WO2018216319A1 - チタンめっき部材の製造方法 - Google Patents
チタンめっき部材の製造方法 Download PDFInfo
- Publication number
- WO2018216319A1 WO2018216319A1 PCT/JP2018/009738 JP2018009738W WO2018216319A1 WO 2018216319 A1 WO2018216319 A1 WO 2018216319A1 JP 2018009738 W JP2018009738 W JP 2018009738W WO 2018216319 A1 WO2018216319 A1 WO 2018216319A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- titanium
- molten salt
- plating film
- titanium plating
- cleaning
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/28—Cleaning or pickling metallic material with solutions or molten salts with molten salts
- C23G1/32—Heavy metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/66—Electroplating: Baths therefor from melts
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/08—Rinsing
Definitions
- the present disclosure relates to a method for manufacturing a titanium plated member.
- the present disclosure claims priority based on Japanese Patent Application No. 2017-1000075, which is a Japanese patent application filed on May 22, 2017. All the descriptions described in the Japanese patent application are incorporated herein by reference.
- Patent Document 1 Japanese Unexamined Patent Publication No. 2015-193899
- Patent Document 1 an alloy film of Fe and Ti is formed on the surface of an Fe wire by using a plating bath in which K 2 TiF 6 and TiO 2 are added to KF-KCl. It is described.
- Non-Patent Document 1 describes a method of forming a titanium film on the surface of Ni and Fe substrates using a plating bath in which K 2 TiF 6 is added to LiF—NaF—KF.
- a method for manufacturing a titanium-plated member includes a step of preparing a base material having a conductive surface, and the base material includes at least one Group 1 metal ion of lithium ions and sodium ions.
- the titanium plating film is cleaned by contacting with a molten salt for cleaning containing at least one compound selected from the group consisting of: In the step of forming a plating film, in the step of removing the first deposit adhered to the surface of the titanium plating film, and in the step of washing the titanium plating film with water and washing with the molten salt for washing, the titanium plating Removing a second deposit adhering to the surface of the film.
- FIG. 1 is a schematic cross-sectional view showing an example of a part of a titanium plating member.
- FIG. 2 is a flowchart showing a procedure for manufacturing a titanium plated member.
- FIG. 3 is a schematic cross-sectional view showing an example of a state in which a substrate is immersed in the molten salt titanium plating solution composition.
- FIG. 4 is a graph showing the corrosion current density of each electrode in physiological saline.
- FIG. 5 is a graph showing the correlation between the current density and potential of each electrode in simulated seawater.
- FIG. 6 is a graph showing the correlation between the current density and potential of each electrode in a simulated electrolyte solution of a polymer electrolyte fuel cell (PEFC).
- FIG. 7 is another graph showing the correlation between the current density and potential of each electrode in a simulated electrolyte solution of a polymer electrolyte fuel cell (PEFC).
- PEFC polymer electrolyte fuel cell
- a method for producing a titanium-plated member includes a step of preparing a base material having a conductive surface, and the base material is at least one group 1 of lithium ions and sodium ions.
- a step of immersing in a molten salt titanium plating solution composition containing metal ions, fluoride ions, and titanium ions, and the substrate immersed in the molten salt titanium plating solution composition as a cathode A step of forming a titanium plating film on the surface by energizing and covering the surface of the substrate with titanium; and the titanium plating film is made of an alkali metal chloride, an alkaline earth metal chloride, and Cleaning the titanium plating film by contacting with a molten salt for cleaning containing at least one compound selected from the group consisting of potassium fluoride, In the step of forming a tan plating film, in the step of removing the first deposit adhered to the surface of the titanium plating film, and in the step of washing the titanium plating
- Titanium has a strong binding force with oxygen, so it easily reacts with water to form oxides and hydroxides and is not suitable for plating from aqueous solutions. Therefore, in order to form a titanium plating film on a substrate, a plating bath of a molten salt titanium plating solution composition made of a molten salt containing titanium ions is used.
- a molten salt titanium plating solution composition containing a predetermined amount of a metal fluoride that is a source of fluoride ions is selected. Potassium fluoride is used as a metal fluoride that is a source of fluoride ions.
- representative metal fluorides that are sources of fluoride ions include alkali metal fluorides such as lithium fluoride (LiF) and sodium fluoride (NaF).
- Lithium fluoride (LiF) and sodium fluoride (NaF) are ionized into lithium ions (LI + ) or sodium ions (Na + ) and fluoride ions (F ⁇ ) in the molten salt.
- LI + , Na + , and F ⁇ work effectively in the molten salt for plating, there is a problem that LiF and NaF re-formed after plating are poorly water-soluble and cannot be removed sufficiently by washing with water. is there.
- the substrate to be plated is a structure having a complicated shape such as a porous shape, it is difficult to sufficiently remove the poorly water-soluble metal fluoride from the plating film only by washing with water. Therefore, reduction of the residual amount of the hardly water-soluble fluoride on the surface of the titanium plating film is required.
- the titanium plated film is at least selected from the group consisting of alkali metal chlorides, alkaline earth metal chlorides, and potassium fluoride.
- the first deposit contains one or both of poorly water-soluble LiF and NaF. Since the compound contained in the cleaning molten salt has a higher compatibility with LiF and NaF than water, the compound is washed with the cleaning molten salt to remove the first deposits, thereby obtaining titanium. The amount of LiF and NaF remaining on the surface of the plating film can be reduced.
- the manufacturing method of the titanium plating member of the present disclosure further includes a step of removing the second deposit adhered to the surface of the titanium plating film in the step of washing the titanium plating film with water and washing with the molten salt for washing.
- the alkali metal chloride, alkaline earth metal chloride, and potassium fluoride contained in the molten salt for washing have higher solubility in water than LiF and NaF. Therefore, after passing through the step of washing with the washing molten salt, the surface of the titanium plating film is further washed with water to remove the second deposit, thereby reducing the amount of residue on the surface of the titanium plating film. Can do.
- the contact of the titanium plating film with the molten salt for washing is performed by immersing the substrate on which the titanium plated film is formed in the molten salt for washing. May be performed.
- a method of contacting the titanium plating film with the molten salt for cleaning a method of immersing the substrate on which the titanium plating film is formed in the molten salt for cleaning sufficiently melts the entire surface of the titanium plating film for cleaning. Salt can be contacted. As a result, the residual amount of poorly water-soluble substances such as LiF and NaF on the surface of the titanium plating film can be more suitably reduced.
