MX2023005365A - Aparato de soldadura. - Google Patents

Aparato de soldadura.

Info

Publication number
MX2023005365A
MX2023005365A MX2023005365A MX2023005365A MX2023005365A MX 2023005365 A MX2023005365 A MX 2023005365A MX 2023005365 A MX2023005365 A MX 2023005365A MX 2023005365 A MX2023005365 A MX 2023005365A MX 2023005365 A MX2023005365 A MX 2023005365A
Authority
MX
Mexico
Prior art keywords
pair
cooling zone
rails
opening portion
gas
Prior art date
Application number
MX2023005365A
Other languages
English (en)
Inventor
Yuta Saito
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of MX2023005365A publication Critical patent/MX2023005365A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)

Abstract

Un aparato de soldadura que comprende una zona de enfriamiento, un respiradero superior e inferior, un pasaje externo, una unidad de soplado, un intercambiador de calor, un par de pasajes de desviación, y una placa de ventilación. Los respiraderos superior e inferior están provistos respectivamente por encima y por debajo de un par de rieles para transportar un sustrato en la zona de enfriamiento. El pasaje externo conecta los respiraderos superior e inferior fuera de la zona de enfriamiento. La unidad de soplado provoca que el gas en el pasaje externo fluya en el orden del respiradero superior, la zona de enfriamiento, y el respiradero inferior antes de devolver el gas de regreso al pasaje externo. El intercambiador de calor está provisto en una porción de la abertura inferior que se conecta al respiradero inferior en la zona de enfriamiento, para enfriar el gas que pasa a través de la porción de la abertura inferior. El par de pasajes de desviación envían respectivamente el gas por encima del par de rieles a la porción de la abertura inferior mientras se desvían de las ubicaciones del par de rieles. La placa de ventilación está provista en un espacio formado entre el par de pasajes de desviación. La placa de ventilación tiene una ranura para enviar el gas por debajo del par de rieles a la porción de la abertura inferior.
MX2023005365A 2020-11-12 2021-06-14 Aparato de soldadura. MX2023005365A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020188689 2020-11-12
PCT/JP2021/022533 WO2022102156A1 (ja) 2020-11-12 2021-06-14 はんだ付け装置

Publications (1)

Publication Number Publication Date
MX2023005365A true MX2023005365A (es) 2023-11-29

Family

ID=81600908

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2023005365A MX2023005365A (es) 2020-11-12 2021-06-14 Aparato de soldadura.

Country Status (8)

Country Link
US (1) US11865645B2 (es)
EP (1) EP4213600A4 (es)
JP (1) JP7128431B1 (es)
KR (1) KR102594816B1 (es)
CN (1) CN116547098A (es)
MX (1) MX2023005365A (es)
TW (1) TWI804011B (es)
WO (1) WO2022102156A1 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI769030B (zh) * 2021-07-28 2022-06-21 印能科技股份有限公司 翹曲抑制迴焊爐
DE102022129100A1 (de) * 2022-11-03 2024-05-08 Ersa Gmbh Wärmetauschermodul zur Anordnung an einer Lötanlage mit einem Filtervlies und Lötanlage mit Wärmetauschermodul

