WO2021103147A1 - 覆晶薄膜及显示装置 - Google Patents

覆晶薄膜及显示装置 Download PDF

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Publication number
WO2021103147A1
WO2021103147A1 PCT/CN2019/124522 CN2019124522W WO2021103147A1 WO 2021103147 A1 WO2021103147 A1 WO 2021103147A1 CN 2019124522 W CN2019124522 W CN 2019124522W WO 2021103147 A1 WO2021103147 A1 WO 2021103147A1
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Prior art keywords
pins
alignment
chip
longitudinal
pad
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PCT/CN2019/124522
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English (en)
French (fr)
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李继龙
王月
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TCL China Star Optoelectronics Technology Co Ltd
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TCL China Star Optoelectronics Technology Co Ltd
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Publication of WO2021103147A1 publication Critical patent/WO2021103147A1/zh
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements

Definitions

  • This application relates to the field of display technology, and in particular to a flip chip film and a display device.
  • a chip on film (COF) carrying a driving chip is bound and connected to an input terminal of the display panel to realize the control of the display function of the display panel by the driving chip. Therefore, output pins are provided on the flip chip film, and bonding pads corresponding to the output pins are provided on the display panel.
  • the bonding process of the chip-on-chip film and the display panel it has always been a problem in the field to ensure the accurate alignment of the output pins and the bonding pad. Since the bonding process requires the use of thermal compression, the chip-on-film and The display panel will inevitably be thermally expanded to cause a change in the output pin spacing. If there is a deviation in the alignment process, it is easy to have a misaligned connection between the output pin and the bonding pad, which will cause the display panel to function abnormally.
  • This application provides a flip chip film, including:
  • the pin area is arranged on the substrate, and the pin area includes a plurality of longitudinal pins for binding and connection and lateral pins for alignment, and the lateral pins are arranged on the longitudinal pins On one side, and is disconnected from the longitudinal pin for insulation.
  • the substrate is a polyimide substrate.
  • the plurality of longitudinal pins are arranged side by side along the transverse direction.
  • the extension direction of the lateral pins is perpendicular to the extension direction of the longitudinal pins.
  • the chip-on-chip film in the application further includes a chip area disposed on the substrate, and the chip area is disposed adjacent to the pin area.
  • the wafer area of the application includes a driving chip, and the driving chip is electrically connected to the vertical pins and used to send control signals to the vertical pins.
  • the lateral pin is a single pin.
  • the spacing between every two adjacent longitudinal pins is the same; the lateral pins are single pins.
  • the vertical pin closest to the horizontal pin is defined as the first vertical pin, and the distance between the horizontal pin and the first vertical pin is equal to The distance between two adjacent longitudinal pins is the same.
  • the length of the horizontal lead is the sum of the width of the two longitudinal leads and the distance between two adjacent longitudinal leads.
  • the horizontal pins and the vertical pins are both rectangular pins.
  • the horizontal pins and the vertical pins are both made of metallic copper.
  • the present application also provides a display device, including the above-mentioned flip chip film, and
  • a display panel with a binding area including a binding pad and an alignment pad
  • binding pads There are a plurality of the binding pads, and they are arranged side by side along the horizontal direction, and the binding pads and the longitudinal pins are bound and connected in a one-to-one correspondence;
  • An alignment gap is provided on the alignment pad, and the horizontal pins are arranged in the alignment gap to ensure alignment and binding of the binding pad and the longitudinal pins.
  • the display panel includes a plurality of the bonding regions, and each of the bonding regions is bonded and connected to one of the flip chip films.
  • the alignment pad is disposed on one side of the binding pad, and the alignment pad and the binding pad extend in the same direction.
  • the alignment pad includes two alignment pads arranged in a longitudinal direction, and the alignment gap is provided at the same position in the middle of the two alignment pads.
  • the dimension of the alignment notch in the longitudinal direction is greater than or equal to the dimension of the horizontal pin in the longitudinal direction, so as to ensure that the horizontal pin is disposed in the alignment notch.
  • the width of a single binding pad is the same as the width of a single alignment pad.
  • the alignment pad is grounded, the binding pad is electrically connected to the display unit of the display panel, and the width of a single binding pad is greater than or equal to a single vertical pin The width.
  • the present application also provides a display device, including a flip chip film and a display panel;
  • the flip chip film includes a substrate and a pin area provided on the substrate; the pin area includes a plurality of longitudinal pins for bonding and connection and a single lateral pin for alignment.
  • the pins are arranged on one side of the longitudinal pins and are insulated from the longitudinal pins; the spacing between every two adjacent longitudinal pins is the same; the length of the lateral pins is two The sum of the width of each of the longitudinal pins and the distance between two adjacent longitudinal pins;
  • the display panel includes a binding area, the binding area includes a binding pad and an alignment pad; there are a plurality of binding pads, and they are arranged side by side in a horizontal direction, and the binding pad is the same as the longitudinal pin A corresponding binding connection; the alignment pads include two longitudinally arranged, and the two alignment pads are provided with alignment gaps in the same position in the middle, and the horizontal pins are arranged in the alignment gaps, To ensure that the binding pad and the longitudinal pins are aligned and bound.
  • the present application provides a chip-on-chip film and a display device using the chip-on-chip film.
  • the display device further includes a display panel.
  • the display panel is provided with an alignment pad, and the alignment pad is provided with an alignment notch.
  • the chip-on-chip film is provided with lateral pins, and by arranging the lateral pins in the alignment gaps, the display panel and the chip-on-chip film can be accurately aligned and connected; in addition, the cover
  • the horizontal and vertical pins on the crystal film are disconnected and insulated, which can prevent electrical contact between the horizontal pins and the components of the display panel during the bonding process or after the process is completed, which may cause the vertical pins to function abnormally , Improve the production yield and reliability of the display device.
  • FIG. 1 is a schematic diagram of the structure of a flip chip film provided by an embodiment of the present application
  • FIG. 2 is a schematic structural diagram of a display device provided by an embodiment of the present application.
  • FIG. 3 is a schematic diagram of the structure of a display panel provided by an embodiment of the present application.
  • the embodiment of the present application provides a chip on film.
  • the chip on film is realized by arranging horizontal pins that are disconnected from the vertical pins on one side of the vertical pins of the chip on film, and implementing the chip on films by using the horizontal pins.
  • the accurate alignment with the display panel solves the problem of difficulty in alignment in the bonding process of the flip chip film and the display panel in the prior art.
  • FIG. 1 it is a schematic structural diagram of a chip on film 10 provided by an embodiment of the present application.
  • the chip on film 10 includes a substrate 11 and a pin area 12 provided on the substrate 11.
  • the substrate 11 may be a flexible substrate, such as a polyimide substrate, etc., for carrying various components on the chip on film 10.
  • the pin area 12 includes a vertical pin 121 and a horizontal pin 122; wherein the vertical pin 121 is used to bind and connect with the input terminal of the display panel to transmit a control signal to the display panel, and the horizontal pin 122 serves as an alignment mark to ensure that the vertical pin 121 is accurately aligned with the input terminal of the display panel.
  • the horizontal pin 122 is arranged on one side of the vertical pin 121 and is insulated from the vertical pin 121.
  • the plurality of longitudinal pins 121 are arranged side by side in the transverse direction, and the spacing between every two adjacent longitudinal pins 121 is the same;
  • the transverse pin 122 is a single pin, which is arranged in all One side of the longitudinal pin 121, and its extending direction is perpendicular to the longitudinal pin 121.
  • one of the longitudinal pins 121 closest to the lateral pins 122 is defined as a first longitudinal pin 121', and the lateral pins 122 are disconnected and insulated from the first longitudinal pins 121' And a fixed gap is formed between the two.
  • the length of the gap is equal to the distance between the two adjacent longitudinal pins 121 to ensure that when the chip on film 10 is bound to the display panel, the The lateral pins 122 can accurately coincide with the corresponding positions of the display panel, thereby ensuring the binding accuracy.
  • the length of the horizontal pin 122 is the sum of the width of the two vertical pins 121 and the distance between two adjacent vertical pins 121, that is, the length of the horizontal pin 122
  • the horizontal pins 122 and the vertical pins 121 are both long-directional pins, and the horizontal pins 122 and the vertical pins 121 are both made of metal copper, so as to realize the horizontal
  • the pins 122 and the vertical pins 121 are prepared through the same manufacturing process, which is beneficial to improve the production efficiency of the chip on film 10.