- the molten salt titanium plating solution composition may further contain chloride ions.
- chloride ions By containing chloride ions together with fluoride ions, the melting point of the molten salt titanium plating solution composition can be lowered by lowering the melting point. As a result, it is possible to perform titanium plating at a lower temperature.
- the amount of fluoride ions may be 30 mol% or more and 50 mol% or less with respect to 100 mol% in total of the chloride ions and the fluoride ions. Within such a range, the melting point of the molten salt titanium plating solution composition can be further lowered. As a result, it is possible to perform titanium plating at an even lower temperature.
- the content of the titanium ion with respect to 100 mol% of all cations contained in the molten salt titanium plating solution composition is preferably 0.1 mol% or more and 12 mol% or less.
- the titanium plated member is preferably an insoluble electrode. This makes it possible to provide an insoluble electrode having a titanium plating film with a reduced amount of surface residue.
- the titanium-plated member is preferably a current collector. This makes it possible to provide a current collector having a titanium plating film with a reduced amount of surface residue.
- the titanium plated member is preferably a biomaterial. This makes it possible to provide a biomaterial having a titanium plating film with a reduced amount of surface residue. Such a biomaterial can also be excellent in corrosion resistance.
- a to B means the upper and lower limits of the range (that is, not less than A and not more than B), and there is no unit description in A, and the unit is described only in B.
- the unit of and the unit of B are the same.
- FIG. 1 is a schematic cross-sectional view showing an example of a part of a titanium plating member.
- FIG. 2 is a flowchart showing a procedure for manufacturing a titanium plated member.
- FIG. 3 is a schematic cross-sectional view showing an example of a state in which a substrate is immersed in the molten salt titanium plating solution composition.
- a titanium plating member 1 includes a base material 10 and a titanium plating film 20 (hereinafter, also simply referred to as “plating film 20”) formed on the surface of the base material 10.
- the plating film 20 is a film made of titanium.
- the titanium plated member 1 is manufactured through steps S10 to S50 shown in FIG.
- the manufacturing method of the titanium plating member 1 which concerns on this Embodiment is a process (S10) which prepares the base material 10 which has an electroconductive surface, and the base material 10 is 1st at least 1st among lithium ion and sodium ion.
- plating solution composition containing a group metal ion, a fluoride ion, and a titanium ion, and a molten salt titanium plating
- the titanium plating film 20 is at least selected from the group consisting of alkali metal chlorides, alkaline earth metal chlorides, and potassium fluoride.
- the first deposit adhered to the surface of the titanium plating film 20 is removed in the step of forming the titanium plating film 20. It is a process.
- the step (S50) of washing the surface of the titanium plating film 20 with water the second deposit adhered to the surface of the titanium plating film 20 in the step of washing the titanium plating film 20 with water and washing with the molten salt for washing is removed. It is a process.
- processes other than S10, S20, S30, S40, and S50 may be included. Hereinafter, each of these steps will be described.
- a base material 10 having a conductive surface is prepared (S10).
- the material which comprises the base material 10 is not specifically limited as long as it is a material which has an electroconductive surface.
- Examples of the base material 10 include a base material made of iron or nickel, or a base material made of an alloy thereof, or a multilayer base material having a layer of iron, nickel, or an alloy thereof on the surface.
- the shape of the substrate 10 is not particularly limited.
- a substrate 10 having various shapes such as a plate shape, a column shape, a pipe shape, and a mesh shape can be employed.
- the substrate 10 is immersed in the plating solution composition 50 (S20).
- the plating solution composition 50 includes at least one Group 1 metal ion of lithium ions (Li + ) and sodium ions (Na + ), fluoride ions (F ⁇ ), and titanium. Ions (Ti n + (n is an integer of 2 or more and 4 or less; the same applies hereinafter)).
- the plating solution composition 50 can contain a plurality of types having different valences as titanium ions.
- the plating solution composition 50 preferably further contains chloride ions (Cl ⁇ ).
- the plating solution composition 50 is, for example, in a mixture of at least one of lithium fluoride (LiF) and sodium fluoride (NaF) and at least one of lithium chloride (LiCl) and sodium chloride (NaCl). It can be prepared as a molten salt by dissolving a titanium compound as a source of Ti n + .
- titanium compounds that supply Ti n + include hexafluorotitanic acid (H 2 TiF 6 ), potassium potassium fluoride (K 2 TiF 6 ), ammonium titanium fluoride ((NH 4 ) 2 TiF 6 ), and titanium fluoride. Soda (Na 2 TiF 6 ), potassium potassium oxalate dihydrate (K 2 TiO (C 2 O 4 ) 2 .2H 2 O), titanium chloride (III) (TiCl 3 ), titanium chloride (IV) (TiCl 4 ).
- the plating solution composition 50 may contain cations other than Li + and Na + .
- the plating solution composition 50 may contain potassium ions (K + ).
- K + potassium ions
- the content of K + with respect to 100 mol% of all ionic components contained in the plating solution composition 50 is 5 mol% or less, or other that does not generate K + . It is preferably used in combination with a titanium compound (for example, titanium (IV) chloride).
- the plating solution composition that is a molten salt
- LiF, NaF, LiCl, and NaCl are ionized and exist in the states of Li + , Na + , F ⁇ , and Cl ⁇ .
- the titanium compound is ionized and exists in the state of Ti n + .
- the presence of Li + , Na + , F ⁇ , Cl ⁇ and Tin + in the plating solution composition 50 of the present embodiment means that, for example, the plating solution composition 50 is dissolved in a mixed solution of nitric acid and hydrofluoric acid.
- the solution can be confirmed by analyzing the solution by ICP emission spectrometry (Inductively Coupled Plasma Spectrometry).
- ICP emission spectroscopic analyzer for example, iCAP6200 manufactured by Thermo Fisher Scientific Co., Ltd. can be used.
- the amount of F ⁇ with respect to the total of 100 mol% of Cl ⁇ and F ⁇ is preferably 30 mol% or more and 50 mol% or less.
- Cl - and F - F to the total 100 mol% of the - is a large melting point depression effect when in a predetermined range ratio.
- the amount of F ⁇ relative to the total of 100 mol% of Cl ⁇ and F ⁇ is in the range of 30 mol% or more and 50 mol% or less, the decrease in melting point is large, and plating can be easily performed even at lower temperatures.
- the amount of F ⁇ relative to the total of 100 mol% of Cl ⁇ and F ⁇ is in the range of 30 mol% or more and 45 mol% or less, the amount of decrease in the melting point is more preferable.
