TW505933B - Laminated body, capacitor, electronic part, and method and device for manufacturing the laminated body, capacitor, and electronic part - Google Patents

Abstract

Resin thin films (12) and metal thin films (11a, 11b) are layered in alternation. The metal thin films (11a, 11b) are set back from the peripheral edges of the resin thin films (12). Via holes (13a, 13b) penetrating the layered product in the layering direction are formed and filled with conductive material (14a, 14b). The conductive material (14a, 14b) electrically connects the metal thin films (11a, 11b) among one another. The metal thin films are not exposed at the periphery, so that corrosion of the metal thin films is not likely to occur. Furthermore, cutting of the metal thin films during the manufacturing process is avoided.

Description

505933 Printed by a member of the Intellectual Property Bureau of the Ministry of Economic Affairs and a Consumer Cooperative, printed Κ_ _ Β7 ____ V. Description of Invention (/) [Technical Field] _ This invention relates to a laminated body having a resin film and a metal film laminated, and a capacitor and Electronic parts. The present invention also relates to a manufacturing method and a manufacturing apparatus suitable for use in manufacturing the multilayer body, the capacitor, and the electronic component. [Background Art] Taking the process of laminated resin film and the process of laminated metal film as a unit, iteratively carried out on a circular support to produce a laminated body composed of a resin film and a metal film alternately laminated, and a method A method for obtaining an electronic component such as a capacitor from a laminated body has been disclosed in, for example, Japanese Patent Laid-Open No. 10-237623. An example of a method for manufacturing a laminated body of a resin film and a metal film will be described below with reference to drawings. ^ FIG. 22 is a schematic cross-sectional view showing an example of a conventional manufacturing apparatus for implementing a manufacturing method of a layered body. In FIG. 22, 915 is a vacuum tank, 916 is a vacuum pump for maintaining the inside of the vacuum tank 915 at a predetermined vacuum degree, and 911 is a cylindrical shape installed in the vacuum tank 915 and rotating in the direction of the arrow in the figure. Container roller (cp roller), 912 series resin film forming device, 913 series patterning material applying device, 914 series metal film forming device, 917 series pattern material removing device, 918 series resin hardening device, 919 series surface treatment device, 920a 920b is a partition wall that separates the area where the metal thin film is formed into different areas, 922 is provided at the opening of the 920a, 920b, and 923 is a shield plate used to close the opening 922 to prevent the formation of the metal film, unless necessary . 3 (Please read the notes on the back before filling out this page) ·· Order -------- Line 丨 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 505933 A7 B7 5 DESCRIPTION OF THE INVENTION (1) In order to form a resin film, a resin film forming device 912 heats a resin material to vaporize or atomize it, and releases it toward the outer peripheral surface of the container roller 911. Since the container roller 911 is cooled to a predetermined temperature, the resin material is cooled, and the film is deposited on the outer peripheral surface of the container roller 911. The stacked resin material can be hardened to a predetermined hardness by irradiating the resin hardening device 918 with an electron beam or ultraviolet rays according to a required situation. Next, the formed resin film may be subjected to an oxygen plasma treatment or the like by a surface treatment device 919 as necessary, so that the surface of the resin film is activated. The patterning material imparting device 913 is a type of oil patterning (oil). Patterning) is a device that forms an edge portion (also referred to as a non-metal band) on a metal thin film, and patterns the metal thin film into a predetermined shape. After forming a thin patterned material on the resin film in advance > forming a metal thin film by evaporation or the like, a gold film is not formed on the patterned material, but an edge portion is formed. The metal thin film formed in this way is formed in a state where the patterned portion is vacated, and a metal thin film having a predetermined pattern can be formed. The patterned material is vaporized in the patterned material applying device 913, and is released from the formed fine holes toward the outer peripheral surface of the container roller 911 at a predetermined position. The fine holes are generally arranged at a predetermined interval so as to be substantially parallel to the direction of the rotation axis of the container roller 911. Thus, the surface where the metal thin film is formed is thinly coated with a patterned material having a plurality of band shapes. Thereafter, a metal thin film forming apparatus 914 'is used to form a metal thin film by vapor deposition or the like. After that, it is removed by a patterned material removal device 917. Residual Figure 4 (Please read the precautions on the back before filling out this page) Printed by the Intellectual Property Bureau Employee Consumer Cooperative of the Ministry of Economic Affairs IAW ------- 丨 Order --------- line 丨 ----------------------- $ Zhang scale is applicable to China National Standard (CNS) A4 specification (210 X 297 (Mm) 5 丨 5 丨 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (;) Case materials. According to the manufacturing device 900 described above, the resin film formed by the resin film forming device 912 and the resin film formed by the resin film forming device 912 can be manufactured on the outer peripheral surface of the rotating container roller 911 with the shielding plate 923 retracted and the opening 922 opened. A laminated body obtained by alternately laminating metal thin films formed by a metal thin film forming device 914. In addition, when the shielding plate 923 covers the opening 922, a laminated body obtained by continuously laminating the resin film formed by the resin film forming device 912 on the outer peripheral surface of the rotating container roller 911 can be manufactured. In addition, when the container roller 911 is rotated, the patterning material applying device 913 is moved (e.g., reciprocated) in a direction parallel to the rotation axis of the container roller 911 to form metal thin films having different positions of the edge portions. In the above manner, a cylindrical multilayer laminate composed of a metal film and a resin film is formed on the outer peripheral surface of the container roll 911, and then the laminate is cut from the radial direction, removed from the container roll 911, and stored. The flat plate is pressurized to obtain, for example, the laminated body mother element 930 of FIG. 23. In Fig. 23, the 931 series metal film, the 932 series resin film, the 933 series edge portion (non-formation area of the metal film), and the arrow 938 are aligned with the advancing direction of the outer peripheral surface of the container roller 911. The laminated body mother element 930 of FIG. 23 is manufactured on the container roll 911, and the layers 936a, 935a, 934, 935b, and 936b are sequentially laminated. Here, the layers 936a and 936b are layers obtained by continuously laminating the shielding film 923 only with the resin film, and the layers 934 and 935a and 935b are layers obtained by alternately laminating the metal film 931 and the resin film 932 with the shielding plate 923 retracted . In addition, the layer 934 is a layer in which the container roller 911 changes the position at which the patterning material is adhered each time the container roller 911 is rotated. 5 This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the notes on the back before filling this page)-· I n -I n I nnf ϋ · 1 n I ϋ n ϋ I n 1 · n 1 · I ϋ n IIII nn ϋ ϋ ϋ ϋ IH ϋ I- 505933 A7 B7 V. Description of the invention (+) The laminated body element 930 is cut from the cut surface 939a, 939b, for example. An external electrode is formed in the cross-section 939a, whereby a large number of chip capacitors 940 shown in FIG. 24 can be obtained. In Fig. 24, 941a and 941b are external electrodes formed by making electrical connection with a metal thin film. The capacitor obtained by the above method has a very small thickness as a resin film as a dielectric layer, and thus becomes a small-sized, large-capacity capacitor. However, the following problems exist in the manufacture of electronic parts such as capacitors by the above method. * First, when the multilayer body element 930 is cut from the cut surfaces 939a and 939b, the metal thin film 931 must be cut. The cutting is performed by, for example, cutting with a cutter. At this time, burrs or chips of the metal film 931 may occur on the cut surface. Since the resin film and the metal film obtained in the above manner are extremely thin, burrs or chips of the metal film 931 may cause a short circuit between the upper and lower metal films holding the resin film. This is the reason for the reduction in the resistance and insulation resistance of the obtained capacitor. Further, in order to cut a metal thin film, a cutting force far exceeding a cutting force of a resin film is required. Therefore, if the cutting conditions are not appropriate, the laminated body near the cut surface may be deformed due to the cutting of the metallic thin film, or the metallic thin film may be subjected to pulling and the metallic thin film may be broken inside the laminated body. Deformation of the outer shape of the laminated body when used as an electronic component reduces the assemblability when assembled on a circuit board. In addition, the cracking of the metal thin film inside the laminated body causes deterioration of the characteristics of the electronic component and a decrease in the yield. Furthermore, cutting the metal thin film means that the metal thin film is exposed on the cut surface. Once the metal film is exposed to the cut surface, the metal film will be oxygenated from the cut surface. 6 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs-· 1 nn I— nnn a-0, I n ϋ— n ϋ n Hi II 1 nnnn ϋ nn I ϋ ϋ I— n 1 nn I nnnn. Printed by Employee Consumer Cooperative 505933 A7 B7 V. Description of the invention (r) Corrosion caused by rusting or rusting. Once the metal film acting as an electrode is corroded, the reliability of the obtained electronic parts is significantly reduced. In order to prevent this phenomenon, it is necessary to apply a packaging treatment such as resin coating to the cut surface. This will lead to an increase in the number of processes and an increase in cost.

In addition, the gold thin film is in a state where the cut surface is exposed. For example, when assembling to a circuit board, solder may adhere to the exposed metal thin film and cause a short circuit. In order to prevent this phenomenon, special consideration must be given to this situation during assembly, which becomes an assembly limitation. I Furthermore, in order to form an external electrode which is electrically connected to the metal thin film, it is inevitable to cut the metal thin film and expose it. However, it is preferable that the cut surface where the external electrode is not formed is not cut, or the metal film is not exposed on the cut surface. The capacitor shown in FIG. 24 is composed of one capacitor element. Therefore, if a plurality of capacitors need to be mounted on a circuit board, a corresponding number of capacitors will be required, which will hinder the miniaturization of the assembly area and increase the number of processes. In addition, in order to drive the semiconductor wafer at high speed, it is effective to reduce the connection length between the semiconductor wafer and peripheral components. However, once a large number of capacitors are mounted, the circuit length will inevitably become longer, which will hinder the speed of signal processing. [Disclosure of the invention] The object of the present invention is to solve part or all of the problems encountered in the above-mentioned conventional knowledge. [About the first invention] The object of the first invention is to provide a multilayer body, a capacitor, and the 7-sheet standard applicable to the 7 national standards (CNS) A4 specifications (210 X 297 mm) " '------ ------------ Order --------- line " (Please read the precautions on the back before filling this page) 505933 A7 ___B7 V. Description of the invention The manufacturing method and the manufacturing device can avoid cutting of the metal film as much as possible, and prevent the metal film from being exposed from the cut surface as much as possible. It is also an object of the present invention to provide a capacitor array including a plurality of capacitors in one element and a capacitor that can be easily combined with other elements, a method of manufacturing the same, and a manufacturing apparatus. The first issue 'states that in order to achieve the above-mentioned object, it has the following constitution. The first laminated body of the first invention is obtained by laminating a plurality of resin films and a plurality of metal films; it is characterized in that 'the end portion of the aforementioned metal film is not exposed to the outside of the aforementioned laminated body'; the aforementioned resin At least one layer of the film has through-holes in the lamination direction; the metal films above and below are electrically connected through the through-holes; at least one layer of the metal films can take out electrodes to the outside through the through-holes. According to this first laminated body, since the end portion of the metal thin film is not exposed to the outside of the aforementioned laminated body, corrosion of the metal thin film and the like are unlikely to occur. In addition, since the metal thin film is not cut during the manufacturing process, problems encountered when cutting the metal #film (such as burrs or chips of the metal thin film, cracking of the metal thin film, deformation of the laminated body, etc.) can be suppressed. In addition, since the metal thin film can take out an electrode to the outside through the through hole ^, it can provide a laminated body y 0 used as an electronic part. Moreover, the second laminated body of the first invention is made of a plurality of resin films.