  • the flip chip film 10 further includes a wafer area 13 arranged on the substrate 11, the wafer area 13 is arranged adjacent to the lead area 12; a driving chip is arranged in the wafer area 13, so The driving chip is electrically connected to the vertical pin 121 for transmitting control signals to the vertical pin 121.
  • the chip on film 10 provided by the embodiment of the present application divides the pin area into longitudinal pins for bonding and connection and lateral pins for positioning, which can ensure that the chip on film 10 is bonded and connected to the display panel.
  • the vertical pins are accurately aligned and connected with the corresponding pins on the display panel, which avoids display panel abnormalities caused by misalignment binding; at the same time, the horizontal pins and the vertical pins are disconnected and insulated. Preventing electrical contact between the horizontal pins and the components of the display panel during the bonding process or after the process is completed, causing the vertical pins to function abnormally.
  • An embodiment of the present application also provides a display device 30.
  • the display device 30 includes the flip chip film 10 and the display panel 20 provided in the foregoing embodiment.
  • the structural features of the chip-on-chip film 10 have been described in detail in the foregoing embodiment, and will not be repeated here. It should be noted that the chip-on-chip film included in the display device 30 provided in this embodiment can be implemented as described above. Any of the flip-chip films provided in the examples.
  • the display panel 20 includes at least one bonding area 21, and the bonding area 21 is connected to the pin area 12 on the flip chip 10 (see FIG. 1) Corresponding settings. It should be understood that the display panel 20 may include a plurality of bonding regions 21, and each of the bonding regions 21 may be bonded and connected to one of the flip-chip films 10, so as to realize that the plurality of flip-chip films are connected to the display panel. Combination control of functions.
  • a binding pad 211 and an alignment pad 212 are arranged in the binding area 21, and the alignment pad 212 is arranged on one side of the binding pad 211.
  • the bonding pad 211 includes a plurality of bonding pads arranged side by side along the transverse direction, and each of the bonding pads 211 is bonded and connected to a longitudinal pin 121 on the chip-on-chip film 10, thereby realizing the chip-on-chip film 10
  • the electrical connection between 10 and the display panel 20 achieves the purpose of controlling the display function of the display panel 20 through the driving chip on the flip chip film 10.
  • the alignment pad 212 is arranged on one side of the binding pad 211, and the alignment pad 212 and the binding pad 211 extend in the same direction, and both extend in the longitudinal direction; the alignment pad 212 is arranged There is an alignment notch 212a, and the alignment notch 212a is used to match the lateral pins 122 on the chip-on-chip 10 to ensure that the bonding pad 211 is accurately aligned and bound to the longitudinal pins 121 .
  • the alignment pad 212 includes two pieces arranged in the longitudinal direction, and the alignment gap 212a is arranged at the same position in the middle of the two alignment pads 212, and the dimension of the alignment gap 212 along the longitudinal direction It is greater than or equal to the dimension of the lateral pin 122 along the longitudinal direction, thereby forming a notch channel extending along the lateral direction, so as to ensure that the lateral pin 122 can be disposed in the aligning notch 212a.
  • the alignment pad 212 is grounded. It should be noted that when the chip-on-chip 10 and the display panel 20 are bonded and connected, a thermocompression bonding process is required. By grounding the alignment pad 212, the accumulation during the thermocompression bonding process can be reduced. The heat is conducted and dispersed through the alignment pad 212 in time to prevent the alignment pad 212, the binding pad 211, the longitudinal pins 121, and the lateral pins 122 from warping due to heat during the hot pressing process .
  • the alignment pad 212 and the lateral pins 122 do not participate in the transmission of control signals, and only play a role of alignment, and the alignment The grounding arrangement of the pad 212 can also play a role in heat dissipation.
  • the lateral pins 122 and the alignment pads 212 partially overlap, resulting in The horizontal pins 122 are connected to the ground.
  • the embodiment of the present application provides an insulating arrangement for the horizontal pins 122 and the vertical pins 121 in the flip chip film 10 to be disconnected, therefore, even if the horizontal pins 122 are connected to the ground, it will not cause The control signal transmitted on the longitudinal pin 121 is abnormal.
