WO2020218319A1 - 固体電解コンデンサ - Google Patents
固体電解コンデンサ Download PDFInfo
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- WO2020218319A1 WO2020218319A1 PCT/JP2020/017282 JP2020017282W WO2020218319A1 WO 2020218319 A1 WO2020218319 A1 WO 2020218319A1 JP 2020017282 W JP2020017282 W JP 2020017282W WO 2020218319 A1 WO2020218319 A1 WO 2020218319A1
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- Prior art keywords
- protective film
- electrolytic capacitor
- sintered body
- porous sintered
- solid electrolytic
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
- H01G9/055—Etched foil electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
- H01G9/10—Sealing, e.g. of lead-in wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
- H01G2009/05—Electrodes or formation of dielectric layers thereon characterised by their structure consisting of tantalum, niobium, or sintered material; Combinations of such electrodes with solid semiconductive electrolytes, e.g. manganese dioxide
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
- H01G9/052—Sintered electrodes
Definitions
- This disclosure relates to solid electrolytic capacitors.
- Patent Document 1 discloses an example of a conventional solid electrolytic capacitor.
- the solid electrolytic capacitor is formed by laminating a dielectric layer, a solid electrolyte layer, and a cathode layer on the outer surface of the porous sintered body and the inner surface of the pores, and covering them with a sealing resin.
- the solid electrolyte capacitor may crack between the solid electrolyte layer and the cathode layer due to the temperature change due to the reflow treatment at the time of mounting. In the cracked state, the temperature and humidity may deteriorate the solid electrolyte layer and increase the equivalent series resistance (ESR).
- ESR equivalent series resistance
- one object of the present disclosure is to provide a solid electrolytic capacitor capable of suppressing deterioration of the solid electrolyte layer.
- the solid electrolytic capacitor provided by the present disclosure includes a porous sintered body made of a valve acting metal, and an electrode wire in which a part of the porous sintered body enters the porous sintered body and protrudes from the porous sintered body.
- the glass transition point of the protective film is 100 ° C. or lower, which is sufficiently lower than the temperature during the reflow treatment. Therefore, the protective film softens during the reflow treatment to relieve the stress that causes cracks between the solid electrolyte layer and the cathode layer. As a result, the generation of cracks between the solid electrolyte layer and the cathode layer is suppressed, so that the deterioration of the solid electrolyte layer is suppressed. Further, when a crack occurs in the sealing resin during the reflow treatment, the softened protective film flows into the crack, and the cracked portion can be closed. As a result, the infiltration of water from the cracks is suppressed, and the deterioration of the solid electrolyte layer is suppressed.
- the solid electrolytic capacitor A1 includes a capacitor element 100, an anode conducting member 6, a cathode conducting member 7, a protective film 8, and a sealing resin 5.
- the direction along one side of the solid electrolytic capacitor A1 in plan view (the direction from left to right in FIG. 1) is the x direction, and the direction along the other side (from bottom to top in FIG. 1).
- the direction) will be the y direction, and the thickness direction of the solid electrolytic capacitor A1 (the direction from the bottom to the top in FIGS. 2 and 3) will be described as the z direction.
- the x-direction dimension is about 3.2 mm
- the y-direction dimension is about 1.6 mm
- the z-direction dimension is about 1.2 mm.
- Each size is not limited.
- FIG. 1 is a plan view showing the solid electrolytic capacitor A1.
- the outer shape of the sealing resin 5 is shown by an imaginary line (dashed line) through the sealing resin 5.
- FIG. 2 is a cross-sectional view taken along the line II-II of FIG.
- FIG. 3 is a cross-sectional view taken along the line III-III of FIG.
- FIG. 4 is an enlarged cross-sectional view of a main part showing the solid electrolytic capacitor A1.
- the capacitor element 100 includes a porous sintered body 1, an anode wire 11, a dielectric layer 2, a solid electrolyte layer 3, and a cathode layer 4.
- the porous sintered body 1 forms an anode with respect to the dielectric layer 2, and is made of a valve acting metal such as Ta or Nb.
- the porous sintered body 1 has a rectangular parallelepiped shape.
- the porous sintered body 1 has a large number of minute pores 15 inside.
- the porous sintered body 1 has a surface 1a facing one side in the x direction, a surface 1c facing the side opposite to the surface 1a in the x direction, and four surfaces 1b connected to the surfaces 1a and 1c.
- the surfaces 1a, 1b, and 1c are rectangular, respectively.
- the anode wire 11 is made of, for example, a valve acting metal such as Ta or Nb.
- the material of the anode wire 11 is not limited, but it is preferably formed of the same valve acting metal as the valve acting metal forming the porous sintered body 1.
- the anode wire 11 enters the porous sintered body 1 in the x direction from the center of the surface 1c of the porous sintered body 1 and projects toward the opposite side in the x direction.
- the anode wire 11 is arranged so as to be parallel to the four surfaces 1b of the porous sintered body 1, is located in the center of the porous sintered body 1 in the z direction, and is porous baked in the y direction. It is located in the center of the body 1.
