TW200743168A - Test component for bump process and test method thereof - Google Patents
Test component for bump process and test method thereofInfo
- Publication number
- TW200743168A TW200743168A TW095115935A TW95115935A TW200743168A TW 200743168 A TW200743168 A TW 200743168A TW 095115935 A TW095115935 A TW 095115935A TW 95115935 A TW95115935 A TW 95115935A TW 200743168 A TW200743168 A TW 200743168A
- Authority
- TW
- Taiwan
- Prior art keywords
- test
- bump
- under bump
- series
- bonding pads
- Prior art date
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
A test method for bump process includes providing a plurality of test components in series, and measuring a total resistance of the series test components. Each test component includes two isolated first bonding pads, a preservation layer on portion of the first bonding pads, two first under bump metallurgies (UBM) on the first bonding pads and the preservation layer, and a first bump on the first under bump metallurgies. Each under bump metallurgy electrically connects to one first bonding pad. The first bump electrically connects the two first under bump metallurgies. Each first under bump metallurgy includes a connect terminal to electrically connect each other in series.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95115935A TWI306640B (en) | 2006-05-04 | 2006-05-04 | Test component for bump process and test method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95115935A TWI306640B (en) | 2006-05-04 | 2006-05-04 | Test component for bump process and test method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200743168A true TW200743168A (en) | 2007-11-16 |
TWI306640B TWI306640B (en) | 2009-02-21 |
Family
ID=45071443
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95115935A TWI306640B (en) | 2006-05-04 | 2006-05-04 | Test component for bump process and test method thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI306640B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8395399B2 (en) | 2007-12-06 | 2013-03-12 | Nxp B.V. | Semiconductor device and wafer with a test structure and method for assessing adhesion of under-bump metallization |
CN110911301A (en) * | 2019-12-26 | 2020-03-24 | 苏州科阳光电科技有限公司 | Wafer level packaging detection structure and method |
-
2006
- 2006-05-04 TW TW95115935A patent/TWI306640B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8395399B2 (en) | 2007-12-06 | 2013-03-12 | Nxp B.V. | Semiconductor device and wafer with a test structure and method for assessing adhesion of under-bump metallization |
CN110911301A (en) * | 2019-12-26 | 2020-03-24 | 苏州科阳光电科技有限公司 | Wafer level packaging detection structure and method |
Also Published As
Publication number | Publication date |
---|---|
TWI306640B (en) | 2009-02-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |