WO2016104710A1 - 加熱冷却機器 - Google Patents
加熱冷却機器 Download PDFInfo
- Publication number
- WO2016104710A1 WO2016104710A1 PCT/JP2015/086244 JP2015086244W WO2016104710A1 WO 2016104710 A1 WO2016104710 A1 WO 2016104710A1 JP 2015086244 W JP2015086244 W JP 2015086244W WO 2016104710 A1 WO2016104710 A1 WO 2016104710A1
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- WIPO (PCT)
- Prior art keywords
- cooling
- induction heating
- heating
- processed
- processing chamber
- Prior art date
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/002—Soldering by means of induction heating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
- B23K3/0475—Heating appliances electric using induction effects, e.g. Kelvin or skin effects
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
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- H05K3/3494—Heating methods for reflowing of solder
Definitions
- the present invention relates to a heating / cooling device, and more particularly to a heating / cooling device suitable for soldering a semiconductor element to a substrate, for example.
- a continuous feed type reflow furnace in which a soldering member is placed on a conveyor and a reflow process is performed by sequentially passing through a preheating zone, a main heating zone, and a cooling zone.
- a reflow furnace is open to the atmosphere.
- Sn-Sb solder material having a high Sb concentration has a property that the solder is difficult to wet because a thick oxide film is formed on the surface of the soldered member, compared to the Sn-Ag solder material. If a reflow furnace opened to the atmosphere is used, the problem is that the surface oxide film of the soldered member cannot be sufficiently reduced, and voids are likely to occur on the solder joint surface.
- Patent Documents 1 to 3 describe a method for preventing the generation of voids by performing reflow treatment in a reducing gas atmosphere to improve solder wettability.
- Patent Document 4 the internal space of the vertical process tube that can be sealed is divided into a main heating zone, a preheating zone, and a cooling zone.
- a reflow furnace in which solder reflow processing is performed on an object to be processed by stopping a lifting means in each of the preheating zone, the main heating zone, and the cooling zone according to a desired processing time condition. Has been.
- Patent Document 5 a cooling plate having a surface that can be in close contact with the heating plate is provided in a chamber that can be opened and closed.
- a soldering apparatus which is provided so as to be capable of moving back and forth with respect to a hot plate, and wherein a vacuum exhaust pump, a carboxylic acid vapor supply source and a non-oxidizing gas supply source are coupled to the chamber.
- Patent Documents 1 to 3 are not equipped with a cooling device, and the cooling after heating the soldering member is natural cooling, and it takes time to solidify the solder and the efficiency is low. There was a problem. Further, in the apparatus of Patent Document 4, each zone space of a preheating zone, a main heating zone, and a cooling zone is necessary, and there is a limit to downsizing the apparatus. Further, in the device of Patent Document 5, a soldering member is placed on a heating plate having a heating device such as a sheath heater and heated by contact-type heat conduction, and the sheath heater is energized. Even when stopped, there is a problem that the cooling efficiency of the cooling plate is deteriorated due to the remaining heat of the hot plate.
- a heating device such as a sheath heater and heated by contact-type heat conduction
- an object of the present invention is a heating / cooling apparatus capable of performing heating and cooling processing in one airtight processing chamber, which improves heating and cooling efficiency and reduces the size of the apparatus. It is to provide a heating and cooling device that can realize the above.
- a heating / cooling apparatus includes an airtight processing chamber having an opening / closing mechanism capable of inserting and removing a member to be processed, and at least one or more induction heating heating the member to be processed.
- An induction heating device comprising a coil; a cooling device for cooling the member to be treated; a temperature sensor for measuring the temperature of the member to be treated; and the induction heating device and the cooling based on the temperature measured by the temperature sensor
- a control device that controls the apparatus, and a moving device is provided that moves a member to be processed and / or a cooling unit of the cooling device to change a distance between the member to be processed and the cooling unit of the cooling device. It is characterized by that.
- the member to be processed disposed inside the airtight processing chamber is heated and cooled, the member is suitable for, for example, solder reflow processing in a reducing gas atmosphere and capable of induction heating. Therefore, even when the cooling device is placed in contact with or close to the member to be processed, it can be heated without being affected by the cooling device.
- the cooling device is separated from the member to be processed by the moving device to lower the cooling capacity, and the member to be processed can be rapidly heated.
- the temperature of the member to be processed is controlled with high accuracy by bringing the cooling device close to the member to be processed by the moving device and balancing heating and cooling. Can do. Further, when the temperature of the member to be processed is lowered, the cooling device can be brought into contact with the member to be processed by the moving device to be rapidly cooled.
- the above heating / cooling process can increase the heating / cooling efficiency and shorten the processing time, and the heating process and the cooling process can be performed continuously without moving the processing target member in the horizontal direction in the processing chamber.
- the device can be miniaturized.
- the induction heating coil is disposed below the member to be processed, and the induction heating coil and a cooling mechanism are integrated in the cooling unit.
- the cooling unit of the cooling device that cools the member to be processed has a structure in which the induction heating coil and the cooling mechanism are integrated, so that a member installation space in the processing chamber can be saved and the processing chamber can be downsized.
- the cooling mechanism forms a flow path through which the refrigerant can circulate by making the induction heating coil have a hollow structure.
- the refrigerant can be circulated using the induction heating coil as a flow path.
- the member to be treated and the induction heating coil can be efficiently cooled by circulating cooling water through the hollow structure.
- the heating / cooling apparatus of the present invention it is preferable to include a cooling plate that contacts the upper surface of the induction heating coil having the hollow structure during cooling.
- the cooling plate is separated from the member to be processed by the moving device, and the member to be processed can be heated by the induction heating coil. Further, when the temperature of the member to be processed is lowered, the member to be processed can be rapidly cooled by bringing the member to be processed into contact with the cooling plate by the moving device.
- a cooling plate positioned between the member to be processed and the induction heating coil, and a cooling medium that is disposed below the cooling plate as the cooling mechanism and into which the induction heating coil is immersed And preferably.
- the cooling plate can be cooled by circulating the refrigerant in the flow path. Thereby, at the time of cooling, a to-be-processed member can be cooled with the cooled cooling plate.
- the cooling plate is formed of a ceramic of silicon carbide, silicon nitride or aluminum nitride.
- the member to be processed can be heated even if the induction heating coil is disposed under the cooling plate. Further, when the heated member to be processed is brought into contact with the cooling plate, rapid cooling is possible by heat exchange with the cooling plate, and energy loss required for heating and cooling can be reduced.
- an insulating cover made of a heat-resistant insulating material that covers the surface of the induction heating coil.
- the insulating cover made of heat-resistant insulating material (ceramics, polytetrafluoroethylene resin, etc.) covers the surface so that the induction heating coil is not exposed, so that the conductive material is heated when the member to be treated is heated. It is possible to prevent the dust and foreign matter from accumulating on the induction heating coil and short-circuiting with the induction heating coil. Since the electric discharge which arises between electrically-conductive members can be prevented, a heating / cooling apparatus can be drive
- the cooling unit is disposed below the member to be processed, and the induction heating coil is disposed above the member to be processed.
- the heating efficiency is further increased.
- the cooling unit may be disposed below the member to be processed, and the induction heating coil may be disposed below the cooling unit.
- the control device is configured to determine an energizing current and a frequency supplied to the induction heating device, an inlet temperature and a flow rate of a refrigerant supplied to the cooling device, and a distance between the processing target member and the cooling plate.
- the induction heating device and the cooling device are controlled based on a temperature measured by a temperature sensor electromagnetically shielded from the induction heating coil.
- control device can control the induction heating device and the cooling device by accurately controlling the parameters related to heating and cooling by the electric signal. Moreover, since the temperature sensor is installed in a state where it is electromagnetically shielded from the induction heating coil, the temperature of the member to be processed can be accurately measured.
- an evacuation apparatus connected to the processing chamber, a reducing gas supply device for introducing a reducing gas into the processing chamber, and an inert gas supply device for introducing an inert gas into the processing chamber
- the control device controls the evacuation device, the reducing gas supply device, and the inert gas supply device.
- control device controls the evacuation device to evacuate the processing chamber, and then controls the reducing gas supply device to introduce the reducing gas into the processing chamber so that the surface of the member to be processed is Can be reduced. Further, since the control device controls the inert gas supply device to introduce the inert gas into the processing chamber and replaces it with the reducing gas, the processing chamber can be safely opened to the atmosphere.
- the heating / cooling apparatus includes a pressure gauge that measures an internal pressure of the processing chamber, and the control device controls the vacuum exhaust device to depressurize the processing chamber, and the processing chamber measured by the pressure gauge. It is preferable that the internal pressure is acquired and the internal pressure is converted into a maximum energization current from the parameter value of the energization current and frequency supplied to the induction heating device, and output control is performed.
- the control device acquires, for example, the reduced internal pressure of the processing chamber from the pressure gauge, performs calculation in consideration of the internal pressure and the heating position of the member to be processed, and induces no discharge in the processing chamber.
- the maximum energization current of the heating coil can be output immediately.
- the induction heating coil is preferably composed of one or a plurality of coils having a vertically long elliptical shape with a constriction at the center, and is arranged in parallel to the member to be processed. .
- such a shape of the coil can prevent heat from being concentrated near the center of the tray on which the member to be processed is placed. Thereby, for example, even if the main surface of the member to be processed has a rectangular shape, high thermal uniformity can be obtained.
- the heating / cooling apparatus of the present invention it is preferable to arrange two or more sets of the induction heating device and the cooling device in one processing chamber.
- all parts other than the induction heating coil and the cooling part can be shared. Further, by storing twice or more heating / cooling units as in the conventional case, heating and cooling of the member to be processed can be performed twice or more at a time, so that significant cost reduction and improvement in processing performance can be expected.
- the apparatus includes a pressing unit that presses the tray against the cooling unit that cools the tray on which the processing target member is placed in contact with the cooling unit.
- the pressing unit presses the tray against the cooling unit.
- the heating / cooling apparatus of the present invention it is possible to efficiently heat and cool the member to be processed by moving one or both of the member to be processed and the cooling unit of the cooling device by the moving device.
- FIG. 1 shows a schematic configuration diagram of the heating / cooling device 100.
- the heating / cooling device 100 includes an airtight processing chamber 4 having an opening / closing mechanism that allows the processing target member 1 to be taken in and out, a cooling unit 3a of the cooling device 3 disposed below the processing target member 1, and a cooling unit 3a.
- the induction heating coil 2a of the induction heating device 2 arranged below, the moving device 15 for changing the distance between the member 1 to be processed and the cooling unit 3a, and the temperature for measuring the temperature of the member 1 to be processed
- a sensor 5, a control device 6 for controlling the induction heating device 2 and the cooling device 3 based on the measured temperature, and an input device 7 for inputting a signal to the control device 6 are provided.
- the apparatus since the induction heating coil 2a and the cooling unit 3a are placed vertically with respect to the member 1 to be processed, the apparatus is compared with the case where the conventional heating unit and cooling unit are placed horizontally. The size can be greatly reduced.
- the processing chamber 4 is an airtight chamber composed of a lid portion 4a and a bottom portion 4b, and the lid portion 4a is supported by a shaft 9 extending from the opening / closing device 8, and together with the shaft 9 is indicated by an arrow in FIG. It moves up and down as shown, and can be opened and closed with respect to the bottom 4b.
- heat shield covers 10a and 10b Inside the upper surface of the lid 4a, heat shield covers 10a and 10b for reflecting the infrared radiation radiated from the member 1 to be processed and re-entering the member 1 can be attached.
- the heat shield covers 10 a and 10 b have a structure that does not hinder heating by the induction heating device 2.
- a vacuum exhaust device 11 is connected to the processing chamber 4 so that the processing chamber 4 can be evacuated. Further, a reducing gas supply device 12 and an inert gas supply device 13 are connected to the processing chamber 4, and a reducing gas or an inert gas can be supplied to the processing chamber 4.
- the induction heating device 2 includes an induction heating coil 2a and a power source 2b.
- Induction heating is a method in which an alternating current is applied to the induction heating coil 2a, an eddy current is generated in a conductive portion of the member 1 to be processed by changing the magnetic flux, and the member 1 is heated by Joule heat generation due to the eddy current.
- the structure is simple, the size can be reduced, and the apparatus can be installed in the processing chamber 4. Moreover, since there is no consumable part, there is no need for maintenance and it is suitable for continuous operation.
- the member to be treated 1 is made of a nonmagnetic material and a metal having low electrical resistance, such as copper, it is difficult to heat directly, so the member to be heated made of a material that is easily induction heated.
- the member to be heated is induction-heated by the induction heating coil 2a, and the member to be treated 1 can be indirectly heated by heat conduction from the heated member to be heated.
- the tray 1d made of the member to be heated is preferably made of metal or carbon having a high electric resistance, and the shape is not particularly limited. Note that the member to be heated is not necessarily provided with a dedicated member, and the same effect can be obtained by configuring the tray 1d with carbon or the like.
- the shape of the induction heating coil 2a is not particularly limited.
- the outer shape of the main surface, which is wound around a conducting wire and has a void in the center is a circular or vertically long elliptical plate, or the outer shape of the main surface has a constriction in the center.
- a bowl-shaped flat plate can be used.
- the cooling device 3 includes a cooling unit 3a, a heat exchanger 3b, a refrigerant pipe 3c that connects the cooling unit 3a and the heat exchanger 3b in a ring shape, a refrigerant in the refrigerant pipe 3c, and the cooling unit 3a and the heat exchanger 3b. And a flow rate adjusting valve 3e for adjusting the flow rate of the refrigerant to be circulated to the cooling unit.
- the heat exchanger 3b, the circulation pump 3d, and the flow rate adjusting valve 3e are installed outside the processing chamber 4, and the heat and the refrigerant flowing through the refrigerant pipe 3c through the pipe (not shown) and heat are supplied to the heat exchanger 3b.
- the operation method of the cooling device 3 is not particularly limited.
- the circulation pump 3d is always operated, and the flow of the refrigerant to the cooling unit 3a can be blocked or the flow rate can be controlled by the flow rate control valve 3e.
- the refrigerant circulation to the cooling unit 3a can be stopped.
- the flow rate of the refrigerant can be adjusted by the flow rate adjusting valve 3e together with the amount of AC power flowing through the induction heating coil 2a and / or its frequency.
- the supply of power to the induction heating coil 2a is stopped, the flow rate adjusting valve 3e is opened wide to increase the amount of refrigerant circulating to the cooling unit 3a, and the member 1 to be processed is rapidly cooled. it can.
- the cooling unit 3a can be configured by, for example, a plate-like member provided on the bottom 4b in the processing chamber 4 and provided with a refrigerant circulation channel.
- the material of the cooling part 3a is not specifically limited, What has heat resistance and is excellent in heat conduction is preferable.
- the cooling unit 3a is preferably an insulator that transmits magnetic flux so as not to be induction heated.
- silicon carbide, ceramics, quartz glass or the like can be used, and silicon carbide is particularly preferable because of its high thermal conductivity.
- the induction heating coil 2a is constituted by a hollow pipe
- the refrigerant pipe 3c is branched from the front side of the flow rate adjusting valve 3e on the discharge side of the circulation pump 3d, and the refrigerant is circulated through the induction heating coil 2a. Can be cooled.
- the moving device 15 drives a frame 15a that supports the member 1 to be processed, a plurality of lifting shafts 15b for lifting and lowering the frame 15a, a lifting base 15c to which the lifting shaft 15b is attached, and a lifting base 15c.
- the distance between the member 1 to be processed and the cooling unit 3a can be changed by moving the member 1 to be processed in the vertical direction.
- the elevating actuator 15d is contracted, the elevating base 15c is raised, and the member 1 supported by the frame 15a attached to the tip of the elevating shaft 15b is raised and separated from the cooling unit 3a.
- the elevating actuator 15d when the elevating actuator 15d is extended, the elevating base 15c is lowered, and the member 1 to be processed supported by the frame 15a attached to the tip of the elevating shaft 15b is lowered to contact the cooling unit 3a.
- the member 1 to be processed can be rapidly heated away from the cooling unit 3a.
- the temperature of the to-be-processed member 1 is controlled with high precision by making the cooling part 3a adjoin to the to-be-processed member 1 and balancing heating and cooling. Can do.
- the cooling member 3a can be brought into contact with the member 1 to be rapidly cooled.
- the moving device 15 may be a device that moves the cooling unit 3a without changing the position of the processing target member 1 and changes the distance between the processing target member 1 and the cooling unit 3a.
- the temperature sensor 5 is not particularly limited, and for example, a thermocouple, an infrared radiation thermometer, or the like can be used. However, it is preferable that the temperature sensor 5 is a sensor that is not affected by induction heating or has a structure that is electromagnetically shielded so as not to be directly induction heated. Among the above, the infrared radiation thermometer is a temperature sensor that is not affected by induction heating. When the temperature sensor 5 is a thermocouple, it is preferable that the core wire portion is covered with a sheath so that the core wire portion is not directly induction heated.
- the cooling unit 3a is affected by the low temperature, and therefore at least a gap is provided between the tip of the temperature sensor 5 and the cooling unit 3a.
- a plurality of temperature sensors may be provided. The reliability of temperature is increased by averaging the input values from a plurality of temperature sensors so that the deviation from the target value is minimized.
- the vacuum exhaust device 11 includes a pipe 11b having a valve 11a and a vacuum pump 11c.
- the vacuum pump 11c is not specifically limited, For example, a rotary pump, a diaphragm pump, a piston type pump etc. can be used. However, when exhausting the reducing gas, the vacuum pump 11c is preferably an explosion-proof type for safety.
- the reducing gas supply device 12 includes a pipe 12b having a valve 12a and a reducing gas cylinder 12c.
- a gas containing hydrogen, formic acid, formaldehyde, or the like can be used.
- the inert gas supply device 13 includes a pipe 13b having a valve 13a and an inert gas cylinder 13c.
- the inert gas for example, nitrogen, argon or the like can be used.
- the control device 6 includes at least a storage device including a RAM, a ROM, a magnetic disk, an optical disk, and the like, and an arithmetic device including a CPU, and is based on programs and data stored in the storage device. A control signal is sent to various devices by the arithmetic device.
- the control device 6 is connected to an input device 7 and a display device such as a display and a printer (not shown). Data stored in the storage device of the control device 6 can be input from an input device 7 connected to the control device 6.
- the data input from the input device 7 includes, for example, holding time t1, holding time t2, first target heating temperature T1, second target heating temperature T2, first target cooling temperature T3, second target cooling temperature T4, and the like. It is done.
- the temperature T of the processing target member 1 measured by the temperature sensor 5 is also input to the control device 6.
- the control device 6 is connected to the opening / closing device 8 and can move the lid portion 4a of the processing chamber 4 up and down by a control signal a. Moreover, the control apparatus 6 is connected to the power supply 2b of the induction heating apparatus 2, and can control the output of the induction heating coil 2a by the control signal b. For example, it is possible to control the frequency and current amount of AC power supplied to the induction heating coil 2a.
- the control device 6 is connected to the heat exchanger 3b of the cooling device 3 and can control the temperature of the refrigerant by a control signal c.
- the control device 6 is connected to the flow rate adjustment valve 3e of the cooling device 3, and can control the flow rate of the refrigerant by the control signal d.
- control apparatus 6 is connected to the valve 11a of the vacuum exhaust apparatus 11, and can open and close the valve 11a by the control signal e. Moreover, the control apparatus 6 is connected to the vacuum pump 11c of the vacuum exhaust apparatus 11, and can operate / stop the vacuum pump 11c by the control signal f.
- the control device 6 is connected to the valve 12a of the reducing gas supply device 12, and can open and close the valve 12a by a control signal g.
- the control apparatus 6 is connected to the valve 13a of the inert gas supply apparatus 13, and can open and close the valve 13a by the control signal h. Moreover, the control apparatus 6 is connected to the raising / lowering actuator 15d of the moving apparatus 15, and can change the distance between the to-be-processed member 1 and the cooling part 3a with the control signal i.
- control device 6 uses the current and frequency supplied to the induction heating coil 2a, the inlet temperature and flow rate of the refrigerant supplied to the cooling unit 3a, and the distance between the processed member 1 and the cooling unit 3a as parameters. 1 temperature can be controlled.
- the member 1 to be processed includes a semiconductor element 1a, an insulating substrate 1b having metal foil on both surfaces of the insulating plate, a base plate 1c, and a tray 1d.
- the semiconductor element is attached to a predetermined position of the metal foil on the upper surface of the insulating substrate through paste solder.
- the base plate 1c is attached to the metal foil on the lower surface of the insulating substrate 1b via paste solder.
- the tray 1d also serves as a conveying jig, and when placed on the cooling unit 3a, the lower surface of the tray 1d is in contact with the upper surface of the cooling unit 3a and the tip of the temperature sensor 5 embedded in the cooling unit 3a. It has become.
- the material of the tray 1d is not particularly limited, and an insulating material such as ceramics or quartz glass, or a high resistance material such as carbon can be used.
- the tray 1d is made of an insulating material
- the base plate 1c can be directly induction-heated by the transmitted magnetic flux.
- the tray 1d is made of a high resistance material
- the base plate 1c can be indirectly heated by heat conduction from the tray 1d that has been induction-heated. If comprised in this way, the to-be-processed member 1 can be heated uniformly, without depending on the material of the base board 1c.
- the tray 1d can appropriately change the shape of the tray 1d so that a plurality of base plates 1c can be conveyed and heated and cooled.
- a method for soldering a semiconductor module by the heating / cooling device 100 will be described.
- valve 11a of the vacuum exhaust device 11 is opened, the inside of the processing chamber 4 is evacuated by using the vacuum pump 11c, and the valve 11a is closed when a predetermined degree of vacuum is reached. However, when it is desired to reduce in a reduced pressure state, the valve 11a may be opened.
- valve 12a of the reducing gas supply device 12 is opened and the reducing gas is supplied from the reducing gas cylinder 12c to the processing chamber 4.
- the valve 12a is closed.
- the valve 12a can be kept open and balanced with the evacuation speed to maintain a predetermined pressure.
- the to-be-processed member 1 is heated to the 1st target heating temperature T1 using the induction heating apparatus 2, and the temperature T of the to-be-processed member 1 measured by the temperature sensor 5 over the holding time t1 is set to the 1st target heating temperature T1. And preheating the member 1 to be treated, reducing the surface of the member 1 to be treated, and improving the wettability of the solder.
- the member to be treated 1 is held with a gap by the moving device 15 so as not to contact the cooling unit 3a. If it does in this way, since it will become difficult to escape from the to-be-processed member 1 to the cooling part 3a, the to-be-processed member 1 can be heated rapidly.
- the first target heating temperature T1 is set to a temperature lower than the melting temperature of the solder. If the solder melts before the surface of the member to be treated 1 is sufficiently reduced, a soldering defect that causes a void in the joint is caused. For this reason, it is necessary to control the temperature so that the temperature T of the member 1 to be processed does not overshoot.
- the control device 6 can feedback control the output of the induction heating device 2 so as to minimize the deviation between the first target heating temperature T1 and the temperature T measured by the temperature sensor 5.
- the heating / cooling apparatus 100 is a method of directly heating the processing target member 1 as a heating element using the induction heating device 2, and thus has an advantage of a high heating rate, shortening the heating time, and heating The processing capacity of the cooling device can be increased.
- Second heating Second heating (solder melting)
- the to-be-processed member 1 is heated to the 2nd target heating temperature T2 using the induction heating apparatus 2, and the temperature T of the to-be-processed member 1 measured by the temperature sensor 5 over the holding time t2 is set to the 2nd target heating temperature T2.
- the solder of the member 1 to be processed is melted.
- the second target heating temperature T2 is set to a temperature higher than the melting temperature of the solder. If the setting of the second target heating temperature T2 is too high with respect to the solder melting temperature, the solid-phase reaction on the solder joint surface proceeds excessively, resulting in solder failure, and conversely, the setting of the second target heating temperature T2 is set to the solder melting temperature.
- the control device 6 can perform feedback control of the induction heating device 2 so as to minimize the deviation between the second target heating temperature T2 and the temperature T measured by the temperature sensor 5.
- control parameters the energization current and frequency supplied to the induction heating coil 2a, the inlet temperature and flow rate of the refrigerant supplied to the cooling unit 3a, and the distance between the member to be processed 1 and the cooling unit 3a can be controlled.
- Cooling (solder solidification) Heating by the induction heating device 2 is stopped, the processing target member 1 and the cooling unit 3a are brought into contact with or close to each other by the moving unit 15, and the processing target member 1 is cooled by the cooling unit 3a. Further, the control device 6 can feedback control the cooling device so that the deviation between the first target cooling temperature T3 and the temperature T measured by the temperature sensor 5 is minimized. Since the cooling unit 3a is made of a material that is not directly heated and does not increase in temperature, the processing target 1 can be quickly cooled, the cooling time can be shortened, and the processing capacity of the heating / cooling device can be increased.
- the heating / cooling apparatus of the present invention is capable of performing reduction treatment, solder melting treatment, and solder solidification treatment to increase solder wettability in one treatment chamber 4.
- the size is smaller than that of the conventional soldering apparatus.
- the cooling part 3a is arrange
- the to-be-processed member 1 from which height differs is processed continuously, since the induction heating coil 2a is arrange
- the distance from the coil 2a does not change. Therefore, readjustment of the height of the induction heating coil 2a is unnecessary, and workability can be improved.
- the semiconductor module which is the member 1 to be processed, is easily heated by the induction heating coil 2a, and the inner wall of the processing chamber 4 and the cooling unit 3a are difficult to be heated. Therefore, there is no waste in heating, and the semiconductor module is rapidly heated. Can be cooled quickly.
- any member can be directly induction-heated. It is a difficult member, and it is easier to perform indirect heating by heat conduction from a member to be heated that has been induction heated.
- the base plate 1c is placed on a tray 1d made of a carbon material and indirectly heated. It is preferable to do.
- the outer shape of the tray 1d is larger than the outer edge of the area where the plurality of base plates 1c are placed, and the outer shape of the induction heating coil 2a is larger than the outer shape of the tray 1d. preferable.
- the shape of the induction heating coil 2a used in the present invention is not particularly limited, and for example, the induction heating coil shown in the plan view of FIG. 2 can be used.
- the shape of the conducting wire is omitted, and only the outer shape of the winding bundle is shown.
- a tray 1d made of a member to be heated is illustrated as a rectangle.
- FIG. 2 (a) shows a flat plate-shaped induction heating coil 2aa in which the outer shape of a main surface that is wound with a conductive wire and has a void in the center is circular.
- FIG. 2B shows a plate-shaped induction heating coil 2ab in which the outer shape of the main surface that is wound with a conductive wire and has a void in the center is a vertically long ellipse.
- FIG. 2 (c) shows a flat induction heating coil 2ac in which the outer shape of a main surface which is wound with a conductive wire and has a void in the center is a vertically long ellipse (saddle shape) having a constriction S in the center.
- These induction heating coils may be a coil wound with an insulation-coated conductive wire, or may be a coil wound with a metal hollow pipe having good electrical conductivity. Even if it is hollow, the current flows on the metal surface, so there is no effect on the loss or heating performance.
- the high temperature part HT and the low temperature part LT when the tray 1d is induction-heated are schematically illustrated by hatching.
- the high temperature part HT is generated on the four sides of the tray 1d
- the low temperature part LT is generated on the four corners.
- the high temperature portion HT is generated along the center and the short side of the tray 1d.
- the temperature in the vicinity of the center of the tray 1d is likely to rise because it is heated simultaneously from the straight portions of the two vertically long elliptical coils.
- the saddle coil 2ac has a shape in which the central space and at least a part of the constriction S are arranged inside the outer periphery of the tray 1d. If it does in this way, the magnetic field line of an induction heating coil can be collected inside tray 1d, and tray 1d can be heated efficiently.
- the amount of heat generated at the point A of the tray 1d can be increased. Further, when the distance L2 from the outermost protruding edge of the saddle coil to the outer edge of the member to be processed is increased on the side having the constriction S of the saddle coil 2ac, the amount of heat generated at the point B of the tray 1d increases. Can be made.
- the distance L3 between the parallel saddle coils 2ac is preferably designed so that the amount of heat generated at the point A and the point B is approximately the same, and the heat uniformity of the tray 1d is adjusted. More preferably, a position adjusting device is provided.
- the distance L4 between the saddle-shaped coil 2ac and the tray 1d is preferably designed so as to obtain a heat generation difference between the outer periphery of the flat plate and the inner side that is appropriate for the heat dissipation of the outer periphery of the flat plate. More preferably, an adjusting device is provided.
- the winding direction of the adjacent saddle coil 2ac is the reverse winding direction. If comprised in this way, since the magnetic field produced by the two induction heating coils 2ac will work so that an eddy current may be strengthened, the tray 1d can be heated efficiently.
- the soft magnetic member 16 is provided below the adjacent saddle coil 2ac. If comprised in this way, the magnetic force line extended below one induction heating coil will be connected to the magnetic force line of the other saddle-shaped coil 2ac via the soft magnetic member 16, and the magnetic field produced on the lower side of the saddle-shaped coil 2ac will be upward. Can be reversed. Moreover, the distribution of the magnetic flux density on the tray 1d can be adjusted by adjusting the arrangement of the soft magnetic member 16 with respect to the saddle coil 2ac.
- the heating / cooling device of the present invention is not limited to the saddle coil, and even if the induction heating coil has other shapes, the position adjusting device, the induction heating coil, A position adjustment device capable of changing the distance L4 to the processing member 1 can be provided, and the winding direction of the adjacent induction heating coil is configured to be the reverse winding direction, and a soft magnetic member is disposed below the induction heating coil. Also good.
- induction heating coils In the above, an example in which two induction heating coils are arranged has been described. However, one induction heating coil may be provided, or two or more induction heating coils may be arranged in parallel.
- FIG. 4 shows a heating / cooling device 101 in which the cooling unit is a hollow induction heating coil 2a in which a flow path through which a refrigerant can circulate is formed, and serves both as a heating unit and a cooling unit.
- the moving device 15 can directly cool the tray 1d by bringing the tray 1d into contact with the induction heating coil 2a (cooling unit).
- the cross section of the induction heating coil 2a preferably has a flat surface in contact with the tray 1d. Specifically, a rectangular cross section having a hollow is preferable.
- the induction heating coil 2a serves as a heating part and a cooling part, it is installed. Space can be saved and the processing chamber can be downsized.
- the cooling unit includes a hollow induction heating coil 2 a in which a flow path through which a refrigerant can circulate is formed, and a cooling plate 3 f made of an insulating material disposed above the induction heating coil 2 a.
- a heating / cooling device 102 is shown which is constituted by a support plate 3g made of an insulating material disposed below the induction heating coil 2a and serves as both a heating unit and a cooling unit.
- the member 1 to be processed can be brought into contact with the cooling plate 3 f to directly cool the member 1 to be processed.
- the heat capacity of the cooling plate 3f is too large, the responsiveness at the time of heating and cooling deteriorates and the processing time becomes long. For this reason, it is desirable to stabilize the cooling capacity and temperature by balancing the heat absorption by the refrigerant circulation flow rate and the heat capacity of the cooling plate 3f.
- the induction heating coil 2a serves as both a heating unit and a cooling unit, the installation space can be saved and the processing chamber can be downsized.
- FIG. 6 shows another embodiment of the heating and cooling device according to the present invention.
- 6A shows a state in which the member to be processed 1 is separated from the cooling unit 3a
- FIG. 6B shows a state in which the member to be processed 1 is in contact with the cooling unit 3a.
- the heating / cooling device 103 includes two sets of induction heating coils 2a and a cooling unit 3a in one processing chamber, and can process two processed members 1 simultaneously. According to the said aspect, all except the induction heating coil 2a and the cooling part 3a can be shared, and the heating / cooling part twice the conventional can be accommodated, and cost reduction and processing performance can be improved.
- each set may be moved simultaneously by one elevating actuator 15d, but each set may be provided with the elevating actuator 15d and moved individually. If it can be moved individually, the distance between the member to be processed 1 and the cooling unit 3a can be individually adjusted, so that temperature control is facilitated.
- FIG. 7 shows another embodiment of the heating and cooling device according to the present invention.
- the non-contact induction heating coil 2 a of the induction heating device 2 is disposed above the processing target member 1, and the cooling unit 3 a of the cooling device 3 is disposed below the processing target member 1.
- Other structures are the same as those in the above embodiment (FIG. 1).
- the heating efficiency can be further increased.
- the refrigerant pipe 3c is branched from the front side of the flow rate control valve 3e on the discharge side of the circulation pump 3d, and the refrigerant flows through the induction heating coil 2a to cool the induction heating coil 2a. can do.
- FIG. 8 shows a modified form of the heating / cooling device 104 shown in FIG.
- the non-contact induction heating coil 2a is disposed below the cooling unit 3a of the cooling device 3. Therefore, the cooling unit 3a is disposed below the tray 1d on which the member 1 to be processed is placed, and the induction heating coil 2a is disposed further below the cooling unit 3a.
- Other structures are the same as those in the above embodiment.
- the induction heating coil 2a may be disposed above the processing target member 1 and below the cooling unit 3a. If comprised in this way, since the to-be-processed member 1 is heated from the upper and lower sides, higher soaking
- FIG. 9 shows another embodiment of the heating and cooling device according to the present invention.
- the induction heating coil 2a is housed in the refrigerant container 3h of the cooling device 3. Moreover, since the flow path through which the refrigerant circulates is formed in the refrigerant container 3h, the induction heating coil 2a is immersed in the refrigerant circulated through the flow path.
- the refrigerant container 3h is housed in a support base 3g 'that is open at the top, and is closed by a cooling plate 3f.
- a refrigerant inlet 3i and a refrigerant outlet 3j are provided at the bottom of the refrigerant container 3h.
- coolant for example, cooling water
- FIG. 9A shows a state when the member 1 is heated.
- an alternating current is passed through the terminal 2c of the induction heating coil 2a.
- the induction heating coil 2a on the right side of the temperature sensor 5 also has a terminal 2c (not shown), and an alternating current flows from the terminal 2c.
- the tray 1 d on which the member 1 to be processed is placed is connected to the lifting shaft 15 b of the moving device 15. During heating, the moving device 15 raises the tray 1d to a position at least 3 mm away from the cooling plate 3f, but the induction heating coil 2a generates an eddy current in the conductive portion of the member 1 to be processed.
- the member 1 to be processed can be heated by contact.
- FIG. 9B shows a state when the member 1 to be processed is cooled.
- the tray 1d is lowered by the moving device 15, and the tray 1d is brought into contact with the cooling plate 3f. Thereby, the member 1 to be processed is rapidly cooled by the cooling plate 3f.
- the circulating refrigerant in the refrigerant container 3h is in direct contact with the cooling plate 3f, the loss of cooling capacity is reduced.
- the shape restriction of the induction heating coil 2a is relaxed, and a sufficient number of turns can be secured, or a low-loss litz wire can be used.
- FIG. 10 shows another embodiment of the heating and cooling device according to the present invention.
- the heating / cooling device 107 is characterized by the moving device 15, particularly the portion where the tray 1d is placed.
- a lifting base 15c formed in a flat plate shape is connected to the lifting actuator 15d of the moving device 15.
- an elevating shaft 15b that is fixed to the elevating base 15c and penetrates the bottom 4b of the processing chamber 4 is provided so as to be movable in the vertical direction by the elevating bearing 15e on the bottom 4b.
- FIG. 10B is an enlarged view of the region R in FIG.
- a pedestal 15f is provided on the other end side of the lifting shaft 15b, and a pair of pedestals 15f of the two lifting shafts 15b shown in FIG. 10A are connected.
- a connecting plate 15g is attached so as to do this.
- a support portion 15h formed of a heat-resistant insulating material for example, engineering plastics such as ceramics, polyimide, peak plate, etc.
- a support portion 15h formed of a heat-resistant insulating material (for example, engineering plastics such as ceramics, polyimide, peak plate, etc.) that holds the bottom end portion of the tray 1d on which the processing target member 1 is placed is provided. It is fixed to the connecting plate 15g.
- the support portion 15h is formed so that the processed member 1 does not interfere with the cooling plate 3f or an insulating cover 2d described later when the processed member 1 is lowered by the moving device 15.
- the moving device 15 having such a configuration can smoothly operate the support portion 15h while holding the tray 1d when the elevating actuator 15d performs the elevating operation according to a command from the control device 6.
- This heating / cooling device 107 is also characterized by the cooling device 3.
- a cooling plate 3f for heat absorption of the processed member 1 and the tray 1d heated to a high temperature state by induction heating is closely attached so as to improve heat transfer. Is formed.
- the cooling plate 3f is preferably made of ceramics having high thermal conductivity (for example, SiC, AlN, etc.) so as to have a thickness larger than that of the member 1 to be processed, thereby increasing the heat capacity.
- a support plate 3g made of an insulating material (for example, plastic or ceramics) provided so as to fix the shape and position of the induction heating coil 2a.
- the induction heating coil 2a needs to be larger in size than the cooling plate 3f. The upper surface of the coil 2a is exposed.
- an insulating material having heat resistance for example, polytetrafluoroethylene resin, polyimide, machinable ceramics, etc.
- a notch is provided at the lower end of the cooling plate 3f so that there is no gap between the end of the cooling plate 3f and the end of the insulating cover 2d, and the tip of the insulating cover 2d is inserted into the notch of the cooling plate 3f. (See FIG. 10B).
- a spacer 2e formed of an insulating material is inserted between the pipes forming the induction heating coil 2a so that the discharge and short circuit are not caused when a current is passed through the induction heating coil 2a.
- FIG. 11 shows another embodiment of the heating and cooling device according to the present invention.
- the heating / cooling device 108 raises the tray 1d by the moving device 15 during heating, and heats the member 1 to be processed placed on the tray 1d by the induction heating coil 2a. At the time of cooling, the tray 1d is lowered by the moving device 15, and the tray 1d and the cooling plate 3f are brought into contact with each other. Thus, the heat of the tray 1d is conducted to the cooling plate 3f to release the heat, and the member 1 to be processed is cooled.
- the tray 1d may be warped due to thermal deformation, or the tray 1d may be bent due to the weight of the member 1 to be processed. In such a case, the contact area between the tray 1d and the cooling plate 3f may decrease, and sufficient cooling performance may not be obtained. If sufficient cooling performance cannot be obtained, the solder structure becomes coarse and cracks easily develop during creep deformation, and the long-term reliability of the solder joint strength decreases.
- the outer peripheral portion of the tray 1d is pressurized by the tray pressing mechanism 17, and the tray 1d is pressed against the cooling plate 3f. Thereby, the contact between the tray 1d and the cooling plate 3f can always be in a good state.
- a carbon material is often used for the tray 1d and is not strong in strength, and may be damaged. That is, if the tray 1d is forcibly pressed against the cooling plate 3f by the tray pressing mechanism 17, the tray 1d may be worn or damaged.
- the temperature of the tray 1d is observed by the temperature sensor 5 when the tray 1d is pressed against the cooling plate 3f. Furthermore, the cooling state can be grasped by observing the temperature of the cooling plate 3 f with the cooling plate temperature sensor 18.
- the control device 6 of the heating / cooling device 108 determines in real time whether or not the contact state between the tray 1d and the cooling plate 3f is good by the above method, and pushes the tray so that the tray 1d is pressed only when the contact state is bad.
- Control mechanism 17 (use signal line j). Thereby, it can be reduced that the tray pressing mechanism 17 presses the tray 1d more than necessary and is damaged.
- the heating / cooling device 108 can improve the contact state between the tray 1d and the cooling plate 3f and maintain a predetermined cooling characteristic. That is, it becomes possible to rapidly cool the member 1 to be processed, and it is possible to obtain a good solder joint state by suppressing the coarsening of the solder structure.
- the heating / cooling device 108 has substantially the same circuit configuration as the heating / cooling device 100 described with reference to FIG. 1, but includes a pressure gauge 19 that measures the pressure in the processing chamber 4, and releases the pressure in the processing chamber 4. The difference is that a discharge valve 20 and a discharge pipe 21 are provided.
- the control device 6 controls the discharge valve 20 connected to the discharge pipe 21 to release the pressure. Can do.
- the control device 6 opens and closes the release valve 20 via the signal line k to control the pressure in the processing chamber 4.
- control device 6 controls the opening / closing of the valve 11a and the operation of the vacuum pump 11c.
- the control device 6 includes an energizing current and a frequency supplied to the induction heating coil 2a, an inlet temperature and a flow rate of the refrigerant supplied to the hollow induction heating coil 2a, a pressure Pr in the processing chamber 4, the processed member 1 and the cooling plate 3f. As a parameter, the temperature of the member 1 can be controlled.
- soldering method of the power semiconductor device by the heating / cooling device 108 will be described focusing on differences from the soldering method of the heating / cooling device 100 described above.
- valve 12a of the reducing gas supply device 12 is opened and the reducing gas is supplied from the reducing gas cylinder 12c to the processing chamber 4.
- the release valve 20 is opened and the supply flow rate of the reducing gas is adjusted by the valve 12a.
- valve 12a When it is desired to reduce the processing chamber 4 under reduced pressure, the valve 12a is closed and the processing chamber 4 is sealed when the value of the pressure gauge 19 for measuring the pressure in the processing chamber 4 reaches a predetermined pressure.
- the pressure can be kept sealed.
- the to-be-processed member 1 is heated to the 1st target heating temperature T1 using the induction heating apparatus 2, and the temperature T of the to-be-processed member 1 measured by the temperature sensor 5 over the holding time t1 is set to the 1st target heating temperature T1.
- the surface of the member 1 to be treated is reduced to improve the wettability of the solder.
- the member to be treated 1 is held with a gap by the moving device 15 so as not to contact the cooling unit 3a. If it does in this way, since it will become difficult to escape from the to-be-processed member 1 to the cooling part 3a, the to-be-processed member 1 can be heated rapidly.
- the control device 6 can feedback control the output of the induction heating device 2 so as to minimize the deviation between the first target heating temperature T1 and the temperature T measured by the temperature sensor 5.
- the member 1 to be treated is held at the first target heating temperature T1, and when the holding time t1 has elapsed, the valve 12a and the release valve 20 of the reducing gas supply device 12 are closed. Further, the valve 11a of the vacuum exhaust device 11 is opened to start the operation of the vacuum pump 11c, the pressure in the processing chamber 4 is reduced until the pressure reaches Pr1, and the valve 11a is closed when the pressure reaches.
- control device 6 inputs the value of the pressure gauge 19 for the processing chamber 4 and the distance between the tray 1d on which the member 1 to be processed is placed and the cooling plate 3f. Then, the control device 6 converts and outputs the maximum energization current (electric power) that can be supplied to the induction heating coil 2a without causing discharge, and controls the heating until the second target heating temperature T2 is reached.
- maximum energization current electric power
- the discharge from the induction heating coil 2a changes depending on the product of the pressure and distance in the processing chamber 4 and the power supplied to the induction heating coil (Paschen's law).
- the maximum energization current (power) is adjusted so as to satisfy the conditions below the curve shown by Paschen's law.
- the second target heating temperature T2 is set to a temperature slightly higher than the liquidus temperature (TS) of the solder material of the member 1 to be processed, and the reducing gas in the processing chamber 4 is melted in a reduced pressure environment. Has the effect of suppressing the entanglement of solder in the solder.
- the induction member 2 is used to heat the member to be processed 1 to the third target heating temperature T3, and the temperature T of the tray 1d on which the member 1 to be processed is measured, which is measured by the temperature sensor 5, over the holding time t3. Is held at the third target heating temperature T3 to melt the solder of the member 1 to be processed.
- the third target heating temperature T3 is set to a temperature sufficiently higher than the liquidus temperature (TS) of the solder, and the molten solder material, the base plate 1c of the member 1 to be processed, the insulating substrate 1b, the insulating substrate 1b, and the semiconductor element 1a
- the temperature is set to a temperature at which the alloy layer on the solder joint surface is easy to grow.
- the control device 6 circulates the energization current, frequency, and refrigerant supplied to the induction heating coil 2a of the induction heating device 2 so as to minimize the deviation between the third target heating temperature T3 and the measured value T of the temperature sensor 5.
- the temperature and flow rate of the cooling circulation device and the distance between the tray 1d on which the member 1 to be processed is placed and the cooling plate 3f can be controlled.
- valve 12a of the reducing gas supply device 12 is opened and the pressure in the processing chamber 4 is controlled to reach atmospheric pressure.
- the opening of the valve 12a of the reducing gas supply device 12 is adjusted, a flow of reducing gas is created in the processing chamber 4, and the discharge valve 20 is opened so that the processing chamber 4 is not pressurized. .
- the control device 6 heats the member 1 to be processed to the third target heating temperature T3 and the pressure in the processing chamber 4 Depending on the distance between the tray 1d on which the member 1 is placed and the cooling plate 3f, the maximum energization current (electric power) supplied to the induction heating coil 2a of the induction heating device 2 is output while being converted, and the processed member 1
- the temperature T of the tray 1d can be controlled.
- the valve 12a and the release valve 20 of the reducing gas supply device 12 are closed, and the vacuum pump of the vacuum exhaust device 11 The operation of 11c and the valve 11a are opened, and the reducing gas in the processing chamber 4 is exhausted until a predetermined pressure is reached.
- the valve 11a When the inside of the processing chamber 4 reaches a predetermined pressure, the valve 11a is closed, the valve 12a of the reducing gas supply device 12 is opened, and the processing chamber 4 is returned to atmospheric pressure. When the atmospheric pressure is reached, the release valve 20 is opened again. By this operation, the gas existing in the solder of the member 1 to be processed is discharged, and voids in the solder joint portion are reduced.
- control device 6 controls the energizing current (power) and the frequency supplied to the induction heating coil 2a of the induction heating device 2 until the member 1 to be processed reaches the third target heating temperature T3 and reaches a predetermined holding time t4.
- the alloy layer on the solder joint surface of the member to be processed 1 can be maintained at a predetermined thickness.
- Cooling soldder solidification
- the heating by the induction heating device 2 is stopped, the processed member 1 and the cooling plate 3f are brought into contact with or close to each other by the moving device 15, and the processed member 1 is cooled by the cooling plate 3f.
- the control device 6 can feedback control the cooling device so as to minimize the deviation between the first target cooling temperature T4 and the temperature T measured by the temperature sensor 5. Since the cooling plate 3f is made of a material that is not directly heated and does not increase in temperature, the processing target 1 can be quickly cooled, the cooling time can be shortened, and the processing capacity of the heating and cooling device can be increased.
- the temperature T of the member 1 to be processed is measured by the temperature sensor 5 and when the second target cooling temperature T5 is reached, the valve 12a of the reducing gas supply device 12 is closed.
- the valve 11a of the vacuum exhaust device 11 is opened, and the inside of the processing chamber 4 is evacuated using the vacuum pump 11c.
- the valve 11a is closed, the valve 13a of the inert gas supply device 13 is opened, and the inert gas is supplied from the inert gas cylinder 13c to the processing chamber 4. Supply.
- the release valve 20 is opened to release the reducing gas into the release pipe 21. After a predetermined time has elapsed, the valve 13a and the release valve 20 are closed. During this time, the member 1 to be processed remains on the cooling plate 3f and is continuously cooled.
- the cooling plate 3f of the cooling device 3 is disposed below the processing target member 1 so as to contact the induction heating coil 2a in which the refrigerant circulates. That is, the reduction process, the solder melting process, and the solder solidification process for improving the solder wettability can be performed only by the raising / lowering operation in one processing chamber 4, so that the size is reduced as compared with the conventional soldering apparatus. Yes.
- the induction heating coil 2a is arrange
- the distance from the coil 2a does not change. Therefore, readjustment of the height of the induction heating coil 2a is unnecessary, and workability can be improved.
- the semiconductor module of the member 1 to be processed is easily heated by the induction heating coil 2a, and the inner wall of the processing chamber 4, the cooling part 3a, etc. are hardly heated, so there is no waste in heating, and the semiconductor module is rapidly heated. Can be cooled quickly.
- the heating / cooling device 106 having the refrigerant container 3h may be configured by combining each member in accordance with the application, such as adopting the tray pressing mechanism 17 or the like.
- fluid such as water, pure water, ultrapure water, antifreeze liquid, or the like that can be cooled by the heat exchanger 3b can be used as the refrigerant.
- a sealing member for example, an O-ring
- the lid 4a is lowered to the position of the bottom 4b by the opening and closing device 8, the sealing member of the elastic body is deformed, so that the airtight state in the processing chamber 4 can be maintained.
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Abstract
Description
開閉装置8によって処理室4の蓋部4aを上昇させて処理室4を開け、被処理部材1を搬入し、被処理部材1をフレーム15a上に載置した後、開閉装置8によって処理室4の蓋部4aを下降させて処理室4を閉じて、密閉する。
真空排気装置11の弁11aを開け、真空ポンプ11cを用いて、処理室4の内部を真空排気し、所定の真空度に到達したところで、弁11aを閉じる。ただし、減圧状態で還元したい場合は、弁11aは開けておいてもよい。
還元ガス供給装置12の弁12aを開けて、還元ガスボンベ12cから処理室4へ還元ガスを供給する。処理室4に所定圧力の還元ガスが供給されたところで、弁12aを閉じる。ただし、減圧状態で還元したい場合は、弁12aを開けたままとし、真空排気速度とバランスさせて、所定の圧力に保つことができる。
誘導加熱装置2を用いて、被処理部材1を第1目標加熱温度T1まで加熱し、保持時間t1に亘り、温度センサ5によって測定される被処理部材1の温度Tを第1目標加熱温度T1に保持して、被処理部材1を予熱すると共に、被処理部材1の表面を還元し、ハンダの濡れ性を高める。加熱に際して、被処理部材1は、冷却部3aと接触しないように移動装置15によって隙間を空けて保持されている。このようにすれば、被処理部材1から冷却部3aへ熱が逃げ難くなるので、被処理部材1を急加熱することができる。第1目標加熱温度T1は、ハンダの溶融温度よりも低い温度に設定されている。被処理部材1の表面が十分還元される前にハンダが溶融すると接合部にボイドを生じるハンダ付け不良になる。このため、被処理部材1の温度Tがオーバーシュートしないように温度制御する必要がある。制御装置6は、第1目標加熱温度T1と、温度センサ5が測定した温度Tとの偏差を最小にするように、誘導加熱装置2の出力をフィードバック制御することができる。
誘導加熱装置2を用いて、被処理部材1を第2目標加熱温度T2まで加熱し、保持時間t2に亘り、温度センサ5によって測定される被処理部材1の温度Tを第2目標加熱温度T2に保持して、被処理部材1のハンダを溶融させる。第2目標加熱温度T2は、ハンダの溶融温度よりも高い温度に設定されている。第2目標加熱温度T2の設定がハンダ溶融温度に対し高過ぎる場合は、ハンダ接合面おける固相反応が過剰に進んでハンダ不良となり、逆に第2目標加熱温度T2の設定をハンダの溶融温度に近づけ過ぎた場合は、加熱の面内ばらつきにより十分温度が上がりきらない場所で、ハンダが溶融せずハンダ不良になる危険性がある。このため、被処理部材1の温度Tを正確に測定し、且つ適正に温度制御する必要がある。制御装置6は、第2目標加熱温度T2と、温度センサ5が測定した温度Tとの偏差を最小にするように、誘導加熱装置2をフィードバック制御することができる。制御パラメータとして、誘導加熱コイル2aに供給する通電電流と周波数、冷却部3aに供給する冷媒の入口温度と流量、被処理部材1と冷却部3aとの距離を制御することができる。
誘導加熱装置2による加熱を止め、移動装置15により、被処理部材1と冷却部3aを接触又は近接させ、被処理部材1を冷却部3aによって冷却する。また、制御装置6は、第1目標冷却温度T3と、温度センサ5が測定した温度Tとの偏差を最小にするように、冷却装置をフィードバック制御することができる。冷却部3aは直接加熱されない材料で構成されており、温度上昇しないので、被処理部材1を速やかに冷却し、冷却時間を短縮して、加熱冷却機器の処理能力を高めることができる。
被処理部材1の温度Tは、温度センサ5によって測定され、第2目標冷却温度T4になったところで、還元ガス供給装置12の弁12aが閉じられている状態で、真空排気装置11の弁11aを開け、真空ポンプ11cを用いて、処理室4の内部を真空排気する。処理室4が所定の真空度に到達したところで弁11aを閉じ、不活性ガス供給装置13の弁13aを開けて、不活性ガスボンベ13cから処理室4へ不活性ガスを供給する。処理室4の圧力が大気圧に戻ったところで、弁13aを閉じる。この間も被処理部材1は、冷却部3aによって継続的に冷却されている。
開閉装置8によって処理室4の蓋部4aを上昇させて処理室4を開け、被処理部材1を搬出した後、開閉装置8によって処理室4の蓋部4aを下降させて処理室4を閉じる
以上説明したように、本発明の加熱冷却機器は、1つの処理室4内で、ハンダ濡れ性を高める還元処理、ハンダ溶融処理、ハンダ凝固処理を行うことができるようにしたので、従来のハンダ付け装置に比べ小型化されている。また、被処理部材1の下方に冷却部3aが配置され、冷却部3aの更に下方に誘導加熱装置2の誘導加熱コイル2aが配置されている。この実施形態によれば、高さの異なる被処理部材1を続けて処理する場合であっても、誘導加熱コイル2aが冷却装置3の下方に配置されているため、被処理部材1と誘導加熱コイル2aとの距離は変わらない。よって、誘導加熱コイル2aの高さの再調整が不要で、作業性を向上させることができる。また、誘導加熱コイル2aによって、被処理部材1である半導体モジュールだけが加熱され易く、処理室4の内壁、冷却部3aなどは加熱され難いので、加熱に無駄がなく、しかも半導体モジュールを急加熱、急冷却することができる。
開閉装置8によって処理室4の蓋部4aを上昇させて処理室4を開け、被処理部材1を搬入し、被処理部材1をフレーム15a上に載置した後、開閉装置8によって処理室4の蓋部4aを下降させて処理室4を閉じて、密閉する。
真空排気装置11の弁11aを開け、真空ポンプ11cを用いて、処理室4の内部を真空排気する。そして、圧力計19の値が所定の真空度に到達したところで、弁11aを閉じる。
還元ガス供給装置12の弁12aを開けて、還元ガスボンベ12cから処理室4へ還元ガスを供給する。処理室4の内圧が大気圧に到達したとき、放出弁20を開放すると共に、還元ガスの供給流量を弁12aで調整する。
誘導加熱装置2を用いて、被処理部材1を第1目標加熱温度T1まで加熱し、保持時間t1に亘り、温度センサ5によって測定される被処理部材1の温度Tを第1目標加熱温度T1に保持して被処理部材1を予熱すると共に、被処理部材1の表面を還元し、ハンダの濡れ性を高める。加熱に際して、被処理部材1は、冷却部3aと接触しないように移動装置15によって隙間を空けて保持されている。このようにすれば、被処理部材1から冷却部3aへ熱が逃げ難くなるので、被処理部材1を急加熱することができる。制御装置6は、第1目標加熱温度T1と、温度センサ5が測定した温度Tとの偏差を最小にするように、誘導加熱装置2の出力をフィードバック制御することができる。
誘導加熱装置2を用いて、被処理部材1を第3目標加熱温度T3まで加熱し、保持時間t3に亘り、温度センサ5によって測定される被処理部材1が載置されるトレイ1dの温度Tを第3目標加熱温度T3に保持して、被処理部材1のハンダを溶融させる。第3目標加熱温度T3は、ハンダの液相線温度(TS)より十分高い温度に設定し、溶融したハンダ材、被処理部材1のベース板1cや絶縁基板1b、絶縁基板1bと半導体素子1a間のハンダ接合面の合金層が成長しやすい温度にしている。
誘導加熱装置2による加熱を止め、移動装置15により、被処理部材1と冷却板3fを接触又は近接させ、被処理部材1を冷却板3fによって冷却する。また、制御装置6は、第1目標冷却温度T4と、温度センサ5が測定した温度Tとの偏差を最小にするように、冷却装置をフィードバック制御することができる。冷却板3fは直接加熱されない材料で構成されており、温度上昇しないので、被処理部材1を速やかに冷却し、冷却時間を短縮して、加熱冷却機器の処理能力を高めることができる。
被処理部材1の温度Tは、温度センサ5によって測定され、第2目標冷却温度T5になったところで、還元ガス供給装置12の弁12aが閉じられている状態で、真空排気装置11の弁11aを開け、真空ポンプ11cを用いて、処理室4の内部を真空排気する。処理室4用の圧力計19の値が所定の真空度に到達したところで弁11aを閉じ、不活性ガス供給装置13の弁13aを開けて、不活性ガスボンベ13cから処理室4へ不活性ガスを供給する。処理室4の圧力が大気圧に戻ったところで、放出弁20を開けて放出配管21に還元ガスを放出し所定時間の経過後、弁13a及び放出弁20を閉じる。この間も被処理部材1は冷却板3f上にあり、継続的に冷却されている。
開閉装置8によって処理室4の蓋部4aを上昇させて処理室4を開け、被処理部材1を搬出した後、開閉装置8によって処理室4の蓋部4aを下降させて処理室4を閉じる。
1a 半導体素子
1b 絶縁基板
1c ベース板
1d トレイ
2 誘導加熱装置
2a 加熱部(誘導加熱コイル)
2aa 主面の外形が円形である平板状の誘導加熱コイル(円形コイル)
2ab 主面の外形が縦長の楕円形である平板状の誘導加熱コイル(縦長楕円コイル)
2ac 主面の外形が瓢箪形である誘導加熱コイル(瓢箪形コイル)
2b 電源
2c 端子
2d 絶縁カバー
2e スペーサ
3 冷却装置
3a 冷却部
3b 熱交換器
3c 冷媒配管
3d 循環ポンプ
3e 流量調節弁
3f 冷却板
3g 支持板
3g’ 支持台
3h 冷媒容器
3i 冷媒導入口
3j 冷媒導出口
4 処理室
4a 蓋部
4b 底部
5 温度センサ
6 制御装置
7 入力装置
8 開閉装置
9 シャフト
10a、10b 遮熱カバー
11 真空排気装置
11a 弁
11b 配管
11c 真空ポンプ
12 還元ガス供給装置
12a 弁
12b 配管
12c 還元ガスボンベ
13 不活性ガス供給装置
13a 弁
13b 配管
13c 不活性ガスボンベ
15 移動装置
15a フレーム
15b 昇降シャフト
15c 昇降ベース
15d 昇降アクチュエータ
15e 昇降軸受け
15f 台座
15g 連結板
15h 支持部
16 軟磁性部材
17 トレイ押当機構
100~108 加熱冷却機器
A,B 温度参照位置
Pr 圧力
S 瓢箪形コイルの長手方向の中央のくびれ
T,T’ 温度
L1 瓢箪形コイルの長手方向の端部からトレイ外縁までの距離
L2 瓢箪形コイルのくびれSを有する側で、瓢箪形コイルの最も突出した外縁から被処理部材の外縁までの距離
L3 並列する誘導加熱コイルどうしの距離
L4 誘導加熱コイルとトレイとの距離
LT 低温部
HT 高温部
Claims (17)
- 被処理部材の出し入れが可能な開閉機構を有する気密性の処理室と、
前記被処理部材を加熱する、少なくとも1つ又は複数の誘導加熱コイルからなる誘導加熱装置と、
前記被処理部材を冷却する冷却装置と、
前記被処理部材の温度を計測するための温度センサと、
前記温度センサにより計測した温度に基づき前記誘導加熱装置及び前記冷却装置を制御する制御装置と、を備え、
前記被処理部材及び/又は前記冷却装置の冷却部を移動させて、前記被処理部材と前記冷却装置の冷却部との距離を変更する移動装置を設けたことを特徴とする加熱冷却機器。 - 前記誘導加熱コイルは、前記被処理部材の下方に配置され、
前記冷却部は、前記誘導加熱コイルと冷却機構が一体化していることを特徴とする請求項1に記載の加熱冷却機器。 - 前記冷却機構は、前記誘導加熱コイルを中空構造とすることで、冷媒が循環可能な流路を形成していることを特徴とする請求項2に記載の加熱冷却機器。
- 前記冷却部は、冷却時に前記中空構造の誘導加熱コイルの上面に当接する冷却板を備えることを特徴とする請求項3に記載の加熱冷却機器。
- 前記被処理部材と前記誘導加熱コイルの間に位置する冷却板と、
前記冷却機構として、前記冷却板の下方に配置され、前記誘導加熱コイルが浸る冷媒の流路と、を備えることを特徴とする請求項2に記載の加熱冷却機器。 - 前記冷却板は、炭化珪素、窒化珪素又は窒化アルミのセラミックスで形成されていることを特徴とする請求項4に記載の加熱冷却機器。
- 前記冷却板は、炭化珪素、窒化珪素又は窒化アルミのセラミックスで形成されていることを特徴とする請求項5に記載の加熱冷却機器。
- 前記誘導加熱コイルの表面を覆う、耐熱性のある絶縁性材料で形成された絶縁カバーを配置したことを特徴とする請求項1に記載の加熱冷却機器。
- 前記冷却部は、前記被処理部材の下方に配置され、
前記誘導加熱コイルは、前記被処理部材の上方に配置されていることを特徴とする請求項1に記載の加熱冷却機器。 - 前記冷却部は、前記被処理部材の下方に配置され、
前記誘導加熱コイルは、前記冷却部の下方に配置されていることを特徴とする請求項1に記載の加熱冷却機器。 - 前記制御装置は、前記誘導加熱装置に供給する通電電流と周波数、前記冷却装置に供給する冷媒の入口温度と流量、前記被処理部材と前記冷却板との距離をパラメータとし、前記誘導加熱コイルから電磁的に遮蔽された温度センサにより計測した温度に基づき前記誘導加熱装置及び前記冷却装置を制御することを特徴とする請求項4に記載の加熱冷却機器。
- 前記制御装置は、前記誘導加熱装置に供給する通電電流と周波数、前記冷却装置に供給する冷媒の入口温度と流量、前記被処理部材と前記冷却板との距離をパラメータとし、前記誘導加熱コイルから電磁的に遮蔽された温度センサにより計測した温度に基づき前記誘導加熱装置及び前記冷却装置を制御することを特徴とする請求項5に記載の加熱冷却機器。
- 前記処理室に接続された真空排気装置と、
還元ガスを前記処理室内へ導入する還元ガス供給装置と、
不活性ガスを前記処理室内へ導入する不活性ガス供給装置と、を備え、
前記制御装置は、前記真空排気装置、前記還元ガス供給装置及び前記不活性ガス供給装置を制御することを特徴とする請求項1に記載の加熱冷却機器。 - 前記処理室の内圧を計測する圧力計を備え、
前記制御装置は、前記真空排気装置を制御して前記処理室内を減圧し、前記圧力計で計測した該処理室の内圧を取得し、前記誘導加熱装置に供給する通電電流と周波数のパラメータ値から該内圧を最大通電電流に変換して出力制御することを特徴とする請求項13に記載の加熱冷却装置。 - 前記誘導加熱コイルは、中央にくびれを有する縦長の楕円形状をなす1つ又は複数のコイルからなり、前記被処理部材に対して平行に配置されていることを特徴とする請求項1に記載の加熱冷却機器。
- 前記誘導加熱装置及び前記冷却装置を1つの処理室に2セット以上配置したことを特徴とする請求項1に記載の加熱冷却機器。
- 前記被処理部材が載置されているトレイを前記冷却部に接触させて冷却する、前記トレイを前記冷却部に押し当てる押当部を備えることを特徴とする請求項1に記載の加熱冷却機器。
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CN116705669A (zh) * | 2023-08-04 | 2023-09-05 | 盛吉盛半导体科技(北京)有限公司 | 一种冷却效果均匀的半导体设备用加热灯盘及冷却方法 |
CN116705669B (zh) * | 2023-08-04 | 2023-10-20 | 盛吉盛半导体科技(北京)有限公司 | 一种冷却效果均匀的半导体设备用加热灯盘及冷却方法 |
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JP6418253B2 (ja) | 2018-11-07 |
US20170203377A1 (en) | 2017-07-20 |
KR102411595B1 (ko) | 2022-06-20 |
JPWO2016104710A1 (ja) | 2017-07-27 |
CN107112247B (zh) | 2019-09-20 |
DE112015004107T5 (de) | 2017-06-14 |
US10583510B2 (en) | 2020-03-10 |
CN107112247A (zh) | 2017-08-29 |
KR20170101185A (ko) | 2017-09-05 |
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