ATE378691T1 - Layout und verfahren für eine anordnung mit segmentierter blm (ball limiting metallurgy) für ein- und ausgänge - Google Patents

Layout und verfahren für eine anordnung mit segmentierter blm (ball limiting metallurgy) für ein- und ausgänge

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Publication number
ATE378691T1
ATE378691T1 AT01944413T AT01944413T ATE378691T1 AT E378691 T1 ATE378691 T1 AT E378691T1 AT 01944413 T AT01944413 T AT 01944413T AT 01944413 T AT01944413 T AT 01944413T AT E378691 T1 ATE378691 T1 AT E378691T1
Authority
AT
Austria
Prior art keywords
blm
layout
inputs
outputs
arrangement
Prior art date
Application number
AT01944413T
Other languages
English (en)
Inventor
Krishna Sheshan
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Application granted granted Critical
Publication of ATE378691T1 publication Critical patent/ATE378691T1/de

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    • HELECTRICITY
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    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/03Manufacturing methods
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    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L24/10Bump connectors ; Manufacturing methods related thereto
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    • H01L24/10Bump connectors ; Manufacturing methods related thereto
    • H01L24/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
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    • H01L2224/0401Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Pinball Game Machines (AREA)
  • Electron Beam Exposure (AREA)
AT01944413T 2000-06-28 2001-06-07 Layout und verfahren für eine anordnung mit segmentierter blm (ball limiting metallurgy) für ein- und ausgänge ATE378691T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/606,319 US7034402B1 (en) 2000-06-28 2000-06-28 Device with segmented ball limiting metallurgy

Publications (1)

Publication Number Publication Date
ATE378691T1 true ATE378691T1 (de) 2007-11-15

Family

ID=24427488

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01944413T ATE378691T1 (de) 2000-06-28 2001-06-07 Layout und verfahren für eine anordnung mit segmentierter blm (ball limiting metallurgy) für ein- und ausgänge

Country Status (9)

Country Link
US (3) US7034402B1 (de)
EP (1) EP1297571B1 (de)
CN (1) CN1255875C (de)
AT (1) ATE378691T1 (de)
AU (1) AU2001266828A1 (de)
DE (1) DE60131402T2 (de)
HK (1) HK1052081A1 (de)
MY (2) MY134545A (de)
WO (1) WO2002001637A2 (de)

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WO2002001637A3 (en) 2002-09-26
CN1455955A (zh) 2003-11-12
MY134545A (en) 2007-12-31
DE60131402T2 (de) 2008-09-18
MY152171A (en) 2014-08-15
CN1255875C (zh) 2006-05-10
EP1297571B1 (de) 2007-11-14
US20060131748A1 (en) 2006-06-22
US7033923B2 (en) 2006-04-25
DE60131402D1 (de) 2007-12-27
US7034402B1 (en) 2006-04-25
WO2002001637A2 (en) 2002-01-03
WO2002001637A9 (en) 2003-11-20
US20050158980A1 (en) 2005-07-21
EP1297571A2 (de) 2003-04-02
AU2001266828A1 (en) 2002-01-08

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