- the penetration length of the anode wire 11 entering the porous sintered body 1 is about 75% of the x-direction dimension of the porous sintered body 1.
- the cross section of the anode wire 11 parallel to the surface 1c is circular.
- the dielectric layer 2 is laminated on the surface of the porous sintered body 1.
- the dielectric layer 2 may also be laminated on the surface of a part of the anode wire 11.
- the porous sintered body 1 has a structure having a large number of pores 15, and the surface covered by the dielectric layer 2 is a surface (surface 1a, which appears in the appearance of the porous sintered body 1). It contains not only 1b, 1c) but also the inner surface of each pore 15.
- the dielectric layer 2 is described as a layer that covers the porous sintered body 1 from the outside for convenience of understanding, but in reality, the outer surface and the thin portion of the porous sintered body 1 are described. It is formed over the inside of the hole 15.
- the dielectric layer 2 is generally composed of an oxide of a valve acting metal, for example, Ta 2 O 5 (tantalum pentoxide) or Nb 2 O 5 (niobium pentoxide).
- the solid electrolyte layer 3 covers the dielectric layer 2.
- the solid electrolyte layer 3 may be any as long as it can electrically form a capacitor with the porous sintered body 1 with the dielectric layer 2 interposed therebetween.
- the solid electrolyte layer 3 is composed of an inner layer 31 and an outer layer 32.
- the inner layer 31 covers the portion of the dielectric layer 2 that covers the inner surface of the pores 15 of the porous sintered body 1, and fills the pores 15 of the porous sintered body 1. ing.
- the inner layer 31 is made of, for example, a conductive polymer.
- the outer layer 32 is laminated on the inner layer 31 so as to cover the inner layer 31 outside the porous sintered body 1. In this embodiment, the outer layer 32 is made of a conductive polymer.
- the solid electrolyte layer 3 may be composed of a single layer of a conductive polymer.
- the cathode layer 4 is laminated on the outer layer 32 of the solid electrolyte layer 3, and is a layer for conducting conduction between the solid electrolyte layer 3 and the cathode conductive member 7.
- the structure of the cathode layer 4 is not particularly limited as long as it has appropriate conductivity.
- the cathode layer 4 is formed so as to cover the surface 1a and the four surfaces 1b of the porous sintered body 1, and is not formed on the portion of the surface 1c of the porous sintered body 1. ..
- the cathode layer 4 may be formed so as to cover the surface 1c of the porous sintered body 1.
- the cathode layer 4 is composed of a base layer 41 and an upper layer 42.
- the base layer 41 is made of graphite, for example, and directly covers the solid electrolyte layer 3.
- the upper layer 42 is laminated on the base layer 41 and is made of, for example, Ag.
- the anode conductive member 6 is joined to the anode wire 11, and a part thereof is exposed from the sealing resin 5.
- the anode conductive member 6 is made of, for example, a Cu-plated Ni—Fe alloy such as 42 alloy.
- the portion of the anode conductive member 6 exposed from the sealing resin 5 is used as an external anode terminal 6a for surface mounting the solid electrolytic capacitor A1.
- the anode conductive member 6 is composed of an intermediate portion 61 and an exposed portion 62.
- the intermediate portion 61 is entirely covered with the sealing resin 5 and is joined to the anode wire 11.
- the exposed portion 62 is a plate-shaped member and is joined to the intermediate portion 61.
- the exposed portion 62 constitutes the external anode terminal 6a by exposing a part of the exposed portion 62 from the sealing resin 5.
- the cathode conductive member 7 is bonded to the cathode layer 4 via a conductive bonding material 71 made of, for example, Ag, and a part thereof is exposed from the sealing resin 5.
- the cathode conductive member 7 is made of, for example, a Cu-plated Ni—Fe alloy such as 42 alloy, and is a plate-shaped member in the present embodiment.
- the surface of the cathode conductive member 7 exposed from the sealing resin 5 is used as an external cathode terminal 7a for surface mounting the solid electrolytic capacitor A1.
- the exposed portion 62 of the anode conductive member 6 and the cathode conductive member 7 are derived from the lead frame at the time of manufacture.
- the sealing resin 5 covers the capacitor element 100, the anode conductive member 6, and the cathode conductive member 7, and is made of, for example, an epoxy resin.
- the protective film 8 is interposed between the capacitor element 100, the anode conductive member 6, the cathode conductive member 7, and the sealing resin 5.
- the protective film 8 is formed on the cathode layer 4 in most of the capacitor elements 100.
- the protective film 8 is formed by forming a part of the anode wire 11 bonded to the anode conductive member 6 and a part of the cathode layer 4 bonded to the cathode conductive member 7 in the capacitor element 100. It covers all but the surface.
- the protective film 8 is made of a polymer containing fluorine and has waterproof property. Therefore, it is possible to prevent the amount of water contained in the pores 15 of the porous sintered body 1 from becoming too large.
- the polymer containing Si is too waterproof, and the water content in the pores 15 of the porous sintered body 1 is too small. It is desirable that the fixed electrolytic capacitor contains less water in the pores 15 during the reflow treatment, but it needs to contain a predetermined amount of water during actual use after the reflow treatment. Therefore, in the present embodiment, the protective film 8 uses a polymer that does not contain Si.