  • the bonding pad 211 is electrically connected to the display unit of the display panel 20 (shown in the figure) to realize the flip chip
  • the driving chip on the film 10 controls the display unit of the display panel 20.
  • the width of the binding pad 211 is greater than or equal to the width of the longitudinal pin 121 to reduce the difficulty of the alignment of the binding pad 211 and the longitudinal pin 121.
  • the binding pad 211 and the alignment pad 212 are both rectangular, and both the binding pad 211 and the alignment pad 212 are made of metal copper, and both have the same width. It should be understood that the above arrangement of the binding pad 211 and the alignment pad 212 can simplify the manufacturing process and improve production efficiency.
  • the display device provided by the embodiment of the present application includes a display panel and a chip-on-chip film bonded and connected to the display panel, the display panel is provided with an alignment pad, the alignment pad is provided with an alignment notch, the The chip-on-chip film is provided with lateral pins.
  • the cover The horizontal pins on the crystal film are insulated from the vertical pins, which can prevent electrical contact between the horizontal pins and the components of the display panel during the bonding process or after the process is completed, which may cause the vertical pins to function abnormally. Improve the production yield and reliability of display devices.

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract

一种覆晶薄膜（10）及显示装置（30），所述覆晶薄膜（10）包括基板（11）及设置于所述基板（11）上的用于绑定连接的纵向引脚（121）和用于对位的横向引脚（122），且所述纵向引脚（121）与所述横向引脚（122）断开绝缘设置；所述显示装置（30）包括上述覆晶薄膜（10）和显示面板（20），所述显示面板（20）上具有绑定垫（211）和对位垫（212），所述对位垫（212）上设置有对位缺口（212a），所述横向引脚（122）设置于所述对位缺口（212a）中，所述绑定垫（211）与所述纵向引脚（121）对位绑定连接。覆晶薄膜（10）和显示装置（30）可以实现二者的准确对位连接，提高生产的良率和可靠性。

