WO2022102156A1 - はんだ付け装置 - Google Patents

はんだ付け装置 Download PDF

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Publication number
WO2022102156A1
WO2022102156A1 PCT/JP2021/022533 JP2021022533W WO2022102156A1 WO 2022102156 A1 WO2022102156 A1 WO 2022102156A1 JP 2021022533 W JP2021022533 W JP 2021022533W WO 2022102156 A1 WO2022102156 A1 WO 2022102156A1
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WO
WIPO (PCT)
Prior art keywords
pair
rails
zone
gas
wall surface
Prior art date
Application number
PCT/JP2021/022533
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
雄太 齊藤
Original Assignee
千住金属工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 千住金属工業株式会社 filed Critical 千住金属工業株式会社
Priority to MX2023005365A priority Critical patent/MX2023005365A/es
Priority to EP21891405.9A priority patent/EP4213600A4/en
Priority to JP2022528335A priority patent/JP7128431B1/ja
Priority to US18/033,719 priority patent/US11865645B2/en
Priority to KR1020237013497A priority patent/KR102594816B1/ko
Priority to CN202180075797.XA priority patent/CN116547098A/zh
Priority to TW110139100A priority patent/TWI804011B/zh
Publication of WO2022102156A1 publication Critical patent/WO2022102156A1/ja