It is obtained by laminating a plurality of metal thin films with a plurality of metal thin films; characterized in that a part of the surroundings of at least one layer of the resin film has a notch portion; the upper and lower metal films are electrically connected through the notch portion; The layer can take out the electrode to the outside through the notch. According to the second laminated body, because the metal film can be taken through the notch, the paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 x 297 public love) (Please read the precautions on the back before filling this page) Ministry of Economy Printed by the Intellectual Property Bureau's Consumer Cooperatives-· IIIIIII .ιδ] · —-— — • — — 1 — — — — — — — — — — — — — — — — — — — • Intellectual Property of the Ministry of Economic Affairs Printed by the Bureau's Consumer Cooperatives 505933 A7 B7 V. Description of Invention (q) The electrodes are provided to the outside, which can be provided as a laminated body used for electronic parts. In the second laminated body, it is preferable that the resin film has a substantially rectangular shape, and the metal thin film is formed by receding on a side of the resin film other than a side where the notch is formed. According to this preferred configuration, since the end portion of the metal film is formed by retracting from the end portion of the resin film, the metal film exposed to the outside of the laminated body can be reduced. This is because corrosion of the metal film is not likely to occur. In addition, since the metal thin film is not cut during the manufacturing process, problems encountered when the metal thin film is cut (such as burrs or chips of the metal thin film, cracking of the metal thin film, deformation of the laminated body, etc.) can be suppressed. Secondly, the first capacitor of the first invention is obtained by using a laminated body composed of a plurality of resin films and a plurality of metal films; characterized in that the end portion of the metal film is not exposed on the laminated body. Outside; at least one layer of the resin film has through holes in the laminated square; through the through holes, the metal film is electrically connected at every other layer to become equipotential; the metal film of the equipotential connection is The electrodes are taken out to the outside through the through holes. According to this first capacitor, since the end portion of the metal thin film is not exposed to the outside of the laminated body, corrosion of the metal thin film and the like are unlikely to occur. In addition, since the metal thin film is not cut during the manufacturing process, problems encountered when the metal thin film is cut (such as burrs or chips of the metal thin film, cracking of the metal thin film, deformation of the laminated body, etc.) can be suppressed. In addition, since the metal film connected at every other layer can be electrically connected to the outside, the resin film can function as a capacitor of the dielectric layer. In addition, the electrode extraction is performed through the through holes formed in the resin film, which can reduce the assembly area when the substrate is assembled. 9 This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ----- ------- 41 ^ -------- Order ------- ^ line (Please read the notes on the back before filling in this page) 505933 A7 B7 V. Description of the invention (?) To achieve high-density assembly. (Please read the precautions on the back before filling out this page.) The second capacitor of the first invention is obtained by using a laminated body composed of a plurality of resin films and a plurality of metal films; At least one layer of the resin film has a notch at a part of the periphery: through the notch, the metal film is electrically connected so that every other layer becomes an equipotential; the metal film of the equipotential connection is through the notch Remove the electrode to the outside. According to this second capacitor, since the metal thin film connected at every other layer can be electrically connected to the outside, the resin thin film can function as a capacitor of the dielectric layer. In addition, since the electrode extraction is performed through the notch formed in the resin film, it is possible to reduce the assembly area at the time of substrate assembly 'and achieve high-density assembly. In the second capacitor described above, it is preferable that the resin film has a substantially rectangular shape, and the metal film is formed backward with respect to a side of the resin film in which the notched portion is formed. According to this preferred configuration, since the end portion of the metal thin film is formed by retracting from the end portion of the resin film, the metal thin film exposed to the outside of the laminated body can be reduced. Therefore, uranium decay and the like of metal thin films are not easy to occur. In addition, because the metal film that is cut in the manufacturing process is reduced by the consumer cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, it can reduce the problems encountered when cutting the metal film (such as metal / · · burrs or chips of the film, metal Film rupture, laminate deformation, etc.). Secondly, the first manufacturing method of the laminated body according to the first invention is used to manufacture a laminated body that is alternately laminated with a resin film and a metal film, and is characterized in that: in the formation area of the resin film, the foregoing The metal thin film is formed to have a smaller area than the aforementioned resin thin film, and the Chinese National Standard (CNS) A4 specification (210 X 297 Public Love 3 505933 A7 B7) is applicable for every 10 paper sizes. 5. Description of the invention (7) Formation 1 In the case of a layer of metal film, that is, a process of changing the formation position of the foregoing metal film so that the resin film and the metal film are alternately laminated; a process of forming a through hole for penetrating the resin film and the metal film; and the through hole 对A process in which a conductive material is filled so that at least a part of the metal thin film is electrically connected to the conductive material. In addition, the second manufacturing method of the laminated body of the first invention is a process of forming a resin film and forming a metal thin film. The manufacturing process and the process of forming a through hole that can penetrate the resin film and the metal film at a predetermined position are one unit. This unit process is repeatedly performed on the support so that the resin film and the metal film are alternately laminated into a laminate; it is characterized in that the metal film is formed to have a larger area than the resin film in the formation area of the resin film. It is small, and the formation position of the metal thin film is changed each time one layer of metal thin film is formed; and the through-holes are continuously formed in the lamination direction, and the continuous through-holes are filled with a conductive material to make the metal thin film At least a part of it is electrically connected to the conductive material. In addition, the third manufacturing method of the laminated body of the first invention is a process of forming a resin film, a process of forming a through hole in the resin film, and a process of forming the resin film. The process of forming a metal film is one unit, and the unit process is repeatedly performed on a support / support so that the resin film and the metal film are alternately laminated into a laminate; it is characterized in that in the area where the resin film is formed, The area of the metal thin film is larger than the area of the resin thin film. Whenever one layer of metal thin film is formed, the formation position of the aforementioned metal thin film is changed; and, by forming the aforementioned metal π on this paper, the Chinese National Standard (CNS) A4 specification (210 X 297 mm) is applied (Please read the notes on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs · IIIIIII-SJ11111111 ^^ — — — — — — — — — — — — — — — — 505933 Ministry of Economic Affairs Printed by the Intellectual Property Bureau employee consumer cooperative A7 B7 V. Description of the invention (p) The aforementioned through holes are formed in the area of the thin film, so that a plurality of the aforementioned metal thin films in the lamination direction are electrically connected through the through holes. The third manufacturing method can efficiently manufacture the laminated body of the first invention. Next, the first method of manufacturing a capacitor according to the first invention is characterized in that the metal thin film is formed to have a smaller area than the formation area of the resin thin film in the area where the resin thin film is formed. In the case of a metal thin film, the formation position of the aforementioned metal thin film is changed to alternately laminate the resin film and the metal thin film; a process of forming a through hole penetrating the resin thin film and the metal thin film; and filling the through hole with a conductive material , Let the aforementioned metal thin film be used as the first gas connection process every other layer. In addition, the second manufacturing method of the capacitor of the first invention is based on a process of laminating a resin film, a process of forming a metal film, and a process of forming a through hole penetrating the resin film and the metal film at a predetermined position. This unit process is repeatedly performed on a support to manufacture a capacitor. It is characterized in that the metal film is formed to have a smaller area than the resin film formation area in the formation area of the resin film, and one layer is formed each time When the metal thin film is formed, the formation position of the metal thin film is changed; and the through holes are continuously formed in the lamination direction, and the continuous through holes are filled with a conductive material so that the metal thin film is electrically connected at every other layer. The third method of manufacturing the capacitor of the first invention is a process of forming a resin film, a process of forming a through hole in the resin film, and a process of forming a metal film on the resin film as a unit. This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) -------------------- Order --------- line (Please read the precautions on the back before filling out this page) ⑽933 ⑽933 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 —____ B7__ 5. Description of the Invention (") This unit process is repeated on the support to manufacture capacitors; It is characterized in that 'the formation area of the resin film is small in the formation area of the resin film, and the formation position of the resin film is changed every time a metal film of one layer is formed; In addition, the through-holes are formed in a region where the metal thin film is formed, so that the metal thin holes f are transmitted through the through-holes to be electrically connected at every other layer. According to the first to third manufacturing methods, the above capacitor of the Jth invention can be efficiently manufactured. ^ Secondly, the first manufacturing apparatus for a laminated body according to the first invention includes: a support body that rotates; a metal thin film forming device and a resin thin film forming device that are arranged opposite to the support body; and the support body and the forming body are housed. The vacuum tank of the device is characterized in that a laser patterning device for metal thin film processing is provided on the downstream side of the metal thin film forming device and upstream of the resin thin film forming device. • According to this first manufacturing apparatus, a metal thin film having a desired edge portion can be easily obtained. Therefore, by using such a manufacturing apparatus, the laminated body of the first invention can be manufactured efficiently. The second manufacturing apparatus of the laminated body of the first invention includes: a supporting body that is rotating; a metal thin film forming device and a resin thin film forming device that are arranged opposite to the supporting body; and the supporting body and the forming body are housed. The vacuum tank of the device is characterized in that 'the system further has: a laser processing device for hole processing' for forming a hole in a lamination direction; and an oil application device 'which is located downstream of the resin film forming device and The upstream side of the metal film forming device is used to apply an oil agent to the resin film. 13 This paper size applies to China National Standard (CNS) A4 specification (21〇X 297 public love) --------------------- Order ------ --- line (please read the precautions on the back before filling this page) 505933 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (p) According to the second manufacturing order, use the hole processing The laser processing device can be used to process through holes (and second through holes) through resin films (and metal films). Further, a metal thin film having a desired edge portion can be obtained by an oil application device. Therefore, by using this manufacturing apparatus, the laminated body of the fourth invention can be efficiently manufactured. In addition, the third manufacturing apparatus for a laminated body according to the first invention includes: a support body that is rounded; a metal thin film forming device and a resin thin film forming device that are arranged opposite to the support; and the support and the forming device are housed. A vacuum tank; characterized in that an oil agent applying device for applying an oil agent to the resin film is provided on a downstream side of the resin film forming device and an upstream side of the metal film forming device; the oil agent applying device has at least one To the nozzle (fine holes are arranged). According to the third manufacturing apparatus, a metal thin film having a desired edge portion can be obtained by the oil agent applying apparatus. In particular, there is at least an oil application device. For the nozzles, the nozzles can be individually moved independently, and a metal film having a substantially grid-like edge portion can be easily obtained. Therefore, the laminated body of the first invention can be efficiently produced by using the manufacturing apparatus. In addition, the fourth manufacturing apparatus of the laminated body of the first invention includes: a supporting body for rotating; a metal thin film forming device and a resin thin film forming device arranged opposite to the supporting body; and the supporting body and the forming body are accommodated. The vacuum tank of the device is characterized in that it further includes: a laser processing device for hole processing to form holes in the lamination direction; an oil application device provided on the downstream side of the resin film forming device and the metal film forming On the upstream side of the device, add oil to the resin film; and add 14 to the metal film • innl I n ϋ nnin I · 1 nnnnnnnnn ϋ n ϋ I 1 (Please read the precautions on the back before filling this page} A moderate ruler Sheet of paper 97 2 X 10 2 / fv Grid 4 AS) N (C · Standard 505933 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (η Laser patterning device for industrial use. It is provided on the downstream side of the metal thin film forming apparatus and on the upstream side of the resin thin film forming apparatus. According to the fourth manufacturing apparatus, laser processing for hole processing is used. This device can process through-holes (and second through-holes) that penetrate resin films (and metal films). In addition, it can obtain the required edge portion by its own oil application device and laser patterning device. The metal thin film. Therefore, by using this manufacturing device, the accumulated body θ of the first invention can be efficiently produced. [About the Π invention] 'The purpose of the Π invention is to provide a method for manufacturing a laminated body, _ It is considered to avoid the cutting of the metal film as much as possible. In addition, the invention of π is to provide a method for manufacturing electronic parts, which takes into consideration the reduction of the cutting surface other than the cutting surface of the external electrode. If the metal thin film is cut off Furthermore, the object of the π invention is to provide an electronic component whose metal thin film is not exposed on the cut surface of the external electrode which has not been opened. '&Quot; The Π invention aims to achieve the above object That is, the method for manufacturing a laminated body according to the present invention includes: a process for forming a resin film; and a method for forming a metal thin film by stacking metal material halves by a vacuum process. Cheng; by conducting Dao @ 战. 程 on the supporting body of the circle, a resin film and a metal film @ laminated body are produced on the aforementioned support body; characterized in that the aforementioned metal thin film is formed by rubbing the H The first non-metallic band formed in the moving direction is in a rectangular shape with the second non-metallic band formed in a substantially right-angle direction with the support body; the movement direction is approximately rectangular. By this, the non-metallic band is cut along the direction of the laminate. Cut, can reduce the cut metal 15 This paper size applies to China National Standard (CNS) A4 specifications (210 X 297 mm) --------------------- Order- -------- Line 2 should first read the precautions on the back and then fill out this page) 505933 Employees' Cooperatives of Intellectual Property Bureau of the Ministry of Economic Affairs printed A7 B7 V. Invention possibility (A) Film possibility. Therefore, short-circuits between the metal films due to burrs or chips generated by cutting the metal films can be prevented. In addition, it is possible to prevent deformation of the laminate or cracking of the metal film due to the cutting resistance of the metal film. Furthermore, since the metal thin film can be prevented from being exposed on the cut surface, the metal thin film can be prevented from being corroded, and restrictions on the assembly as electronic parts can be reduced. In addition, the manufacturing method of the electronic component according to the present invention is performed on a supporting body: a process of forming a resin film; and a process of forming a metal film by depositing a metal material by a vacuum process; After producing a laminated body containing a resin film and a metal thin film on a support, the aforementioned laminated body is cut in the direction of the lamination to form an external electrode to manufacture an electronic component; the metal thin film formed on the support is borrowed The first non-metallic belt formed in the moving direction of the support body and the second non-metallic belt formed in a direction substantially orthogonal to the moving direction of the support body are divided into a substantially rectangular shape; A portion is performed along at least a portion of the aforementioned non-metallic strip. Thereby, cutting along the non-metallic tape in the direction of the lamination can reduce the possibility of cutting the metal thin film. Therefore, short-circuits between the metal films due to the hairs or chips generated by cutting the metal films can be prevented. In addition, it is possible to prevent deformation of the laminate or cracking of the metal film due to the cutting resistance of the metal film. Furthermore, since the metal thin film can be prevented from being exposed on the cut surface, the metal thin film can be prevented from being corroded, and restrictions on the assembly as electronic parts can be reduced. In addition, regarding the first electronic component of the Π invention, it has a stack of 16 paper sizes that are applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ------------ — 丨 丨 —-Order --------- (Please read the precautions on the back before filling out this page) Printed by the Intellectual Property Bureau Staff Consumer Cooperative of the Ministry of Economic Affairs 505933 A7 B7 V. Description of Invention (丨 ί) Is obtained by laminating at least two layers of a resin film and a metal film respectively; and, an electrode is formed on a part of a side surface in a direction other than the lamination direction of the laminated body and is electrically connected to the metal thin film Or; characterized in that the metal thin film is not exposed on the side of the laminated body on which the electrodes are not formed. In addition, the second electronic component of the present invention is cut from a laminated layer obtained by laminating at least two layers of a resin film and a metal film, respectively, and cuts off a part of the cut surface with Yu Shu metal. The thin film is electrically connected to form an electrode; it is characterized in that the cut surface of the electrode is not formed, and the metal thin film is not exposed. According to the above-mentioned first and second electronic parts, since the metal thin film is not exposed on the surface where the electrodes are not formed, the metal thin film can be prevented from being corroded, and restrictions on assembly can be reduced. [Brief description of the drawings]. Figures 1A to 1E are not schematic structures of a chip capacitor obtained by using the laminated body of the embodiment A-1 of the present invention. 'Figure 1A is a cross-sectional view of the front view. Surface view, Figure 1B It is a right side view, FIG. 1C is a top view, and FIG. 1D is a cross-sectional view seen from the direction of the arrow D-D of FIG. 1A. FIG. 1E is a cross-sectional view seen from the direction of the arrow E-E of FIG. 1A. : Fig. 2 is a schematic side view showing a state in which a capacitor is assembled on a circuit board according to Embodiment A-1 of the present invention. Figs. 3A to 3E do not use the laminated body of Embodiment A-2 of the present invention. The schematic structure of the obtained chip capacitor is shown in FIG. 3A, which is a cross-sectional view in the front direction, FIG. 3B is a right side view, and FIG. 3C is a bottom view. ® 3D is in FIG. 17 X 297 mm) --- I--1 --------- IIII ^ · I ------- (Please read the notes on the back before filling this page) 505933 Intellectual Property of the Ministry of Economic Affairs Printed by the bureau member / consumer cooperative k A7 _____B7 _ V. Description of the invention (丨 b) A cross-section view of the D-D line of 3A seen from the arrow cube, Figure 3E is a cross-section seen from line E-E of Figure 3A from the direction of the arrow Illustration. FIG. 4A is a plan view showing a schematic configuration of a capacitor (capacitor row) according to Embodiment A-3, and FIG. 4B is a front view showing an example in which the capacitor of FIG. 4A is assembled on a circuit board. 5A to 5E are schematic structures of a chip capacitor obtained by using a multilayer body according to Embodiment A-4 of the present invention. FIG. 5A is a sectional view in a front view, FIG. 5B is a right side view, and FIG. 5C is a top view. FIG. 5D is a cross-sectional view seen from the direction of the arrow along line D-D in FIG. 5A, and FIG. 5E is a cross-sectional view seen from the direction of arrow from line EE of FIG. 5A. 6A and 6B are schematic side views showing a state where the capacitor of the embodiment A-4 of the present invention is assembled on a circuit board. 7A to 7E are schematic structures of a chip capacitor obtained by using the laminated body of Embodiment A-5 of the present invention. FIG. 7A is a cross-sectional view in the front view, FIG. 7B is a right side view, and FIG. 7C is a bottom view. FIG. 7D is a cross-sectional view seen from the direction of the arrow along the line D-D of FIG. 7A, and FIG. 7E is a cross-sectional view seen from the direction of the arrow along line E-E of FIG. 7A. FIG. 8 is a schematic cross-sectional view of an example of a manufacturing apparatus used to implement a method for manufacturing a laminated body according to Embodiment B-1 of the present invention. L: Fig. 9A and Fig. 9B are schematic diagrams of a patterning material applying device, Fig. 9A is a front view seen from a container roll, and Fig. 9B is a cross-sectional view taken along line B-B of Fig. 9A. -Fig. 10 is a developed view of an example of a stripe pattern of a patterned material formed on the outer peripheral surface of a container roll by a pair of patterned material imparting devices. 18 This paper size is in accordance with China National Standard (CNS) A4 (210 x 297 mm) --- — — — — — —-I · III 1 I 1 I ^ · 11111111 IAW1 (Please read the precautions on the back first (Fill in this page again) 505933 Printed by A7 B7, Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs 5. Description of the invention () Figure u is an expanded plan view of a layered body formed on the light outer surface of the container of embodiment B-1. Fig. 12 is a schematic cross-sectional view showing an example of a manufacturing apparatus used for carrying out a method for manufacturing a laminated body according to Embodiment B-4 of the present invention. Fig. 13 is a schematic cross-sectional view showing an example of a manufacturing apparatus used for carrying out a method for manufacturing a laminated body according to Embodiments 8 to 5 of the present invention. Fig. 14 is a schematic cross-sectional view of the main components of the handle 1 which is one of the manufacturing apparatuses used in the method for manufacturing the laminated body related to the embodiment B-6 of the present invention. Fig. 15 is a schematic cross-sectional view showing an example of a manufacturing apparatus for a laminated body used for carrying out a method for manufacturing a laminated body related to Embodiment C-1 of the present invention. FIGS. 16A to 16D are diagrams showing an example of a laminated body element obtained by Embodiment C-1 of the present invention. FIG. 16A is a front view, FIG. 16B is a top view, and FIG. 16C is a view of FIG. 16A. A cross-sectional view seen from the direction of the arrow along the line, FIG. 16D is a cross-sectional view seen from the direction of the arrow from the Π-Π line of FIG. 16A. Fig. 17 is a schematic perspective view showing an example of a wafer mold container obtained by the embodiment C-1 of the present invention. (Figure 18 is a schematic cross-sectional view of an example of a multilayer manufacturing device used to implement a method for manufacturing a laminated body related to Embodiment C-2 of the present invention.-Figure 19 is a first embodiment of the present invention 2 Front view of an example of a patterned material-imparting device for a related multilayer manufacturing device. 19 This paper size applies the Chinese National Standard (CNS) A4 specification (210 x 297 mm) nnn 1 n ϋ nnnnnn ϋ · ϋ n ϋ — Nn a δ, I nnnn I —1 n I (Please read the notes on the back before filling out this page) 505933 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (β) Figure 20 is from the front Look at a partially enlarged view of the nozzle head of the patterning material applying device of Fig. 19. Fig. 2 is a partial cross-sectional view of the fine hole seen from the direction of the arrow of the melon-melon line of Fig. 20. Fig. 22 is a schematic display for Fig. 23 is a schematic cross-sectional view of an example of a manufacturing apparatus used to implement a conventional manufacturing method of a laminated body. Fig. 23 is a perspective view of a schematic structure of a laminated body mother element obtained by the manufacturing apparatus of Fig. 22. To A perspective view of a conventional chip capacitor is constructed. [The best form for implementing the invention] [About the first invention] The following describes the first invention specifically with reference to the drawings. A. Multilayer and capacitor And the embodiment of the capacitor > J. (Embodiment 1-1) Fig. 1A to Fig. 1E are schematic structures of a chip capacitor obtained by using the laminated body of Embodiment A-1 of the present invention. Fig. 1A is a front view. 1B is a right side view, FIG. 1C is a top view, FIG. 1D is a cross-sectional view seen from the direction of the arrow DD line in FIG. 1 and FIG. 1E is a cross-section seen from the front direction of the line E-E in FIG. 1A The figure shows the laminated structure in a schematic way, and the size and number of laminated layers are significantly different from the actual laminated number. The laminated body 10 of this embodiment interacts with metal films 11a and 11b at different positions. Laminated by layers, metal film 11a and metal film nb 20 This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) -------- I ---- i ---- --- Order * -------- (Please read the notes on the back before (Write this page) 505933 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 5. The description of the invention (β) is laminated with the resin film 12. The area where the metal films 11a and 11b are formed is smaller than the area where the resin film 12 is formed The ends of the metal thin films 11a and 11b do not expose the outer peripheral surface of the laminated body 10. The two through holes 13a, 13b penetrating through the laminated direction of the laminated body 10 are formed separately. In terms of the relationship with the metal thin film, V The through hole 13a on one side penetrates only the metal thin film 11a, and the through hole 13b on the other side penetrates only the metal thin film 11b. Conductive materials 14a and 14b are filled in the two through holes 13a and 13b. The conductive material 14a is electrically connected to the metal thin film 11a, but is insulated from the metal thin film lib. The conductive material 14b is electrically connected to the metal thin film lib, but is insulated from the metal thin film 11a. Then, if the conductive material 14a, 14b exposed on the upper or lower surface of the laminated body 10 is used as an electrode extraction portion (removal electrode) and different potentials are respectively applied, a metal thin film 11a, 11b can be configured as an electrode, and a resin thin film 12 Capacitor for the dielectric layer. . ^ On the exposed conductive materials 14a and 14b, electrode terminals (protrusions (bumps) made of gold, silver, aluminum, copper, solder, conductive glue, conductive polymer, etc. can also be formed. )electrode). Fig. 2 is a schematic side view showing a state where the capacitor 10 shown in Figs. 1A to 1E is assembled on a circuit board 17; The electrode terminals 15 formed on the conductive materials 14a and 14b filled with the through holes 13a and 13b and the electrode terminals 19 on the circuit board 17 are connected. In the case of the conventional chip capacitor 940 shown in FIG. 24, since the electrodes 941a and 941b are formed on the side, it is necessary to use a larger projected area as seen from above the chip capacitor 940 as the assembly area. On the other hand, the paper size of this embodiment is 21 Chinese paper standard (CNS) A4 (210 > < 297 公 楚 1 一 * --- I ------------ 1 丨 Order --I --- I--I ^ w-- (Please read the precautions on the back before (Fill in this page) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs's Consumer Cooperatives 505933 A7 B7 V. Description of the invention (y) For the container, since the take-out electrode system is formed below, the required assembly area is the same as that seen from above the capacitor 10. The projected area is approximately the same. Thereby, higher density assembly can be obtained. In FIG. 2, although the electrode terminals 15 are formed on the conductive materials 14 a and 14 b, and the electrode terminals 15 are connected to the electrode terminals 19 on the circuit board 17, the conductive materials 14 a and 14 b may be directly provided without the electrode terminals 15. It is directly connected to the electrode terminal 19 on the circuit board 17. In FIGS. 1A to 1E, although the through-holes 13a and 13b penetrating in the lamination direction are filled with conductive materials 14a and 14b so that the electrodes can be taken out from either of the upper and lower surfaces, the through-holes 13a and 13b may not be made A through hole is formed by forming a non-through hole only from one of the upper and lower surfaces, and then filled with a conductive material, thereby becoming a capacitor in which a take-out electrode is formed on only one side. In Figs. 1A to 1E, although a laminated body for a capacitor is taken as an example, in addition to the application of the capacitor, it can be used in the example of a buckle wire, a microwave, and a laminated circuit board. In this case, the laminated structure and the connection form of the metal thin film and the extraction electrode can be changed depending on the intended application. • (Embodiment A-2) Figures 3A to 3E show the schematic structure of a chip capacitor obtained by using the product of Embodiment A-2 of the present invention. Figure 3A is a cross-sectional view in the front direction, and Figure 3B is a Right side view, FIG. 3C is a bottom view, FIG. 3D is a cross-sectional view seen from the direction of arrow D-D in FIG. 3A, and FIG. 3E is a cross-sectional view seen from line of arrow E-E in FIG. 3A. In the figure, the laminated structure is shown in a schematic way. Various sizes and the number of laminated layers are significantly different from the actual laminated number. twenty two & ^ Dimensions apply Chinese National Standard (CNS) A4 specifications (210 X 297 mm ^ " " ---- I -------- · 丨 丨 丨 丨 丨 丨 Order ---- ----- (Please read the precautions on the back before filling this page) 505933 A7 B7 V. Description of the invention (> 丨) The laminated ft 20 of this embodiment forms the metal thin films 21a and 21b at different positions. It is laminated, and the resin film 12 is laminated between the metal thin film 21a and the metal thin film 21b. The formation area of the metal thin films 21a and 21b is smaller than that of the resin thin film 22, and the ends of the metal thin films 21a and 21b are not exposed. The outer peripheral surface of the body 20. In each resin film 22, two through holes 23a, 23b penetrating in the lamination direction are formed separately. The through holes 23a are formed in the formation area of the metal thin film 21a and outside the formation area of the metal thin film 21b. The material filled with the depleted metal film 21a in the through hole 23a is electrically connected to the metal film 21a laminated on top and bottom through the through hole 23a. The through hole 23b is formed in the formation area of the metal thin film 21b and outside the formation area of the metal thin film 21a. Of the metal thin film 21b filled in the through hole 23b The material is electrically connected to the metal film 21b laminated on top and bottom. Thus, the metal film 21a and the metal film 21b are insulated. The through holes 23a and 23b under the metal film 21a and 21b at the bottom layer are filled with the metal film 21a. 21b is the same material. The through holes 23a and 23b on the uppermost metal films 21a and 21b can be filled with conductive materials 24a and 24b as required. Therefore, if the through holes 23a under the laminated body 20 are used The metal thin films 21a, 21b in 23b or the conductive materials 24a, 24b in the through holes 23a, 23b on the laminated body 20 are used as electrode extraction portions (removal electrodes). If different potentials are respectively provided, it can constitute a The metal thin films 21a and 21b are electrodes, and the resin thin film 22 is a capacitor having a dielectric layer. The metal thin film materials and / or the conductive materials 24a and 24b in the through holes 23a and 23b exposed on the outer surface may be formed of gold, Electrode terminals made of silver, copper, solder, conductive adhesive, conductive polymer, etc. (23 paper sizes are applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the back Please fill in this page for further information) · 1 I--III · II 1 ---- · Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the Employee Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by 505933 A7 B7 5. (Work) protrusion (bump) electrode). The capacitor of this embodiment is also the same as that of embodiment A-1, and can be assembled in the manner shown in FIG. 2, and can be assembled with high density. In FIGS. 3A to 3E, although through-holes 23a and 23b penetrating in the lamination direction are provided, the electrodes can be taken out from any one of the upper and lower surfaces, but the through-holes 23a and 23b may not penetrate to the upper surface (that is, the most The resin layer above the upper metal thin film 21a, 2lb does not have a through hole), but a take-out electrode is formed only on the lower side to form a capacitor. / In FIGS. 3A to 3E, although a laminated body for a capacitor is taken as an example, in addition to the use of a capacitor, it can be used in, for example, a coil, a filter, and a laminated circuit board. In this case, the laminated structure and the connection form of the metal thin film and the extraction electrode can be changed depending on the intended application. (Embodiment A-3): FIG. 4A is a plan view of a schematic configuration of a capacitor (electrical train line) according to Embodiment A-3, and FIG. 4B is a side view of an example in which the capacitor of FIG. 4A is assembled on a circuit board view. As shown in FIG. 4A, the capacitor elements 36 independently of the capacitor row 30 function as capacitor functions. The capacitor elements 36 are arranged in a lattice pattern in the vertical and horizontal directions. Each capacitor element .36 has the same configuration as the capacitors described in Embodiments A-i or A-2. That is, each of the capacitor elements 36 is composed of a resin thin film and a metal thin film 31 a, 3 lb which are alternately laminated. Each of the metal thin films 31a, 3lb is connected to a pair of extraction electrodes 35a, 35b, respectively. A through-electrode 37 may be formed in a non-formed region of the capacitor element 36 as required. The penetrating electrode 37 is 24 formed by penetrating the capacitor row 30 in the thickness direction. The paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) ------------- ί I 1 III 1 I ---— I — —Αν— C Please read the notes on the back before filling out this page} 505933 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (4) Through hole ( The second through hole) 38 is formed by filling a conductive material 39 therein. The through electrode 37 is insulated from each of the metal thin films 31a and 31b constituting the capacitor element 36. Electrode terminals (protrusion (bump) electrodes) made of gold, silver, inscription, Portuguese, solder, conductive paste, conductive polymer, etc. may also be formed on the extraction electrodes 35a, 35b and the through electrode 37. FIG. 4B shows an example of assembly. A capacitor array 30 and a carrier 46 on which a semiconductor wafer 45 is mounted are stacked on the circuit substrate 41. The electrode terminal 42 of the circuit board 41 is connected to an electrode terminal 35 'formed on the extraction electrode of the capacitor element 36 of the capacitor row 30. Further, the other electrode terminals 42 of the circuit board 41 are connected to electrode terminals 37 ′ formed on the through electrodes 37 of the capacitor row 30, and are connected to the electrode terminals 47 of the carrier 46 through the through electrodes 37 and further to the semiconductor The chip 45 is connected. Once the capacitor element 36 is separated by a plurality of capacitor elements 36 on the same surface to form a capacitor row, the assembly area can be reduced compared to the case where separate capacitors are arranged separately. Furthermore, even if a plurality of capacitor elements are integrated in one element, since the electrodes constituting each capacitor element (metal thin film) are independent, there is almost no mutual interference between capacitor elements, and floating capacity is not easy to occur. Furthermore, once the through-electrode 37 is formed in the capacitor row, other electronic components (semiconductor wafer 45 in the above example) can be placed on the capacitor row, and the substrate 41 and the electronic component can be electrically connected through the through-electrode 37. Therefore, in addition to reducing the assembly area, it can also be placed on the electronic paper. This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ------------- ------- Order --------- line (please read the notes on the back before filling in this page) 505933 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of Invention (External ) Capacitors are placed near the components to drive the electronic components at high frequencies. Further, the semiconductor integrated circuit 40 may be constructed by accommodating the capacitor array 30, the carrier 46, and the semiconductor wafer 45 mounted thereon in a single package. According to the semiconductor integrated circuit 40, a semiconductor chip for exerting individual functions can be used as one unit, so that the assembly process can be simplified compared to individually assembling semiconductor components. In addition, in a multilayer wiring substrate in which a plurality of insulating substrates are laminated through a predetermined wiring pattern layer, and each wiring pattern layer is connected through a through-hole formed in the thickness direction of the insulating substrate, the above-mentioned capacitor array 30 may be used as insulation. Part of the substrate (equipped with through holes). According to this configuration, capacitor elements and the like can be accommodated in a multi-layer wiring board, which can greatly reduce the assembly area and simplify the assembly process compared to the case of assembling capacitors on the substrate surface. (Embodiment A-4). Figs. 5A to 5E show a schematic configuration of a chip capacitor obtained by using a multilayer body according to Embodiment A-4 of the present invention. Fig. 5A is a cross-sectional view of the front view. It is a right side view, FIG. 5C is a top view, FIG. 5D is a cross-sectional view seen from the direction of the arrow D-D of FIG. 5A, and FIG. 5E is a cross-sectional view seen from the direction of the arrow E-E of FIG. 5A. In the figure, the laminated structure is shown in a schematic way. Various sizes and the number of laminated layers are significantly different from the actual laminated number. In the laminated body 50 of this embodiment, metal thin films 5la, 51b at different positions are laminated alternately, and a resin thin film 52 is laminated between the metal thin films 51a and 51b. At two places around the laminated body 50, 26 paper sizes are applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm)! I ----I ---- 丨 丨 丨 ----- 丨丨 丨 Order. 丨 丨 丨 丨 丨 丨 丨 (Please read the notes on the back before filling in this page) Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 505933 A7 B7 V. Description of the invention .53a, 53b are isolated. In Figs. 5A to 5E, the cutout portions 53a, 53b are formed in a substantially semi-cylindrical shape on the two opposing sides. The relationship with the metal thin film is that the notched portion 53a on one side is cut into only the metal thin film 51a, and the notched portion 53b on the other side is cut into only the metal thin film 51b. In the two gaps; the mouth portions 53a, 53b are filled with conductive materials 54a, 54b. The conductive material 54a is electrically connected to the metal thin film 51a, and is insulated from the metal thin film 51b. The conductive material 54b is electrically connected to the metal thin film 51b, and is in an insulated state from the metal thin film 51a. The metal thin films 51a, 51b are formed in a smaller area than the area where the resin film 52 is formed, so that the metal thin films 51a, 51b are not exposed on the two sides except for the two sides where the notch portions 53a, 53b are formed. Therefore, if the conductive material 54a, 54b of the laminated body 50 formed with the notched portions 53a and 53b exposed on the two sides and the upper and lower surfaces is used as electrode extraction portions (removal electrodes), respectively, different potentials can be formed to form U metal. The thin film 51a, 51b gallium electrodes, and the resin thin film 52 are capacitors having a dielectric layer. In this embodiment, if the capacitor has the same capacitance as that of the capacitor A of Embodiment A-1, it can be further downsized. Electrode terminals (protrusions (bumps)) composed of gold, silver, aluminum, copper, solder, conductive paste, conductive polymer, etc. may be formed on the conductive materials 54a, 54b exposed on the upper and lower surfaces and the side surfaces. )electrode). Figs. 6A and 6B are schematic side views showing a state where the capacitors 50 shown in Figs. 5A to 5E are mounted on a circuit board 57. Figs. Fig. 6A is an electrode terminal 55 formed on a conductive material 54a, 54b filled with notches 53a, 53b and an electrode terminal 27 on a circuit substrate 57. This paper is in accordance with China National Standard (CNS) A4 (210 X 297 mm) III — — — — — — — — — — — — — — — — — — — — — — — I— (Please read the notes on the back before filling out this page) 505933 A7 _____ B7 V. Description of the invention ("") when the sub-59 is connected. When the capacitor of this embodiment is assembled as shown in Fig. 6A, "compared to the conventional chip capacitor 940 shown in Fig. 24, the assembly area can be reduced, even if it is Compared with the case of assembling the capacitors of the first embodiment, the assembly area can be further reduced, and high-density assembly can be obtained. As shown in FIG. 6B, the capacitor 50 is directly provided on the circuit substrate 57 without forming the electrode terminal 55, so that it is exposed. When the conductive materials 54a and 54b on the side surfaces and the terminal 59 disposed on the periphery of the capacitor 50 are connected by a conductive material 58 such as solder. By using this assembly method, the assembly height can be reduced. Further, since the conductive material 58 is attached to the side surface of the capacitor 50, even if a poor adhesion of the conductive material 58 to the capacitor 50 occurs during assembly, it can be easily corrected. In FIG. 6A, although the electrode terminal 55 is formed on the conductive materials 54a and 54b, and the electrode terminal 55 is connected to the electrode terminal 59 on the circuit substrate 57, the electrode terminal 55 may not be provided and the conductive material 54a may be provided. 54b is directly connected to the electrode terminal 59 on the circuit substrate 57. In FIGS. 5A to 5E, although the notch portions 53a and 53b formed through the lamination direction are filled with conductive materials 54a and 54b so that the electrodes can be taken out from the upper and lower surfaces and from any of the two opposite sides, It is also possible not to make the cutouts / 53a, 53b penetrate, but to form a non-perforated cutout from only one of the top and bottom surfaces, and then fill it with a conductive material, thereby 'becoming the formation surface of the extraction electrode only in the up and down direction. One side of the capacitor. -In Figures 5A to 5E, although the laminated body for capacitors is taken as an example, in addition to the use of capacitors, it can be used in coils and filters, for example. This paper size is applicable to China National Standard (CNS) A4 specifications ( 210 X 297 public love) (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy 5JI n II n H ϋ HI nnnnn ϋ I n ϋ ϋ I ϋ nnnn ϋ n 505933 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of Invention (> 7). In this case, the laminated structure and the connection form of the metal thin film and the extraction electrode can be changed depending on the intended application. The formation positions of the notches 53a and 53b are not limited to the examples shown in FIGS. 5A to 5E. For example, it may not be formed on the two opposite sides, but may be formed on two of the four corners. (Embodiment A-5) FIGS. 7A to 7E are schematic structures of a chip capacitor obtained by using the laminated body of Embodiment A-5 of the present invention. FIG. 7A is a cross-sectional view in the front direction, and FIG. 7B is a right side view. FIG. 7C is a bottom view, FIG. 7D is a cross-sectional view seen from the direction of arrow D-D of FIG. 7A, and FIG. 7E is a cross-sectional view seen from line of arrow E-E of FIG. 7A. In the figure, the laminated structure is shown in a schematic way. Various sizes and the number of laminated layers are significantly different from the actual laminated number. In the multilayer body 60 of this embodiment, metal films 61a and 61b at different positions are alternately laminated, and a resin film 62 is laminated between the metal film 61a and the metal film 61b. The notches 63a, 63b which are continuous in the lamination direction at two places on the peripheral surface of each resin film 62 are formed by being separated. In Figs. 7A to 7E, the cutout portions 63a and 63b are formed in a substantially semi-cylindrical shape on the two opposite sides. The notch portion 63a is formed in the formation area of the metal thin film 61a and outside the formation area of the metal thin film 61b. The material of the metal thin film 61a filled in the notch portion 63a is electrically connected to the upper and lower metal thin films 61a. X, the notch portion 63b is formed in the formation area of the metal 雠 61b and outside the formation area of the metal thin film 61a, and the material 雠 6lb filled with the metal 雠 6lb in the notch portion 63b and the upper and lower stacked metal film 29 are read (read first Note on the back, please fill in this page again) ·· Order, 丨 λ 丨 · 丨 丨 This paper size applies to China National Standard (CNS) A4 specifications (210 ^ 7 ^^ 505933 A7 B7 Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs V. Description of the invention (4) 61b is used for electrical connection. As a result, the metal film 61a is insulated from the metal film 61b. The notches 63a and 63b below the metal film 61a and 61b are filled with the metal film 61a. 61b is the same material. The notches 63a, 63b on the uppermost metal films 61a, 61b can be filled with conductive materials as required. For example, the metal films 61a, 61b are formed of more resin. The formation area of the thin film 62 is in a small area, so that the metal thin films 61a and 61b are not exposed on the two sides except the two sides where the notched portions 63a and 63b are formed. Therefore, if the notched portions 63a and 63b are formed and exposed on 2 side and up and down The metal thin film material or conductive material 64a, 64b on the surface is used as an electrode extraction portion (removal electrode), and different potentials are applied to each other, so that a capacitor having metal thin films 61a and 61b as electrodes and a resin thin film 62 as a dielectric layer can be formed. Metal thin film materials and / or conductive materials 64a, 64b in the upper and lower notch portions 63a, 63b can also be formed of gold, silver, aluminum, copper, solder, conductive glue, conductive polymers, etc. The structure of the electrode terminal (protrusion (bump) electrode). The capacitor in this embodiment can be assembled in the same manner as in Fig. 6A and Fig. 6A, and the same effect can be obtained. Fig. 7A ~ In FIG. 7E, although the notch portions 63a, 63b are also formed in / on the uppermost metal thin films 61a, 61b, they are filled with conductive materials 64a, 64b, and the electrodes can be taken out from above, but the uppermost metal thin films 61a, The notch above 61b is not necessary. _ In Figs. 7A to 7E, although the laminated body for capacitors is used as an example, in addition to the purpose of the capacitor, 尙 can be used in, for example, wire 圏, filter 30 (please First read the back Please fill in this page again for the matters needing attention) # 定 i 线 丨 # This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) Printed by the Employees' Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 505933 A7 _____B7__: __ V. Invention Explain (") wave device, laminated circuit board, etc. At this time, the laminated structure and the connection form of the metal film and the extraction electrode can be changed according to the required application. The formation positions of the notches 63a and 63b are not limited to this. Examples of FIGS. 7A to 7E. For example, it may not be formed on the two opposite sides, but may be formed on two of the four corner pianos. B. Method and device for manufacturing multilayer body and capacitor Next, the method and device for manufacturing the multilayer body and capacitor described in the above item A will be described. : The basic manufacturing process of the laminated body and capacitor of the first invention is: ① a process of alternately laminating a resin film and a metal film on a support (a cross-lamination process) ② a laminated body (laminate body) It consists of a process (cut-off process) of cutting from a predetermined position to the direction of lamination. The metal thin films laminated in the cross-lamination process are patterned into a predetermined shape. In order to pattern the metal thin film, ① an oil-type patterning method in which a predetermined shape of an oil agent is given before the metal thin film is laminated; or ② after the metal thin film is laminated, the laminated metal thin film is irradiated with laser light to remove the metal Laser patterning of thin film materials; or ③ a combination of the two aforementioned methods; Formation of through-holes 13a, 13b shown in Embodiment A-1 (Figures 1A to 1E), filling of conductive materials 14a, 14b, and cutout portions shown in Embodiment A-4 (Figures 5A to 5E) Formation of 53a, 53b, filling of conductive materials 54a, 54b, and formation of penetrating electrode 37 shown in Embodiment A-3 (FIG. 4A, FIG. 4B), the separation process can be cut off after the above-mentioned cross-lamination process is completed Before the start, 'holes were formed in the stacking direction with laser light, etc., and then the Chinese national standard (CNS) A4 specification (210 X 297 mm) was applied to 31 paper sizes (please read the precautions on the back before filling this page)