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5420930B2 (es) * 1973-09-03 1979-07-26
JP2794352B2 (ja) 1991-08-22 1998-09-03 エイテックテクトロン 株式会社 リフロー半田付け装置
US5172849A (en) * 1991-09-25 1992-12-22 General Motors Corporation Method and apparatus for convection brazing of aluminum heat exchangers
US5195673A (en) * 1991-09-25 1993-03-23 General Motors Corporation Method and apparatus for convection brazing of aluminum heat exchangers
US5172847A (en) * 1991-09-25 1992-12-22 General Motors Corporation Method and apparatus for convection brazing of aluminum heat exchangers
JP2709365B2 (ja) * 1992-03-16 1998-02-04 日立テクノエンジニアリング株式会社 ベーパーリフローはんだ付け装置
JP2559743Y2 (ja) 1992-04-15 1998-01-19 松下電工株式会社 リフロー炉におけるフラックス除去兼プリント配線板冷却装置
US5271545A (en) * 1993-03-31 1993-12-21 Seco/Warwick Corporation Muffle convection brazing/annealing system
US5440101A (en) * 1993-04-19 1995-08-08 Research, Incorporated Continuous oven with a plurality of heating zones
JP3445356B2 (ja) 1994-06-03 2003-09-08 株式会社タムラ製作所 はんだ付け基板の冷却装置
US5611476C1 (en) * 1996-01-18 2002-02-26 Btu Int Solder reflow convection furnace employing flux handling and gas densification systems
JPH10200253A (ja) 1997-01-08 1998-07-31 Sanyo Electric Co Ltd リフロー炉
JPH1154903A (ja) * 1997-07-31 1999-02-26 Fujitsu Ltd リフローソルダリング方法及びリフロー炉
DE29902957U1 (de) * 1998-03-10 1999-06-10 Heraeus Noblelight Gmbh Reflow-Lötofen
JP4041628B2 (ja) * 1998-10-13 2008-01-30 松下電器産業株式会社 加熱装置と加熱方法
US6129258A (en) * 1999-02-16 2000-10-10 Seco/Warwick Corporation Muffle convection brazing and annealing system and method
CN2433040Y (zh) * 2000-07-04 2001-06-06 张敏 具废气回收装置的回焊机
US6382500B1 (en) * 2000-08-22 2002-05-07 Advanced Micro Devices, Inc. Solder reflow furnace with flux effluent collector and method of preventing flux contamination
US6386422B1 (en) * 2001-05-03 2002-05-14 Asm Assembly Automation Limited Solder reflow oven
GB2375975B (en) * 2001-05-30 2005-07-20 Philip Arthur Mullins Filtering apparatus
JP2003225761A (ja) * 2001-11-28 2003-08-12 Oak Nippon Co Ltd 金属製ワークピースのコンベクション式ろう付け装置
JP2003181682A (ja) 2001-12-20 2003-07-02 Tamura Seisakusho Co Ltd はんだ付け用冷却装置
US6749655B2 (en) * 2002-04-17 2004-06-15 Speedline Technologies, Inc. Filtration of flux contaminants
JP2004195476A (ja) 2002-12-16 2004-07-15 Tamura Seisakusho Co Ltd はんだ付け用冷却装置およびリフロー装置
TW200526100A (en) * 2004-01-16 2005-08-01 Senju Metal Industry Co Reflow furnace
JP4100578B2 (ja) * 2005-08-23 2008-06-11 千住金属工業株式会社 リフロー炉
JP2007273571A (ja) * 2006-03-30 2007-10-18 Tamura Furukawa Machinery:Kk リフロー炉
JP5087987B2 (ja) 2007-05-11 2012-12-05 トヨタ紡織株式会社 車両用シート
JP5075806B2 (ja) * 2008-12-25 2012-11-21 有限会社ヨコタテクニカ リフロー半田付け装置
CN102652044B (zh) 2009-12-11 2015-06-10 千住金属工业株式会社 回流炉
JP5540680B2 (ja) 2009-12-11 2014-07-02 千住金属工業株式会社 リフロー炉
KR101268319B1 (ko) * 2011-02-18 2013-05-28 주식회사 티에스엠 리플로우 납땜장치
CN103648700A (zh) * 2011-09-15 2014-03-19 富士通通讯网络株式会社 回流焊接装置及方法
WO2013098882A1 (ja) 2011-12-27 2013-07-04 株式会社大門 給水配管用プラグ
CN103379801A (zh) * 2012-04-27 2013-10-30 鸿富锦精密工业（深圳）有限公司 散热装置
JP5541354B1 (ja) * 2012-12-28 2014-07-09 千住金属工業株式会社 気体吹き出し孔の配列構造及びはんだ付け装置
CN105408046B (zh) * 2013-07-23 2017-07-21 千住金属工业株式会社 软钎焊装置和真空软钎焊方法
JP6418253B2 (ja) * 2014-12-26 2018-11-07 富士電機株式会社 加熱冷却機器
JP6502909B2 (ja) 2016-10-26 2019-04-17 株式会社タムラ製作所 リフロー装置
JP6642386B2 (ja) * 2016-11-18 2020-02-05 株式会社デンソー リフロー装置およびそれを用いた基板の製造方法
CN108115239B (zh) * 2016-11-29 2021-08-10 张跃 以气体为介质进行加热/冷却的钎焊炉及其工作方法
CN106793563B (zh) 2016-12-14 2023-07-28 深圳市新迪精密科技有限公司 Pcb板表面装贴焊接的冷却装置
CN108237296A (zh) * 2016-12-26 2018-07-03 上海朗仕电子设备有限公司 一种带平板式盘管的回流焊炉冷却模组
US10537031B2 (en) * 2017-03-22 2020-01-14 Service Support Specialties, Inc. Reflow soldering apparatus, system and method
JP6746673B2 (ja) * 2018-01-29 2020-08-26 株式会社タムラ製作所 気体浄化装置及び搬送加熱装置
KR20200125651A (ko) * 2018-03-09 2020-11-04 가부시키가이샤 오리진 플럭스, 솔더 페이스트, 납땜 프로세스, 납땜 제품의 제조 방법, bga 패키지의 제조 방법
CN110385497A (zh) * 2018-04-20 2019-10-29 伊利诺斯工具制品有限公司 回流焊炉和回流焊炉中的调温单元
CN110385496B (zh) * 2018-04-20 2022-09-30 伊利诺斯工具制品有限公司 回流焊炉及其操作方法
CN110871299A (zh) * 2018-08-29 2020-03-10 伊利诺斯工具制品有限公司 回流焊炉的降温系统
CN112935450A (zh) * 2019-12-10 2021-06-11 伊利诺斯工具制品有限公司 回流焊炉

Also Published As

Publication number Publication date
JP7128431B1 (ja) 2022-08-31
EP4213600A4 (en) 2024-05-29
TWI804011B (zh) 2023-06-01
KR102594816B1 (ko) 2023-10-26
US11865645B2 (en) 2024-01-09
EP4213600A1 (en) 2023-07-19
TW202233334A (zh) 2022-09-01
JPWO2022102156A1 (es) 2022-05-19
US20230356314A1 (en) 2023-11-09
WO2022102156A1 (ja) 2022-05-19
CN116547098A (zh) 2023-08-04
KR20230058185A (ko) 2023-05-02

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