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Definitions

  • the present invention relates to an apparatus for performing a soldering process.
  • soldering process is widely known as a method for mounting various electronic products (for example, IC chips) on a circuit board.
  • a solder paste is printed in place on the circuit board.
  • the electronic product is mounted on this circuit board.
  • the circuit board is heated and cooled in this order in a soldering apparatus called a reflow furnace.
  • a cooling device disclosed in Patent Document 1 As a conventional technique for cooling a circuit board, a cooling device disclosed in Patent Document 1 can be mentioned.
  • This conventional cooling device employs a method of supplying cooling gas from above and below.
  • This conventional cooling device includes left and right rails for transporting circuit boards and left and right suction passages combined with these rails. These suction passages extend in the vertical direction of the cooling device on the sides of the left and right rails.
  • the left suction passage is connected to the upper and lower collection passages.
  • the upper recovery passage collects the cooling gas that moves to the left of the circuit board after being sprayed from above the circuit board above the left rail.
  • the lower recovery passage collects the cooling gas that moves to the left of the circuit board after being sprayed from below the circuit board, below the left rail.
  • the upper collection passage and the lower collection passage merge on the downstream side of them to form a single passage.
  • the right suction passage has the same configuration as the left suction passage.
  • Patent Document 2 discloses a cooling device that employs the same gas supply method as Patent Document 1.
  • Patent Document 3 discloses a cooling device of a method of supplying gas from above (down blow method). The cooling device of Patent Document 3 has cooling fins provided between the stirring fan and the rail, and the gas supplied from above is cooled here and blown onto the circuit board.
  • Patent Document 4 discloses an apparatus in which a gas supplied from above is heated by a heater and blown onto a circuit board.
  • the passage where the upper and lower collection passages merge is formed outside the cooling zone. Therefore, the cooling gas flowing through the merging passage may be cooled by the inner wall surface of the merging passage.
  • the cooling gas is cooled by the inner wall surface, there is a possibility that the flux contained therein may condense and adhere to the cooling gas. Therefore, improvement is desired from the viewpoint of suppressing the liquefaction of the flux in the cooling zone and improving the efficiency of collecting the flux outside the cooling zone.
  • the first invention is a soldering apparatus, which has the following features.
  • the soldering device includes a cooling zone, an upper vent, a lower vent, an external passage, a blower unit, a heat exchanger, a pair of bypass passages, and a vent plate.
  • the cooling zone cools the soldered substrate.
  • the upper vent is provided above the pair of rails that carry the substrate in the cooling zone.
  • the lower vent is provided below the pair of rails in the cooling zone.
  • the external passage connects the upper and lower vents outside the cooling zone.
  • the blower unit communicates with the upper vent.
  • the ventilation unit causes the gas in the external passage to flow in the order of the upper vent, the cooling zone, and the lower vent and returns to the external passage.
  • the heat exchanger is provided in a lower opening connected to the lower vent below the pair of rails.
  • the heat exchanger cools the gas passing through the lower opening.
  • the pair of bypass passages are provided on the sides of the pair of rails in parallel with the pair of rails.
  • the bypass passage sends gas above the pair of rails to the lower opening while bypassing the positions of the pair of rails.
  • the ventilation plate is provided in a space formed between the pair of bypass passages below the pair of rails.
  • the vent plate has a slit that sends gas below the pair of rails to the lower opening.
  • Each of the pair of bypass passages has a suction port located above the pair of rails, a discharge port located below the ventilation plate, and a position of the pair of rails from the inside to the outside of the pair of rails. It has a bent portion that bends.
  • the discharge port is located below the ventilation plate and above the lower opening.
  • the third invention further has the following features in the first or second invention.
  • Each of the pair of bypass passages has a suction port located above the pair of rails, a discharge port located below the ventilation plate, and a position of the pair of rails from the inside to the outside of the pair of rails. It has a bent portion that bends.
  • One of the suction ports faces the other of the suction ports.
  • One of the discharge ports faces the other of the discharge ports.
  • the fourth invention further has the following features in any one of the first to third inventions.
  • the width of the pair of bypass passages in the transport direction of the substrate is substantially equal to the width of the vent plate in the transport direction.
  • the slit is formed in a direction orthogonal to the transport direction of the substrate.
  • the fifth invention further has the following features in any one of the first to fourth inventions.
  • the upper vent is provided on the side wall surface of the furnace body as the side wall surface of the cooling zone.
  • the blower unit includes a blower fan, a fan inlet zone, and a fan outlet zone.
  • the blower fan is provided on the ceiling wall surface of the furnace body as the ceiling wall surface of the cooling zone.
  • the fan inlet zone extends from the upper vent toward the wall surface facing the side wall surface of the furnace body, and gas flows from the upper vent toward the blower fan.
  • the fan outlet zone is provided so as to surround the fan inlet zone, and gas flows from the blower fan toward the cooling zone.
  • the sixth invention further has the following features in the fifth invention.
  • the bottom wall surface of the outlet zone as the bottom wall surface of the fan outlet zone faces the substrate transport surface formed between the pair of rails.
  • a large number of vents are formed at equal intervals on the bottom wall surface of the outlet zone.
  • the seventh invention further has the following features in any one of the first to sixth inventions.
  • the soldering apparatus further includes a branch passage and a collector.
  • the branch passage branches from the external passage in the middle of the external passage.
  • the collector is connected to the branch passage.
  • the collector collects the flux in a liquid state.
  • the eighth invention further has the following features in the seventh invention.
  • the collector includes a storage unit and a connection unit that connects the storage unit to the branch passage.
  • the branch point of the branch passage in the external passage is located directly below the lower vent.
  • the storage portion is provided below the branch point.
  • the passage connecting the branch point and the storage portion is inclined downward from the branch point toward the storage portion.
  • the first invention when the substrate is above the heat exchanger, most of the gas above the pair of rails can be sent to the heat exchanger by the pair of bypass passages.
  • the slits allow much of the gas above the pair of rails to be sent to the heat exchanger. Therefore, when two or more substrates are continuously conveyed, it is possible to cool these substrates while suppressing the flow of gas existing between the pair of rails from being disturbed.
  • the position of the discharge port is located below the ventilation plate and above the lower opening, it is possible to shorten the length of the bypass passage.
  • By shortening the length of the bypass passage it is possible to supply this gas to the heat exchanger while suppressing the gas flowing through the bypass passage from being cooled by the inner wall surface. Therefore, the gas passing through the bypass passage can be reliably cooled in the heat exchanger, and the flux contained in this gas can be efficiently recovered downstream of the heat exchanger.
  • the third invention when the substrate is located above the heat exchanger, most of the gas flowing to the side of the substrate is sucked from the suction port, and is below the ventilation plate through the bending portion and the discharging port. It becomes possible to spit out.
