WO2019007034A1 - 一种电路板、电气元件和显示装置 - Google Patents

一种电路板、电气元件和显示装置 Download PDF

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Publication number
WO2019007034A1
WO2019007034A1 PCT/CN2018/073421 CN2018073421W WO2019007034A1 WO 2019007034 A1 WO2019007034 A1 WO 2019007034A1 CN 2018073421 W CN2018073421 W CN 2018073421W WO 2019007034 A1 WO2019007034 A1 WO 2019007034A1
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WIPO (PCT)
Prior art keywords
circuit board
wiring pad
pad
wiring
pads
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PCT/CN2018/073421
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English (en)
French (fr)
Inventor
王灵国
王鑫
刘颖
王耀东
樊斌
刘彬彬
Original Assignee
京东方科技集团股份有限公司
北京京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 北京京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/329,005 priority Critical patent/US10779410B2/en
Publication of WO2019007034A1 publication Critical patent/WO2019007034A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178—Means for venting or for letting gases escape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present application relates to the field of wiring pad design, and in particular to a circuit board, an electrical component, and a display device.
  • the solvent or water vapor in the flux rapidly oxidizes to form a gas that does not escape in time before the solder paste solidifies so as to be at the ground pad and the ground terminal. Bubbles are formed between them, causing problems of soldering bubbles in the pads after the ground pads are soldered to the ground terminals.
  • the present disclosure is directed to the above-described technical problems existing in the prior art, and provides a circuit board, an electrical component, and a display device.
  • the circuit board can intersect the bubble discharge path of the split wiring pad at the geometric center point of the connection pad, so that the gas generated during the soldering process of the terminal pad and other circuit board terminals can be separated by the bubble discharge path formed by the division.
  • the geometric center point of the wiring pad is discharged to the edge, thereby eliminating or reducing soldering bubbles between the wiring pad and the terminal during soldering, making the connection between the two more secure, and also increasing the wiring pad and the terminal block.
  • the contact area between the two makes it easier to dissipate heat after soldering.
  • the present disclosure provides a circuit board including a wiring pad and at least one bubble discharge path, wherein the bubble discharge path extends through the wiring pad.
  • the wiring pad includes a plurality of sub-pads divided by a plurality of bubble discharge paths, the plurality of bubble discharge paths intersecting at a first point, the first point being a geometric center of the connection pad .
  • the shape of the terminal pad is polygonal or circular, the side length of each side of the polygon is in the range of 1 to 2 mm, and the radius of the circle has a length ranging from 1 to 2 mm.
  • the number is 4 to 7.
  • the polygon may be a rectangle, a pentagon or a hexagon.
  • the wiring pad is divided into four blocks that are centrally symmetrical.
  • the polygon may be a rectangle, a pentagon or a hexagon.
  • a plurality of the sub-pads have equal areas.
  • At least one vent hole is disposed on each of the plurality of sub-pads
  • adjacent sub-pads are separated by a distance ranging from 0.2 to 0.3 mm.
  • the wiring pad comprises a ground pad.
  • the present disclosure also provides an electrical component, including the above described circuit board.
  • the present disclosure also provides a display device including the above-described circuit board and/or the above-described electrical components.
  • the display device further includes a display panel, and the circuit board is a peripheral circuit board that is bound to the display panel.
  • the electrical component provided by the present disclosure can be used to connect the wiring pads on the circuit board of the electrical component to the terminals on the other circuit board by using the above-mentioned circuit board, and the generated gas is separated from the bubble discharge path formed by the segmentation.
  • the geometric center point of the pad is discharged to its edge, thereby eliminating or reducing soldering bubbles between the wiring pad and the terminal during soldering, making the connection between the two more secure, while also increasing the connection between the wiring pad and the terminal
  • the contact area makes it easier to dissipate heat after soldering.
  • the display device provided by the present disclosure can improve the display quality of the display device by using the above-mentioned circuit board or electrical component, thereby improving display performance.
