EP3797432A1 - Verfahren zur herstellung einer vielzahl von widerstandsbaueinheiten über ein keramiksubstrat - Google Patents
Verfahren zur herstellung einer vielzahl von widerstandsbaueinheiten über ein keramiksubstratInfo
- Publication number
- EP3797432A1 EP3797432A1 EP19730343.1A EP19730343A EP3797432A1 EP 3797432 A1 EP3797432 A1 EP 3797432A1 EP 19730343 A EP19730343 A EP 19730343A EP 3797432 A1 EP3797432 A1 EP 3797432A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- resistance
- electrically conductive
- strips
- carrier plate
- conductive material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000000919 ceramic Substances 0.000 title claims description 6
- 239000000758 substrate Substances 0.000 title claims description 6
- 239000000463 material Substances 0.000 claims abstract description 107
- 239000004020 conductor Substances 0.000 claims abstract description 84
- 238000000034 method Methods 0.000 claims description 48
- 239000000523 sample Substances 0.000 claims description 17
- 238000004544 sputter deposition Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000001704 evaporation Methods 0.000 claims description 2
- 230000008020 evaporation Effects 0.000 claims description 2
- 230000000712 assembly Effects 0.000 description 6
- 238000000429 assembly Methods 0.000 description 6
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/001—Mass resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
Definitions
- the present invention relates to a method for producing a multiplicity of resistance structural units, each of which comprises a carrier with a group of resistance elements, at the ends of which a respective first and second electrical connection is provided.
- Such methods are used to manufacture resistance modules which are used in electrical components and / or electrical devices and can be conductively connected to the circuits of the components or devices by means of the electrical connections.
- the resistance modules can have at least two resistance elements which are formed on one side of a carrier in strips arranged parallel to one another.
- the strips of the resistance elements can be twice as wide as they are long, which usually results in a roughly square shape for the resistance modules.
- a carrier plate which has an upper side and a lower side;
- first longitudinal direction cuts along the longitudinal direction and second longitudinal direction cuts along the longitudinal direction such that the transverse direction cuts between see groups of mutually associated, longitudinally adjacent strips of the resistance material, that further the first longitudinal direction cuts separate the first ends from the intermediate regions of a respective row of zones of the electrically conductive material, and that the second longitudinal direction cuts the second ends from the intermediate regions cut off a respective row of zones of the electrically conductive material (in particular the aforementioned row or another row), so that a respective resistance unit and a respective remaining section of the carrier plate, the separated intermediate areas, are alternately formed along the transverse direction has a number of zones of the electrically conductive material.
- the resistance material and the electrically conductive material are thus applied to the carrier plate in a regular manner in strips or zones, the applied resistance material and the applied electrically conductive material overlapping in certain areas. These overlapping areas serve as electrical connections of the resistor modules, by means of which the resistor modules can be conductively connected to the electrical component or device.
- the separation ie the formation of individual resistance modules, takes place at the end of the method, suitable cuts severing the carrier plate in the longitudinal direction and in the transverse direction, in such a way that a large number of resistance modules are immediately produced.
- the transverse direction and the longitudinal direction define two mutually perpendicular reference directions and do not necessarily designate a longitudinal shape of the carrier plate, the strip of the resistance material, or the resistance assembly.
- the size of the electrical connections of the resistance elements formed can be determined in a simple manner by a suitable choice of the first and second longitudinal direction cuts and in particular can be minimized independently of the (not arbitrarily scalable) size of the zones of the electrically conductive material. Furthermore, the intermediate regions of the zones of the electrically conductive material make it possible to test the electrical resistance before the separation, in accordance with an advantageous embodiment which will be explained below.
- the rows of strips of the resistance material and the rows of zones of the electrically conductive material are arranged alternately next to one another in the transverse direction, but not necessarily in the same number.
- a respective row of zones of the electrically conductive material can be arranged between two rows of strips of the resistance material, the number of rows of strips of the resistance material corresponding in particular to the number of rows of zones of the electrically conductive material can.
- two respective rows of zones of the electrically conductive material are arranged between two rows of strips of the resistance material, the number of rows of zones of the electrically conductive material than in particular twice as large as the number of rows of strips of the resistance material.
