Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/002—Details
  • H01G4/228—Terminals
  • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/002—Details
  • H01G4/228—Terminals
  • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
  • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/002—Details
  • H01G4/005—Electrodes
  • H01G4/008—Selection of materials
  • H01G4/0085—Fried electrodes
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/002—Details
  • H01G4/005—Electrodes
  • H01G4/012—Form of non-self-supporting electrodes
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/002—Details
  • H01G4/018—Dielectrics
  • H01G4/06—Solid dielectrics
  • H01G4/08—Inorganic dielectrics
  • H01G4/12—Ceramic dielectrics
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/30—Stacked capacitors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/002—Details
  • H01G4/018—Dielectrics
  • H01G4/06—Solid dielectrics
  • H01G4/08—Inorganic dielectrics
  • H01G4/12—Ceramic dielectrics
  • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
  • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
  • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/002—Details
  • H01G4/018—Dielectrics
  • H01G4/06—Solid dielectrics
  • H01G4/08—Inorganic dielectrics
  • H01G4/12—Ceramic dielectrics
  • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
  • H01G4/1236—Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
  • Y02E60/13—Energy storage using capacitors

Definitions

• the present disclosure relates to a multilayer ceramic capacitor.
• Multilayer capacitors are known in which the ESL (equivalent series inductance) is reduced by making the current flow route thicker, the current flow route shorter, or the magnetic fields generated by currents with different polarities canceling each other out.
• Patent Document 1 discloses an example of a multilayer capacitor with a reduced ESL.
• the multilayer capacitor disclosed in Patent Document 1 Japanese Unexamined Patent Publication No. 2006-135333 has a capacitor body in which a plurality of dielectric layers, a plurality of first internal electrodes, and a plurality of second internal electrodes are laminated. It is equipped with The capacitor body includes a plurality of first via conductors that are electrically connected to the plurality of first internal electrodes and extend to one main surface of the capacitor body, and a plurality of first via conductors that are electrically connected to the plurality of second internal electrodes. A plurality of second via conductors are connected to the capacitor body and extend to one main surface of the capacitor body.
• One main surface of the capacitor body includes a plurality of first external electrodes each electrically connected to a plurality of first via conductors, and a plurality of first external electrodes each electrically connected to a plurality of second via conductors.
• a plurality of second external electrodes are provided.
• the first external electrode and the second external electrode are provided on the surface of the capacitor body.
• the thickness of the capacitor body is reduced by the thickness. That is, the provision of the external electrode imposes restrictions on the number of stacked internal electrodes, making it impossible to increase the capacitance.
• the present disclosure aims to solve the above problems, and to provide a multilayer ceramic capacitor that can increase capacitance.
• the multilayer ceramic capacitor of the present disclosure includes: a capacitor body in which a plurality of dielectric layers, a plurality of first internal electrodes, and a plurality of second internal electrodes are laminated; a first via conductor provided inside the capacitor body and electrically connected to the plurality of first internal electrodes; a second via conductor provided inside the capacitor body and electrically connected to the plurality of second internal electrodes; Equipped with A multilayer ceramic capacitor characterized in that the dimensions of the multilayer ceramic capacitor are the same as the dimensions of the capacitor body in the lamination direction of the dielectric layer, the first internal electrode, and the second internal electrode.
• the dimensions of the multilayer ceramic capacitor in the stacking direction are the same as the dimensions of the capacitor body.
• the dimensions of the capacitor body in the stacking direction can be maximized, so the number of layers of the first internal electrode and the second internal electrode can be increased, and the capacitance can be increased. Can be done.
• FIG. 2 is a plan view of a multilayer ceramic capacitor in a first embodiment.
• FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor shown in FIG. 1 taken along line II-II.
• FIG. 3 is a cross-sectional view schematically showing the configuration of Modification Example 1 of the multilayer ceramic capacitor in the first embodiment.
• FIG. 7 is a cross-sectional view schematically showing the configuration of a second modification of the multilayer ceramic capacitor in the first embodiment.
• FIG. 7 is a cross-sectional view schematically showing the configuration of a third modification of the multilayer ceramic capacitor in the first embodiment.
• FIG. 3 is a cross-sectional view schematically showing the configuration of a multilayer ceramic capacitor in a second embodiment.