- Anion fraction of - F in the plating solution composition 50 of the present embodiment is preferably 0.1 to 0.9, 0. More preferably, it is 25 or more and 0.75 or less.
- the anion fraction of F ⁇ is 0.1 or more, particularly 0.25 or more, the titanium plating member 1 having the plating film 20 with high surface smoothness can be obtained more reliably.
- the anion fraction of F ⁇ is 0.9 or less, particularly when it is 0.75 or less, removal of the residual material after the formation of the plating film 20 tends to be easy. Therefore, the anion fraction of F ⁇ is preferably within the above range.
- the content of Ti n + in the plating solution composition is not particularly limited, and is appropriately set according to the plating conditions. However, if the content of Ti n + is too large, unnecessary precipitates are formed, resulting in a large reduction in current efficiency. On the other hand, if the content of Ti n + is too small, the titanium plating film is not sufficiently formed. Therefore, the content of Ti n + is preferably 20 mol% or less, more preferably 12 mol% or less with respect to 100 mol% of all cations in the plating solution composition.
- the content of Ti n + is preferably 0.1 mol% or more, more preferably 0.5 mol% or more with respect to 100 mol% of all cations in the plating solution composition. That is, it is preferable that the content of the titanium ion with respect to 100 mol% of all cations contained in the molten salt titanium plating solution composition is 0.1 mol% or more and 12 mol% or less.
- the substrate 10 immersed in the plating solution composition 50 is energized so as to become a cathode, and the surface of the substrate 10 is coated with titanium, thereby forming the titanium plating film 20 on the surface (S30). .
- a voltage is applied between the anode 30 immersed in the plating solution composition 50 and the substrate 10 as a cathode in a state where the substrate 10 is immersed in the plating solution composition 50. It is carried out by applying and energizing to electrolyze the plating solution composition 50. Thereby, titanium ions are reduced to titanium on the surface of the base material 10 which is a cathode, and the surface of the base material 10 is covered with titanium, whereby the plating film 20 is formed on the surface of the base material 10.
- the electrolysis of the plating solution composition 50 is performed so that the absolute value of the current density on the substrate 10 of the current flowing between the anode 30 and the substrate 10 is 1 mA / cm 2 or more and 500 mA / cm 2 or less.
- the absolute value of the current density is preferably 1 mA / cm 2 or more and 300 mA / cm 2 or less.
- the plating film 20 having higher surface smoothness can be formed.
- the surface of the plating film 20 is washed with a washing molten salt (S40).
- a washing molten salt containing at least one compound selected from the group consisting of an alkali metal chloride, an alkaline earth metal chloride, and potassium fluoride.
- the first deposit contains one or both of poorly water-soluble LiF and NaF. Since the compound contained in the cleaning molten salt has higher compatibility with LiF and NaF than water, LiF and NaF remaining on the surface of the plating film 20 are obtained by performing a cleaning step with the cleaning molten salt. The amount of can be reduced.
- alkali metal chloride examples include lithium chloride (LiCl), sodium chloride (NaCl), and potassium chloride (KCl).
- alkaline earth metal chloride examples include magnesium chloride (MgCl 2 ) and calcium chloride (CaCl 2 ).
- the molten salt may contain these alkali metal chlorides, alkaline earth metal chlorides and potassium fluoride alone or in combination of two or more.
- the molten salt may contain salts other than these alkali metal chlorides, alkaline earth metal chlorides and potassium fluoride.
- Alkali metal chlorides, alkaline earth metal chlorides and potassium fluoride (KF) have higher compatibility with LiF and NaF than water. Therefore, the amount of LiF and NaF on the surface of the plating film 20 can be reduced by bringing the plating film 20 into contact with the cleaning molten salt.
- the method for bringing the plating film 20 into contact with the molten salt for cleaning is not particularly limited.
- the substrate 10 on which the plating film 20 is formed is immersed in the molten salt for cleaning, or the molten salt is allowed to flow over the surface of the plating film 20.
- a method of cleaning the surface of the plating film 20 by spraying or the like can be used.
- the method of bringing the plating film 20 into contact with the cleaning molten salt is preferably performed by immersing the substrate 10 on which the plating film 20 is formed in the cleaning molten salt.
- the substrate 10 on which the plating film 20 is formed is immersed in the cleaning molten salt, whereby the cleaning molten salt can be sufficiently brought into contact with the entire surface of the plating film 20.
- poorly water-soluble substances such as LiF and NaF on the surface of the plating film 20 can be more effectively cleaned.
- the surface of the plating film 20 is washed with water (S50).
- the titanium plating film 20 is washed with water, and the second adhering matter adhering to the surface of the plating film 20 in the step of washing with the molten salt for washing (S40) is removed.
- the residual amount of poorly water-soluble LiF and NaF on the surface of the plating film 20 is reduced by performing the step (S40) of cleaning the surface of the plating film 20 with the cleaning molten salt.
- the second deposit attached to the surface of the plating film 20 is mainly composed of components contained in the washing molten salt, that is, chlorides of alkali metal and alkaline earth metal. And KF.
- Alkali metal chlorides, alkaline earth metal chlorides and KF are not only compatible with LiF and NaF, but also highly soluble in water. Therefore, the second deposit can be removed more easily than LiF and NaF by washing with water.
- the two-step cleaning process S40 and S50
- the residual material remaining on the surface of the plating film 20 can be reduced. As a result, a high-quality titanium plated member 1 with a small amount of residual impurities can be manufactured.
- a water-soluble solvent such as alcohol or other detergent such as a surfactant may be used in combination with water.
- a water-soluble solvent such as alcohol or other detergent such as a surfactant may be used in combination with water.
- the titanium plated member 1 thus manufactured is a member having a protective film having high hardness, high surface smoothness, and excellent corrosion resistance and wear resistance. Furthermore, it is a high-quality titanium plating member 1 with a small amount of residual impurities on the plating film 20. Therefore, it can be used in various fields.
- the ratio ((Ra / R) ⁇ 100 (%)) of the average surface roughness Ra to the average thickness R of the plating film 20 in the titanium plated member 1 manufactured by the above manufacturing method is preferably 10% or less. More preferably, it is 5% or less. If it is such a range, the titanium plating member 1 which has the plating film 20 with sufficiently high surface smoothness can be provided.