-· Ϋ I ί I ϋ I n I n II ϋ n ϋ ϋ I nnnnnnnn ϋ I ϋ I ϋ n 1 · ϋ n ϋ ϋ ϋ n ϋ I 505933 Α7 Β7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Explanation (?.) This hole is filled with conductive material. Alternatively, in the interactive lamination process, whenever the resin film and / or the metal film are laminated, the laser light is irradiated to remove the resin film and the metal film at a predetermined position, and continuous holes are formed in the lamination direction. After completion, the obtained through hole was filled with a conductive material section. In addition, the formation of the through-holes 23a, 23b of the through resin films 21a, 21b shown in Embodiment A-2 (FIGS. 3A to 3E), and the formation of the resin shown in Embodiment A-5 (FIGS. 7A to 7E) The formation of the notches 63a and 63b of the films 61a and 61l / is performed in the interactive lamination process. After the resin film is laminated and before the metal film is laminated, only the predetermined position of the newly laminated resin film is removed by laser light and the like. The thin film forms a through hole, and then a metal thin film is laminated, and the upper and lower metal thin films can be connected to each other through the through hole. The manufacturing method and manufacturing apparatus of the first invention can choose between the various methods described above and combine to obtain a plurality of embodiments. The following is a list of representative embodiments. (Embodiment B-1) Fig. 8 is a schematic cross-sectional view showing an example of a manufacturing apparatus used to implement a method for manufacturing a laminated body according to Embodiment B-1 of the present invention. In this implementation form. The metal thin film is patterned by the oil patterning method, and the laser processing device is used to form the through-holes or notches after the cross-lamination f process is completed. In FIG. 8, 100 is a manufacturing device of this embodiment, 115 Department of vacuum tank, 116 is a vacuum pump used to maintain the inside of the vacuum tank 115 at a predetermined degree of vacuum, 111 is set in the vacuum tank Π5, to the figure. Arrow in the middle 32 This paper size is applicable to China National Standard (CNS) A4 specifications (210 X 297 mm) ^ (Please read the precautions on the back before filling out this page) # Order · — • Line 丨-505933 A7 B7 V. Description of the invention (; 丨) Cylindrical container roller rotating in 111a direction, ι12 series resin film forming device, 130a, 130b series patterning material applying device (nozzle), U4 series metal film forming device (metal material supply source), 117 series patterned material removal device, 118 series resin hardening device, 119 series surface treatment device, 120 series partition wall that separates metal film forming area into different areas, 121 series openings in partition wall 120, 123 series unless necessary Otherwise, in order to prevent the formation of the metal film, the shielding plate for opening ι21 is opened and closed by moving in the moving direction 123a, 125 laser processing equipment, 127 plasma irradiation device. By rotating the container roller 111, the container roller 111 can be used. Formed on the outer peripheral surface: The resin film formed by the resin film forming device 112 and the metal film formed by the metal film forming device 114 are alternately laminated. Laminated body. At this time, a pair of patterning material applying devices 10a and 130b are used to give a patterned oiling agent of a predetermined shape to the surface of the resin film before the formation of the metal film, thereby forming a patterned film. Metal film of any shape. The basic structure of the patterning material applying device 130a is the same as that of the patterning material applying device 130b. The patterning materials shown in Figs. 9A and 9B are the same as those of the device (nozzle) 130a and 130b. 9A is a front view seen from the side of the container roller 111, and FIG. 9B is a cross-sectional view taken along the line BB of FIG. 9A. In FIG. 9A, the arrow 111b indicates the moving direction of the outer peripheral surface of the container roller 111. _ Pattern The chemical material imparting devices 130a and 130b have: a storage tank 134 for the patterned material (oil agent) 137 to maintain the liquid state, and 33 paper sizes that are applicable to China National Standard (CNS) A4 (210 X 297) (Please read the notes on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs · · n ϋ I n · nn ϋ nn ϋ n II h ϋ I n I nnn II— an in n 1_1 in n 1 n -ϋ · ϋ nn-505933 A7 B7 V. Description of the invention (8) Mold cavity 133 of vaporized patterned material. The storage tank 134 and the mold cavity 133 are connected by a connecting path 135. It is light facing the container 丨 丨 丨Opposite faces 132 are formed with a plurality of micro holes 131 (five in Figs. 9A and 9B) connected to the mold cavity 133. The plurality of micro holes 131 are substantially flat with the moving direction 111b of the container roller m; The predetermined distances are arranged at regular intervals. The patterning material applying devices 130a and 130b are heated to a temperature higher than the vaporization temperature of the patterning material (oil agent) 137. The patterning material 137 in the storage tank 134 is vaporized and moves to the cavity 133, from the fine holes 131 to The outer surface of the container roll ill is released. The released patterning material will liquefy on the outer peripheral surface of the container roller U1, forming a liquid film of the patterning material. In the manufacturing apparatus of this embodiment shown in FIG. 8, the pair of patterned material applying apparatuses 130 a and 130 b may be respectively substantially parallel to the rotation axis direction of the container roll 111 (the direction of movement and movement of the outer peripheral surface of the container roll 111). 111b is moving at approximately a right angle). Thus, the plurality of stripes of the patterned material formed on the outer peripheral surface of the container roller 111 by the patterned material applying device 130a and the plurality of the pattern formed on the outer peripheral surface of the container roller by the patterned material applying device 130b. The stripes of the patterned material of the strips appear crossed. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs.Figure 10 shows the device is provided with a pair of patterned materials.13. 0a, 130b is an expanded view of an example of a striped pattern of a patterned material formed on the outer peripheral surface of the container roll 111. The arrow 11 lb indicates the moving direction of the outer peripheral surface of the valley roller 111. The solid line 138a indicates five stripes of the patterned material formed on the outer peripheral surface of the container roll 111 by the patterning material imparting device 130a, and the dotted line 138b indicates the pattern of the container roll 111 by the patterning material imparting device i30b. 5 strips of patterned material formed on the outer surface 34 This paper size applies to Chinese National Standard (CNS) A4 (210 X 297 public love) 505933 A7 B7 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Description (π). As shown in the figure, a pair of patterning material applying devices 130a and 130b are respectively reciprocated at a predetermined speed in parallel with the rotation axis direction of the container roller 111 at a predetermined speed. A grid-like pattern is formed on the patterned material. In particular, if the moving speed of the patterning material applying devices 130a and 咋 b is made substantially the same as the moving speed of the outer peripheral surface of the container roll 111, the stripes formed by each of the patterning material applying devices 130a and 130b and the moving direction 111b are formed. The angle can be set to approximately 45 degrees. As a result, it is possible to obtain a pattern in which the stripes 138a and 138b have a substantially orthogonal grid pattern. Thereafter, once the metal thin film is formed by the metal thin film forming device 114, since the metal thin film is not formed in the portion to which the patterning material has been applied, a rectangular metal thin film patterned into a grid shape can be formed. Further, the movement of the patterning material applying devices 130a and 130b is controlled so that the formation position of the lattice pattern formed after the container roller 111 is rotated once is not the same position as the formation position of the previous lattice pattern, preferably It is formed at a position shifted by a predetermined amount in parallel with one of the stripes 138a and 138b. Then, again control the movement of the patterning material imparting device 130a, 130b, so that the position of the grid-like pattern formed after one rotation is the same as before; The next formation position is inconsistent but consistent with the previous formation position. Thereby, the two kinds of metal thin films with the grid-like edge portion pattern shifted from the predetermined amount can be alternately laminated through the resin thin film. Furthermore, the metal film holding the resin film moves the pattern position in such a manner as to retain a predetermined facing portion. The opposing portion forms a capacitance forming area of the capacitor. The laser processing device 125 is irradiated with a lightning 35 toward the outer surface of the container roller 111 (please read the note on the back? Matters before filling out this page) · --ϋ · ϋ n _ϋ n H I think OJ · nnnn an ϋ i line 丨The paper size of this paper applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 505933 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of invention (w) Radiation. The laser processing device 125 includes a scanning device (not shown), and can irradiate the container roller 111 at any position in the direction of the rotation axis and / or the traveling direction of the outer peripheral surface in the direction close to the normal direction of the outer peripheral surface of the container roller 111. laser. In this embodiment, after forming an interactive laminate composed of a resin film and a gold film on the outer peripheral surface of the container roll 111, the container roll 111 is rotated and the laser light is irradiated to a predetermined position in synchronization with the rotation. The laser light from the laser processing device 125 can heat and melt both the resin film and the metal film (in some cases, even evaporation) can be removed. Thereby, a through hole penetrating through the layered direction of the layered body can be formed. As a laser light source that can process both resin film and metal film, although it is determined by the thickness of the resin film material, the metal film material, and the thickness thereof, generally, for example, C02 laser, YAG laser, excimer laser, Green laser and so on. The plasma irradiation device 127 is provided on the downstream side of the laser processing device 125 toward the outer peripheral surface of the container roll 111. As the plasmon, an oxygen plasma, an argon plasma, a nitrogen plasma, etc. can be used, but an oxygen plasma is preferable in consideration of the purification rate of the laser processing surface. In the following, the interactive lamination process using the device shown in FIG. 8 will be described. The inside of the vacuum tank 115 is reduced to about 2 × 10 Pa by the vacuum pump 116, for example. The outer peripheral surface of the container roll 111 is preferably cooled to -20 to -40 ° C, and more preferably to -10 to 10 ° C. The rotation speed can be set freely, generally 15 to 100 rpm, and the peripheral speed is preferably 10 to 300 m / min. The resin film forming device 112 is used to heat and vaporize the resin film material. 36 This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling out this page). — — — — — — — 线 丨 # 505933 A7 B7 V. Description of the invention (β) or atomize and release it toward the outer peripheral surface of the container roll 111. The resin film material is cooled on the outer peripheral surface of the container roll 111 to form a liquid film. (Please read the note on the back? Matters before filling out this page} As a resin film material, there is no particular limitation as long as it can be deposited in the above manner to form a film. It can be appropriately determined according to the purpose of the obtained laminated body, and the antifriction Monomeric resins are preferred. For example, acrylic resins are preferred as the main component of vinyl resins, and more specifically polyfunctional (methacrylate monomers and polyfunctional vinyl ester monomers are preferred). Among them, cyclopentadiene ~ can dimethanol diacrylate, cyclohexanedimethanol divinyl ether monomers and the like are monomers formed by replacing these hydrocarbon groups, from electrical characteristics, heat resistance, safety, etc. It is desirable from a viewpoint. The "main component" herein means that the above-mentioned components are contained in the resin film material in an amount of 90% by weight or more. The resin film material formed by stacking can be used by a resin curing device 118 as required. The hardening process is performed to a desired degree of hardening. As a hardening process, it is printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. The hardening device 4 can be, for example, an electron beam irradiation device, an ultraviolet irradiation device, or a thermal hardening device, etc. The degree of the hardening treatment can be appropriately changed according to the characteristics of the laminated body to be manufactured, for example, the degree of hardening is 50 to 95%, and further 50 to 50%. A hardening treatment of 75% is better. In addition, the definition of the hardening degree of the present invention is called an infrared spectrophotometer to find the ratio of the absorbance of C = 0 group to the C = C group (16000CIXT1) to find the individual monomers and The ratio of the hardened material is obtained by subtracting the reduced absorbance by 1. The formed resin film can be surface-treated by a surface treatment device 119 as required. For example, discharge treatment or ultraviolet irradiation treatment in an oxygen atmosphere ， Activate the surface of the resin film to improve its paper thickness with the metal sheet. Applicable to China National Standard (CNS) A4 (210 X 297 mm). 505933 A7 B7. 5. Description of the invention (4) Adhesion of the film. _ Next, a pair of patterning material applying devices 130a and 130b are used to apply a patterning material with a grid pattern as shown in FIG. 10 to the resin film. A thin patterning material is formed. After the metal film is formed by evaporation or the like, the metal film is not formed on the Tuning material, but the edge portion is formed. In this way, a metal film having a desired pattern can be formed. As the pattern used The chemical material is preferably an oil agent selected from at least one of the group consisting of an ester-based oil agent, a glycol-based oil agent, a fluorine-based oil agent, and a hydrocarbon-based oil agent. More preferably, it is an ester-based oil agent, two Alcohol-based oil agents and fluorine-based oil agents are particularly preferred as fluorine-based oil agents. If patterning materials other than the above are used, the surface of the laminate may be rough, pinholes of resin films and metal films, and metal films may be formed. Problems such as instability at the interface. After the patterning material is applied, the metal thin film is laminated by the metal thin film forming device 114. As a method of laminating the metal thin film, vapor deposition, sputtering, ion implantation, and the like are known. In the present invention, in the present invention, from the viewpoint of obtaining a film having excellent moisture resistance with high productivity, it is preferable to use vapor deposition, especially electron beam vapor deposition. As the material of the metal film, aluminum, copper, zinc, nickel, iron, inscription, etc. can be used. , Silicon, gallium or these compounds, or their oxides, or their oxides. Among them, aluminum is preferred from the viewpoint of adhesiveness and economy. The metal thin film may contain other components than those described above. Moreover, the metal thin film may not be limited to one type. For example, the A1 layer and the Cu layer may be mixed to enhance the characteristics, and high performance may be achieved depending on the use conditions. In addition, to stop the formation of the metal thin film, use the shielding sheet 38. The paper size is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) (please read the precautions on the back before filling out this page). · Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs · —------- I Aw- III —----- 505933 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Description (37 ) 123 to close the opening 121. After that, the remaining patterning material is removed by the patterning material removing device 117. Most of the patterned material has evaporated and disappeared when the metal thin film was formed, but a part of it remains after the metal thin film is laminated. Residual patterned materials can cause problems such as rough surface of the laminate, pinholes of the resin film and metal film (the laminate is loose), and instability of the boundary portion of the metal film. The method of removing the patterned material is not particularly limited, and it can be selected according to the patterned material used. For example, it can be removed by light irradiation or heating by an electric heater, plasma irradiation, ion irradiation, or electron irradiation. Decomposition and removal. According to the above manufacturing apparatus 100, the resin film formed by the resin film forming apparatus 112 and the metal film forming apparatus Η4 are manufactured on the outer peripheral surface of the rotating container roll 111 with the opening 121 opened. The laminated body obtained by superimposing the metal thin film and the laminated body is produced by continuously laminating the resin film formed by the resin film forming device 112 on the outer peripheral surface of the rotating container roll 111 with the opening 124 closed. Laminated body. Furthermore, as described above, by controlling the rotation synchronously with the rotation of the container roller ill, the back and forth movement of the patterning material imparting devices 130a and 130b allows the position of the grid-like edge portion pattern of the metal thin film to be alternately applied through the resin thin film. 2 ways to change. After the lamination of the resin film and the metal film is completed, a laminated body is laminated on the outer peripheral surface of the container roll 111, and a laser processing device 125 is used to form a through hole in the laminated body. Specifically, while rotating the container roller 111 39, the paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page) Order i-line 丨 线- ------------------- 505933 Member of the Intellectual Property Bureau of the Ministry of Economy X Consumer Cooperative printed A7 B7 V. Description of the invention (β), while scanning the laser light in synchronization with the rotation, Laser light is irradiated to a predetermined position. After the through-holes are formed, it is preferable that the inner wall surface of the through-holes is irradiated with plasma by a plasma irradiation device 127. By performing a plasma treatment on the inner wall surface of the through-hole ', the resin film material from the inner wall surface will be removed to increase the exposed amount of the metal film. As a result, when a conductive material is filled in the through hole later, the reliability of the electrical connection between the conductive material and the metal thin film can be improved. ‘FIG. 11 is an expanded plan view of a laminated body formed on the outer peripheral surface of the container roll 111. The moving direction of the outer peripheral surface of the container roller 111 is indicated by an arrow 111b in FIG. The metal thin film 31a and the metal thin film 31b that are patterned into a substantially lattice shape are alternately laminated through a resin film. The substantially grid-like edge portion pattern of the metal thin film 31a is almost the same as the substantially grid-like edge portion pattern of the metal thin film 31b. The two patterns are such that the metal thin film 31a and the metal thin film 31b have a predetermined overlapping portion in the lamination direction. Staggered to form. The overlapped portion of the metal thin film 31a and the metal thin film 31b forms a capacitance forming area when used as a capacitor. The through-hole 33a in the lamination direction is formed at a position penetrating the metal thin film 31a but not penetrating the metal thin film 31b. In addition, the through-hole 33b in the lamination direction is formed at a position penetrating the metal thin film 31b but not through the metal thin film 31a. The laminated body is peeled from the container roll 111, and the plate is pressed, and then the through-holes 33a, 33b are filled with a conductive material. (For example, the well-known 40 paper sizes containing metal particles are applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm): " ------------- · ----- -1 ^ --------- ^ ----------------- (Please read the notes on the back before filling in this page) 505933 A7 B7 Ministry of Economy Wisdom The property bureau employee consumer cooperative prints the conductive resin of the invention description (? 丨) to obtain the laminated body component. Next, a cutting and separation process is performed. It cuts along the edge portions where the metal thin films 3la, 31b are not formed, that is, on the cutting surfaces 71a, 71b in the direction of lamination. Thereby, the laminated body shown in Embodiment A-1 · 1 (Fig. 18 to Fig. 1) can be obtained. As described above, according to this embodiment, the cut surfaces 71a and 71b do not include the formation regions of the metal thin films 31a and 31b. That is, since the metal thin films 31a and 31b are not cut, burrs or chips that occur when the metal thin film is cut are not generated. Further, since the metal thin film is not cut, only a small cutting force is required, and deformation of the laminated body and cracking of the metal thin film are unlikely to occur during cutting. Also, since the metal thin film is not exposed on the cut surface, the metal thin film does not easily corrode even if it is not packaged. In addition, since the formation of the through holes 33a and 33b is performed by the laser processing device I25, no mechanical external force is applied to the metal thin film or the resin film during processing. Therefore, deformation of the laminated body or cracking of the metal thin film does not occur. As necessary, of course, the outer surface of the laminated body obtained as described above may be packaged or colored. · In the above process, the opening 121 may also be closed at the initial stage and the final stage of the cross-lamination process to form a protective layer of a predetermined thickness where only the resin film is continuously laminated. In the above process, if instead of the cutting surface 71a, a surface parallel to the cutting surface 71a 'and a surface approximately passing through the respective centers of the through-hole 33a and the through-hole 33b is taken as the cutting surface, Embodiment A_4 can be obtained (Fig. 5A ~ Figure 5E) 41 (Please read the precautions on the back before filling out this page) · Order i-line 丨 · 丨 This paper size applies to China National Standard (CNS) A4 (21〇X 297 mm) 505933 A7 B7 5. The laminated body shown in the description of the invention (M). At this time, although the metal thin films 31a and 31b are cut on this cut surface, since the cut surfaces include notches 53a, 53b and edge portions, the actual cut area of the metal thin films 3a, 3lb is reduced. In addition, the cut surface 71b on the other side does not cut the metal thin films 31a, 3lb. Therefore, compared with the conventional separating and cutting process of the capacitor manufacturing method, the cutting area of the metal thin film can be reduced. Therefore, it is possible to reduce the occurrence of burrs or chips when the metal film is cut. Moreover, only a small cutting force is required, and deformation of the laminated body and cracking of the metal thin film are less likely to occur during cutting. In addition, since the metal thin film is not exposed on the peripheral surfaces other than the formation surfaces of the cutout portions 53a and 53b, the metal thin film is less likely to be corroded. Furthermore, to obtain the capacitor array shown in Embodiment A-3 (FIG. 4A) (the embodiment in which the capacitor element 36 is used as the capacitor in Embodiment A-1), it is sufficient to adopt the following method. That is, in the above, a through-hole (the first through-hole) is formed at a predetermined position in the edge portion area where the metal thin film 31a and 3lb are not formed, and the second through-hole is similarly filled with conductive electricity. Material to form a through electrode. After that, the edge regions are cut so as not to cut the metal thin films 31a, 31b. Also in this case, since the metal thin films 31a and 31b are not cut, burrs or chips that occur when the metal thin films are cut are not generated. Further, since the metal thin film is not cut, only a small cutting force is required, and deformation of the laminated body and cracking of the metal thin film are less likely to occur during cutting. In addition, since the metal thin film is not exposed on the cut surface, the uranium decay of the metal thin film is unlikely to occur even without packaging. _ (Embodiment B-2) In this embodiment, the following are different from the above-mentioned Embodiment B-1. 42 The paper size applies the Chinese National Standard (CNS) A4 (210 X 297 mm). (Notes to fill out this page). · Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs — — — — — — — — — — — — — — — — — — — — — — — — — — 505933 A7 B7 ). That is, in the embodiment B-1, the laser processing device 125 is irradiated with laser light to form a through-hole in the layered body after the end of the layering process. However, in the embodiment B-1, the layering is performed in the layering process. Laser light is radiated during the process. Specifically, the resin film and metal film newly laminated by one rotation of the container roller 111 are irradiated with laser light by the laser processing device 125 to remove the resin film and metal film at a predetermined position. By synchronously scanning the laser light with the rotation of the container roller Π1, the irradiation positions of the laser light in the lamination direction can be made uniform. In this way, continuous holes can be formed in the stacking direction, and through holes can be formed in the stacking direction. When forming the through-holes, it is only necessary to irradiate the area where the metal thin film is not formed on the resin film with laser light, and process the through-holes (second through-holes) for through electrodes. Also in this embodiment, the plasma treatment of the inner wall surface of the through hole by the plasma irradiation device 127 is desired. The plasma treatment can be performed at any time during the cross-lamination process, or after the cross-lamination process. . In this embodiment, the discontinuity can be easily formed by stopping the hole processing performed by the laser processing device 125 during a predetermined period in the interactive lamination process. hole. For example, if a protective layer obtained by laminating a resin film on the upper layer and / or the lower layer of the laminated body is formed continuously, if the upper and lower protective layer portions are not subjected to hole processing, the extraction electrode can be obtained only in the upper and lower layers. Capacitors formed on one side. Except for the above, the rest are the same as those of the embodiment B-1. (Implementation Form B-3) 43 This paper size is applicable to China National Standard (CNS) A4 (210 x 297 public love) (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs n 1 ϋ 1 nn I ^ OJi nn I nm ϋ n I n 1 nnnnn · ϋ n ϋ I nnnn · ϋ ϋ ϋ ϋ n ϋ n I-505933 A7 B7 Printed by the Consumers' Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs (W) In the present embodiment, the points described below are the same as those in the embodiments B to 2. That is, 'in this embodiment B-3', a laser processing device® is used which has the characteristics of being able to remove the resin film but not the metal film.丨 At first glance The laser light source with the above characteristics depends on the resin film material and the metal film material M. For example, a long wavelength M can be used, such as a co2 laser. In the interactive lamination process, a metal thin film formed by the metal thin film forming device II4 and a resin thin film formed by the resin thin film forming device 112 are sequentially laminated, and then a laser processing device 125 is used to irradiate laser light to a predetermined position. The laser light provided by the laser processing device 125 removes the resin film and forms a through hole through the resin film at the irradiation position. When a metal film exists under the resin film, as long as the laser power is controlled below a predetermined threshold, the laser light has no effect on the metal film. After that, if a metal thin film is formed in the area containing the through hole formed in the resin film, the metal thin film above and below the resin film can be connected through the through hole. 0- Same as in the embodiments B-1 and B-2, each rotation The position of the grid-like edge portion pattern of the metal thin film is changed when the container roller 111 is used once. The shape is appropriately set by the position of the grid-like pattern of the metal thin film that changes with each layer. Formed at the position of the through hole of the resin film, a laminated body mother element can be obtained through a metal film formed through the through hole of the resin film. The laminated body mother element and the embodiments B-1, B- 2 Also cut from the cutting surfaces 71a, 71b of FIG. 11. Thereby, the laminated body shown in embodiment A-2 (FIG. 3A ~ 3E) can be obtained. In addition, if you replace the cut surface 71a, change it to 44 (please read the precautions on the back before filling this page) · ---- Order 丨-线 丨 # 丨 丨 This paper standard applies to China National Standard (CNS) A4 (210 X 297 mm) 505933 A7 B7 Printed by the Consumers' Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (0) A surface parallel to the cut surface 71a and passing through the through holes 33a and the respective approximately center of the through holes 33b is By cutting the surface, a laminated body as shown in Embodiment A-5 (FIG. 7A to FIG. 7E) can be obtained. In this embodiment, after the through-hole is formed in the resin film in the cross-lamination process, a metal film is formed to fill the through-hole with a metal film material. Therefore, the metal thin films are sequentially connected through the through-holes formed in the resin thin film, but it is not necessary to fill the through-holes with a conductive material as in Embodiments B-1 and B-2. However, when a hole is formed in the resin film on the upper surface layer of the multilayer mother component, and a metal film is exposed at the bottom of the hole, it is preferable to fill the hole with a conductive material by connecting the metal film. Thereby, the electrode can be easily taken out through the filled conductive material. In the cross-lamination process, laser light is irradiated to the area where the metal thin film is not formed to form a through-hole (second through-hole), and the through-hole is continuous in the lamination direction. Thereby, a multilayer body mother element (having a through-hole that does not penetrate the metal film) can be obtained. Once the conductive holes are filled with a conductive material in the same manner as in the embodiments B-1_ and B-2, and then cut from the edge region, a capacitor array having the through-electrodes shown in the embodiment A-3 can be obtained. (An embodiment of the capacitor using the capacitor element 36 as the embodiment A-2). In this embodiment as well, it is preferable to perform plasma treatment on the inner wall surface of the through hole using the plasma irradiation apparatus 127 in the cross-stacking process. In this embodiment, as in Embodiment B-4, the hole processing by the laser processing device 125 may be stopped at a predetermined time in the cross-lamination process. For example, the upper layer and / or the lower layer of the laminated body only have 45 consecutive layers. The paper size is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) ~ (Please read the precautions on the back before filling this page) . · Order- · Line 丨 # 505933 A7 B7 V. Description of the invention (When the protective layer obtained by laminating the resin film is used, if the upper and lower protective layer parts are not subjected to hole processing, the electrode surface can only be taken out of the upper and lower surfaces. One-side capacitor. Except for the above, it is the same as Embodiment B-2. (Embodiment B-4) This embodiment B-4 uses the laser patterning method of laser light to pattern metal thin films. It is different from the above-mentioned embodiments B-1 to B-3 performed by the oil patterning method. As shown in FIG. 12, the manufacturing method used to implement the method for manufacturing the laminated body related to the embodiment B-4 of the present invention is shown. A schematic cross-sectional view of an example of the device. Parts having the same components as those in FIG. 8 are given the same reference numerals and descriptions thereof are omitted. In this embodiment, they are used for metal thin films instead of Embodiments B-1 to B-3. The patterning material used for patterning. The material 'applying means 130a, 130b- and the patterning material removing means 117 (see Fig. 8) are replaced with a laser patterning means 140. The laser patterning device 140 is provided in gold, and belongs to the downstream side of the thin film forming device 114 and the upstream side of the resin thin film forming device 112. . After the metal thin film is formed, a laser patterning device 140 is used to irradiate the surface of the metal thin film with laser light, and the metal thin film where it is irradiated is heated and melted (in some cases, even evaporation) is removed to form an edge portion. -The laser light emitted from the laser patterning device 140 is different from the laser light from the laser processing device 125, and has the following functions: only for thin metal films, 46 This paper size applies Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs-II nn ϋ nn 一 δν I ϋ n ϋ II ϋ n III nn I nnnn I ϋ ϋ nnnn III ϋ nnn '505933 A7 B7 V. Description of the invention (time) It has no effect on resin film. As a laser light source with related characteristics, it depends on the resin film material and the metal film material. For example, a YAG (Yttrium Aluminum Garnet) laser, a green laser, an excimer laser, and the like have a shorter wavelength. Long-wavelength laser light is reflected on the surface and surface of the metal thin film. The output of the laser light source can be appropriately selected depending on the type and thickness of the metal thin film to be removed. .  The laser light may be radiated in accordance with a desired shape pattern of the edge portion. Depending on the shape and pattern of the edge portion, a plurality of laser light sources may be used. For example, 'if the metal thin film is patterned to have a grid-like edge portion, the following method can be adopted. The light from the first laser light source is divided into a plurality of directions parallel to the rotation axis of the container roller 111 by 稜鏡, and is irradiated toward the outer peripheral surface of the container roller 111 to form a plurality of continuous directions in the traveling direction of the outer peripheral surface of the container roller 111. Strip edge. The light from the second laser light source intersects with the strip-shaped edge portion formed by the first laser light source and is scanned by a known method. If the metal thin film is patterned by the laser patterning method as in this embodiment, a pattern of any shape can be easily made. In the oil patterning method of the embodiments B-1 to B-3, the edge direction of the surface is formed to be inclined with respect to the outer periphery of the container roll 111. However, the laser patterning method of this embodiment may The edge portion is formed in a direction parallel to the traveling direction of the outer peripheral surface of the container roller 111 and in a right-angle direction. Along with the rotation of the container roller 111, the laser film patterning device 140 is used to cool the grid into a grid-like metal film. The resin film forming device 112 is used to laminate the resin film, and the metal film forming device 114 is further borrowed thereon. Standards are applicable to China National Standard (CNS) A4 specifications (210 X 297 mm) (Please read the notes on the back before filling this page) · Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs-5J · n 1 1 n ϋ 1 I ϋ nninnnn ϋ I n I n ϋ ϋ n ϋ nn nn 505933 A7 B7 V. Description of the invention (w) Laminate a metal thin film. After that, although the metal thin film on the surface layer was patterned into a grid pattern again by the laser patterning device 140, the formation position of the grid pattern at this time was shifted from the formation position of the previous grid pattern by a predetermined amount. form. Then, the container roller 111 is rotated again, so that the position of the grid pattern formed with respect to the metal thin film is shifted from the position of the previous grid pattern by a predetermined amount, and the position of the grid pattern from the previous grid position is Same location. Thereby, it is possible to alternately laminate two kinds of metal thin films of a predetermined pattern position with a resin film through a resin thin film. Thereby, a laminated body similar to that shown in Fig. 11 can be obtained on the outer surface of the container roll 111. In this embodiment, as described above, the relative relationship between the traveling direction 111b of the outer peripheral surface of the container roller 111 and the direction of the grid pattern is not limited to that shown in FIG. 11. Except for the above, the rest is the same as any of Embodiments B-1 to B-3, and a multilayer body (or a capacitor) shown in Embodiments A-1, A-2, A-4, and A-5 can be obtained. Or the capacitor array shown in Embodiment A-3. (Embodiment B-5) This embodiment B-5 simultaneously uses the oil patterning method and the laser patterning method to pattern the metal thin film. On the one hand, it is different from the above-mentioned embodiments B-1 to B-3 by the oil patterning method and the embodiment B-4 by the laser patterning method. The implementation shown in FIG. 13 is different. A schematic cross-sectional view of an example of a manufacturing apparatus used in a method for manufacturing a laminated body according to Embodiment B-5 of the present invention. Parts having the same constituent elements as those in FIGS. 8 and 12 are given the same reference numerals and descriptions thereof are omitted. 48 This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling out this page) ·· Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs ------ --- ^ 1 # ----------------------- 505933 A7 B7 Intellectual Property of the Ministry of Economic Affairs Printed by employee consumer cooperatives 5. Description of the invention (π) In this embodiment, the patterning material applying device 142 is provided downstream of the resin film forming device 112 and upstream of the metal film forming device 114. The patterning material providing device 142 is an oil recovery patterning method to form a plurality of strip-shaped edge portions. The laser patterning device 140 is provided downstream of the metal thin film forming device 114 and upstream of the resin film forming device 112. The laser patterning device 140 is an edge portion formed by a laser patterning method, and the edge portion intersects a band-shaped edge portion formed by the patterning material applying device 142. " The outer peripheral surface of the patterning material applying device 142 facing the container roller 111 The formed micropores are arranged at a predetermined interval at right angles to the direction of travel of the outer peripheral surface of the container roll 111. The patterned material vaporized in the patterned material applying device 142 is released from the micropores and adhered. A plurality of strip-shaped liquid films are formed on the resin film laminated on the container roll ill in parallel with the traveling direction of the outer peripheral surface of the container roll 111. 'After that, if the metal thin film is laminated by the metal thin film forming device 114, a band-shaped edge portion corresponding to the liquid film portion of the patterned material is formed. Next, the laser patterning device 140 is used to allow the laser light to cross the above The strip-shaped edge portion is scanned to irradiate the metal thin film to form an edge. unit. Thereby, a metal film patterned into a predetermined grid shape can be formed. In the same manner as in this embodiment, the formation position of the grid pattern of the metal film of a certain layer is formed relative to the position of the resin film formed through the resin film below it. The formation position of the grid pattern of the metal thin film is shifted by a certain amount, and the formation of the grid pattern of the metal thin film formed through the resin film below is formed. 297 mm) '~~ (Please read the notes on the back before filling this page). · -Ϋ -ϋ n n n n-OJI n I ϋ I ϋ in • Line 丨 505933 A7 B7 V. Description of the invention (M) The positions are the same. In other words, the two types of metal thin films whose grid patterns are shifted from the predetermined amount are alternately laminated with a resin thin film interposed therebetween. In order to achieve this layering, the following methods can be adopted. As the first method, when the container roller 111 rotates once, the patterning material imparting device 142 is moved along the rotation axis direction of the container roller lu, and then it returns to the original position after one rotation, that is, the so-called reciprocating motion is performed. . Alternatively, as the second method, when the container roller 111 rotates once, the irradiation position of the laser light generated by the laser patterning device 14 may be shifted by a predetermined amount at a right angle to the scanning direction. Return to the original position after the next rotation. Thereby, the same laminated body as that shown in Fig. 11 can be obtained on the outer surface of the container roll 111. However, in this embodiment, the direction of the edge portion of one of the vertical and horizontal directions of the grid-like pattern of the metal thin film is the same as the scanning direction 111b of the outer peripheral surface of the container roller 111. In addition, by moving the patterning material imparting device I42 to a direction that is flat with respect to the rotation axis direction of the container roller 111, or adjusting the scanning conditions of the laser light generated by the laser patterning device 140, the metal can also be The direction of the edge portion of the grid pattern of the film is set to intersect the traveling direction 111b of the outer peripheral surface of the container roll 111 at an arbitrary angle. The setting of the edge direction is determined by considering the size of the device and the laser / scanning speed used. Except for the above, the rest is the same as any one of the embodiments B-1 to B-3, and the multilayer body (or capacitor) shown in the embodiments A-1, A-2, A-4, and A-5 can be obtained. Or the capacitor array shown in Embodiment A-3. (Embodiment B-6) In this embodiment B-6, it replaces Embodiment B-1 ~ B-5. The paper size of this paper applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) --- ---------- Φ (Please read the notes on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs

11 · nn ϋ · ϋ n · ϋ ϋ I nnn 1 I n ϋ nn in n in n in n I n 11 nn — II 505933 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (w) The cylindrical container roller I11 used was replaced with a regular polygonal column-shaped support body, which was intermittently rotated to form a laminated body on the outer periphery. Fig. 14 is a schematic cross-sectional view of main components of an example of a manufacturing apparatus used for implementing a method for manufacturing a laminated body according to Embodiment B-6 of the present invention. In Fig. 14, the same components as those in Figs. 8, 12, and 13 are given the same reference numerals, and descriptions thereof are omitted. In this embodiment, a laminated body is formed on the peripheral surface of the support body 211 in the shape of a regular octagonal pillar. The support body 211 is intermittently rotated in a rotation direction of 45 degrees in a direction of 2111a. The patterning of the metal thin film is performed by a patterning material imparting device 220, 230 by an oil-type patterning method. The fine holes 222 of the first patterning material applying device 220 face the outer peripheral surface of the support body 211, and are formed plurally at a predetermined interval along the vertical direction of the paper surface (the width direction of the outer peripheral surface of the support body 211). When the rotation of the support body 211 is stopped, the patterned material vaporized in the device is released from the micro holes 222, and at the same time, the patterned material is given to the device 220 to move in the direction of the movement direction 224. As a result, a liquid film of a plurality of band-shaped patterned materials is formed on the outer peripheral surface of the support 211 in parallel with the moving direction of the outer peripheral surface. Thereafter, by rotating the support body 211 by 45 degrees, the outer peripheral surface of the support body 211 to which the patterning material has been applied via the first patterning material applying device 220 is opposed to the second patterning material applying device 230. The minute holes 232 of the second patterning material applying device 230 face the outer peripheral surface of the support body 211, and are formed plurally at predetermined intervals along the moving direction of the outer peripheral surface of the support body 211. When the rotation of the support body 211 is stopped, the Chinese national standard (CNS) A4 specification (210 X 297 male f 'is applied to 51 paper sizes (please read the precautions on the back before filling this page)--I n ϋ I nnnnn III ϋ n I ϋ n ϋ I nn 1 II— I n I n ϋ ϋ 505933 A7 B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (θ) The patterned material vaporized in the device is made of micropores. 232 is released, and at the same time, the patterning material imparting device 230 is moved in a direction perpendicular to the paper surface (the width direction of the outer peripheral surface of the support body 211). As a result, a plurality of bands are formed along the width of the support body on the outer peripheral surface of the support body 211. The liquid film of the patterned material in the shape of a support. As for the outer peripheral surface of the liquid film of the support 211 that forms a substantially lattice-like pattern by the first and second patterning material applying devices 220 and 230, the support 211 is further rotated by 45 degrees. Opposite the metal thin film forming device 114, a metal thin film patterned into a substantially rectangular shape can be formed. Thereafter, the surface on which the metal thin film is formed is opposed to the resin thin film forming device 240. There are 240 resin thin film forming devices Inclined heating plates 243a, 243b. The liquid resin film material 241 drips onto the heating plate 243a through the supply tube 242, and is evaporated while flowing along the heating plates 243a, 243b. In addition, the unevaporated resin film material The system is recovered to the tray 244. The evaporated resin film material passes between the shielding plates 245a * and the shielding plates 245b, 245c- and adheres to the outer peripheral surface of the support 211 to form a resin film. As described above, by letting the positive 8 The angular pillar-shaped support 211 rotates intermittently at 45 degrees in the rotation direction 21a, and can form an interactive laminate of a metal film and a resin film with a rectangular pattern on the outer periphery of the support 211. In this embodiment, too, Similarly, two types of metal films with a predetermined amount of grid pattern staggered are alternately laminated through a resin film to obtain a laminated body for a capacitor. In order to shift the grid pattern of the metal film, for example, the first 1 Patterned material imparting device 220 or 2nd pattern 52 (Please read the precautions on the back before filling in this page) · Order-丨 线 丨 #! This paper size applies to Chinese national standards ( CNS) A4 specification (21〇X 297 public love) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs Employee Co-operative Society 505933 A7 ____ B7 V. Description of the invention (h) The chemical material giving device 230 goes perpendicular to the support body 211 every time the support 211 rotates The movement in the moving direction can be realized by a wide amount of movement. Although not shown in FIG. 14, the above device is housed in a vacuum device that maintains a predetermined vacuum degree. Alternatively, it can also be shown in FIGS. 8, 12, and 13 The patterning material removing device 117, the resin hardening device 118, the surface treatment device 119, the shielding plate 123, and the plasma irradiation device 127 are arranged so as to face the outer peripheral surface of the support 211. After the laminated body is formed and the laminated body is laminated on the outer peripheral surface of the support body 211, a laser processing device 125 is used to form a through-hole through the entire laminated body at a predetermined position in the same manner as in Embodiment B-1. Or, in the interactive lamination process, whenever the rotation of the support body 211 is stopped, the laser processing device 125 is used to form a through hole for the resin film and the metal film at a predetermined position of the new laminate in the same manner as in Embodiment B-2. After the cross-lamination process is completed, the laminated body is peeled from the support 211 to fill the through hole 塡 with a conductive material. After that, cutting is performed at a predetermined position to obtain a laminated body shown in Embodiments A-1 (Fig. 1A to Fig. IE) and A-4 (Fig. 5A to Fig. 5E), and Embodiment A-3 (Fig. The capacitor array shown in 4A) (capacitor element 36 is an embodiment of the capacitor of embodiment A-1). In addition, the laser processing device 125 capable of removing only the resin film is used. In the alternate lamination process, whenever the rotation of the support body 211 is stopped, it is the same as in the embodiment B-3. The resin film forms a through hole. Thereafter, the laminated body is peeled off from the support body 211 and cut at a predetermined position to obtain the laminated bodies shown in Embodiments A-2 (Figs. 3A to 3E) and A-5 (Figs. 7A to 7E). In addition, in the area shape where no metal thin film is formed, this paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the precautions on the back before filling this page). 505933 A7 V. Description of the invention (/, Cheng = the second through hole for the through electrode, filled with conductive material, and then the capacitor column shown in Embodiment A-3 (Figure 4A) can be obtained. The benefit element 36 is the actual state of the capacitor of the embodiment A-2). ^ In the example of FIG. 14, the grid-like patterning of the metal thin film is performed by using the t-th and the second-patterned patterning material imparting device 22,23. The oil patterning method is performed, but the present invention is not limited to this. For example, instead of the second and second patterning material providing devices 22, 23, the laser shown in Embodiment B-4 may be used instead The laser patterning method of the patterning device is used to pattern the metal thin film. Or, one of the first and second patterning materials is applied to the device 22, 23, and the laser patterning device is replaced with the laser patterning device. In the embodiment B__5, both the oil patterning method and the laser patterning method are used in combination. The metal thin film is patterned. In addition, the support 211 is not limited to the shape of a regular 8-corner post, a regular 6-corner post, a regular 10-corner post, and the like. As described above, according to this embodiment, due to the laminated system Each of the outer peripheral surfaces of the support 211 is formed into a flat plate shape. Compared with the case of using a roll-shaped support body, the pressing process of the flat plate after the support body 211 is peeled off can be omitted or simplified. Furthermore, it can be prevented from being formed on the flat plate. Cracking of the laminated body, cracking of the metal film, etc., which occurs during the pressing process, improves the yield. (Embodiment B-7) This embodiment B-7 'uses a flat-shaped support of a predetermined size as a support system. A resin film and a metal film are formed under the support while continuously carrying a plurality of the supports. Specifically, a conveying path is formed for a plurality of supports to circulate. 54 This paper standard is in accordance with China National Standard (CNS) A4 (210 X 297 mm) (Please read the notes on the back before filling out this page)