• FIG. 7 is a cross-sectional view schematically showing the configuration of a modified example of the multilayer ceramic capacitor in the second embodiment.
• FIG. 7 is a cross-sectional view schematically showing the configuration of a multilayer ceramic capacitor in a third embodiment.
• FIG. 7 is a cross-sectional view schematically showing the configuration of a multilayer ceramic capacitor in a fourth embodiment.
• FIG. 7 is a cross-sectional view schematically showing a state in which a multilayer ceramic capacitor according to a fourth embodiment is mounted on a mounting board using a bonding material.
• (a) is a plan view schematically showing the configuration of a multilayer ceramic capacitor having a rectangular shape with rounded corners when viewed in the stacking direction
• (b) is a plan view when viewed in the stacking direction.
• FIG. 2 is a plan view schematically showing the structure of a multilayer ceramic capacitor having an octagonal shape.
• (a) is a cross-sectional view schematically showing the structure of a multilayer ceramic capacitor with inclined side surfaces
• (b) is a cross-sectional view schematically showing the configuration of a multilayer ceramic capacitor with inclined side surfaces
• (b) is a cross-sectional view schematically showing the configuration of a multilayer ceramic capacitor in which the end portion in the direction orthogonal to the lamination direction is located on the main surface of the capacitor body.
• FIG. 2 is a cross-sectional view schematically showing the configuration of a multilayer ceramic capacitor having a shape that is recessed inward in the stacking direction compared to other parts.
• FIG. 13(b) is a cross-sectional view schematically showing the structure of a capacitor
• FIG. 1 is a plan view of a multilayer ceramic capacitor 100 in a first embodiment of the present disclosure.
• FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor 100 shown in FIG. 1 taken along line II-II.
• the multilayer ceramic capacitor 100 includes a capacitor body 1, a first via conductor 5, and a second via conductor 6.
• the capacitor body 1 has a structure in which a plurality of dielectric layers 2, a plurality of first internal electrodes 3, and a plurality of second internal electrodes 4 are laminated. More specifically, the capacitor body 1 has a structure in which a plurality of first internal electrodes 3 and second internal electrodes 4 are alternately stacked with dielectric layers 2 in between.
• the material of the dielectric layer 2 is arbitrary, and is made of, for example, a ceramic material whose main component is BaTiO 3 , CaTiO 3 , SrTiO 3 , SrZrO 3 , or CaZrO 3 .
• These main components may contain subcomponents whose content is smaller than that of the main components, such as Mn compounds, Fe compounds, Cr compounds, Co compounds, and Ni compounds.
• the shape of the capacitor body 1 is arbitrary.
• the capacitor body 1 has a rectangular parallelepiped shape as a whole.
• the shape of a rectangular parallelepiped as a whole is not a perfect rectangular parallelepiped, such as a rectangular parallelepiped with rounded corners and ridges, but it has six surfaces and can be considered a rectangular parallelepiped as a whole. It is a shape that can be made.
• the dimensions of the capacitor body 1 are arbitrary, but for example, the vertical dimension of the rectangle in plan view is 0.3 mm or more and 3.0 mm or less, the horizontal dimension is 0.3 mm or more and 3.0 mm or less, and the dielectric layer 2 , the dimensions of the first internal electrode 3 and the second internal electrode 4 in the lamination direction T (hereinafter simply referred to as the lamination direction T) can be set to 50 ⁇ m or more and 200 ⁇ m or less.
• the dimension of the capacitor body 1 in the stacking direction T refers to the thickness of the capacitor body 1.
• the first main surface 1a and the second main surface 1b of the capacitor body 1, which face each other in the stacking direction T, are not provided with external electrodes or other members. . Therefore, in the stacking direction T, the dimensions of the multilayer ceramic capacitor 100 are the same as the dimensions of the capacitor body 1. Note that the dimensions of the multilayer ceramic capacitor 100 in the stacking direction T are the outermost part on the first main surface 1a side and the second main surface in the stacking direction T among the constituent parts of the multilayer ceramic capacitor 100. It means the distance between the outermost part on the 1b side.
• the first internal electrode 3 and the second internal electrode 4 may be made of any material, for example, metals such as Ni, Cu, Ag, Pd, Pt, Fe, Ti, Cr, Sn, or Au, or those metals. Contains alloys etc. as main components.