Description

覆晶薄膜及显示装置
本申请要求于2019年11月26日提交中国专利局、申请号为201911169511.5、发明名称为“覆晶薄膜及显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示技术领域，尤其涉及一种覆晶薄膜及显示装置。
背景技术
随着显示技术的发展，特别是手机、平板电脑等手持式显示设备的普及，用户对产品解析度的要求越来越高，高解析度意味着相同尺寸下的布线密度更高，对模组绑定制程的精度要求越高。
在现有技术中，通过将承载有驱动芯片的覆晶薄膜(Chip on Film，COF)与显示面板的输入端子绑定连接，以实现驱动芯片对显示面板显示功能的控制。因此，在覆晶薄膜上设置有输出引脚，同时在显示面板上设置有与输出引脚对应连接的绑定垫。在覆晶薄膜与显示面板的绑定制程中，保证输出引脚与绑定垫的准确对位一直是本领域的一个难题，由于绑定过程中需要使用热压合的方式，覆晶薄膜和显示面板难免会受热膨胀引发输出引脚间距的变化，若对位过程中存在偏差，则很容易出现输出引脚与绑定垫的错位连接，进而导致显示面板功能异常。
发明概述
技术问题
在覆晶薄膜与显示面板的绑定过程中，需要使用热压合工艺，覆晶薄膜和显示面板会因受热膨胀而引发输出引脚间距的变化，进而导致对位偏差，甚至出现输出引脚与绑定垫的错位连接，引起显示面板功能异常。
问题的解决方案
技术解决方案
本申请
为了解决上述技术问题，本申请提出的技术方案如下：
本申请提供了一种覆晶薄膜，包括：
基板；以及
引脚区，设置于所述基板上，所述引脚区包括用于绑定连接的多个纵向引脚和用于对位的横向引脚，所述横向引脚设置于所述纵向引脚的一侧，且与所述纵向引脚断开绝缘设置。
在本申请的覆晶薄膜中，所述基板为聚酰亚胺基板。
在本申请的覆晶薄膜中，所述多个纵向引脚为沿横向并排设置。
在本申请的覆晶薄膜中，所述横向引脚的延伸方向与所述纵向引脚的延伸方向垂直。
在本申请的覆晶薄膜中，申请所述覆晶薄膜还包括设置于所述基板上的晶片区，所述晶片区与所述引脚区相邻设置。
在本申请的覆晶薄膜中，申请所述晶片区包括驱动芯片，所述驱动芯片与所述纵向引脚电性连接，用于向所述纵向引脚发送控制信号。
在本申请的覆晶薄膜中，所述横向引脚为单个引脚。
在本申请的覆晶薄膜中，每相邻两个所述纵向引脚之间的间距相同；所述横向引脚为单个引脚。
在本申请的覆晶薄膜中，定义与所述横向引脚最靠近的一个所述纵向引脚为第一纵向引脚，所述横向引脚与所述第一纵向引脚之间的间距与相邻两个所述纵向引脚之间的间距相同。
在本申请的覆晶薄膜中，所述横向引脚的长度为两个所述纵向引脚的宽度及相邻两个所述纵向引脚间距之和。
在本申请的覆晶薄膜中，所述横向引脚与所述纵向引脚均为长方形引脚。
在本申请的覆晶薄膜中，所述横向引脚及所述纵向引脚均由金属铜制成。
本申请申请还提供了一种显示装置，包括如上所述的覆晶薄膜，以及
具有绑定区的显示面板，所述绑定区包括绑定垫和对位垫；
所述绑定垫有多个，且沿横向并排设置，所述绑定垫与所述纵向引脚一一对应绑定连接；
所述对位垫上设置对位缺口，所述横向引脚设置于所述对位缺口中，以保证所述绑定垫与所述纵向引脚对位绑定。
在本申请的显示装置中，所述显示面板包括多个所述绑定区，每个所述绑定区与一个所述覆晶薄膜绑定连接。
在本申请的显示装置中，所述对位垫设置于所述绑定垫的一侧，所述对位垫与所述绑定垫的延伸方向相同。
在本申请的显示装置中，所述对位垫包括沿纵向设置的两条，且所述两条对位垫的中间相同位置设置所述对位缺口。
在本申请的显示装置中，所述对位缺口沿纵向的尺寸大于或等于所述横向引脚沿纵向的尺寸，以保证所述横向引脚设置于所述对位缺口中。
在本申请的显示装置中，单个所述绑定垫的宽度与单个所述对位垫的宽度相同。
在本申请的显示装置中申请，所述对位垫接地设置，所述绑定垫电性连接所述显示面板的显示单元，单个所述绑定垫的宽度大于或等于单个所述纵向引脚的宽度。
本申请还一种显示装置，包括覆晶薄膜以及显示面板；
所述覆晶薄膜包括基板以及设置于所述基板上的引脚区；所述引脚区包括用于绑定连接的多个纵向引脚和用于对位的单个横向引脚，所述横向引脚设置于所述纵向引脚的一侧，且与所述纵向引脚断开绝缘设置；每相邻两个所述纵向引脚之间的间距相同；所述横向引脚的长度为两个所述纵向引脚的宽度及相邻两个所述纵向引脚间距之和；