- the method does not result in any restrictions regarding the dimensions of the resistor modules.
- the method can be used to produce resistance modules which are small in size and can also be used in components or devices which require a particularly compact design of the resistor modules, such as mobile telephones, smartphones, smartwatches, hearing aids or similar devices.
- the respective resistor assembly formed by cutting the carrier plate comprises a portion of the carrier plate that forms the carrier of the resistor module, a group of strips of the resistor material that form the group of resistor elements of the resistor module, a number of first ends zones of the electrically conductive material which form the first electrical connections of the resistance elements and a number of second ends of zones of the electrically conductive material which form the second electrical connections of the resistance elements.
- each resistance element is electrically conductively connected in the transverse direction by overlapping its two ends with a respective end of a zone of the electrically conductive material, which serve as a respective electrical connection for connection to the electrical component or device.
- the mutual spacings of the transverse direction cuts and the mutual spacings of the first and second longitudinal direction cuts are preferably selected such that the resistor module formed, in particular a resistor module with two resistor elements, a width less than 0.6 mm and a length less than 0.8 mm, the width in particular in a range from 0.3 mm to 0.34 mm and the length in particular in a range from 0.54 mm to 0.62 mm and the width preferably approx 0.32 mm and the length is preferably 0.58 mm.
- These small dimensions are outside the range of the resistor modules that can be produced by previous methods. In other words, resistance units in these dimensions can only be produced by the method according to the invention.
- the group of strips of the resistance material comprises two strips of the resistance material.
- the resistance module accordingly comprises two resistance elements. Embodiments with more than two, for example three or four, strips of the resistance material are also possible.
- Each of the resistance elements can be connected separately to an electrical component or device or to an electrical circuit by means of the first or second ends of two zones of the electrically conductive material or the electrical connections formed thereby.
- the strips of the resistance material and the zones of the electrically conductive material are of the same size.
- the strips of the resistance material have the same widths, the same length and the same thickness. A resistance module is thus formed, the resistance elements of which have the same resistance values.
- the strips of the resistance material as the resistance assembly formed are of different sizes, in particular with different widths transverse to the direction of extension of the strips of the resistance material between the first end and the second end. Accordingly, the resistance values of the resistance elements of the respective resistance module formed can be of different sizes.
- the carrier plate preferably comprises a ceramic substrate which, in particular due to its electrically insulating property, prevents electrical contact between the resistance material and the electrically conductive material outside the zones of the electrically conductive material.
- Such carrier plates are simple to manufacture and can be manufactured inexpensively and in large numbers.
- the ceramic substrate enables a simple and problem-free cutting of the carrier plate in step d).
- the resistance material and the electrically conductive material are only applied to the underside of the carrier plate.
- the resistor assembly is thus designed for mounting and contacting in a flip-chip design.
- the advantage of this design is that the resistance module can be connected directly to the electrical circuit of the device or component and / or can be inserted into it, with the connection of further connection wires to the resistance module or to the circuit being dispensed with can be.
- step b) of forming the plurality of strips of the resistance material comprises applying a metal layer to the underside of the carrier plate by sputtering and locally removing the metal layer by evaporation.
- the cathode sputtering the so-called “sputtering”
- sputtering allows layers of the resistance material to be applied to the carrier plate in a small thickness, which are characterized by great uniformity and good reproducibility. This enables a large number of resistance elements to be produced, the resistance values of which are all within a predetermined, narrow range.
- the resistance material in the form of a multiplicity of strips to the carrier plate, can be removed or evaporated outside the predetermined areas of the strips, for example by a laser. Using this method, the resistance material can be limited precisely and with great positional accuracy to the areas of the strips.
- a mask can be applied to the underside of the carrier plate, which has a plurality of exemptions corresponding to the strips.
- the resistance material can be evaporated onto the underside of the carrier plate. Through the mask, the resistance material comes into contact with the carrier plate only at the locations of the exemptions, as a result of which After the mask has been removed, a large number of strips of the resistance material form on the carrier plate.
- other methods are also conceivable to form the strips of the resistance material.