  • FIG. 1 is a schematic view showing a large-area bubble generated in a ground pad after soldering in a solder pad and a ground terminal in the prior art
  • FIG. 2 is a schematic view of a wiring pad in which a vent hole is not provided in some embodiments of the present disclosure
  • FIG. 4 is a schematic diagram of a wiring pad on a circuit board in some embodiments of the present disclosure.
  • peripheral circuit board manufacturing generally improves the problem of soldering bubbles by controlling process parameters, such as controlling the temperature of the shop floor, controlling the constant temperature time, controlling the reflow time, and separately wrapping the circuits inside the peripheral circuit board and electrical components.
  • the crystal material film layer is baked to remove the moisture in the flux during the soldering process. Even so, the ground pad 3 and the ground terminal 4 still generate a relatively large area of air bubbles 5 in the ground pad after soldering, as shown in FIG. Shown.
  • Some embodiments of the present disclosure provide a circuit board, as shown in FIG. 2, including a wiring pad 1 including a plurality of sub-pads divided by a plurality of bubble discharge paths 2 (which may also be referred to as division lines) 11.
  • the bubble discharge path 2 of the divided wiring pad 1 is linear and intersects at a first point P, which is the geometric center of the wiring pad 1.
  • the wiring pad 1 is a center symmetrical pattern, and the first point P is the symmetrical center of the wiring pad 1.
  • the gas generated during the soldering process of the terminal pad 1 and the terminals of the other circuit boards is discharged from the center of symmetry of the terminal pad 1, thereby reducing the bubble area in the central area of the wiring pad 1 and making the wire bonding.
  • the welding of the disc 1 and the terminal is more firm, and the contact area of the two is larger, which is advantageous for heat dissipation.
  • the wiring pad 1 in this embodiment has a rectangular shape.
  • the rectangular wiring pad 1 is divided into four centrally symmetric ones. Therefore, the gas generated during the soldering process of the connection pads of the wiring pad 1 and other circuit boards is discharged from the center of symmetry of the wiring pad 1 to the peripheral edge, thereby reducing the bubble area in the central area of the wiring pad 1 and making the wiring welding.
  • the welding of the disc 1 and the terminal is more firm, and the contact area of the two is larger, which is advantageous for heat dissipation.
  • the distance L between the adjacent sub-pads 11 ranges from 0.2 to 0.3 mm. That is, the width L of the bubble discharge path formed by dividing the wiring pad 1 is in the range of 0.2 to 0.3 mm.
  • the gas formed in the central region of the wiring pad 1 at the time of soldering is discharged from the central region of the wiring pad 1 through the bubble discharge path, and the width of the bubble discharge path is set to ensure that the gas in the central region of the wiring pad 1 is smoothly discharged to the same In the edge area, there is no airflow blockage.
  • the wiring pad 1 includes a ground pad.
  • the circuit board in this embodiment may be any circuit board integrated with a plurality of small electrical components, the other circuit boards refer to circuit boards in small electrical components, and the terminals of other circuit boards refer to circuit boards in small electrical components.
  • the ground terminal also includes the ground pad and can also be divided into a plurality of sub-pads.
  • a plurality of ground pads are usually disposed on the circuit board, and each of the ground pads is used for soldering connection with the ground on each small electrical component. Since the ground pad on the board and the ground in the small electrical component are usually larger than the other functional pins, soldering bubbles are easily generated during soldering, so the ground pad is divided to facilitate the soldering process on the board. The discharge of gas between the ground pad and the ground on the board in the small electrical component.
  • the shape of the wiring pad 1 is polygonal or circular, and the side length of each side of the polygon is 2 ⁇ 4mm, the radius of the circle has a length ranging from 2 to 4 mm, and the number of the sub-pads 11 is 8 to 12.