- the protective film 8 is a polymer having a perfluoroalkyl group having 6 carbon atoms (C 6 F 13- R) and a thermal decomposition temperature of 200 ° C. to 300 ° C.
- the protective film 8 is not limited to this.
- the thickness of the protective film 8 is about 0.5 ⁇ m in this embodiment.
- the thickness of the protective film 8 is not limited to this, but is preferably 0.01 to 5 ⁇ m, and more preferably 0.1 to 2 ⁇ m.
- the glass transition point of the protective film 8 is 35 to 50 ° C.
- the glass transition point of the protective film 8 is not limited to this, and may be equal to or less than the glass transition point of the cathode layer 4 or the sealing resin 5. Since the glass transition point of the sealing resin 5 is about 110 to 180 ° C., the glass transition point of the protective film 8 may be 180 ° C. or lower, preferably 110 ° C. or lower. More preferably, the glass transition point of the protective film 8 is 35 to 85 ° C, and even more preferably 35 to 50 ° C.
- the glass transition point in the present disclosure is detected by the DSC (Differential Scanning Calorimetry) method. The glass transition point may be detected by other methods.
- FIG. 5 is an enlarged cross-sectional view of the solid electrolytic capacitor A1 and shows a state in which a crack 5a is generated in the sealing resin 5 during the reflow process. Due to the demand for miniaturization, the sealing resin 5 is formed thin. Since the protective film 8 is not completely waterproof, the pores 15 of the porous sintered body 1 contain a certain amount of water. Therefore, the heat generated by the reflow treatment may cause the moisture to expand, causing cracks 5a in the sealing resin 5. In the reflow treatment, for example, the temperature is heated to about 260 ° C., so that the temperature inside the solid electrolytic capacitor A1 exceeds the glass transition point of the protective film 8. Therefore, the viscosity of the protective film 8 decreases and the fluidity increases. As a result, as shown in FIG. 5, a part 8a of the softened protective film 8 flows into the crack 5a of the sealing resin 5 and closes the crack 5a.
- FIG. 6 is a diagram showing a flow of a method for manufacturing the solid electrolytic capacitor A1.
- 7 to 10 are cross-sectional views showing a process related to a method for manufacturing the solid electrolytic capacitor A1, and are views corresponding to FIG. 2.
- the porous sintered body 1 is formed (porous sintered body forming step).
- a porous body is formed (porous body forming step).
- a fine powder of a valve acting metal such as Ta or Nb is filled in the space of the mold.
- the tip portion of the wire material 92 that becomes the anode wire 11 is allowed to enter the fine powder filled in the space portion.
- pressure is applied to the filled fine powder by a mold.
- the fine powder is compressed and the porous body 93 is pressure-molded.
- the wire material 92 is cut at a predetermined position away from the porous body 93, and the porous body 93 is taken out. As described above, the porous body 93 in which the wire material 92 has entered is obtained.
- the porous body 93 and the wire material 92 are sintered.
- the fine powders of the valve acting metal are sintered, and the porous sintered body 1 having a large number of pores 15 and the anode wire 11 are formed (sintering treatment).
- the outer shape of the porous sintered body 1 becomes smaller than the outer shape of the porous body 93 due to the shrinkage caused by the sintering treatment.
- the porous body 93 is molded so that the porous sintered body 1 and the anode wire 11 have predetermined dimensions.
- the dielectric layer 2 is formed (dielectric layer forming step).
- the porous sintered body 1 is immersed in a chemical conversion solution of an aqueous phosphoric acid solution. Then, in this chemical conversion liquid, the porous sintered body 1 is anodized.
- the dielectric layer 2 made of, for example, Ta 2 O 5 or Nb 2 O 5 is formed so as to cover the outer surface and the inner surface of the porous sintered body 1.
- the solid electrolyte layer 3 is formed (solid electrolyte layer forming step).
- the inner layer 31 is first formed (inner layer formation).
- the polymer dispersion and the solvent are mixed.
- the polymer dispersion is a conductive polymer particle that has been polymerized in advance, and is, for example, polypyrrole, polythiophene, poly (N-methylpyrrole), poly (3-methylthiophene), poly (3-methoxythiophene), poly (3). , 4-ethylenedioxythiophene), or a polymer or copolymer composed of one or two selected from the above, is preferably used from the viewpoint of conductivity.
- polypyrrylol and poly (3,4-ethylenedioxythiophene) are more preferable because they can further improve conductivity and heat resistance.
- the solvent can disperse the polymer dispersion uniformly, and for example, water, ethanol, an organic solvent, or the like can be appropriately adopted. As a result, a dispersion fluid is obtained.
- the porous sintered body 1 on which the dielectric layer 2 is formed is immersed in the dispersion liquid and pulled up. The solvent is then removed, for example by drying the dispersion fluid. As a result, the inner layer 31 made of the conductive polymer is formed.
- the outer layer 32 is formed (outer layer formation).