• the first internal electrode 3 and the second internal electrode 4 may contain the same ceramic material as the dielectric ceramic contained in the dielectric layer 2 as a common material. In that case, the proportion of the common material contained in the first internal electrode 3 and the second internal electrode 4 is, for example, 20 vol% or less.
• the thickness of the first internal electrode 3 and the second internal electrode 4 is arbitrary, and can be, for example, about 0.3 ⁇ m or more and 1.0 ⁇ m or less.
• the number of layers of the first internal electrode 3 and the second internal electrode 4 is arbitrary, but the total number of both can be, for example, about 10 to 150 layers.
• a plurality of first through holes 3a are formed in the first internal electrode 3 in order to insert a plurality of second via conductors 6, which will be described later.
• a plurality of second through holes 4a are formed in the second internal electrode 4 in order to allow a plurality of first via conductors 5, which will be described later, to be inserted therethrough.
• capacitance is formed by the first internal electrode 3 and the second internal electrode 4 facing each other with the dielectric layer 2 interposed therebetween.
• the first via conductor 5 is provided inside the capacitor body 1 and electrically connected to the plurality of first internal electrodes 3.
• the first via conductor 5 passes through a second through hole 4a formed in the second internal electrode 4, and is insulated from the second internal electrode 4.
• the first via conductor 5 is provided inside the capacitor body 1 in such a manner that it extends in the stacking direction T from the first major surface 1a to the second major surface 1b of the capacitor body 1. There is. That is, the first via conductor 5 is exposed on the first main surface 1a and the second main surface 1b of the capacitor body 1. However, as will be described later, the first via conductor 5 does not need to be exposed on the first main surface 1a of the capacitor body 1, nor does it need to be exposed on the second main surface 1b.
• the second via conductor 6 is provided inside the capacitor body 1 and electrically connected to the plurality of second internal electrodes 4.
• the second via conductor 6 passes through a first through hole 3a formed in the first internal electrode 3, and is insulated from the first internal electrode 3.
• the second via conductor 6 is provided inside the capacitor body 1 in such a manner that it extends in the stacking direction T from the first major surface 1a to the second major surface 1b of the capacitor body 1. There is. That is, the second via conductor 6 is exposed on the first main surface 1a and the second main surface 1b of the capacitor body 1. However, as will be described later, the second via conductor 6 does not need to be exposed on the first main surface 1a of the capacitor body 1, nor does it need to be exposed on the second main surface 1b.
• the first via conductor 5 and the second via conductor 6 do not protrude outward in the stacking direction T beyond the first main surface 1a and second main surface 1b of the capacitor body 1. That is, in the stacking direction T, the dimensions of the first via conductor 5 and the dimensions of the second via conductor 6 are equal to or smaller than the dimensions of the capacitor body 1. In the example shown in FIG. 2, the dimensions of the first via conductor 5 and the dimensions of the second via conductor 6 in the stacking direction T are the same as the dimensions of the capacitor body 1.
• the first via conductor 5 and the second via conductor 6 may be made of any material, for example, metals such as Ni, Cu, Ag, Pd, Pt, Fe, Ti, Cr, Sn, or Au, or those metals. Contains alloys etc. as main components.
• the first via conductor 5 and the second via conductor 6 can be provided at any position.
• a plurality of first via conductors 5 and a plurality of second via conductors 6 are provided in a matrix.
• the number of first via conductors 5 and second via conductors 6 can be any number.
• the shapes of the first via conductor 5 and the second via conductor 6 are arbitrary, and may be cylindrical, for example.
• the diameters of the first via conductor 5 and the second via conductor 6 are, for example, about 30 ⁇ m or more and 150 ⁇ m or less.
• the distance between the first via conductor 5 and the second via conductor 6 adjacent to each other, more specifically, the distance L1 between the center of the first via conductor 5 and the center of the second via conductor 6 (See FIG. 2) is, for example, about 50 ⁇ m or more and 500 ⁇ m or less.
• the dimensions of the multilayer ceramic capacitor 100 in the stacking direction T are the same as the dimensions of the capacitor body 1. That is, on the first main surface 1a and the second main surface 1b of the capacitor body 1, an external electrode connected to the first via conductor 5, an external electrode connected to the second via conductor 6, and No other members are provided.
