WO2018008125A1 - 立体配線基板、立体配線基板の製造方法、立体配線基板用基材 - Google Patents

立体配線基板、立体配線基板の製造方法、立体配線基板用基材 Download PDF

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Publication number
WO2018008125A1
WO2018008125A1 PCT/JP2016/070139 JP2016070139W WO2018008125A1 WO 2018008125 A1 WO2018008125 A1 WO 2018008125A1 JP 2016070139 W JP2016070139 W JP 2016070139W WO 2018008125 A1 WO2018008125 A1 WO 2018008125A1
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Prior art keywords
metal film
film
metal
wiring board
resin film
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PCT/JP2016/070139
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English (en)
French (fr)
Japanese (ja)
Inventor
道脇　茂
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株式会社メイコー
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Priority to PCT/JP2016/070139 priority Critical patent/WO2018008125A1/ja
Priority to KR1020187027682A priority patent/KR20190025538A/ko
Priority to CN201680086437.9A priority patent/CN109315069B/zh
Priority to JP2017510605A priority patent/JP6169304B1/ja
Priority to TW106108954A priority patent/TWI713418B/zh
Publication of WO2018008125A1 publication Critical patent/WO2018008125A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Definitions

  • the present invention relates to a three-dimensionally molded three-dimensional wiring board, a method for manufacturing the three-dimensional wiring board, and a three-dimensional wiring board base material used for the three-dimensional wiring board.
  • a conventionally known three-dimensional wiring board is a MID (Molded Interconnect Device) substrate, which is a component in which an electric circuit is directly and three-dimensionally formed on the surface of a structure having a three-dimensional structure.
  • MID Manufacturing Interconnect Device
  • methods such as a two-shot method, MIPTEC (Microscopic Integrated Processing Technology), and LDS (Laser Direct Direct Structure) are known.
  • MIPTEC Magnetic Integrated Processing Technology
  • LDS Laser Direct Direct Structure
  • Patent Document 1 discloses a technique related to an MID substrate and its manufacture.
  • the entire surface of the molded mold resin is metalized, and the metal (metalizing layer) at the outer edge portion of the wiring circuit is removed by laser light. Thereafter, a region to be a wiring circuit is energized to perform electroplating, and then the entire surface of the molded body is subjected to flash etching to remove metals other than the wiring circuit, thereby forming a wiring circuit on the mold resin.
  • a special laser irradiation apparatus corresponding to the three-dimensional shape of the molded mold resin is required, and there is a problem of increase in manufacturing cost due to labor of laser processing and equipment investment.
  • the metal necessary for the wiring circuit is deposited by electrolytic plating, it is necessary to energize only the region that becomes the wiring circuit, so that the region that becomes the wiring circuit is electrically connected to the outer periphery of the molded body. Or have to be electrically connected to the outer periphery via a feeder line. That is, there is a problem that it is difficult to electrically separate the region to be the wiring circuit from the outer peripheral portion of the molded body (that is, formation of an independent wiring pattern), and formation of a feed line that is finally unnecessary as a circuit and The problem of increased cost associated with removal arises.
  • LDS In LDS, primary molding is performed using a special resin material containing catalytic metal ion particles, and the area that becomes the wiring circuit is irradiated with laser light to activate (metallize) the catalytic metal ion particles. Then, plating (in principle, electroless plating) is performed on the exposed portion of the catalyst metal to form a wiring circuit on the mold resin.
  • the minimum value of L / S is about 100/150 ⁇ m because of the problem of the accuracy of activating (metalizing) the catalytic metal ion particles in the molded mold resin, and it is difficult to form a finer wiring pattern. It was.
  • a special laser irradiation device is required as in MIPTEC, and there is a problem of increased manufacturing costs due to labor of laser processing and capital investment.
  • the wiring circuit is formed in the mold resin having a three-dimensional shape, so that the finally manufactured MID substrate is basically a single-sided substrate. For this reason, the freedom degree of a wiring circuit becomes small compared with a double-sided board, and the problem that size reduction of board
  • a method for solving the problem and the above-described problem there is a method of manufacturing a three-dimensional wiring board by forming a wiring circuit on a thermoplastic resin such as polyimide and then bending the resin by heating and pressing.
  • Patent Document 2 discloses that a metal foil is pasted on a polyimide film by thermocompression bonding, and then three-dimensional molding is disclosed, and Patent Document 3 discloses that a three-dimensional molding is performed after applying a conductive paste on a polysulfone resin. It is disclosed.
  • thermoplastic resin which is a completely different material, and a metal serving as a wiring are separated.
  • the thermoplastic resin and the metal can be firmly adhered by using sputtering, vapor deposition, other wet plating methods, or by handling a special method using molecular bonding technology. It is being considered.
  • JP 2012-94605 A Japanese Patent Laid-Open No. 06-188537 JP 2000-174399 A
  • thermoplastic resin that is a flat surface is bent by heating and pressurizing to form three-dimensionally, elongation occurs around the bent portion. At this time, many thermoplastic resins have large elongation at break, and can be stretched relatively freely.
  • the patterned metal stretches to a certain limit, if it stretches beyond that, a wide crack is generated and breaks.
  • a metal forming a wiring circuit is formed on a resin by a method such as Patent Document 2 and Patent Document 3 and then three-dimensional molding is performed, the wiring circuit easily breaks at a bent portion of the three-dimensional wiring board, and reliability is improved. It becomes difficult to manufacture an excellent three-dimensional wiring board. In particular, when a three-dimensional board having a complicated three-dimensional shape and a large amount of extension is molded, disconnection due to breakage of the wiring circuit is more likely to occur.
  • thermoplastic resin and the metal in order to firmly adhere the thermoplastic resin and the metal, sputtering, vapor deposition, other wet plating methods, or special methods using molecular bonding techniques are used.