- step c) of forming the plurality of zones of the electrically conductive material comprises printing the underside of the carrier plate with an electrically conductive paste, in particular with a silver-palladium alloy.
- an electrically conductive paste in particular with a silver-palladium alloy.
- a printing plate can be used for this purpose, on which the electrically conductive paste is applied in a regular pattern, the pattern corresponding to the arrangement of the zones.
- the pattern of the electrically conductive paste applied to the printing plate is matched to the arrangement of the strips of the resistance material.
- the zones can also be galvanized, in particular nickel-tin-galvanized.
- step b) of forming the plurality of strips of the resistance material and step c) of forming the plurality of zones of the electrically conductive material can also be carried out in reverse order or in part simultaneously.
- the strips of the resistance material can overlap with the zones of the electrically conductive material in such a way that the respective strip of the resistance material partially covers the respective zones of the electrically conductive material, or in such a way that the respective zones of the electrically partially cover the respective strip of the resistive material.
- the carrier plate is cut in step d) by means of a laser beam.
- the transverse direction cuts, the first longitudinal direction cuts and the second longitudinal direction cuts can be carried out in any order.
- the regular arrangement of the transverse direction cuts, the first longitudinal direction cuts and the second longitudinal direction cuts follows or corresponds to the regular pattern of the strips of the resistance material and the regular pattern of the zones of the electrically conductive material.
- the electrical resistance of a respective strip of the resistance material is measured before the carrier plate is cut through the first and second longitudinal direction cuts, in particular before step d), with contact probes at that zone of the electrically conductive material which is at the first end of the respective strip of the resistance material is overlapped, and are applied to that zone of the electrically conductive material which overlaps with the second end of the respective strip of the resistance material.
- the measured values can be checked as part of a quality control to determine whether the resistance values are in a predetermined nominal range or whether deviations from them can be determined.
- the contact probes can be Kelvin probes, which use the Kelvin method to measure the electrical resistance of the respective zone of the resistance material.
- the measurement of the electrical resistance before cutting through the carrier plate has the advantage that the entire area of a respective zone of the electrically conductive material is available for the attachment of a contact probe, which is due to the small size of the resistance unit and the small size ratio between the contact probe - de and the respective zone of the electrically conductive material, positioning of the contact probe is made considerably easier or only possible.
- a second aspect of the invention relates to a resistance assembly, which has been produced according to a method according to the invention, with a carrier, a group of resistance elements arranged on the underside of the carrier, first electrical connections which are connected to a respective first end of the resistance elements, and second electrical connections, which are connected to a respective second end of the resistance elements, the resistance assembly having a width of less than 0.6 mm and a length of less than 0.8 mm, the width in particular in a range of 0.3 mm is up to 0.34 mm and the length is in particular in a range from 0.54 mm to 0.62 mm.
- the resistor assembly is designed for mounting and contacting in a flip-chip design and, due to its small size, can be used in electrical components or devices that require a particularly compact design of the resistor assemblies, such as cell phones, smartphones, smart watches, hearing aids or similar devices.
- Fig. 1 step a) of an embodiment of a method according to the invention for producing a plurality of resistor modules
- FIG. 6 shows the bottom view of an embodiment of a resistance module according to the invention.
- the carrier plate 10 can be formed from a ceramic substrate, which forms an electrically insulating carrier device for receiving a resistance material and an electrically conductive material.
- arrows and the letters “Q”, “L” denote a transverse direction Q and a longitudinal direction L orthogonal thereto.
- the transverse direction Q and the longitudinal direction L define two reference directions running perpendicular to one another, and do not necessarily denote a longitudinal shape of the Carrier plate 10 or the resistance units formed.
- the carrier plate 10 comprises an upper side 12 and a lower side 14, which is shown in plan view in FIG. 1.
- step b) of the inventive method which is shown in Fig. 2, a lot of strips 16 of a resistance material is applied to the underside 14 of the carrier plate 10 in a regular pattern.
- the strips 16 are arranged in rows 18 which extend in the longitudinal direction L and are arranged next to one another with respect to the transverse direction Q.
