CN1546566A - Molding compound for sheet tantalum capacitor - Google Patents
Molding compound for sheet tantalum capacitor Download PDFInfo
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- CN1546566A CN1546566A CNA2003101126530A CN200310112653A CN1546566A CN 1546566 A CN1546566 A CN 1546566A CN A2003101126530 A CNA2003101126530 A CN A2003101126530A CN 200310112653 A CN200310112653 A CN 200310112653A CN 1546566 A CN1546566 A CN 1546566A
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- moulding compound
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- epoxy resin
- coupling agent
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Abstract
The invention discloses a molded plastic compound for sheet tantalum capacitor, which is an epoxy resin compound and belongs to the field of special-purpose plastic encapsulating material in electronic industry. The molded plastic uses epoxy resin as the main block resin and phenolic resins as curing agent, prepared by adding solidification accelerating agent, filling material, releasing agent, combustion inhibitor, coloring agent, coupling agent, toughening agent and modifier though the steps of disintegrating, mixing, pugging, cooling down, disintegrating, batch mixing, pre-forming and packaging.
Description
Technical field
A kind of moulding compound that is used for chip tantalum capacitor is a kind of epoxy resin composite, belongs to electronic industry special plastic packaged material technical field.
Background technology
Electronic component develops to the chip type direction and becomes a kind of trend.Premium propertiess such as chip tantalum capacitor has that volume is little, capacity is big, applied range, reliability height, power are big, low ESR, its application develops into the civilian industry field from initial war industry, and the eighties rises and expands in the information industries such as small-size computer, movable type and portable communicating tool.
The chip tantalum capacitor moulding compound is a critical material of making chip tantalum capacitor, as mold pressing plastic packaging shell, is high, the professional extremely strong proprietary material of a kind of performance requriements mainly, and the quality of its quality will directly influence the qualification rate and the work-ing life of product.
Consult according to documents and materials, the moulding compound that is used for chip tantalum capacitor is reported that seldom these product performance characteristics are very outstanding abroad, professional fairly obvious, technical requirements is high.It is predicted, will reach more than 300 tons to the market demand of China's chip tantalum capacitor moulding compound in 2005, and the development of homemade special-purpose chip tantalum capacitor moulding compound and produce and still be in the starting stage.
Summary of the invention
The purpose of this invention is to provide a kind of moulding compound that is used for chip tantalum capacitor.
Technical scheme of the present invention
Moulding compound of the present invention, the quality percentage prescription of its essentially consist is:
Resins, epoxy 10～30
Solidifying agent 5～15
Curing catalyst 0.1～1.5
Filler 50～80
Releasing agent 0.2～2
Fire retardant 0.3～3
Tinting material 0.1～5
Coupling agent 0.2～3
Toughner 0～2
Properties-correcting agent 0～2
It is matrix resin that product of the present invention adopts Resins, epoxy, resol is solidifying agent, add curing catalyst, filler, fire retardant, releasing agent, tinting material, coupling agent, toughner and properties-correcting agent, through pulverizing, mixing, mixing, cooling, pulverizing, batch mixing close, premolding, packaging process is prepared from.Its formulating of recipe is reasonable, and is practical.
The composition of Resins, epoxy
Resins, epoxy is the main component of moulding compound, accounts for 10～30% of moulding compound gross weight.As matrix resin, Resins, epoxy itself can not solidify in the moulding compound system, mainly produces cross-linking and curing reaction by solidifying agent, curing catalyst under the effect of heat, finally becomes thermosetting resin.
The Resins, epoxy of product of the present invention is mixed system, wherein the mass percent of each component is: the selection softening temperature is 50～130 ℃ an ortho-cresol linear loop epoxy resins 50～95%, cycloaliphatic epoxy resin or biphenyl type epoxy resin 0～15%, bisphenol A type epoxy resin 0～15%, brominated epoxy resin 5～30% forms through thorough mixing.
Solidifying agent
Solidifying agent is the important composition of epoxy molding plastic, accounts for 5～15% of moulding compound gross weight, and its effect is to make moulding compound that crosslinking reaction can take place under certain conditions, generates not molten insoluble reticulation.
The solidifying agent of product of the present invention is 90～100 parts with linear phenolic resin, adds 0～10 part of trimellitic acid 1,2-anhydride, tetrahydrophthalic anhydride, HHPA, Dyhard RU 100 and/or polymeric amide etc. and forms solidifying agent.
Curing catalyst
Curing catalyst is one of requisite composition of epoxy molding plastic, accounts for 0.1～1.5% of moulding compound gross weight, and its effect is the curing that promotes Resins, epoxy, improves the curing performance of moulding compound.
The curing catalyst kind of product of the present invention has: methylimidazole, phenylimidazole, undecane imidazoles, 2-ethyl-4-methylimidazole, triphenylphosphine and derivative thereof, bicyclic amidine (DBU) and derivative or salt.
Filler
Filler also is the important composition of epoxy molding plastic, accounts for 50～80% of moulding compound gross weight.The main effect of filler is to improve thermal conductivity, reduction thermal expansivity and shaping shrinkage rate, also can play enhancement, improves reliability.
The filler of product of the present invention is mainly silicon powder, and fineness is 300～1200 orders.Concrete kind has: crystalline silicon powder, fusion silicon powder, ball-shaped silicon micro powder etc.
Releasing agent
Releasing agent is the auxiliary agent composition of epoxy molding plastic, accounts for 0.2～2% of moulding compound gross weight.The effect of releasing agent is to make moulding compound be easy to the demoulding after compression molding, but does not influence the performance of Laser Printing.
The releasing agent kind of product of the present invention has: stearic acid, calcium stearate, Zinic stearas, Ka Naba wax, illiteracy holder wax, paraffin, Hoechst wax etc.
Fire retardant
Fire retardant is the auxiliary agent composition of epoxy molding plastic, accounts for 0.3～3% of moulding compound gross weight.The effect of fire retardant is to make moulding compound possess the affiliated nonflammable performance of non-dangerous goods.
The fire retardant kind of product of the present invention has: antimonous oxide, red phosphorus, phosphoric acid ester.
Tinting material
Tinting material is the important composition of epoxy molding plastic, accounts for 0.1～5% of moulding compound gross weight.The main effect of tinting material gives epoxy molding plastic required appearance color.
The concrete kind of product tinting material of the present invention has: carbon black, iron oxide red, iron oxide yellow, chrome green, phthalocyanine blue, permanent violet, titanium dioxide etc.
Coupling agent
Coupling agent is the auxiliary agent composition of epoxy molding plastic, accounts for 0.2～3% of moulding compound gross weight.The effect of coupling agent is that the avidity between the moulding compound each component is improved.
The coupling agent kind of product of the present invention has: silane coupling agent, titanate coupling agent.
Toughner
Toughner is the auxiliary agent composition of epoxy molding plastic, accounts for 0～2% of moulding compound gross weight.The effect of toughner is to make moulding compound have certain soft flexible energy.
The toughner kind of product of the present invention has: silicon rubber, terminal hydroxy group modified butadiene acrylonitrile rubber.
Properties-correcting agent
Properties-correcting agent is the auxiliary agent composition of epoxy molding plastic, accounts for 0～2% of moulding compound gross weight.The effect of properties-correcting agent is to make moulding compound possess comprehensive performance.
The properties-correcting agent kind of product of the present invention has: silicone oil, white carbon black etc.
Beneficial effect of the present invention
This product is the crucial starting material of chip tantalum capacitor plastic packaging, and it has higher thermotolerance, fast process-cycle, good plasticity, low linear expansivity, outstanding humidity resistance and resistance to sudden heating.This product detects by analysis and through the finished product examination, every technical indicator has all reached the requirement of regulation.
Constant product quality of the present invention, quality conformance is good, and Steadydamp-heat, property at high and low temperature are all qualified, can satisfy chip tantalum capacitor and produce the mould pressing process parameter request, and formulating of recipe is reasonable, and is practical.