  • sputtering, vapor deposition, other wet plating methods, or special methods using molecular bonding techniques are used.
  • Such pre-processing requires a desired medicine or device, and is a problem that leads to an increase in cost of the three-dimensional wiring board itself.
  • the present invention has been made in view of such problems, and the object thereof is to prevent peeling between the resin film and the metal that is the material of the wiring circuit, fine processing of the wiring circuit, and disconnection of the wiring circuit. It is to provide a three-dimensional wiring board that can be manufactured at a low cost and a manufacturing method thereof, a three-dimensional wiring board, and a three-dimensional wiring board substrate used therein.
  • the three-dimensional wiring board of the present invention has a dynamic viscoelastic property in which a storage elastic modulus in a saturation region of a glass transition temperature or higher is 2 ⁇ 10 7 Pa or lower, and a breaking elongation of 50% or higher.
  • a three-dimensional resin film comprising: a first metal film formed on a surface of the resin film and having a desired pattern; and a second metal film formed on the first metal film, The resin film has a plurality of projections and depressions on the surface on which the first metal film is formed, and the first metal film has a film thickness adjusted so as to have a porous structure in which metal is deposited in the form of particles. It is that you are.
  • the manufacturing method of the three-dimensional wiring board of this invention is equipped with the dynamic viscoelastic property whose storage elastic modulus in the saturation region above a glass transition temperature is 2 * 10 ⁇ 7 > Pa or less, and 50 A step of preparing a flat resin film having an elongation at break of at least%, a step of forming irregularities on the surface of the resin film by applying heat and pressure to the resin film, and a step of forming the resin film Forming a first metal film on the surface; patterning the first metal film by photolithography to form a desired pattern; and forming the first metal film.
  • a three-dimensional molding process in which the resin film is heated and pressed to form a three-dimensional mold, and a second gold film is formed on the patterned first metal film.
  • a metal film forming step wherein the first metal film is formed in a porous shape by depositing metal in a particle shape and adjusting the film thickness.
  • the substrate for a three-dimensional wiring board according to the present invention has a dynamic viscoelastic property with a storage elastic modulus of 2 ⁇ 10 7 Pa or less in a saturation region not lower than the glass transition temperature, and 50 % Of the three-dimensional resin film having a breaking elongation of not less than 1%, and a first metal film formed on the surface of the resin film and having a desired pattern, and the resin film is formed of the first metal film.
  • the formation surface is provided with a plurality of projections and depressions, and the thickness of the first metal film is adjusted so as to have a porous structure formed by depositing metal particles.
  • the present invention it is possible to prevent peeling between the resin film and the metal that is the material of the wiring circuit, to finely process the wiring circuit, and to prevent disconnection of the wiring circuit and to have excellent reliability and to be manufactured at low cost. It is possible to provide a three-dimensional wiring board that can be produced, a method for producing the same, a three-dimensional wiring board, and a three-dimensional wiring board base material used therefor.
  • or FIG. 8, FIG. 11, FIG. 16, and FIG. 17 are sectional drawings in the manufacturing process of a three-dimensional wiring board.
  • FIG. 2 is a graph which shows the temperature dependence of the value of the storage elastic modulus of the dynamic viscoelastic property of the thermoplastic resin film used for the three-dimensional wiring board which concerns on a present Example, and the conventional thermoplastic resin film.
  • FIGS. 9 and 10 are schematic views of the metal film formation for the three-dimensional wiring board according to the embodiment of the present invention.
  • 12 to 15 are schematic views showing a manufacturing process related to three-dimensional molding according to the embodiment of the present invention.
  • FIG. 18 is a perspective view of a three-dimensional wiring board according to an embodiment of the present invention.
  • thermoplastic resin film 1 having a thickness of about 150 ⁇ m is prepared (preparation step).
  • the thermoplastic resin film 1 for example, a known resin film such as polyimide or polyethylene terephthalate can be used.
  • the thickness of the thermoplastic resin film 1 may be adjusted to about 100 ⁇ m (75 ⁇ m or more and 150 ⁇ m or less). When used together, it may be adjusted to 50 ⁇ m or less.
  • the thermoplastic resin film 1 has a dynamic viscoelasticity property in which a storage elastic modulus in a saturation region equal to or higher than the glass transition temperature is 2 ⁇ 10 7 Pa or lower.
  • the storage elastic modulus of the dynamic viscoelastic property in the saturation region above the glass transition temperature is 1 ⁇ 10 7 Pa or less.
  • the saturated region at or above the glass transition temperature refers to a region in which the decrease in storage elastic modulus that greatly decreases across the glass transition point begins to saturate and the change in decrease in storage elastic modulus is reduced.
  • thermoplastic resin film 1 has a dynamic viscoelastic property in which the storage elastic modulus in the saturation region above the glass transition temperature is 1/100 or less of the storage elastic modulus in the stable region below the glass transition temperature.
  • the stable region below the glass transition temperature refers to a region where the change in storage elastic modulus is relatively small from room temperature to a temperature slightly before the glass transition temperature.
  • FIG. 2 shows the temperature dependence of the storage elastic modulus of the dynamic viscoelastic properties of the thermoplastic resin film 1 (this material) according to this example and the conventional thermoplastic resin film (hereinafter referred to as a conventional material). Showing gender.
  • the horizontal axis of FIG. 2 is temperature (° C.)
  • the vertical axis is storage elastic modulus E ′ (Pa).
  • the temperature range of the stable region and the saturated region is different depending on each material.
  • the storage elastic modulus of the dynamic viscoelastic property according to the thermoplastic resin film 1 is from room temperature to about 240 ° C. which is slightly lower than the glass transition temperature (about 258 ° C.) of the thermoplastic resin film 1.