• the first via conductor 5 and the second via exposed on the first main surface 1a or the second main surface 1b of the capacitor body 1 are The conductor 6 is connected to the land via solder or the like.
• the multilayer ceramic capacitor 100 in this embodiment external electrodes are not provided on the first main surface 1a and the second main surface 1b of the capacitor body 1, and the multilayer ceramic capacitor 100 in the stacking direction T
• the dimensions are the same as the dimensions of the capacitor body 1. Due to such a configuration, when comparing multilayer ceramic capacitors of the same size, the multilayer ceramic capacitor 100 of this embodiment has a larger multilayer ceramic capacitor than a conventional multilayer ceramic capacitor in which external electrodes are provided on the surface of the capacitor body.
• the dimensions of the capacitor body 1 in direction T can be maximized.
• the number of laminated layers of the first internal electrode 3 and the second internal electrode 4 can be increased, and the capacitance can be increased. .
• the dimensions of the first via conductor 5 and the dimensions of the second via conductor 6 are the same as the dimensions of the capacitor body 1. 6 is exposed on the first main surface 1 a and the second main surface 1 b of the capacitor body 1 .
• the first via conductor 5 and the second via conductor 6 can be connected in direct contact with the land, etc. of the mounting board, which further improves connection reliability. can be done.
• a known ceramic green sheet can be used, and can be obtained, for example, by applying a ceramic slurry containing ceramic powder, a resin component, and a solvent onto a base material and drying it. .
• the conductive paste for internal electrodes is a conductive paste for forming the first internal electrode 3 and the second internal electrode 4, and a known paste can be used.
• the conductive paste for internal electrodes includes, for example, particles made of a metal such as Ni, Cu, Ag, Pd, Pt, Fe, Ti, Cr, Sn, or Au or a precursor thereof, and a solvent.
• the conductive paste for internal electrodes may further contain a dispersant and a resin component serving as a binder.
• an internal electrode pattern is formed by applying a conductive paste for internal electrodes to the ceramic green sheet by a method such as printing.
• a description will be given assuming that an internal electrode pattern is formed that allows a plurality of multilayer ceramic capacitors 100 to be manufactured at once.
• a mother laminate is produced by laminating a plurality of ceramic green sheets on which internal electrode patterns are formed.
• a ceramic green sheet on which no internal electrode pattern is formed may be placed on the outside in the stacking direction T.
• the produced mother laminate is preferably pressed by a method such as rigid pressing or isostatic pressing.
• a through hole for forming the first via conductor 5 and a through hole for forming the second via conductor 6 are formed in the mother laminate.
• the through hole is formed, for example, by irradiating with a laser beam.
• the conductive paste for via conductors includes particles made of a metal such as Ni, Cu, Ag, Pd, Pt, Fe, Ti, Cr, Sn, or Au or a precursor thereof, and a solvent.
• the conductive paste for via conductors may further contain a dispersant and a resin component serving as a binder.
• the mother laminate is cut into a predetermined size by a cutting method such as punching, dicing, laser cutting, etc. to obtain a laminate chip.
• a multilayer ceramic capacitor 100 is obtained by firing the obtained multilayer chip with a predetermined profile.
• FIG. 3 is a cross-sectional view schematically showing the configuration of a first modification of the multilayer ceramic capacitor 100 according to the first embodiment.
• the cutting position of the cross-sectional view shown in FIG. 3 is the same as the cutting position of the cross-sectional view shown in FIG.
• the dimensions of the first via conductor 5 and the dimensions of the second via conductor 6 are smaller than the dimensions of the capacitor body 1 in the stacking direction T. Further, as shown in FIG. 3, the first via conductor 5 and the second via conductor 6 are exposed to the second main surface 1b, but are not exposed to the first main surface 1a. . Therefore, in the first principal surface 1a of the capacitor body 1, the positions where the first via conductor 5 and the second via conductor 6 are provided are recessed portions recessed inward in the stacking direction T. In this case, when mounting the multilayer ceramic capacitor 100, the second main surface 1b of the capacitor body 1 can be used as the mounting surface.