  • the gas discharged below the ventilation plate merges with the gas that has passed through the slit. Therefore, gas turbulence may occur below the ventilation plate.
  • this turbulence is blocked by the ventilation plate, the flow of gas existing between the pair of rails is hardly disturbed. Therefore, it is possible to cool these substrates while suppressing the flow of gas existing between the pair of rails from being disturbed.
  • the distance between the pair of rails is adjusted according to the size of the board. That is, this interval increases when cooling a substrate having a wide width in a direction orthogonal to the transport direction, and decreases when cooling a substrate having a narrow width. Therefore, if the slit is formed parallel to the transport direction, the turbulence of the gas flow around the slit may increase depending on the distance between the pair of rails.
  • the distance between the pair of rails is larger than that in the case where the slits are formed parallel to the transport direction. It is possible to suppress the occurrence of defects due to adjustment.
  • the fifth invention it is possible to flow the gas flowing into the blower unit from the external passage through the upper vent through the fan inlet zone, the blower fan, and the fan outlet zone in this order and send them out to the cooling zone.
  • the upper vent is provided on the side wall surface of the furnace body.
  • the blower fan is provided on the ceiling wall surface of the furnace body.
  • the fan outlet zone is provided so as to surround the fan inlet zone. Therefore, according to such an arrangement relationship, the direction of the gas flowing into the blower unit from the side wall surface of the furnace body is changed in the blower unit, and the direction of the gas sent out from the blower unit is simply directed from the upper side to the lower side of the cooling zone. It is possible to go in one direction. Therefore, it is possible to stabilize the flow of gas existing between the pair of rails.
  • a large number of vents are formed at equal intervals on the bottom wall surface of the outlet zone facing the substrate transport surface. Therefore, it is possible to evenly blow out the gas that has flowed into the blower unit during the operation of the blower unit from these vents and direct it toward the substrate transport surface. Therefore, it is possible to further stabilize the flow of gas existing between the pair of rails.
  • the liquid flux generated by the condensation in the heat exchanger can be recovered by the recovery device outside the cooling zone via the external passage and the branch passage.
  • the passage connecting the branch point and the storage portion is inclined downward from the branch point toward the storage portion. Therefore, it is possible to improve the efficiency of recovery of the liquid flux outside the cooling zone by the recovery device.
  • FIG. 1 It is a figure which shows the whole structure example of the soldering apparatus which concerns on embodiment of this invention. It is a figure which shows an example of the main structure of the cooling zone shown in FIG. It is a figure which looked at the upper part of the cooling zone when the cooling zone was cut along the 3-3 line of FIG. 2 from the conveyor side. It is a figure which looked at the cooling zone when the cooling zone was cut along the 4-4 line of FIG. 2 from the heating zone side. It is a figure which looked at the upper part of the cooling zone when the cooling zone was cut along the line 5-5 of FIG. 2 from the conveyor side. It is a figure which looked at the lower part of the cooling zone when the cooling zone was cut along the line 6-6 of FIG. 2 as seen from the conveyor side.
  • FIG. 1 shows the whole structure example of the soldering apparatus which concerns on embodiment of this invention. It is a figure which shows an example of the main structure of the cooling zone shown in FIG. It is a figure which looked at the upper part of the cooling zone when the cooling zone was cut
  • FIG. 3 is a diagram showing another example of the configuration above the cooling zone shown in FIG. It is a figure which shows the configuration example around the heat exchanger shown in FIG. It is a figure explaining the gas flow in the cooling zone shown in FIG. It is a figure explaining the gas flow in the cooling zone shown in FIG. It is a figure which shows an example of the main structure of the cooling zone of the soldering apparatus which concerns on a reference example of this invention. It is a figure which looked at the upper part of the cooling zone when the cooling zone was cut along the line 12-12 of FIG. 11 from the heating zone side. It is a figure which looked at the upper part of the cooling zone when the cooling zone was cut along the line 13-13 of FIG. 11 from the conveyor side.
  • soldering apparatus hereinafter, also referred to as “reflow furnace”
  • reflow furnace soldering apparatus
  • FIG. 1 is a diagram showing an example of overall configuration of a reflow oven according to an embodiment of the present invention.
  • the reflow oven 1 shown in FIG. 1 includes a conveyor 10.
  • the conveyor 10 has a pair of rails 11L and 11R arranged along the longitudinal direction of the reflow furnace 1, and transports the circuit board CB (see FIG. 4) installed between them in the transport direction BDD.
  • the distance between the rails 11L and 11R is adjusted according to the size of the circuit board CB.
  • Solder paste is printed at a predetermined position on the circuit board CB.
  • an electronic product is mounted on the circuit board CB.
  • the solder paste printing process and the electronic product mounting process are performed before the soldering process performed in the reflow furnace 1.
  • the reflow furnace 1 is also equipped with labyrinths 20 and 50.
  • the labyrinth 20 is provided at the inlet of the reflow furnace 1.
  • the labyrinth 20 has an internal structure composed of a plurality of fin-shaped metal plates and the like. This internal structure prevents outside air from entering through the inlet of the reflow furnace 1.
  • the labyrinth 50 is provided at the outlet of the reflow furnace 1.
  • the labyrinth 50 is provided for the purpose of preventing outside air from entering from the outlet of the reflow furnace 1.
  • the reflow furnace 1 further includes a heating zone 30.
  • the heating zone 30 includes, for example, a preheating zone and a peak heating zone.
  • the five zones on the entrance side that is, the labyrinth 20 side
  • the remaining three zones on the exit side that is, the labyrinth 50 side
  • the number of preheating and peak heating zones varies depending on the type of the reflow furnace 1.
  • the circuit board CB In the preheating zone, the circuit board CB is heated in a relatively low temperature range. The heating in the preheating zone begins to vaporize the flux contained in the solder paste. In the peak heating zone, the circuit board CB is heated in a temperature range in which the solder component contained in the solder paste melts. The range of the preheating temperature and the range of the peak heating temperature are appropriately set depending on the composition of the solder components. Flux vaporization occurs not only in the preheating zone but also in the peak heating zone. By heating the circuit board CB in the peak heating zone, the volatile components in the flux are vaporized.
  • the reflow furnace 1 further includes a cooling zone 40.
  • the cooling zone 40 is divided into a first zone and a second zone.
  • the total number of cooling zones 40 varies depending on the type of the reflow furnace 1. Therefore, the total number of cooling zones 40 may be one.
  • the circuit board CB is cooled. Cooling of the circuit board CB in the cooling zone solidifies the solder component.
  • the cooling zone 40 is connected to the heating zone 30. Therefore, a part of the flux volatile component vaporized in the heating zone 30 flows into the cooling zone 40.
  • a configuration example of the cooling zone 40 and a cooling operation of the circuit board CB in the cooling zone 40 will be described.
  • FIG. 2 is a diagram showing an example of a main configuration of the cooling zone 40 shown in FIG. As shown in FIG. 2, the cooling zone 40 includes cooling zones 40A and 40B. The configuration of the cooling zone 40A and that of the cooling zone 40B are basically the same. Therefore, in the following, the cooling zone 40A will be described as a representative of these, and the description of the cooling zone 40B will be omitted.
  • FIGS. 3 to 6 will be referred to as a supplement to the description of FIG.
  • FIG. 3 corresponds to a view of the upper part of the cooling zone 40 when the cooling zone 40 is cut along the 3-3 line shown in FIG. 2 as viewed from the conveyor 10 side.
  • FIG. 4 corresponds to a view of the cooling zone 40A when the cooling zone 40A is cut along the 4-4 line shown in FIG. 2 as viewed from the cooling zone 40B (heating zone 30) side.
  • FIG. 5 corresponds to a view of the upper part of the cooling zone 40 when the cooling zone 40 is cut along the 5-5 line shown in FIG. 2 as viewed from the conveyor 10 side.
  • FIG. 3 corresponds to a view of the upper part of the cooling zone 40 when the cooling zone 40 is cut along the 3-3 line shown in FIG. 2 as viewed from the conveyor 10 side.
  • FIG. 4 corresponds to a view of the cooling zone 40A when the cooling zone 40A is cut along the 4-4 line shown in FIG. 2 as viewed from the cooling zone 40
  • the blower unit 90 is provided above the cooling zone 40A.
  • the blower unit 90 is attached to the ceiling wall surface (hereinafter, referred to as “furnace ceiling wall surface”) 41 of the cooling zone 40A.
  • the blower unit 90 sucks a cooling gas (for example, nitrogen gas) from its side.
  • the blower unit 90 sends out the sucked gas below it.
  • the blower unit 90 includes a blower fan 91, a fan inlet zone 92, and a fan outlet zone 93.
  • the blower fan 91 is located below the furnace body ceiling wall surface 41.
  • the blower fan 91 sucks in the gas in the fan inlet zone 92 and sends it out to the fan outlet zone 93.
  • the blower fan 91 includes a baffle plate 91a and 91b. These baffle plates are provided to swirl the gas sent out from the blower fan 91 in the fan outlet zone 93 in the horizontal direction.
  • the baffle plates 91a and 91b have an arcuate cross section, and their sizes are substantially equal.
  • the baffle plate 91a extends from the outer edge of the blower fan 91 shown by the broken line toward the left side wall surface (hereinafter, referred to as “rear body left side wall surface”) 42L of the cooling zone 40A.
  • the baffle plate 91b extends from the outer edge portion toward the right side wall surface (hereinafter, referred to as “furnace body right side wall surface”) 42R of the cooling zone 40A.
  • the "right side” and "left side” are shown with reference to the transport direction BDD.
  • the blower fan 91 includes small baffle plates 91c and 91d.
  • the purpose of installing these small baffle plates is the same as that of the baffle plates 91a or 91b.
  • the sizes of the small baffles 91c and 91b are approximately equal.
  • these small baffle plates have a smaller cross-sectional R and vertical size than the baffle plates 91a and 91b. Therefore, in the example shown in FIG.
  • the gas sent out from the blower fan 91 flows along the surface of the baffle plate 91a (or the baffle plate 91b), or the small baffle plate 91c (or the baffle plate 91b). It flows along the surface of 91b). According to the latter flow, a gas flow swirling around the central portion of the fan outlet zone 93 is generated. According to the former flow, a gas flow that swirls outside the central portion is generated.
  • the fan inlet zone 92 includes a side wall surface (hereinafter referred to as “inlet zone side wall surface”) 92a and 92b, a bottom wall surface (hereinafter referred to as “entrance zone bottom wall surface”) 92d, and a ceiling wall surface (hereinafter referred to as “inlet zone bottom wall surface”) 92d. It is referred to as “entrance zone ceiling wall surface”) and is partitioned by (particularly, see FIGS. 3 and 4).
  • a partition plate 92c is provided in the fan inlet zone 92. The partition plate 92c faces the right wall surface 42R of the furnace body.
  • the partition plate 92c is installed at a position closest to the side surface of the blower fan 91 farthest from the right wall surface 42R of the furnace body. By providing the partition plate 92c at such a position, the gas flowing into the fan inlet zone 92 from the upper vent 44 is evenly supplied to the bottom surface of the blower fan 91.
  • the inlet zone bottom wall surface 92d inclines downward from the partition plate 92c toward the furnace body right side wall surface 42R.
  • the entrance zone bottom wall surface 92d may not have such an inclination, and the entire area of the entrance zone bottom wall surface 92d may extend in the horizontal direction.
  • the partition plate 92c may not be provided from a viewpoint different from the efficiency of maintenance.
  • the inlet zone bottom wall surface 92d is connected to the furnace body left side wall surface 42L, and is inclined downward from here toward the furnace body right side wall surface 42R.
  • the bottom wall surface 92d of the inlet zone becomes horizontal near the wall surface 42R on the right side of the furnace body and is connected to the wall surface 42R on the right side of the furnace body.
  • the fan outlet zone 93 is provided so as to surround the fan inlet zone 92. As shown in FIGS. 3 and 4, the fan outlet zone 93 is referred to as a side wall surface (hereinafter referred to as “exit zone side wall surface”) 93a and 93b and a bottom wall surface (hereinafter referred to as “exit zone bottom wall surface”). ) 93c, the furnace body ceiling wall surface 41, and the furnace body right side wall surface 42R.
  • the substrate passage zone 40a described above is a space formed below the bottom wall surface 93c of the exit zone.
  • the outlet 94 shown in FIG. 3 corresponds to the fan outlet zone 93 on this cut surface.
  • the outlet 94 is configured to direct the gas sent out from the blower fan 91 and swirling horizontally along the surface of the baffle plate 91a or 91b downward.
  • the bottom wall surface 93c of the exit zone is located below the outlet 94.
  • a large number of vents 95 are formed at equal intervals on the bottom wall surface 93c of the outlet zone. The gas in the fan outlet zone 93 is blown out from each of the vents 95.
  • the outlet zone bottom wall surface 93c has a pent roof shape that gently inclines downward from the central portion toward the furnace body right side wall surface 42R and the furnace body left side wall surface 42L, respectively.
  • the reason for this is that even if a liquid flux is generated on the bottom wall surface 93c of the outlet zone, the flux is expected to move to a position close to the furnace body right side wall surface 42R or the furnace body left side wall surface 42L. When such movement of the flux occurs, the dripping of the flux from the central portion located directly above the circuit board CB is suppressed.
  • the shape of the bottom wall surface 93c of the exit zone is not limited to this, and other shapes may be applied.
  • the upper vent 44 is provided on the right wall surface 42R of the furnace body.
  • a lower vent 45 is provided on the bottom wall surface (hereinafter, referred to as “furnace bottom wall surface”) 43 of the cooling zone 40A.
  • One end of the external passage 46 is connected to the lower vent 45.
  • An upper vent 44 is connected to the other end of the external passage 46. That is, the upper vent 44 and the lower vent 45 are connected via the external passage 46.
  • a lower opening 47 is provided between the conveyor 10 and the lower vent 45.
  • the lower opening 47 is a space connecting the substrate passage zone 40a and the lower vent 45.
  • a heat exchanger 60 is provided in the lower opening 47. The heat exchanger 60 exchanges heat with the gas passing therethrough and cools the gas. Details of the configuration example around the heat exchanger 60 will be described in item “2-2”.
  • a ventilation plate 70 is provided below the conveyor 10 and above the heat exchanger 60.
  • the ventilation plate 70 is made of a metal flat plate.
  • the ventilation plate 70 is formed with three slits 71 at equal intervals.
  • the longitudinal direction of these slits 71 is orthogonal to the transport direction BDD. That is, the slit 71 is formed in a direction orthogonal to the transport direction BDD (hereinafter, also referred to as “horizontal TRD”).
  • the total number of slits 71 is not limited to the example of FIG. That is, the total number of slits 71 may be 2 or less, or 4 or more. Further, the forming direction of the slit 71 may be a direction parallel to the transport direction BDD.
  • a bypass passage 72 that bypasses the position of the rail 11L is provided on the side of the rail 11L.
  • the bypass passage 72 has a suction port 72a located above the rail 11L, a discharge port 72b located below the ventilation plate 70, and a bent portion 72c. Gas above the rail 11L flows into the suction port 72a, and this gas is discharged from the discharge port 72b.
  • the bent portion 72c is bent from the inside to the outside of the rail 11L (on the left side wall surface 42L side of the furnace body) at the position of the rail 11L.
  • a bypass passage 73 having the same configuration as the bypass passage 72 is provided on the side of the rail 11R.
  • the suction port 73a of the bypass passage 73 faces the suction port 72a.
  • the discharge port 73b of the bypass passage 73 faces the discharge port 72b.
  • the bent portion 73c of the bypass passage 73 is bent to the outside of the rail 11R (on the right side wall surface 42R side of the furnace body) at the position of the rail 11R.
  • the bypass passages 72 and 73 have a certain width in the transport direction BDD. As shown in FIG. 6, the width of these bypass aisles in the transport direction BDD is approximately equal to the width of the vent plate 70 in the transport direction BDD. Further, as can be seen from FIG. 6, the width of the ventilation plate 70 in the lateral TRD is substantially equal to the distance between the bypass passages 72 and 73. In reality, there is a gap between the bypass passage 72 or 73 and the ventilation plate 70, and this gap is closed by a support plate provided below the ventilation plate 70. With such an arrangement, the ventilation plate 70 is provided in the space formed between the bypass passages 72 and 73. By providing the ventilation plate 70 at this position, the movement of the gas in the vertical direction of the ventilation plate 70 is restricted to the movement via the slit 71.
  • the external passage 46 branches in the middle. Specifically, the external passage 46 branches immediately below the lower vent 45.
  • a branch passage 49 extends from the branch point 48. The end of the branch passage 49 is connected to the connection portion 81 of the collector 80.
  • the liquid flux FX is stored in the storage unit 82 of the collector 80.
  • the entire reservoir 82 is located below the branch point 48.
  • the passage connecting the branch point 48 and the storage portion 82 (that is, the branch passage 49 and the connection portion 81) is inclined downward from the branch point 48 toward the storage portion 82.
  • FIG. 8 is a diagram showing a configuration example around the heat exchanger 60 shown in FIG.
  • the heat exchanger 60 includes a main body 61 and a refrigerant passage 62.
  • the main body 61 has an internal space, and the refrigerant passage 62 is arranged in this internal space.
  • the refrigerant passage 62 is provided so as to be folded back between the opposite side surfaces of the main body portion 61.
  • the total number of the refrigerant passages 62 may be one or two or more.
  • the supply port 62a of the refrigerant passage 62 is provided below the heat exchanger 60, and the discharge port 62b of the refrigerant passage 62 is provided above the heat exchanger 60. Then, the flow of the refrigerant from the lower side to the upper side of the main body portion 61 is formed while folding back between the opposite side surfaces of the main body portion 61.
  • the lower opening 47 is composed of a small opening 47a accommodating the main body 61 and a large opening 47b having a wider cross-sectional area than the small opening 47a.
  • the width of the large opening 47b is approximately equal to the distance between the bends 72c and 73c.
  • the heat exchanger 60 is detachably provided in the lower opening 47.
  • the heat exchanger 60 is connected to the furnace body right side wall surface 42R via a connection unit (not shown). Therefore, when the heat exchanger 60 is removed together with the connection unit, the heat exchanger 60 is separated from the cooling zone 40.
  • FIGS. 9 and 10 are diagrams illustrating a gas flow in the cooling zone 40. Note that FIGS. 9 and 10 correspond to views of the cooling zone 40A when the cooling zone 40A is cut at the same position as in FIG. 4 as viewed from the cooling zone 40B side. The difference between FIGS. 9 and 10 lies in the presence or absence of the circuit board CB. That is, the circuit board CB is drawn in FIG. 9, and the circuit board CB is not drawn in FIG. The situation shown in FIG. 10 is typically observed when cooling while continuously transporting two or more circuit boards.
  • the arrows “GFD” in FIGS. 9 and 10 indicate the direction of the gas flow generated in the cooling zone 40 due to the operation of the blower unit 90.
  • the specific flow of this flow is as follows. That is, when the blower unit 90 is operated, the gas in the external passage 46 flows into the fan inlet zone 92 through the upper vent 44. The gas flowing into the fan inlet zone 92 is sucked up by the blower fan 91 and sent out to the fan outlet zone 93. The gas sent out to the fan outlet zone 93 flows through the fan outlet zone 93 in a form flowing outside the fan inlet zone 92, and heads toward the outlet zone bottom wall surface 93c.
  • the direction of the gas flowing into the blowing unit 90 from the right wall surface 42R of the furnace body changes in the blowing unit 90, and when it is sent out from the blowing unit 90, the direction from the upper side to the lower side of the cooling zone 40A. It changes to.
  • the gas that has reached the bottom wall surface 93c of the outlet zone flows into the substrate passage zone 40a through the vent 95 (see FIG. 5).
  • the vents 95 are formed at equal intervals on the bottom wall surface 93c of the outlet zone. Therefore, the flow rates of the gas flowing from the vent 95 into the substrate passage zone 40a are substantially equal in the surface direction of the outlet zone bottom wall surface 93c.
  • the gas flowing into the substrate passage zone 40a from the vent 95 is blown onto the circuit board CB to cool it.
  • the gas blown onto the circuit board CB changes its direction in the circuit board CB and flows around the circuit board CB.
  • the gas flowing around the circuit board CB is roughly classified into a gas flowing in the transport direction BDD and a gas flowing in the lateral TRD.
  • the gas flowing in the transport direction BDD passes through the side of the circuit board CB and heads for the ventilation plate 70.
  • the gas that has reached the ventilation plate 70 goes to the lower opening 47 via the slit 71.
  • the flow of gas before passing through the slit 71 is arranged while passing through the slit 71. Therefore, the direction of the gas flow (that is, the direction from the upper side to the lower side) is constant below the slit 71.
  • the gas that has passed through the slit 71 reaches the large opening 47b.
  • the gas flowing in the lateral TRD flows into the bent portion 72c (or the bent portion 73c) from the suction port 72a (or the suction port 73a) and is discharged from the discharge port 72b (or 73b).
  • the gas flow is arranged in the bent portion 72c (or the bent portion 73c). Then, the gas discharged from the discharge port 72b (or 73b) reaches the large opening 47b while spreading in the lateral TRD.
  • the gas that has reached the large opening 47b is cooled by coming into contact with the surface of the refrigerant passage 62 when passing through the heat exchanger 60 (internal space of the main body 61).
  • the cooled gas flows through the external passage 46 by the suction operation of the blower unit 90, and flows into the blower unit 90 (fan inlet zone 92) through the upper vent 44. Therefore, the temperature of the gas blown out from the outlet zone bottom wall surface 93c (vent 95) by the blowing operation of the blowing unit 90 is low, whereby the circuit board CB is cooled.
  • Oxygen gas may flow into the substrate passage zone 40a from the outside of the cooling zone 40. This oxygen gas may cause oxidation of the soldered portion of the circuit board CB. Further, if the flow of gas existing between the rails 11L and 11R is disturbed, the oxygen gas mixed in the circuit board CB is likely to oxidize the soldered portion or the like during cooling.
  • the bypass passages 72 and 73 allow most of the gas above the conveyor 10 to be large opening 47b. Can be sent to. Further, when the circuit board CB is not present above the heat exchanger 60, most of the gas above the conveyor 10 can be sent to the large opening 47b by the slit 71. Therefore, it is possible to always suppress the disturbance of the gas flow existing between the rails 11L and 11R.
  • the positions of the discharge ports 72b and 73b are located below the ventilation plate 70 and above the lower opening 47, so that the lengths of the bypass passages 72 and 73 are long. Can be shortened.
