WO2015151755A1 - 脆性材料基板の分断方法 - Google Patents

脆性材料基板の分断方法 Download PDF

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Publication number
WO2015151755A1
WO2015151755A1 PCT/JP2015/057316 JP2015057316W WO2015151755A1 WO 2015151755 A1 WO2015151755 A1 WO 2015151755A1 JP 2015057316 W JP2015057316 W JP 2015057316W WO 2015151755 A1 WO2015151755 A1 WO 2015151755A1
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WO
WIPO (PCT)
Prior art keywords
material substrate
brittle material
line
forming
scribe line
Prior art date
Application number
PCT/JP2015/057316
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
曽山　浩
Original Assignee
三星ダイヤモンド工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三星ダイヤモンド工業株式会社 filed Critical 三星ダイヤモンド工業株式会社
Priority to US15/127,052 priority Critical patent/US10927031B2/en
Priority to EP18205159.9A priority patent/EP3517269A1/en
Priority to EP15772939.3A priority patent/EP3127673B1/en
Priority to JP2016511500A priority patent/JP6249091B2/ja
Priority to CN201580017504.7A priority patent/CN106232311B/zh
Priority to KR1020167026885A priority patent/KR101847921B1/ko
Publication of WO2015151755A1 publication Critical patent/WO2015151755A1/ja
Priority to US16/799,706 priority patent/US20200189957A1/en