• the dimensions of the first via conductor 5 and the second via conductor 6 in the stacking direction T can be adjusted, for example, by pressing the conductive paste for via conductors filled in the through holes during manufacturing. Furthermore, the dimensions of the first via conductor 5 and the second via conductor 6 in the stacking direction T may be adjusted by increasing the content of the resin component contained in the conductive paste for via conductors. That is, by increasing the content of the resin component contained in the conductive paste for via conductors, the resin component that disappears during firing is increased, and the dimensions of the first via conductor 5 and the second via conductor 6 that are formed are reduced. Make smaller.
• the multilayer ceramic capacitor 100 shown in FIG. can be made larger. Furthermore, in the multilayer ceramic capacitor 100 shown in FIG. 5 and the second via conductor 6 are not exposed on the first main surface 1a. Therefore, it is possible to suppress unintended electrical contact between the first via conductor 5 and the second via conductor 6 and other electronic components on the first main surface 1a side. The same applies to the case where the first via conductor 5 and the second via conductor 6 are not exposed to the first main surface 1a but to the second main surface 1b of the capacitor body 1.
• the first main surface 1a of the capacitor body 1 may be used as the mounting surface.
• FIG. 4 is a cross-sectional view schematically showing the configuration of a second modification of the multilayer ceramic capacitor 100 in the first embodiment.
• the cutting position of the cross-sectional view shown in FIG. 4 is the same as the cutting position of the cross-sectional view shown in FIG.
• the multilayer ceramic capacitor 100 shown in FIG. 3 the multilayer ceramic capacitor 100 shown in FIG. It's also small. Further, as shown in FIG. 4, the first via conductor 5 and the second via conductor 6 are exposed on the first main surface 1a but not on the second main surface 1b. . In this case, when mounting the multilayer ceramic capacitor 100, the first main surface 1a of the capacitor body 1 becomes the mounting surface.
• the second main surface 1b of the capacitor body 1 is a flat surface. That is, among the ends of the first via conductor 5 and the second via conductor 6 in the stacking direction T, the end on the second main surface 1b side is covered with the dielectric layer 2.
• holes for forming the first via conductor 5 and the second via conductor 6 are formed in the mother laminate. It can be manufactured by providing a through hole that penetrates and a hole that does not. Further, after forming the through holes in the mother laminate, a ceramic green sheet may be attached so as to close one end of the through holes.
• the multilayer ceramic capacitor 100 shown in FIG. can be made larger. Furthermore, in the multilayer ceramic capacitor 100 shown in FIG. 4, since the first via conductor 5 and the second via conductor 6 are not exposed on the second main surface 1b, Unintended electrical contact between the via conductor 5 and the second via conductor 6 and other electronic components can be suppressed. In particular, since the ends of the first via conductor 5 and the second via conductor 6 that are not exposed to the second main surface 1b are covered with the dielectric layer 2, the multilayer ceramic capacitor 100 shown in FIG. It is possible to more reliably prevent unintended electrical contact with other electronic components. The same applies to the case where the first via conductor 5 and the second via conductor 6 are not exposed to the second main surface 1b of the capacitor body 1 but to the first main surface 1a.
• FIG. 5 is a cross-sectional view schematically showing the configuration of a third modification of the multilayer ceramic capacitor 100 in the first embodiment.
• the cutting position of the cross-sectional view shown in FIG. 5 is the same as the cutting position of the cross-sectional view shown in FIG.
• the first via conductor 5 and the second via conductor 6 are not exposed on the first main surface 1a and the second main surface 1b.
• the ends of the first via conductor 5 and the second via conductor 6 on the first main surface 1a side are open, and the ends on the second main surface 1b side are formed by the dielectric layer 2. covered.
• the first main surface 1a of the capacitor body 1 becomes the mounting surface.
• the multilayer ceramic capacitor 100 shown in FIG. 5 can be manufactured using the manufacturing technology of the multilayer ceramic capacitor 100 shown in FIGS. 3 and 4 described above.
• the same effects as the multilayer ceramic capacitor 100 shown in FIG. 4 can be obtained.
• FIG. 6 is a cross-sectional view schematically showing the configuration of a multilayer ceramic capacitor 100A in the second embodiment.