- the surface average roughness Ra of the plating film 20 can be measured using a cross-sectional observation by SEM (Scanning Electron Microscope) or a surface roughness meter. Furthermore, the average thickness R of the plating film 20 can be determined by cross-sectional observation with an SEM.
- the surface average roughness Ra of the plating film 20 means the arithmetic average roughness Ra defined in JIS B 0601 (2001).
- the average thickness R of the plating film 20 means, for example, the arithmetic average of the thickness of the plating film 20 at any 10 points in the SEM image.
- the manufacturing method of the titanium plating member 1 according to the present embodiment it is possible to reduce the residual amount of the hardly water-soluble fluoride on the surface of the titanium plating film.
- the molten salt titanium plating solution composition 50 containing chloride ions (Cl ⁇ ) has been described.
- the molten salt titanium plating solution composition 50 can also be prepared without including Cl ⁇ .
- the molten salt titanium plating solution composition 50 can be prepared so as to include other anions instead. In this case, it is desirable to select the other anions so as not to form a residue such as a salt that is stable at the plating temperature and difficult to remove after plating.
- the titanium plating member is preferably an insoluble electrode. This makes it possible to provide an insoluble electrode having a titanium plating film with a reduced amount of surface residue.
- Such an insoluble electrode is preferably used for hydrogen production.
- the insoluble electrode is for hydrogen production, it can be provided as an insoluble electrode for hydrogen production with low resistance. This makes it possible to produce high purity hydrogen.
- the titanium plated member is preferably a current collector. This makes it possible to provide a current collector having a titanium plating film with a reduced amount of surface residue.
- Such a current collector is preferably for a fuel cell.
- the current collector is for a fuel cell, it can be provided as a fuel cell current collector having good electrical conductivity.
- the current collector is for a fuel cell, it is more preferably for a polymer electrolyte fuel cell.
- the titanium plated member is preferably a biomaterial. This makes it possible to provide a biomaterial having a titanium plating film with a reduced amount of surface residue. Such a biomaterial can also be excellent in corrosion resistance.
- the use of the biomaterial is preferably selected from the group consisting of spinal fixation devices, fracture fixing materials, artificial joints, artificial valves, intravascular stents, denture bases, artificial tooth roots and orthodontic wires.
- Example 1 Preparation of molten salt titanium plating solution composition and preparation of titanium plated member
- 2 mol of K 2 TiF 6 powder or 13 mol of TiCl 4 was dissolved as a titanium source in 100 mol of the main component of the molten salt titanium plating solution composition shown in Table 1 below.
- sample no. 1-No. No. 4 molten salt titanium plating solution composition was prepared.
- sample no. 1-No. In any of the molten salt titanium plating solution compositions of No. 4, the content of potassium ions is 5 mol% or less with respect to 100 mol% of all ion components contained in the composition. Furthermore, sample no.
- the molten salt titanium plating solution composition No. 1 is a sample in which the amount of fluoride ions exceeds 50 mol% (51 mol%) with respect to 100 mol% in total of chloride ions and fluoride ions. Sample No.
- the molten salt titanium plating solution composition No. 2 is a sample not containing chloride ions. Sample No. 3 and no. The molten salt titanium plating solution composition No.
- the molten salt titanium plating solution composition of No. 4 has a titanium ion content of 0.1 mol% or more and 12 mol% or less (1.9 mol% or 11.5 mol%) with respect to 100 mol% of all cations contained in the composition. It is.
- sample no. No. 1 molten salt titanium plating solution composition produced by using a titanium plating member precursor specimen No. 1 corresponds to a titanium plating member precursor.
- Sample No. The titanium plating member precursor produced using the molten salt titanium plating solution composition of No. 2 corresponds to the titanium plating member precursor.
- Sample No. No. 3 molten salt titanium plating solution composition prepared by using a titanium plating member precursor, 3 corresponds to the titanium plating member precursor.
- Sample No. No. 4 molten salt titanium plating solution composition produced by using a titanium plating member precursor specimen No. 4 corresponds to a titanium plated member precursor.
- the above-described cleaning molten salt A to cleaning molten salt D and pure water are used.
- Specimen No. 1 titanium plating member precursor was washed to remove the first deposit and the second deposit on the surface.
- the test specimen No. Five titanium plated member precursors 1 were prepared and immersed for 10 minutes in a container containing the molten salt A for cleaning to the molten salt D for cleaning and pure water shown in Table 2 (S40). Thereafter, the test specimen No. 1 titanium plating member precursor was pulled up from each container and ultrasonically cleaned with pure water for 10 minutes (S50). Thereby, the test body No. 1 titanium plating member was produced.
- the molten salt D for cleaning and pure water serve as a comparative cleaning agent.
- a cleaning molten salt (cleaning molten salt A to cleaning) containing at least one compound selected from the group consisting of alkali metal chlorides, alkaline earth metal chlorides and potassium fluoride. It can be seen that the metal fluoride and molten salt residue components did not remain on the surface of the titanium plated member washed with molten salt C).
- Example 2 >> Specimen No. produced in Example 1 Five titanium plating member precursors 2 were prepared. This specimen No. The steps of S40 to S50 (see FIG. 2) in the method for producing a titanium plated member are performed under the same conditions as in Example 1 for the titanium plated member precursor of FIG. The first deposit and the second deposit were removed. As a result, the test specimen No. 2 titanium plated members were produced. Furthermore, specimen No. The presence or absence of residual components of the metal fluoride and the molten salt A for washing to the molten salt D for washing was analyzed for the titanium plated member 2 under the same conditions as in Example 1. The results are shown in the EDX column of Table 3. “Salt component” in Table 3 also means the residual components of metal fluoride and cleaning molten salt A to cleaning molten salt D.
- a molten salt for cleaning (cleaning molten salt A to cleaning) containing at least one compound selected from the group consisting of alkali metal chlorides, alkaline earth metal chlorides and potassium fluoride It can be seen that the metal fluoride and molten salt residue components did not remain on the surface of the titanium plated member washed with molten salt C).
- Example 3 Specimen No. produced in Example 1 Five titanium plating member precursors 3 were prepared. This specimen No. The steps of S40 to S50 (see FIG. 2) in the method of manufacturing a titanium plated member are performed on the titanium plated member precursor of No. 3 under the same conditions as in Example 1, thereby obtaining the surface of the titanium plated member precursor. The first deposit and the second deposit were removed. As a result, the test specimen No. 3 titanium plated members were produced. Furthermore, specimen No. The presence or absence of residual components of the metal fluoride and the molten salt A for cleaning to the molten salt D for cleaning was analyzed for the titanium plated member 3 under the same conditions as in Example 1. The results are shown in the EDX column of Table 4. “Salt component” in Table 4 also means the residual components of metal fluoride and cleaning molten salt A to cleaning molten salt D.