  • a substantially constant value is maintained at 4 ⁇ 10 9 Pa. That is, as shown in FIG. 2, in the thermoplastic resin film 1, the temperature range from room temperature to about 240 ° C. is a stable region. Moreover, when it becomes 240 degreeC or more, a storage elastic modulus will fall rapidly and in the glass transition temperature of the thermoplastic resin film 1, it is about 2 * 10 ⁇ 8 > Pa.
  • the storage elastic modulus rapidly decreases even in the temperature range exceeding the glass transition temperature, and is smaller than about 2 ⁇ 10 7 Pa at about 255 ° C. and about 1 ⁇ 10 7 Pa at about 270 ° C. And if it becomes about 270 degreeC or more, a storage elastic modulus will reduce to about 1 * 10 ⁇ 7 > Pa or less.
  • the saturation region of the thermoplastic resin film 1 is set to a temperature range of about 255 ° C. or higher. Therefore, the thermoplastic resin film 1 according to this example has a storage elastic modulus value of 2 ⁇ 10 8 Pa or less in the dynamic viscoelastic property in the saturation region.
  • the thermoplastic resin film 1 according to this example has a storage elastic modulus in a saturation region that is equal to or higher than the glass transition temperature (specifically, 270 ° C. or lower). Has a characteristic of being about 1/100 or less of the storage elastic modulus in a stable region of 240 ° C. or higher.
  • Such a storage elastic modulus can be realized by selecting a predetermined raw material of the thermoplastic resin film 1 and adjusting the crystal structure.
  • AURUM registered trademark of Mitsui Chemicals, Inc. is selected as a raw material, and the crystal structure of the thermoplastic resin film 1 has more ether bond portions, thereby achieving the above characteristics. It has been realized.
  • the storage elastic modulus in the stable range from room temperature to about 260 ° C., the storage elastic modulus is maintained at a substantially constant value of 3 ⁇ 10 9 Pa, and at the glass transition temperature (270 ° C.).
  • the storage elastic modulus is about 1.8 ⁇ 10 8 Pa, and even when it exceeds 300 ° C., the storage elastic modulus is stabilized at about 4 ⁇ 10 7 Pa.
  • the saturation range of the conventional product is a temperature range of about 290 ° C. or higher. For these reasons, the conventional product has a smaller decrease in storage elastic modulus (viscosity) than the thermoplastic resin film 1 used this time.
  • the resin film to be prepared is not limited to the thermoplastic type, and may be a thermosetting resin film or a thermosetting resin and a thermoplastic as long as it has the above storage elastic modulus and a relatively large elongation at break.
  • the relatively large elongation at break is a value of at least 50%, preferably 150% or more.
  • thermoplastic resin film 1 heat and pressure are applied to both surfaces (first surface 1a and second surface 1b) of the thermoplastic resin film 1 to form a plurality of irregularities (anchors) on both surfaces of the thermoplastic resin film 1 (irregularities).
  • Forming step Specifically, as shown in FIG. 3, the metal foils 2 and 3 whose surfaces are roughened are pressed against the first surface 1a and the second surface 1b of the thermoplastic resin film 1 while being heated. More specifically, the roughened surface 2a of the metal foil 2 is pressed against the first surface 1a of the thermoplastic resin film 1, and the metal foil 3 is pressed against the second surface 1b of the thermoplastic resin film 1.
  • the roughened roughened surface 3 a is pressed and the thermoplastic resin film 1 is sandwiched between the metal foils 2 and 3. Then, the thermoplastic resin film 1 is heated to a glass transition temperature or higher (for example, about 270 ° C. or higher) and then pressurized with a predetermined pressure.
  • the press treatment was performed under the conditions of a heating temperature of 330 ° C., a pressure of 25 kg / cm 2 , and a treatment time of 20 minutes.
  • the thickness of the metal foils 2 and 3 in this example is about 12 ⁇ m, and the ten-point average roughness Rz on the roughened surfaces 2a and 3a is 5 to 8 ⁇ m. These numerical values can be appropriately changed according to the application and required reliability.
  • the material of the metal foils 2 and 3 may be copper, for example, or any other metal material that can be easily processed.
  • thermoplastic resin film 1 By applying pressure and heating using the metal foils 2 and 3, the thermoplastic resin film 1 is softened and enters the recesses that form the roughened surface 2 a of the metal foil 2. And metal foil 2 are attached. Similarly, the softened thermoplastic resin film 1 enters the concave portion that forms the roughened surface 3a of the metal foil 3, and the thermoplastic resin film 1 and the metal foil 3 are attached. That is, an attaching step for attaching the metal foils 2 and 3 to the thermoplastic resin film 1 as shown in FIG. 4 is performed. By such an attaching step, the surface shapes of the roughened surfaces 2a and 3a of the metal foils 2 and 3 are transferred to both surfaces of the thermoplastic resin film 1, and the both surfaces of the thermoplastic resin film 1 are transferred.
  • the material of the metal foils 2 and 3 is made of copper, so that a flexible copper-clad laminate (FCCL: Flexible Cupper Laminate) equivalent product in which the copper foil is bonded on both sides is formed. It will be.
  • FCCL Flexible Cupper Laminate
  • thermoplastic resin film 1 having a storage elastic modulus with dynamic viscoelasticity as shown in FIG. 2 since the thermoplastic resin film 1 having a storage elastic modulus with dynamic viscoelasticity as shown in FIG. 2 is used, the metal foils 2 and 3 are attached by heating and pressing. At the time of application, the viscosity of the thermoplastic resin film 1 is greatly reduced, the fluidity is increased, and the thermoplastic resin film 1 easily flows into the roughened surfaces 2a and 3a. That is, the unevenness forming process can be easily and reliably performed.
  • the conventional product since the conventional product has low fluidity even when the temperature exceeds 300 ° C., the conventional product does not flow into the roughened surface even when a metal foil having a roughened surface is attached by heating and pressing. Therefore, the roughened surface of the metal foil cannot be transferred with high accuracy to the surface of the conventional product.