• the cutting position of the cross-sectional view shown in FIG. 6 is the same as the cutting position of the cross-sectional view shown in FIG.
• the multilayer ceramic capacitor 100A in the second embodiment has the same dimensions as the capacitor body 1 in the stacking direction T.
• the dimensions of the first via conductor 5 and the second via conductor 6 in the stacking direction T are smaller than the dimensions of the capacitor body 1.
• the capacitor main body 1 is provided on the outside in the lamination direction T, has higher strength than the dielectric layer 2, and is connected to the first via conductor 5 and the second via conductor in the lamination direction T.
• An outer layer 10 is provided covering one end of 6.
• an outer layer 10 is provided on the second main surface 1b side of the capacitor body 1.
• the ends of the first via conductor 5 and the second via conductor 6 on the first main surface 1a side are exposed to the first main surface 1a.
• the outer layer 10 may be provided on the first main surface 1a side of the capacitor body 1 instead of on the second main surface 1b side.
• the outer layer 10 is made of, for example, a ceramic material containing particles such as aluminum oxide, glass, or resin, or metal particles, preferably the same metal as the metal constituting the first via conductor 5 and the second via conductor 6. It is made of a ceramic material having higher strength than the ceramic material constituting the dielectric layer 2, such as a ceramic material containing particles. However, when the outer layer 10 is made of a ceramic material containing metal particles, it is necessary to interpose an insulating sheet or the like between the outer layer 10 and the first via conductor 5 and the second via conductor 6.
• the multilayer ceramic capacitor 100A in the second embodiment can be manufactured basically in the same manner as the multilayer ceramic capacitor 100 in the first embodiment, but a process for forming the outer layer 10 is required. be. That is, after forming the through holes in the mother laminate, a ceramic green sheet for forming the outer layer 10 is attached to the outside of the mother laminate in the stacking direction T. Thereafter, the formed hole is filled with conductive paste for via conductor. The subsequent steps are the same as those for manufacturing the multilayer ceramic capacitor 100 in the first embodiment.
• the number of stacked layers of the first internal electrode 3 and the second internal electrode 4 can be increased, Capacitance can be increased.
• an outer layer 10 which has higher strength than the dielectric layer 2 and covers one end of the first via conductor 5 and the second via conductor 6 in the stacking direction T. is provided, the strength of the multilayer ceramic capacitor 100A can be improved, and cracks in the capacitor body 1 can be suppressed.
• FIG. 7 is a cross-sectional view schematically showing the structure of a modified example of the multilayer ceramic capacitor 100A in the second embodiment.
• the cutting position of the cross-sectional view shown in FIG. 7 is the same as the cutting position of the cross-sectional view shown in FIG.
• the multilayer ceramic capacitor 100A shown in FIG. 7 differs from the multilayer ceramic capacitor 100A shown in FIG. 6 in the positions of the ends of the first via conductor 5 and the second via conductor 6. That is, the ends of the first via conductor 5 and the second via conductor 6 on the first main surface 1a side are located inside the first main surface 1a in the stacking direction T, and It is not exposed on the main surface 1a.
• the multilayer ceramic capacitor 100A shown in FIG. 7 also has the same effect as the multilayer ceramic capacitor 100A shown in FIG. 7
• FIG. 8 is a cross-sectional view schematically showing the configuration of a multilayer ceramic capacitor 100B in the third embodiment.
• the cutting position of the cross-sectional view shown in FIG. 8 is the same as the cutting position of the cross-sectional view shown in FIG.
• the multilayer ceramic capacitor 100B in the third embodiment has the same dimensions as the capacitor body 1 in the stacking direction T.
• the first via conductor 5 and the second via conductor 6 are exposed on the first main surface 1a of the capacitor body 1, but are not exposed on the second main surface 1b. do not have. However, the first via conductor 5 and the second via conductor 6 may also be exposed on the second main surface 1b.
• the first via conductor 5 and the second via conductor 6 each include a first material layer 21 and a second material layer 22 made of a different material from the first material layer 21. .
• the second material layer 22 is provided at at least one open end of the first via conductor 5 and the second via conductor 6 in the stacking direction T, the surface of which is not covered.
• the second material layer 22 is located at the open end of the first via conductor 5 and the second via conductor 6 on the first main surface 1a side of the capacitor body 1. It is provided and exposed on the first main surface 1a.