所述显示面板包括绑定区，所述绑定区包括绑定垫和对位垫；所述绑定垫有多个，且沿横向并排设置，所述绑定垫与所述纵向引脚一一对应绑定连接；所述对位垫包括沿纵向设置的两条，且所述两条对位垫的中间相同位置设置对位缺口，所述横向引脚设置于所述对位缺口中，以保证所述绑定垫与所述纵向引脚对位绑定。
有益效果
本申请提供了覆晶薄膜和应用所述覆晶薄膜的显示装置，所述显示装置还包括 显示面板，所述显示面板上设置有对位垫，所述对位垫上设置有对位缺口，所述覆晶薄膜上设置有横向引脚，通过将所述横向引脚设置于所述对位缺口中，可以实现所述显示面板与所述覆晶薄膜的准确对位连接；另外，所述覆晶薄膜上的横向引脚与纵向引脚为断开绝缘设置，可以防止在绑定制程中或制程完成后所述横向引脚与显示面板的元器件电性接触而引起纵向引脚的功能异常，提高显示装置的生产良率和可靠性。
发明的有益效果
对附图的简要说明
附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的覆晶薄膜的结构示意图；
图2是本申请实施例提供的显示装置的结构示意图；
图3是本申请实施例提供的显示面板的结构示意图。
发明实施例
本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
本申请实施例提供了一种覆晶薄膜，通过在所述覆晶薄膜的纵向引脚一侧设置与所述纵向引脚断开的横向引脚，并通过所述横向引脚实现覆晶薄膜与显示面板的准确对位，解决了现有技术中覆晶薄膜与显示面板绑定制程中对位难的问题。
如图1所示，是本申请实施例提供的覆晶薄膜10的结构示意图，所述覆晶薄膜10包括基板11和设置于所述基板11上的引脚区12。所述基板11可以是柔性基板，如聚酰亚胺基板等，用于承载所述覆晶薄膜10上的各种元器件。所述引脚区12包括纵向引脚121和横向引脚122；其中所述纵向引脚121用于与显示面板输入端子绑定连接，以向所述显示面板传递控制信号，所述横向引脚122起对位标记作用，用于保证所述纵向引脚121与显示面板的输入端子准确对位。所述横向引脚122设置于所述纵向引脚121的一侧，并且与所述纵向引脚121断开绝缘设置。
应当理解的是，将本申请实施例提供的覆晶薄膜10与显示面板进行绑定连接时，通过所述横向引脚122实现正确对位，同时所述横向引脚122与所述纵向引脚121断开绝缘设置，可以防止在绑定制程中或制程完成后所述横向引脚122与显示面板的元器件电性接触而引起纵向引脚的功能异常。
可选地，所述多个纵向引脚121为沿横向并排设置，且每相邻两个所述纵向引脚121之间的间距相同；所述横向引脚122为单个引脚，设置于所述纵向引脚121的一侧，且其延伸方向与所述纵向引脚121垂直。
可选地，定义与所述横向引脚122最靠近的一个所述纵向引脚121为第一纵向引脚121’，所述横向引脚122与所述第一纵向引脚121’断开绝缘设置，并且二者之间形成一固定间隙，该间隙的长度等于相邻两个所述纵向引脚121之间的间距，以保证将所述覆晶薄膜10与显示面板绑定时，所述横向引脚122可以准确地与显示面板的对应位置重合，进而保证绑定精度。
可选地，所述横向引脚122的长度为两个所述纵向引脚121的宽度及相邻两个所述纵向引脚121之间的间距之和，即：所述横向引脚122的长度等于两倍的所述纵向引脚121的宽度加上相邻两个所述纵向引脚121之间的间距，例如：当单个所述纵向引脚121的宽度为a，相邻两个所述纵向引脚121之间的间距为b，所述横线引脚122的长度为c，则c＝2*a+b。通过将所述横向引脚122的长度进行上述设置，使所述横向引脚122具有一定长度，在通过所述横向引脚122使所述覆晶薄膜10与显示面板对位时，可进一步确保所述覆晶薄膜10与显示面板的准直设置。
可选地，所述横向引脚122及所述纵向引脚121均为长方向引脚，且所述横向引 脚122及所述纵向引脚121均由金属铜制成，从而实现所述横向引脚122与所述纵向引脚121通过同一制程工艺制备完成，有利于提高所述覆晶薄膜10的生产效率。