- molten salt for cleaning cleaning molten salt A to cleaning material
- at least one compound selected from the group consisting of alkali metal chlorides, alkaline earth metal chlorides and potassium fluoride It can be seen that the metal fluoride and molten salt residue components did not remain on the surface of the titanium plated member washed with molten salt C).
- Example 4 Specimen No. produced in Example 1 Five titanium plating member precursors 4 were prepared. This specimen No. The surface of the titanium plated member precursor is obtained by performing steps S40 to S50 (see FIG. 2) in the titanium plated member manufacturing method under the same conditions as in Example 1 for the titanium plated member precursor of FIG. The first deposit and the second deposit were removed. As a result, the test specimen No. 4 titanium plated members were prepared. Furthermore, specimen No. Each of the titanium plated members of 4 was analyzed for the presence or absence of residual components of metal fluoride and cleaning molten salt A to cleaning molten salt D under the same conditions as in Example 1. The results are shown in the EDX column of Table 5. “Salt component” in Table 5 also means the residual components of metal fluoride and cleaning molten salt A to cleaning molten salt D.
- a cleaning molten salt (cleaning molten salt A to cleaning) containing at least one compound selected from the group consisting of alkali metal chlorides, alkaline earth metal chlorides and potassium fluoride. It can be seen that the metal fluoride and molten salt residue components did not remain on the surface of the titanium plated member washed with molten salt C).
- the titanium plating film is at least selected from the group consisting of alkali metal chlorides, alkaline earth metal chlorides, and potassium fluoride.
- the metal fluoride remaining on the surface of the titanium plating film and the residual components of the molten salt for cleaning are obtained by cleaning the titanium plating film by bringing it into contact with a cleaning molten salt containing one compound and washing the titanium plating film with water.
- the amount of (eg LiF and NaF) can be reduced.
- Example 5 Corrosion resistance to physiological saline
- the corrosion resistance with respect to the physiological saline was evaluated in the following procedures.
- a nickel porous substrate (3 cm ⁇ 5 cm ⁇ 1 mmt, porosity is 96%, average pore diameter is 300 ⁇ m, hereinafter “nickel porous body” Ti plating was performed on the surface of) to produce a Ti-plated product.
- Ni porous body (trade name: “Celmet (registered trademark)”, manufactured by Sumitomo Electric Industries, Ltd.) and a Ti metal plate (manufactured by Niraco Co., Ltd.) were prepared as test samples of comparative examples.
- Electrolyte solution 0.9 mass% sodium chloride aqueous solution (saline)
- Working electrode Test specimen of Example or Comparative specimen (Ti plated product, Ni or Ti)
- Reference electrode Ag / AgCl electrode
- Counter electrode Ni metal plate Scanning speed: 10 mV / sec Liquid temperature: 25 degreeC.
- the results of FIG. 4 show that the Ti-plated product as an example has a low corrosion current density compared to the Ni porous material as a comparative example, and is stable in a physiological saline environment. It was done. From this result, it was found that the Ti plated product as an example is suitable as a biomaterial. Further, the Ti plated product as an example had a low corrosion current density compared to the Ti metal plate as a comparative example. From this result, it was shown that the stability with respect to the environment of physiological saline is further improved by adopting the structure of the metal porous body instead of the metal plate.
- Example 6 Corrosion resistance to salt water simulating seawater.
- the corrosion resistance with respect to the salt solution which simulated seawater was evaluated in the following procedures.
- a Ti-plated product produced by the same method as the Ti-plated product used in Example 5 was prepared as a test body of the example.
- a Ti metal plate manufactured by Niraco Co., Ltd. was prepared as a test sample of a comparative example.
- the Ti plated product as an example has a lower current density than the Ti commercial product as a comparative example, and exhibits high corrosion resistance against seawater. Thereby, it turned out that the Ti plating goods which are an Example are promising as an insoluble electrode (anode) for salt electrolysis.
- Example 7 Evaluation of suitability for polymer electrolyte fuel cells. The suitability of the following Ti-plated products for polymer electrolyte fuel cells was evaluated by the following procedure.
- a Ti-plated product produced by the same method as the Ti-plated product used in Example 5 was prepared as a test body of the example.
- a test body of a comparative example a Ni porous body (trade name: “Celmet (registered trademark)”, manufactured by Sumitomo Electric Industries, Ltd.) and a Ti metal plate (manufactured by Nilaco Corporation) were prepared.
- the Ti plated product as an example has a lower current density than that of a comparative Ni sample, and a current collector used in a polymer electrolyte fuel cell It proved promising as a material.
- titanium plating member 10 base material, 20 plating film, 30 anode, 40 container, 50 plating solution composition.