- the porous sintered body 1 on which the inner layer 31 is formed is immersed in a known oxidizing agent and monomer solution, respectively, pulled up, and then dried. As a result, a chemical polymerization reaction is caused. Then, cleaning and re-chemical conversion treatment are performed as necessary. As a result, the outer layer 32 made of the conductive polymer is formed.
- an electrolytic polymerization method may be used in which an electrolyte solution containing a monomer and a dopant is applied and an electric current is passed to form an outer layer 32 made of a conductive polymer.
- the cathode layer 4 is formed (cathode layer forming step).
- the base layer 41 is formed (base layer formation).
- the porous sintered body 1 is immersed in a solution of graphite and an organic solvent, pulled up, and then dried or fired.
- the upper layer 42 is formed (upper layer formation).
- the porous sintered body 1 is immersed in a solution of an Ag filler and an organic solvent, pulled up, and then dried or fired.
- the upper layer 42 is formed and the cathode layer 4 is obtained.
- the capacitor element 100 is formed.
- the materials to be the anode conductive member 6 and the cathode conductive member 7 are joined to the capacitor element 100 (joining step).
- the base metal serving as the intermediate portion 61 of the anode conductive member 6 and the anode wire 11 are welded. Then, this base material is cut into a predetermined size. The base material cut to a predetermined size becomes the intermediate portion 61.
- the anode wire 11 is cut to a predetermined length.
- the intermediate portion 61 is bonded to the lead frame 96 which is the exposed portion 62 of the anode conductive member 6, and the capacitor element 100 (cathode layer 4) is bonded to the lead frame 97 which is the cathode conductive member 7. To do.
- the lead frame 97 and the cathode layer 4 are joined by a conductive bonding material 71 such as silver paste.
- the protective film 8 is formed (protective film forming step).
- the protective film 8 is formed, for example, by immersing the capacitor element 100 to which the lead frames 96, 97 and the intermediate portion 61 are bonded in a dispersion liquid in which a polymer dispersion containing fluorine and a solvent are mixed, pulling it up, and then drying or Bake. As a result, as shown in FIG. 10, the protective film 8 is formed on the capacitor element 100, the lead frames 96 and 97, and the intermediate portion 61.
- the protective film 8 may be formed by applying a dispersion liquid by spraying and drying or firing.
- the sealing resin 5 is formed by, for example, a transfer molding method (sealing resin forming step). Then, unnecessary portions of the lead frames 96 and 97 are cut and removed. Through the above steps, the solid electrolytic capacitor A1 shown in FIGS. 1 to 4 can be obtained.
- the glass transition point of the protective film 8 is 40 to 50 ° C., which is sufficiently lower than the temperature during the reflow treatment. Therefore, the protective film 8 in contact with the cathode layer 4 softens during the reflow treatment to relieve the stress that causes cracks between the solid electrolyte layer 3 and the cathode layer 4. As a result, the generation of cracks between the solid electrolyte layer 3 and the cathode layer 4 is suppressed. Therefore, the deterioration of the solid electrolyte layer 3 due to the crack between the solid electrolyte layer 3 and the cathode layer 4 is suppressed.
- the protective film 8 made of a polymer containing fluorine without containing Si covers the capacitor element 100.
- the protective film 8 has a certain degree of waterproofness. Therefore, as compared with the case where the protective film 8 is not formed, it is possible to suppress the infiltration of water into the cracks formed between the solid electrolyte layer 3 and the cathode layer 4. As a result, deterioration of the solid electrolyte layer 3 is suppressed. Further, the amount of water contained in the pores 15 of the porous sintered body 1 is suppressed as compared with the case where the protective film 8 is not formed. As a result, the generation of cracks 5a in the sealing resin 5 due to the expansion of water during the reflow treatment is suppressed. Further, since the protective film 8 does not contain Si, it is possible to prevent the amount of water contained in the pores 15 of the porous sintered body 1 from becoming too small.
- the protective film 8 is made of a polymer containing fluorine and not Si
- the protective film 8 may have other configurations as long as the glass transition point is 100 ° C. or lower. Even in this case, the protective film 8 softens during the reflow treatment to relieve the stress that causes cracks between the solid electrolyte layer 3 and the cathode layer 4, so that the protective film 8 is between the solid electrolyte layer 3 and the cathode layer 4. The occurrence of cracks can be suppressed. Therefore, the deterioration of the solid electrolyte layer 3 due to the crack between the solid electrolyte layer 3 and the cathode layer 4 is suppressed.
- FIG. 11 is a cross-sectional view showing a solid electrolytic capacitor according to the second embodiment, and is a diagram corresponding to FIG.
- the solid electrolytic capacitor A2 of the present embodiment is different from the first embodiment described above in that the protective film 8 covers the capacitor element 100, but does not cover the anode conductive member 6 and the cathode conductive member 7.
- the protective film 8 covers most of the capacitor element 100. Specifically, the protective film 8 covers the entire porous sintered body 1 and a part of the portion of the anode wire 11 protruding from the porous sintered body 1 that is adjacent to the porous sintered body 1. Covering.
- the base end portion 11a (end portion on the opposite side in the x direction) of the anode wire 11 is not covered with the protective film 8.
- the base end portion 11a may also be covered with the protective film 8.