此外，所述覆晶薄膜10还包括设置于所述基板11上的晶片区13，所述晶片区13与所述引脚区12相邻设置；所述晶片区13内设置有驱动芯片，所述驱动芯片与所述纵向引脚121电性连接，用于向所述纵向引脚121发射控制信号。
本申请实施例提供的覆晶薄膜10通过将引脚区划分为用于绑定连接的纵向引脚和用于定位的横向引脚，可以保证所述覆晶薄膜与显示面板进行绑定连接时，所述纵向引脚与显示面板上的对应引脚准确对位连接，避免了错位绑定造成的显示面板异常；同时，将所述横向引脚与所述纵向引脚断开绝缘设置，可以防止在绑定制程中或制程完成后所述横向引脚与显示面板的元器件电性接触而引起纵向引脚的功能异常。
本申请实施例还提供了一种显示装置30，如图2所示，所述显示装置30包括上述实施例提供的覆晶薄膜10和显示面板20。关于所述覆晶薄膜10的结构特征在上述实施例中已经进行详细说明，此处不再赘述，需要说明的是，本实施例提供的显示装置30中所包含的覆晶薄膜可以是上述实施例提供的覆晶薄膜中的任意一种。
关于所述显示面板20的结构特征参见图3所示，所述显示面板20包括至少一个绑定区21，所述绑定区21与所述覆晶薄膜10上的引脚区12(参见图1所示)对应设置。应当理解的是，所述显示面板20可以包括多个绑定区21，每一个所述绑定区21可以与一个所述覆晶薄膜10绑定连接，从而实现多个覆晶薄膜对显示面板功能的组合控制。
参考图2和图3所示，所述绑定区21内设置有绑定垫211和对位垫212，所述对位垫212设置于所述绑定垫211的一侧。其中所述绑定垫211包括沿横向并排设置的多个，每一个所述绑定垫211与一个所述覆晶薄膜10上的纵向引脚121对应绑定连接，从而实现所述覆晶薄膜10与所述显示面板20的电性连接，达到通过所述覆晶薄膜10上的驱动芯片控制所述显示面板20的显示功能的目的。
所述对位垫212设置于所述绑定垫211的一侧，所述对位垫212与所述绑定垫211 的延伸方向相同，均为沿纵向延伸；所述对位垫212上设置有对位缺口212a，所述对位缺口212a用于与所述覆晶薄膜10上的横向引脚122进行匹配，以保证所述绑定垫211与所述纵向引脚121准确对位绑定。
可选地，所述对位垫212包括沿纵向设置的两条，且所述两条对位垫212的中间相同位置设置所述对位缺口212a，且所述对位缺口212沿纵向的尺寸大于或等于所述横向引脚122沿纵向的尺寸，从而形成沿横向延伸的缺口通道，以保证所述横向引脚122可以设置于所述对位缺口212a中。
可选地，所述对位垫212接地设置。需要说明的是，所述覆晶薄膜10与所述显示面板20进行绑定连接时，需要使用热压合工艺，通过将所述对位垫212接地设置，可以将热压合过程中积累的热量及时通过所述对位垫212传导分散，防止热压合过程中所述对位垫212、所述绑定垫211及所述纵向引脚121、所述横向引脚122因受热而翘起。
另外需要说明的是，在本申请实施例提供的显示装置中，所述对位垫212和所述横向引脚122不参与控制信号的传输，仅起到对位的作用，同时所述对位垫212的接地设置还可以起到散热的作用。此外，在将所述覆晶薄膜10与所述显示面板20进行绑定连接时，由于工艺的波动，不可避免地会出现所述横向引脚122与所述对位垫212部分重叠，造成所述横向引脚122对地连通，由于本申请实施例提供覆晶薄膜10中横向引脚122与纵向引脚121断开绝缘设置，因此，即使所述横向引脚122对地连通也不会造成所述纵向引脚121上传输的控制信号异常。
应当理解的是，在所述显示面板20的绑定区21中，所述绑定垫211与所述显示面板20的显示单元电性连接(图中为示出)，以实现所述覆晶薄膜10上的驱动芯片对所述显示面板20的显示单元的控制。
可选地，所述绑定垫211的宽度大于或等于所述纵向引脚121的宽度，以降低所述绑定垫211与所述纵向引脚121对位的难度。
可选地，所述绑定垫211及所述对位垫212均是长方形，所述绑定垫211和所述对位垫212均有金属铜制成，且二者具有相同宽度。应当理解的是，所述绑定垫211及所述对位垫212的上述设置可以简化其制备工艺，提高生产效率。
本申请实施例提供的显示装置，包括显示面板和与所述显示面板绑定连接的覆 晶薄膜，所述显示面板上设置有对位垫，所述对位垫上设置有对位缺口，所述覆晶薄膜上设置有横向引脚，通过将所述横向引脚设置于所述对位缺口中，可以实现所述显示面板与所述覆晶薄膜的准确对位连接；另外，将所述覆晶薄膜上的横向引脚与纵向引脚断开绝缘设置，可以防止在绑定制程中或制程完成后所述横向引脚与显示面板的元器件电性接触而引起纵向引脚的功能异常，提高显示装置的生产良率和可靠性。