- 2 shows a section of the carrier plate 10, in which, for example, sixteen strips 16 are arranged in four parallel rows 18.
- the arrangement of the strips 16 can be continued in both of the mutually orthogonal directions Q and L according to the pattern shown.
- the strips 16 have a first end 20 and a second end 22 along the transverse direction Q.
- the resistance material can be applied, for example, by sputtering, a process known as "sputtering". This technique has the advantage that the resistance material can be applied in a layer of uniform thickness to the underside 14 of the carrier plate 10 and layers of small thickness can also be produced.
- the resistance material can be applied to the carrier plate, for example, in continuous areas extending parallel along the longitudinal direction L.
- a laser can be used to form the individual strips 16 (segmentation), which removes or evaporates resistance material at predetermined intervals along the longitudinal direction L. This method enables the strips 16 to be arranged precisely and in a precise position.
- the underside 14 of the carrier plate 10 can be covered before the application of the resistance material, for example, by a mask, not shown, which has 16 clearances at the location of the strips and can be made, for example, of plastic.
- the strips 16 of the resistance material are equal to one another, ie the strips 16 of the resistance material have the same widths and lengths and the same thicknesses. Accordingly, the strips 16 of the resistance material have the same electrical resistance values. In other embodiments, the strips can have different sizes in order to allow strips 16 of the resistance material with different electrical see generating resistance values. This can be achieved in a simple manner by varying the length of the strips along the longitudinal direction L.
- step c) of the method according to the invention in which a multiplicity of zones 24 of an electrically conductive material are formed on the underside 14 of the carrier plate 10.
- the zones 24 of the electrically conductive material are applied in a regular pattern on the carrier plate 10, the zones 24 of the electrically conductive material being arranged in a plurality of rows 26 which extend in the longitudinal direction L and are arranged next to one another with respect to the transverse direction Q. are.
- the rows 26 of the zones 24 of the electrically conductive material run parallel to the rows 18 of the strips 16 of the resistance material and alternate with them in the transverse direction Q, so that the number of rows 26 of the zones 24 of the electrically conductive material in Essentially corresponds to the number of rows 18 of strips 16 of the resistance material.
- the zones 24 of the electrically conductive material each have a first end 28, an intermediate region 30 and a second end 32 along the transverse direction Q, with the exception of the edge regions of the carrier plate 10, the strips 16 of the resistance material at their first ends 20 with the overlap the first end 28 of a respective zone 24 of the electrically conductive material and overlap at their second ends 22 with the second end 32 of a respective zone 24 of the electrically conductive material.
- the regular pattern of the zones 24 is matched to the regular pattern of the strips 16, specifically such that on each strip 16 there is an overlap area with a respective zone 24 at its first end 20 and an overlap area with a respective zone 24 at its second end 22 is formed.
- the zones 24 of the electrically conductive material can consist, for example, of a silver-palladium alloy. Zones 24 can be attached in Form of a paste, in particular by printing on the underside 14 of the carrier plate 10. For this purpose, the electrically conductive paste is applied to a printing plate, not shown, in a regular pattern corresponding to a predetermined arrangement of the zones 24. Using this technique, a large number of zones 24 of the electrically conductive material can be generated efficiently in one printing process.
- the step b) shown in FIG. 2 of forming the plurality of strips 16 of the resistance material and the step c) shown in FIG. 3 of forming the plurality of zones 24 of the electrically conductive material can also be carried out in reverse order or partially simultaneously become.
- the overlapping of the strips 16 of the resistive material with the zones 24 of the electrically conductive material can either be such that the respective strip 16 of the resistive material partially covers the respective zones 24 of the electrically conductive material, or in such a way that the respective zones 24 of the electrically conductive material partially cover the respective strip 16 of the resistance material.
- contact probes 34 in particular Kelvin probes, are brought into contact with the zones 24 of the electrically conductive material which are assigned to a respective strip 16 of the resistance material. 4, only the contact points of the contact probes 34 are illustrated.
- the contact probes 34 are located on that zone 24 of the electrically conductive material that overlaps with the first end 20 of the respective strip 16 of the resistance material and on that zone 24 of the electrically conductive material that overlaps with the second end 22 of the respective strip 16 of the resistance material - as overlapped, created.