  • the polygon may be a rectangle, a pentagon or a hexagon. Since a polygon having a side length of 2 to 4 mm or a circular wiring pad 1 having a radius of 2 to 4 mm has a large area, a large number of sub-pads 11 can be divided and formed. Such division not only does not affect the contact connection between the wiring pad 1 and the terminal, but also ensures that a large area of the wiring pad 1 is welded, and gas formed in the central portion thereof can be discharged through a plurality of bubble discharge paths. To its edge region, the retention of gas in the central region is avoided or reduced, thereby reducing the area of the bubble formed between the wiring pad 1 and the terminal.
  • the wiring pad 1 in this embodiment has a rectangular shape.
  • the rectangular wiring pad 1 is divided into 8 blocks that are centrally symmetrical. This is advantageous for the gas generated during the soldering process of the terminal pad 1 and other circuit board terminals to be discharged from the center of symmetry of the wiring pad 1 to the peripheral edge through the eight divided gaps (ie, the existing eight bubble discharge paths). Thereby, the bubble area in the central area of the wiring pad 1 is reduced, the soldering of the wiring pad 1 and the terminal is more firm, and the contact area of the two is larger, which is advantageous for heat dissipation.
  • Some embodiments of the present disclosure provide an electrical component, including the above described circuit board. That is, the wiring pads on the circuit board in the electrical component in some embodiments of the present disclosure may be designed as the structure in the above-described embodiments of the present disclosure.
  • the arrangement is such that when the wiring pads on the circuit board in the electrical component are soldered to the terminals on the other circuit board, the generated gas is separated from the geometric center point of the wiring pad by the bubble discharge path formed by the division. Discharge, thereby eliminating or reducing welding bubbles between the wiring pads and the terminals during soldering, so that the connection between the two is stronger, and also increases the contact area between the wiring pads and the terminals, so that after soldering More easy to dissipate heat