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring

Definitions

  • the present invention relates to a method for dividing a brittle material substrate.
  • a crack line that has progressed in a line shape on the surface of the substrate (hereinafter referred to as a crack line) is formed by a scribing device. .
  • Patent Document 1 a dent on the upper surface of a glass plate is a chip of glass generated during scribing, and this is called a scribe line.
  • a scribe line a dent on the upper surface of a glass plate is a chip of glass generated during scribing.
  • cracks extending in the downward direction from the scribe line are generated simultaneously with the engraving of the scribe line. That is, a crack line is formed simultaneously with the formation of the scribe line.
  • the substrate When the crack has completely progressed in the thickness direction, the substrate can be divided along the crack line only by forming the crack line.
  • stress application called a break process is performed after the formation of the crack line.
  • the substrate is divided by causing the cracks in the crack line to advance completely in the thickness direction by the break process. If this crack line is not formed, the substrate cannot be divided along the scribe line even if stress is applied in the break process. Therefore, in order to divide the glass plate with certainty, it has been necessary to reliably form a crack line.
  • a crack line requires a crack as a starting point (hereinafter referred to as a starting point crack).
  • the starting crack can be easily formed by riding the blade edge onto the edge of the substrate. This is because local destruction is likely to occur at the edge of the substrate. The edge of the blade that has been slid further slides on the surface of the glass substrate, so that the crack line can be extended from the starting crack.
  • the operation of the blade edge riding on the edge of the substrate may cause a large damage to the blade edge or a large chipping of the edge of the substrate. Therefore, there are many cases where it is desired to avoid such an operation completely or to suppress the frequency thereof.
  • the scribing apparatus includes a scribing body having a cutter and a vibration generating member that applies vibration to the cutter.
  • the cutter is positioned immediately above the scribe start point by moving the scribe body relative to the work surface while being separated from the work.
  • the tip of the cutter is brought into contact with the scribe start point by the weight of the scribe body.
  • a starting crack is formed at the scribe start point away from the edge on the work surface.
  • a scribe line is formed triggered by the starting crack.
  • the crack line was inclined and formed in the thickness direction of a glass plate by the wave
  • the starting crack is formed by applying an impact to the scribing body.
  • it is necessary to apply a large impact force to the cutter. For this reason, great damage is applied to the cutting edge of the cutter, and fine breakage also occurs on the substrate surface at the scribe start point.
  • the present invention has been made in order to solve the above-described problems.
  • the purpose of the present invention is to generate a crack line along the scribe line after the scribe line is formed. It is to provide a method for dividing a brittle material substrate that can suppress damage to the substrate.
  • the method for dividing a brittle material substrate of the present invention includes the following steps.
  • a brittle material substrate having a surface surrounded by an edge including first and second sides facing each other and having a thickness direction perpendicular to the surface is prepared.
  • the blade edge is pressed against the surface of the brittle material substrate.
  • the cutting edge has a projection and a side portion extending from the projection and having a convex shape. The blade edge is pressed so that the protrusion of the blade edge is disposed between the first side and the side and the side of the blade edge is disposed between the protrusion and the second side on the surface of the brittle material substrate. Done.
  • the crack line is formed by extending a crack of the brittle material substrate in the thickness direction from the second position toward the first position along the scribe line.
  • the brittle material substrate is divided along the crack line.
  • the crack line can be formed along the scribe line. Since it is not necessary to generate a crack line at the same time as scribing, it becomes easy to select the cutting edge and scribing conditions, and it is possible to increase the scribing speed. In addition, the quality of the brittle material end face after division is stable and improved because it is not easily affected by irregularities on the surface of the substrate or mounting table. Furthermore, since damage to the blade edge and the substrate surface can be suppressed, it is possible to extend the life of the blade edge and improve the strength of the substrate after dividing.
  • a glass substrate is used as the brittle material substrate.
  • the brittle material substrate include a ceramic substrate made of low-temperature fired ceramics or high-temperature fired ceramics, a silicon substrate, a compound semiconductor substrate, a sapphire substrate, or a quartz substrate.
  • a cutting instrument 50 is used in the method for dividing a glass substrate in the present embodiment.
  • the cutting instrument 50 has a cutting edge 51 and a shank 52.
  • the blade edge 51 is held by a shank 52 as its holder.
  • the cutting edge 51 is provided with a top surface SD1 (first surface) and a plurality of surfaces surrounding the top surface SD1.
  • the plurality of surfaces include a side surface SD2 (second surface) and a side surface SD3 (third surface).
  • the top surface SD1, the side surfaces SD2, and SD3 (first to third surfaces) face different directions and are adjacent to each other.
  • the blade edge 51 has a vertex at which the top surface SD1, the side surfaces SD2 and SD3 merge, and the protrusion PP of the blade edge 51 is configured by this vertex.
  • the side surfaces SD2 and SD3 form ridge lines constituting the side portion PS of the blade edge 51.
  • the side part PS extends linearly from the protrusion part PP.
  • the side part PS is a ridgeline as mentioned above, it has the convex shape extended linearly.
  • the cutting edge 51 is preferably a diamond point. That is, the cutting edge 51 is preferably made of diamond from the viewpoint that the hardness and the surface roughness can be reduced. More preferably, the cutting edge 51 is made of single crystal diamond. More preferably, crystallographically, the top surface SD1 is a ⁇ 001 ⁇ plane, and each of the side surfaces SD2 and SD3 is a ⁇ 111 ⁇ plane. In this case, although the side surfaces SD2 and SD3 have different orientations, they are crystal surfaces that are equivalent to each other in terms of crystallography.
  • Diamond that is not a single crystal may be used.
  • polycrystalline diamond synthesized by a CVD (Chemical Vapor Deposition) method may be used.
  • sintered diamond obtained by bonding polycrystalline diamond particles, which are sintered from fine graphite or non-graphitic carbon without containing a binder such as an iron group element, with a binder such as an iron group element is used. May be.