- the protective film 8 is in contact with the cathode layer 4 at a portion overlapping the surfaces 1a and four surfaces 1b of the porous sintered body 1, and is in contact with the solid electrolyte layer 3 at a portion overlapping the surface 1c of the porous sintered body 1.
- the protective film 8 is formed on the entire surfaces of the surface 1a and the four surfaces 1b on which the cathode layer 4 is formed among the surfaces of the porous sintered body 1, and covers the entire surface of the cathode layer 4. There is. Further, the protective film 8 is also interposed between the capacitor element 100 and the cathode conductive member 7. Although the protective film 8 has an insulating property, when the thickness is 1 ⁇ m or less, practical conduction between the cathode layer 4 and the cathode conductive member 7 can be performed.
- FIG. 12 is a diagram showing a flow of a method for manufacturing the solid electrolytic capacitor A2.
- 13 and 14 are cross-sectional views showing a process related to a method for manufacturing the solid electrolytic capacitor A2, and are views corresponding to FIG. 2.
- the method for manufacturing the solid electrolytic capacitor A2 is different from the method for manufacturing the solid electrolytic capacitor A1 according to the first embodiment in that a protective film forming step is performed before the joining step.
- the porous sintered body forming step, the dielectric layer forming step, the solid electrolyte layer forming step, and the cathode layer forming step are the same as the manufacturing method according to the first embodiment, the description thereof will be omitted.
- the capacitor element 100 is formed by these steps.
- the protective film 8 is formed (protective film forming step).
- the capacitor element 100 is immersed in a dispersion liquid in which a polymer dispersion containing fluorine and a solvent are mixed, pulled up, and then dried or fired.
- the base end portion 11a of the anode wire 11 is not immersed in the dispersion liquid.
- the protective film 8 is formed on the portion of the capacitor element 100 other than the proximal end portion 11a.
- the protective film 8 may be formed by applying a dispersion liquid by spraying and drying or firing. Further, after forming the protective film 8 on the capacitor element 100, the protective film 8 formed in the region where the cathode conductive member 7 is joined may be removed.
- the materials to be the anode conductive member 6 and the cathode conductive member 7 are joined to the capacitor element 100 on which the protective film 8 is formed (joining step).
- the base metal which is the intermediate portion 61 of the anode conductive member 6, and the anode wire 11 are welded. Then, this base material is cut into a predetermined size. The base material cut to a predetermined size becomes the intermediate portion 61.
- the anode wire 11 is cut to a predetermined length.
- the intermediate portion 61 is bonded to the lead frame 96 which is the exposed portion 62 of the anode conductive member 6, and the capacitor element 100 (cathode layer 4) is bonded to the lead frame 97 which is the cathode conductive member 7. To do.
- the lead frame 97 and the cathode layer 4 are joined by a conductive bonding material 71 such as silver paste.
- the sealing resin 5 is formed by, for example, a transfer molding method (sealing resin forming step). Then, unnecessary portions of the lead frames 96 and 97 are cut and removed. By going through the above steps, the solid electrolytic capacitor A2 shown in FIG. 11 can be obtained.
- the protective film 8 covers the capacitor element 100 and is formed in contact with the cathode layer 4. Therefore, the protective film 8 softens during the reflow treatment to relieve the stress that causes cracks between the solid electrolyte layer 3 and the cathode layer 4. As a result, the generation of cracks between the solid electrolyte layer 3 and the cathode layer 4 is suppressed. Therefore, the deterioration of the solid electrolyte layer 3 due to the crack between the solid electrolyte layer 3 and the cathode layer 4 is suppressed. Further, when a crack 5a is generated in the sealing resin 5 during the reflow treatment, a part 8a of the softened protective film 8 can flow into the crack 5a and close the crack 5a (see FIG. 5). As a result, the infiltration of water from the crack 5a is suppressed, so that the deterioration of the solid electrolyte layer 3 is suppressed.
- the protective film 8 is waterproof. Therefore, as compared with the case where the protective film 8 is not formed, it is possible to suppress the infiltration of water into the cracks formed between the solid electrolyte layer 3 and the cathode layer 4. As a result, deterioration of the solid electrolyte layer 3 is suppressed. Further, the amount of water contained in the pores 15 of the porous sintered body 1 is suppressed as compared with the case where the protective film 8 is not formed. As a result, the generation of cracks 5a in the sealing resin 5 due to the expansion of water during the reflow treatment is suppressed. Further, since the protective film 8 does not contain Si, it is possible to prevent the amount of water contained in the pores 15 of the porous sintered body 1 from becoming too small.
- FIG. 15 is a cross-sectional view showing a solid electrolytic capacitor according to the third embodiment, and is a diagram corresponding to FIG.
- the solid electrolytic capacitor A3 of the present embodiment is different from the second embodiment described above in that the protective film 8 is not formed on the surface of the capacitor element 100 corresponding to the surface 1c of the porous sintered body 1. There is.
- the protective film 8 is formed only on the surfaces of the capacitor element 100 corresponding to the surfaces 1a and the four surfaces 1b of the porous sintered body 1.
