WO2020001982A1 - Verfahren zur herstellung einer vielzahl von widerstandsbaueinheiten über ein keramiksubstrat - Google Patents
Verfahren zur herstellung einer vielzahl von widerstandsbaueinheiten über ein keramiksubstrat Download PDFInfo
- Publication number
- WO2020001982A1 WO2020001982A1 PCT/EP2019/065399 EP2019065399W WO2020001982A1 WO 2020001982 A1 WO2020001982 A1 WO 2020001982A1 EP 2019065399 W EP2019065399 W EP 2019065399W WO 2020001982 A1 WO2020001982 A1 WO 2020001982A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resistance
- electrically conductive
- strips
- carrier plate
- conductive material
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/001—Mass resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
Definitions
- the separation ie the formation of individual resistance modules, takes place at the end of the method, suitable cuts severing the carrier plate in the longitudinal direction and in the transverse direction, in such a way that a large number of resistance modules are immediately produced.
- the transverse direction and the longitudinal direction define two mutually perpendicular reference directions and do not necessarily designate a longitudinal shape of the carrier plate, the strip of the resistance material, or the resistance assembly.
- the size of the electrical connections of the resistance elements formed can be determined in a simple manner by a suitable choice of the first and second longitudinal direction cuts and in particular can be minimized independently of the (not arbitrarily scalable) size of the zones of the electrically conductive material. Furthermore, the intermediate regions of the zones of the electrically conductive material make it possible to test the electrical resistance before the separation, in accordance with an advantageous embodiment which will be explained below.
- the rows of strips of the resistance material and the rows of zones of the electrically conductive material are arranged alternately next to one another in the transverse direction, but not necessarily in the same number.
- a respective row of zones of the electrically conductive material can be arranged between two rows of strips of the resistance material, the number of rows of strips of the resistance material corresponding in particular to the number of rows of zones of the electrically conductive material can.
- the strips of the resistance material and the zones of the electrically conductive material are of the same size.
- the strips of the resistance material have the same widths, the same length and the same thickness. A resistance module is thus formed, the resistance elements of which have the same resistance values.
- the resistance material and the electrically conductive material are only applied to the underside of the carrier plate.
- the resistor assembly is thus designed for mounting and contacting in a flip-chip design.
- the advantage of this design is that the resistance module can be connected directly to the electrical circuit of the device or component and / or can be inserted into it, with the connection of further connection wires to the resistance module or to the circuit being dispensed with can be.
- step b) of forming the plurality of strips of the resistance material comprises applying a metal layer to the underside of the carrier plate by sputtering and locally removing the metal layer by evaporation.
- the cathode sputtering the so-called “sputtering”
- sputtering allows layers of the resistance material to be applied to the carrier plate in a small thickness, which are characterized by great uniformity and good reproducibility. This enables a large number of resistance elements to be produced, the resistance values of which are all within a predetermined, narrow range.
- step c) of forming the plurality of zones of the electrically conductive material comprises printing the underside of the carrier plate with an electrically conductive paste, in particular with a silver-palladium alloy.
- an electrically conductive paste in particular with a silver-palladium alloy.
- a printing plate can be used for this purpose, on which the electrically conductive paste is applied in a regular pattern, the pattern corresponding to the arrangement of the zones.
- the pattern of the electrically conductive paste applied to the printing plate is matched to the arrangement of the strips of the resistance material.
- the zones can also be galvanized, in particular nickel-tin-galvanized.
- step b) of forming the plurality of strips of the resistance material and step c) of forming the plurality of zones of the electrically conductive material can also be carried out in reverse order or in part simultaneously.
- the strips of the resistance material can overlap with the zones of the electrically conductive material in such a way that the respective strip of the resistance material partially covers the respective zones of the electrically conductive material, or in such a way that the respective zones of the electrically partially cover the respective strip of the resistive material.
- the carrier plate is cut in step d) by means of a laser beam.
- the transverse direction cuts, the first longitudinal direction cuts and the second longitudinal direction cuts can be carried out in any order.