• the second material layer 22 does not need to be exposed on the first main surface 1a of the capacitor body 1. In this case, of the first main surface 1a and the second main surface 1b of the capacitor body 1, the main surface on the side where the second material layer 22 is provided becomes the mounting surface.
• the first material layer 21 contains Ni as a main component, for example.
• the second material layer 22 contains, for example, any one of Sn, Sn-Ag, Sn-Bi, Sn-In, Sn-Ag-Cu, and Au as a main component.
• Sn-Ag is an alloy of Sn and Ag
• Sn-Bi is an alloy of Sn and Bi
• Sn-In is an alloy of Sn and In
• Sn-Ag-Cu is an alloy of Sn and Bi. It is an alloy of Ag and Cu.
• Ni is a metal that is easily oxidized, but Sn, Sn-Ag, Sn-Bi, Sn-In, Sn-Ag-Cu, and Au are metals with excellent oxidation resistance.
• any one of Sn, Sn-Ag, Sn-Bi, Sn-In, Sn-Ag-Cu, and Au is applied to the open end of at least one of the first via conductor 5 and the second via conductor 6.
• the main component of the first material layer 21 is not limited to Ni, and may be metals such as Cu, Ag, Pd, Pt, Fe, Ti, Cr, or Au, or alloys containing these metals. You can.
• the first via conductor 5 and the second via conductor 6 can be formed using, for example, one type of conductive paste for via conductors. For example, when holes formed in the mother laminate are filled with a conductive paste for via conductors containing Ni and Sn and singulated, and then fired, Sn, which has a lower melting point than Ni, appears on the surface side. As a result, the first via conductor 5 and the second via conductor 6 including the first material layer 21 containing Ni as a main component and the second material layer 22 containing Sn as a main component can be formed. can. In this case, the first material layer 21 and the second material layer 22 do not form two neat layers as shown in FIG. In a manner, a first material layer 21 and a second material layer 22 are formed.
• the first via conductor 5 and the second via conductor 6 may be formed using two types of materials.
• holes formed in the mother laminate are filled with conductive paste for via conductors containing Ni as a main component, separated into pieces, and then fired.
• a first material layer 21 containing Ni as a main component is formed, but it is shrunk by firing and its end portion is located inside the surface of the capacitor body 1 in the stacking direction T.
• the paste may not be filled to the surface.
• a second material layer 22 containing Sn as a main component is formed on the first material layer 21 .
• FIG. 9 is a cross-sectional view schematically showing the configuration of a multilayer ceramic capacitor 100C in the fourth embodiment.
• the cutting position of the cross-sectional view shown in FIG. 9 is the same as the cutting position of the cross-sectional view shown in FIG.
• the positions where the first via conductor 5 and the second via conductor 6 are provided when viewed in the stacking direction T on the surface of the capacitor body 1 are as follows.
• a recessed portion 30 is provided inside in the stacking direction T.
• the recessed portion 30 can be formed, for example, by producing a mother laminate and then removing a portion of the surface by irradiating a laser beam, or by forming a recess using a press or the like.
• a recess 30 is provided in the second main surface 1b of the capacitor body 1.
• the recess 30 of the capacitor body 1 may be provided on the first main surface 1a, or may be provided on each of the first main surface 1a and the second main surface 1b.
• the shape of the recess 30 when viewed in the stacking direction T is arbitrary. However, it is preferable that the recess 30 is provided so that the first via conductor 5 and the second via conductor 6 are completely exposed when viewed in the stacking direction T. In the example shown in FIG. 9, the dimensions of the recess 30 are larger than the dimensions of the first via conductor 5 and the second via conductor 6 in any direction orthogonal to the stacking direction T.
• the first via conductor 5 and the second via conductor 6 are each exposed in the recess 30 of the capacitor body 1. Further, the first via conductor 5 and the second via conductor 6 are each exposed on the first main surface 1a. However, the first via conductor 5 and the second via conductor 6 do not need to be exposed on the first main surface 1a.
• the strength when mounted using a bonding material such as solder can be improved. That is, in a configuration in which the recess 30 is not provided, the amount of the bonding material at the bonding position may decrease as the bonding material spreads. On the other hand, in the multilayer ceramic capacitor 100C according to the present embodiment, as shown in FIG. can be increased, and the mounting strength can be improved.