- the surface of the capacitor element 100 corresponding to the surface 1c of the porous sintered body 1 and the anode wire 11 are not covered with the protective film 8.
- the protective film 8 is formed on all surfaces on which the cathode layer 4 of the porous sintered body 1 is formed, and is in contact with the cathode layer 4 on these surfaces.
- the protective film 8 is formed on all the surfaces on which the cathode layer 4 of the porous sintered body 1 is formed, and is in contact with the cathode layer 4 on these surfaces. Since the protective film 8 softens during the reflow treatment and relieves the stress that causes cracks between the solid electrolyte layer 3 and the cathode layer 4, cracks between the solid electrolyte layer 3 and the cathode layer 4 are prevented from occurring. Can be suppressed. Therefore, the deterioration of the solid electrolyte layer 3 due to the crack between the solid electrolyte layer 3 and the cathode layer 4 is suppressed.
- the protective film 8 is formed on a surface corresponding to the surface 1a and the four surfaces 1b of the porous sintered body 1 in which the sealing resin 5 is thinly formed and cracks 5a are likely to occur. Therefore, when a crack 5a is generated in the sealing resin 5 during the reflow treatment, a part 8a of the softened protective film 8 can flow into the crack 5a and close the crack 5a (see FIG. 5). As a result, the infiltration of water from the crack 5a is suppressed, so that the deterioration of the solid electrolyte layer 3 is suppressed.
- the protective film 8 is not formed on the surface of the porous sintered body 1 corresponding to the surface 1c, but since the protective film 8 in contact with the surface is formed thick, cracks 5a are unlikely to occur.
- the protective film 8 is formed on the surfaces corresponding to the surfaces 1a and the four surfaces 1b of the porous sintered body 1, it is solid as compared with the case where the protective film 8 is not formed. It is possible to prevent water from entering the cracks formed between the electrolyte layer 3 and the cathode layer 4. As a result, deterioration of the solid electrolyte layer 3 is suppressed. Further, the amount of water contained in the pores 15 of the porous sintered body 1 is suppressed as compared with the case where the protective film 8 is not formed. As a result, the generation of cracks 5a in the sealing resin 5 due to the expansion of water during the reflow treatment is suppressed. Further, since the protective film 8 does not contain Si, it is possible to prevent the amount of water contained in the pores 15 of the porous sintered body 1 from becoming too small.
- the protective film 8 is formed on the entire surface of the porous sintered body 1 corresponding to the surface 1b has been described, but the present disclosure is not limited to this.
- the protective film 8 may not be formed on a part of the surface of the porous sintered body 1 corresponding to the surface 1b (in FIG. 16, a part on the opposite side in the x direction). .. Even in this case, the protective film 8 can be softened during the reflow treatment to relieve some stress that causes cracks between the solid electrolyte layer 3 and the cathode layer 4.
- the protective film 8 can suppress the infiltration of water into the cracks formed between the solid electrolyte layer 3 and the cathode layer 4 as compared with the case where the protective film 8 is not formed, and the porous sintered body 1 can be prevented from infiltrating water. The amount of water contained in the pores 15 can be suppressed.
- the solid electrolytic capacitor according to the present disclosure is not limited to the above-described embodiment.
- the specific configuration of each part of the solid electrolytic capacitor according to the present disclosure can be freely redesigned.
- Appendix 1 Porous sintered body made of valve acting metal and An anode wire that partially enters the porous sintered body and protrudes from the porous sintered body.
- Appendix 2. The solid electrolytic capacitor according to Appendix 1, wherein the glass transition point of the protective film is 110 ° C. or lower.
- the solid electrolytic capacitor according to Appendix 2 wherein the glass transition point of the protective film is 35 to 85 ° C. Appendix 4.
- Porous sintered body made of valve acting metal and An anode wire that partially enters the porous sintered body and protrudes from the porous sintered body.
- the protective film is a solid electrolytic capacitor made of a polymer containing fluorine. Appendix 6.
- Appendix 7. The solid electrolytic capacitor according to Appendix 5 or 6, wherein the protective film has a perfluoroalkyl group (C 6 F 13- R) having 6 carbon atoms and is made of a polymer having a thermal decomposition temperature of 200 ° C. to 300 ° C. .. Appendix 8.
- Appendix 9. The solid electrolytic capacitor according to Appendix 8, wherein the protective film has a thickness of 0.1 to 2 ⁇ m.
- Appendix 11. The solid electrolytic capacitor according to Appendix 10, wherein at least a part of the protective film is formed on the anode conductive member and the cathode conductive member.
- Appendix 12. The solid electrolytic capacitor according to Appendix 10, wherein at least a part of the protective film is interposed between the cathode layer and the cathode conductive member.
- Appendix 13 The solid electrolytic capacitor according to Appendix 12, wherein the protective film covers the entire surface of the cathode layer. Appendix 14.
- the anode conductive member includes an intermediate portion covered with the sealing resin and bonded to the anode wire, and an exposed portion which is a plate-shaped member and is bonded to the intermediate portion.