- the regular arrangement of the transverse direction cuts, the first longitudinal direction cuts and the second longitudinal direction cuts follows or corresponds to the regular pattern of the strips of the resistance material and the regular pattern of the zones of the electrically conductive material.
- a second aspect of the invention relates to a resistance assembly, which has been produced according to a method according to the invention, with a carrier, a group of resistance elements arranged on the underside of the carrier, first electrical connections which are connected to a respective first end of the resistance elements, and second electrical connections, which are connected to a respective second end of the resistance elements, the resistance assembly having a width of less than 0.6 mm and a length of less than 0.8 mm, the width in particular in a range of 0.3 mm is up to 0.34 mm and the length is in particular in a range from 0.54 mm to 0.62 mm.
- Fig. 1 step a) of an embodiment of a method according to the invention for producing a plurality of resistor modules
- step b) of the inventive method which is shown in Fig. 2, a lot of strips 16 of a resistance material is applied to the underside 14 of the carrier plate 10 in a regular pattern.
- the strips 16 are arranged in rows 18 which extend in the longitudinal direction L and are arranged next to one another with respect to the transverse direction Q.
- 2 shows a section of the carrier plate 10, in which, for example, sixteen strips 16 are arranged in four parallel rows 18.
- the arrangement of the strips 16 can be continued in both of the mutually orthogonal directions Q and L according to the pattern shown.
- the strips 16 have a first end 20 and a second end 22 along the transverse direction Q.
- the resistance material can be applied, for example, by sputtering, a process known as "sputtering". This technique has the advantage that the resistance material can be applied in a layer of uniform thickness to the underside 14 of the carrier plate 10 and layers of small thickness can also be produced.
- the resistance material can be applied to the carrier plate, for example, in continuous areas extending parallel along the longitudinal direction L.
- a laser can be used to form the individual strips 16 (segmentation), which removes or evaporates resistance material at predetermined intervals along the longitudinal direction L. This method enables the strips 16 to be arranged precisely and in a precise position.
- the underside 14 of the carrier plate 10 can be covered before the application of the resistance material, for example, by a mask, not shown, which has 16 clearances at the location of the strips and can be made, for example, of plastic.
- step c) of the method according to the invention in which a multiplicity of zones 24 of an electrically conductive material are formed on the underside 14 of the carrier plate 10.
- the zones 24 of the electrically conductive material are applied in a regular pattern on the carrier plate 10, the zones 24 of the electrically conductive material being arranged in a plurality of rows 26 which extend in the longitudinal direction L and are arranged next to one another with respect to the transverse direction Q. are.
- the rows 26 of the zones 24 of the electrically conductive material run parallel to the rows 18 of the strips 16 of the resistance material and alternate with them in the transverse direction Q, so that the number of rows 26 of the zones 24 of the electrically conductive material in Essentially corresponds to the number of rows 18 of strips 16 of the resistance material.
- contact probes 34 in particular Kelvin probes, are brought into contact with the zones 24 of the electrically conductive material which are assigned to a respective strip 16 of the resistance material. 4, only the contact points of the contact probes 34 are illustrated.
- the contact probes 34 are located on that zone 24 of the electrically conductive material that overlaps with the first end 20 of the respective strip 16 of the resistance material and on that zone 24 of the electrically conductive material that overlaps with the second end 22 of the respective strip 16 of the resistance material - as overlapped, created.
- the contact probes 36 are designed to for example using the Kelvin method to measure the electrical resistance of a respective strip 16 of the resistance material and thus the electrical resistance of the respective resistance element to be formed. The measured values can then be used to determine whether the resistance values are in a predetermined range or whether there are deviations.
- step d) of the method according to the invention in which a plurality of resistor assemblies 44 are separated from the carrier plate 10 by rows 18 of strips 16 of the resistor material and rows 26 of zones 24 of the electrically conductive material - the.
- the sequence of cuts includes transverse direction cuts 36 along the transverse direction Q, first longitudinal direction cuts 38 along the longitudinal direction L and second longitudinal direction cuts 40 along the longitudinal direction L.
