to the use of automatic filling and sealing machine, effectively enhance productivity, the rifle head of automatic filling and sealing machine is worn and torn little.
Embodiment
Below in conjunction with embodiment, the present invention is further described.
A kind of capacitor epoxy resin composition, is characterized in that comprising following percent composition: 36.44% epoxy resin, 7% dibutyl ester, 1.9% red phosphorus, 0.44% toner, 40% aluminium hydroxide, 14% calcium carbonate and 0.22% defoamer.
Further, described calcium carbonate is HD-600 type.
Above-described specific embodiment, is only preferred embodiment of the present invention, such as according to the equivalent arrangements that the present patent application the scope of the claims does, all should be technology of the present invention and contained.
Claims (2)
1. a capacitor epoxy resin composition, is characterized in that, comprises following percent composition: 36.44% epoxy resin, 7% dibutyl ester, 1.9% red phosphorus, 0.44% toner, 40% aluminium hydroxide, 14% calcium carbonate and 0.22% defoamer.
2. capacitor epoxy resin composition according to claim 1, it is characterized in that, described calcium carbonate is HD-600 type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510874821.2A CN105419232A (en) | 2015-12-03 | 2015-12-03 | Epoxy resin composition for capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510874821.2A CN105419232A (en) | 2015-12-03 | 2015-12-03 | Epoxy resin composition for capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105419232A true CN105419232A (en) | 2016-03-23 |
Family
ID=55497796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510874821.2A Pending CN105419232A (en) | 2015-12-03 | 2015-12-03 | Epoxy resin composition for capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105419232A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1546566A (en) * | 2003-12-12 | 2004-11-17 | 无锡市化工研究设计院 | Molding compound for sheet tantalum capacitor |
| CN102888081A (en) * | 2012-09-24 | 2013-01-23 | 沈阳爱迪生科技有限公司 | Flame-retardant encapsulating material and preparation method thereof |
| CN103221452A (en) * | 2010-11-26 | 2013-07-24 | 日立化成株式会社 | Epoxy resin based molding material for sealing and electronic part or device provided with element sealed with this molding material |
-
2015
- 2015-12-03 CN CN201510874821.2A patent/CN105419232A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1546566A (en) * | 2003-12-12 | 2004-11-17 | 无锡市化工研究设计院 | Molding compound for sheet tantalum capacitor |
| CN103221452A (en) * | 2010-11-26 | 2013-07-24 | 日立化成株式会社 | Epoxy resin based molding material for sealing and electronic part or device provided with element sealed with this molding material |
| CN102888081A (en) * | 2012-09-24 | 2013-01-23 | 沈阳爱迪生科技有限公司 | Flame-retardant encapsulating material and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160323 |
|
| RJ01 | Rejection of invention patent application after publication |