  • the electrical component provided by some embodiments of the present disclosure can generate a wiring pad on a circuit board in an electrical component and a connection terminal on another circuit board by using the circuit board provided in the embodiment of the present disclosure.
  • the gas is discharged from the geometric center point of the wiring pad to the edge thereof by dividing the bubble discharge path, thereby eliminating or reducing welding bubbles between the wiring pad and the terminal during soldering, so that the connection between the two is stronger, and at the same time
  • the contact area between the wiring pad and the terminal is increased, so that the two are easier to dissipate after soldering.
  • Some embodiments of the present disclosure provide a display device including a circuit board provided in an embodiment of the present disclosure.
  • the display device may further include a display panel, and the circuit board is a peripheral circuit board that is bound to the display panel.
  • the display device provided by the present disclosure may be any product or component having a display function such as a liquid crystal panel, a liquid crystal television, an OLED panel, an OLED television, a display, a mobile phone, a navigator or the like.

Abstract

一种电路板、电气元件和显示装置。该电路板包括接线焊盘（1），接线焊盘（1）分割为多个子焊盘（11），分割接线焊盘（1）的气泡排放路径（2）相交于第一点（P），第一点（P）为接线焊盘（1）的几何中心。该电路板通过使分割接线焊盘（1）的气泡排放路径（2）呈直线状并且相交于接线焊盘（1）的几何中心点（P），能使接线焊盘（1）与其他电路板的接线端子在焊接过程中产生的气体通过分割形成的气泡排放路径（2）从接线焊盘（1）的几何中心点（P）向其边缘排出，从而消除或减少焊接时接线焊盘（1）与接线端子之间的焊接气泡，使二者的连接更加牢固，同时还增大了接线焊盘（1）与接线端子之间的接触面积，使二者焊接后更容易散热。

Description

一种电路板、电气元件和显示装置
相关申请的交叉引用
本申请要求于2017年7月3日递交的中国专利申请第201720792608.1号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本申请涉及接线焊盘设计技术领域，具体地，涉及一种电路板、电气元件和显示装置。
背景技术
在外围电路板的接地焊盘与其他电气元件的接地端子焊接时，因为助焊剂中的溶剂或水汽快速氧化形成气体，该气体在焊膏固化前未及时逸出从而在接地焊盘和接地端子之间形成气泡，造成接地焊盘与接地端子焊接后焊盘内存在焊接气泡的问题。
公开内容
本公开针对现有技术中存在的上述技术问题，提供一种电路板、电气元件和显示装置。该电路板通过使分割接线焊盘的气泡排放路径相交于接线焊盘的几何中心点，能使该接线焊盘与其他电路板的接线端子焊接过程中产生的气体通过分割形成的气泡排放路径从接线焊盘的几何中心点向其边缘排出，从而消除或减少焊接时接线焊盘与接线端子之间的焊接气泡，使二者的连接更加牢固，同时还增大了接线焊盘与接线端子之间的接触面积，使二者焊接后更容易散热。
本公开提供一种电路板，包括接线焊盘和至少一条气泡排放路径，其中，所述气泡排放路径贯穿所述接线焊盘。
可选地，所述接线焊盘包括由多条气泡排放路径分割的多个子焊盘，所述多条气泡排放路径相交于第一点，所述第一点为所 述接线焊盘的几何中心。
可选地，所述接线焊盘为中心对称图形，所述第一点为所述接线焊盘的对称中心。
可选地，所述接线焊盘的形状为多边形或圆形，所述多边形的每边的边长范围为1～2mm，所述圆形的半径长度范围为1～2mm，所述子焊盘的数量为4～7块。
可选地，所述多边形可以是矩形、五边形或六边形。
可选地，所述接线焊盘被分割为中心对称的4块。
可选地，所述接线焊盘的形状为多边形或圆形，所述多边形的每边的边长范围为2～4mm，所述圆形的半径长度范围为2～4mm，所述子焊盘的数量为8～12块。
可选地，所述多边形可以是矩形、五边形或六边形。
可选地，所述接线焊盘被分割为中心对称的4块。
可选地，多个所述子焊盘的面积相等。
可选地，所述接线焊盘上开设有至少一个排气孔，所述排气孔设置于所述接线焊盘的四周边缘区域。
可选地，所述多个子焊盘中的每一个上均设置有至少一个排气孔
可选地，相邻的所述子焊盘的间隔距离范围为0.2～0.3mm。
可选地，所述接线焊盘包括接地焊盘。
本公开还提供一种电气元件，包括上述电路板。
本公开还提供一种显示装置，包括上述电路板和/或上述电气元件。
可选地，所述显示装置还包括显示面板，所述电路板为与所述显示面板绑定连接的外围电路板。
本公开的有益效果：本公开所提供的电路板，通过使分割接线焊盘的气泡排放路径相交于接线焊盘的几何中心点，能使接线焊盘与第一电路板的接线端子焊接过程中产生的气体通过分割形成的气泡排放路径从接线焊盘的几何中心点向其边缘排出，从而消除或减少焊接时接线焊盘与接线端子之间的焊接气泡，使二 者的连接更加牢固，同时还增大了接线焊盘与接线端子之间的接触面积，使二者焊接后更容易散热。
本公开所提供的电气元件，通过采用上述电路板，能够使电气元件中电路板上的接线焊盘与其他电路板上的接线端子焊接连接时，产生的气体通过分割形成的气泡排放路径从接线焊盘的几何中心点向其边缘排出，从而消除或减少焊接时接线焊盘与接线端子之间的焊接气泡，使二者的连接更加牢固，同时还增大了接线焊盘与接线端子之间的接触面积，使二者焊接后更容易散热。
本公开所提供的显示装置，通过采用上述电路板或电气元件，能够提高该显示装置的制作质量，从而提高其显示性能。
附图说明
图1为现有技术中接地焊盘和接地端子在焊接后接地焊盘内产生大面积气泡的示意图；
图2为本公开一些实施例中未设置排气孔的接线焊盘的示意图；
图3为本公开一些实施例中设置有排气孔的接线焊盘的示意图；以及
图4为本公开一些实施例中电路板上接线焊盘的示意图。
具体实施方式
为使本领域的技术人员更好地理解本公开的技术方案，下面结合附图和具体实施方式对本公开所提供的一种电路板、电气元件和显示装置作进一步详细描述。
目前，外围电路板制作一般是通过控制制程参数来改善焊接气泡的问题，例如控制车间温度，控制恒温时间，控制回流时间，以及分别对外围电路板和电气元件中对其内部的电路进行包裹封装的晶体材料膜层进行烘烤来排除焊接过程中助焊剂中的水分，即便如此，接地焊盘3和接地端子4在焊接后接地焊盘内依 然会产生面积比较大的气泡5，如图1所示。
气泡的存在会导致接地焊盘与接地端子之间的接触面积减小、接触电阻增大，二者之间的焊接连接不牢固，最终容易导致电路故障。
因此，如何消除外围电路板的接地焊盘与其他电气元件的接地端子之间的焊接气泡已成为目前亟待解决的问题。
本公开的一些实施例提供一种电路板，如图2所示，包括接线焊盘1，接线焊盘1包括由多条气泡排放路径2(也可以称为分割线)分割的多个子焊盘11，分割接线焊盘1的气泡排放路径2呈直线状并且相交于第一点P，第一点P为接线焊盘1的几何中心。