Embodiment
Embodiment 1
O-cresol epoxy resin 90kg, brominated epoxy resin 10kg thorough mixing is even, add linear phenolic resin 50kg, methylimidazole 1kg, carbon black 2kg, Ka Naba wax 2kg, molten silicon micro mist 400kg, antimonous oxide 6kg, silane coupling agent 4kg, silicon rubber 1kg, through pulverizing, mixing, mixing, cooling, pulverizing, batch mixing close, premolding, packaging process is prepared from the chip tantalum capacitor moulding compound.
After testing, the helical length of flow is 70cm, and the hot plate gel time is 30s (160 ℃), and heat-drawn wire is 163 ℃, and flexural strength is 127MPa.Be applicable to the compression molding that requires high-intensity chip tantalum capacitor.
Embodiment 2
O-cresol epoxy resin 85kg, brominated epoxy resin 10kg, bisphenol A epoxide resin 5kg thorough mixing is even, add linear phenolic resin 50kg, methylimidazole 1kg, iron oxide yellow 6kg, Ka Naba wax 2kg, molten silicon micro mist 300kg, silicon metal micro mist 100kg, antimonous oxide 6kg, silane coupling agent 4kg, silicon rubber 1kg, through pulverizing, mixing, mixing, cooling, pulverizing, batch mixing close, premolding, packaging process is prepared from the chip tantalum capacitor moulding compound.
After testing, the helical length of flow is 80cm, and the hot plate gel time is 33s (160 ℃), and heat-drawn wire is 155 ℃, and flexural strength is 120MPa.Be applicable to the compression molding of the demanding chip tantalum capacitor of plasticity.
Embodiment 3
O-cresol epoxy resin 85kg, brominated epoxy resin 10kg, cycloaliphatic epoxy resin 5kg thorough mixing is even, add linear phenolic resin 50kg, methylimidazole 1kg, phthalocyanine blue 3kg, Ka Naba wax 2kg, molten silicon micro mist 300kg, ball-shaped silicon micro powder 100kg, antimonous oxide 6kg, silane coupling agent 4kg, silicon rubber 1kg, through pulverizing, mixing, mixing, cooling, pulverizing, batch mixing close, premolding, packaging process is prepared from the chip tantalum capacitor moulding compound.
After testing, the helical length of flow is 75cm, and the hot plate gel time is 28s (160 ℃), and heat-drawn wire is 176 ℃, and flexural strength is 118MPa.Be applicable to the compression molding of the demanding chip tantalum capacitor of thermotolerance.
Claims (9)
1. moulding compound that is used for chip tantalum capacitor, the quality percentage prescription of its essentially consist is:
Resins, epoxy 10～30
Solidifying agent 5～15
Curing catalyst 0.1～1.5
Filler 50～80
Releasing agent 0.2～2
Fire retardant 0.3～3
Tinting material 0.1～5
Coupling agent 0.2～3
Toughner 0～2
Properties-correcting agent 0～2
2. moulding compound according to claim 1, it is characterized in that used Resins, epoxy, wherein the mass percent of each component is: softening temperature is 50～130 ℃ an ortho-cresol linear loop epoxy resins 50～95%, cycloaliphatic epoxy resin or biphenyl type epoxy resin 0～15%, bisphenol A type epoxy resin 0～15%, brominated epoxy resin 5～30% forms through thorough mixing.
3. moulding compound according to claim 1, it is characterized in that used solidifying agent is: with linear phenolic resin is 90～100 parts, adds 0～10 part of trimellitic acid 1,2-anhydride, tetrahydrophthalic anhydride, HHPA, Dyhard RU 100 and/or polymeric amide and forms solidifying agent.
4. moulding compound according to claim 1 is characterized in that used curing catalyst is: methylimidazole, phenylimidazole, undecane imidazoles, 2-ethyl-4-methylimidazole, triphenylphosphine or bicyclic amidine.
5. moulding compound according to claim 1, it is characterized in that used filler is: crystalline silicon powder, fusion silicon powder, ball-shaped silicon micro powder, fineness are 300～1200 orders.
