KR20190025538A - 입체 배선 기판, 입체 배선 기판의 제조 방법, 입체 배선 기판용 기재 - Google Patents

입체 배선 기판, 입체 배선 기판의 제조 방법, 입체 배선 기판용 기재 Download PDF

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Publication number
KR20190025538A
KR20190025538A KR1020187027682A KR20187027682A KR20190025538A KR 20190025538 A KR20190025538 A KR 20190025538A KR 1020187027682 A KR1020187027682 A KR 1020187027682A KR 20187027682 A KR20187027682 A KR 20187027682A KR 20190025538 A KR20190025538 A KR 20190025538A
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KR
South Korea
Prior art keywords
metal film
film
metal
resin film
dimensional
Prior art date
Application number
KR1020187027682A
Other languages
English (en)
Korean (ko)
Inventor
시게루 미치와키
Original Assignee
메이코 일렉트로닉스 컴파니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 메이코 일렉트로닉스 컴파니 리미티드 filed Critical 메이코 일렉트로닉스 컴파니 리미티드
Publication of KR20190025538A publication Critical patent/KR20190025538A/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
KR1020187027682A 2016-07-07 2016-07-07 입체 배선 기판, 입체 배선 기판의 제조 방법, 입체 배선 기판용 기재 KR20190025538A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2016/070139 WO2018008125A1 (ja) 2016-07-07 2016-07-07 立体配線基板、立体配線基板の製造方法、立体配線基板用基材

Publications (1)

Publication Number Publication Date
KR20190025538A true KR20190025538A (ko) 2019-03-11

Family

ID=59384378

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187027682A KR20190025538A (ko) 2016-07-07 2016-07-07 입체 배선 기판, 입체 배선 기판의 제조 방법, 입체 배선 기판용 기재

Country Status (5)

Country Link
JP (1) JP6169304B1 (zh)
KR (1) KR20190025538A (zh)
CN (1) CN109315069B (zh)
TW (1) TWI713418B (zh)
WO (1) WO2018008125A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021132991A1 (ko) * 2019-12-23 2021-07-01 엘지이노텍 주식회사 기판
US12041716B2 (en) 2019-12-23 2024-07-16 Lg Innotek Co., Ltd. Substrate

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7177918B2 (ja) * 2019-04-23 2022-11-24 京セラ株式会社 配線基板、電子装置及び電子モジュール
TWI789171B (zh) * 2021-12-21 2023-01-01 財團法人工業技術研究院 電子裝置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06188537A (ja) 1992-12-22 1994-07-08 Toshiba Corp 配線基板の製造方法
JP2000174399A (ja) 1998-12-01 2000-06-23 Nhk Spring Co Ltd 立体配線基板とその製造方法および基板用絶縁材料
JP2012094605A (ja) 2010-10-25 2012-05-17 Panasonic Corp 立体基板および立体基板の製造方法

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JPH08293646A (ja) * 1995-02-23 1996-11-05 Hitachi Ltd プリント配線基板及びその製造方法
JP3498937B2 (ja) * 1997-05-08 2004-02-23 三井化学株式会社 樹脂基板およびその製造方法
JPH11121880A (ja) * 1997-10-14 1999-04-30 Hitachi Cable Ltd 成形回路部品及びその製造方法
CN100574561C (zh) * 1997-12-29 2009-12-23 伊比登株式会社 多层印刷布线板
EP1542518A4 (en) * 2002-06-04 2009-08-26 Sumitomo Electric Industries CIRCUIT BOARD FOR PRINTED WIRING, PRINTED PCB AND METHOD FOR THE PRODUCTION THEREOF
US8021748B2 (en) * 2003-09-29 2011-09-20 Ibiden Co., Ltd. Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same
JP5583384B2 (ja) * 2008-12-02 2014-09-03 パナソニック株式会社 回路基板の製造方法、及び前記製造方法により得られた回路基板
JP5562334B2 (ja) * 2009-07-03 2014-07-30 三井化学株式会社 樹脂組成物、それを含む積層体、半導体装置およびフィルム
KR101116181B1 (ko) * 2010-09-29 2012-03-06 주식회사 두산 성형성이 우수한 에폭시수지를 포함한 적층체 및 그 제조방법
JP5896200B2 (ja) * 2010-09-29 2016-03-30 日立化成株式会社 半導体素子搭載用パッケージ基板の製造方法
JP2014143221A (ja) * 2011-05-18 2014-08-07 Panasonic Corp 回路基板の製造方法、並びに、その製造方法で得られる回路基板
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JPH06188537A (ja) 1992-12-22 1994-07-08 Toshiba Corp 配線基板の製造方法
JP2000174399A (ja) 1998-12-01 2000-06-23 Nhk Spring Co Ltd 立体配線基板とその製造方法および基板用絶縁材料
JP2012094605A (ja) 2010-10-25 2012-05-17 Panasonic Corp 立体基板および立体基板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021132991A1 (ko) * 2019-12-23 2021-07-01 엘지이노텍 주식회사 기판
US12041716B2 (en) 2019-12-23 2024-07-16 Lg Innotek Co., Ltd. Substrate

Also Published As

Publication number Publication date
WO2018008125A1 (ja) 2018-01-11
TWI713418B (zh) 2020-12-11
CN109315069A (zh) 2019-02-05
JP6169304B1 (ja) 2017-07-26
TW201803415A (zh) 2018-01-16
JPWO2018008125A1 (ja) 2018-07-12
CN109315069B (zh) 2021-01-08

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