通过使分割接线焊盘1的气泡排放路径2相交于接线焊盘1的几何中心点，能使接线焊盘1与其他电路板的接线端子在焊接过程中产生的气体通过分割形成的气泡排放路径2从接线焊盘1的几何中心点向其边缘排出，从而消除或减少焊接时接线焊盘1与接线端子之间的焊接气泡，使二者的连接更加牢固，同时还增大了接线焊盘1与接线端子之间的接触面积，使二者焊接后更容易散热。
可选地，接线焊盘1为中心对称图形，第一点P为接线焊盘1的对称中心。如此设置，更加有利于接线焊盘1与其他电路板的接线端子在焊接过程中产生的气体从接线焊盘1的对称中心排出，从而减小接线焊盘1中心区域的气泡面积，使接线焊盘1与接线端子的焊接更加牢固，且二者的接触面积更大，利于散热。
可选的，接线焊盘1的形状为多边形或圆形，多边形的每边的边长范围为1～2mm，圆形的半径长度范围为1～2mm，子焊盘11的数量为4～7块。其中，多边形可以是矩形、五边形或六边形等形状。由于边长范围为1～2mm的多边形或半径长度范围为1～2mm的圆形的接线焊盘1面积较小，所以分割形成的子焊盘11数量较少。对于面积较小的接线焊盘1，其分割形成的子焊盘11数量不能太多，因为分割的子焊盘11的数量太多会减小接线 焊盘1与接线端子之间的接触面积，从而影响接线焊盘1与接线端子之间的接触连接。
如图2所示，本实施例中接线焊盘1为矩形。将矩形接线焊盘1分割为中心对称的4块。如此有利于接线焊盘1与其他电路板的接线端子在焊接过程中产生的气体从接线焊盘1的对称中心向四周边缘排出，从而减小接线焊盘1中心区域的气泡面积，使接线焊盘1与接线端子的焊接更加牢固，且二者的接触面积更大，利于散热。
可选的，多个子焊盘11的面积相等。如此能使分割子焊盘11的气泡排放路径2从接线焊盘1的中心向其边缘均匀发散分布，从而有利于焊接时在接线焊盘1的中心区域形成的气体通过气泡排放路径2均匀排出至接线焊盘1的四周边缘区域，避免气体在接线焊盘1中心区域的局部滞留较多，进而使接线焊盘1中心区域不会形成较大面积的气泡。
如图3所示，接线焊盘1上开设有多个排气孔12，排气孔12设置于接线焊盘1的四周边缘区域。排气孔12的设置，便于焊接时在接线焊盘1中心区域形成的气体通过气泡排放路径排出到接线焊盘1的边缘后，从接线焊盘1边缘上的排气孔12排出，从而避免或减少气体在接线焊盘1四周边缘区域滞留形成气泡，进而使接线焊盘1与接线端子的焊接更加牢固。
可选的，相邻的子焊盘11之间的间隔距离L范围为0.2～0.3mm。即，分割接线焊盘1而形成的气泡排放路径的宽度L范围为0.2～0.3mm。焊接时形成于接线焊盘1中心区域的气体通过该气泡排放路径从接线焊盘1的中心区域排出，而该气泡排放路径的宽度的设置能确保接线焊盘1中心区域的气体顺利排出至其边缘区域，不会形成气流阻塞。
接线焊盘1包括接地焊盘。另外，本实施例中的电路板可以为集成有多个小电气元件的任意电路板，其他电路板指小电气元件中的电路板，其他电路板的接线端子指小电气元件中的电路板上的接地端，该接地端也包括接地焊盘的形式，并且也可以分割 为多个子焊盘。电路板上通常设置有多个接地焊盘，各个接地焊盘分别用于与各个小电气元件上的接地端进行焊接连接。由于电路板上的接地焊盘和小电气元件中的接地端通常比其他功能管脚的面积大，焊接时容易产生焊接气泡，所以对接地焊盘进行分割，以利于焊接过程中电路板上的接地焊盘与小电气元件中的电路板上的接地端之间气体的排出。
本公开的另一些实施例提供一种电路板，与一些实施例中不同的是，如图4所示，接线焊盘1的形状为多边形或圆形，多边形的每边的边长范围为2～4mm，圆形的半径长度范围为2～4mm，子焊盘11的数量为8～12块。
其中，多边形可以是矩形、五边形或六边形等形状。由于边长范围为2～4mm的多边形或半径长度范围为2～4mm的圆形的接线焊盘1面积较大，所以可以分割形成较多数量的子焊盘11。如此分割不仅不会影响接线焊盘1与接线端子之间的接触连接，而且还能确保较大面积的接线焊盘1在焊接时，形成在其中心区域的气体能够通过多条气泡排放路径排出至其边缘区域，避免或减少中心区域气体的滞留，从而减小形成在接线焊盘1与接线端子之间的气泡面积。
如图4所示，本实施例中接线焊盘1为矩形。将矩形接线焊盘1分割为中心对称的8块。如此有利于接线焊盘1与其他电路板的接线端子在焊接过程中产生的气体通过8条分割间隙(即，存在的8条气泡排放路径)从接线焊盘1的对称中心向四周边缘排出，从而减小接线焊盘1中心区域的气泡面积，使接线焊盘1与接线端子的焊接更加牢固，且二者的接触面积更大，利于散热。
本实施例中电路板的其他结构与一些实施例中相同，此处不再赘述。
本公开实施例所提供的电路板，通过使分割接线焊盘的气泡排放路径呈直线状并且相交于接线焊盘的几何中心点，能使接线焊盘与其他电路板的接线端子在焊接过程中产生的气体通过分割形成的气泡排放路径(分割间隙)从接线焊盘的几何中心点向 其边缘排出，从而消除或减少焊接时接线焊盘与接线端子之间的焊接气泡，使二者的连接更加牢固，同时还增大了接线焊盘与接线端子之间的接触面积，使二者焊接后更容易散热。
