JP3992317B2 - Electronic component manufacturing method and thin film manufacturing apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component manufacturing method and a thin film manufacturing apparatus.
[0002]
[Prior art]
The role played by thin films in modern society is very widespread, and thin films are used in various parts of daily life such as wrapping paper, magnetic tape, capacitors, and semiconductors. Without these thin films, it is impossible to talk about the basic trends of technology such as high performance and miniaturization in recent years.
[0003]
At the same time, various methods have been developed for forming thin films that satisfy industrial demands. For example, wrapping paper, magnetic tape, capacitors, etc., continuous winding vacuum deposition is advantageous for high-speed mass production. Has been done. At that time, it is selected according to the purpose of the thin film that forms the evaporation material and the substrate material, and at the same time, the reactive gas is introduced into the vacuum chamber as necessary, or the thin film is formed with the potential applied to the substrate. Thus, a thin film having desired characteristics can be formed.
[0004]
For example, in manufacturing a magnetic recording medium, an evaporating material containing a magnetic element such as Co, Ni, or Fe is used, and a long magnetic recording medium is obtained by performing reactive vapor deposition while introducing oxygen gas into a vacuum chamber. I can do it. In semiconductors, a thin film is formed mainly by sputtering. The sputtering method is particularly effective for forming a thin film using a ceramic material, and the ceramic thin film is often formed by a coating and baking method when the film thickness is several μm or more, and is often formed by the sputtering method when the film thickness is 1 μm or less.
[0005]
On the other hand, thin film formation using a resin material is performed by a coating method, and reverse coating and die coating are used industrially. Generally, a material diluted with a solvent is dried and cured after coating. . Moreover, although the minimum of the film thickness of the resin thin film formed by these construction methods is based on the material to be used, it is often about 1 μm, and a film thickness of less than that is often difficult to obtain. In general coating means, since the coating thickness immediately after coating is several μm or more, solvent dilution is necessary for forming an ultrathin resin film, and a resin thin film of 1 μm or less cannot often be obtained. . Further, when solvent dilution is performed, defects are likely to occur in the dried coating film, and it is not preferable from the viewpoint of environmental protection.
[0006]
Therefore, a method capable of forming a resin thin film without performing solvent dilution and a method capable of stably obtaining an extremely thin resin thin film are desired. As a method for solving this, a method of forming a resin thin film in a vacuum has been proposed. This is a method in which the resin material is vaporized in vacuum and then adhered to the support. According to this method, a resin thin film free from void defects can be formed, and there is no need for solvent dilution.
[0007]
By laminating different types of thin films on the ceramic thin film or resin thin film, various composite thin films that have not been obtained in the past can be obtained, and their industrial application fields are very diverse. Among them, chip-shaped electronic parts are very promising, and capacitors, coils, resistors, capacitive batteries, or composite parts of these, etc., are being formed with extremely small size and high performance by thin film lamination. Expansion has begun.
[0008]
Needless to say, an electrode is indispensable for obtaining an electronic component. However, in an electronic component using a metal thin film, a metal thin film having a different potential can be formed in the electronic component by patterning the metal thin film. I can do it. That is, an electronic component can be formed by using a metal thin film divided into a plurality of parts with a patterning portion as an insulating region and laminating this with an insulating thin film.
[0009]
As a means for obtaining a patterned metal thin film, there is a technique called an oil margin. This is because the metal thin film is not formed on the patterning material when the metal thin film is formed by vapor deposition or the like after the patterning material is formed thin in advance. The metal thin film thus formed is formed in a state where the patterning portion is removed, and a metal thin film having a desired pattern can be formed. For example, a capacitor having a cross-sectional structure as shown in FIG. 4 can be obtained by setting patterning and cutting positions as shown in FIG.
[0010]
As the patterning material, various oils including hydrocarbon oil, mineral oil, fluorine oil, and other materials suitable for the metal thin film to be formed can be used. As a method for applying the patterning material, in addition to coating or a similar method, the patterning material is enclosed in a sealed nozzle having a minute opening corresponding to the pattern and heated, and material vapor is ejected from the opening to form a metal. A method of aggregating on the thin film forming surface can be used.