- the contact probes 36 are designed to for example using the Kelvin method to measure the electrical resistance of a respective strip 16 of the resistance material and thus the electrical resistance of the respective resistance element to be formed. The measured values can then be used to determine whether the resistance values are in a predetermined range or whether there are deviations.
- step d By carrying out the functional test after step c) of the method and before severing the carrier plate 10 according to step d), the attachment of the contact probes 34 to the respective zones 24 is facilitated, since the area of the intermediate regions 30 is also at this time of the method the zones 24 are available for this. At least one pair of contact probes 34 is required for testing the strips 16 of the resistance material (one contact probe 34 each on the two sides of the respective strip 16), and several pairs of contact probes 34 can also be used, several Streak fen 16 to check at the same time.
- step d) of the method according to the invention in which a plurality of resistor assemblies 44 are separated from the carrier plate 10 by rows 18 of strips 16 of the resistor material and rows 26 of zones 24 of the electrically conductive material - the.
- the sequence of cuts includes transverse direction cuts 36 along the transverse direction Q, first longitudinal direction cuts 38 along the longitudinal direction L and second longitudinal direction cuts 40 along the longitudinal direction L.
- the regular arrangement of the transverse direction cuts 36, the first longitudinal direction cuts 38 and the second longitudinal direction cuts 40 corresponds to the regular pattern of the strips 16 of the resistance material and the regular pattern of the zones 24 of the electrically conductive material.
- the transverse direction cuts 36 run between groups 42 of strips 16 of the resistance material which are assigned to one another and are adjacent to one another in the longitudinal direction L.
- the groups 42 each comprise two strips 16.
- the groups 42 can also comprise more or only one strip 16.
- the number of strips 16 of the resistance material of the resistance assemblies 44 can be changed by simply adapting the cutting distances.
- the first longitudinal direction cuts 38 separate the first ends 28 from the intermediate regions 30 of a respective row 26 of zones 24 of the electrically conductive material.
- the second longitudinal direction cuts 40 separate the second ends 32 from the intermediate regions 30 of a respective row 26 of zones 24 of the electrically conductive material.
- the sequence of cuts 36, 38, 40 along the transverse direction Q thus alternately forms a respective resistance assembly 44 and a respective remaining section 46 of the carrier plate.
- the respective remaining section 46 comprises separated intermediate areas 30 of a row 26 of zones 24 of the electrically conductive material and is no longer required after the manufacturing process has ended.
- transverse direction cuts 36, the first longitudinal direction cuts 38 and the second longitudinal direction cuts 40 are generally carried out in any order for severing the carrier plate 10.
- the carrier plate 10 can be severed, for example, by means of a laser beam, which permits precise and efficient structuring of the carrier plate 10 in one operation.
- the strips 16 of the resistance material can generally have a longitudinal shape (in particular essentially rectangular), wherein the respective longitudinal axis of the strips 16 of the resistance material can be aligned along the longitudinal direction L or along the transverse direction Q.
- the strips 16 of the resistance material can also have an essentially square shape, for example. 6 shows, in a bottom view, an example of a resistor assembly 44 of the plurality of resistor assemblies that were generated by steps a) to d) of the method explained.
- each resistor assembly 44 comprises a portion of the carrier plate 10 that forms the carrier 48 of the resistor assembly 44, a group 42 of strips 16 of the resistor material that form a group of resistor elements 50 of the resistor assembly 44, a number of first Ends 28 of zones 24 of the electrically conductive material, which form first electrical connections 52 of the resistance elements 50, and a number of second ends 32 of zones 24 of the electrically conductive material, which form second electrical connections 54 of the resistance elements 50.
- the first electrical connections 52 are connected to a respective first end of the resistance elements 50 and the second electrical connections 54 are connected to a respective second end of the resistance elements 50.
- the arrangement of the resistor elements 50 on the underside of the carrier 48 makes the resistor module 44 particularly suitable for mounting and contacting in a flip-chip design.