  • the lengths of the bypass passages 72 and 73 it is possible to supply the gas to the heat exchanger 60 while suppressing the gas flowing through the bypass passages 72 and 73 from being cooled by the inner wall surfaces thereof. .. Therefore, the gas passing through the bypass passages 72 and 73 can be reliably cooled in the heat exchanger 60, and the flux contained in the gas can be efficiently recovered downstream of the heat exchanger 60.
  • the gas discharged below the ventilation plate 70 merges with the gas that has passed through the slit 71. Therefore, gas turbulence may occur below the ventilation plate 70. However, since this turbulence is blocked by the ventilation plate 70, the flow of gas existing between the rails 11L and 11R is hardly disturbed. Therefore, according to the configuration of the reflow furnace according to the embodiment, it is possible to cool the circuit board CB while suppressing the flow of gas existing between the rails 11L and 11R from being disturbed.
  • the distance between the rails 11L and 11R is adjusted according to the size of the circuit board CB. That is, when cooling the circuit board CB having a wide lateral TRD, the distance between the rails 11L and 11R increases, and when cooling the circuit board CB having a narrow width, the distance decreases. Therefore, if the slit 71 is formed parallel to the transport direction BDD, the turbulence of the gas flow may increase around the slit 71 depending on the distance between the rails 11L and 11R.
  • the rail 11L is compared with the case where the slit 71 is formed in parallel with the transport direction BDD. It is possible to suppress the occurrence of defects due to the adjustment of the 11R interval.
  • the direction of the gas flowing into the blower unit 90 from the right wall surface 42R of the furnace body is changed in the blower unit 90, and the direction of the gas sent out from the blower unit 90 is set to the cooling zone. It is possible to move from the upper side to the lower side of the 40. Therefore, it is possible to stabilize the flow of gas existing between the rails 11L and 11R.
  • the vents 95 are formed at equal intervals on the bottom wall surface 93c of the outlet zone, the gas flowing into the blower unit 90 is evenly blown out from these vents 95. It can be sent out to the cooling zone 40. Therefore, it is possible to further stabilize the flow of gas existing between the rails 11L and 11R.
  • the reflow furnace it is possible to flow the flux in a liquid state in the order of the branch point 48, the branch passage 49, and the connection portion 81 below the lower vent 45. Therefore, it is possible to efficiently recover the cooling zone 40 outside the cooling zone 40 (that is, the recovery device 80).
  • the flux is recovered by the recovery device 80. It is possible to increase efficiency.
  • FIG. 11 is a diagram showing an example of a main configuration of a cooling zone of a soldering apparatus according to a reference example.
  • the cooling zone 40 includes cooling zones 40C and 40D.
  • the configuration of the cooling zone 40C and that of the cooling zone 40D are basically the same. Therefore, in the following, the cooling zone 40C will be described as a representative of these, and the description of the cooling zone 40D will be omitted.
  • FIGS. 12 to 15 will be referred to as a supplement to the description of FIG.
  • FIG. 12 corresponds to a view of the cooling zone 40C when the cooling zone 40C is cut along the line 12-12 shown in FIG. 11 as viewed from the cooling zone 40D (heating zone 30) side.
  • FIG. 13 corresponds to a view of the upper part of the cooling zone 40 when the cooling zone 40 is cut along the line 13-13 shown in FIG. 11 as viewed from the conveyor 10 side.
  • FIG. 14 corresponds to a view of the lower part of the cooling zone 40 when the cooling zone 40 is cut along the line 14-14 shown in FIG. 11 as viewed from the conveyor 10 side.
  • blower unit 90 is provided above the cooling zone 40C.
  • the configuration of the blower unit 90 and its surroundings is the same as that of the embodiment.
  • the inlet zone bottom wall surface 92d is horizontal near the furnace body right side wall surface 42R and is connected to the furnace body right side wall surface 42R.
  • the configuration is the same as that of the embodiment.
  • one end of the drain pipe 83 is connected to this horizontal region.
  • the drain pipe 83 discharges the liquid flux generated in the fan inlet zone 92 to the outside of the fan inlet zone 92.
  • the central axis of the drain pipe 83 extends in the vertical direction.
  • the other end of the drain pipe 83 reaches the substrate passage zone 40a.
  • a drain slider 84 is provided detachably from the wall surface constituting the substrate passage zone 40a.
  • the drain slider 84 has a function of guiding the flux dripping from the drain pipe 83 to the lower opening 47.
  • a heat exchanger 60 is provided in the lower opening 47.
  • the configuration is the same as that of the embodiment.
  • the filter 74 is provided above the heat exchanger 60.
  • the filter 74 is made of a metal porous body having a three-dimensional network structure.
  • the filter 74 has a cross-sectional shape (square in the example shown in FIG. 14) that can be fitted into the lower opening 47. Details of the configuration example around the heat exchanger 60 will be described in item “4-2”.
  • FIG. 15 is a diagram showing a configuration example around the heat exchanger 60 shown in FIG.
  • the heat exchanger 60 includes a main body 61 and a refrigerant passage 62.
  • the lower opening 47 is also composed of a small opening 47a and a large opening 47b.
  • the configuration is the same as that of the embodiment.
  • the filter 74 is provided in the large opening 47b.
  • the filter 74 is provided in the large opening 47b.
  • the filter 74 is provided in the large opening 47b, the upper surface of the main body 61 is covered with the filter 74. Since the upper surface of the main body 61 is covered with the filter 74, the gas inside the cooling zone 40A always flows into the internal space of the main body 61 via the filter 74.
  • the filter 74 is detachably provided in the lower opening 47.
  • FIG. 16 is a diagram illustrating a gas flow in the cooling zone 40 shown in FIG. Note that FIG. 16 corresponds to a view of the cooling zone 40C when the cooling zone 40C is cut at the same position as that of FIG. 12 as viewed from the cooling zone 40D side.
  • the gas in the external passage 46 flows into the substrate passage zone 40a through the vent 95 (see FIG. 5).
  • the gas flowing into the substrate passage zone 40a from the vent 95 flows from the upper side to the lower side of the conveyor 10 while cooling the circuit board CB, and reaches the upper surface of the filter 74.
  • the gas that reaches the upper surface of the filter 74 flows into the filter 74.
  • the turbulence of the gas before flowing into the filter 74 is adjusted while flowing inside the filter 74 (rectification action by the filter 74). Therefore, the direction of the gas flow is constant (that is, the direction from the upper side to the lower side) below the lower surface of the filter 74. Further, according to this rectifying action, the flow rate of the gas in the horizontal direction below the lower surface of the filter 740 becomes uniform.
  • the gas flowing out from the lower surface of the filter 74 is cooled by coming into contact with the surface of the refrigerant passage 62 when passing through the heat exchanger 60 (internal space of the main body 61).
  • the cooled gas flows through the external passage 46 by the suction operation of the blower unit 90, and flows into the blower unit 90 (fan inlet zone 92) through the upper vent 44. Therefore, the temperature of the gas blown out from the outlet zone bottom wall surface 93c (vent 95) by the blowing operation of the blowing unit 90 is low, whereby the circuit board CB is cooled.
  • Reflow furnace (soldering equipment) 10 Conveyor 11L, 11R Rail 40, 40A, 40B Cooling zone 40a Substrate passage zone 41 Furnace ceiling wall 42L Furnace left wall 42R Furnace right wall 43 Furnace bottom wall 44 Upper vent 45 Lower vent 46 External passage 47 Lower Opening 47a Small opening 47b Large opening 48 Branch point 49 Branch passage 60 Heat exchanger 61 Main body 62 Refrigerator passage 62a Supply port 62b Discharge port 70 Ventilation plate 71 Slit 72, 73 Bypass passage 72a, 73a Suction port 72b, 73b Discharge port 74 Filter 80 Collector 81 Connection part 82 Storage part 83 Drain pipe 84 Drain slider 90 Blower unit 91 Blower fan 92 Fan inlet zone 92a, 92b Inlet zone side wall surface 92c Partition plate 92d Inlet zone bottom wall surface 92e Inlet zone ceiling wall surface 93 Fan outlet zone 93a, 93b Outlet zone side wall surface 93c Outlet zone bottom wall surface 95 Ventilation port CB

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
PCT/JP2021/022533 2020-11-12 2021-06-14 はんだ付け装置 WO2022102156A1 (ja)

Priority Applications (7)

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MX2023005365A MX2023005365A (es) 2020-11-12 2021-06-14 Aparato de soldadura.
EP21891405.9A EP4213600A4 (en) 2020-11-12 2021-06-14 SOLDERING DEVICE
JP2022528335A JP7128431B1 (ja) 2020-11-12 2021-06-14 はんだ付け装置
US18/033,719 US11865645B2 (en) 2020-11-12 2021-06-14 Soldering apparatus
KR1020237013497A KR102594816B1 (ko) 2020-11-12 2021-06-14 납땜 장치
CN202180075797.XA CN116547098A (zh) 2020-11-12 2021-06-14 焊接装置
TW110139100A TWI804011B (zh) 2020-11-12 2021-10-21 焊接裝置

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EP (1) EP4213600A4 (ko)
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KR (1) KR102594816B1 (ko)
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MX (1) MX2023005365A (ko)
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11589488B1 (en) * 2021-07-28 2023-02-21 Ableprint Iechnology Co., Ltd. Warpage suppressing reflow oven
WO2024094381A1 (de) * 2022-11-03 2024-05-10 Ersa Gmbh Wärmetauschermodul zur anordnung an einer lötanlage mit einem filtervlies und lötanlage mit wärmetauschermodul

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0550218A (ja) * 1991-08-22 1993-03-02 A Tec Tekutoron Kk リフロー半田付け装置
JPH0587987U (ja) * 1992-04-15 1993-11-26 松下電工株式会社 リフロー炉におけるフラックス除去兼プリント配線板冷却装置
JPH07336040A (ja) * 1994-06-03 1995-12-22 Tamura Seisakusho Co Ltd はんだ付け基板の冷却装置
JPH10200253A (ja) * 1997-01-08 1998-07-31 Sanyo Electric Co Ltd リフロー炉
JP2011121101A (ja) * 2009-12-11 2011-06-23 Senju Metal Ind Co Ltd リフロー炉

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5420930B2 (ko) * 1973-09-03 1979-07-26
US5172847A (en) * 1991-09-25 1992-12-22 General Motors Corporation Method and apparatus for convection brazing of aluminum heat exchangers
US5195673A (en) * 1991-09-25 1993-03-23 General Motors Corporation Method and apparatus for convection brazing of aluminum heat exchangers
US5172849A (en) * 1991-09-25 1992-12-22 General Motors Corporation Method and apparatus for convection brazing of aluminum heat exchangers
JP2709365B2 (ja) * 1992-03-16 1998-02-04 日立テクノエンジニアリング株式会社 ベーパーリフローはんだ付け装置
US5271545A (en) * 1993-03-31 1993-12-21 Seco/Warwick Corporation Muffle convection brazing/annealing system
US5440101A (en) * 1993-04-19 1995-08-08 Research, Incorporated Continuous oven with a plurality of heating zones
US5611476C1 (en) * 1996-01-18 2002-02-26 Btu Int Solder reflow convection furnace employing flux handling and gas densification systems
JPH1154903A (ja) * 1997-07-31 1999-02-26 Fujitsu Ltd リフローソルダリング方法及びリフロー炉
DE29902957U1 (de) * 1998-03-10 1999-06-10 Heraeus Noblelight Gmbh, 63450 Hanau Reflow-Lötofen
JP4041628B2 (ja) * 1998-10-13 2008-01-30 松下電器産業株式会社 加熱装置と加熱方法
US6129258A (en) * 1999-02-16 2000-10-10 Seco/Warwick Corporation Muffle convection brazing and annealing system and method
CN2433040Y (zh) * 2000-07-04 2001-06-06 张敏 具废气回收装置的回焊机
US6382500B1 (en) * 2000-08-22 2002-05-07 Advanced Micro Devices, Inc. Solder reflow furnace with flux effluent collector and method of preventing flux contamination
US6386422B1 (en) * 2001-05-03 2002-05-14 Asm Assembly Automation Limited Solder reflow oven
GB2375975B (en) * 2001-05-30 2005-07-20 Philip Arthur Mullins Filtering apparatus
JP2003225761A (ja) * 2001-11-28 2003-08-12 Oak Nippon Co Ltd 金属製ワークピースのコンベクション式ろう付け装置
JP2003181682A (ja) 2001-12-20 2003-07-02 Tamura Seisakusho Co Ltd はんだ付け用冷却装置
US6749655B2 (en) * 2002-04-17 2004-06-15 Speedline Technologies, Inc. Filtration of flux contaminants
JP2004195476A (ja) 2002-12-16 2004-07-15 Tamura Seisakusho Co Ltd はんだ付け用冷却装置およびリフロー装置
TW200526100A (en) * 2004-01-16 2005-08-01 Senju Metal Industry Co Reflow furnace
JP4100578B2 (ja) * 2005-08-23 2008-06-11 千住金属工業株式会社 リフロー炉
JP2007273571A (ja) * 2006-03-30 2007-10-18 Tamura Furukawa Machinery:Kk リフロー炉
JP5087987B2 (ja) 2007-05-11 2012-12-05 トヨタ紡織株式会社 車両用シート
JP5075806B2 (ja) * 2008-12-25 2012-11-21 有限会社ヨコタテクニカ リフロー半田付け装置
MY158726A (en) 2009-12-11 2016-11-15 Senju Metal Industry Co Reflow furnace
KR101268319B1 (ko) * 2011-02-18 2013-05-28 주식회사 티에스엠 리플로우 납땜장치
WO2013038456A1 (ja) * 2011-09-15 2013-03-21 富士通テレコムネットワークス株式会社 リフローはんだ付け装置および方法
JP5050218B1 (ja) 2011-12-27 2012-10-17 株式会社大門 給水配管用プラグ
CN103379801A (zh) * 2012-04-27 2013-10-30 鸿富锦精密工业（深圳）有限公司 散热装置
JP5541354B1 (ja) * 2012-12-28 2014-07-09 千住金属工業株式会社 気体吹き出し孔の配列構造及びはんだ付け装置
WO2015011785A1 (ja) * 2013-07-23 2015-01-29 千住金属工業株式会社 はんだ付け装置及び真空はんだ付け方法
WO2016104710A1 (ja) * 2014-12-26 2016-06-30 富士電機株式会社 加熱冷却機器
JP6502909B2 (ja) 2016-10-26 2019-04-17 株式会社タムラ製作所 リフロー装置
JP6642386B2 (ja) * 2016-11-18 2020-02-05 株式会社デンソー リフロー装置およびそれを用いた基板の製造方法
CN108115239B (zh) * 2016-11-29 2021-08-10 张跃 以气体为介质进行加热/冷却的钎焊炉及其工作方法
CN106793563B (zh) * 2016-12-14 2023-07-28 深圳市新迪精密科技有限公司 Pcb板表面装贴焊接的冷却装置
CN108237296A (zh) * 2016-12-26 2018-07-03 上海朗仕电子设备有限公司 一种带平板式盘管的回流焊炉冷却模组
US10537031B2 (en) * 2017-03-22 2020-01-14 Service Support Specialties, Inc. Reflow soldering apparatus, system and method
JP6746673B2 (ja) * 2018-01-29 2020-08-26 株式会社タムラ製作所 気体浄化装置及び搬送加熱装置
EP3763477A4 (en) * 2018-03-09 2021-11-17 Origin Company, Limited FLUX, BRAZING PULP, BRAZING PROCESS, PROCESS FOR PRODUCING A BRAZING PRODUCT AND PROCESS FOR PRODUCING A BGA BOX
CN110385497A (zh) * 2018-04-20 2019-10-29 伊利诺斯工具制品有限公司 回流焊炉和回流焊炉中的调温单元
CN110385496B (zh) * 2018-04-20 2022-09-30 伊利诺斯工具制品有限公司 回流焊炉及其操作方法
CN110871299A (zh) * 2018-08-29 2020-03-10 伊利诺斯工具制品有限公司 回流焊炉的降温系统
CN112935450A (zh) * 2019-12-10 2021-06-11 伊利诺斯工具制品有限公司 回流焊炉

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0550218A (ja) * 1991-08-22 1993-03-02 A Tec Tekutoron Kk リフロー半田付け装置
JPH0587987U (ja) * 1992-04-15 1993-11-26 松下電工株式会社 リフロー炉におけるフラックス除去兼プリント配線板冷却装置
JP2559743Y2 (ja) 1992-04-15 1998-01-19 松下電工株式会社 リフロー炉におけるフラックス除去兼プリント配線板冷却装置
JPH07336040A (ja) * 1994-06-03 1995-12-22 Tamura Seisakusho Co Ltd はんだ付け基板の冷却装置
JPH10200253A (ja) * 1997-01-08 1998-07-31 Sanyo Electric Co Ltd リフロー炉
JP2011121101A (ja) * 2009-12-11 2011-06-23 Senju Metal Ind Co Ltd リフロー炉

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4213600A4

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11589488B1 (en) * 2021-07-28 2023-02-21 Ableprint Iechnology Co., Ltd. Warpage suppressing reflow oven
WO2024094381A1 (de) * 2022-11-03 2024-05-10 Ersa Gmbh Wärmetauschermodul zur anordnung an einer lötanlage mit einem filtervlies und lötanlage mit wärmetauschermodul

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TWI804011B (zh) 2023-06-01
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JPWO2022102156A1 (ko) 2022-05-19
EP4213600A1 (en) 2023-07-19
EP4213600A4 (en) 2024-05-29
US20230356314A1 (en) 2023-11-09
US11865645B2 (en) 2024-01-09
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CN116547098A (zh) 2023-08-04
KR20230058185A (ko) 2023-05-02

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