-«N ϋ ϋ n ϋ nn a-0 * · I nnnnn ϋ ϋ I nn -ϋ nn ϋ n · ϋ n ϋ ϋ nnn ϋ nnnn ϋ ϋ ϋ I 505933 Printed by the Consumers’ Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs A7- --§1-^-V. Description of the invention (β) A resin thin film forming device and a metal thin film forming device are arranged on the way. Once the support passes through the resin film forming device and the metal film forming device, the resin film and the metal film are formed under the support, respectively. In the case of patterning a metal thin film by an oil patterning method, the support is structured by applying a patterning material to the device after passing through the resin film forming device and before reaching the metal film forming device. In the case of patterning a metal thin film using a laser patterning method, the support is configured to pass through the laser patterning device after passing through the metal film forming device and before reaching the film forming device. In addition, when forming the through hole, a laser processing device may be installed in the roving path of the support body according to the configuration of the facing film according to the processing configuration B-1 to B-6. In the above manner, an interlayer of a metal film and a resin film patterned on a support can be obtained. After that, the through-holes are filled with a conductive material according to the required properties, and then cut to obtain the multilayer body of Embodiment A-1, A-2, A-4, A-5 or the capacitor of Embodiment A-3. In the present invention, the patterning method of the metal thin film is not limited to the above example. For example, if an oil patterning method is used, the patterning material applying device 540 described in Embodiment C-2 described later can be used. . << Example >> (Example I-1) «Describes that the multilayer device and chip capacitor shown in Embodiment A-1 (Figure 1A to Figure 1E) are manufactured using the manufacturing apparatus shown in Embodiment B-1 (Figure 8). 55 This paper size is in accordance with China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) 丨 Order i line 丨-505933 A7 ____B7 V. Description of the invention (bait The vacuum tank 116 is used to draw the inside of the vacuum tank ι15 to 2 × l (T2Pa, and the outer peripheral surface of the container roller 111 is cooled to 10 ° C. The diameter of the container roller 111 is 500 mm, and the moving speed of the outer peripheral surface is 100 m. As the tree film material, dicyclopentadiene dimethanol diacrylate is used. As the metal film material, aluminum is used, which is formed by vapor deposition. As the patterning material, a fluorine-based oil agent is used. Before lamination, firstly spray a fluorine-based mold release agent (Daikin Industries ("Daifuri") manufactured by Daikin Industries (Stock Co., Ltd.)) on the outer surface of the container roll, and then extend it thinly with a non-woven fabric. Protective film. The above resin film The gasification of the material is accumulated on the outer peripheral surface of the container roller Π1 by the resin film forming device 112. The thickness of each layer is 0.6. Then, a UV curing device is used as the resin curing device 118, and the above-mentioned stacked resin film material is applied. Polymerize to harden to a hardening degree of 70%. This operation is repeated by rotating the container roll 111, and a protective layer with a thickness of 15 // m is formed on the outer peripheral surface of the container roll 111. During this period, the opening 121 is shielded It is covered by the board 123. Secondly, the laminated layer is used as the element layer of the capacitor capacity generating portion. The above resin film material is used so that the laminated thickness of each layer is 0.1 / zm. Then, the resin hardening device 118 is used to make the resin film hardening degree 70%. After that, the surface is subjected to oxygen plasma treatment by the surface treatment device 119. Then, the vapor of the patterning material is emitted from the fine holes of the patterning material applying device 130a, 130b. The patterning material applying device 56 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) Printed by 5JI H ϋ 1 «n IIIII ϋ nnnnnn ϋ ϋ n ϋ I nn I- ϋ ϋ l 505933 A7 B7 5. Description of the invention (π) 130a, 130b are roughly the same as the container The speed of the moving speed of the outer peripheral surface of the roller ill is reciprocated, and a grid-shaped liquid film pattern obtained from the patterned material is formed on the resin film surface of the outer peripheral surface of the container roller 111. Next, aluminum is formed from the metal thin film forming device 114. Metal evaporation. The thickness of the laminate was 30 nm. Thereafter, V performs far-infrared heating and plasma discharge treatment with a patterned material removing device 117 to remove the remaining patterned material. The position of the grid-like pattern formed by the patterning material is changed each time the container roll 111 rotates, and two types of metal films having different grid-like pattern positions are alternately laminated through a resin film. The above operation is performed by rotating the container roll 111 about 3000 times to form an element layer having a total thickness of 390 / Z m. After that, the opening 121 is closed, and the protective layer is laminated in the same manner as in forming the protective layer. After the formation of the protective layer is completed, the resin film forming apparatus is stopped, and while the container roll 111 is rotated, a laser processing apparatus 125 is used to form a through hole penetrating the entire laminated body at a predetermined position. As the laser processing device 125, a C02 (output 20W) laser was used. At this time, the plasma irradiation device 127 performs an oxygen plasma treatment on the formed through-holes. Next, the laminated body was peeled from the container roll 111, and the plate was pressurized, and a conductive resin was filled in the through hole to obtain a laminated body mother element. Thereafter, cutting is performed at a position (edge portion) where the metal thin film is not to be cut, to obtain a laminated body shown in FIGS. 1A to 1E. The dimensions of the obtained laminated body were 0.5 mm in length, LOmm in width, 0.42 mm in thickness (height in the lamination direction), and the diameter of the through hole was 0.2 mm. In addition, 57 paper sizes are applicable to the Chinese National Standard (CNS) A4 specification (21 × 297 mm) (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs — 1 inn -nnn-δ, · IM · a ·· · ϋ nnnnnn «ϋ nn ϋ n Hi n flu n — &gt; inn in nn I— 505933 A7 B7 V. Description of the invention (Η) is the opposite of the metal film acting as a capacitor The area of the area was 0.4 mm in length and 0.3 mm in width. An electrode terminal was formed on the surface of a conductive resin in a pair of through-holes, and the characteristics as a capacitor were evaluated. As a result, the capacity was 40 nF. (Example. I-12) Except for the pedicle Except for the variation in the grid pattern of the resin film above and below the metal film, the rest is the same as in Example 1-1 to obtain a laminated body element. Then, the position of the cut surface of Example 1-1 is changed to obtain The laminated body shown in Embodiment A-4 (FIG. 5A to FIG. 5E). The obtained laminated body has an outer dimension of 0.5 mm in length, 1.0 mm in width, and a thickness (height in the direction of the lamination) of 0.42 mm. The radius of the notch is 0.1mm. The area of the facing area of the metal thin film acting as a capacitor is 0.4 mm in length × 0.65 mm in width. An electrode terminal was formed on the surface of the conductive resin in the notch of the pair, and the characteristics as a capacitor were evaluated, and the capacity was 87 nF. The capacitor of this example Compared with the capacitor of Example 1.21, although the capacitors are approximately the same size, the area of the facing area of the metal thin film can be increased, so that the capacity can be increased. In the first invention, the above embodiments are merely at best For example, the present invention is not limited to the above-mentioned embodiments. For example, the number of layers of the multilayer body may be appropriately determined according to the application of the multilayer body, the required specifications (such as the capacitance required when used in a capacitor), and the like. The number of laminated layers calculated from the thickness of one layer and the total thickness described in the example is just one example. However, from the viewpoint of the use of the formed laminated body, extremely thin laminated bodies are prone to cracks, etc. According to the review made by the inventors Generally, as long as the thickness of the laminated body is more than 100 / zm, cracks will not occur, etc., but the 58 scale below 20 // m applies the Chinese national standard. (CNS) A4 specifications (210 X 297 mm Γ '(Please read the precautions on the back before filling this page) Order · 丨 线 丨 #! Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives 505933 Intellectual Property Bureau of the Ministry of Economic Affairs Printed by employees' consumer cooperatives A7 B7 V. The description of the invention (θ) requires special attention in use. Therefore, if the upper limit of the total thickness of one layer of resin film and one layer of metal film is, the number of layers of resin film is More than 20 layers is the actual lower limit of the number of layers of the laminated body. It is more preferable that the number of laminated resin films is 100 or more. On the other hand, the upper limit of the laminate is less limited than the lower limit 値. Among them, in a high-density assembled circuit board, since the height of parts is higher than that of a semiconductor wafer, electronic parts having a thickness of 1 mm or more become fewer. If the total thickness of a layer of a resin film and a layer of a metal film is lower than .0.1 / zm, the number of laminated layers of the resin film is 10,000 or less, which becomes the standard for the upper limit of the number of laminated layers. [About the Πth invention] The method for manufacturing a laminated body according to the Πth invention is characterized in that a laminated body (containing a resin film and a thin metal sheet divided into a substantially rectangular shape) is formed on a support. The specific method is described below with reference to the drawings. (Embodiment C-1) Fig. 15 is a schematic cross-sectional view showing an example of a manufacturing apparatus for a laminated body used for carrying out a method for manufacturing a laminated body related to Embodiment C-1 of the present invention. In FIG. 15, 500 is a manufacturing device of the laminated body of this embodiment, 515 is a vacuum tank, 516 is a vacuum pump for maintaining the inside of the vacuum tank 515 at a predetermined vacuum degree, and 511 is installed in the vacuum tank 515. A cylindrical container roller rotating in the direction of the arrow in the figure, a 512 series resin film forming device, a 513 series patterning material imparting device, and a 514 series golden phoenix film formation 59 This paper size applies to China National Standard (CNS) A4 specifications ( 210 X 297 public love) (Please read the precautions on the back before filling out this page) -11! 1111 ^ · 11111111 — — — — — — — — — — II — — — — — — — — 505933 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Inventive (technical) device (metal material supply source), 517 series patterned material removal device, 518 series resin hardening device, 519 series surface treatment device, and 52 series A partition wall that separates the metal film forming area from other areas. 521 is provided in the opening of the partition wall 520, and 523 is in the moving direction 523a in order to prevent the formation of the metal thin film unless necessary. The shielding plate used for moving to close the opening 521, 530 is a laser light irradiation device that radiates laser light toward the outer peripheral surface of the container roller 511, and 531 is laser light emitted from the laser light irradiation device. The formation of the divided thin metal film ′ can be realized by the patterning material applying device 513, the metal thin film forming device 514, and the laser light irradiation device 530. The patterning material applying device 513 ejects the heated and vaporized patterning material from the fine holes opened toward the container roller 511, and a band-shaped liquid film is adhered to the surface of the resin film on the container roller 511. The portion where the patterning material is adhered does not form a metal thin film, and becomes the first non-metallic strip X edge portion). The arrangement (interval, number) of the fine holes in the rotation axis direction of the container roller 511 is determined according to the arrangement of the non-metallic belt to be formed. The width of the non-metallic belt is adjusted by changing the size of the micropores and the amount of air jets. At this time, 'in synchronization with the rotation of the container roller 511, the patterning material imparting device 513 is moved in a direction parallel to the rotation axis of the container roller 511, and a metal thin film different from the formation position of the non-metallic belt / can be formed. In addition, as a method of applying a patterning material, in addition to the above-mentioned methods, although there is a method of directly applying by reverse coating or die coating # coating, this method is applied to a resin film. The surface is given an external force. In order to prevent the resin film and the metal film from being deformed, cracked, and the surface is rough. This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 male i). (Please read the precautions on the back first. (Fill in this page) .. · Order · One-line 丨 engine 丨 505933 A7 B7 5. Description of the invention (pair) Roughness, etc., it is better to use non-contact method of giving. The patterning material used is preferably an oil agent selected from the group consisting of an vinegar-based oil agent, a glycol-based oil agent, a fluorine-based oil agent, and a hydrocarbon-based oil agent. More preferred are ester-based oil agents, glycol-based oil agents, and fluorine-based oil agents, and particularly preferred are fluorinated oil agents. When patterning materials other than the above are used, problems such as rough surface of the laminate, pinholes of the resin film and the metal film, and instability of the boundary portion of the metal film may occur. After the patterning material is applied, a metal thin film is formed by a metal thin film forming device 514. As a method for forming a metal thin film, a known vacuum process method such as vapor deposition, sputtering, and ion implantation can be used. In the present invention, from the viewpoint of obtaining a film having excellent moisture resistance with high productivity, vapor deposition is adopted. Plating, especially electron beam evaporation is preferred. As the material of the metal film, you can use Ming, copper, zinc, town, iron, Ming, sand, marry or these compounds, or their oxides, or their compounds, etc .: From the standpoint of adhesiveness and economy, aluminum is preferred. In addition, the metal thin film may contain other components than those described above. In addition, the metal thin film may not be limited to one type. For example, the A1 layer and the Cu layer may be mixed to enhance the characteristics, and high performance may be achieved depending on the use conditions. The thickness of the metal thin film is appropriately determined / determined according to the use of the obtained laminated body. When used for electronic parts, the thickness is 100 nm or less, preferably 10 to 50 nm, and more preferably 20 to 40 nm. The upper limit of the film resistance is preferably 20 Ω / □ or less, more preferably 15 Ω / □ or less, more preferably 10 Ω / □ or less, and the lower limit is preferably 1 Ω / □ or more, more preferably 2 Ω / □ or more, and more preferably 3Ω / 〇 or more. 61 This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the notes on the back before filling out this page) Printed by the Employees ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