[0011]
[Problems to be solved by the invention]
However, there is a problem of residual material when patterning with an oil margin. That is, most of the patterning material re-evaporates during the formation of the metal thin film, but some remains after the metal thin film is formed, and the remaining pattern material becomes a component outside the design, and is produced in the form of product yield or performance variation Affects affected electronic components. Here, in order to reduce the remaining material, it is effective to minimize the patterning material in advance. However, if it is insufficient, the insulation is poor, and thus control is difficult. Therefore, it has been desired to stabilize the oil margin by reducing the influence of the remaining material.
[0012]
An object of the present invention is to solve the above-mentioned problems, and to obtain a laminated thin film that is less affected by the remaining material and has excellent surface properties and patterning characteristics.
[0013]
[Means for Solving the Problems]
In order to solve these problems, the present invention provides a method for producing an electronic component comprising at least a metal thin film and an insulating thin film, and a step of applying a patterning material made of oil prior to the formation of the metal thin film; and forming the metal thin film, the remaining said patterned material, a step of removing by heating with a heating amount varying the heating means, and forming the insulating thin film, to impart the patterning material A process, a process of forming the metal thin film, a process of removing the patterning material by heating with a heating means having a variable heating amount, and a process of forming the insulating thin film are sequentially and repeatedly performed in a vacuum. which comprises carrying out, and at least a vacuum vessel, and a support disposed in the vacuum chamber, which is installed along the moving direction of the support, Oh Patterning material application device for applying a patterning material comprising a Le, a metal thin film forming apparatus, the patterning material removal device for removing patterning material by heating amount varying the heating means, the manufacture of thin film characterized by having an insulating thin film forming apparatus Device.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
The invention according to claim 1 of the present invention is a method of manufacturing an electronic component in which at least a metal thin film and an insulating thin film are laminated, and a step of applying a patterning material made of oil prior to the formation of the metal thin film ; Forming the metal thin film, removing the remaining patterning material by heating with a heating means with variable heating amount , and forming the insulating thin film, and applying the patterning material And the step of forming the metal thin film, the step of removing the patterning material by heating with a heating means having a variable heating amount, and the step of forming the insulating thin film are sequentially and repeatedly performed in vacuum. In this way, a laminated thin film having excellent surface properties and patterning characteristics can be obtained.
[0015]
【Example】
Embodiments of the present invention will be described below with reference to the drawings. An electronic component formed by multilayer lamination of a metal thin film and an insulating thin film was formed by an apparatus as schematically shown in FIG. In FIG. 1, a metal thin film forming source 8, an insulating thin film forming source 9, a curing device 10, a patterning material applying device 11, and a patterning material removing device 12 are arranged around the laminated film supporting can 7. The thin film laminated body of the lamination number according to the number can be formed.
[0016]
As the metal thin film forming source, a resistance heating evaporation source, an induction heating evaporation source, an electron beam evaporation source, a sputter evaporation source, a cluster evaporation source, other devices used for forming a thin film, or a combination thereof may be used according to the metal thin film to be formed. I can do it. Also, the insulating thin film forming source depends on the insulating thin film to be formed, such as heater heating of resin-based materials, vaporization or atomization by ultrasonic waves or spraying, sputtering of ceramic-based materials, sputtering of oxides, vapor deposition, etc. A device can be used. As a curing device used when forming a resin dielectric thin film as the insulating thin film, ultraviolet curing, electron beam curing, thermal curing, or a combination thereof can be used. On the other hand, the patterning of the metal thin film is an oil margin method in which a thin pattern of oil or the like is applied before forming the metal thin film.