- the first longitudinal direction cuts 38 separate the first ends 28 from the intermediate regions 30 of a respective row 26 of zones 24 of the electrically conductive material.
- the second longitudinal direction cuts 40 separate the second ends 32 from the intermediate regions 30 of a respective row 26 of zones 24 of the electrically conductive material.
- the sequence of cuts 36, 38, 40 along the transverse direction Q thus alternately forms a respective resistance assembly 44 and a respective remaining section 46 of the carrier plate.
- the respective remaining section 46 comprises separated intermediate areas 30 of a row 26 of zones 24 of the electrically conductive material and is no longer required after the manufacturing process has ended.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201980042448.0A CN112384998B (zh) | 2018-06-25 | 2019-06-12 | 在陶瓷基板上制造多个电阻器单元的方法 |
CA3104943A CA3104943A1 (en) | 2018-06-25 | 2019-06-12 | Method for producing a plurality of resistance modular units over a ceramic substrate |
ES19730343T ES2896949T3 (es) | 2018-06-25 | 2019-06-12 | Método para fabricar una pluralidad de unidades de resistencia sobre un sustrato cerámico |
US17/255,803 US11302462B2 (en) | 2018-06-25 | 2019-06-12 | Method for producing a plurality of resistance modular units over a ceramic substrate |
EP19730343.1A EP3797432B1 (de) | 2018-06-25 | 2019-06-12 | Verfahren zur herstellung einer vielzahl von widerstandsbaueinheiten über ein keramiksubstrat |
KR1020217002406A KR20210024096A (ko) | 2018-06-25 | 2019-06-12 | 세라믹 기판 위에 복수의 저항 모듈식 유닛을 제조하는 방법 |
JP2020571768A JP2021529434A (ja) | 2018-06-25 | 2019-06-12 | セラミック基板の上に複数の抵抗モジュラーユニットを作り出すための方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102018115205.1 | 2018-06-25 | ||
DE102018115205.1A DE102018115205A1 (de) | 2018-06-25 | 2018-06-25 | Verfahren zur Herstellung einer Vielzahl von Widerstandsbaueinheiten |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2020001982A1 true WO2020001982A1 (de) | 2020-01-02 |
Family
ID=66857908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2019/065399 WO2020001982A1 (de) | 2018-06-25 | 2019-06-12 | Verfahren zur herstellung einer vielzahl von widerstandsbaueinheiten über ein keramiksubstrat |
Country Status (10)
Country | Link |
---|---|
US (1) | US11302462B2 (de) |
EP (1) | EP3797432B1 (de) |
JP (1) | JP2021529434A (de) |
KR (1) | KR20210024096A (de) |
CN (1) | CN112384998B (de) |
CA (1) | CA3104943A1 (de) |
DE (1) | DE102018115205A1 (de) |
ES (1) | ES2896949T3 (de) |
HU (1) | HUE057294T2 (de) |
WO (1) | WO2020001982A1 (de) |
Citations (6)
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EP0078089A1 (de) * | 1981-10-28 | 1983-05-04 | Telecommunications Radioelectriques Et Telephoniques T.R.T. | Verfahren zur Herstellung einer überspannungsfesten Versorgungsbrücke und nach diesem Verfahren hergestellte Versorgungsbrücke |
EP0484756A2 (de) * | 1990-11-05 | 1992-05-13 | Isabellenhütte Heusler GmbH KG | Widerstandsanordnung in SMD-Bauweise |
JPH07302704A (ja) * | 1994-05-10 | 1995-11-14 | Matsushita Electric Ind Co Ltd | 抵抗器 |
JP3358990B2 (ja) * | 1998-06-22 | 2002-12-24 | ローム株式会社 | チップ型抵抗器の製造方法 |