ϋ nn nnnnn ^ tfJ · nn an n I 1 &gt; ^ 1 I 1 · ϋ nnn ϋ ϋ nn ϋ ϋ · -1 nnn ϋ nn -ϋ ϋ I 505933 A7 ___ B7 V. Description of the invention (p) The patterning material applying device 513 imparts a strip-shaped patterned material to the moving direction of the outer peripheral surface of the container roller 511. The position where the patterned material is provided does not form a metal thin film, but forms a partially vacant strip-shaped metal thin film. The laser light emitting device 530 removes the formed metal film by heating and evaporating the laser light. The laser light used is selected based on the material of the metal thin film to be removed. Generally, laser light with a short wavelength such as YAG (Yttrium Aluminum Garnet) laser is preferred. Long-wavelength laser light is reflected on the surface of the metal thin film. In addition, if the resin film is irradiated, the resin film will burn and disappear. The trajectory of the laser light is formed in parallel with the first non-metallic belt (the patterning material applying device 513 is formed parallel to the moving direction of the outer peripheral surface of the container roller 511). ) Irradiation is performed by scanning at a substantially right angle. That is, since the metal thin film is moved by the rotation of the container roller 511, scanning is performed obliquely with respect to the moving direction and irradiation is performed. Moving direction and scanning direction of the metal film • The angle formed is determined by the moving speed of the metal film formed on the outermost surface of the container roller 511. The non-metallic band formed by the irradiation of laser light is more reliable in insulation properties than the non-metallic band formed by the imparting of a patterned material, and a non-metallic band with obvious junctions can be obtained. In addition, since it is formed without contacting the laminated body, no external force is applied to the laminated body, and it is possible to prevent the resin film and the metal film from being deformed, cracked, and roughened. The width of the non-metallic strip can be adjusted by the output and scanning of the laser light source. 62 The paper size is applicable to the Chinese National Standard (CNS) A4 (210 X 297 public love) (Please read the precautions on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economics-0 n an nnnnn ^ eJa ni ϋ ϋ ϋ ϋ ϋ ϋ I 1 nnnn 1 n Cooperative prints 505933 A7 B7 V. Description of Invention (w) method to change. In the above manner, the first non-metallic belt formed by the patterning material applying device 513 (parallel to the moving direction of the outer peripheral surface of the container roller 511), and the second non-metallic belt formed by the laser light irradiation device 530 (At a substantially right angle to the direction of movement of the outer periphery of the container roller 511) The metal thin film can be divided into a substantially rectangular shape (square or rectangular).

Next, configurations other than the above in the manufacturing apparatus of FIG. 15 will be described. The inside of the vacuum tank 515 is maintained at a predetermined vacuum degree by the vacuum pump 16. The preferred vacuum degree in the vacuum tank 515 is about 0.027Pa (2Xl0_4Tοιτ). In addition, it is desirable to maintain the space containing the metal thin film forming device 514 separated by the partition wall 520 to be slightly lower than other spaces. This prevents the metal vapor flow or metal particle flow from the metal thin film forming device 514 from inadvertently leaking into a space other than the space containing the metal thin film forming device 514. The outer peripheral surface of the .V container roller 511 is processed into a smooth shape, preferably a mirror shape, and is preferably cooled to -20 to 40 ° C (particularly -10 to 10 ° C). The rotation speed and degree can be freely set, usually about 15 to 100 rpm, and the peripheral speed is preferably 20 to 30,000 m / min. The resin film forming device 512 is a device for vaporizing or atomizing the resin material forming the resin film, and faces the container roller 511 The surface is released. The resin material is adhered to the outer peripheral surface of the container roll 511 to form a resin film. According to this method, an extremely thin and uniform resin film having no disadvantages such as pinholes can be obtained. As the resin material, there is no particular limitation as long as it can be formed into a thin film by evaporation, vaporization, or atomization in the manner described above, and it is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 cm) according to the 63 layers of the obtained laminate. ) (Please read the notes on the back before filling this page)

-· -IH ϋ n ϋ nnn 1 nnn ϋ 1 II ϋ nn ϋ n! Ϋ ϋ nnnn ϋ nnn ϋ n 1 · II Printed by the Intellectual Property Bureau Staff Consumer Cooperatives of the Ministry of Economic Affairs 505933 A7 B7 V. Description of the Invention (Stone &gt;) The use of the polymer is appropriately selected, and a reactive monomer resin is preferred. For example, in the case of electronic component materials, it is better to use acrylate resin or vinyl resin as the main component. Specifically, polyfunctional (meth) acrylate monomers and polyfunctional vinyl ester monomers are used. Among them, cyclopentadiene dimethanol dipropenyl ester, cyclohexane dimethanol divinyl ether monomer, or the monomer formed by replacing these hydrocarbon groups, from electrical characteristics, heat resistance, stability, etc. From the point of view, it is the hope. As a means for scattering the resin material, a heating means such as a heater, a method of vaporization or atomization by a super wave or a sprayer can be used. In particular, from the viewpoints of the thickness and uniformity of the formed resin film, prevention of defects, and simplification of the device, a method of evaporating and vaporizing the resin material by heating means such as a heater is desirable. The accumulated resin material may be hardened by a resin hardening device 518 as necessary to achieve a desired degree of hardening. As for the hardening treatment, a treatment for polymerizing and / or crosslinking the resin material may be mentioned. As the resin curing device ', for example, an electron beam irradiation device, an ultraviolet irradiation device, or a thermosetting device can be used. The degree of hardening treatment can be appropriately changed according to the characteristics of the laminated body to be manufactured. For example, the laminated body used for the manufacture of electronic parts such as capacitors, etc .: The hardening treatment is preferably performed so that the degree of hardening reaches 50 to 95%. % Is better. If the degree of hardening is lower than the above range, once external force is applied in the subsequent process, it is easy to deform, and cracks or short circuits of the metal film may occur. On the other hand, if the degree of hardening exceeds the above range, cracks and the like may occur when an external force is applied in a subsequent process. In addition, the definition of the degree of hardening in the present invention is based on the infrared spectrophotometer to obtain the absorption of 64 bases. This standard is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) &quot; --- ( Please read the notes on the back before filling this page) -nnn an ϋ nn 1: 0 * · I nn ϋ n ϋ ϋ ϋ I h ϋ nn ϋ n ϋ II ϋ ϋ n ϋ n 505933 A7 B7 V. Description of the invention ( e) The ratio of luminosity to C = C group (MOOOcnT1), to obtain the ratio 各个 of each monomer to the hardened material, and subtract 1 to decrease the absorbance. In the present invention, the thickness of the resin film is not particularly limited, and is preferably 1 / zm or less, more preferably 0.7 / m or less, and more preferably 0.4 / zm or less. In order to meet the requirements of miniaturization and high performance of the laminated body obtained by the method of the present invention, the thickness of the resin film is preferably thin. For example, when the laminated body obtained by the manufacturing method of the present invention is used for a capacitor, the thinner the resin film that becomes the dielectric layer, the larger the capacitance of the capacitor. The formed resin film can be subjected to surface treatment by a surface treatment device 519 as necessary. For example, discharge treatment or ultraviolet irradiation treatment in an oxygen atmosphere can activate the surface of a resin film to improve adhesion to a metal film. On the resin film thus formed, a metal film is formed by the above-mentioned method. After that, it is desirable to remove the remaining patterned material before laminating the resin film. Residual patterned materials may cause problems such as rough surface of the laminated layer, pinholes of the resin film and metal film (laminated layer is loose), and instability of the boundary portion of the metal film. The patterning material is removed by a patterning material removing device 517. As the patterning material, there is no particular limitation on the removal method, as long as it is appropriately selected according to the type of the patterning material, and it can be removed by heating and / or decomposition, for example. Examples of the method of heating removal include a method of irradiating with light or an electric heater. The method of irradiating with light is simple on a device and has high removal performance. The light referred to here includes far infrared rays and infrared rays. On the other hand, as a method of decomposition and removal, plasma irradiation and ion irradiation can be used. This paper size is applicable to Chinese National Standard (CNS) A4 (210 X 297 mm). (Please read the precautions on the back before filling this page. ) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs I «I nnn _1 nn a δτ I n I n BB1 I * ϋ ϋ I n ϋ ϋ in n 1— n · nn ϋ ^ 1 · nn HI ϋ ϋ-^ 1 nn 505933 A7 B7 V. Description of invention (妗), electron irradiation, etc. At this time, the plasma irradiation may use oxygen plasma, argon plasma, nitrogen plasma, etc. Among them, oxygen plasma is preferred. The configuration of the patterned material removing device 517 and the laser light irradiation device 530 may be as shown in FIG. 15. The patterning material removing device 517 is disposed on the upstream side, and the laser light irradiation device 530 may be disposed on the upstream side. According to the above device, when the opening 521 is opened, the resin film formed by the resin film forming device 512 and the metal formed by the metal film forming device 514 are alternately laminated on the outer peripheral surface of the rotating container roller 511. Laminated film is manufactured, and when the opening 521 is closed and closed, the resin film formed by the resin film forming device 512 is continuously laminated on the outer peripheral surface of the rotating container roller 511 to produce Out of the laminated body. Next, the method for manufacturing the chip capacitor 610 shown in FIG. 17 after obtaining the multilayer body mother component 600 shown in FIGS. 16A to Γ6E using the above device will be described (the details of FIGS. 16A to 16D and FIG. 17 will be described later) Description). While rotating the container roll 511, the layer 604a, the layer 603a, the layer 602, the layer 603b, and the layer 604b are successively laminated on the container roll 511 in this order. The layer 604a is initially layered. The layer 604a is a layer (protective layer) obtained by continuously laminating only a resin film. Although the protective layer 604a cannot provide the capacity as a capacitor, it effectively functions to prevent damage to the layer (element layer) 602 due to the heat load or external force. When the protective layer 604a is laminated, the shielding sheet 523 is used to cover 66 sheets of paper. The Chinese standard (CNS) A4 specification (21 × 297 mm) is applicable. (Please read the precautions on the back before filling this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs-IIIIIII «ΙΙΙΙΙΙΙΙ — — — ΙΙΙΙΙΙΙΙΙΙΙΙΙΙΙΙΙΙΙΙ1Ι. 505933 A7 B7 V. Description of the invention (w) The opening 521, in this state, rotates the container roller 5u to allow the resin film to continuously build up a predetermined number . Next, a layer 603a is laminated. The layer 603a is a layer (reinforcing layer) obtained by laminating a resin film and a metal film alternately. The reinforcing layer 603a functions effectively to prevent damage to the layer C element layer) 602 due to heat load or external force. In addition, the presence of a metal thin film connected to the external electrode can also contribute to the improvement of the adhesion strength of the external electrode. In the build-up of the reinforcing layer 603a, a self-patterning material applying device 513 applies a band-shaped patterning material to the surface of the resin film. Further, the moving shield plate 523 opens the opening 521, and a metal thin film is laminated. In this case, the metal thin film is formed by dividing a first non-metallic belt provided with a patterned material in a band shape into a band shape. Next, the laser beam is irradiated while scanning the laser beam from the laser beam irradiation device 530 to form a second non-metallic band. In this poem, the scanning direction of the laser light is scanned at a substantially right angle with respect to the first non-metallic belt system. In this state, 1 the container roller 511 is rotated a predetermined number of times to form a layer 603a obtained by dividing and laminating an approximately rectangular metal film and a resin film. Next, a layer 602 is laminated. The layer 602 is a layer (element layer) of a capacitor film generating part of a resin film and a metal film. In the stack of the element layer 602, each time the container roller 511 rotates, the patterning material applying device 513 is caused to reciprocate a predetermined width in the direction of the rotation axis of the container roller 511. In this way, it is possible to form a metal thin film in which the position of the first non-metallic belt is different for each adjacent layer. The formation of the second non-metallic band by the laser light irradiation device 530 is the same as that of the above-mentioned reinforcing layer 603a. 67 This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the note on the back first) Please fill in this page for further information). · Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs: ° JI n 1 I nn ϋ ϋ I ϋ n ϋ 1 nn ϋ ϋ n ϋ n I n ϋ ϋ ϋ ϋ ϋ n ϋ n ' 505933 A7 B7 5. Description of the invention (M). Next, the reinforcement layer 603b is laminated. The patterning material applying device 513 is fixed at the same position as when the reinforcing layer 603a is laminated, and laminated with a predetermined number of layers under the same conditions as those used when the reinforcing layer 603a is laminated. Λ Finally, a protective layer 604 is laminated. At this time ', the shielding plate 523 is moved to cover the opening 521. The application of the patterning material and the irradiation of the laser light are stopped. In this state, the container roller 5Ϊ1 is rotated to continuously laminate only a predetermined number of resin films. In the above, in the case where the laser beam is irradiated to form the second non-metallic belt, the scanning of the laser light is synchronized with the rotation of the container roller 511, so that the position of the second non-metallic belt in the lamination direction is substantially uniform throughout the laminated body. As expected. With this configuration, the laminated body is cut along the second non-metallic tape from the laminated direction, so that the metal thin film is not cut, and the metal thin film is not exposed on the cut surface. As a result, a cylindrical multilayer body composed of a resin film and a metal film divided into a substantially rectangular shape on the outer peripheral surface of the container roll 511 can be obtained. Next, the laminated body is cut in a radial direction to be divided, and taken out from the container roll 511. The cutting at this time is performed on the second non-metallic belt. Since there is no metal film in this part, cutting is easy, and no burrs or chipping of the metal film occurs. Also, no metal thin film was exposed on the cut surface. The laminated body taken out is divided into a flat plate and pressed to obtain, for example, a laminated body mother element 600 shown in FIGS. 16A to 16D. Figure 16A is a front view of the multilayer mother component viewed from the direction of the cut surface, Figure 16B is a top view, and Figure 16C is 68 (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs— · !!!! Order ------! Line-· ---------------------- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 505933 A7 B7 V. Invention Explanation (M) is a cross-sectional view seen from the direction of the arrow along the line I-I in FIG. 16A, and FIG. 16D is a cross-sectional view seen from the direction of the arrow along line Π-Π of FIG. 16A. In FIGS. 16A to 16D, the arrow 601 corresponds to the traveling direction of the outer peripheral surface of the container roller 511. Further, 605 is a cut surface when the cylindrical laminated body is divided, 606 Tan metal film, 607 resin film, 608a is a first non-metallic belt, and 608b is a second non-metallic belt. Figs. 16A to 16D show the laminated states in an easy-to-understand manner, and the actual number of laminated layers is much more than that. In addition, the thicknesses of the metal thin film 606 and the resin thin film 607, and the widths of the first and second non-metallic strips 608a, 608b are drawn more exaggerated than the actual thing. In FIG. 16A, the protective roller 511 is positioned below the laminated body mother element 600, and the protective layer 604a, the reinforcing layer 603a, the element layer 602, the reinforcing layer 603b, and the protective layer 604b are sequentially laminated from the bottom. As shown above, layer 6 (Ma, 604b is the layer obtained by continuously laminating the resin film only when the opening M1 is closed, and layer 602 and layer 603a, 603b is the layer obtained by alternately laminating the metal film and the resin film when the opening 521 is open. In addition, the layer 602 is synchronized with the rotation of the container roller 911. When the container roller 911 rotates once, the position of the first non-metallic belt 608a is changed and laminated. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (please read the back first) (Notes for filling in this page, please fill in this page again). As can be clearly seen from FIG. 16A to FIG. 16D, in the multilayer mother component of this embodiment, the metal film 606 is not exposed on the cut surface 605. Before the first process, the metal thin film 606 will not be corroded on the cutting surface 605. Oxidation or rusting will occur. _ The multilayer body mother component 600 obtained above is cut from the cutting surface 609a. The cutting surface 609a passes through the first The approximate center of the non-metallic strip 608a. The 69 paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 505933 A7 B7 V. Description of the invention (β) By spraying, it is equal to the cut surface 609a Form external electrodes. ----------- --- (Please read the precautions on the back before filling in this page) Cut at a position corresponding to the cut surface 609b. The cut surface 609b passes through the approximately central portion of the second non-metal strip 608b. There is no metal thin film on the surface 609b, and cutting is easy, and no burr chipping of the metal thin film will occur. Also, the metal thin film will not be exposed on the cut surface. Therefore, the metal thin film 606 does not exist until the next process. Corrosion, such as oxidation or rust, may occur on the cut surface 609b. After that, packaging and coating are performed as needed to obtain most of the chip capacitors 610 shown in FIG. 17. In FIG. 17, 611a and 611b are connected to the metal film. 606 is an external electrode formed by electrical connection. As shown in FIG. 17, the opposite side of the chip capacitor 610 obtained in this embodiment without the external electrodes 611a, 611b (the cut surface 609b described above) has no metal thin film 606. Therefore, even if a special insulating layer is not formed on the cutting surface 609b, the external electrodes 6fla and 611b can be directly soldered to the circuit substrate for surface assembly. Therefore, the assembly process can be simplified and the circuit can be simplified. The miniaturization of the entire board also contributes # • (Implementation Form C-2) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, as shown in FIG. 18, is used to implement the layers related to Embodiment C-2 of the present invention. A schematic cross-sectional view of an example of a manufacturing apparatus. In FIG. 18, parts that are the same as those in FIG. 8 are given the same reference numerals and descriptions thereof are omitted. The manufacturing apparatus 500 'of the laminated body in FIG. The illustrated manufacturing device 500 of FIG. 15 is different in that the patterned material imparting device 513 which replaces the manufacturing device 500 of FIG. 15 is replaced with a patterned northern material and 70. This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 Public love) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 505933 A7 B7 V. Description of the invention (θ) to the device 54 and the laser light irradiation device 530 of the manufacturing device 500 in FIG. 15 is removed. The patterning material imparting device 540 of this embodiment is a mode C-1 in which a liquid-state patterning material is ejected from a fine hole in the form of a droplet. The patterning material imparting device 513 is different. Fig. 19 is a front view of the patterning material applying device 540 as seen from the container roller 511 side. The patterning material applying device 540 is arranged so that the direction of the arrow 601 coincides with the traveling direction of the outer peripheral surface of the container roller 511. On the front side of the patterning material applying device 540, the nozzle head 541 is disposed at a right angle to the arrow 001. Fig. 20 is an enlarged view of a part of the nozzle head of the patterning material applying device of Fig. 19 when viewed from the front. In the figure, the arrow 602 corresponds to the direction of the arrow 601 in FIG. 19. A fine tie 542 is provided on the surface of the nozzle head 541. In the example of FIG. 20, three micro holes 542 are set as a group, which are arranged at a predetermined interval at an angle of approximately 45 ° with the arrow 602. The micro holes are arranged at a predetermined interval in the nozzle head. Established quantity. In addition, these fine holes 542 are arranged so that the projections on the surface perpendicular to the arrow 602 will be equally spaced. f FIG. 21 is a partial cross-sectional view of the fine holes 542 seen from the direction of the arrow on the melons-melons line in FIG. 20. The portion of the bottom plate 543 corresponding to the position of the minute hole 542 is processed into a cylinder 548, and the piezoelectric element 544 and the piston head 545 are sequentially inserted into the cylinder 548. An orifice plate 546 71 is arranged in front of the bottom plate 543. This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 χ 297 mm) (Please read the precautions on the back before filling this page)