[0017]
An electronic component can be produced by cutting the thin film laminate obtained by alternately laminating the metal thin film and the insulating thin film thus patterned, and then forming electrodes by thermal spraying or the like as necessary. FIG. 1 shows a method for forming a multilayer laminate of a metal thin film and an insulating thin film. In addition to the method of FIG. 1, a metal thin film or an insulating thin film is formed on a film. A multilayer laminate can be formed by stacking a large number of sheets, and the scope of the present invention is not restricted by the method of FIG.
[0018]
Example 1
When forming a vapor-deposited thin film of aluminum as a metal thin film and an acrylate resin thin film by heater heating vaporization as a dielectric thin film, ultraviolet curing and oil patterning were combined to provide a capacitor whose schematic structure is shown in FIG. The thickness of the aluminum thin film was 50 nm, and the thickness of the resin thin film was 1 μm. As the resin material, 1.9 nonanediol diacrylate mixed with 5 wt% of a photopolymerization initiator was used. The number of repeated layers was about 1000 for both aluminum and resin, and the width of the insulating portion formed by patterning was about 0.5 mm. Fluorine-containing oil was used as the patterning material. The center distance in the film surface direction between adjacent patterning insulating portions is 2.5 mm. Further, a far infrared heater was used to remove the patterning material, and the output was changed. The effect of removing the patterning material was evaluated by the ratio of the step generated in the vicinity of the patterning portion to the laminated film thickness of the non-patterning portion. FIG. 5 shows the measurement results. As can be seen from FIG. 5, as the heater output for patterning removal increases, the difference in thickness between the patterned portion and the non-patterned portion becomes smaller, and the surface property of the laminated thin film is improved. In addition, the patterning disturbance accompanying the increase in the number of stacked layers became smaller as the heater output increased. When the heater was not heated, the width of the patterning insulating portion became unstable with the lamination.
[0019]
(Example 2)
When forming a copper vapor-deposited thin film as a metal thin film and an acrylate resin thin film by heater heating vaporization as a dielectric thin film, electron beam curing and oil patterning were combined to obtain a capacitor whose outline structure is shown in FIG. The thickness of the copper thin film was 40 nm, and the thickness of the resin thin film was 0.1 μm. Dimethinol tricyclodecane diacrylate was used as the resin material. The number of repeated layers was about 4000 for both copper and resin, and the width of the insulating portion formed by patterning was about 0.1 mm. Mineral oil was used as the patterning material. The center distance in the film surface direction between adjacent patterning insulating portions is 1.4 mm. Further, the output of the patterning material was changed using an electron beam. The effect of removing the patterning material was evaluated by the ratio of the step generated in the vicinity of the patterning portion with respect to the laminated film thickness of the non-patterning portion. FIG. 6 shows the measurement results. As can be seen from FIG. 6, as the electron beam output for patterning removal increases, the difference in thickness between the patterned portion and the non-patterned portion decreases, and the surface property of the laminated thin film is improved. Further, when the patterning material was not removed, pattern disturbance was observed as the number of layers increased.
[0020]
Here, the reason why the surface property of the laminated thin film is improved by removing the patterning material in Examples 1 and 2 is considered as follows. That is, when the patterning material remains after the metal thin film is formed, an insulating thin film is formed thereon, so that the laminated thin film grows with the patterning material contained therein. Therefore, the unevenness of the surface after lamination is severe. On the other hand, when stacking is performed while removing excess patterning material, the stacked thin film is formed only of a metal thin film and an insulating thin film, so that a dent corresponding to the thickness of the metal thin film is slightly seen in the patterning portion. It is possible to form a laminated thin film without large irregularities.
[0021]
In the examples, the case where an acrylate resin material is used as the insulating thin film material has been described. However, other resin materials and resin materials such as epoxy resins and other ceramic materials and metal oxide materials are also used. What we can do is as already mentioned. For example, the effect of the present invention could be confirmed even when titanium oxide having a thickness of 50 nm to 300 nm was used as the dielectric by electron beam evaporation in an oxygen atmosphere as the metal oxide.