综上所述，虽然本申请以具体实施例揭露如上，但上述实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种覆晶薄膜，，包括：
    基板；以及
    引脚区，设置于所述基板上，所述引脚区包括用于绑定连接的多个纵向引脚和用于对位的横向引脚，所述横向引脚设置于所述纵向引脚的一侧，且与所述纵向引脚断开绝缘设置。
  2. 根据权利要求1所述的覆晶薄膜，其中，所述基板为聚酰亚胺基板。
  3. 根据权利要求1所述的覆晶薄膜，其中，所述多个纵向引脚为沿横向并排设置。
  4. 根据权利要求1所述的覆晶薄膜，其中，所述横向引脚的延伸方向与所述纵向引脚的延伸方向垂直。
  5. 根据权利要求1所述的覆晶薄膜，其中，所述覆晶薄膜还包括设置于所述基板上的晶片区，所述晶片区与所述引脚区相邻设置。
  6. 根据权利要求2所述的覆晶薄膜，其中，所述晶片区包括驱动芯片，所述驱动芯片与所述纵向引脚电性连接，用于向所述纵向引脚发送控制信号。
  7. 根据权利要求1所述的覆晶薄膜，其中，所述横向引脚为单个引脚。
  8. 根据权利要求2所述的覆晶薄膜，其中，每相邻两个所述纵向引脚之间的间距相同；所述横向引脚为单个引脚。
  9. 根据权利要求8所述的覆晶薄膜，其中，定义与所述横向引脚最靠近的一个所述纵向引脚为第一纵向引脚，所述横向引脚与所述第一纵向引脚之间的间距与相邻两个所述纵向引脚之间的间距相同。
  10. 根据权利要求9所述的覆晶薄膜，其中，所述横向引脚的长度为两个所述纵向引脚的宽度及相邻两个所述纵向引脚间距之和。
  11. 根据权利要求1所述的覆晶薄膜，其中，所述横向引脚与所述纵向 引脚均为长方形引脚。
  12. 根据权利要求1所述的覆晶薄膜，其中，所述横向引脚及所述纵向引脚均由金属铜制成。
  13. 一种显示装置，其中，包括权利要求1所述的覆晶薄膜，以及
    具有绑定区的显示面板，所述绑定区包括绑定垫和对位垫；
    所述绑定垫有多个，且沿横向并排设置，所述绑定垫与所述纵向引脚一一对应绑定连接；
    所述对位垫上设置对位缺口，所述横向引脚设置于所述对位缺口中，以保证所述绑定垫与所述纵向引脚对位绑定。
  14. 根据权利要求13所述的显示装置，其中，所述显示面板包括多个所述绑定区，每个所述绑定区与一个所述覆晶薄膜绑定连接。
  15. 根据权利要求13所述的显示装置，其中，所述对位垫设置于所述绑定垫的一侧，所述对位垫与所述绑定垫的延伸方向相同。
  16. 根据权利要求15所述的显示装置，其中，所述对位垫包括沿纵向设置的两条，且所述两条对位垫的中间相同位置设置所述对位缺口。
  17. 根据权利要求16所述的显示装置，其中，所述对位缺口沿纵向的尺寸大于或等于所述横向引脚沿纵向的尺寸，以保证所述横向引脚设置于所述对位缺口中。
  18. 根据权利要求13所述的显示装置，其中，单个所述绑定垫的宽度与单个所述对位垫的宽度相同。
  19. 根据权利要求13所述的显示装置，其中，所述对位垫接地设置，所述绑定垫电性连接所述显示面板的显示单元，单个所述绑定垫的宽度大于或等于单个所述纵向引脚的宽度。
  20. 一种显示装置，其中，包括覆晶薄膜以及显示面板；
    所述覆晶薄膜包括基板以及设置于所述基板上的引脚区；所述引脚区包括用于绑定连接的多个纵向引脚和用于对位的单个横向引脚，所述横向引脚设置于所述纵向引脚的一侧，且与所述纵向引 脚断开绝缘设置；每相邻两个所述纵向引脚之间的间距相同；所述横向引脚的长度为两个所述纵向引脚的宽度及相邻两个所述纵向引脚间距之和；
    所述显示面板包括绑定区，所述绑定区包括绑定垫和对位垫；所述绑定垫有多个，且沿横向并排设置，所述绑定垫与所述纵向引脚一一对应绑定连接；所述对位垫包括沿纵向设置的两条，且所述两条对位垫的中间相同位置设置对位缺口，所述横向引脚设置于所述对位缺口中，以保证所述绑定垫与所述纵向引脚对位绑定。
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