WO2015170514A1 - 蛍光体含有識別物体及びその製造方法 - Google Patents
蛍光体含有識別物体及びその製造方法 Download PDFInfo
- Publication number
- WO2015170514A1 WO2015170514A1 PCT/JP2015/058104 JP2015058104W WO2015170514A1 WO 2015170514 A1 WO2015170514 A1 WO 2015170514A1 JP 2015058104 W JP2015058104 W JP 2015058104W WO 2015170514 A1 WO2015170514 A1 WO 2015170514A1
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- WO
- WIPO (PCT)
- Prior art keywords
- phosphor
- silicone
- substrate
- identification object
- thin layer
- Prior art date
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims abstract description 115
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 168
- 239000000203 mixture Substances 0.000 claims abstract description 101
- 239000000463 material Substances 0.000 claims abstract description 51
- 238000000465 moulding Methods 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 73
- 125000003342 alkenyl group Chemical group 0.000 claims description 19
- 150000001875 compounds Chemical class 0.000 claims description 17
- 238000007259 addition reaction Methods 0.000 claims description 12
- 239000003054 catalyst Substances 0.000 claims description 10
- 150000002978 peroxides Chemical class 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 6
- 229920005573 silicon-containing polymer Polymers 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 4
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 2
- 238000012546 transfer Methods 0.000 claims description 2
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- 239000010409 thin film Substances 0.000 abstract description 15
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 23
- -1 trimethoxysilyl groups Chemical group 0.000 description 18
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- 238000001723 curing Methods 0.000 description 12
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- 239000000049 pigment Substances 0.000 description 12
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 230000001771 impaired effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000007809 chemical reaction catalyst Substances 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 238000013006 addition curing Methods 0.000 description 3
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- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
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- 238000000576 coating method Methods 0.000 description 2
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- 239000000835 fiber Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000007850 fluorescent dye Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
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- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- HKVABTLWYHNNBA-UHFFFAOYSA-N [2,2-dichloro-1-(2,4-dichlorophenyl)ethenyl] dimethyl phosphate Chemical compound COP(=O)(OC)OC(=C(Cl)Cl)C1=CC=C(Cl)C=C1Cl HKVABTLWYHNNBA-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N ferric oxide Chemical compound O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 150000002688 maleic acid derivatives Chemical class 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 150000004893 oxazines Chemical class 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 238000005502 peroxidation Methods 0.000 description 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 150000003057 platinum Chemical class 0.000 description 1
- 239000002574 poison Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- XSIXARXPTLGAOD-UHFFFAOYSA-M tetrasodium;hydroxide Chemical compound [OH-].[Na+].[Na+].[Na+].[Na+] XSIXARXPTLGAOD-UHFFFAOYSA-M 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H21/00—Non-fibrous material added to the pulp, characterised by its function, form or properties; Paper-impregnating or coating material, characterised by its function, form or properties
- D21H21/14—Non-fibrous material added to the pulp, characterised by its function, form or properties; Paper-impregnating or coating material, characterised by its function, form or properties characterised by function or properties in or on the paper
- D21H21/40—Agents facilitating proof of genuineness or preventing fraudulent alteration, e.g. for security paper
- D21H21/44—Latent security elements, i.e. detectable or becoming apparent only by use of special verification or tampering devices or methods
- D21H21/48—Elements suited for physical verification, e.g. by irradiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/22—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length
- B29C43/30—Making multilayered or multicoloured articles
- B29C43/305—Making multilayered articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
- B42D25/378—Special inks
- B42D25/387—Special inks absorbing or reflecting ultraviolet light
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/06—Luminescent, e.g. electroluminescent, chemiluminescent materials containing organic luminescent materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0058—Liquid or visquous
- B29K2105/007—Paste, dough
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0037—Other properties
- B29K2995/0098—Peel strength; Peelability
Definitions
- the present invention relates to a phosphor-containing identification object that can be identified by light irradiation and a method for producing the same. More specifically, the present invention relates to a phosphor-containing identification object having a phosphor for identification on the surface and a method for manufacturing the same.
- Patent Document 1 proposes a marking ink composition in which a pigment is added to an addition-cured silicone compound having a specific composition.