6. moulding compound according to claim 1 is characterized in that used releasing agent is: stearic acid, calcium stearate, Zinic stearas, Ka Naba wax, illiteracy holder wax, paraffin, Hoechst wax.
7. moulding compound according to claim 1 is characterized in that used fire retardant is: antimonous oxide, red phosphorus, phosphoric acid ester.
8. moulding compound according to claim 1 is characterized in that used tinting material is: carbon black, iron oxide red, iron oxide yellow, chrome green, phthalocyanine blue, permanent violet, titanium dioxide.
9. moulding compound according to claim 1 is characterized in that used coupling agent is: silane coupling agent, titanate coupling agent; The toughening agent is: silicon rubber, terminal hydroxy group modified butadiene acrylonitrile rubber; Used properties-correcting agent is: silicone oil, white carbon black.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2003101126530A CN1546566A (en) | 2003-12-12 | 2003-12-12 | Molding compound for sheet tantalum capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2003101126530A CN1546566A (en) | 2003-12-12 | 2003-12-12 | Molding compound for sheet tantalum capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1546566A true CN1546566A (en) | 2004-11-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNA2003101126530A Pending CN1546566A (en) | 2003-12-12 | 2003-12-12 | Molding compound for sheet tantalum capacitor |
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Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100532490C (en) * | 2005-08-05 | 2009-08-26 | 比亚迪股份有限公司 | Encapsulating material and method for making same |
| CN101870798A (en) * | 2010-06-29 | 2010-10-27 | 北京玻钢院复合材料有限公司 | Epoxy resin dough moulding compound and preparation method thereof |
| CN102010576A (en) * | 2010-09-11 | 2011-04-13 | 汕头市骏码凯撒有限公司 | Repairable type epoxy resin encapsulating glue and preparation method thereof |
| CN102031081A (en) * | 2010-11-26 | 2011-04-27 | 烟台德邦电子材料有限公司 | Liquid epoxy encapsulating material and preparation method thereof |
| CN101246764B (en) * | 2007-02-12 | 2012-09-26 | Ls电线有限公司 | Composite for overhead transmission cable and method for preparing thereof |
| CN103897350A (en) * | 2014-04-17 | 2014-07-02 | 苏州生益科技有限公司 | Thermosetting resin composition and prepreg and laminated board prepared therefrom |
| CN104017332A (en) * | 2014-06-09 | 2014-09-03 | 浙江恒耀电子材料有限公司 | Preparation method for environment-friendly epoxy molding composite material for encapsulating tantalum capacitor |
| CN104262916A (en) * | 2014-09-17 | 2015-01-07 | 铜陵新力电子有限公司 | Special packing for durable capacitor rubber diaphragm and preparation method of packing |
| CN105419232A (en) * | 2015-12-03 | 2016-03-23 | 佛山市顺德区创格电子实业有限公司 | Epoxy resin composition for capacitor |
| CN105778411A (en) * | 2014-12-18 | 2016-07-20 | 北京首科化微电子有限公司 | Secondary mixing method of epoxy resin composition for semiconductor encapsulation |
| CN105778409A (en) * | 2014-12-18 | 2016-07-20 | 北京首科化微电子有限公司 | Epoxy resin composition for semiconductor packaging, and preparation method thereof |
| CN106084185A (en) * | 2016-06-22 | 2016-11-09 | 柳州市强威锻造厂 | A kind of dicyandiamide based epoxy resin curing formula |
| CN106503394A (en) * | 2016-11-16 | 2017-03-15 | 华南理工大学 | A kind of method of the fractional order circuit model for setting up tantalum electric capacity |
| CN108806975A (en) * | 2018-06-11 | 2018-11-13 | 铜陵市胜美达电子制造有限公司 | A kind of capacitor packing material |
| CN109535508A (en) * | 2018-11-19 | 2019-03-29 | 南昌科悦企业管理咨询有限公司 | A kind of counter body material and preparation method thereof that flame retardant property is good |