- the mutual distances of the transverse direction cuts 36 and the mutual distances of the first and second longitudinal direction cuts 38, 40 are selected such that the resistance assembly 44 has a width less than 0.6 mm and a length less than 0.8 mm, the width in particular can be in a range from 0.3 mm to 0.34 mm and the length can in particular be in a range from 0.54 mm to 0.62 mm. Due to its small size, which can be achieved by the method according to the invention, the resistor assembly 44 can be used in electrical components or devices which require a particularly small and compact design of the resistor assemblies. LIST OF REFERENCES
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102018115205.1A DE102018115205A1 (de) | 2018-06-25 | 2018-06-25 | Verfahren zur Herstellung einer Vielzahl von Widerstandsbaueinheiten |
PCT/EP2019/065399 WO2020001982A1 (de) | 2018-06-25 | 2019-06-12 | Verfahren zur herstellung einer vielzahl von widerstandsbaueinheiten über ein keramiksubstrat |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3797432A1 true EP3797432A1 (de) | 2021-03-31 |
EP3797432B1 EP3797432B1 (de) | 2021-09-15 |
Family
ID=66857908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19730343.1A Active EP3797432B1 (de) | 2018-06-25 | 2019-06-12 | Verfahren zur herstellung einer vielzahl von widerstandsbaueinheiten über ein keramiksubstrat |
Country Status (11)
Country | Link |
---|---|
US (1) | US11302462B2 (de) |
EP (1) | EP3797432B1 (de) |
JP (1) | JP2021529434A (de) |
KR (1) | KR20210024096A (de) |
CN (1) | CN112384998B (de) |
CA (1) | CA3104943A1 (de) |
DE (1) | DE102018115205A1 (de) |
ES (1) | ES2896949T3 (de) |
HU (1) | HUE057294T2 (de) |
TW (1) | TW202001940A (de) |
WO (1) | WO2020001982A1 (de) |
Family Cites Families (33)
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FR2515445A1 (fr) * | 1981-10-28 | 1983-04-29 | Trt Telecom Radio Electr | Procede de realisation d'un pont d'alimentation soumis a des surcharges importantes et pont d'alimentation realise suivant ce procede |
JPS60166102U (ja) | 1984-04-11 | 1985-11-05 | シャープ株式会社 | チツプ部品 |
JPH0632650Y2 (ja) | 1989-08-01 | 1994-08-24 | ローム株式会社 | 抵抗器用基板 |
US5104480A (en) | 1990-10-12 | 1992-04-14 | General Electric Company | Direct patterning of metals over a thermally inefficient surface using a laser |
DE9015206U1 (de) * | 1990-11-05 | 1991-01-17 | Isabellenhuette Heusler Gmbh Kg, 6340 Dillenburg, De | |
JP2788156B2 (ja) | 1992-09-18 | 1998-08-20 | ローム株式会社 | 多連型チップ抵抗器における捺印方法 |
JP3309010B2 (ja) * | 1993-09-02 | 2002-07-29 | コーア株式会社 | 電子部品の製造方法 |
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DE19755753A1 (de) | 1997-12-16 | 1999-06-17 | Bosch Gmbh Robert | Widerstandsbauelement und Verfahren zu seiner Herstellung |
JPH11204315A (ja) * | 1998-01-12 | 1999-07-30 | Matsushita Electric Ind Co Ltd | 抵抗器の製造方法 |
JPH11340002A (ja) * | 1998-05-26 | 1999-12-10 | Rohm Co Ltd | チップ型抵抗器用集合基板 |
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DE10110179B4 (de) * | 2001-03-02 | 2004-10-14 | BCcomponents Holding B.V. | Verfahren zum Herstellen von Dünnschicht-Chipwiderständen |
