CN101755334B - 半导体器件 - Google Patents
半导体器件 Download PDFInfo
- Publication number
- CN101755334B CN101755334B CN200780100002.6A CN200780100002A CN101755334B CN 101755334 B CN101755334 B CN 101755334B CN 200780100002 A CN200780100002 A CN 200780100002A CN 101755334 B CN101755334 B CN 101755334B
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- semiconductor device
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 167
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- 239000000758 substrate Substances 0.000 claims description 171
- 229910052751 metal Inorganic materials 0.000 claims description 90
- 239000002184 metal Substances 0.000 claims description 90
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- 239000011229 interlayer Substances 0.000 claims description 22
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000011651 chromium Substances 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
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- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
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- 239000010937 tungsten Substances 0.000 description 1
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- H01L2924/01—Chemical elements
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- H01L2924/01—Chemical elements
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- H01L2924/01078—Platinum [Pt]
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- H01L2924/01—Chemical elements
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- H01L2924/014—Solder alloys
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- H01L2924/049—Nitrides composed of metals from groups of the periodic table
- H01L2924/0504—14th Group
- H01L2924/05042—Si3N4
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/064601 WO2009013826A1 (ja) | 2007-07-25 | 2007-07-25 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
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CN101755334A CN101755334A (zh) | 2010-06-23 |
CN101755334B true CN101755334B (zh) | 2011-08-31 |
Family
ID=40281089
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN200780100002.6A Expired - Fee Related CN101755334B (zh) | 2007-07-25 | 2007-07-25 | 半导体器件 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20100155941A1 (zh) |
JP (1) | JP5387407B2 (zh) |
KR (1) | KR101095409B1 (zh) |
CN (1) | CN101755334B (zh) |
WO (1) | WO2009013826A1 (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4538764B2 (ja) * | 2008-07-24 | 2010-09-08 | カシオ計算機株式会社 | 半導体装置およびその製造方法 |
JP5350022B2 (ja) * | 2009-03-04 | 2013-11-27 | パナソニック株式会社 | 半導体装置、及び該半導体装置を備えた実装体 |
US8378485B2 (en) | 2009-07-13 | 2013-02-19 | Lsi Corporation | Solder interconnect by addition of copper |
JP5378130B2 (ja) | 2009-09-25 | 2013-12-25 | 株式会社東芝 | 半導体発光装置 |
US8624391B2 (en) * | 2009-10-08 | 2014-01-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chip design with robust corner bumps |
JP2011096918A (ja) * | 2009-10-30 | 2011-05-12 | Oki Semiconductor Co Ltd | 半導体装置および半導体装置の製造方法 |
US9070851B2 (en) | 2010-09-24 | 2015-06-30 | Seoul Semiconductor Co., Ltd. | Wafer-level light emitting diode package and method of fabricating the same |
US9449933B2 (en) | 2012-03-29 | 2016-09-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Packaging device and method of making the same |
JP5475077B2 (ja) * | 2012-09-07 | 2014-04-16 | 日本特殊陶業株式会社 | 配線基板およびその製造方法 |
US9418877B2 (en) | 2014-05-05 | 2016-08-16 | Qualcomm Incorporated | Integrated device comprising high density interconnects in inorganic layers and redistribution layers in organic layers |