Φ -------- Order-I line 丨 · 505933 Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 ___ V. Description of the Invention (V), the pattern between them is filled with liquid. Material 547. The diameter of the micropores 542 can be appropriately designed to be, for example, about 70 // m. The spraying of the patterned material in a liquid state from the micropores 542 is performed in the following manner. By virtue of the piezoelectric effect of the piezoelectric element 544, the piezoelectric element 544A 'is retracted so that the piston head 545 moves backward in the left direction in the figure. As a result, the front face of the piston head 545 becomes negative pressure, and the patterning material 547 is sucked into the cylinder 548 of the bottom plate. After that, the piezoelectric element is returned to the original state, and the patterned material accumulated in the cylinder 548 is discharged through the micro hole 542. In this mode, the patterned material is discontinuously discharged as a droplet. Therefore, the patterned material is adhered to the adhered surface (the surface of the resin film) by a small dot after a single release. By adjusting the discharge amount (droplet size) and interval of the patterning material once, the patterning material can be attached as a continuous liquid film. According to the above-mentioned patterning material imparting device 540, it is possible to easily control most of the fine holes independently. Therefore, not only the belt-shaped patterned material can be imparted to the patterned material applying device 513 of Embodiment C-1, but also a checkerboard-shaped (lattice) patterned material. Therefore, in this embodiment, the patterned material imparting device 540 can be used to provide a belt-shaped patterned material in the traveling direction of the outer peripheral surface of the container roller 511, and the belt-shaped patterned material can be provided at a predetermined interval in the opposite orthogonal direction. Patterned material. Thereafter, as long as the metal thin film 'is formed by the metal thin film forming device 514 and the portion of the patterned material provided with a checkerboard shape becomes a non-metallic strip, the metal thin film is divided into a substantially rectangular shape. Therefore, in this embodiment, it is not necessary to implement the laser light irradiation device 530 of the mode C-1. 72 This standard is applicable to China National Standard (CNS) A4 (210 X 297 mm) &quot; (Please read the precautions on the back before filling in this page) ·· δ, I n HI ϋ 1 nn 11 II HI n 1 nmnn I n in I n ϋ — n in nmm II nm. 505933 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (V) At this time, the same as the implementation form C-1, let The patterned material, which is provided in a band shape, which is substantially orthogonal to the traveling direction of the outer peripheral surface of the container roller 511, moves in synchronization with the rotation of the container roller 511, so that the position of the second non-metallic belt in the laminated direction is horizontal It is desirable to maintain a general consistency across the stratified body. According to the patterning material applying device 540, the same can be done as when the element layer 602 of Embodiment C-1 is laminated, even if the patterning material applying device 540 is not allowed to move back and forth on the rotation axis side of the container roller 511, The micropores of the patterned material can be changed to change the position of the first non-metallic belt. Furthermore, compared with the embodiment C-1 in which the vaporized patterned material is released and liquefied on the adhered surface, the released The patterning material has a sharper directivity, and the patterning material can be easily and accurately attached as expected. Furthermore, since the distance between the micro-pores and the surface to be attached can be increased (for example, left to right), the degree of freedom in device design is improved. Although the patterning material with a better shape in this embodiment can be appropriately selected in consideration of the viscosity under the use environment, etc., basically, the patterning material described in § 1-1 of the embodiment C can be directly used. In this embodiment, as in Embodiment C-1, a chip capacitor shown in FIG. 17 can be manufactured. The formation of the first and second non-metallic belts is not limited to the method of the above embodiment C- ^ C-2. For example, after forming a continuous metal thin film, the first and second non-metallic strips may be formed by irradiation with laser light. Or set up a patterned material imparting device with slit-shaped openings (applicable to the Chinese paper standard (CNS) A4 size (210 X 297 mm) with 73 paper sizes) (Please read the precautions on the back before (Fill in this page)-· nnnn ϋ nn ^ eJa nn 1 · n ϋ ϋ ϋ I nnnnnnn ϋ · ϋ ϋ ϋ ϋ n ϋ βϋ n ϋ ^ 1 -ϋ · 505933 A7 _B7__ 5. Description of the invention (P) Outside the container roller The direction of movement of the surface is a substantially right angle direction as the long side direction) and a shutter that opens and closes the slit-like opening; the vaporized patterned material is discharged from the slit-like opening to make the second non-metallic strip The patterning material for formation is attached to the surface of the resin film. In the above-mentioned embodiments B-1 to B-7, C-1, and C-2, although a cylindrical container roller or the like is used as a support, the present invention is not limited to this. For example, it may be a belt-shaped support or a disc-shaped support that rotates between two or more rollers. In addition, if a release agent is applied to the support surface before the lamination is started, the operation of removing the lamination body after the lamination is completed becomes easy, which is desirable. As the mold release agent, for example, a fluorine-based mold release agent (e.g., a trade name of "agent", manufactured by Daikin Industries, Ltd.) can be used. In addition to the spraying method, the method of applying the mold release agent may be selected from sputtering method and vapor deposition method, which are suitable for the conditions of the release agent material and the procedure. «Embodiment» (Exemplary Embodiment Π-1) A chip capacitor having a structure shown in Fig. 17 was manufactured using a manufacturing apparatus shown in Fig. 15. The vacuum pump 516 was used to draw the inside of the vacuum tank 515 to 0.027 Pa (2 × 10_4 Torr), and the outer peripheral surface of the container roller 511 was cooled to 5 ° C. The diameter of the container roller 511 is 500 mm, and the moving speed of the outer peripheral surface is 50 m / min. Prior to lamination, a fluorine-based mold release agent (Daikin Industries, Ltd. ("Daifuri") manufactured by Daikin Industries (Limited)) was sprayed on the outer surface of the container roll 511, and then thinly stretched with a non-woven fabric. 74 This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling out this page). · Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperative, Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by Employee Consumer Cooperative 505933 A7 — — _B7__ 5. Description of the Invention (V) First, a protective layer 604 a with only a resin film continuously laminated is laminated. As the material of the protective layer 604a, dicyclopentadiene dimethanol diacrylate is used, and its vaporization is deposited on the outer peripheral surface of the container roll 511 by a resin film forming device 512. The laminated thickness of each layer was 0.6 // m. Next, using ultraviolet curing as the resin curing device 518, the resin film material deposited as described above was polymerized and cured to a curing degree of 70%. This operation is performed repeatedly by rotating the container roller 511, and a protective layer 604a having a thickness of 15 m is formed on the outer peripheral surface of the container roller 511. During this period, the opening 521 is shielded by a shield plate 523. Next, a portion of the reinforcing layer 603a laminated alternately with the resin film and the metal film is laminated. The resin film material of the reinforcing layer 603a is the same as the material of the protective layer 604a described above. The laminated thickness of each resin film was 0.6 # m. Then, the resin hardening device ‘518 was used to harden the resin film to a hardening degree of 70%. After that, the surface is subjected to an oxygen plasma treatment by a surface treatment device 519. Next, the patterned material applying device 513 is used to allow the vaporized patterned material to be ejected from the fine holes and adhere to the surface of the resin film in a band shape. As the patterning material, a fluorine-based oil agent is used. The temperature at which the vapor pressure of this patterned material becomes 0.1 ltoir is 100 ° C. Oil: The average molecular weight of the agent is 1500. The adhesion width of the band-shaped patterned material is 150 // m. Next, the moving shielding plate 523 opens the opening 521. Next, metal metal deposition of aluminum is performed from the metal thin film forming apparatus 514. The thickness of the laminate is 300 angstroms. After that, the patterned material removing device 517 performs far-infrared heating and plasma discharge processing to remove the remaining patterned material. Then 'from the laser light irradiation device 530 to irradiate the laser light to form the .2 non-metal 75 This paper size applies Chinese National Standard (CNS) A4 specifications (210 X 297 mm) (Please read the precautions on the back before filling this page ) One 5J nn ϋ I n .1 ϋ I ϋ ϋ n II n -ϋ nn ϋ ϋ ί · 1 nn ϋ n 1 ϋ ϋ n-505933 A7 B7 V. Description of the invention (70) Band. As the laser light, a YAG laser with an output of 20 W was used. At this time, the scanning trace of the laser light is scanned in a direction substantially at right angles to the first metal strip formed by the patterning material applying device 513. The above operation is performed by rotating the container roller 511 about 500 times to form a layer 603a portion / of a total thickness of 315 / zm, and then stacking a component layer 602 as a capacitor capacity generating portion. The resin film material was the same as described above, and the laminated thickness of each layer was 0.4 / zm. Then, the resin film was hardened by the resin hardening device 518, and the degree of hardening was 70%. After that, the surface is subjected to an oxygen plasma treatment by a surface treatment device 519. Next, the patterning material applying device 513 is used to attach the same patterning material as described above in a band shape with the same width as the above. Next, metal deposition of aluminum is performed from the metal thin film forming apparatus 514. The build-up thickness is 300 angstroms. Thereafter, the remaining patterned material is removed by the patterned material removing device 5II. Next, laser light is radiated from the low-light irradiation device 530 to form a second non-metallic band. At this time, as in the case where the reinforcing layer 603a is laminated, the scanning trajectory of the laser light is scanned in a direction substantially perpendicular to the first metal strip formed by the patterning material applying device 513. The above operation is performed by rotating the container roller 511 about 2000 times to form / layer 602 of a total thickness of 860 // m. During this period, the patterning material applying device 513 is synchronized with the rotation of the container roller 511, and each time the container roller 511 rotates, it moves back and forth 1000 // m in the direction of the rotation axis. Next, the movement of the patterning material applying device 513 is stopped to form a portion of the reinforcing layer 603b having a thickness of 315 // m. The formation method is exactly the same as that of the layer 603a. 76 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) ------------ # (Please read the notes on the back before filling this page) Intellectual Property of the Ministry of Economic Affairs Bureau of the Consumer Cooperatives of the Ministry of Economic Affairs of the People's Republic of China --------- Line --------- 505933 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the Invention (γ) Finally, the thickness is 15 / zm portion of the protective layer 604b. At this time, the shielding plate 523 is moved to cover the opening 521. The formation method from the portion 604b is exactly the same as that of the layer 604a. In the above process, in the stacking of the reinforcing layers 603a, 603b, and the element layer 602, the scanning of the laser light of the laser light irradiating device 530 and the rotation of the container roller 511 are synchronized so that the stacking direction of the second non-metallic belt The positions are approximately the same in the entire laminated body. Next, the cylindrical layered body formed by the soil on the outer surface of the container roll 511 is divided into eight along the second non-metallic belt in the circumferential direction and removed, and then pressed under heating to obtain the locations shown in FIGS. 16A to 16D. The plate-shaped laminated body mother component 600 is shown. At this time, no metal film was exposed on the cut surface 605 at all. This was cut from the cut surface 609a, and then the cut surface was sprayed with brass metal to form an external electrode. Furthermore, a conductive paste (copper, nickel, alloy of sheet metal, etc. is dispersed in a thermosetting phenol resin) is applied to the metal spray-coated surface, followed by heat curing, and the surface of the resin is further coated with molten solder. Thereafter, it is cut from a portion corresponding to the cut surface 609b. At this time, no metal film was exposed on the cut surface • 609b. Thereafter, the surface was coated by dipping in a silane coupling agent solution to obtain a chip capacitor as shown in FIG. The obtained chip capacitor has a thickness of about 1.5 mm in the lamination direction, a depth of 1.6 mm, and a width (in the direction between the two external electrodes) of about 3.2 mm. Although it is a small object, its capacity is 0.33 // F. The withstand voltage is 50V. In addition, the insulation resistance 値 at a DC applied voltage of 16V was 2 × 1012Ω, and no short circuit between the metal thin films or cracking of the metal thin films was found. Element layer 602, reinforcement layers 603a, 603b, and protective layer 77 (Please read the precautions on the back before filling in this page) 0 Order --- n 1 nn I ί ϋ ϋ n ί I nnn I 1 n I i.— ϋ I n. This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) 505933 A7 B7 V. Description of the invention (puff) 604a, 6 (Mb of resin film with 95% hardening degree , 95%, 90%. The thickness of the metal thin film of the element layer 602 and the reinforcing layers 603a, 603b is 300 angstroms, and the film resistance is 6 Ω / E]. Furthermore, a part of the above-mentioned laminated body element 600 was decomposed, and as a result, the element layer was found The width of the first and second non-metallic strips of 6% of the metal film is 150 / zm, 50 / zm in order, and the widths of the first and second non-metallic strips of the metal film of the reinforcing layer 603a, 603b are in order. 150 / zm, 50 / zm (Comparative Example Π-1) Except that laser light irradiation was not performed by the laser light irradiating device 530, the chip capacitor shown in FIG. 10 was obtained in the same manner as in Example Π-1. The obtained chip capacitor had a thickness of about 1.5 mm in the lamination direction, a depth of 1.6 mm, and a width (in the direction between the two external electrodes) of about 3. 2mm, ## is 0.35 // F. The withstand voltage is 50V. In addition, the insulation resistance at a DC applied voltage of 16V is 5 X 1011 Q. Among the element layer 602, the reinforcing layers 603a, 603b, and the protective layers 604a, 604b The hardening degree of the resin film is 95%, 95%, and 90% respectively. The thickness of the metal thin film of the element layer 602 and the reinforcing layers 603a and 603b. Is 300 angstroms, and the film resistance is 6Ω / E]. Furthermore, the above-mentioned laminated body A part of the element 600 was partially decomposed, and as a result, it was found that the width of the non-metallic strip of the metal thin film of the element layer portion was 150 // m, and the width of the non-metallic strip of the metal thin film of the reinforcing layer portion was 150 / zm. In Comparative Example Π-1, it has excellent insulation resistance, 78 paper sizes are applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling out this page) # Ministry of Economic Affairs Intellectual Property Printed by the Bureau ’s Consumer Cooperatives-OT (aaaa a ·· &lt; · ϋ ϋ I n ϋ n ί ^ 1 ϋ ϋ ϋ Printed by the Employees ’Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 505933 A7 B7 V. Description of the Invention (ri) It is generally believed that this is due to the sufficient formation of non-metallic bands on the cut surface. Therefore, in the present π invention, the above-mentioned embodiments are at best only ~ examples, and the present invention is not limited to the above-mentioned embodiments. For example, the number of layers of the laminated body may be based on the purpose of the laminated body or the required specifications (such as It is appropriately determined by using a capacitor shape, a required zero capacitance, and the like. The number of layers obtained from the one-layer thickness and the entire thickness described in the above embodiment is merely an example. M, From the viewpoint of using the formed laminated body, the extremely thin laminated body is prone to breakage and the like. According to the inspection done by the inventors, as long as the thickness is generally 100 z / m or more, cracks and the like will hardly occur. However, special attention should be paid to the use of the thickness below 20 // 2. Therefore, if the upper limit of the total thickness of the 1-layer tree ^ gastric membrane and the 1-layer metal film is l # m, then the number of layers of the tree-layer gastric membrane is 20 or more. Real lower limit 値. It is more preferable that the number of laminated resin films is 100 or more. On the other hand, the upper limit of the multilayer body is subject to less limiting factors than the lower limit. Among them, in a high-density assembled circuit board, since the height of the part is higher than that of a semiconductor wafer, electronic parts having a thickness of 1 mm or more become fewer. If the total thickness of the 1-layer resin film and the 1-layer metal film is lower than%. 1 / zm, the number of laminated layers of the resin film is 10,000 or less, which becomes the standard of the upper limit of the number of laminated layers. f The embodiments described above are only for the purpose of clarifying the technical content of the present invention. The present invention is not limited in interpretation due to these specific examples. It can be within the scope of the spirit of the invention and the scope of patent application Various changes are made, and the present invention should be interpreted broadly. 79 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) C Please read the note on the back first? Please fill in this page again for matters)---------- Order --------- Line 丨 · 505933 A7 __B7 V. Description of Invention (7you) Printed by the Employees' Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 10 Laminates 11a, 11b Metal films 12 Resin films 13a, 13b Through holes 14a, 14b Conductive material 15 V Electrode terminals 17 Circuit boards 19 Electrode terminals 20 Laminates 21a, 21b Metal films 22 Resin films 23a, 23b Through holes 24a, 24b conductive material 30 capacitor (capacitor row) 31a, 31b metal thin film 33a, 33b through hole 35a, 35b take out electrode 35, electrode terminal 36 capacitor element 37 through electrode 37, electrode terminal 38 through hole 39 conductive material 40 semiconductor integrated circuit 41 Circuit board 42 Electrode terminal 45 Semiconductor wafer 46 Carrier 80 (Please read the precautions on the back before filling this page) Order i line 丨 — This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 505933 A7 B7 V. Description of invention (bamboo) 47 50 51a, 51b 52 53a, 53b 54a, 54b 55 57 58 59 60 61a, 61b 62 63a, 63b 64a, 64b 71a, 71b 100 111 112 114 115 116 117 118 119 120 121 123 Electrode terminal laminate metal film resin film notch conductive material electrode terminal circuit board conductive material electrode terminal laminate metal film resin film notch conductive material cutting area layer manufacturing device Container roll resin film forming device, metal film forming device, vacuum tank, vacuum pump, patterned material removal device, resin hardening device, surface treatment device, next door opening shielding plate (please read the precautions on the back before filling this page) Ϋ n · ϋ n ϋ nn one-port, nnn ϋ nn III nnnn HI n an nnn---n ϊ nn ϋ 81 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 505933 A7 B7 V. Description of the invention (Suppressed) Printed by the Intellectual Property Bureau of the Ministry of Economy, Employees' Cooperatives, 125 Laser processing device 127 Plasma irradiation device 130a, 130b Patterning material imparting device 131 Micropores 132 Opposite side 133% Mold cavity 134 Storage Groove 135 Link Road 137 Patterning material · 138a, 138 b Stripe pattern of patterning material 140 Laser patterning device 142 Patterning material imparting device 211 Support body 220 Patterning material imparting device 222 Micropore 230 Patterning material imparting device 232 Micropore 240 'Resin film forming device 241 Resin film material 242 Supply tube 243a, 243b Heating plate 244 Plates 245a, 245b, 2 45c Shielding plate 500, 5005 Laminate manufacturing device 511 Container roller 511a Container roller rotation direction 512 Resin film forming device 82 (Please read the precautions on the back first (Fill in this page) · Order i line 丨-This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 505933 A7 B7 V. Description of invention (Η) Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 513 Patterned material applying device 514 Metal thin_forming device (metal material supply source) 515 Vacuum tank 516 Vacuum pump 517 Patterned material removal device 518 Resin hardening device 519 Surface treatment device 520 Partition 521 Opening '523 Masking plate. 523a Moving direction 530 laser light irradiation device 531 laser light 540 Patterning material applying device 541 Nozzle head 542 Fine hole · 543 Base plate 544 Piezo element 545 Piston head 546 Sharp hole plate 547 Patterning material 548 Cylinder 600 Laminated body element 601 Direction of travel of outer peripheral surface of container roller 602 Element layer 603a, 603b Reinforcing layers 604a, 604b Protective layer 605 Cut surface 83 (Please read the precautions on the back before filling this page) 0 Order · 1 line 丨 ^ --- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 505933

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (heart) 606 Metal film 607 Resin film 608a First non-metallic tape 608b Second non-metallic tape 609a, 609b Section 610 Ί Chip capacitors 611a, 611b External electrodes 900 Laminate manufacturing equipment 911 Container roll i 912 Resin film forming device 913 Patterning material applying device 914 Metal film forming device 915 Vacuum tank 916 Vacuum pump 917 Patterning material removing device 918 Resin hardening device 919 Surface treatment device 920a, 920b Partition wall 922 Opening 923 Blocking plate 930 Laminated body element 931 Metal film 932 Resin film 933 Edge portion (non-metallic tape) 938 Travel direction of outer peripheral surface of container roller 939a, 939b Cut-off surface 940 Chip capacitor 941a, 941b External electrode λ 84 sheets Standards are applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling out this page) 1 11 nnnnn one by one ov f 1 n ϋ ϋ n ϋ n I line 1 ·- ----------------------

Claims (1)