  • thermoplastic resin film 1 As a method of forming irregularities on the surface of the thermoplastic resin film 1, a method of transferring the irregularities of the roughened metal foils 2 and 3 with a high-temperature press was selected, but other methods such as mechanical buffing were used. You may employ
  • the concave / convex shape of the copper foil used for the printed wiring board is such that the tip of the convex portion can be caught larger than the base of the convex portion, whereas the surface of the thermoplastic resin film 1 directly by mechanical polishing or chemical polishing. In the method of forming the unevenness on the surface, it is difficult to form the unevenness in a shape having a catch, and the adhesion strength is often low.
  • NC processing, laser processing, punching processing, or the like is performed in order to ensure conduction on the front and back surfaces (first surface 1 a and second surface 1 b) of the thermoplastic resin film 1.
  • Through-hole 4 is formed using the opening technique.
  • the opening diameter of the through hole 4 is 0.3 mm.
  • an actual three-dimensional wiring board has a plurality of through holes 4.
  • the quantity of the through-hole 4 can also be suitably changed according to the circuit structure of a three-dimensional wiring board.
  • a positioning hole for example, an opening diameter of 3 mm
  • a positioning hole for use as positioning at the time of three-dimensional molding, which will be described later, is removed without forming an outer edge portion of the thermoplastic resin film 1 (that is, finally forming a three-dimensional wiring board). A plurality of portions).
  • thermoplastic resin film 1 that is, with respect to the flexible copper-clad laminate
  • an etching process using cupric chloride or the like is performed, 3 is removed (removal step).
  • both surfaces of the thermoplastic resin film 1 to which the surface shapes of the roughened surfaces 2a and 3a of the metal foils 2 and 3 are transferred are exposed. That is, the first surface 1a and the second surface 1b having an uneven shape are exposed.
  • the concavo-convex forming step is completed through the above-described attaching step and removing step.
  • thermoplastic resin film 1 Next, on the surface of the thermoplastic resin film 1 so as to cover the first surface 1a, the second surface 1b of the thermoplastic resin film 1, and the side surface 1c of the thermoplastic resin film 1 exposed by the through holes.
  • the first metal film 5 is formed (first metal film forming step).
  • a metal is metallized on the surface of the thermoplastic resin film 1 by general electroless plating.
  • the catalyst film (Sn—Pd colloidal aqueous solution) is impregnated with the thermoplastic resin film 1 having irregularities formed thereon.
  • the Sn—Pd colloid is electrically adsorbed on the surface of the thermoplastic resin film 1.
  • the accelerator liquid is impregnated with the thermoplastic resin film 1 with Sn—Pd colloid supported on the surface, Sn covering the periphery of Pd is removed, and Pd ions are changed to metal Pd. That is, the catalyst treatment is performed to support the catalyst (for example, Pd) on the thermoplastic resin film 1 (FIG. 7).
  • sulfuric acid concentration: 10%
  • oxalic acid about 0.1%) can be used as the accelerator liquid.
  • thermoplastic resin film 1 carrying Pd as a catalyst is immersed in an electroless plating tank for 5 minutes.
  • copper is precipitated using Pd as a catalyst, and the formation of the first metal film 5 is completed so as to cover the surface of the thermoplastic resin film 1 (FIG. 8).
  • the electroless plating is generated in the form of particles, and the first metal film 5 is formed in a porous shape by the copper particles 5a. Is done.
  • the term “porous” means that the first metal film 5 does not have a film thickness that is completely formed on the film, but the entire film is electrically connected when at least a part of the particles are not all in contact with each other. (It is not always necessary to conduct electricity, and even if the distance between particles is separated by three-dimensional molding, it may be conducted by a second metal film described later).
  • the first surface 1a and the second surface 1b of the thermoplastic resin film 1 are uneven anchor surfaces, copper particles are deposited in the recesses of each surface. A porous film is formed.
  • a film thickness (a film thickness capable of transmitting light) in which the same amount of copper is deposited on a flat plate as when copper is deposited in a range of 0.05 ⁇ m to 0.50 ⁇ m. ) Is formed.
  • the first metal film 5 is formed so as to have a film thickness obtained by depositing an amount of copper equivalent to that obtained when 0.1 ⁇ m of copper is deposited on a flat plate.
  • the reason for adjusting the state (that is, the film thickness) of the first metal film 5 is that if the first metal film 5 is formed in a complete film shape that does not transmit light, the three-dimensional molding described later is performed. This is because even if a crack is generated in the first metal film 5, it is difficult to repair the crack even by a second metal film described later. More specifically, if the above numerical value is smaller than 0.05 ⁇ m, a portion where copper does not precipitate is generated in the recessed portion formed in the resin, and the recess is filled with the second metal film in the formation of the second metal film described later. Adhesion is greatly reduced. In addition, the distance between the particles after being stretched is too large, and it becomes difficult to repair conduction in the second metal film described later.
  • the distance between the particles is only large, so the crack is small.
  • the metal film exceeding the limit (the first metal film 5). ) Is cracked and becomes a wide crack.
  • the process of forming the first metal film 5 in a porous shape will be described in detail below.
  • the copper shown in FIG. 9 continues to be deposited from the state where the copper has started to be deposited on the uneven surface, the newly deposited copper forms a chemical bond with the already deposited copper.
  • the activity of Pd which is a catalyst
  • the formation of copper proceeds in the surface direction along the unevenness (that is, the direction spreading on the surface of the thermoplastic resin film 1).
  • it also starts to proceed in the thickness direction (that is, the thickness direction of the first metal film 5).
  • thermoplastic resin film 1 and the first metal film 5 are combined. It can be firmly joined by the anchor effect.
  • first metal film 5 is formed on the thermoplastic resin film 1
  • further formation of the second metal film described later is performed, and the adhesion when the thickness of the second metal film is 10 ⁇ m
  • a relatively high peel strength of about 15 N / cm can be obtained.
