ATE137605T1 - Herstellen von einer selektiv niedergeschlagenen schicht mit anwendung von alkylaluminiumhydrid - Google Patents
Herstellen von einer selektiv niedergeschlagenen schicht mit anwendung von alkylaluminiumhydridInfo
- Publication number
- ATE137605T1 ATE137605T1 AT90310506T AT90310506T ATE137605T1 AT E137605 T1 ATE137605 T1 AT E137605T1 AT 90310506 T AT90310506 T AT 90310506T AT 90310506 T AT90310506 T AT 90310506T AT E137605 T1 ATE137605 T1 AT E137605T1
- Authority
- AT
- Austria
- Prior art keywords
- aluminum
- selectively deposited
- producing
- deposited layer
- alkylaluminum hydride
- Prior art date
Links
- 150000004678 hydrides Chemical class 0.000 title 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 4
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 125000005234 alkyl aluminium group Chemical group 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000005229 chemical vapour deposition Methods 0.000 abstract 1
- 239000012789 electroconductive film Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/32051—Deposition of metallic or metal-silicide layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
- H01L21/28562—Selective deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25002189 | 1989-09-26 | ||
JP2036198A JP2721023B2 (ja) | 1989-09-26 | 1990-02-19 | 堆積膜形成法 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE137605T1 true ATE137605T1 (de) | 1996-05-15 |
Family
ID=26375242
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT90310506T ATE137605T1 (de) | 1989-09-26 | 1990-09-25 | Herstellen von einer selektiv niedergeschlagenen schicht mit anwendung von alkylaluminiumhydrid |
Country Status (10)
Country | Link |
---|---|
US (2) | US5180687A (de) |
EP (1) | EP0420595B1 (de) |
JP (1) | JP2721023B2 (de) |
KR (1) | KR940010501B1 (de) |
AT (1) | ATE137605T1 (de) |
DE (1) | DE69026783T2 (de) |
ES (1) | ES2086375T3 (de) |
MY (1) | MY107418A (de) |
PT (1) | PT95430B (de) |
SG (1) | SG45388A1 (de) |
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JP2721023B2 (ja) * | 1989-09-26 | 1998-03-04 | キヤノン株式会社 | 堆積膜形成法 |
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US6156393A (en) * | 1997-11-12 | 2000-12-05 | John C. Polanyi | Method of molecular-scale pattern imprinting at surfaces |
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US7223694B2 (en) * | 2003-06-10 | 2007-05-29 | Intel Corporation | Method for improving selectivity of electroless metal deposition |
CN103147067A (zh) * | 2011-12-07 | 2013-06-12 | 无锡华润华晶微电子有限公司 | 低压化学气相淀积装置及其薄膜淀积方法 |
JP2018532271A (ja) * | 2015-10-15 | 2018-11-01 | 東京エレクトロン株式会社 | インターコネクトのための選択的なボトムアップ式金属フィーチャ充填 |
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US10950448B2 (en) | 2018-04-06 | 2021-03-16 | Applied Materials, Inc. | Film quality control in a linear scan physical vapor deposition process |
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DE69120446T2 (de) * | 1990-02-19 | 1996-11-14 | Canon Kk | Verfahren zum Herstellen von abgeschiedener Metallschicht, die Aluminium als Hauptkomponente enthält, mit Anwendung von Alkylaluminiumhydrid |
-
1990
- 1990-02-19 JP JP2036198A patent/JP2721023B2/ja not_active Expired - Fee Related
- 1990-09-24 US US07/587,045 patent/US5180687A/en not_active Expired - Lifetime
- 1990-09-25 DE DE69026783T patent/DE69026783T2/de not_active Expired - Fee Related
- 1990-09-25 EP EP90310506A patent/EP0420595B1/de not_active Expired - Lifetime
- 1990-09-25 SG SG1996005589A patent/SG45388A1/en unknown
- 1990-09-25 ES ES90310506T patent/ES2086375T3/es not_active Expired - Lifetime
- 1990-09-25 AT AT90310506T patent/ATE137605T1/de not_active IP Right Cessation
- 1990-09-26 KR KR1019900015296A patent/KR940010501B1/ko not_active IP Right Cessation
- 1990-09-26 MY MYPI90001665A patent/MY107418A/en unknown
- 1990-09-26 PT PT95430A patent/PT95430B/pt not_active IP Right Cessation
-
1992
- 1992-10-30 US US07/969,353 patent/US5393699A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ES2086375T3 (es) | 1996-07-01 |
DE69026783T2 (de) | 1996-11-14 |
KR910007084A (ko) | 1991-04-30 |
KR940010501B1 (ko) | 1994-10-24 |
DE69026783D1 (de) | 1996-06-05 |
PT95430A (pt) | 1991-05-22 |
US5393699A (en) | 1995-02-28 |
JPH03202471A (ja) | 1991-09-04 |
SG45388A1 (en) | 1998-01-16 |
EP0420595A2 (de) | 1991-04-03 |
EP0420595A3 (en) | 1991-09-11 |
EP0420595B1 (de) | 1996-05-01 |
MY107418A (en) | 1995-12-30 |
PT95430B (pt) | 1997-07-31 |
JP2721023B2 (ja) | 1998-03-04 |
US5180687A (en) | 1993-01-19 |
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