本公开一些实施例提供一种电气元件，包括上述电路板。即本公开一些实施例中电气元件中的电路板上的接线焊盘可以设计为本公开上述实施例中的结构。如此设置，能够使电气元件中的电路板上的接线焊盘与其他电路板上的接线端子在焊接连接时，产生的气体通过分割形成的气泡排放路径从接线焊盘的几何中心点向其边缘排出，从而消除或减少焊接时接线焊盘与接线端子之间的焊接气泡，使二者的连接更加牢固，同时还增大了接线焊盘与接线端子之间的接触面积，使二者焊接后更容易散热。
需要说明的是，电气元件中的电路板上的接线焊盘与其他电路板上的接线端子在焊接连接时，只将接线焊盘与接线端子中的一个设置为分割子焊盘的形式，因为如果二者都设置为分割子焊盘的形式，反而不利于接线焊盘与接线端子之间的良好接触和连接，同时如果两者的气泡排放路径对位不准，还非常不利于焊接时接线焊盘中心区域气体的顺利排出。
本公开一些实施例所提供的电气元件，通过采用本公开实施例中提供的电路板，能够使电气元件中的电路板上的接线焊盘与其他电路板上的接线端子在焊接连接时，产生的气体通过分割形成的气泡排放路径从接线焊盘的几何中心点向其边缘排出，从而消除或减少焊接时接线焊盘与接线端子之间的焊接气泡，使二者的连接更加牢固，同时还增大了接线焊盘与接线端子之间的接触面积，使二者焊接后更容易散热。
本公开一些实施例提供一种显示装置，包括本公开实施例中提供的电路板。
其中，显示装置还可以包括显示面板，电路板为与显示面板绑定连接的外围电路板。
需要说明的是，该显示装置也可以包括本公开实施例中提供电气元件。
通过采用本公开实施例中提供的电路板或者本公开实施例中提供中的电气元件，能够提高该显示装置的制作质量，从而提高其显示性能。
本公开所提供的显示装置可以为液晶面板、液晶电视、OLED面板、OLED电视、显示器、手机、导航仪等任何具有显示功能的产品或部件。
可以理解的是，以上实施方式仅仅是为了说明本公开的原理而采用的示例性实施方式，然而本公开并不局限于此。对于本领域内的普通技术人员而言，在不脱离本公开的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本公开的保护范围。

Claims (17)

  1. 一种电路板，包括接线焊盘和至少一条气泡排放路径，其中，所述气泡排放路径贯穿所述接线焊盘。
  2. 根据权利要求1所述的电路板，其中，所述接线焊盘包括由多条气泡排放路径分割成的多个子焊盘，所述多条气泡排放路径相交于第一点，所述第一点为所述接线焊盘的几何中心。
  3. 根据权利要求2所述的电路板，其中，所述接线焊盘为中心对称图形，所述第一点为所述接线焊盘的对称中心。
  4. 根据权利要求2或3所述的电路板，其中，所述接线焊盘的形状为多边形或圆形，所述多边形的每边的边长范围为1～2mm，所述圆形的半径长度范围为1～2mm，所述子焊盘的数量为4～7块。
  5. 根据权利要求4所述的电路板，其中，所述多边形可以是矩形、五边形或六边形。
  6. 根据权利要求5所述的电路板，其中，所述接线焊盘被分割为中心对称的4块。
  7. 根据权利要求2或3所述的电路板，其中，所述接线焊盘的形状为多边形或圆形，所述多边形的每边的边长范围为2～4mm，所述圆形的半径长度范围为2～4mm，所述子焊盘的数量为8～12块。
  8. 根据权利要求7所述的电路板，其中，所述多边形可以是矩形、五边形或六边形。
  9. 根据权利要求8所述的电路板，其中，所述接线焊盘被分割为中心对称的4块。
  10. 根据权利要求2-9中任一项所述的电路板，其中，多个所述子焊盘的面积相等。
  11. 根据权利要求2-10中任一项所述的电路板，其中，所述接线焊盘上开设有至少一个排气孔，所述排气孔设置于所述接线焊盘的四周边缘区域。
  12. 根据权利要求11所述的电路板，其中，所述多个子焊盘中的每一个上均设置有至少一个排气孔。
  13. 根据权利要求1-12中任一项所述的电路板，其中，相邻的所述子焊盘的间隔距离范围为0.2～0.3mm。
  14. 根据权利要求2-13中任一项所述的电路板，其中，所述接线焊盘包括接地焊盘。
  15. 一种电气元件，其中，包括权利要求1-14任意一项所述的电路板。
  16. 一种显示装置，其中，包括权利要求1-14任意一项所述的电路板和/或权利要求15所述的电气元件。
  17. 根据权利要求16所述的显示装置，其中，还包括显示面板，所述电路板为与所述显示面板绑定连接的外围电路板。
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