[0022]
In the examples, only the case where the metal thin film layer is made of aluminum or copper has been described. However, other metals such as silver, nickel, and zinc, and alloys containing them are not used. By mixing the Cu layer and the Cu layer, the characteristics are complemented, and depending on the use conditions, there is a possibility that high performance can be achieved.
[0023]
Although only the case where a far infrared heater and an electron beam are used as the means for removing the patterning material has been described in the embodiment, the same effect can be obtained by using other removing means such as an ultraviolet lamp irradiation or a plasma irradiation. Obtained.
[0024]
As described above, as the patterning material, various oils including hydrocarbon oil, mineral oil, fluorine oil, and other materials suitable for the metal thin film to be formed can be used. As a method for applying the patterning material, in addition to coating or a similar method, the patterning material is enclosed in a sealed nozzle having a minute opening corresponding to the pattern and heated, and material vapor is ejected from the opening to form a metal. A method of aggregating on the thin film forming surface can be used.
[0025]
Moreover, although the case where a can was used as a support in Examples 1 and 2 was described, the present invention is not limited by these supports, and a flat or curved support other than a cylindrical shape In addition, an electronic component can be formed on a metal, an insulator, glass, or a semiconductor according to the present invention.
[0026]
Also, in the embodiments, the description has been given taking the capacitor as an example of the electronic component, but the surface property and patterning characteristics of the laminated thin film can also be obtained by using the patterning material removal described in the present invention in other electronic components such as a chip coil and a noise filter. It can be easily inferred that it can be improved, and the present invention can be widely applied to a method of manufacturing an electronic component and a manufacturing apparatus of a thin film.
[0027]
【The invention's effect】
As described above, according to the electronic component manufacturing method and thin film manufacturing apparatus of the present invention, a laminated thin film having excellent surface properties and patterning characteristics can be obtained, and high performance electronic components such as high performance capacitors can be realized. .
[Brief description of the drawings]
FIG. 1 is a diagram showing an example of a thin film manufacturing apparatus according to the present invention. FIG. 2 is a diagram showing an example of a conventional film deposition apparatus. FIG. 3 is a diagram showing an example of patterning of a metal thin film. FIG. 5 is a diagram showing an example of a sectional view of a component. FIG. 5 is a diagram showing an example of the relationship between the power of the removal heater and the surface property of the laminated film. FIG. 6 is an example of the relationship between the power of the removal electron beam and the surface property of the laminated film. Figure [Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Metal thin film 2 Insulating thin film 3 Electrode 4 Pattern position 5 Vacuum tank 6 Exhaust system 7 Can 8 Conductor thin film formation source 9 Dielectric thin film formation source 10 Curing apparatus 11 Patterning material provision apparatus 12 Patterning material removal apparatus

Claims (5)

In a method of manufacturing an electronic component formed by laminating at least a metal thin film and an insulating thin film, a step of applying a patterning material made of oil prior to formation of the metal thin film, a step of forming the metal thin film, and the remaining Removing the patterning material by heating with a heating means having variable heating amount, forming the insulating thin film, applying the patterning material, forming the metal thin film, A method of manufacturing an electronic component, wherein the step of removing the patterning material by heating with a heating means having a variable amount of heating and the step of forming the insulating thin film are successively and repeatedly performed in a vacuum. . 2. The method of manufacturing an electronic component according to claim 1, wherein the metal thin film is formed by any one of a vacuum deposition method, an ion plating method, and a sputtering method. The method of manufacturing an electronic component according to claim 1 or 2, wherein said metal thin film is at least two or more layers. The method of manufacturing an electronic component according to claim 1 or 3, wherein said metal thin film and the insulating thin film is formed in vacuum. At least a vacuum chamber, a support installed in the vacuum chamber, a patterning material applying device for applying a patterning material made of oil, a metal thin film forming device, and a heating amount installed along the moving direction of the support A thin film manufacturing apparatus comprising a patterning material removing apparatus and an insulating thin film forming apparatus for removing a patterning material by a variable heating means.

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