  • the conventional product shown in FIG. 2 it is not possible to easily form irregularities on the conventional product, and the conventional product and the metal film formed by electroless plating can be firmly adhered. Can not. In the experiment, it was found that only a peel strength of 2 N / cm or less was obtained for adhesion between the conventional product and the metal film formed by electroless plating, and the metal film peeled off in the conventional product.
  • the material of the first metal film 5 is not limited to copper, for example, various metals such as silver, gold, or nickel, or alloys or metals containing at least one of these metals and copper.
  • a laminated material may be used, it is preferable to use a metal that is relatively soft and has a high elongation at break.
  • the film thickness for realizing the state of transmitting light and conducting is different depending on the metal to be used, the first metal film 5 is formed in a porous shape when another metal is used. Therefore, the film thickness is adjusted as appropriate so that the above can be realized.
  • the first metal film is formed so as to cover the first surface 1a, the second surface 1b of the thermoplastic resin film 1 and the side surface 1c of the thermoplastic resin film 1 exposed by the through holes. 5, the first metal film 5 is formed only on either the first surface 1a or the second surface 1b of the thermoplastic resin film 1 in accordance with the required structure and characteristics of the three-dimensional wiring board. It may be formed. That is, the three-dimensional wiring board of the present invention includes not only those having wiring patterns formed on both sides but also those having wiring patterns formed only on one side.
  • thermoplastic resin film 1 is formed on the thermoplastic resin film 1 to stabilize the crystal structure of the first metal film 5.
  • the first metal film 5 is patterned by photolithography to form a desired wiring pattern (pattern forming step). Specifically, a photosensitive resist film is thermocompression bonded to the surface of the thermoplastic resin film 1 in a state where the first metal film 5 is formed, and exposure and development are performed using a mask film on which a predetermined pattern is printed. Do. Subsequently, the first resist film 5 is etched using the developed resist film as an etching mask to form a desired wiring pattern. Thereafter, the resist film is peeled and removed.
  • the first metal film 5 is patterned by photolithography, it is possible to realize a higher definition pattern than patterning using an inkjet printing technique or a gravure offset printing technique. That is, the first metal film 5 has higher resolution (that is, excellent linearity and high-definition wiring formation) than a wiring pattern patterned using an ink jet printing technique or a gravure offset printing technique. ) Being.
  • thermoplastic resin film 1 in a state where the first metal film 5 is formed is subjected to heat treatment and pressure treatment to perform three-dimensional molding (three-dimensional molding step).
  • three-dimensional molding step first, the thermoplastic resin film 1 is positioned with respect to the molding die 11 using the plurality of positioning holes described above. This is for aligning the molding position and the wiring pattern position. Specifically, a plurality of pins having a diameter that fits with the positioning holes are provided on the mold. Then, the positioning hole of the thermoplastic resin film 1 is fitted to this pin to align the position. That is, as shown in FIG. 12, the thermoplastic resin film 1 is disposed between the upper mold 12 and the lower mold 13 of the mold 11. Subsequently, as shown in FIG.
  • the heating temperature is in the range of 240 ° C. to 350 ° C. that is equal to or higher than the glass transition temperature of the material (for example, 280 ° C.), but the heating temperature is appropriately adjusted according to the material of the thermoplastic resin film 1.
  • the heating temperature is required to be not lower than the glass transition temperature and not higher than the heat-resistant temperature of the thermoplastic resin film 1, but is preferably set to the lowest possible temperature within the range. This is for reducing a decrease in adhesion due to heating of the first metal film 5 and the thermoplastic resin film 1 formed on the thermoplastic resin film 1.
  • the upper mold 12 and the lower mold 13 are brought closer to each other, and the thermoplastic resin film 1 is pressed from above and below with a desired pressure (for example, 10 MPa) (FIG. 14).
  • the desired pressure is appropriately adjusted in consideration of the material of the thermoplastic resin film 1 and the point that the desired three-dimensional molding becomes difficult if the pressure is too weak.
  • the thermoplastic resin film 1 is taken out from the metal mold
  • the shape of the actual three-dimensional wiring board has a plurality of steps (unevenness), so the mold 11 also has a plurality of steps (unevenness).
  • a structure in which a plurality of steps (unevenness) between the upper mold 12 and the lower mold 13 are fitted to each other may be employed.
  • the thermoplastic resin film 1 that is, the substrate 16 for the three-dimensional wiring board
  • the thermoplastic resin film 1 that has undergone the three-dimensional molding is likely to have a crack 17 in the bent portion 1d that is bent by the three-dimensional molding.
  • the crack 17 is a gap formed by an increase in the interparticle distance of the copper particles 5 a constituting the first metal film 5, and is a complete metal film shape that does not transmit light.
  • the structure is different from that of a crack generated by stretching the metal film.
  • a crack may not generate
  • the crack 17 is caused by the first metal film 5 having an increased interparticle distance, but the first metal film 5 is porous. Therefore, the width of the crack 17 itself is equal to the size of the particle 5a and becomes very small. Furthermore, compared to the case where the first metal film 5 is formed in a complete film shape. The width of the crack 17 is reduced. That is, the substrate 16 for a three-dimensional wiring board according to the present embodiment is in a state in which the crack 17 can be repaired more easily than in the case where the first metal film 5 is formed in a complete film shape. It has become.
  • the crack 17 (gap between the particles) is small when stretched in a state where light is transmitted because the distance between the particles is only large, but the limit is exceeded when the film is stretched in a complete film shape that does not transmit light.
  • the metal film is cracked and a wide crack is generated.
  • the crack 17 is a straight line having a narrow width corresponding to the shape of the roughened surface. And non-linear shapes.
  • the straight and non-linear cracks 17 are easily filled with metal by forming a second metal film, which will be described later, and the conduction recovery in the first metal film 5 is made easier.
  • the above-described three-dimensional molding may be performed in a state where the thermoplastic resin film 1 is sandwiched between two protective films.
  • angular part 1e in the bending part 1d can be made slightly smooth, and generation
  • the protective film is preferably formed of the same material as the thermoplastic resin film 1.
  • the shape of the corner portion 1e in the bent portion 1d is curved, or the angle is made smaller than 90 degrees (for example, 75 degrees to 85 degrees).
  • the mold 11 may be designed.
  • thermoplastic resin film 1 is pressed from above and below using the upper mold 12 and the lower mold 13.
  • the thickness uniformity of the thermoplastic resin film 1 after the heat press is performed. Can be ensured and a predetermined three-dimensional shape can be formed, and other press processing methods such as vacuum press or pressure press may be used.
  • the second metal film 21 is formed so as to cover the surface of the first metal film 5 of the substrate 16 for the three-dimensional wiring board (second metal film forming step: FIG. 17).
  • a metal is additionally deposited on the surface of the first metal film 5 by general electroless plating.
  • the three-dimensional wiring substrate base material 16 is desired in order to remove the oxide layer formed on the surface of the three-dimensional wiring substrate base material 16 by heating in the molding step.
  • a cleaning solution for example, acid degreasing solution, 5% sulfuric acid solution.
  • a catalyst treatment is performed to cause the first metal film 5 of the substrate 16 for a three-dimensional wiring board to react with a type of catalyst (for example, an ionic Pd catalyst) that replaces the first metal film 5, and thereafter, the three-dimensional wiring board
  • the base material 16 for use is immersed in an electroless plating solution.
  • the metal is selectively deposited only around the first metal film 5 where the catalyst is present on the surface, and the metal is not formed in the region that does not become a wiring circuit (that is, the exposed region of the thermoplastic resin film 1). Is not deposited, and an additional pattern forming process for the second metal film 21 is not required.
  • copper is used as the metal of the second metal film 21, and a plurality of copper particles (not shown as particles in FIG. 17 but described as a film) are the first metal film 5. It will be deposited on the particles 5a.
  • the second metal film 21 is formed in a complete film shape without being formed in a porous shape.
  • the second metal film 21 having a thickness of 10 ⁇ m or more could be formed by immersion for 2 hours.
  • the particles 21a constituting the second metal film 21 grow around the particles 5a constituting the first metal film 5, and the thickness direction and the thickness of the second metal film 21 are related to each other. It grows to the same extent with respect to the direction orthogonal to the direction (planar direction of the second metal film 21).
  • the 2nd metal film 21 can be formed so that the linear and non-linear crack 17 of the 1st metal film 5 which arose by three-dimensional shaping
  • the film thickness of the second metal film 21 is assumed. It may be adjusted to 1 ⁇ 2 times or more of the maximum width of the crack 17, more preferably adjusted to a film thickness comparable to the width of the crack 17.
  • the second metal film 21 is also generated on the side surface 1c of the through hole 4 in the same manner as the surface layer, and it is possible to repair the conduction even if there is a front and back conduction failure due to the through hole 4.
  • a relatively high peel strength of about 15 N / cm can be obtained for the adhesion between the thermoplastic resin film 1 and the first metal film 5 plated with the second metal film 21 by 10 ⁇ m. Therefore, the minute swelling and the peeling of the metal film due to the residual stress at the time of forming the second metal film 21 are prevented, and the reliability as a three-dimensional wiring board can be improved.
  • the layer thickness (wiring pattern thickness) of the conductor layer necessary for the wiring circuit is insufficient with the film thickness of the first metal film 5, but by forming the second metal film 21.
  • the necessary film thickness of the conductor layer can be ensured and the wiring resistance value can be reduced.
  • the second metal film 21 is formed by electroless plating. However, if the second metal film 21 can be finally formed only on the surface of the first metal film 5, another film is formed. A technique (for example, electrolytic plating) may be used. However, when the second metal film 21 is formed by electroless plating as in this embodiment, it can be formed even if the independent wiring, that is, the wiring circuit is electrically separated from the outer peripheral portion of the molded body. However, when the second metal film 21 is formed by electrolytic plating, it is necessary that all the wirings are electrically connected to the outer peripheral portion of the molded body, which is taken into consideration at the time of design including the installation of the feeder line. It will be necessary. Further, in this case, when a non-conductive portion is generated by the three-dimensional molding, the second metal film 21 cannot be formed because electricity does not flow beyond the non-conductive portion.
  • the material of the second metal film 21 is not limited to copper, and other metals such as nickel or nickel chrome, nickel copper, gold, or silver or alloys containing these may be used for the three-dimensional wiring board.
  • the material can be appropriately adjusted according to required characteristics and reliability.
  • the surface of the second metal film 21 is subjected to a rust preventive agent treatment, and the three-dimensional wiring board composed of the thermoplastic resin film 1, the first metal film 5, and the second metal film 21. 30 is completed.
  • FIG. For the formation of the protective film, a method of forming a coverlay provided with an opening on a three-dimensional object, or a method of applying a photosensitive resist ink and forming an opening on the three-dimensional object by photolithography may be employed.
  • the three-dimensional wiring board 30 according to the present example is about 15 N / cm of adhesion when the first metal film 5 and the 10 ⁇ m second metal film 21 are formed on the thermoplastic resin film 1.
  • the relatively high peel strength can be obtained, and the minute blisters and the metal film are prevented from being peeled off due to the residual stress when the second metal film 21 is formed.
  • the occurrence of cracks and breaks in the wiring pattern (first metal film 5 and second metal film 21) due to stress applied during external processing, reflow during component mounting, and the like is suppressed.
  • FIG. 18 is a schematic drawing for explaining the three-dimensional shape of the three-dimensional wiring board 30, and the wiring pattern and the through hole are omitted.
  • the three-dimensional wiring board 30 has a conductor layer made of the first metal film 5 and the second metal film 21 on the surface of the thermoplastic resin film 1 (first surface 1a and second surface 1b). Since it has a three-dimensional shape, it can be applied to various uses. For example, when the thermoplastic resin film 1 is relatively thick (for example, 100 ⁇ m), as shown in FIG. 19, the electronic component 41 mounted on the other mounting substrate 40 is shielded from electromagnetic waves while other It is possible to mount the electronic component 42 on the surface. In this case, in order to achieve electromagnetic shielding by the conductor layers (the first metal film 5 and the second metal film 21) located on the electronic component 41 side (that is, the inner side), the inner conductor layer is patterned.
  • the three-dimensional wiring board 30 is fixed to the mounting board 40 using a bonding member such as solder or a conductive adhesive.
  • the electronic component 42 is arranged in the space shielded by the three-dimensional wiring board 30 and the mounting substrate 40, and the electronic component 41 and the electronic component 42 are separated. Thus, electromagnetic shielding may be achieved.
  • a conductor layer not subjected to patterning is grounded to function as a GND layer, and a single characteristic impedance control pattern or a differential impedance control pattern is formed on the conductor layer located on the opposite side to the conductor pattern not subjected to the patterning. Good. With such a structure, impedance control can be achieved in the three-dimensional wiring board 30.
  • the thermoplastic resin film 1 is made relatively thin (for example, 50 ⁇ m or less)
  • the three-dimensional wiring board 30 is bonded to another mold resin having a three-dimensional shape to replace the conventional MID board. Can be used as a body.
  • the thermoplastic resin film 1 is thin, even if the three-dimensional wiring board 30 is bonded to another mold resin, the thickness of the composite made of the three-dimensional wiring board 30 and the other mold resin does not increase, and the composite This is because the strength of the body can be ensured.
  • the said composite body has the conductor layer formed in both surfaces of the thermoplastic resin film 1 compared with the existing MID board
  • a two-dimensionally molded portion is formed by connecting a flat thermoplastic resin film and wiring is provided to connect the two portions, a structure and usage method like a so-called flex-rigid substrate can be obtained.
  • the three-dimensional wiring board according to the first embodiment of the present invention has a dynamic viscoelastic property with a storage elastic modulus of 2 ⁇ 10 7 Pa or less in a saturation region not lower than the glass transition temperature and has a breaking elongation of 50% or more.
  • the second metal film is formed using the patterned first metal film, a special apparatus or process for patterning the first metal film and the second metal film is not required. Thus, a lower cost and finer wiring pattern is realized.
  • the first metal film is formed in a porous shape on the unevenness forming surface of the resin film, the second metal film can be easily and reliably provided with a narrow linear and non-linear crack in the first metal film. A wiring circuit (first metal film and second metal film) that has been repaired, has no conduction failure, and has excellent reliability is realized.
  • the resin film and the first metal film / second metal film can be firmly bonded by the anchor effect, and the adhesion of both members is compared. High peel strength can be obtained. And by obtaining such peel strength, peeling of minute blisters and metal film due to residual stress at the time of forming the second metal film is prevented, and reliability as a three-dimensional wiring board is improved. Furthermore, the occurrence of cracks and disconnections in the wiring circuit due to stress applied in various processes after the completion of the three-dimensional wiring board (solder resist formation, outer shape processing, reflow during component mounting, etc.) is also suppressed. From the above, the three-dimensional wiring board of the present invention has excellent reliability by preventing peeling between the resin film and the metal that is the material of the wiring circuit, fine processing of the wiring circuit, and disconnection of the wiring circuit, It can be manufactured at low cost.
  • the second metal film has a linear shape and a non-linear shape generated in the first metal film at a bent portion of the resin film. It is to repair the crack. As a result, no poor conduction occurs in the wiring circuit, and excellent reliability can be realized.
  • the thickness of the second metal film is 1 ⁇ 2 times or more the width of the crack. Therefore, the crack generated in the first metal film can be reliably repaired by the second metal film.
  • the first metal film is formed by depositing 0.05 ⁇ m or more and 0.50 ⁇ m or less of copper on a flat plate. It is to provide a film thickness in which an equivalent amount of copper is deposited in the form of particles. Thereby, the crack which arises in the 1st metal film can be made small, and it can repair reliably by the 2nd metal film.
  • a three-dimensional wiring board according to a fifth embodiment of the present invention is that, in the fourth embodiment described above, the first metal film has a structure in which copper particles are placed in the recesses of the resin film. Thereby, a resin film and a 1st metal film can be firmly joined by an anchor effect, and higher peel strength can be obtained about adhesion of both members.
  • the first metal film is formed on both surfaces of the resin film.
  • the degree of freedom of the wiring circuit is higher than that of the single-sided substrate, and miniaturization can be easily realized, so that the density of the three-dimensional wiring substrate can be increased.
  • the manufacturing method of the three-dimensional wiring board which concerns on 7th embodiment of this invention is equipped with the dynamic viscoelastic property whose storage elastic modulus is 2 * 10 ⁇ 7 > Pa or less in the saturation region above a glass transition temperature, and 50% or more
  • a preparation step for preparing a flat resin film having elongation at break a step of forming a plurality of projections and depressions on the surface of the resin film by applying heat and pressure to the resin film, and A first metal film forming step of forming a first metal film, a pattern forming step of patterning the first metal film by photolithography to form a desired pattern, and a state in which the first metal film is formed
  • the first metal film is formed in a porous shape by depositing metal in the form of particles
  • the second metal film is formed using the patterned first metal film, a special apparatus or process for patterning the first metal film and the second metal film is not required.
  • an existing wiring board manufacturing apparatus can be used, and a finer wiring pattern can be realized at a lower cost.
  • the first metal film is formed in a porous shape on the unevenness forming surface of the resin film, it is possible to prevent the first metal film from generating a crack that cannot be repaired even in the subsequent three-dimensional formation process. .
  • the unevenness (anchor surface) is formed on the surface of the resin film, the resin film and the first metal film / second metal film can be firmly bonded by the anchor effect, and the adhesion between both members is relatively high.
  • Peel strength can be obtained. And by obtaining such peel strength, peeling of minute blisters and metal film due to residual stress at the time of forming the second metal film is prevented, and reliability as a three-dimensional wiring board is improved. Furthermore, the occurrence of cracks and disconnections in the wiring circuit due to stress applied in various processes after the completion of the three-dimensional wiring board (solder resist formation, outer shape processing, reflow during component mounting, etc.) is also suppressed. From the above, the method for manufacturing a three-dimensional wiring board according to the present invention can easily prevent peeling between the resin film and the metal that is the material of the wiring circuit, fine processing of the wiring circuit, and prevention of disconnection of the wiring circuit. Furthermore, a three-dimensional wiring board can be manufactured at low cost.
  • a manufacturing method of a three-dimensional wiring board according to an eighth embodiment of the present invention is the above-described seventh embodiment, wherein the resin film is bent by the three-dimensional molding in the three-dimensional molding step in the second metal film forming step.
  • the crack is repaired by the second metal film.
  • the manufacturing method of the three-dimensional wiring board according to the ninth embodiment of the present invention is the above-described eighth embodiment, wherein the thickness of the second metal film is set to 1 ⁇ 2 times the width of the crack in the second metal film forming step. That's it. Thereby, the crack generated in the first metal film can be reliably repaired by the second metal film.
  • the unevenness forming step includes the step of forming the roughened surface of the roughened metal foil with the resin. It is heating while pressing on a film, and is equipped with the sticking process which affixes the said metal foil on the said resin film, and the removal process which removes the said metal foil. Thereby, a resin film and a 1st metal film can be firmly joined by an anchor effect, and higher peel strength can be obtained about adhesion of both members.
  • a manufacturing method of a three-dimensional wiring board according to an eleventh embodiment of the present invention includes any one of the seventh to tenth embodiments described above, wherein copper, silver, nickel, or gold is formed on the flat plate in the first metal film forming step. Or an amount of copper, silver, nickel, gold, or an alloy containing at least one of these is deposited in the form of particles equivalent to the case where 0.05 to 0.50 ⁇ m or less of an alloy containing at least one of these is deposited. It is to be. Thereby, the crack which arises in a 1st metal film can be made small without impairing adhesion
  • a manufacturing method of a three-dimensional wiring board according to a twelfth embodiment of the present invention is the method according to any one of the seventh to eleventh embodiments, wherein the first metal film is formed by catalytic treatment and electroless plating in the first metal film formation step. Is to form. This eliminates the need for costly pretreatment and a manufacturing apparatus therefor, and can further reduce the cost of the three-dimensional wiring board itself.
  • a manufacturing method of a three-dimensional wiring board according to a thirteenth embodiment of the present invention in any one of the seventh to twelfth embodiments described above, the first metal film on both surfaces of the resin film in the first metal film formation step.
  • the first metal is patterned on any of the first metal films formed on both surfaces of the resin film in the pattern forming step, and is patterned in the second metal film forming step.
  • the second metal film is formed on any of the films.
  • the substrate for a three-dimensional wiring board according to the fourteenth embodiment of the present invention has a dynamic viscoelasticity property in which a storage elastic modulus in a saturation region equal to or higher than the glass transition temperature is 2 ⁇ 10 7 Pa or lower, and is 50% or higher.
  • the first metal film is provided with a plurality of irregularities, and the film thickness is adjusted so as to have a porous structure formed by depositing metal particles.
  • the first metal film is formed in a porous shape on the uneven surface of the resin film, even if narrow linear and non-linear cracks occur in the first metal film, additional formation is performed. The crack is easily and reliably repaired by the film, and the final conduction failure is prevented.
  • the unevenness (anchor surface) is formed on the surface of the resin film, the resin film and the first metal film / second metal film can be firmly bonded by the anchor effect, and the adhesion of both members is compared. High peel strength can be obtained. And by obtaining such peel strength, peeling of minute blisters and metal film due to residual stress during additional film formation is prevented, and reliability as a final substrate is improved.
  • the substrate for a three-dimensional wiring board according to the present invention has excellent reliability by preventing the peeling between the resin film and the metal that is the material of the wiring circuit, the fine processing of the wiring circuit, and the disconnection of the wiring circuit. In addition, it can be manufactured at low cost.
  • the substrate for a three-dimensional wiring board according to the fifteenth embodiment of the present invention is the above-described fourteenth embodiment, wherein the first metal film has copper deposited on a flat plate in a range of 0.05 ⁇ m to 0.50 ⁇ m. It is to provide a film thickness in which an equivalent amount of copper is deposited in the form of particles. As a result, it is possible to increase the density of the finally produced three-dimensional wiring board.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
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  • Parts Printed On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
PCT/JP2016/070139 2016-07-07 2016-07-07 立体配線基板、立体配線基板の製造方法、立体配線基板用基材 WO2018008125A1 (ja)

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KR1020187027682A KR20190025538A (ko) 2016-07-07 2016-07-07 입체 배선 기판, 입체 배선 기판의 제조 방법, 입체 배선 기판용 기재
CN201680086437.9A CN109315069B (zh) 2016-07-07 2016-07-07 立体配线基板、立体配线基板的制造方法及立体配线基板用基材
JP2017510605A JP6169304B1 (ja) 2016-07-07 2016-07-07 立体配線基板、立体配線基板の製造方法、立体配線基板用基材
TW106108954A TWI713418B (zh) 2016-07-07 2017-03-17 立體配線基板、立體配線基板的製造方法以及立體配線基板用基材

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