- Patent Document 2 proposes a marking ink composition obtained by adding a pigment to a condensation-cured silicone compound having a specific composition and a printing method thereof. All patent documents are characterized by adhesion to a silicone molded body as a base material and a rapid curing rate. These marking ink compositions are generally quite different in composition, even though they are based on silicone and are the same as the substrate being marked. Therefore, the properties of the surface covered with the marking composition will be different from the substrate.
- a material having appropriate characteristics is selected according to the application, or the composition is customized to adjust the optimal characteristics.
- Appropriate properties depending on the application often include surface properties as well as bulk physical properties.
- surface adhesion and tackiness it is a characteristic that also requires surface adhesion and tackiness.
- the marking is for identification and has nothing to do with the properties of the appropriate substrate depending on the application. Not only is it irrelevant, but the properties of the substrate, especially the surface properties, are impaired. For example, the surface adhesion and tackiness are reduced by marking. This is a problem when marking on silicone-based materials and parts, and has not been solved.
- Patent Document 4 is an example of using such invisible ink.
- the vinyl chloride polymer is listed as the base material and the resin component of the invisible ink, but it is exemplified to be effective for the silicone polymer.
- the resin component of invisible ink is curable. Therefore, when applied to a silicone-based material, the above-described problem of marking without changing the surface characteristics of the substrate remains.
- Patent Document 5 proposes a water-based invisible ink used for ink jet printing. However, it is difficult to apply water-based ink to a silicone material.
- Patent Document 6 and Patent Document 7 proposals have been made to increase the crosslink density near the surface of the silicone gel material to make it rubbery.
- a silicone containing SiH group which is a cross-linking material component for addition curing
- the release film Before curing the addition-curing silicone gel used as the base material, apply a silicone containing SiH group, which is a cross-linking material component for addition curing, to the release film, and then apply it to the base material, and then heat cure on it. It is a molded product manufactured in this way.
- Japanese Patent Publication No.52-14642 Japanese Patent Publication No.57-49589 Japanese Patent No. 4949130 JP 2002-169469 A JP 2012-111946 A Japanese Patent Laid-Open No. 10-6440 JP-A-10-183110
- the conventional technique has a problem that it is difficult to perform marking without changing the surface characteristics of the base material.
- the present invention can be applied to a silicone thin film, has excellent adhesion to a substrate, and does not impair the original properties of the substrate by marking. And a method for manufacturing the same.
- the entire surface or a part of the substrate is covered with a phosphor-containing silicone thin layer, and the phosphor does not emit light when irradiated with visible light, but is irradiated with ultraviolet rays or black light. It has a distinctiveness by emitting light at.
- the method for producing a phosphor-containing identification object according to the present invention is the above-described method for producing a phosphor-containing identification object, wherein the phosphor-containing thin layer forming silicone composition is contacted after molding the substrate or simultaneously with the molding. And then heated or pressurized.
- the phosphor-containing identification object of the present invention is provided with markings that can be easily identified by irradiation with light, particularly ultraviolet rays or black light, and has excellent adhesion between the marking and the substrate.
- the original properties of the base material are not impaired. Therefore, it can be applied to an identification object such as a molded body as an assembled part in particular, and can be used for preventing misplacement of parts and suppressing counterfeit products.
- FIG. 1A is an observation photograph of a phosphor-containing identification object made of a silicone molded article according to an embodiment of the present invention in general indoor illumination
- FIG. 1B is an observation photograph under black light irradiation.
- the substrate may be any material such as resin, paper, metal, ceramics, and fiber.
- the whole or part of the surface of the substrate is covered with a phosphor-containing silicone thin layer, and the phosphor does not emit light when irradiated with visible light, but has distinctiveness when emitted by irradiation with ultraviolet light or black light.
- the preferred thickness of the phosphor-containing silicone thin layer is 0.1 to 20 ⁇ m, more preferably 0.5 to 15 ⁇ m.
- the shape of the substrate is preferably a sheet.
- the shape is not limited as long as the effects of the present invention can be exhibited, such as a columnar shape, a prismatic shape, a hollow body, and a sheet having a complicated surface shape.
- the base material composition used for the base material contains a base polymer composed of one or a plurality of silicone polymers. It is often cured by adding a curable component such as a cross-linking material or a catalyst, or a silicone resin that imparts tackiness.
- a curable component such as a cross-linking material or a catalyst, or a silicone resin that imparts tackiness.
- a composition comprising only such a base polymer and a curable component can be used as the substrate composition.