505933 A8 B8 C8 D8 6. Scope of patent application 1. A laminated body obtained by laminating a plurality of resin films and a plurality of metal films; characterized in that the ends of the metal film are not exposed on the laminated body At least one layer of the resin film has a through hole in a lamination direction; the upper and lower metal films are electrically connected through the through hole; at least one layer of the metal film can take out an electrode to the outside through the through hole. 2- The laminated body according to item 1 of the scope of patent application, wherein the through hole 塡 is filled with a conductive substance, and the upper and lower metal films are electrically connected through the conductive substance. 3. For the laminated body according to item 1 of the scope of patent application, wherein the above-mentioned metal thin film is directly connected through the above-mentioned through hole. 4. A laminated body obtained by laminating a plurality of resin films and a plurality of metal films; characterized in that, 'a part of the periphery of at least one layer of said resin film has a notch portion; and said upper and lower portions are passed through said notch portion. The metal thin film is used for electrical connection; at least one layer of the metal thin film can take out the electrode to the outside through the notch. 5. For the laminated body according to item 4 of the scope of patent application, wherein the notch is filled with a conductive substance, and the upper and lower metal films are electrically connected through the conductive substance. 6. The laminated body according to item 4 of the scope of patent application, wherein the upper and lower metal thin films are directly connected through the notch. 7. For the laminated body in item 4 of the scope of patent application, in which the above-mentioned resin 1 paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -------- Line 丨 ------------------- 505933 0588 29 ABCD The supplementary film has a substantially rectangular shape, and the metal film is formed backward on the side of the resin film except for the side where the notch is formed. (Please read the precautions on the back before writing this page) 8. —A capacitor Is obtained by using a laminated body composed of a plurality of resin films and a plurality of metal films; characterized in that the ends of the metal film are not exposed to the outside of the laminate; at least one layer of the resin film has Through-holes in the lamination direction; through the through-holes, the metal thin film is electrically connected so that every other layer becomes equipotential; the metal thin-films that are equipotentially connected are obtained through the through-holes Electrodes to the outside. 9. For the capacitor in the scope of patent application item 8, wherein the through-hole 塡 is filled with a conductive substance, and the aforementioned metal thin film is electrically connected through the above-mentioned conductive substance. In the capacitor, the aforementioned metal thin film is electrically connected through the aforementioned through hole. 11. For the capacitor in the item 8 of the scope of patent application, wherein the aforementioned metal thin film is separated into a plurality on the same surface and formed on the same surface. A plurality of electrostatic capacity forming regions are formed. 12. For example, the capacitor in the scope of patent application No. 11 further has a through electrode that is insulated from the aforementioned metal thin film. 13. A semiconductor integrated circuit characterized in that the scope of patent application The capacitor according to any one of items 8 to 12 is contained in a package. 14. A multilayer wiring board characterized in that the capacitor according to any one of claims 8 to 12 is applied to the surface or the inside thereof. The paper size is applicable to Chinese National Standard (CNS) A4 (210 X 297 mm) 505933 A8 B8 C8 D8 Benefit range 15 · —A capacitor is obtained by using a laminated body formed of a plurality of resin films and a plurality of metal films. The capacitor is characterized in that at least one layer of the resin film has a notch at a part of the periphery through the notch. The metal film is electrically connected in such a manner that every other layer becomes an equipotential; the metal film of the equipotential connection is to take out the electrode to the outside through the notched portion. 16. For example, the capacitor of the scope of patent application No. 15 Wherein, the notch 塡 is filled with a conductive substance, and the metal thin film is electrically connected through the conductive substance. 17. The capacitor according to item 15 of the scope of patent application, wherein the metal thin film is directly connected through the notch. 18. The capacitor of item 15 of the patent application, wherein φ, the resin film has a substantially rectangular shape, and the metal film is formed by receding on the side of the resin film other than the side where the notch is formed. 19. A method for manufacturing a laminated body, which is used for manufacturing a laminated body in which a resin film and a metal thin film are alternately laminated; characterized in that the method includes: forming the metal thin film more than the resin in a region where the resin thin film is formed; The formation area of the film is small, and whenever a metal film is formed, the formation position of the aforementioned metal film is changed so that the resin film and the metal film are alternately laminated; _ forming a process for penetrating the resin film and the metal film The process of through-holes; and 3 (Please read the notes on the back before filling out this page) 印 Printed on the paper by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 505933 A8 B8 C8 D8 6. The scope of the patent application is a process of filling the aforementioned through hole with a conductive material so that at least a part of the metal film is electrically connected to the conductive material. (Please read the precautions on the back before filling this page) 20. If the laminated body manufacturing method of item 19 of the scope of patent application, it further has: forming a second through hole that can penetrate the resin film but not the metal film A process of filling the aforementioned second through hole with a conductive material. 21. —A method for manufacturing a laminated body is a process in which a process of forming a resin film, a process of forming a metal film, and a process of forming a through hole penetrating the resin film and the metal film at a predetermined position on a support This unit process is repeatedly performed so that the resin film and the metal film are alternately laminated as a laminate; it is characterized in that the metal film is formed to have a smaller area than the resin film formation area in the formation area of the resin film. Whenever one layer of the metal thin film is formed, the formation position of the metal thin film is changed; the through-holes are continuously formed in the lamination direction, and the continuous through-holes are filled with a conductive material, so that at least a part of the metal thin-film and the The aforementioned conductive material is electrically connected. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 22. If the laminated body manufacturing method of item 21 of the patent application scope, further includes: a process of forming a second through hole that can penetrate the aforementioned resin film but not the aforementioned metallic film; Let the aforementioned second through-holes be continuously formed in the lamination direction, and then fill the aforementioned continuous second through-holes with a conductive material. 23. A method for manufacturing a laminated body is a process for forming a resin film. 4 This paper is applicable to China National Standard (CNS) A4 (210 X 297 mm) Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 505933 Jaw C8 D8 6. Scope of patent application, process for forming through holes in the aforementioned resin film, and on the aforementioned resin film The process of forming a metal thin film is one unit, and the unit process is repeatedly performed on a support so that the resin film and the metal thin film are alternately laminated into a laminated body; characterized in that, in the formation area of the resin thin film, the metal The film is formed to have a smaller area than the formation area of the aforementioned resin film, and In the case of a one-layer metal thin film, the formation position of the aforementioned metal thin film is changed; and by forming the aforementioned through hole in the area where the aforementioned metal thin film is formed, a plurality of the aforementioned metal thin films in the lamination direction are electrically connected through the aforementioned through hole. 24. If the method for manufacturing a laminated body according to item 23 of the scope of patent application is to form a second through hole in the area of the resin film where the metal film is not formed after the resin film is formed and before the metal film is formed, The two through-holes are continuous in the lamination direction, and then the continuous second through-holes are filled with a conductive material. 25. If the method for manufacturing a laminated body according to item 19, 21, or 23 of the scope of the patent application is applied after the aforementioned metal thin film is formed, laser light is scanned in a substantially grid-like manner to limit the area where the aforementioned metal thin film is formed. 26. If the method of manufacturing a laminated body according to item I9, 21 or 23 of the scope of patent application, after the formation of the aforementioned resin film, apply a substantially grid-like oil to the surface of the resin film, and then form a metal film to limit the aforementioned metal Formation area of the thin film. 27. If the method for manufacturing a laminated body according to item 26 of the patent application scope is to manufacture the aforementioned laminated body on a support moving in a single direction; 5 This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297) Mm) (Please read the notes on the back before filling this page) ϋ I ϋ ϋ 1 1 1 I n ϋ 1 1 ϋ n I n ϋ nn ϋ nn ϋ ϋ n I ϋ · 505933 A8 B8 C8 D8 The scope of the patent application uses at least one pair of nozzles (having fine holes arranged opposite to the surface of the resin film), and the trajectory of the fine holes of the individual nozzles depicted on the resin film relative to the moving direction of the support At a substantially 45-degree angle, the above-mentioned nozzles are moved back and forth in a direction substantially orthogonal to the moving direction of the support to perform the application of the oil. 28 · A method for manufacturing a capacitor, comprising: forming a metal thin film in a region where a resin thin film is formed to have a smaller area than the formation area of the resin thin film; and when forming a metal thin film of one layer, that is, Change the formation position of the aforementioned metal film to alternate the process of laminating the resin film and the metal film; the process of forming a through hole that can penetrate the resin film and the metal film: and fill the through hole with a conductive material so that the metal film is The first layer is the first gas connection process. 29. The method for manufacturing a capacitor according to item 28 of the scope of patent application, wherein the inner wall surface of the through hole is subjected to plasma treatment after the through hole is formed and before the conductive material is formed. 30 · —A method for manufacturing a capacitor, which is based on a process of laminating a resin film, a process of forming a metal film, and a process of forming a through hole that can penetrate the resin film and the metal film at a predetermined position as a unit, and repeats it on a support. This unit process is performed to manufacture a capacitor; characterized in that, in the formation area of the resin film, the metal film is formed to have a smaller area than the formation area of the resin film, and whenever one layer of the metal film is formed, that is, Change the formation position of the aforementioned metal film; and 6 paper sizes are applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs Printed-I · I nl II nn-nnn I n II nn ϋ I nn · ϋ nnn ϋ n I ϋ n ϋ 1 I— ϋ II— &lt; Printed by the Intellectual Property Office of the Ministry of Economic Affairs and Consumer Cooperatives 505933 A8 B8 C8 D8 ---- 6. The scope of the patent application is to form through-holes continuously in the direction of lamination, and to 'charge conductive materials' to the aforementioned continuous through-holes. 1 have the metal thin film layer to make said electrical connection intervals. 31_ The method for manufacturing a capacitor according to item 30 of the scope of patent application, is to perform plasma treatment on the inner wall surface of the aforementioned through hole. 32 · ~ A method for manufacturing a capacitor is a process of forming a resin film, a process of forming a through hole in the aforementioned resin film, and a process of forming a metal film on the aforementioned resin film as a unit, and repeating this unit on the support A process for manufacturing a capacitor; characterized in that the metal thin film is formed to have a smaller area than that of the resin thin film in the formation area of the resin thin film, and the metal is changed every time a metal thin film is formed The position where the film is formed; and by forming the through fLi ′ in the area where the metal thin film is formed, the metal thin film is electrically connected through the through hole every other layer. In the manufacturing method, the plasma treatment is performed on the through-holes' after the resin film is formed with through-holes and before the metal thin film M is formed. .34. A laminated body manufacturing device, comprising: a support body in a round shape; a metal thin film forming device and a resin thin film forming device arranged opposite to the support body; and a vacuum tank for accommodating the support body and the forming device; It is characterized in that, 'a laser patterning device for metal thin film processing is provided on the downstream side of the metal thin film forming device and on the upstream side of the resin thin film forming device. [7] This standard applies to the Chinese National Standard (CNS) A4 standard (21 〇χ 297 公 爱) * ^ (Please read the notes on the back before filling in this page} m. Nnnnln ϋ 』口, a ί ϋ ϋ n -1_1 1 ϋ I n I li I nnn II nn ϋ I n I ϋ n ϋ I ϋ n I Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 505933 A8 B8 C8 D8 VI. Application for patent scope 〇 35. If the laminated device manufacturing device in the scope of patent application No. 34 is further equipped with holes A laser processing device for forming a hole in the lamination direction. 36. For example, the manufacturing device for a laminated body according to item 35 of the patent application scope further includes a plasma irradiation device, It is provided on the downstream side of the laser processing device and on the upstream side of the metal thin film forming device. 37. A manufacturing device for a laminated body, which includes: a supporting body that is rounded; a metal thin film forming device that is arranged opposite to the supporting body And a resin film forming device; and a vacuum tank for accommodating the support and the forming device; further comprising: a laser processing device for hole processing for forming holes in a lamination direction; and an oil application device It is located on the downstream side of the aforementioned resin film forming device and on the upstream side of the aforementioned metal film forming device, and is used to apply an oil agent to the resin film. A plasma irradiation apparatus is further provided on the downstream side of the laser processing apparatus and on the upstream side of the metal thin film forming apparatus. 39. The apparatus for manufacturing a laminated body according to item 37 of the patent application scope, wherein the oil agent is provided Device with at least one pair of nozzles (with fine holes). _ 40. —A kind of laminated device manufacturing device, It has: a round support; a metal thin film forming device and a resin thin film arranged opposite to the aforementioned support 8 The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 male f (Please read the note on the back first) (Please fill in this page again for matters) Order ---- Line | _--------------. 505933 A8 B8 C8 D8 Printed by the Consumers' Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs And a vacuum tank for accommodating the support body and the forming device; characterized in that an oil agent for applying an oil agent to the resin film is provided on the downstream side of the resin film forming device and on the upstream side of the metal film forming device; Device;% The oil-agent applying device has at least one pair of nozzles (fine holes are arranged). 41. The apparatus for manufacturing a laminated body according to item 40 of the scope of the patent application, wherein the trajectories of the aforementioned fine holes of the paired individual nozzles depicted on the resin film cross each other. 42. The device for manufacturing a laminated body according to item 39 or 40 of the scope of patent application, wherein the pair of the aforementioned nozzles are respectively approximately at the same speed as the moving speed of the supporting body, and are substantially orthogonal to the moving direction of the supporting body. Move back and forth in the direction. ♦ 43. The manufacturing device of a laminated body according to item 39 or 40 of the patent application scope, wherein the trajectory drawn on the resin film by the aforementioned fine holes of the pair of individual nozzles is formed by the moving direction of the aforementioned support The angle is about 45 degrees, and the trajectories formed by the fine holes of the individual nozzles cross. 44. An apparatus for manufacturing a laminated body, comprising: a support body that is round; a metal thin film forming device and a resin thin film forming device that are disposed opposite to the support; and a vacuum tank that houses the support and the forming device; The system further includes: a laser processing device for hole processing to form holes in the lamination direction; and an oil applying device 'located on the downstream side of the aforementioned resin film forming device 9 (Please read the precautions on the back before filling in this Page) «· II ----- Order · —— — — — — 丨 · ^ 1 — — — — — —-II ---- I ------- Degrees are applicable to China National Standards (CNS) A4 specification (210 X 297 mm) 505933 A8 B8 C8 D8 6. The scope of the patent application, the upstream side of the aforementioned metal film forming device, impart oil to the resin film; and the laser patterning device for metal film processing, set On the downstream side of the metal thin film forming apparatus and on the upstream side of the resin thin film forming apparatus. 45. The device for manufacturing a laminated body according to item 44 of the patent scope of claim 1 further includes a plasma irradiation device 'which is provided downstream of the laser processing device and upstream of the metal thin film forming device. 46 · —A method for manufacturing a laminated body, which has a process of forming a resin film; and a process of forming a metal film by depositing a metal material by a vacuum process; by performing these processes on a supporting body on a circle, the aforementioned support A laminated body containing a resin film and a metal film is manufactured on the body; the metal film is formed by a first non-metallic belt formed in a moving direction of the support body, and is roughly aligned with a moving direction of the support body. The second non-metallic band formed in the right-angle direction is divided into a substantially rectangular shape. 47. If the method of manufacturing a laminated body according to item 46 of the application for a patent, it is recommended that the non-metallic tape 1 and / or the second non-metallic tape be adhered with a patterning material on the surface of the resin film before the formation of the metal film Formed by. 48. A method for manufacturing a laminated body according to item 47 of the patent application, wherein the 'patterned material is adhered in a manner not in contact with the surface of the resin film. 49. A method for manufacturing a laminated body according to item 47 of the patent application, Among them, the adhesion of the patterned material is to release the vaporized patterned material from the micropores of the device provided with the patterned material disposed on the surface of the resin film. 10 The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the notes on the back before filling out this page) Pray for printing by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs n 1 ϋ BaBai i mamt II nnnnn -ϋ nnn ϋ nnnn ϋ I n i_i n -1 n 505933 A8 B8 C8 D8, the scope of patent application is adhered to the surface of the resin film. 50. The method for manufacturing a laminated body according to item 47 of the scope of patent application, wherein the attachment of the patterning material is a patterning in which a liquid state is released from the micropores of the device provided to the patterning material disposed on the surface of the resin film. Material, adhered to the surface of the resin film. 51. The method for manufacturing a laminated body according to item 47 of the scope of patent application is to remove the remaining patterned material after the metal thin film is formed and before the resin thin film is formed. 52. The method for manufacturing a laminated body according to item 47 of the application, wherein the patterning material is selected from the group consisting of an ester-based oil agent, a glycol-based oil agent, a fluorine-based oil agent, and a hydrocarbon-based oil agent. At least one of the oils. 53. The method for manufacturing a laminated body according to item 46 of the scope of patent application, wherein the first non-metallic strip and / or the second non-metallic strip are formed by removing the metal thin film after forming the metal thin film. ‘54. The manufacturing method of the laminated body according to item 53 of the patent application range, wherein the removal of the metal thin film is performed by irradiating laser light. 55. The method for manufacturing a laminated body according to item 46 of the patent application scope, wherein the positions in the laminated direction of the second non-metallic belt are substantially the same. 56. The method for manufacturing a laminated body according to item 46 of the patent application scope, wherein after obtaining the laminated body on the laminated body, cut along the first non-metallic belt or at least a part of the second metallic belt in the laminated direction Off. 57. According to the method for manufacturing a laminated body according to item 46 of the application for a patent, after obtaining the laminated body on the laminated body, the metal film is cut in the laminated direction in such a way that the cut surface is not exposed. 11 This paper size applies to China National Standard (CNS) A4 (210 X 297 public love) (Please read the precautions on the back before filling out this page) 鬌: Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, I n I · Ϋ 1 n I n I mMmm ϋ n an ϋ n ϋ n I imam nnn ϋ ϋ n 6. Scope of applying for a patent 58. The method for manufacturing a laminated body according to item 46 of the applied patent scope, in which 'after obtaining the laminated body on the laminated body, proceed: cut in the direction of the laminated layer so that the metal film does not expose the cut surface ; And cutting in a direction different from the aforementioned cutting, so that the metal thin film is exposed to the cutting surface, to the lamination direction; there are two types of cutting. 59. The method for manufacturing a laminated body according to item 46 of the patent application range, wherein the lamination of the 'resin film' is carried out by attaching the evaporated resin material to the face of the support. 60. The method for producing a laminated body according to item 59 of the application, wherein the resin material is a reactive monomer resin. 61. If the method for manufacturing a laminated body according to item 59 of the application for a patent, it is preferable that the resin material is hardened after being attached to the resin material. 62. The method for manufacturing a laminated body according to item 46 of the patent application scope, wherein after the resin film is laminated, surface treatment is performed. ', 63 · —A method for manufacturing an electronic part is performed on a supporting body: a process of forming a resin film; and a process of forming a metal film by depositing a metal material by a vacuum process, thereby supporting the aforementioned support After the multilayer body containing the resin film and the metal thin film is produced on the body, the betel body is cut in the stacking direction to form an external electrode to manufacture an electronic part, and is characterized in that the metal thin film formed on the support is a system ^ 12 is a first non-metallic belt formed in the moving direction of the aforementioned body, and a second non-metallic belt formed in a direction substantially orthogonal to the moving direction of the aforementioned support $ [J is substantially rectangular; ^ 12 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling out this page) Printed by the Intellectual Property Bureau's Consumer Cooperatives-I m III n ϋ nn · n IIIIIIII § ^^^ 1 — — — — — — — — — — — — — — — — — — — 505933 A8 D8 6. Application scope A small portion is performed along at least a portion of the aforementioned non-metallic strip. 64. The method for manufacturing an electronic component according to item 63 of the scope of patent application, wherein the positions of the second non-metallic strips in the lamination direction are substantially the same. 65. The manufacturing method of electronic parts according to item 63 of the scope of patent application, wherein the aforementioned cutting is performed in at least two directions with mutually different directions, and the cutting in one direction is such that the metal film does not expose the cutting Face to face. 66. The method for manufacturing an electronic part according to item 65 of the scope of patent application, wherein an external electrode is formed on a cut surface where a metal thin film is exposed. 67. The method for manufacturing an electronic part according to item 63 of the scope of patent application, wherein the electronic part is a capacitor. 68. The method for manufacturing an electronic part according to item 63 of the scope of patent application, wherein the electronic part is a chip capacitor. 69. An electronic component having: a laminated body obtained by laminating at least two layers of a resin film and a metal thin film respectively; an electrode on a part of a side surface in a direction other than the laminated direction of the laminated body, and It is formed by a method of making electrical connection with the aforementioned metal thin film; characterized in that the side of the laminated body on which the electrodes are not formed does not expose the aforementioned metal thin film. 70. The electronic component according to item 69 of the patent application scope, wherein the laminated body has Roughly cuboid shape, applicable to 13 paper sizes outside the laminated direction of the laminated body. Applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page). Order- --------line! Printed by the Intellectual Property Bureau's Consumer Cooperatives of the Ministry of Economic Affairs 505933 A8 B8 C8 D8 VI. Among the two sets of facing faces in the direction of patent application: The facing faces of one group are formed with electrodes, while the facing faces of the other group are not exposed Metal film. 71. An electronic part is a self-laminating direction for a laminated body obtained by laminating at least two layers of a resin film and a metal film, respectively, and electrically connecting the metal film to a part of the cut surface. Forming an electrode; characterized in that a cut surface of the electrode is not formed, and the metal thin film is not exposed. 72. The electronic component according to claim 69 or 71, wherein the electronic component is a capacitor. (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 14 The paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm)