JP2009226482A - 太陽電池を接続するためのはんだ付け装置 - Google Patents
太陽電池を接続するためのはんだ付け装置 Download PDFInfo
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- JP2009226482A JP2009226482A JP2009051586A JP2009051586A JP2009226482A JP 2009226482 A JP2009226482 A JP 2009226482A JP 2009051586 A JP2009051586 A JP 2009051586A JP 2009051586 A JP2009051586 A JP 2009051586A JP 2009226482 A JP2009226482 A JP 2009226482A
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- 238000005476 soldering Methods 0.000 title claims abstract description 43
- 230000006698 induction Effects 0.000 claims abstract description 48
- 239000004020 conductor Substances 0.000 claims abstract description 32
- 238000003825 pressing Methods 0.000 claims abstract description 12
- 230000007935 neutral effect Effects 0.000 claims abstract description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 239000002826 coolant Substances 0.000 claims description 4
- 230000001939 inductive effect Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 10
- 238000013459 approach Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
- H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/002—Soldering by means of induction heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
- B23K3/0475—Heating appliances electric using induction effects, e.g. Kelvin or skin effects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/101—Using electrical induction, e.g. for heating during soldering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Sustainable Development (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Dermatology (AREA)
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- Sustainable Energy (AREA)
- Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
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- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- General Induction Heating (AREA)
Abstract
【解決手段】太陽電池(1、2、3)を接続するための本はんだ付け装置において、誘導法則で動作する熱源が、はんだ剤が設けられた太陽電池の導電トラック(4)を導体(7)と接続するように設けられ、熱源は高周波発生器とこの高周波電流が高周波磁界を生じさせる誘導ループ(21)とを有し、誘導ループは導電トラック及び導電トラックに沿って配置された導体に熱を発生させる渦電流を誘起する。U字状の誘導ループは、はんだ領域における熱の動きを最適化するのに役立つ狭窄部及び拡張部を有する。各拡張部は、磁界中立の押圧部(27)についてはんだ付け点への接近を生じ導電トラック上に導体を押圧する。誘導ループを用いて太陽電池の電池上側(5)及び下側(6)の導電トラックの全長が1つのはんだ付け作業で導体にはんだ付けされ得る。
【選択図】図3
Description
4 導電トラック
5 電池上側
6 電池下側
7 導体
8 電池列
10 はんだ付けヘッド
11 直線状ガイド
12 スタンド
13 スライド
14 モータ
15 ハウジング
16 接続ブロック
17 ガイドブロック
17.1 ドリル孔
18 調整スピンドル
18.1 調整ナット
19 板
21 誘導ループ
21.1 アーム
22 接続片
22.1 ドリル孔
22.2 水接続部
22.3 接触面
22.4 絶縁板
23 フィーダ要素
23.1、23.2 管
24 ループ要素
25 狭窄部
25.1 直線部
26 拡張部
26.1 弧状部
27 押圧部
28 ネジ又はボルト
28.1 ネジボルト
P1 矢印
Claims (8)
- 誘導法則で動作する熱源が、はんだ剤が設けられた太陽電池(1、2、3)の導電トラック(4)を導体(7)に接続する、太陽電池(1、2、3)を接続するためのはんだ付け装置であって、
熱源が、高周波発生器と、高周波発生器の高周波電流が高周波磁界を生じさせる誘導ループ(21)とを有し、誘導ループ(21)が、導電トラック(4)及び導電トラック(4)に沿って配置された導体(7)に、はんだ付け作業のために必要である熱を発生させる渦電流を誘起することを特徴とする、はんだ付け装置。 - 誘導ループ(21)が、U字の形状を有し、U字の少なくとも1つのアーム(21.1)が、波状に形成されていることを特徴とする、請求項1に記載のはんだ付け装置。
- 誘導ループ(21)が、拡張部(26)及び狭窄部(25)を有する高周波磁界及び高周波発生器の効果的で経済的な動作を効果的に最適化するのに役立つことを特徴とする、請求項2に記載のはんだ付け装置。
- 誘導ループ(21)が、冷却液が流れる管の形態をとることを特徴とする、請求項1から3のいずれか一項に記載のはんだ付け装置。
- 誘導ループ(21)の実効長が、設定可能であることを特徴とする、請求項1から4のいずれか一項に記載のはんだ付け装置。
- ネジ(28)又はボルト(28)が、拡張部(26)内に挿入され得、ネジ(28)又はボルト(28)が、その点において誘導ループ(21)を電気的に短絡していることを特徴とする、請求項5に記載のはんだ付け装置。
- 各拡張部(26)には、拡張部(26)を貫通して導電トラック(4)上に導体(7)を押圧する磁界中立の押圧部(27)が形成されていることを特徴とする、請求項1から6のいずれか一項に記載のはんだ付け装置。
- はんだ付けヘッド(10)には、導体(7)に接続されなければならない太陽電池(1、2、3)の導電トラック(4)の数と同一数の誘導ループ(21)が設けられており、太陽電池の全ての導電トラック(4)が、導体(7)に同時に全長に沿ってはんだ付けされることを特徴とする、請求項1から7のいずれか一項に記載のはんだ付け装置。
Applications Claiming Priority (2)
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US3816108P | 2008-03-20 | 2008-03-20 | |
US61/038,161 | 2008-03-20 |
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JP2009226482A true JP2009226482A (ja) | 2009-10-08 |
JP5420276B2 JP5420276B2 (ja) | 2014-02-19 |
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JP2009051586A Expired - Fee Related JP5420276B2 (ja) | 2008-03-20 | 2009-03-05 | 太陽電池を接続するためのはんだ付け装置 |
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US (1) | US8680444B2 (ja) |
EP (1) | EP2103373B1 (ja) |
JP (1) | JP5420276B2 (ja) |
CN (1) | CN101540353B (ja) |
AT (1) | ATE524265T1 (ja) |
ES (1) | ES2373755T3 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2012018110A1 (ja) * | 2010-08-06 | 2012-02-09 | アロニクス株式会社 | 太陽電池素子の接続装置 |
JP2012143805A (ja) * | 2011-01-14 | 2012-08-02 | Eco & Engineering Co Ltd | 加熱ヘッド、及びこれを用いた太陽電池素子の接続装置、太陽電池ストリングの接続装置 |
JP2012146895A (ja) * | 2011-01-14 | 2012-08-02 | Eco & Engineering Co Ltd | 太陽電池素子ストリングとバスバーの接続方法及び接続装置 |
JP2013069963A (ja) * | 2011-09-26 | 2013-04-18 | Alonics Ltd | 裏面接点型太陽電池素子の接続装置、及び加熱ヘッド |
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- 2008-04-17 AT AT08154725T patent/ATE524265T1/de active
- 2008-04-17 ES ES08154725T patent/ES2373755T3/es active Active
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2009
- 2009-03-05 JP JP2009051586A patent/JP5420276B2/ja not_active Expired - Fee Related
- 2009-03-19 CN CN2009101276361A patent/CN101540353B/zh not_active Expired - Fee Related
- 2009-03-20 US US12/408,054 patent/US8680444B2/en not_active Expired - Fee Related
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2012018110A1 (ja) * | 2010-08-06 | 2012-02-09 | アロニクス株式会社 | 太陽電池素子の接続装置 |
JP2012143805A (ja) * | 2011-01-14 | 2012-08-02 | Eco & Engineering Co Ltd | 加熱ヘッド、及びこれを用いた太陽電池素子の接続装置、太陽電池ストリングの接続装置 |
JP2012146895A (ja) * | 2011-01-14 | 2012-08-02 | Eco & Engineering Co Ltd | 太陽電池素子ストリングとバスバーの接続方法及び接続装置 |
JP2013069963A (ja) * | 2011-09-26 | 2013-04-18 | Alonics Ltd | 裏面接点型太陽電池素子の接続装置、及び加熱ヘッド |
WO2016104710A1 (ja) * | 2014-12-26 | 2016-06-30 | 富士電機株式会社 | 加熱冷却機器 |
JPWO2016104710A1 (ja) * | 2014-12-26 | 2017-07-27 | 富士電機株式会社 | 加熱冷却機器 |
KR20170101185A (ko) * | 2014-12-26 | 2017-09-05 | 후지 덴키 가부시키가이샤 | 가열 냉각 기기 |
US10583510B2 (en) | 2014-12-26 | 2020-03-10 | Fuji Electric Co., Ltd. | Heating and cooling device |
KR102411595B1 (ko) * | 2014-12-26 | 2022-06-20 | 후지 덴키 가부시키가이샤 | 가열 냉각 기기 |
Also Published As
Publication number | Publication date |
---|---|
EP2103373A1 (de) | 2009-09-23 |
EP2103373B1 (de) | 2011-09-14 |
ATE524265T1 (de) | 2011-09-15 |
ES2373755T3 (es) | 2012-02-08 |
CN101540353B (zh) | 2011-09-07 |
CN101540353A (zh) | 2009-09-23 |
JP5420276B2 (ja) | 2014-02-19 |
US8680444B2 (en) | 2014-03-25 |
US20090236328A1 (en) | 2009-09-24 |
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