| CN109957210A (en) * | 2019-02-18 | 2019-07-02 | 英鸿纳米科技股份有限公司 | A kind of nanoscale electric chip encapsulation material |
| CN116874988A (en) * | 2023-08-02 | 2023-10-13 | 常州天启新新科技有限公司 | High-flame-retardance medium-temperature curing epoxy resin premix and preparation method and application thereof |
-
2003
- 2003-12-12 CN CNA2003101126530A patent/CN1546566A/en active Pending
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100532490C (en) * | 2005-08-05 | 2009-08-26 | 比亚迪股份有限公司 | Encapsulating material and method for making same |
| CN101246764B (en) * | 2007-02-12 | 2012-09-26 | Ls电线有限公司 | Composite for overhead transmission cable and method for preparing thereof |
| CN101870798A (en) * | 2010-06-29 | 2010-10-27 | 北京玻钢院复合材料有限公司 | Epoxy resin dough moulding compound and preparation method thereof |
| CN101870798B (en) * | 2010-06-29 | 2011-11-30 | 北京玻钢院复合材料有限公司 | Epoxy resin dough moulding compound and preparation method thereof |
| CN102010576A (en) * | 2010-09-11 | 2011-04-13 | 汕头市骏码凯撒有限公司 | Repairable type epoxy resin encapsulating glue and preparation method thereof |
| CN102031081A (en) * | 2010-11-26 | 2011-04-27 | 烟台德邦电子材料有限公司 | Liquid epoxy encapsulating material and preparation method thereof |
| CN103897350A (en) * | 2014-04-17 | 2014-07-02 | 苏州生益科技有限公司 | Thermosetting resin composition and prepreg and laminated board prepared therefrom |
| CN103897350B (en) * | 2014-04-17 | 2016-10-26 | 苏州生益科技有限公司 | A kind of compositions of thermosetting resin and use its prepreg made and laminate |
| CN104017332A (en) * | 2014-06-09 | 2014-09-03 | 浙江恒耀电子材料有限公司 | Preparation method for environment-friendly epoxy molding composite material for encapsulating tantalum capacitor |
| CN104262916A (en) * | 2014-09-17 | 2015-01-07 | 铜陵新力电子有限公司 | Special packing for durable capacitor rubber diaphragm and preparation method of packing |
| CN105778411A (en) * | 2014-12-18 | 2016-07-20 | 北京首科化微电子有限公司 | Secondary mixing method of epoxy resin composition for semiconductor encapsulation |
| CN105778409A (en) * | 2014-12-18 | 2016-07-20 | 北京首科化微电子有限公司 | Epoxy resin composition for semiconductor packaging, and preparation method thereof |
| CN105419232A (en) * | 2015-12-03 | 2016-03-23 | 佛山市顺德区创格电子实业有限公司 | Epoxy resin composition for capacitor |
| CN106084185A (en) * | 2016-06-22 | 2016-11-09 | 柳州市强威锻造厂 | A kind of dicyandiamide based epoxy resin curing formula |
| CN106503394A (en) * | 2016-11-16 | 2017-03-15 | 华南理工大学 | A kind of method of the fractional order circuit model for setting up tantalum electric capacity |
| CN106503394B (en) * | 2016-11-16 | 2019-05-14 | 华南理工大学 | A method of establishing the fractional order circuit model of tantalum capacitor |
| CN108806975A (en) * | 2018-06-11 | 2018-11-13 | 铜陵市胜美达电子制造有限公司 | A kind of capacitor packing material |
| CN109535508A (en) * | 2018-11-19 | 2019-03-29 | 南昌科悦企业管理咨询有限公司 | A kind of counter body material and preparation method thereof that flame retardant property is good |
| CN109957210A (en) * | 2019-02-18 | 2019-07-02 | 英鸿纳米科技股份有限公司 | A kind of nanoscale electric chip encapsulation material |
| CN116874988A (en) * | 2023-08-02 | 2023-10-13 | 常州天启新新科技有限公司 | High-flame-retardance medium-temperature curing epoxy resin premix and preparation method and application thereof |
| CN116874988B (en) * | 2023-08-02 | 2024-01-26 | 常州天启新新科技有限公司 | High-flame-retardance medium-temperature curing epoxy resin premix and preparation method and application thereof |
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