Abstract
Description
チタンめっきにおいて表面が平滑なチタンめっき膜を得るためには、めっき浴中にフッ化物イオンが存在することが重要である。しかし、フッ化物イオンは、めっき浴中に存在する金属イオンと結合して難水溶性の金属フッ化物を形成する場合がある。難水溶性の金属フッ化物がめっき部材のチタンめっき膜の表面に残留すると、水洗により充分に除去することが難しい。そのため、めっき部材表面の難水溶性フッ化物の残留量を低減できるチタンめっき部材の製造方法が望まれていた。
上記チタンめっき部材の製造方法によれば、チタンめっき膜表面の難水溶性フッ化物の残留量を低減することが可能となる。
最初に本開示の実施態様を列記して説明する。
次に、図面を参照して本開示のチタンめっき部材の製造方法の一実施の形態の詳細を以下に説明する。本明細書において「A~B」という形式の表記は、範囲の上限下限(すなわちA以上B以下)を意味し、Aにおいて単位の記載がなく、Bにおいてのみ単位が記載されている場合、Aの単位とBの単位とは同じである。
図1~図3を参照して、本実施の形態におけるチタンめっき部材の製造方法について説明する。図1は、チタンめっき部材の一部の一例を示す概略断面図である。図2は、チタンめっき部材を製造するための手順を示すフローチャートである。図3は溶融塩チタンめっき液組成物に基材を浸漬した状態の一例を示す概略断面図である。
このようにして製造されたチタンめっき部材1は、高硬度を有し、表面平滑性が高く、かつ耐腐食性、耐摩耗性に優れた保護膜を有する部材である。さらに、めっき膜20上の残留不純物量が少ない高品質なチタンめっき部材1である。そのため、種々の分野において使用することができる。
[溶融塩チタンめっき液組成物の調製およびチタンめっき部材の作製]
試験体となるチタンめっき部材を作製するため、下記の表1に示す溶融塩チタンめっき液組成物の主剤100molに対し、チタン源としてK2TiF6粉末を2molまたはTiCl4を13mol溶解させることによって、まず試料No.1~No.4の溶融塩チタンめっき液組成物を調製した。
実施例1において作製した試験体No.2のチタンめっき部材前駆体を5つ準備した。この試験体No.2のチタンめっき部材前駆体に対し、チタンめっき部材の製造方法におけるS40~S50の工程(図2参照)を、実施例1と同じ条件の下で行なうことにより、上記チタンめっき部材前駆体の表面の第1の付着物および第2の付着物を除去した。これにより試験体No.2のチタンめっき部材を作製した。さらに試験体No.2のチタンめっき部材に対し、実施例1と同じ条件の下で金属フッ化物および洗浄用溶融塩A~洗浄用溶融塩Dの残渣成分の有無を分析した。結果を表3のEDXの欄に示す。表3中の「塩成分」も、金属フッ化物および洗浄用溶融塩A~洗浄用溶融塩Dの残渣成分を意味する。
実施例1において作製した試験体No.3のチタンめっき部材前駆体を5つ準備した。この試験体No.3のチタンめっき部材前駆体に対し、チタンめっき部材の製造方法におけるS40~S50の工程(図2参照)を、実施例1と同じ条件の下で行なうことにより、上記チタンめっき部材前駆体の表面の第1の付着物および第2の付着物を除去した。これにより試験体No.3のチタンめっき部材を作製した。さらに試験体No.3のチタンめっき部材に対し、実施例1と同じ条件の下で金属フッ化物および洗浄用溶融塩A~洗浄用溶融塩Dの残渣成分の有無を分析した。結果を表4のEDXの欄に示す。表4中の「塩成分」も、金属フッ化物および洗浄用溶融塩A~洗浄用溶融塩Dの残渣成分を意味する。
実施例1において作製した試験体No.4のチタンめっき部材前駆体を5つ準備した。この試験体No.4のチタンめっき部材前駆体に対し、チタンめっき部材の製造方法におけるS40~S50の工程(図2参照)を、実施例1と同じ条件の下で行なうことにより、上記チタンめっき部材前駆体の表面の第1の付着物および第2の付着物を除去した。これにより試験体No.4のチタンめっき部材を作製した。さらに試験体No.4のチタンめっき部材それぞれに対し、実施例1と同じ条件の下で金属フッ化物および洗浄用溶融塩A~洗浄用溶融塩Dの残渣成分の有無を分析した。結果を表5のEDXの欄に示す。表5中の「塩成分」も、金属フッ化物および洗浄用溶融塩A~洗浄用溶融塩Dの残渣成分を意味する。
[生理食塩水に対する耐食性]
以下のTiめっき品について、生理食塩水に対する耐食性を以下の手順で評価した。
上述したチタンめっき部材の製造方法のS10~S50を経ることにより、ニッケル製の多孔体基材(3cm×5cm×1mmt、気孔率は96%、平均気孔径は300μm、以下では「ニッケル多孔体」と記す。)の表面にチタンめっきを行なってTiめっき品を作製した。
以下の条件によりサイクリックボルタンメトリーを行なった。結果を図4に示す。図4中、実施例の試験体ならびに比較例の試験体(Niの多孔体およびTiの金属板)を、それぞれ「Tiめっき品」、「Ni」および「Ti」と表記した。
電解液 :0.9質量%の塩化ナトリウム水溶液(生理食塩水)
作用極 :実施例の試験体または比較例の試験体(Tiめっき品、NiまたはTi)
参照極 :Ag/AgCl電極
対極 :Niの金属板
走査速度:10mV/sec
液温 :25℃。
[海水を模擬した食塩水に対する耐食性]
以下のTiめっき品について、海水を模擬した食塩水に対する耐食性を以下の手順で評価した。
実施例の試験体として、実施例5で用いたTiめっき品と同じ方法により作製したTiめっき品を準備した。比較例の試験体としてTiの金属板(株式会社ニラコ製)を準備した。
電解液として海水を模擬した3.3質量%の食塩水を使用したこと以外、上述した[生理食塩水に対する耐食性]の欄に示した条件と同じ条件により、サイクリックボルタンメトリーを行った。結果を図5に示す。図5中、実施例の試験体および比較例の試験体を、それぞれ「Tiめっき品」および「Ti市販品」と表記した。
[固体高分子型燃料電池への適性評価]
以下のTiめっき品の固体高分子型燃料電池への適性を以下の手順で評価した。
実施例の試験体として、実施例5で用いたTiめっき品と同じ方法により作製したTiめっき品を準備した。比較例の試験体として、Niの多孔体(商品名:「セルメット(登録商標)」、住友電気工業株式会社製)およびTiの金属板(株式会社ニラコ製)をそれぞれ準備した。
電解液として10質量%の硫酸ナトリウム水溶液(硫酸を加えてpH=3に調整した)(PEFC模擬電解液)を使用したこと以外、上述した[生理食塩水に対する耐食性]の欄に示した条件と同じ条件により、サイクリックボルタンメトリーを行った。結果を図6および図7に示す。図6および図7中、実施例の試験体、ならびに比較例の試験体(Niの多孔体およびTiの金属板)を、それぞれ「Tiめっき品」、「Ni比較用」および「Ti比較用」と表記した。なお図6において、「Tiめっき品」および「Ti比較用」における各電極の電流密度と電位との相関関係のプロットが重複して現れたため、図7において縦軸(電流密度)を拡大することにより、「Tiめっき品」および「Ti比較用」における上記相関関係のプロットが区別可能に現れるようにした。
Claims (8)
- 導電性の表面を有する基材を準備する工程と、
前記基材を、リチウムイオンおよびナトリウムイオンのうち少なくとも1つの第1族金属イオンと、フッ化物イオンと、チタニウムイオンと、を含有する溶融塩チタンめっき液組成物に浸漬する工程と、
前記溶融塩チタンめっき液組成物に浸漬された前記基材がカソードとなるように通電し、前記基材の前記表面をチタンで被覆することにより、前記表面上にチタンめっき膜を形成する工程と、
前記チタンめっき膜を、アルカリ金属の塩化物、アルカリ土類金属の塩化物およびフッ化カリウムからなる群より選択される少なくとも1つの化合物を含有する洗浄用溶融塩と接触させて前記チタンめっき膜を洗浄することにより、前記チタンめっき膜を形成する工程において前記チタンめっき膜の表面に付着した第1の付着物を除去する工程と、
前記チタンめっき膜を水洗して、前記洗浄用溶融塩により洗浄する工程において前記チタンめっき膜の前記表面に付着した第2の付着物を除去する工程と、を含む、チタンめっき部材の製造方法。 - 前記第1の付着物を除去する工程において、前記チタンめっき膜の前記洗浄用溶融塩への接触は、前記チタンめっき膜が形成された前記基材を前記洗浄用溶融塩に浸漬することにより行う、請求項1に記載のチタンめっき部材の製造方法。
- 前記溶融塩チタンめっき液組成物は、塩化物イオンをさらに含有する、請求項1または請求項2に記載のチタンめっき部材の製造方法。
- 前記溶融塩チタンめっき液組成物は、前記塩化物イオンと前記フッ化物イオンとの合計100mol%に対する前記フッ化物イオンの量が30mol%以上50mol%以下である、請求項3に記載のチタンめっき部材の製造方法。
- 前記溶融塩チタンめっき液組成物中に含まれる全カチオン100mol%に対する前記チタニウムイオンの含有量は、0.1mol%以上12mol%以下である、請求項1から請求項4のいずれか1項に記載のチタンめっき部材の製造方法。
- 前記チタンめっき部材は、不溶性電極である、請求項1から請求項5のいずれか1項に記載のチタンめっき部材の製造方法。
- 前記チタンめっき部材は、集電体である、請求項1から請求項5のいずれか1項に記載のチタンめっき部材の製造方法。
- 前記チタンめっき部材は、生体材料である、請求項1から請求項5のいずれか1項に記載のチタンめっき部材の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/500,557 US20200102664A1 (en) | 2017-05-22 | 2018-03-13 | Method for manufacturing titanium-plated member |
KR1020197029051A KR20200010182A (ko) | 2017-05-22 | 2018-03-13 | 티탄 도금 부재의 제조 방법 |
JP2019519484A JPWO2018216319A1 (ja) | 2017-05-22 | 2018-03-13 | チタンめっき部材の製造方法 |
EP18806582.5A EP3633078A4 (en) | 2017-05-22 | 2018-03-13 | METHOD FOR MANUFACTURING A TITANIUM-COATED ELEMENT |
CN201880022080.7A CN110475910A (zh) | 2017-05-22 | 2018-03-13 | 镀钛部件的制造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017100758 | 2017-05-22 | ||
JP2017-100758 | 2017-05-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2018216319A1 true WO2018216319A1 (ja) | 2018-11-29 |
Family
ID=64395401
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2018/009738 WO2018216319A1 (ja) | 2017-05-22 | 2018-03-13 | チタンめっき部材の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20200102664A1 (ja) |
EP (1) | EP3633078A4 (ja) |
JP (1) | JPWO2018216319A1 (ja) |
KR (1) | KR20200010182A (ja) |
CN (1) | CN110475910A (ja) |
WO (1) | WO2018216319A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019171744A1 (ja) * | 2018-03-08 | 2019-09-12 | 住友電気工業株式会社 | チタンめっき部材の製造方法及びチタンめっき部材 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111819310B (zh) * | 2018-03-07 | 2022-11-25 | 住友电气工业株式会社 | 镀膜以及镀覆部件 |
CN111910152B (zh) * | 2020-09-01 | 2022-10-25 | 台州星星光电科技有限公司 | 一种盖板表面疏水抗碱涂层的镀膜方法 |
KR102625422B1 (ko) * | 2022-03-11 | 2024-01-23 | 주식회사 제로원파트너스 | 에너지 효율이 향상된 ptc 난방 필름 및 이의 제조 방법 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51138511A (en) * | 1975-05-27 | 1976-11-30 | Sony Corp | Method for regulating the hardness of metallic tita nium |
JPH059763A (ja) * | 1991-07-05 | 1993-01-19 | Mitsubishi Materials Corp | 水に難溶性の塩が付着した金属材料の洗浄方法 |
JPH06173065A (ja) * | 1992-12-09 | 1994-06-21 | Japan Energy Corp | Tiの精製方法 |
JPH09215743A (ja) * | 1996-02-09 | 1997-08-19 | Japan Energy Corp | 生体用複合インプラント材 |
JP2000256898A (ja) * | 1999-03-03 | 2000-09-19 | Permelec Electrode Ltd | ウェーハの銅めっき方法 |
JP2008192758A (ja) * | 2007-02-02 | 2008-08-21 | Sumitomo Electric Ind Ltd | 電気二重層キャパシタ用電極 |
JP2015193899A (ja) | 2013-11-19 | 2015-11-05 | 住友電気工業株式会社 | 電析用電解質および金属膜の製造方法 |
JP2017100758A (ja) | 2015-11-30 | 2017-06-08 | 株式会社吉野工業所 | 計量容器 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4411762A (en) * | 1981-11-09 | 1983-10-25 | Diamond Shamrock Corporation | Titanium clad copper electrode and method for making |
KR100900117B1 (ko) * | 2004-10-01 | 2009-06-01 | 스미토모덴키고교가부시키가이샤 | 용융염욕, 이 용융염욕을 이용해서 얻어진 석출물, 금속제품의 제조방법 및 금속제품 |
WO2006057231A1 (ja) * | 2004-11-24 | 2006-06-01 | Sumitomo Electric Industries, Ltd. | 溶融塩浴、析出物および金属析出物の製造方法 |
JP2013147731A (ja) * | 2011-12-22 | 2013-08-01 | Sumitomo Electric Ind Ltd | 溶融塩電解による金属の製造方法 |
CN103882477B (zh) * | 2012-12-21 | 2016-12-28 | 攀钢集团攀枝花钢铁研究院有限公司 | 一种用于制备金属钛的电解质和熔盐及金属钛的制备方法 |
CN106868550A (zh) * | 2017-02-27 | 2017-06-20 | 北京科技大学 | 一种熔融盐中电解废钛制备高纯钛的方法 |
-
2018
- 2018-03-13 JP JP2019519484A patent/JPWO2018216319A1/ja active Pending
- 2018-03-13 EP EP18806582.5A patent/EP3633078A4/en not_active Withdrawn
- 2018-03-13 WO PCT/JP2018/009738 patent/WO2018216319A1/ja active Application Filing
- 2018-03-13 CN CN201880022080.7A patent/CN110475910A/zh active Pending
- 2018-03-13 KR KR1020197029051A patent/KR20200010182A/ko unknown
- 2018-03-13 US US16/500,557 patent/US20200102664A1/en not_active Abandoned
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51138511A (en) * | 1975-05-27 | 1976-11-30 | Sony Corp | Method for regulating the hardness of metallic tita nium |
JPH059763A (ja) * | 1991-07-05 | 1993-01-19 | Mitsubishi Materials Corp | 水に難溶性の塩が付着した金属材料の洗浄方法 |
JPH06173065A (ja) * | 1992-12-09 | 1994-06-21 | Japan Energy Corp | Tiの精製方法 |
JPH09215743A (ja) * | 1996-02-09 | 1997-08-19 | Japan Energy Corp | 生体用複合インプラント材 |
JP2000256898A (ja) * | 1999-03-03 | 2000-09-19 | Permelec Electrode Ltd | ウェーハの銅めっき方法 |
JP2008192758A (ja) * | 2007-02-02 | 2008-08-21 | Sumitomo Electric Ind Ltd | 電気二重層キャパシタ用電極 |
JP2015193899A (ja) | 2013-11-19 | 2015-11-05 | 住友電気工業株式会社 | 電析用電解質および金属膜の製造方法 |
JP2017100758A (ja) | 2015-11-30 | 2017-06-08 | 株式会社吉野工業所 | 計量容器 |
Non-Patent Citations (4)
Title |
---|
A. ROBIN: "ELECTOLYTIC COATING OF TITANIUM ONTO IRON AND NICKEL ELECTRODES IN THE MOLTEN LiF+NaF+KF EUTECTIC", JOURNAL OF ELECTROANAL. CHEM., vol. 230, 1987, pages 125 - 141, XP026763330, doi:10.1016/0022-0728(87)80137-7 |
CLAYTON, F. R. ET AL.: "Electrochemical Studies of Titanium 1-2 in Molten Fluorides", JOURNAL OF THE ELECTROCHEMICAL SOCIETY, vol. 120, no. 9, 1973, pages 1193 - 1199, XP055555016 * |
See also references of EP3633078A4 * |
SONG, JIANXUN ET AL.: "The Influence of Fluoride Anion on the Equilibrium between Titanium Ions and Electrodeposition of Titanium in Molten Fluoride-Chloride Salt", MATERIALS TRANSACTIONS, vol. 55, no. 8, 2014, pages 1299 - 1303, XP055555019 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019171744A1 (ja) * | 2018-03-08 | 2019-09-12 | 住友電気工業株式会社 | チタンめっき部材の製造方法及びチタンめっき部材 |
JPWO2019171744A1 (ja) * | 2018-03-08 | 2021-03-11 | 住友電気工業株式会社 | チタンめっき部材の製造方法及びチタンめっき部材 |
JP7086172B2 (ja) | 2018-03-08 | 2022-06-17 | 住友電気工業株式会社 | チタンめっき部材の製造方法及びチタンめっき部材 |
Also Published As
Publication number | Publication date |
---|---|
EP3633078A1 (en) | 2020-04-08 |
EP3633078A4 (en) | 2021-03-03 |
JPWO2018216319A1 (ja) | 2020-03-19 |
CN110475910A (zh) | 2019-11-19 |
US20200102664A1 (en) | 2020-04-02 |
KR20200010182A (ko) | 2020-01-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2018216321A1 (ja) | 金属多孔体及び金属多孔体の製造方法 | |
WO2018216319A1 (ja) | チタンめっき部材の製造方法 | |
WO2018216322A1 (ja) | 複合金属多孔体及び複合金属多孔体の製造方法 | |
BR112017021409B1 (pt) | Método para fosfatação de uma superfície metálica, e, superfície metálica revestida com fosfato | |
JP6487258B2 (ja) | 金属製基材の表面に多孔質層を形成する方法 | |
Singh et al. | Development of corrosion-resistant electroplating on AZ91 Mg alloy by employing air and water-stable eutectic based ionic liquid bath | |
JP4883534B2 (ja) | 溶融塩浴、溶融塩浴の製造方法およびタングステン析出物 | |
JP6947212B2 (ja) | 溶融塩チタンめっき液組成物およびチタンめっき部材の製造方法 | |
JP6802255B2 (ja) | 導電性材料及びその製造方法 | |
WO2022138219A1 (ja) | 金属充填微細構造体および金属充填微細構造体の製造方法 | |
Marín-Sánchez et al. | Electrodeposition of Zn-Mn coatings on steel from 1-ethyl-3-methylimidazolium bis (trifluoromethanesulfonyl) imide ionic liquid | |
JPWO2019098378A1 (ja) | 黒色酸化被膜を備えるマグネシウム又はアルミニウム金属部材及びその製造方法 | |
JP7086172B2 (ja) | チタンめっき部材の製造方法及びチタンめっき部材 | |
CN113463148A (zh) | 一种在钛或钛合金基材表面电镀金的方法 | |
JP5799037B2 (ja) | プラズマ電解酸化による皮膜形成方法 | |
WO2021176769A1 (ja) | チタンめっき用電解質及びチタンめっき用電解質を用いたチタンめっき部材の製造方法 | |
WO2020217603A1 (ja) | チタン含有部材の製造方法 | |
US20220243338A1 (en) | Electrode coating | |
JP7052130B1 (ja) | 塩素発生用電極およびその製造方法 | |
Gill et al. | Improved experimental method for electroless deposition of iridium using a platinum sublayer to form a catalyst coated membrane | |
KR20210045310A (ko) | 산성 수계 은-니켈 합금 전기도금 조성물 및 방법 | |
KR20240024950A (ko) | 공업용 전해 프로세스용 전극 | |
JP2013100601A (ja) | フッ化処理による表面改質方法 | |
Norikawa et al. | A New Electrodeposition Process of Metallic Ti Films Utilizing Water-soluble KF–KCl Molten Salts | |
Sauri et al. | Self-Organization Phenomena During Electrodeposition of Ag-In Alloys |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 18806582 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2019519484 Country of ref document: JP Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 20197029051 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2018806582 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 2018806582 Country of ref document: EP Effective date: 20200102 |