  • the shank 52 extends along the axial direction AX.
  • the blade edge 51 is preferably attached to the shank 52 so that the normal direction of the top surface SD1 is approximately along the axial direction AX.
  • the protrusions PP and the side portions PS of the blade edge 51 are formed on the surface SF of the glass substrate 4 with a thickness that the glass substrate 4 has. It is pushed in the direction DT.
  • the blade edge 51 is slid on the surface approximately along the direction in which the side portion PS is projected onto the surface SF.
  • a groove-like scribe line without a vertical crack is formed on the surface SF.
  • the groove-like scribe line can be generated by at least one of plastic deformation and scraping of the glass substrate 4, but is preferably formed by plastic deformation so that fine glass fragments are not generated by scraping.
  • the crack line CL is a crack extending in the thickness direction DT from the dent of the scribe line SL, and extends linearly on the surface SF. According to the method described later, after only the scribe line SL is formed, the crack line CL can be formed along the scribe line SL.
  • the method for dividing glass substrate 4 mainly includes steps S10 to S50. The details will be described below.
  • glass substrate 4 is first prepared in step S10 (FIG. 3).
  • the glass substrate 4 has a flat surface SF surrounded by edges including a side ED1 (first side) and a side ED2 (second side) facing each other.
  • the glass substrate has a thickness direction DT (FIGS. 1A, 2A and 2B) perpendicular to the surface SF.
  • the edges are rectangular. Therefore, the sides ED1 and ED2 are sides parallel to each other. In the example shown in FIG. 4, the sides ED1 and ED2 are rectangular short sides.
  • step S20 the blade edge 51 is pressed against the surface SF of the glass substrate 4 at the position N1. Details of the position N1 will be described later. 1A, referring to FIG. 1A, the protrusion PP of the blade 51 is disposed between the side ED1 and the side PS on the surface SF of the glass substrate 4, and the side PS of the blade 51 is the protrusion PP. And the side ED2.
  • a plurality of scribe lines SL are formed on the surface SF of the glass substrate 4.
  • the scribe line SL is formed between the position N1 (first position) and the position N3.
  • a position N2 (second position) is located between the positions N1 and N2. Therefore, the scribe line SL is formed between the positions N1 and N2 and between the positions N2 and N3.
  • the positions N1, N2 and N3 are away from the edge of the surface SF of the glass substrate 4. Therefore, the formed scribe line SL is separated from the edge of the glass substrate 4.
  • the position N1 is close to the side ED1 out of the sides ED1 and ED2.
  • the position N2 is close to the side ED2 out of the sides ED1 and ED2.
  • the scribe line SL is formed by scratches caused by sliding the blade edge 51 pressed against the surface SF of the glass substrate 4 on the surface SF.
  • the blade edge 51 is displaced from the position N1 to the position N2, and is further displaced from the position N2 to the position N3. That is, referring to FIG. 1A, the blade edge 51 is displaced in a direction DA that is a direction from the side ED1 toward the side ED2.
  • the direction DA corresponds to the direction in which the axis AX extending from the blade edge 51 is projected onto the surface SF. In this case, the blade edge 51 is dragged on the surface SF by the shank 52.
  • step S ⁇ b> 40 thickness from position N ⁇ b> 2 to position N ⁇ b> 1 along scribe line SL (see the broken line arrow in the figure)
  • the crack line CL is formed by extending the crack of the glass substrate 4 in the direction DT (FIG. 2B). Formation of the crack line CL is started when the assist line AL and the scribe line SL intersect each other at the position N2.
  • the assist line AL is formed after the scribe line SL is formed.
  • the assist line AL is a kind of crack line (FIG. 2B), and is formed by a crack in the glass substrate 4 in the thickness direction DT.
  • the method of forming the assist line AL is not particularly limited, but may be formed using the edge of the surface SF as a base point as shown in FIG. In this case, an operation in which the blade edge 51 rides on the edge of the surface SF of the glass substrate 4 is required for the purpose of forming the assist line AL.
  • the number of assist lines AL is typically one, and the number of scribe lines SL. The effect due to this operation is small.
  • the crack line CL is less likely to be formed in the direction from the position N2 to the position N3 than in the direction from the position N2 to the position N1. That is, the ease of extension of the crack line CL has a direction dependency. Therefore, the phenomenon that the crack line CL is formed between the positions N1 and N2 but not between the positions N2 and N3 may occur.
  • the present embodiment is intended to divide the glass substrate 4 along the positions N1 and N2, and is not intended to separate the glass substrate 4 along the positions N2 and N3. Therefore, while it is necessary to form the crack line CL between the positions N1 and N2, the difficulty of forming the crack line CL between the positions N2 and N3 is not a problem.
  • step S50 the glass substrate 4 is divided along the crack line CL. Specifically, a break process is performed. Note that, when the crack line CL is completely advanced in the thickness direction DT at the time of formation, the formation of the crack line CL and the division of the glass substrate 4 may occur at the same time. In this case, the break process can be omitted.
  • the glass substrate 4 is divided.
  • the first modification relates to a case where the intersection of assist line AL and scribe line SL is insufficient as a trigger for starting formation of crack line CL (FIG. 5).
  • the glass substrate 4 is separated along the assist line AL by applying stress to the glass substrate 4. Thereby, formation of the crack line CL is started.
  • the assist line AL is formed on the surface SF of the glass substrate 4, but the assist line AL for separating the glass substrate 4 is on the back surface (the surface opposite to the surface SF) of the glass substrate 4. It may be formed.
  • the assist line AL and the scribe line SL intersect each other at the position N2 on the planar layout, but do not directly contact each other.
  • the blade edge 51 is pressed against the surface SF of the glass substrate 4 at the position N3 in step S20 (FIG. 3).
  • step S30 (FIG. 3) when the scribe line SL is formed, in the present modification, the blade edge 51 is displaced from the position N3 to the position N2, and is further displaced from the position N2 to the position N1. That is, referring to FIG. 1A, the blade edge 51 is displaced in a direction DB that is a direction from the side ED2 toward the side ED1.
  • the direction DB corresponds to the direction opposite to the direction in which the axis AX extending from the blade edge 51 is projected onto the surface SF. In this case, the blade edge 51 is pushed forward on the surface SF by the shank 52.
  • step S30 when scribe line SL is formed in step S30 (FIG. 3), cutting edge 51 is positioned on surface SF of glass substrate 4 as compared to position N1. Pressed with greater force at N2. Specifically, the load on the blade edge 51 is increased when the position N4 is set to a position between the positions N1 and N2 and the formation of the scribe line SL reaches the position N4. In other words, the load on the scribe line SL is increased between the positions N4 and N3, which are the end portions of the scribe line SL, as compared with the position N1. Thereby, formation of the crack line CL from the position N2 can be easily induced while reducing a load at a portion other than the terminal portion.
  • assist line AL is formed before formation of scribe line SL in the present embodiment.
  • the assist line AL is formed in the same manner as in FIG. 5 (Embodiment 1).
  • scribe line SL is formed in step S30 (FIG. 3).
  • the method for forming the scribe line SL is the same as that in FIG. 4 (Embodiment 1).
  • the assist line AL and the scribe line SL intersect each other at the position N2.
  • the assist line AL is formed on the surface SF of the glass substrate 4, but the assist line AL for separating the glass substrate 4 is on the back surface (the surface opposite to the surface SF) of the glass substrate 4. May be formed.
  • the assist line AL and the scribe line SL intersect each other at the position N2 on the planar layout, but do not directly contact each other.
  • the configuration other than the above is substantially the same as the configuration of the first embodiment described above.
  • crack line CL is started when assist line AL and scribe line SL intersect each other at position N2.
  • scribe line SL is formed from position N3 to position N1, as in FIG. 8 (Embodiment 1).
  • glass substrate 4 is separated along assist line AL by applying stress to glass substrate 4. Thereby, formation of the crack line CL is started (see the broken line arrow in the figure).
  • step S30 when scribe line SL is formed in step S30 (FIG. 3), cutting edge 51 is positioned on surface SF of glass substrate 4 as compared to position N1. Pressed with greater force at N2. Specifically, the load on the blade edge 51 is increased when the position N4 is set to a position between the positions N1 and N2 and the formation of the scribe line SL reaches the position N4. In other words, the load on the scribe line SL is increased between the positions N4 and N3, which are the end portions of the scribe line SL, as compared with the position N1. Thereby, formation of the crack line CL from the position N2 can be easily induced while reducing a load at a portion other than the terminal portion.
  • step S30 Referring to FIG. 17, in the present embodiment, in step S30 (FIG. 3), scribe line SL is formed as follows.
  • the blade edge 51 is slid beyond the edge ED2 from the position N1.
  • the stress distortion generated inside the substrate immediately below the scribe line is released, and the crack line extends from the end of the scribe line SL located on the side ED2 toward the position N1 (FIG. 3: Step S40).
  • the load applied to the cutting edge 51 when forming the scribe line SL may be constant, but when the cutting edge 51 is displaced from the position N1 to the position N2, the load applied to the cutting edge 51 at the position N2 increases. May be. For example, the load is increased by about 50%.
  • the cutting edge 51 to which the increased load is applied is slid over the side ED2. In other words, the load on the cutting edge 51 is increased at the end of the scribe line SL.
  • the crack line extends from the end of the scribe line SL located on the side ED2 toward the position N1 via the position N2 (FIG. 3: step S40).
  • the stress distortion also increases, and the stress distortion is easily released when the cutting edge 51 passes the side ED2, so that the crack line can be formed more reliably. .
  • the configuration other than the above is substantially the same as the configuration of the first embodiment described above.
  • step S30 Referring to FIG. 18, in the present embodiment, in step S30 (FIG. 3), scribe line SL is formed from position N1 to position ED2 via position N2.
  • step S40 stress is applied between position N2 and side ED2. This induces formation of a crack line along the scribe line SL (FIG. 3: step S40).
  • the pressed blade edge 51 is slid between the position N2 and the side ED2 on the surface SF (a region between the broken line and the side ED2 in the drawing). This sliding is performed until the side ED2 is reached.
  • the cutting edge 51 is preferably slid so as to cross the track of the scribe line SL formed first, and more preferably to overlap the track of the scribe line SL formed first.
  • the length of this second sliding is, for example, about 0.5 mm.
  • this re-sliding may be performed on each of the plurality of scribe lines SL (FIG. 18), or a process of forming one scribe line SL and re-sliding may be performed. It may be performed sequentially for each scribe line SL.
  • the configuration other than the above is substantially the same as the configuration of the first embodiment described above.
  • step S30 Referring to FIG. 20, in the present embodiment, in step S30 (FIG. 3), the blade edge 51 is moved away from the edge of the surface SF by moving the blade edge 51 from the position N1 to the position N2 and further to the position N3. A scribe line SL is formed. The method of forming the scribe line SL is almost the same as that in FIG. 4 (Embodiment 1).
  • the blade edge 51 may be displaced from the position N3 to the position N2 and from the position N2 to the position N1.
  • the configuration other than the above is substantially the same as the configuration of the first embodiment described above.
  • a blade edge 51v may be used instead of the blade edge 51 (FIGS. 1A and 1B).
  • the blade edge 51v has a conical shape having a vertex and a conical surface SC.
  • the protruding part PPv of the blade edge 51v is constituted by a vertex.
  • the side portion PSv of the blade edge is configured along a virtual line (broken line in FIG. 23B) extending from the apex to the conical surface SC. Thereby, the side part PSv has a convex shape extending linearly.
  • the first and second sides of the edge of the glass substrate are rectangular short sides, but the first and second sides may be long rectangular sides.
  • the shape of the edge is not limited to a rectangle, and may be a square, for example. Further, the first and second sides are not limited to being linear, and may be curved. In each of the above embodiments, the surface of the glass substrate is flat, but the surface may be curved.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
PCT/JP2015/057316 2014-03-31 2015-03-12 脆性材料基板の分断方法 WO2015151755A1 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
US15/127,052 US10927031B2 (en) 2014-03-31 2015-03-12 Method for dividing brittle-material substrate
EP18205159.9A EP3517269A1 (en) 2014-03-31 2015-03-12 Method for cutting brittle-material substrate
EP15772939.3A EP3127673B1 (en) 2014-03-31 2015-03-12 Method for cutting brittle-material substrate
JP2016511500A JP6249091B2 (ja) 2014-03-31 2015-03-12 脆性材料基板の分断方法
CN201580017504.7A CN106232311B (zh) 2014-03-31 2015-03-12 脆性材料基板的分断方法
KR1020167026885A KR101847921B1 (ko) 2014-03-31 2015-03-12 취성 재료 기판의 분단 방법
US16/799,706 US20200189957A1 (en) 2014-03-31 2020-02-24 Method for dividing brittle-material substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-074089 2014-03-31
JP2014074089 2014-03-31