• the ends of the first via conductor 5 and the second via conductor 6 on the side of the recess 30 are located at the same position as the inner wall perpendicular to the stacking direction T among the inner walls forming the recess 30. However, it may be located on the inner side of the inner wall in the stacking direction T, or may be located on the outer side of the stacking direction T than the inner wall. However, even if the ends of the first via conductor 5 and the second via conductor 6 are located on the outer side of the inner wall forming the recess 30 in the stacking direction T, the ends of the first via conductor 5 and the second via conductor 6 It does not protrude outward in the stacking direction T.
• the dimensions of the recess 30 are larger than the dimensions of the first via conductor 5 and the second via conductor 6 in any direction orthogonal to the stacking direction T. .
• the dimensions of the recess 30 may be the same as the dimensions of the first via conductor 5 and the second via conductor 6. Since the multilayer ceramic capacitor 100 shown in FIG. 3 is a multilayer ceramic capacitor having such a configuration, it can also be said to be a multilayer ceramic capacitor in the fourth embodiment.
• the multilayer ceramic capacitor 100 shown in FIG. 1 has a square shape when viewed in the stacking direction T, but it may have a rectangular shape or other shapes.
• the shape of the multilayer ceramic capacitor 100 when viewed in the stacking direction T may be a rectangle with rounded corners as shown in FIG. 11(a), or a rectangular shape with rounded corners as shown in FIG. It can also be square.
• the side surface of the capacitor body 1 is orthogonal to the first main surface 1a and the second main surface 1b, but as shown in FIG. 12(a), It may be inclined. Further, as shown in FIG. 12(b), in at least one of the first main surface 1a and the second main surface 1b of the capacitor body 1, the end portion in the direction perpendicular to the stacking direction T is It may be recessed inward in the stacking direction T compared to other parts.
• the dimensions of the first via conductor 5 and the second via conductor 6 are the same at any position in the stacking direction T, but may be different.
• the first via conductor 5 and the second via conductor 6 are orthogonal to the stacking direction T as they go from one end of the stacking direction T to the other end. It may have a shape in which the dimension in the direction gradually increases.
• the diameter gradually increases from one end to the other end in the stacking direction T.
• a recess 30 may be provided in the multilayer ceramic capacitor 100 shown in FIG. 13(a) (see FIG. 13(b)).
• the multilayer ceramic capacitor in this application is as follows. ⁇ 1> a capacitor body in which a plurality of dielectric layers, a plurality of first internal electrodes, and a plurality of second internal electrodes are laminated; a first via conductor provided inside the capacitor body and electrically connected to the plurality of first internal electrodes; a second via conductor provided inside the capacitor body and electrically connected to the plurality of second internal electrodes; Equipped with In the multilayer ceramic capacitor, the dimensions of the multilayer ceramic capacitor are the same as the dimensions of the capacitor body in the stacking direction of the dielectric layer, the first internal electrode, and the second internal electrode.
• ⁇ 2> The multilayer ceramic capacitor according to ⁇ 1>, wherein dimensions of the first via conductor and dimensions of the second via conductor in the stacking direction are the same as dimensions of the capacitor body.
• ⁇ 3> The multilayer ceramic capacitor according to ⁇ 1>, wherein in the stacking direction, the dimensions of the first via conductor and the dimensions of the second via conductor are smaller than the dimensions of the capacitor body.
• the capacitor body includes an outer layer that is provided on the outside in the lamination direction, has higher strength than the dielectric layer, and covers one end of the first via conductor and the second via conductor in the lamination direction.
• the first via conductor and the second via conductor each include a first material layer and a second material layer made of a different material from the first material layer, The second material layer is provided at an open end of at least one of the first via conductor and the second via conductor in the stacking direction, the surface of which is not covered.
• ⁇ 6> The multilayer ceramic according to ⁇ 5>, wherein the second material layer contains any one of Sn, Sn-Ag, Sn-Bi, Sn-In, Sn-Ag-Cu, and Au as a main component. capacitor.
• a recessed portion recessed inward in the lamination direction is provided at a position where the first via conductor and the second via conductor are provided.

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• 2023
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