JP3967553B2 (ja) * | 2001-03-09 | 2007-08-29 | ローム株式会社 | チップ型抵抗器の製造方法、およびチップ型抵抗器 |
JP3958532B2 (ja) * | 2001-04-16 | 2007-08-15 | ローム株式会社 | チップ抵抗器の製造方法 |
JP4078042B2 (ja) | 2001-06-12 | 2008-04-23 | ローム株式会社 | 複数の素子を有するチップ型電子部品の製造方法 |
JP2003124010A (ja) * | 2001-10-18 | 2003-04-25 | Rohm Co Ltd | チップ型電子部品の製造方法、およびチップ型電子部品 |
JP3846312B2 (ja) * | 2002-01-15 | 2006-11-15 | 松下電器産業株式会社 | 多連チップ抵抗器の製造方法 |
CN1328002C (zh) * | 2002-03-12 | 2007-07-25 | 浜松光子学株式会社 | 加工对象物切割方法 |
TWI520269B (zh) * | 2002-12-03 | 2016-02-01 | Hamamatsu Photonics Kk | Cutting method of semiconductor substrate |
JP4047760B2 (ja) * | 2003-04-28 | 2008-02-13 | ローム株式会社 | チップ抵抗器およびその製造方法 |
JP4358664B2 (ja) * | 2004-03-24 | 2009-11-04 | ローム株式会社 | チップ抵抗器およびその製造方法 |
JP4380586B2 (ja) * | 2005-05-06 | 2009-12-09 | 住友金属鉱山株式会社 | 薄膜抵抗体およびその製造方法 |
TW200709235A (en) | 2005-05-20 | 2007-03-01 | Electro Scient Ind Inc | Method of forming passive electronic components on a substrate by direct write technique using shaped uniform laser beam |
JP2007073693A (ja) * | 2005-09-06 | 2007-03-22 | Rohm Co Ltd | チップ抵抗器とのその製造方法 |
JP4745027B2 (ja) * | 2005-11-09 | 2011-08-10 | 太陽社電気株式会社 | チップ抵抗器の製造方法 |
TWI287806B (en) * | 2006-02-22 | 2007-10-01 | Walsin Technology Corp | Method of manufacturing chip resistor |
US7882621B2 (en) * | 2008-02-29 | 2011-02-08 | Yageo Corporation | Method for making chip resistor components |
CN102394164B (zh) * | 2011-07-11 | 2014-04-16 | 广东风华高新科技股份有限公司 | 一种小型片式电阻的制造方法 |
TW201409493A (zh) * | 2012-08-24 | 2014-03-01 | Ralec Electronic Corp | 晶片式排列電阻器及其製造方法 |
CN107622848A (zh) * | 2017-09-22 | 2018-01-23 | 中国振华集团云科电子有限公司 | 一种分裂式印刷结构以及导体印刷结构的制备方法 |
-
2018
- 2018-06-25 DE DE102018115205.1A patent/DE102018115205A1/de not_active Withdrawn
-
2019
- 2019-06-12 HU HUE19730343A patent/HUE057294T2/hu unknown
- 2019-06-12 JP JP2020571768A patent/JP2021529434A/ja active Pending
- 2019-06-12 US US17/255,803 patent/US11302462B2/en active Active
- 2019-06-12 ES ES19730343T patent/ES2896949T3/es active Active
- 2019-06-12 KR KR1020217002406A patent/KR20210024096A/ko not_active Application Discontinuation
- 2019-06-12 WO PCT/EP2019/065399 patent/WO2020001982A1/de active Search and Examination
- 2019-06-12 CN CN201980042448.0A patent/CN112384998B/zh active Active
- 2019-06-12 CA CA3104943A patent/CA3104943A1/en active Pending
- 2019-06-12 EP EP19730343.1A patent/EP3797432B1/de active Active
- 2019-06-18 TW TW108121095A patent/TW202001940A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US20210272724A1 (en) | 2021-09-02 |
TW202001940A (zh) | 2020-01-01 |
EP3797432B1 (de) | 2021-09-15 |
CN112384998B (zh) | 2022-06-07 |
HUE057294T2 (hu) | 2022-05-28 |
US11302462B2 (en) | 2022-04-12 |
KR20210024096A (ko) | 2021-03-04 |
WO2020001982A1 (de) | 2020-01-02 |
ES2896949T3 (es) | 2022-02-28 |
CN112384998A (zh) | 2021-02-19 |
JP2021529434A (ja) | 2021-10-28 |
CA3104943A1 (en) | 2020-01-02 |
DE102018115205A1 (de) | 2020-01-02 |
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