- the cathode conductive member is a plate-shaped member and
- Appendix 15 The solid electrolytic capacitor according to any one of Appendix 1 to 14, wherein the porous sintered body has a rectangular parallelepiped shape.
- Appendix 16 The solid electrolytic capacitor according to any one of Appendix 1 to 15, wherein the porous sintered body is made of Ta or Nb.
- A1 to A3 Solid electrolytic capacitor 100: Capacitor element 1: Porous sintered body 1a, 1b, 1c: Surface 15: Pore 11: Anode wire 11a: Cathode portion 2: Dielectric layer 3: Solid electrolyte layer 31: Inner layer 32: Outer layer 4: Cathode layer 41: Underlayer 42: Upper layer 5: Encapsulating resin 5a: Crack 6: Anode conducting member 6a: External anode terminal 61: Intermediate part 62: Exposed part 7: Cathode conducting member 7a: External cathode terminal 71: Conductive bonding material 8: Protective film 92: Wire material 93: Porous body 96, 97: Lead frame
Abstract
Description
弁作用金属からなる多孔質焼結体と、
前記多孔質焼結体に一部が進入し、かつ、前記多孔質焼結体から突出する陽極ワイヤと、
前記多孔質焼結体に形成された誘電体層と、
前記誘電体層に形成された固体電解質層と、
前記固体電解質層に形成された陰極層と、
前記陰極層に少なくとも一部が形成された保護膜と、
を備え、
前記保護膜のガラス転移点は、180℃以下である、固体電解コンデンサ。
付記2.
前記保護膜のガラス転移点は、110℃以下である、付記1に記載の固体電解コンデンサ。
付記3.
前記保護膜のガラス転移点は、35~85℃である、付記2に記載の固体電解コンデンサ。
付記4.
前記保護膜のガラス転移点は、35~50℃である、付記3に記載の固体電解コンデンサ。
付記5.
弁作用金属からなる多孔質焼結体と、
前記多孔質焼結体に一部が進入し、かつ、前記多孔質焼結体から突出する陽極ワイヤと、
前記多孔質焼結体に形成された誘電体層と、
前記誘電体層に形成された固体電解質層と、
前記固体電解質層に形成された陰極層と、
前記陰極層に少なくとも一部が形成された保護膜と、
を備え、
前記保護膜は、フッ素を含むポリマーからなる、固体電解コンデンサ。
付記6.
前記保護膜は、Siを含まない、付記5に記載の固体電解コンデンサ。
付記7.
前記保護膜は、炭素数が6のパーフルオロアルキル基(C6F13-R)を有し、熱分解温度が200℃~300℃のポリマーからなる、付記5または6に記載の固体電解コンデンサ。
付記8.
前記保護膜の厚さは、0.01~5μmである、付記1ないし7のいずれか1つに記載の固体電解コンデンサ。
付記9.
前記保護膜の厚さは、0.1~2μmである、付記8に記載の固体電解コンデンサ。
付記10.
前記陽極ワイヤに接合された陽極導通部材と、
前記陰極層に接合された陰極導通部材と、
をさらに備える、付記1ないし9のいずれか1つに記載の固体電解コンデンサ。
付記11.
前記保護膜は、少なくとも一部が前記陽極導通部材および前記陰極導通部材に形成されている、付記10に記載の固体電解コンデンサ。
付記12.
前記保護膜は、少なくとも一部が前記陰極層と前記陰極導通部材との間に介在する、付記10に記載の固体電解コンデンサ。
付記13.
前記保護膜は、前記陰極層の全面を覆っている、付記12に記載の固体電解コンデンサ。
付記14.
前記多孔質焼結体および前記陽極ワイヤの全体を覆う封止樹脂をさらに備え、
前記陽極導通部材は、前記封止樹脂に覆われ、かつ、前記陽極ワイヤに接合されている中間部と、板状部材であり、かつ、前記中間部に接合されている露出部と、を備え、
前記陰極導通部材は、板状部材であり、
前記露出部の一部および前記陰極導通部材の一部は、前記封止樹脂から露出して外部端子を構成している、付記10ないし13のいずれか1つに記載の固体電解コンデンサ。
付記15.
前記多孔質焼結体は直方体形状である、付記1ないし14のいずれか1つに記載の固体電解コンデンサ。
付記16.
前記多孔質焼結体は、TaまたはNbからなる、付記1ないし15のいずれか1つに記載の固体電解コンデンサ。
100 :コンデンサ素子
1 :多孔質焼結体
1a,1b,1c:面
15 :細孔
11 :陽極ワイヤ
11a :基端部分
2 :誘電体層
3 :固体電解質層
31 :内部層
32 :外部層
4 :陰極層
41 :下地層
42 :上層
5 :封止樹脂
5a :亀裂
6 :陽極導通部材
6a :外部陽極端子
61 :中間部
62 :露出部
7 :陰極導通部材
7a :外部陰極端子
71 :導電性接合材
8 :保護膜
92 :ワイヤ材料
93 :多孔質体
96,97:リードフレーム
Claims (16)
- 弁作用金属からなる多孔質焼結体と、
前記多孔質焼結体に一部が進入し、かつ、前記多孔質焼結体から突出する陽極ワイヤと、
前記多孔質焼結体に形成された誘電体層と、
前記誘電体層に形成された固体電解質層と、
前記固体電解質層に形成された陰極層と、
前記陰極層に少なくとも一部が形成された保護膜と、
を備え、
前記保護膜のガラス転移点は、180℃以下である、固体電解コンデンサ。 - 前記保護膜のガラス転移点は、110℃以下である、請求項1に記載の固体電解コンデンサ。
- 前記保護膜のガラス転移点は、35~85℃である、請求項2に記載の固体電解コンデンサ。
- 前記保護膜のガラス転移点は、35~50℃である、請求項3に記載の固体電解コンデンサ。
- 弁作用金属からなる多孔質焼結体と、
前記多孔質焼結体に一部が進入し、かつ、前記多孔質焼結体から突出する陽極ワイヤと、
前記多孔質焼結体に形成された誘電体層と、
前記誘電体層に形成された固体電解質層と、
前記固体電解質層に形成された陰極層と、
前記陰極層に少なくとも一部が形成された保護膜と、
を備え、
前記保護膜は、フッ素を含むポリマーからなる、固体電解コンデンサ。 - 前記保護膜は、Siを含まない、請求項5に記載の固体電解コンデンサ。
- 前記保護膜は、炭素数が6のパーフルオロアルキル基(C6F13-R)を有し、熱分解温度が200℃~300℃のポリマーからなる、請求項5または6に記載の固体電解コンデンサ。
- 前記保護膜の厚さは、0.01~5μmである、請求項1ないし7のいずれか1つに記載の固体電解コンデンサ。
- 前記保護膜の厚さは、0.1~2μmである、請求項8に記載の固体電解コンデンサ。
- 前記陽極ワイヤに接合された陽極導通部材と、
前記陰極層に接合された陰極導通部材と、
をさらに備える、請求項1ないし9のいずれか1つに記載の固体電解コンデンサ。 - 前記保護膜は、少なくとも一部が前記陽極導通部材および前記陰極導通部材に形成されている、請求項10に記載の固体電解コンデンサ。
- 前記保護膜は、少なくとも一部が前記陰極層と前記陰極導通部材との間に介在する、請求項10に記載の固体電解コンデンサ。
- 前記保護膜は、前記陰極層の全面を覆っている、請求項12に記載の固体電解コンデンサ。
- 前記多孔質焼結体および前記陽極ワイヤの全体を覆う封止樹脂をさらに備え、
前記陽極導通部材は、前記封止樹脂に覆われ、かつ、前記陽極ワイヤに接合されている中間部と、板状部材であり、かつ、前記中間部に接合されている露出部と、を備え、
前記陰極導通部材は、板状部材であり、
前記露出部の一部および前記陰極導通部材の一部は、前記封止樹脂から露出して外部端子を構成している、請求項10ないし13のいずれか1つに記載の固体電解コンデンサ。 - 前記多孔質焼結体は直方体形状である、請求項1ないし14のいずれか1つに記載の固体電解コンデンサ。
- 前記多孔質焼結体は、TaまたはNbからなる、請求項1ないし15のいずれか1つに記載の固体電解コンデンサ。
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JP6788492B2 (ja) | 2016-12-21 | 2020-11-25 | 株式会社トーキン | 固体電解コンデンサおよびその製造方法 |
JP2018142668A (ja) * | 2017-02-28 | 2018-09-13 | パナソニックIpマネジメント株式会社 | 固体電解コンデンサ |
CN110419087A (zh) | 2017-03-06 | 2019-11-05 | 阿维科斯公司 | 固体电解电容器组装件 |
JP7275055B2 (ja) | 2017-07-03 | 2023-05-17 | キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション | 固体電解キャパシタアセンブリ |
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DE112020002422T5 (de) | 2019-05-17 | 2022-02-17 | Avx Corporation | Delaminierungsresistenter festelektrolytkondensator |
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2020
- 2020-04-22 WO PCT/JP2020/017282 patent/WO2020218319A1/ja active Application Filing
- 2020-04-22 US US17/603,074 patent/US11915886B2/en active Active
- 2020-04-22 CN CN202080030847.8A patent/CN113728408B/zh active Active
- 2020-04-22 KR KR1020217038045A patent/KR20210148365A/ko unknown
- 2020-04-22 JP JP2021516148A patent/JP7473537B2/ja active Active
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JP2009130166A (ja) * | 2007-11-26 | 2009-06-11 | Sanyo Electric Co Ltd | 固体電解コンデンサ |
JP2013501359A (ja) * | 2009-07-30 | 2013-01-10 | ケメット エレクトロニクス コーポレーション | 改善されたesr安定性を備えた固体電解コンデンサ |
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US20220189706A1 (en) | 2022-06-16 |
JP7473537B2 (ja) | 2024-04-23 |
JPWO2020218319A1 (ja) | 2020-10-29 |
US11915886B2 (en) | 2024-02-27 |
CN113728408B (zh) | 2024-03-08 |
CN113728408A (zh) | 2021-11-30 |
KR20210148365A (ko) | 2021-12-07 |
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