JP2006313785A (ja) * | 2005-05-06 | 2006-11-16 | Sumitomo Metal Mining Co Ltd | 薄膜抵抗体およびその製造方法 |
US20140055228A1 (en) * | 2012-08-24 | 2014-02-27 | Ralec Electronic Corporation | Chip resistor device and method for fabricating the same |
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JPS60166102U (ja) | 1984-04-11 | 1985-11-05 | シャープ株式会社 | チツプ部品 |
JPH0632650Y2 (ja) | 1989-08-01 | 1994-08-24 | ローム株式会社 | 抵抗器用基板 |
US5104480A (en) | 1990-10-12 | 1992-04-14 | General Electric Company | Direct patterning of metals over a thermally inefficient surface using a laser |
JP2788156B2 (ja) | 1992-09-18 | 1998-08-20 | ローム株式会社 | 多連型チップ抵抗器における捺印方法 |
JP3309010B2 (ja) * | 1993-09-02 | 2002-07-29 | コーア株式会社 | 電子部品の製造方法 |
JPH08102401A (ja) * | 1994-09-30 | 1996-04-16 | Matsushita Electric Ind Co Ltd | 抵抗器およびその製造方法 |
US5976392A (en) | 1997-03-07 | 1999-11-02 | Yageo Corporation | Method for fabrication of thin film resistor |
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JP3967553B2 (ja) * | 2001-03-09 | 2007-08-29 | ローム株式会社 | チップ型抵抗器の製造方法、およびチップ型抵抗器 |
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-
2018
- 2018-06-25 DE DE102018115205.1A patent/DE102018115205A1/de not_active Withdrawn
-
2019
- 2019-06-12 HU HUE19730343A patent/HUE057294T2/hu unknown
- 2019-06-12 ES ES19730343T patent/ES2896949T3/es active Active
- 2019-06-12 WO PCT/EP2019/065399 patent/WO2020001982A1/de active Search and Examination
- 2019-06-12 KR KR1020217002406A patent/KR20210024096A/ko not_active Application Discontinuation
- 2019-06-12 EP EP19730343.1A patent/EP3797432B1/de active Active
- 2019-06-12 US US17/255,803 patent/US11302462B2/en active Active
- 2019-06-12 CA CA3104943A patent/CA3104943A1/en active Pending
- 2019-06-12 JP JP2020571768A patent/JP2021529434A/ja active Pending
- 2019-06-12 CN CN201980042448.0A patent/CN112384998B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0078089A1 (de) * | 1981-10-28 | 1983-05-04 | Telecommunications Radioelectriques Et Telephoniques T.R.T. | Verfahren zur Herstellung einer überspannungsfesten Versorgungsbrücke und nach diesem Verfahren hergestellte Versorgungsbrücke |
EP0484756A2 (de) * | 1990-11-05 | 1992-05-13 | Isabellenhütte Heusler GmbH KG | Widerstandsanordnung in SMD-Bauweise |
JPH07302704A (ja) * | 1994-05-10 | 1995-11-14 | Matsushita Electric Ind Co Ltd | 抵抗器 |
JP3358990B2 (ja) * | 1998-06-22 | 2002-12-24 | ローム株式会社 | チップ型抵抗器の製造方法 |
JP2006313785A (ja) * | 2005-05-06 | 2006-11-16 | Sumitomo Metal Mining Co Ltd | 薄膜抵抗体およびその製造方法 |
US20140055228A1 (en) * | 2012-08-24 | 2014-02-27 | Ralec Electronic Corporation | Chip resistor device and method for fabricating the same |
Also Published As
Publication number | Publication date |
---|---|
US20210272724A1 (en) | 2021-09-02 |
JP2021529434A (ja) | 2021-10-28 |
HUE057294T2 (hu) | 2022-05-28 |
KR20210024096A (ko) | 2021-03-04 |
CN112384998A (zh) | 2021-02-19 |
EP3797432A1 (de) | 2021-03-31 |
ES2896949T3 (es) | 2022-02-28 |
CN112384998B (zh) | 2022-06-07 |
CA3104943A1 (en) | 2020-01-02 |
DE102018115205A1 (de) | 2020-01-02 |
EP3797432B1 (de) | 2021-09-15 |
TW202001940A (zh) | 2020-01-01 |
US11302462B2 (en) | 2022-04-12 |
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