- a composition to which an inorganic filler, a flame retardant, a heat resistance improver, a pigment or the like is added can also be used as the substrate composition.
- a substrate composition comprising such a polymer and an inorganic filler is generally finally cured.
- an uncured composition can also be used as a substrate as long as it has a physical property capable of maintaining its shape like putty.
- the silicone polymer that is the main component of the base composition is generally a linear polydiorganoshiroskin.
- Such linear polydiorganosiloxane is composed of diorganosiloxane units, and the ends of the polymer are blocked with silyl groups having hydrolyzable groups such as hydroxyl groups, hydrogen atoms, monovalent organic groups, and trimethoxysilyl groups. ing.
- a branched polysiloxane partially containing a monoorganosiloxane unit can also be used.
- a network-like polysiloxane or resinous polysiloxane composed of triorganosiloxane units, diorganosiloxane units, monoorganosiloxane units, and SiO 2 units should be used. You can also.
- an alkyl group such as a methyl group, an aryl group such as a phenyl group, a substituted alkyl group such as a 1,1,1-trifluoropropyl group, an alkenyl group such as a vinyl group, and the like are used. .
- most organic groups are generally methyl groups.
- An appropriate amount of an alkenyl group such as a vinyl group is used for controlling the curing by a peroxide or for addition curing by a hydrosilylation reaction.
- a phenyl group is used.
- 1,1,1-trifluoropropyl group or the like is used.
- the inorganic filler used in the base material composition there is no limitation on the inorganic filler used in the base material composition. Fine silica, quartz powder, silica such as diatomaceous earth, metal oxide such as alumina, metal hydroxide such as aluminum hydroxide, metal carbonate such as calcium carbonate, metal nitride such as aluminum nitride, boron nitride, aluminum Examples thereof include metal powders such as silver and silver, carbon black, graphite, and graphite. Sometimes used in powder form, sometimes used in fibrous form.
- the composition used for marking is mainly composed of phosphor and silicone.
- the fluorescent substance itself may be a fluorescent pigment that emits fluorescence, or a fluorescent substance having a structure in which a fluorescent dye is fixed to a resin or the like.
- those that are particularly useful in the silicone molded article of the present invention are fluorescent compounds that emit fluorescence near a wavelength of 400 nm, but are hardly recognizable with the naked eye under normal visible light. These fluorescent compounds are used as a main component of invisible ink and are used for identification with black light close to ultraviolet light.
- limiting in the shape of a fluorescent substance a needle shape or granular thing is preferable.
- the needle-shaped material preferably has an average diameter (D) of 0.1 to 20 ⁇ m, an average length (L) of 0.5 to 2000 ⁇ m, and an L / D of 3 to 2000.
- the granular material preferably has an average particle size of 0.1 to 100 ⁇ m.
- These phosphors may be used after being pulverized.
- the phosphor preferably has heat resistance that does not change at a temperature of 120 ° C. or higher. If it has a heat resistance of 120 ° C. or higher, it will not change during the heat curing of silicone. Further, it is preferable that the phosphor does not poison the Pt catalyst. When the Pt catalyst is poisoned, curing inhibition occurs when the silicone molded body is used for the silicone thin layer or the substrate.
- an organic fluorescent pigment or an inorganic fluorescent pigment is preferable.
- An example is an organic invisible phosphor manufactured by DayGlo, product number D034 (inorganic phosphor pigment), DINV series (organic phosphor pigment), and the like.
- Marking silicone which is another main component of the composition used for marking, is important for making the substrate and the silicone thin layer indivisible.
- the marking silicone is preferably compatible with the silicone that is the main component of the composition constituting the substrate.
- the marking silicone may be selected from silicones having a majority of organic groups as methyl groups. desirable.
- silicone containing a phenyl group is the main component of the composition constituting the substrate, the marking silicone should be the same silicone containing a phenyl group to ensure compatibility of both silicones. Is desirable. The most reliable method is to use the silicone used for the composition constituting the substrate also for the marking silicone.
- the marking silicone contains an alkenyl group. It is desirable to use silicone, and it is also desirable to use together an organohydrogensiloxane containing SiH groups. It is desirable that the amount of the organohydrogensiloxane used and the average number of SiH groups in one molecule be such that the silicone containing the marking alkenyl group can be cured by an addition reaction.
- the number of alkenyl groups in one molecule in the marking silicone is two, it is desirable that the number of SiH groups in one molecule of organohydrogensiloxane is three or more.
- the ratio of the number of SiH groups in one molecule of organohydrogensiloxane and the number of alkenyl groups in one molecule of marking silicone is preferably 0.5 to 5.0.
- the marking composition contains an addition reaction in addition to the alkenyl group-containing silicone and organohydrogensiloxane.
- a catalyst may be included.
- the catalyst for the addition reaction is generally a platinum catalyst. Examples thereof include platinum black, chloroplatinic acid, isopropanol solution of chloroplatinic acid, and platinum complexes having vinylsiloxanes as ligands.
- an addition reaction catalyst is included in the marking composition, it is easy to cause problems such as lowering the storage stability of the marking composition or making it difficult to maintain the surface properties of the substrate. Cost.
- the marking composition contains an addition reaction curing retarder.
- an addition reaction curing retarder As long as the performance of the silicone molded product of the present invention is not impaired, all compounds conventionally known to have an effect as a curing retarder can be used. Examples of such compounds include phosphorus-containing compounds such as triphenylphosphine, nitrogen-containing compounds such as tributylamine, tetramethylethylenediamine, and benzotriazole, sulfur-containing compounds, acetylenic compounds, compounds containing two or more alkenyl groups, hydro Examples include peroxy compounds and maleic acid derivatives.
- a compound containing an alkenyl group or an alkynyl group is preferable, particularly a compound containing two or more alkynyl groups in one molecule, a compound containing an alkenyl group and an alkynyl group in one molecule, and an alkenyl group and an alcohol in one molecule.
- a compound containing a reactive hydroxyl group, an organosilicon compound having a bond unit in which an alkenyl group is bonded to both of the silicon atoms adjacent via an oxygen atom, maleic acid diester, and the like are preferable.
- a filler In this marking composition, a filler, an adhesion-imparting agent, an antireflection additive and the like may be added as necessary.
- Silicone product manufacturers produce and sell various addition-cured products. Among them, there are two-part products with a mixing ratio of 1: 1, and some products do not contain fillers.
- One of the two-part products (assuming it is liquid A) contains alkenyl group-containing silicone and platinum catalyst, and the other (assuming it is liquid B) contains alkenyl group-containing silicone and organohydrogensiloxane. It is.
- the use of such product B solution as a silicone and effect related component in the marking composition is not the best, but is preferred as a suboptimal method.
- the curing retarder may be contained in the B liquid, but even if it is not contained, a readily available compound may be added as appropriate.
- the surface state of the silicone molded product of the present invention may become sticky or soft compared to the surface state of the substrate.
- the substrate is a gel-like or putty-like material
- tackiness can be suppressed by adding extra organohydrogensiloxane to the marking composition.
- it does not maintain the characteristics of the substrate surface, it can be said to be an example of the effect that can be realized by the silicone molded article of the present invention.
- the silicone molded body is preferably in an inseparable state between the base material and the phosphor-containing silicone thin layer.
- This integral inseparable state can be realized by various methods.
- the silicone in the composition constituting the substrate and the silicone in the composition constituting the phosphor-containing silicone thin layer are preferably compatible.
- the substrate surface including the phosphor silicone thin layer is covered with a protective film simultaneously or after application. It is also preferable to make it adhere.
- a protective film For example, polyethylene, a polypropylene, a polyethylene terephthalate, a polytetrafluoroethylene etc. can be illustrated. These films may be subjected to release treatment or the like on the surface.
- a more preferable method for creating an inseparable state is a method in which the base material is formed, the phosphor-containing silicone thin film is formed, and the protective film is adhered at the same time. This method not only improves the production efficiency, but also makes it possible to create an inseparable state between the substrate and the phosphor-containing thin layer with higher reliability.
- the base material is an uncured material such as putty
- a silicone molded body in which the base material and the phosphor-containing silicone thin film are inseparable can be obtained by these methods.
- the substrate and the phosphor-containing silicone thin layer are cured simultaneously when the substrate composition is curable. This is a very effective method for creating an inseparable state. At that time, it is more preferable to cure by heating.
- the base material is a material that is heat-cured by peroxide or addition reaction
- the phosphor-containing silicone composition contains an alkenyl group-containing silicone and an organohydrogensiloxane and does not contain an addition reaction catalyst.
- the method for applying the phosphor-containing silicone composition to the surface of the substrate or the protective film there is no particular limitation on the method for applying the phosphor-containing silicone composition to the surface of the substrate or the protective film, and spraying, screen printing, bar coater, ink jet printing, gravure printing, transfer method, and other conventionally known methods.
- An appropriate method can be selected. You may apply
- a molded body other than silicone can also be used for the substrate of the phosphor-containing identification object of the present invention.
- a substrate is not limited to a composition based on polymers, and wood, paper, metal, ceramics and the like can be used.
- the use of the phosphor-containing identification object of the present invention is not limited, but what is useful is the assembly industry related to electronics and automobiles, especially the field of silicone heat dissipation sheets.
- a silicone molded body in an industrial assembly process, a plurality of silicone heat-dissipating sheets having different characteristics, colors, thicknesses, sizes, and the like are often used as parts in the same place. Being able to easily identify without changing the original properties of the substrate in such a process is useful for preventing misunderstandings and the like.
- Luminescence of the phosphor was observed using a black light ES27BLB (ultraviolet peak wavelength 365 nm) manufactured by Sankyo Electric Co., Ltd.
- this measuring device for example, there is a laser diffraction / scattering particle distribution measuring device manufactured by HORIBA, Ltd.
- a thermally conductive silicone composition was prepared as follows. Made by Toray Dow Corning Co., Ltd., product number: CF5036A & B 1 kg each, 2.5 kg of alumina with an average particle diameter of 30 ⁇ m, 1.2 kg of alumina with an average particle diameter of 2 ⁇ m, and tetrasodium oxide with an average particle diameter of 0.17 ⁇ m After mixing 0.1 kg of iron (colorant) and degassing, A liquid and B liquid of the silicone heat conductive composition were obtained. The CF5036A solution contains a platinum catalyst, and the B solution contains a crosslinking agent containing SiH groups. (Reference Example 2) A thermally conductive silicone composition was prepared as follows.
- thermoly conductive silicone putty composition was prepared in the same manner as in Reference Example 1 except that CF5036A & B was changed to polydimethylsiloxane having both ends of viscosity of 0.5 Pa ⁇ s blocked with trimethylsiloxy groups.
- Example 1 The thermally conductive addition-curable silicone gel composition A and B prepared in Reference Example 1 were mixed at a weight ratio of 1: 1 and degassed under reduced pressure. On a polyethylene terephthalate (PET) film having a thickness of 0.3 mm, a metal frame having an inner size of 150 mm ⁇ 200 mm and a thickness of 0.5 mm was placed, and spread to a thickness of about 0.7 mm therein.
- PET polyethylene terephthalate
- a PET film coated with a phosphor-containing silicone composition is placed on a thermally conductive addition-curable silicone gel composition spread in a metal frame so that the coated surface is in contact with the curable thermally conductive composition, and 120 ° C. was pressed for 10 minutes and cured by heating to prepare a silicone molded article.
- FIG. 1A is an observation photograph of a phosphor-containing identification object made of a silicone molded article according to an embodiment of the present invention in general indoor illumination
- FIG. 1B is an observation photograph under black light irradiation.
- a pressure-sensitive adhesive tape obtained by coating a PET film with a silicone pressure-sensitive adhesive was placed on the surface of the phosphor-containing silicone thin film and pressure bonded.
- the cured thermally conductive silicone gel layer as the base material was cohesively broken. This confirmed that the phosphor-containing silicone thin film was inseparable from the substrate. Further, the surface characteristics (flexibility and adhesiveness) of the silicone molded body were not different from those of Comparative Example 1 below.
- Example 2 Comparative Example 1
- 0.2 g of organic invisible phosphor DINV-13 (average particle size 5 ⁇ m, organic non-ionogen oxazine derivative pigment, specific gravity 1.4) manufactured by DayGlo (Example 2)
- Silicone molding was conducted in the same manner as in Example 1 except that 0.2 g (Example 3) of an organic invisible phosphor DINV-18 (average particle size 5 ⁇ m, quinazolone pigment, specific gravity 1.02) manufactured by DayGlo was used.
- the body was made.
- the thickness of each silicone thin film layer was 3.5 ⁇ m.
- Table 1 summarizes the results of surface observation similar to that in Example 1.
- Comparative Example 1 in Table 1 is a silicone molded product obtained by curing only the heat conductive addition-curable silicone gel composition produced in the reference example to the same size.
- the results in Table 1 show that this silicone molded product can be easily identified by irradiation with black light, has excellent adhesion between the marking and the substrate, and the original properties of the substrate are impaired by the marking. It showed no.
- Example 4 5 g of the peroxide composition RC14A for extrusion molding manufactured by Toray Dow Corning Co., Ltd. was added to 500 g of the peroxide curable silicone thermal conductive composition prepared in Reference Example 2, and mixed and degassed with two rolls for peroxidation. A material-curable silicone substrate material was prepared. A phosphor-containing silicone composition was prepared in the same manner as in Example 1 except that 0.2 g of an inorganic invisible phosphor IPO-13 manufactured by DayGlo was used instead of D034, and coated on a PET film.
- the above-mentioned peroxide-curable silicone substrate material is placed on a PET film, and the coated surface of the phosphor-containing silicone composition-coated PET film is in contact with the peroxide-curable silicone substrate material. And a forming sheet having a thickness of about 1 mm with a constant speed roll.
- This molding sheet was heated in a 120 ° C. oven for 20 minutes to produce a silicone molded body.
- the PET film on the side coated with the phosphor-containing silicone of the silicone molded article was peeled off and the surface was observed.
- the surface property was the same as that of the silicone molded product obtained by curing only the heat conductive addition-curable silicone gel composition prepared in Reference Example 2. When irradiated with black light, the phosphor was observed to shine.
- a pressure-sensitive adhesive tape in which a silicone adhesive was coated on a PET film was placed on the surface of the phosphor-containing silicone thin film and pressure bonded. When this tape was peeled off, it was peeled between the pressure-sensitive adhesive surface of the pressure-sensitive adhesive tape and the surface of the molded body. When black light was irradiated on both peeled surfaces, the peeled molded sheet surface was shined, and the adhesive tape surface was hardly lit. When the surface of the molded body was scratched with a spatula, the cured silicone thermally conductive composition layer was destroyed.
- Example 5 A PET film coated with a phosphor-containing silicone composition produced by the same method as in Example 4 was prepared.
- the thermally conductive silicone putty composition prepared in Reference Example 3 is placed on a PET film, and the coated surface is covered with a phosphor-containing silicone composition-coated PET film so that the coated surface is in contact with the silicone putty material.
- the surface characteristics (flexibility and adhesiveness) of the silicone molded body were the same as the surface of the thermally conductive silicone putty molded by the same method without using the phosphor-containing silicone thin film.
- the phosphor-containing identification object of the present invention can be applied to resin, paper, metal, ceramics, fibers, and the like. Specifically, it can be applied as a product mark, an authenticity determination mark, or the like indicating the origin, manufacturing date, raw material, quality, etc. of various products.
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Abstract
Description
しかし、これは基材の表面特性を変えずにマーキングするという課題とは正反対のアプローチであった。
蛍光体の発光は、三共電気(株)製ブラックライトES27BLB(紫外線ピーク波長365nm)を使用して観察した。
<平均粒子径>
平均粒子径の測定はレーザー回折光散乱法により、50%粒子径を測定する。この測定器としては、例えば堀場製作所社製のレーザー回折/散乱式粒子分布測定装置がある。
次のようにして熱伝導性シリコーン組成物を調製した。付加反応によって硬化する東レダウコーニング社製、製品番号:CF5036A&Bの各1kgに平均粒子径30μmのアルミナ2.5kg、平均粒子径2μmのアルミナ1.2kg、および平均粒子径0.17μmの四三酸化鉄(着色剤)0.1kgを混合の後、脱泡することにより、シリコーン熱伝導性組成物のA液とB液を得た。なお、CF5036A液には白金触媒が含まれており、B液にはSiH基を含有する架橋剤が含まれている。
(参考例2)
次のようにして熱伝導性シリコーン組成物を調製した。過酸化物によって硬化する東レダウコーニング社製、製品番号:SH432ベース500gに平均粒子径2μmのアルミナ1000g、および、および平均粒子径0.17μmの四三酸化鉄(着色剤)5gをニーダーと2本ロールで混合・脱泡することにより、過酸化物硬化型シリコーン熱伝導性組成物を得た。
(参考例3)
CF5036A&Bを粘度が0.5Pa・sの両末端がトリメチルシロキシ基で封鎖されたポリジメチルシロキサンに変えたほかは参考例1と同様にして、熱伝導性シリコーンパテ組成物を調整した。
参考例1で作製した熱伝導性付加硬化型シリコーンゲル組成物A液とB液を重量比1:1で混合して減圧にして脱泡した。厚さ0.3mmのポリエチレンテレフタレート(PET)フィルム上に、内側サイズが150mm×200mmで厚さ0.5mmの金枠を乗せ、その中に約0.7mmの厚さに広げた。
実施例1におけるD034の代わりに、DayGlo社製有機系インビジブル蛍光体DINV-13(平均粒径5μm,有機非イオノゲンオキサジン誘導体顔料,比重1.4)を0.2g(実施例2)、および、DayGlo社製有機系インビジブル蛍光体DINV-18(平均粒径5μm,キナゾロン顔料,比重1.02)を0.2g(実施例3)を使用した他は、実施例1と同様にしてシリコーン成形体を作製した。シリコーン薄膜層の厚さはいずれも3.5μmであった。
参考例2で作製した過酸化物硬化型シリコーン熱伝導性組成物500gに、東レダウコーニング社製押し出し成型用過酸化物組成物RC14Aを5g加えて2本ロールで混合・脱泡して過酸化物硬化型シリコーン基材用材料を調製した。
D034の代わりに、DayGlo社製無機系インビジブル蛍光体IPO-13を0.2gを使用したほかは実施例1と同じ方法で蛍光体含有シリコーン組成物を調製し、PETフィルムにコートした。上述の過酸化物硬化型シリコーン基材用材料をPETフィルム上に置き、その上を、この蛍光体含有シリコーン組成物コートPETフィルムで塗布面が過酸化物硬化型シリコーン基材用材料と接するようにカバーし、等速ロールで厚さ約1mmの成形用シートにした。この成形用シートを120℃オーブンで20分間加熱してシリコーン成形体を作製した。
シリコーン成形体の蛍光体含有シリコーンをコートした側のPETフィルムを剥がして表面を観察した。表面の性状は、参考例2で作製した熱伝導性付加硬化型シリコーンゲル組成物だけを硬化させたシリコーン成形体と同様であった。ブラックライトで照射すると、蛍光体が光って観察された。室内光では蛍光体の存在はわずかに観察されたが発光はせず、表面は黒灰色のままであった。
蛍光体含有シリコーン薄膜の表面に、PET性フィルムにシリコーン粘着剤をコーティングした感圧接着テープを乗せて圧着した。このテープを剥がしたところ、粘着テープの粘着面と成形体表面の間で剥離した。剥離した両面にブラックライトを照射すると、剥離した成形シート表面が光り、粘着テープ面はほとんど光らなかった。ヘラで成形体表面を引っ掻いたところ、硬化したシリコーン熱伝導性組成物層が破壊した。これらのことから蛍光体含有シリコーン薄膜は基材と一体不可分であることが確認できた。
これらの結果は、過酸化物で硬化したシリコーン成形体でもブラックライトの照射で容易に識別を行うことができ、マーキングと基材との接着性に優れ、しかも、マーキングによって基材本来の特性が損なわれることがないことを示していた。
実施例4と同じ方法で作製した蛍光体含有シリコーン組成物をコートしたPETフィルムを用意した。参考例3で作製した熱伝導性シリコーンパテ組成物をPETフィルム上に置き、その上を、蛍光体含有シリコーン組成物コートPETフィルムで塗布面がシリコーンパテ材料と接するようにカバーし、等速ロールで厚さ約0.3mmの成形用シートにした。成形用シートは室温で2時間放置することによってパテ状成形体を作製した。
蛍光体含有シリコーン組成物コートPETフィルムを剥がし、PET表面とパテ状成形体表面にブラックライトを照射したところ、パテ状成形体表面だけが光り、蛍光体含有シリコーン薄膜はパテ状成形体表面に付着していることが確認できた。蛍光体含有シリコーン薄膜が付着した成形体表面に、実施例1で使用したのと同じ感圧接着テープを乗せて圧着した。このテープを剥がしたところ、熱伝導性シリコーンパテ層が凝集破壊した。これらのことから、蛍光体含有シリコーン薄膜は基材と一体不可分であることが確認できた。またシリコーン成形体の表面特性(柔軟性と粘着性)は、蛍光体含有シリコーン薄膜を使わずに同じ方法で成形した熱伝導性シリコーンパテの表面と同じであった。
これらの結果は、硬化していないパテ状のシリコーン成形体でもブラックライトの照射で容易に識別を行うことができ、マーキングと基材との接着性に優れ、しかも、マーキングによって基材本来の特性が損なわれることがないことを示していた。
Claims (15)
- 基材の表面全体もしくは一部が、蛍光体含有シリコーン薄層で覆われ、
前記蛍光体は、可視光線の照射では発光せず、紫外線又はブラックライトの照射で発光することにより識別性を有することを特徴とする蛍光体含有識別物体。 - 前記基材の主たるポリマー成分はシリコーンであり、基材とシリコーン薄層が一体不可分の状態である請求項1に記載の蛍光体含有識別物体。
- 前記基材は硬化物である請求項1又は2に記載の蛍光体含有識別物体。
- 前記基材の主たるポリマー成分であるシリコーンと、蛍光体含有シリコーン薄層を形成するシリコーン組成物中のシリコーンが相溶している請求項2又は3に記載の蛍光体含有識別物体。
- 前記蛍光体含有シリコーン薄層を形成するシリコーン組成物は、それ自体では硬化性能を有さないが、基材と接触することで硬化している請求項2~4のいずれかに記載の蛍光体含有識別物体。
- 前記基材は熱伝導性シリコーン組成物である請求項1~5のいずれかに記載の蛍光体含有識別物体。
- 前記蛍光体含有シリコーン薄層の厚さは0.1~20μmである請求項1~6のいずれかに記載の蛍光体含有識別物体。
- 前記基材はパテ状である請求項1又は2に記載の蛍光体含有識別物体。
- 前記蛍光体は針状又は粒状である請求項1~8のいずれかに記載の蛍光体含有識別物体。
- 請求項1~9のいずれかに記載の蛍光体含有識別物体の製造方法であって、
基材を成形した後、もしくは成形と同時に蛍光体含有薄層形成用シリコーン組成物を接触させ、しかる後に加熱することを特徴とする蛍光体含有識別物体の製造方法。 - 前記蛍光体含有シリコーン薄層を形成するシリコーン組成物は、
(A)アルケニル基を1分子中に2個以上有するシリコーンポリマー、
(B)SiH基を(A)成分を硬化させるに十分な数有するオルガノハイドロジェンシロキサン、
(C)蛍光体を主成分とし、
前記(A)成分と前記(B)成分の反応の触媒となる化合物を含有しない請求項10に記載の蛍光体含有識別物体の製造方法。 - 前記蛍光体含有シリコーン薄層を形成するシリコーン組成物は、さらに(D)成分として、アルケニル基とSiH基の付加反応を遅延する化合物を含む請求項11に記載の蛍光体含有識別物体の製造方法。
- 前記基材はヒドロシリル化反応で硬化、又は過酸化物によって硬化されている請求項10~12のいずれかに記載の蛍光体含有識別物体の製造方法。
- 前記蛍光体含有薄層が形成される面が離型フィルムで覆われている請求項10~13のいずれかに記載の蛍光体含有識別物体の製造方法。
- 離型フィルム全体もしくは一部に蛍光体含有薄層形成用シリコーン組成物を塗布し、塗布面を基材と接触させて前記蛍光体含有薄層形成用シリコーン組成物を基材表面に転写する請求項10~14のいずれかに記載の蛍光体含有識別物体の製造方法。
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CN201580001096.6A CN105431894B (zh) | 2014-05-09 | 2015-03-18 | 含荧光体的识别物体及其制造方法 |
US14/903,219 US10017000B2 (en) | 2014-05-09 | 2015-03-18 | Phosphor-containing identification substance and method for producing the same |
JP2015543172A JP6077670B2 (ja) | 2014-05-09 | 2015-03-18 | 蛍光体含有識別物体及びその製造方法 |
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JP (1) | JP6077670B2 (ja) |
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CN114854395B (zh) * | 2021-02-03 | 2024-05-31 | 中国科学院化学研究所 | 发光可控的荧光材料及其制备方法与应用 |
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CN105431894A (zh) | 2016-03-23 |
JPWO2015170514A1 (ja) | 2017-04-20 |
US10017000B2 (en) | 2018-07-10 |
JP6077670B2 (ja) | 2017-02-08 |
CN105431894B (zh) | 2018-03-09 |
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