CN205944139U (zh) | 2016-03-30 | 2017-02-08 | 首尔伟傲世有限公司 | 紫外线发光二极管封装件以及包含此的发光二极管模块 |
JP7279624B2 (ja) | 2019-11-27 | 2023-05-23 | 株式会社ソシオネクスト | 半導体装置 |
US11495561B2 (en) | 2020-05-11 | 2022-11-08 | X Display Company Technology Limited | Multilayer electrical conductors for transfer printing |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1893046A (zh) * | 2005-07-04 | 2007-01-10 | 富士通株式会社 | 半导体器件 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2920854B2 (ja) * | 1991-08-01 | 1999-07-19 | 富士通株式会社 | ビィアホール構造及びその形成方法 |
US5802699A (en) * | 1994-06-07 | 1998-09-08 | Tessera, Inc. | Methods of assembling microelectronic assembly with socket for engaging bump leads |
JPH08222571A (ja) * | 1995-02-13 | 1996-08-30 | Sony Corp | フリップチップicとその製造方法 |
JP2000512065A (ja) * | 1996-05-24 | 2000-09-12 | テセラ,インコーポレイテッド | 超小型電子素子のコネクタ |
JP2000243876A (ja) * | 1999-02-23 | 2000-09-08 | Fujitsu Ltd | 半導体装置とその製造方法 |
JP2000299406A (ja) * | 1999-04-15 | 2000-10-24 | Sanyo Electric Co Ltd | 半導体装置 |
US6332988B1 (en) * | 1999-06-02 | 2001-12-25 | International Business Machines Corporation | Rework process |
JP3629178B2 (ja) * | 2000-02-21 | 2005-03-16 | Necエレクトロニクス株式会社 | フリップチップ型半導体装置及びその製造方法 |
US7034402B1 (en) * | 2000-06-28 | 2006-04-25 | Intel Corporation | Device with segmented ball limiting metallurgy |
JP4068801B2 (ja) * | 2000-11-30 | 2008-03-26 | 株式会社ルネサステクノロジ | 半導体装置 |
JP4156205B2 (ja) * | 2001-03-16 | 2008-09-24 | 株式会社フジクラ | 半導体パッケージおよび半導体パッケージの製造方法 |
JP4313520B2 (ja) * | 2001-03-19 | 2009-08-12 | 株式会社フジクラ | 半導体パッケージ |
JP2003124393A (ja) * | 2001-10-17 | 2003-04-25 | Hitachi Ltd | 半導体装置およびその製造方法 |
US6617696B1 (en) * | 2002-03-14 | 2003-09-09 | Fairchild Semiconductor Corporation | Supporting control gate connection on a package using additional bumps |
US20030218246A1 (en) * | 2002-05-22 | 2003-11-27 | Hirofumi Abe | Semiconductor device passing large electric current |
US7531898B2 (en) * | 2002-06-25 | 2009-05-12 | Unitive International Limited | Non-Circular via holes for bumping pads and related structures |
JP4124173B2 (ja) * | 2003-07-01 | 2008-07-23 | 日本電気株式会社 | 応力緩和構造とその形成方法、応力緩和シートとその製造方法、及び半導体装置並びに電子機器 |
US7468545B2 (en) * | 2005-05-06 | 2008-12-23 | Megica Corporation | Post passivation structure for a semiconductor device and packaging process for same |
JP4701017B2 (ja) * | 2005-06-21 | 2011-06-15 | パナソニック株式会社 | 半導体装置の製造方法及び半導体装置 |
KR100647483B1 (ko) * | 2005-08-19 | 2006-11-23 | 삼성전자주식회사 | 반도체 패키지의 배선 구조물 및 이의 제조 방법, 이를이용한 웨이퍼 레벨 패키지 및 이의 제조 방법 |
JP4441658B1 (ja) * | 2008-12-19 | 2010-03-31 | 国立大学法人東北大学 | 銅配線形成方法、銅配線および半導体装置 |
-
2007
- 2007-07-25 CN CN200780100002.6A patent/CN101755334B/zh not_active Expired - Fee Related
- 2007-07-25 KR KR1020107001067A patent/KR101095409B1/ko active IP Right Grant
- 2007-07-25 WO PCT/JP2007/064601 patent/WO2009013826A1/ja active Application Filing
- 2007-07-25 JP JP2009524353A patent/JP5387407B2/ja not_active Expired - Fee Related
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2010
- 2010-01-20 US US12/690,469 patent/US20100155941A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1893046A (zh) * | 2005-07-04 | 2007-01-10 | 富士通株式会社 | 半导体器件 |
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Publication number | Publication date |
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CN101755334A (zh) | 2010-06-23 |
WO2009013826A1 (ja) | 2009-01-29 |
KR20100029247A (ko) | 2010-03-16 |
JPWO2009013826A1 (ja) | 2010-09-30 |
KR101095409B1 (ko) | 2011-12-19 |
JP5387407B2 (ja) | 2014-01-15 |
US20100155941A1 (en) | 2010-06-24 |
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