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US15/127,052 A-371-Of-International US10927031B2 (en) 2014-03-31 2015-03-12 Method for dividing brittle-material substrate
US16/799,706 Division US20200189957A1 (en) 2014-03-31 2020-02-24 Method for dividing brittle-material substrate

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WO2015151755A1 true WO2015151755A1 (ja) 2015-10-08

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US (2) US10927031B2 (zh)
EP (2) EP3517269A1 (zh)
JP (5) JP6249091B2 (zh)
KR (1) KR101847921B1 (zh)
CN (2) CN106232311B (zh)
TW (2) TWI680106B (zh)
WO (1) WO2015151755A1 (zh)

Cited By (8)

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JP2016221822A (ja) * 2015-05-29 2016-12-28 三星ダイヤモンド工業株式会社 脆性材料基板における垂直クラックの形成方法および脆性材料基板の分断方法
WO2017026191A1 (ja) * 2015-08-07 2017-02-16 三星ダイヤモンド工業株式会社 脆性基板の分断方法
WO2017145937A1 (ja) * 2016-02-26 2017-08-31 三星ダイヤモンド工業株式会社 脆性基板の分断方法
JP2018015989A (ja) * 2016-07-28 2018-02-01 三星ダイヤモンド工業株式会社 脆性基板の分断方法
KR20180136528A (ko) 2016-05-25 2018-12-24 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 기판의 분단 방법
KR20190011681A (ko) 2017-07-25 2019-02-07 미쓰보시 다이야몬도 고교 가부시키가이샤 다이아몬드 날끝 및 기판 분단 방법
KR20190124697A (ko) * 2017-03-13 2019-11-05 니폰 덴키 가라스 가부시키가이샤 유리판의 제조 방법
JP2022056887A (ja) * 2020-09-30 2022-04-11 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法

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Publication number Priority date Publication date Assignee Title
KR101847921B1 (ko) 2014-03-31 2018-04-11 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 분단 방법
CN111116029A (zh) * 2014-05-30 2020-05-08 三星钻石工业股份有限公司 脆性基板的裂缝线形成方法及脆性基板
JP6682907B2 (ja) * 2016-02-26 2020-04-15 三星ダイヤモンド工業株式会社 脆性基板の分断方法
CN106542727B (zh) * 2016-10-10 2019-03-05 华南理工大学 一种微磨削尖端精准诱导的曲面镜面脆裂成型方法
US11701739B2 (en) * 2019-04-12 2023-07-18 Skyworks Solutions, Inc. Method of optimizing laser cutting of wafers for producing integrated circuit dies

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