TW200743168A - Test component for bump process and test method thereof - Google Patents

Test component for bump process and test method thereof

Info

Publication number
TW200743168A
TW200743168A TW095115935A TW95115935A TW200743168A TW 200743168 A TW200743168 A TW 200743168A TW 095115935 A TW095115935 A TW 095115935A TW 95115935 A TW95115935 A TW 95115935A TW 200743168 A TW200743168 A TW 200743168A
Authority
TW
Taiwan
Prior art keywords
test
bump
under bump
series
bonding pads
Prior art date
Application number
TW095115935A
Other languages
Chinese (zh)
Other versions
TWI306640B (en
Inventor
Min-Lung Huang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW95115935A priority Critical patent/TWI306640B/en
Publication of TW200743168A publication Critical patent/TW200743168A/en
Application granted granted Critical
Publication of TWI306640B publication Critical patent/TWI306640B/en

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A test method for bump process includes providing a plurality of test components in series, and measuring a total resistance of the series test components. Each test component includes two isolated first bonding pads, a preservation layer on portion of the first bonding pads, two first under bump metallurgies (UBM) on the first bonding pads and the preservation layer, and a first bump on the first under bump metallurgies. Each under bump metallurgy electrically connects to one first bonding pad. The first bump electrically connects the two first under bump metallurgies. Each first under bump metallurgy includes a connect terminal to electrically connect each other in series.
TW95115935A 2006-05-04 2006-05-04 Test component for bump process and test method thereof TWI306640B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95115935A TWI306640B (en) 2006-05-04 2006-05-04 Test component for bump process and test method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95115935A TWI306640B (en) 2006-05-04 2006-05-04 Test component for bump process and test method thereof

Publications (2)

Publication Number Publication Date
TW200743168A true TW200743168A (en) 2007-11-16
TWI306640B TWI306640B (en) 2009-02-21

Family

ID=45071443

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95115935A TWI306640B (en) 2006-05-04 2006-05-04 Test component for bump process and test method thereof

Country Status (1)

Country Link
TW (1) TWI306640B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8395399B2 (en) 2007-12-06 2013-03-12 Nxp B.V. Semiconductor device and wafer with a test structure and method for assessing adhesion of under-bump metallization
CN110911301A (en) * 2019-12-26 2020-03-24 苏州科阳光电科技有限公司 Wafer level packaging detection structure and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8395399B2 (en) 2007-12-06 2013-03-12 Nxp B.V. Semiconductor device and wafer with a test structure and method for assessing adhesion of under-bump metallization
CN110911301A (en) * 2019-12-26 2020-03-24 苏州科阳光电科技有限公司 Wafer level packaging detection structure and method

Also Published As

Publication number Publication date
TWI306640B (en) 2009-02-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees