WO2014192456A1 - 樹脂モールド装置および樹脂モールド方法 - Google Patents

樹脂モールド装置および樹脂モールド方法 Download PDF

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Publication number
WO2014192456A1
WO2014192456A1 PCT/JP2014/061014 JP2014061014W WO2014192456A1 WO 2014192456 A1 WO2014192456 A1 WO 2014192456A1 JP 2014061014 W JP2014061014 W JP 2014061014W WO 2014192456 A1 WO2014192456 A1 WO 2014192456A1
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WIPO (PCT)
Prior art keywords
mold
resin
lower mold
film
clamper
Prior art date
Application number
PCT/JP2014/061014
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
雅彦 藤沢
中沢　英明
吉和 村松
Original Assignee
アピックヤマダ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2013113222A external-priority patent/JP2014231185A/ja
Priority claimed from JP2013115783A external-priority patent/JP2014233882A/ja
Priority claimed from JP2013139424A external-priority patent/JP6180206B2/ja
Application filed by アピックヤマダ株式会社 filed Critical アピックヤマダ株式会社
Priority to CN201480029820.1A priority Critical patent/CN105283294B/zh
Priority to KR1020157036843A priority patent/KR102203781B1/ko
Priority to SG11201508166RA priority patent/SG11201508166RA/en
Publication of WO2014192456A1 publication Critical patent/WO2014192456A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention relates to a technology that is effective when applied to a resin molding apparatus and a resin molding method.
  • a large-sized work for example, one in which a plurality of chip components mounted on a substrate is electrically connected to the substrate through a bonding wire
  • the upper mold is formed using a mold that constitutes a cavity recess (which becomes a cavity when clamping a workpiece).
  • the resin placed on the center of the work flows outward, so a molded article due to a void due to air entrapment or a wire sweep etc.
  • the release film is deformed according to the shape of the cavity recess outside the molding die, and the release film is supplied in a state where the resin is supplied to the preform portion (bottom) corresponding to the bottom of the cavity recess. And the technique of carrying in and arrange
  • a film having a certain degree of flexibility, stretchability and heat resistance is used for the release film as described in Patent Document 1.
  • a release film when heated at a certain temperature, causes heat shrinkage so as to shrink toward its center or heat shrinkage so as to form non-uniform wrinkles. Further, when the release film is deformed, for example, in accordance with the shape of the cavity recess, it can be said that the release film has a considerable amount of stored distortion.
  • the release film when the release film is placed in a preheated mold while being deformed, for example, in the shape of a cavity recess, the shape of the release film may be maintained in a desired shape. Can not.
  • the release film may be wrinkled, or the wrinkles may overlap to form a gap. When the release film is wrinkled or overlapped in this manner, problems occur such as transfer to the appearance of the molded product or leakage of resin from the overlapped portion.
  • An object of the present invention is to provide a technology capable of improving the quality of molded articles.
  • the resin mold apparatus is a resin mold apparatus that mold-closes an upper mold and a lower mold in which a cavity recess is formed, and resin-molds a work with the resin filled in the cavity recess.
  • the lower mold includes a lower mold cavity piece constituting a bottom portion of the cavity concave portion, a lower mold clamper constituting a side portion of the cavity concave portion, and a loader capable of holding and transporting a film on which the resin is mounted.
  • a suction unit for suctioning the film disposed (also referred to as a set) so as to cover the end face of the lower mold cavity piece and the end face of the lower mold clamper, wherein the lower mold cavity piece is the lower mold clamper
  • the loader is configured such that the end face of the lower mold cavity piece and the end face of the lower mold clamper are horizontal (both flush and at the same height).
  • the film is placed on the lower mold held in the lower mold so that the resin is positioned on the lower mold cavity piece, and the suction unit sucks the film following the inner surface of the cavity recess. And holding and supplying the resin to the cavity recess.
  • a resin mold apparatus is a resin mold apparatus that mold-closes a first mold and a second mold in which a cavity recess is formed, and resin-molds a work with the resin filled in the cavity recess.
  • the second mold includes a cavity piece that constitutes a bottom of the cavity recess, a clamper that constitutes a side of the cavity recess, and a movable part that moves the cavity piece relative to the clamper.
  • an adsorbing portion for adsorbing a film disposed so as to cover an end face of the cavity piece and an end face of the clamper, and conveying the film in a flat state, and also an end face of the cavity piece and an end face of the clamper Of the cavity piece while keeping the film flat while positioning it at an equivalent height (also referred to as horizontal or even).
  • the resin molding method uses a resin molding apparatus to mold-close the upper mold and the lower mold in which the cavity recess is formed, and resin-mold the work with the resin filled in the cavity recess.
  • the lower mold includes a lower mold cavity piece that constitutes the bottom of the cavity recess, a lower mold clamper that constitutes the side of the cavity recess, and a film on which the resin is mounted.
  • a suction portion for suctioning the film disposed so as to cover the end face of the lower mold cavity piece and the end face of the lower mold clamper, and (a) the end face of the lower mold cavity piece And the film so that the resin is positioned on the lower mold cavity piece by the loader in the lower mold in which the lower mold clamper and the end face of the lower mold clamper are horizontally held.
  • the film in a flat state and then deform the film following the shape of the cavity recess, for example, to prevent the occurrence of wrinkles in the film or to prevent the films from overlapping. can do. Therefore, it is possible to improve the quality of the molded product by preventing the appearance defect of the molded product from being formed or preventing the resin leakage from the overlapping portion.
  • a cavity recess in the lower mold, for example, by immersing a chip component (for example, a semiconductor chip, a chip capacitor) or a bonding wire in a resin melted in the cavity recess, molding by void or wire sweep etc. Defective products can be reduced.
  • the loader includes a holding surface for holding the film, and a recess that is recessed from the holding surface to release the resin mounted on the film. It is preferable to provide a hand portion having an air passage communicating with the holding surface around the recess and sucking the film.
  • the film can be held by suction so that the film is not bent by the weight of the resin in the concave portion mounted on the film.
  • the loader includes a rolled shutter portion capable of opening and closing the holding surface, and the film is supported by the shutter portion in a closed state of the shutter portion. It is preferable to convey and arrange the film in the lower mold in the open state of the shutter unit.
  • the film can be held flat by the shutter portion so that the film is not bent by the weight of the resin in the concave portion mounted on the film.
  • the shutter portion can be rolled up to save space.
  • the said loader is provided with a heating part and a cooling part.
  • the upper part of the lower mold cavity piece is provided so as to be separable, and the upper part of the lower mold clamper is provided so as to be separable.
  • the upper end of the lower mold cavity piece and the lower end of the lower mold cavity piece are connected such that the upper end of the lower mold cavity piece and the upper end face of the lower mold clamper are horizontal. It is preferable to convey the film arranged to cover the upper end face of the mold clamper.
  • the lower plate includes ring-shaped upper and lower plates, and the lower plate has a stepped portion which is recessed at a peripheral edge end from a surface on the upper plate side and extends in a circumferential direction Forming the film plate portion by interposing the film between the upper plate and the lower plate, the inner plate portion of the upper plate corresponding to the stepped portion of the lower plate, and the upper plate being fitted;
  • the lower clamper is formed with a stepped portion which is recessed from the end face at the peripheral edge end and extends in the circumferential direction, and the inner diameter portion of the lower plate corresponds to the stepped portion of the lower clamper. It is preferable to fit.
  • the film can be held flat with a simple configuration, and can be disposed in the lower mold as it is.
  • the upper end face of the lower mold cavity piece and the end face of the lower mold clamper in the state where the upper part of the lower mold cavity piece is provided separably and opened is provided separably and opened. It is preferable that the upper part of the lower mold cavity piece is floatingly supported so as to be horizontal.
  • the transport unit it is not necessary to push down the lower mold clamper by the transport unit to make the end surface of the lower mold cavity piece and the end surface of the lower clamper horizontal, and the operation and configuration of the transport unit can be simplified.
  • the upper part of the lower mold cavity piece is in a floating state, so the heat shrinkage of the film can be prevented, and the resin mounted on the film is prevented from overheating. It becomes easy to perform heating adjustment.
  • the lower clamper includes a plurality of pins floatingly supported so as to project from an end face of the lower clamper.
  • the plurality of pins preferably protrude from an end face of the lower clamper to support the workpiece, and in a state in which the workpiece is clamped, the plurality of pins are preferably accommodated in the lower clamper.
  • FIG. 5 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 4;
  • FIG. 6 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 5;
  • FIG. 7 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG.
  • FIG. 6 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 7;
  • FIG. 9 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 8; It is a typical sectional view of a press part in a resin mold process in a 2nd embodiment of the present invention.
  • FIG. 11 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 10;
  • FIG. 12 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 11;
  • FIG. 13 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 12;
  • FIG. 11 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 10;
  • FIG. 12 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 11;
  • FIG. 13 is a schematic
  • FIG. 14 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 13; It is a schematic cross section of the press part in the resin mold process in 3rd Embodiment of this invention.
  • FIG. 16 is a schematic cross-sectional view of a press portion in the resin molding process continued from FIG. 15;
  • FIG. 17 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 16;
  • FIG. 18 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 17;
  • FIG. 19 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG.
  • FIG. 21 is an exploded cross-sectional view of a film plate portion shown in FIG. 20.
  • FIG. 21 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 20;
  • FIG. 23 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 22;
  • FIG. 24 is a schematic cross-sectional view of the press portion in the resin molding process continued from FIG. 23; It is a schematic cross section of the press part in the resin mold process in 5th Embodiment of this invention.
  • FIG. 26 is a schematic cross-sectional view of the press portion in the resin molding process continued from FIG.
  • FIG. 25 It is typical sectional drawing of the press part in the resin mold process in 6th Embodiment of this invention. It is a schematic cross section of the press part in the resin mold process in the other structural example of this invention.
  • FIG. 29 is a schematic cross-sectional view of the press portion in the resin molding process continued from FIG. 28; It is a schematic cross section of the press part in the resin mold process in the other structural example of this invention.
  • FIG. 31 is a schematic cross-sectional view of a press portion in a resin molding process continued from FIG. 30;
  • FIG. 32 is a schematic cross-sectional view of the press portion in the resin molding process continued from FIG. 31; It is a typical sectional view of the press part in the resin mold process in a 7th embodiment of the present invention.
  • FIG. 36 is a schematic cross-sectional view of the press portion in the resin molding process continued from FIG. 35; It is front explanatory drawing of the type
  • FIG. 38 is a plan view of the movable platen of FIG. 37.
  • 39A and 39B are cross-sectional explanatory views of the molding die during the mold closing operation continued from FIG. 40A to 40C are cross-sectional explanatory views showing an example of a mold and a mold closing operation.
  • 41A to 41C are cross-sectional explanatory views showing another example of the mold and the mold closing operation.
  • the number of components is limited to the specific number unless explicitly stated or the principle is clearly limited to a specific number. It may be more or less than a specific number.
  • shape such as components, it is to be understood that substantially similar or similar to the shapes etc. is included unless specifically stated otherwise and when it is considered that it is not clearly apparent in principle. .
  • FIG. 1 is an overall configuration diagram showing the resin molding apparatus 100 in a planar layout.
  • the resin molding apparatus 100 includes not only a configuration for resin molding but also a configuration for heat curing (post curing) and storing a non-defective item after inspecting a work (molded product) after resin molding. It has become.
  • the resin mold apparatus 100 includes a work supply unit 110, a resin supply unit 120, a press unit 130, a work inspection unit / cooling unit 140, a cure unit 150 (cure furnace), and a work storage unit 160 as processing units that perform various processing steps. Is equipped. Moreover, the resin mold apparatus 100 is provided with the control part 170 which controls each processing process. As each processing part, at least one should just be comprised, and the case where the resin supply part 120 and the press part 130 are each comprised by two machines (plurality) is shown by this embodiment. As described above, the operation rate of the entire resin mold apparatus 100 can be improved by configuring a plurality of processing units that require longer processing time than other processing units.
  • the resin mold apparatus 100 includes a robot mechanism unit 180 provided with a transfer robot for transferring a work or resin between the processing units.
  • the transfer robot is, for example, a robot that can rotate and linearly move between the processing units, and has a hand at an end of an articulated joint.
  • each processing unit is disposed so as to surround the robot mechanism unit 180 (transport robot). For this reason, the movement distance of the work or resin between the processing units (the movement of the work or resin is indicated by a broken line in FIG. 1) is shortened, and the work can be efficiently transported.
  • a workpiece or resin may be transported between the processing units by a transport mechanism other than a transport robot configured by a linear motion mechanism such as an air cylinder or a linear motor.
  • the workpiece supply unit 110 (see FIG. 1) is a processing unit for supplying a workpiece to the press unit 130 where resin molding is performed.
  • the work supply unit 110 includes a magazine (not shown) capable of storing a plurality of works (formed products) before forming. The work supplied from this magazine is temporarily placed on a work placement unit (not shown) provided to the robot mechanism unit 180 by the transfer robot of the robot mechanism unit 180, and the loader 190 (transfer unit provided to the press unit 130 ) To the press unit 130.
  • the resin supply unit 120 (see FIG. 1) is a processing unit for supplying the resin to the press unit 130 where resin molding is performed.
  • the resin supply unit 120 will be described with reference to FIG.
  • FIG. 2 is a diagram for explaining the operation of the resin supply unit 120 for supplying the granular type resin R (hereinafter referred to as granular resin).
  • the resin supply unit 120 supplies the granular resin R to the resin storage portion 121 capable of storing granular resin R, a plurality of small resin storage portions 122, and the resin supply region (supply target). And a plurality of troughs 123.
  • the resin storage part 122 and the trough 123 which make a pair are in communication, and are provided movably by an XY drive mechanism (not shown).
  • the resin storage portion 121 can be fixedly provided to store a large amount of granular resin R, and can supply the granular resin R by dividing into smaller resin storage portions 122 than this. Then, the granular resin R is sent out from the resin storage portion 122 to the trough 123 by an electromagnetic feeder (not shown), and dropped into a resin supply region in a predetermined shape (for example, a flat shape).
  • At least a pair of resin reservoir 122 and trough 123 may be provided, but by providing a plurality of pairs (three pairs in FIG. 2), it is possible to shorten the dropping time of granular resin R to the resin supply region. it can.
  • the three pairs of resin reservoirs 122 and troughs 123 are connected by a connecting member 124.
  • a connecting member 124 By this connection, even if an electromagnetic feeder is not provided in each pair, it is possible to simultaneously supply the same amount of resin to the resin supply region so as to have a desired shape by one electromagnetic feeder.
  • a plurality of dispensers for supplying liquid resin may be provided. Also in this case, the correct quantity of liquid resin can be quickly supplied.
  • the supply target of the resin supply unit 120 is the release film F.
  • the release film F for example, a film having a certain degree of flexibility, elasticity, heat resistance, such as FEP film, PET film, fluorine-impregnated glass cloth, polyvinylidene chloride, PTFE, ETFE, etc. is used.
  • the release film F to be supplied with the resin is pulled out by the one gripping member 126 on the support base 125 from the rolled state, and is gripped by the gripping members 126 and 126 at the predetermined width. It is cut by a cutting member 127 (e.g., a cutter) into a film width corresponding to the number of times of molding, to be in a predetermined shape (e.g., a strip shape).
  • a cutting member 127 e.g., a cutter
  • the resin supply to the release film F is performed by supplying granular resin R while moving each trough 123 in the extending direction (X direction) of the supply area in the first row, After the resin supply to the shape supply region is completed, it moves in the second row direction (Y direction). Next, granular resin R is supplied while each trough 123 moves in the extending direction (X direction) of the supply region in the second row, and after resin supply for one row is completed, the third row direction (Y direction) Move to). Next, granular resin R is supplied while each trough 123 moves in the extending direction (X direction) of the supply region in the third row, and resin supply for one row is completed, and resin to the entire resin supply region Supply ends.
  • the granular resin R can be supplied (mounted) on the release film F with a predetermined area (area) and a predetermined thickness (height) for a predetermined time. Then, the granular resin R supplied onto the release film F is transported to the loader 190 by the robot mechanical unit 180 together with the release film F, and is then carried into the inside of the press unit 130 by the loader 190. For this reason, the release film F is also a carrier film for transporting the resin R.
  • the press unit 130 (see FIG. 1) is a processing unit for performing resin molding on a work to form a mold resin unit (molding unit). This processing step will be described in detail later.
  • the workpiece after molding is temporarily placed on a workpiece placement unit (not shown) provided in the robot mechanical unit 180 by the loader 190, and passed to the transfer robot of the robot mechanical unit 180.
  • the workpiece inspection unit / cooling unit 140 (see FIG. 1) is a processing unit for inspecting the state of the workpiece (molded product) after molding, and is a processing unit for cooling the workpiece being heated. .
  • the cooling unit can be provided separately from the workpiece inspection unit, but the arrangement can be made compact by arranging the cooling unit in a vacant area of the workpiece inspection unit.
  • the inspection items of the workpiece inspection unit include, for example, thickness measurement of the workpiece and appearance inspection of the workpiece. These inspection results are transmitted to the control unit 170 and processed. For example, molded articles are collectively or divided and imaged, and it is inspected by appearance observation whether there is any molding defect such as unfilled. If there is a molding failure or failure, the type of failure or the captured image is stored in the storage unit of the control unit 170 as operation information. By stopping the operation of the entire apparatus and performing maintenance when an abnormality (such as an unfilled state more than expected) is detected, it is possible to prevent continuous production of defective products. When the inspection is completed, the workpiece is transported to the curing unit 150 by the transport robot from the workpiece delivery position of the workpiece inspection unit / cooling unit 140.
  • an abnormality such as an unfilled state more than expected
  • the curing unit 150 (see FIG. 1) is a processing unit for heat curing (post curing) the mold resin portion of the workpiece.
  • the curing unit 150 is closed to the outside by an open / close door (not shown), and the inside is heated to a predetermined temperature.
  • the open / close door is opened, and when the work is disposed inside and the transfer robot retracts, the open / close door is closed and heat curing is performed for a predetermined time. Thereafter, the work carried out of the curing unit 150 by the transfer robot is cooled by the work inspection unit / cooling unit 140 and then conveyed to the work storage unit 160.
  • the workpiece storage unit 160 (see FIG. 1) is a processing unit for storing a workpiece as a final process of the resin molding apparatus 100.
  • the workpiece storage unit 160 includes a magazine similar to the workpiece supply unit 110, and a workpiece (molded product) is stored in the magazine by the transport robot of the robot mechanism unit 180.
  • FIG. 3 is a schematic cross-sectional view of the press unit 130 in the present embodiment.
  • FIG. 3 also shows the workpiece W in the state of the article to be molded.
  • a chip component 11 for example, a semiconductor chip
  • a substrate 10 for example, a wiring substrate
  • the press unit 130 includes a mold 30 (a pair of upper mold 31 and lower mold 32).
  • the lower mold 32 is a movable mold and the upper mold 31 is a fixed mold, but the upper mold 31 is a movable mold, the lower mold 32 is a fixed mold, or the upper mold 31 and the lower mold 32 are movable. If you want to
  • the work W is held by the upper mold 31, and the lower mold 32 is provided with a cavity recess 33 (which constitutes the cavity C at the time of work clamping).
  • the mold 30 includes a lower mold cavity piece 34 constituting the bottom of the cavity recess 33 and a lower mold clamper 35 surrounding the lower mold cavity piece 34 and constituting the side (wall) of the cavity recess 33.
  • the depth (height) of the cavity recess 33 changes and the volume of the cavity C changes.
  • the upper mold 31 includes an upper mold base 36, an upper mold insert 37, and an upper clamper 40.
  • An upper mold insert 37 having a heater (not shown) and configured to be able to heat the work W is fixed and assembled on the lower surface of the upper mold base 36, and the upper mold clamper 40 is assembled movably in the vertical direction There is.
  • the upper clamper 40 is formed of a single plate-shaped die, and a through hole 41 is formed in the upper die.
  • the upper mold insert 37 is inserted into the through hole 41 of the upper clamper 40 and disposed. That is, the upper mold insert 37 is surrounded by the upper clamper 40.
  • the upper mold clamper 40 is vertically movably assembled to the upper mold base 36 via an elastic member 42 (for example, a spring) constituting a movable portion, and is suspended and supported (floating support). Therefore, with respect to the upper mold base 36, the relationship between the fixed upper mold insert 37 and the movable upper mold clamper 40 is such that the upper mold insert 37 is relative to the upper mold clamper 40 by the expansion and contraction of the elastic member 42. Will move to
  • the lower surface (lower end surface) of the upper mold insert 37 is the upper mold clamper 40. Is located higher (upper position) than the lower surface (lower end surface) of In other words, the lower surface of the upper clamper 40 is at a lower position (lower position) than the lower surface (lower end surface) of the upper mold insert 37.
  • the upper mold insert 37 so as to be movable relative to the upper mold clamper 40, the work W can be clamped at a uniform height position regardless of the thickness of the work W.
  • the upper die 31 includes a seal member 43 (for example, an O-ring) provided between the outer peripheral surface of the upper die insert 37 and the inner peripheral surface of the through hole 41 of the upper die clamper 40.
  • a seal member 43 for example, an O-ring
  • a gap between the outer peripheral surface of the upper mold insert 37 and the inner peripheral surface of the through hole 41 of the upper mold clamper 40 is an air path in order to reduce the pressure in the cavity C formed during workpiece clamping. It is sealed to be 41A (see FIG. 7).
  • the upper mold clamper 40 is formed with an air passage 44 communicating from the inner peripheral surface of the through hole 41 to the outside of the mold so as to communicate with the air passage 41A.
  • the air passage 44 is in communication with a pressure reducing portion 45 (for example, a pump) outside the mold.
  • a pressure reducing portion 45 for example, a pump
  • the upper mold 31 is provided with a workpiece holding unit that holds the workpiece W (see FIG. 27).
  • the work holding portion is provided with an air passage 90 communicating with the end face of the upper mold insert 37, and a pressure reducing portion 91 communicating with the air path 90 brings the back surface of the substrate 10 of the work W into alignment with the lower surface of the upper mold insert 37.
  • the work W is held by suction.
  • the workpiece holding portion may hold the workpiece W by a claw portion provided on the end face of the upper mold insert 37 or an electrostatic chuck.
  • the configuration of the lower mold 32 will be specifically described.
  • the lower mold 32 which is a movable mold, is manufactured by a known mold clamping mechanism that raises and lowers the lower mold movable platen via a drive transmission mechanism (a link mechanism such as a toggle link or a screw shaft) driven by a drive source (electric motor). Opening and closing is to be performed.
  • a drive transmission mechanism a link mechanism such as a toggle link or a screw shaft
  • a drive source electric motor
  • the lower mold 32 includes a lower mold base 46, a lower mold cavity piece 34, and a lower clamper 35.
  • a lower mold cavity piece 34 is fixedly mounted on the upper surface of the lower mold base 46, and a lower mold clamper 35 is mounted movably in the vertical direction.
  • the lower clamper 35 is composed of a single plate-like mold, and a through hole 47 is formed in this.
  • the lower mold cavity piece 34 is inserted into the through hole 47 of the lower clamper 35 and disposed. That is, the lower mold cavity piece 34 is surrounded by the lower mold clamper 35.
  • the lower mold cavity piece 34 is configured to be able to heat the resin R as described later by providing a heater (not shown).
  • the lower clamper 35 is vertically movably assembled to the lower mold base 46 via an elastic member 50 (e.g., a spring) constituting a movable portion, and is floatingly supported. Therefore, the relationship between the lower mold cavity piece 34 fixed relative to the lower mold base 46 and the movable lower mold clamper 35 is such that the lower mold cavity piece 34 is relative to the lower mold clamper 35 by the expansion and contraction of the elastic member 50. Will move in a
  • the upper surface (upper end surface) of the lower mold cavity piece 34 is the lower mold clamper 35.
  • the lower mold 32 is provided with a seal member 51 (for example, an O-ring) provided between the outer peripheral surface of the lower mold cavity piece 34 and the inner peripheral surface of the through hole 47 of the lower mold clamper 35.
  • the seal member 51 is disposed between the outer peripheral surface of the lower mold cavity piece 34 and the inner peripheral surface of the through hole 47 of the lower clamper 35 in order to suck the release film F disposed on the parting surface of the lower mold 32. Is sealed so as to form an air passage 47A (see FIG. 5).
  • the upper surface of the lower mold cavity piece 34 and the inner peripheral surface of the through hole 47 of the lower clamper 35 constitute the cavity recess 33, so the air passage 47 A communicates with the bottom of the cavity recess 33 and the corner between the side It will be done.
  • the lower mold clamper 35 is formed with an air passage 52 communicating from the inner peripheral surface of the through hole 47 to the outside of the mold so as to communicate with the air passage 47A.
  • the air passage 52 is in communication with a suction unit 53 (for example, a pump) outside the mold.
  • a suction unit 53 for example, a pump
  • an air passage 54 is formed which leads from the upper surface of the lower clamper 35 to the outside of the mold.
  • the air passage 54 is in communication with a suction unit 55 (for example, a pump) outside the mold.
  • a suction unit 55 for example, a pump
  • a loader 190 having a work loader 56 capable of transporting the work W to the upper die 31 and a film loader 57 capable of transporting the resin R and the release film F to the lower die 32 adjacent to each press portion 130 (see FIG. 1) provided.
  • the work loader 56 and the film loader 57 are configured to be able to deliver the work W and the release film F from the robot mechanical unit 180 to the inside of the press unit 130, and are driven by different systems by a drive mechanism not shown. It is possible to carry out the work W and the release film F to 130.
  • the film loader 57 may be configured to receive the resin R and the release film F from the robot mechanical unit 180 in the loader 190, or the robot mechanical unit 180 may convey the resin R and the release film F to the resin supply unit 120. It may be supplied.
  • the work loader 56 includes a support plate 60, a support portion 61, and a positioning portion 62.
  • the size of the flat area of the support plate 60 is larger than, for example, the flat area of the through hole 41 of the upper clamper 40.
  • a support portion 61 in a ring shape in plan view is provided at a predetermined height.
  • a plurality of positioning portions 62 are provided at a predetermined height on the upper surface of the support plate 60 and outside the support portion 61.
  • the support portion 61 is provided along the inner side of the outer edge of the substrate 10 of the workpiece W so that the planar region is as similar as possible to the planar region of the substrate 10. Further, the support portion 61 is provided such that the height thereof is higher than the height of a member mounted on the substrate 10 of the workpiece W (for example, the thickness of the chip part 11 and the height of the bonding wire). Thus, the workpiece W is supported by the support portion 61 on the outer surface of the substrate 10 so that the support plate 60 does not contact (interfere with) the chip component 11 and the bonding wire (not shown).
  • the positioning portion 62 is configured to be able to position the work loader 56 with respect to the upper mold insert 37 by coming into contact with the inner peripheral surface of the through hole 41 of the upper mold clamper 40. It is provided in each corner of the through hole 41 having a rectangular shape in plan view. Further, the positioning portion 62 is provided such that its height is in contact with the inner peripheral surface of the through hole 41 before the workpiece W is transferred to the upper mold insert 37. Thereby, the workpiece W is positioned by the positioning portion 62 so as to be disposed in a predetermined area of the lower surface of the upper mold insert 37.
  • the work loader 56 transfers the work W to the upper mold 31 by bringing the back surface of the substrate 10 of the work W into contact with the lower surface of the upper mold insert 37. At this time, the substrate 10 is pressed against the lower surface of the upper mold insert 37 by the support portion 61, and the substrate 10 (work W) is held by the holding portion of the upper mold 31.
  • the film loader 57 is provided with a hand portion 63 for adsorbing and holding the release film F on which the resin R is mounted.
  • the hand portion 63 has a holding surface 64 (suction surface) for holding the release film F, an air passage 65 communicating with the holding surface 64, and a recess 66 recessed from the holding surface 64.
  • the holding surface 64 has a size (size of the flat area of the hand portion 63) which can be adsorbed along the outer periphery of the flat area of the strip-like release film F, for example.
  • a plurality of concave portions 66 are formed in the hand portion 63 so as to be arranged in a matrix of, for example, n rows and m columns (at least one of n and m is 2 or more) in the area of the holding surface 64.
  • the air passage 65 is formed in the hand portion 63 so as to communicate with the outside of the hand portion 63 from the holding surface 64 (for example, the outer peripheral portion of the holding surface 64 and the holding surface 64 between the concave portions 66) without interference with the concave portions 66. ing.
  • An air passage 65 leading to the holding surface 64 is provided around the recesses 66 (between the recesses 66).
  • the air passage 65 is in communication with a suction portion 67 (for example, a pump) outside the hand portion 63.
  • the release film F loaded with the resin R can be held while being tensioned at the outer periphery as necessary by attracting and absorbing the resin R, and the weight of the resin R causes the release film F to bend. It can be adsorbed and held flat so that it does not occur.
  • the flat state of the release film F means that the release film F is not bent or distorted, and is flat to the extent that there is no problem in transporting the resin R or setting it in the molding die 30. It does not have to be a perfect plane.
  • the release film F is suctioned from the air passage 65 around the recess 66 while securing the release of the resin R mounted on the release film F in the recess 66.
  • the resin R and the release film F are delivered to the lower mold 32 in a state where the release film F is held flat on the holding surface 64 (in a state without deformation).
  • the state (shape, amount) of the resin R mounted on the release film F can be maintained.
  • the resin R is mounted not in the entire surface of the release film F but in a plurality of areas (corresponding to a plurality of recesses 66).
  • FIGS. 3 to 9 are schematic cross-sectional views of the press unit 130 during the resin molding process in the present embodiment.
  • the resin mold apparatus 100 in the present embodiment includes a release film F disposed on the parting surface of the lower mold 32.
  • a release film F disposed on the parting surface of the lower mold 32.
  • resin leakage from the gap between the lower mold cavity piece 34 and the lower mold clamper 35 can be prevented.
  • resin clogging between the lower mold cavity piece 34 and the lower mold clamper 35 can be prevented, and relative movement of the lower mold cavity piece 34 with respect to the lower mold clamper 35 can be secured.
  • depending on the strength of the release film F and the weight of the resin R it is possible to suck and hold only the outer periphery of the release film F.
  • the workpiece W is carried in by the work loader 56 from the outside of the mold.
  • the film loader 57 carries in the resin R and the release film F.
  • the resin R is mounted (supplied) on the roll-shaped release film F, and the release film F is cut into a predetermined shape (for example, a strip shape) (see FIG. 2).
  • the release film F is sucked by the suction unit 67 and sucked by the holding surface 64 and carried in a flat state.
  • the suction operation of the suction unit 67 or the like is indicated by an arrow (see FIG. 3 and the like).
  • the work loader 56 is raised, and the work W is delivered to the upper die 31.
  • the positioning portion 62 is brought into contact with the inner peripheral surface of the through hole 41 of the upper clamper 40 by the lifting of the work loader 56
  • the back surface of the substrate 10 is brought into contact with the lower surface of the upper insert 37.
  • the substrate 10 (work W) is held on the lower surface of the upper mold insert 37 by the work holding portion (not shown).
  • the work W is delivered from the work loader 56 to the upper mold 31.
  • the film loader 57 is lowered to deliver the release film F having the resin R mounted on the lower mold 32 to start melting of the resin R.
  • the holding surface 64 is brought into contact with the upper surface of the lower clamper 35 via the release film F by lowering the film loader 57, and then the elastic member 50 is compressed (the movable portion is moved). . That is, the lower clamper 35 is pushed down by lowering the film loader 57.
  • the film loader 57 is lowered until the upper surface (upper end surface) of the lower mold cavity piece 34 and the upper surface (upper end surface) of the lower mold clamper 35 become horizontal.
  • the release film F may be delivered to the lower mold 32 by the operation of raising the lower mold 32.
  • the resin R on the release film F is heated by the inside of the lower mold cavity piece 34 to start melting.
  • the film loader 57 holds the flat release film F at the holding surface 64. That is, in the lower mold 32 in which the upper surface (upper end surface) of the lower mold cavity piece 34 and the upper surface (upper end surface) of the lower mold clamper 35 are horizontally held, the resin R is transferred by the film loader 57 to the lower mold cavity piece 34. Position the flat release film F so that it is positioned above.
  • the release film F may be flat when it is disposed (supplied) to the lower mold 32. In this case, as shown in FIG.
  • the film loader 57 when the holding surface 64 of the film loader 57 is shaped or sized to be pressed against the cavity recess 33 through the release film F, the film loader 57 is an end face of the cavity piece 34. It is possible to supply the release film F to the lower mold 32 in the horizontal state simply by performing the pressing operation until it abuts on the lower mold 32 and it is possible to easily supply it without causing the wrinkles and the like.
  • the release film in a flat state is disposed to cover the upper surface of the lower mold cavity piece 34 and the upper surface of the lower mold clamper 35.
  • F is adsorbed and held by the adsorption units 53 and 55.
  • the resin R and the release film F are delivered from the film loader 57 to the lower mold 32.
  • the suction units 53 and 55 may be separate systems or may be the same system.
  • the work loader 56 is lowered as shown in FIG. Thereby, the work loader 56 is separated from the work W. Then, the work W is held only by the upper mold 31.
  • the film loader 57 is lifted to extend the elastic member 50 (movable portion Move). Then, the lower mold cavity piece 34 is moved relative to the lower mold clamper 35 by the elastic member 50 to form the cavity recess 33. At this time, the outer peripheral portion of the release film F is adsorbed by the adsorption portion 55, and the portion corresponding to the corner portion of the cavity recess 33 of the release film F is adsorbed by the adsorption portion 53. While the release film F is deformed. As a result, the release film F follows the inner surface of the cavity recess 33 and is held by suction.
  • the release film F is adsorbed and held while following the inner surface of the cavity recess 33, and the resin R is supplied to the cavity recess 33 as it is. Since the resin R is disposed on the lower mold cavity piece 34 via the release film F by the film loader 57, the lower mold cavity piece 34 moves relative to the lower mold clamper 35 to form the cavity recess 33. Even if this is done, the resin R is supplied to the cavity recess 33 while maintaining the state as it is. Therefore, the shape of the resin R does not collapse, and the resin R can be supplied to the bottom of the cavity recess 33 without changing the position. As described above, supplying the resin R to the cavity recess 33 in a desired state works to reduce the quality defects of the molded product due to the void and the wire sweep.
  • the movable lower die 32 is raised to close the mold 30 (clamping). Specifically, the lower mold 32 is raised to a position where the release film F is clamped by the lower clamper 35 and the upper clamper 40. Thereby, the inside of the mold 30 including the cavity recess 33 is airtight. At this time, by driving the decompression unit 45, the inside of the mold 30 including the cavity recess 33 is decompressed (deaerated) through the air passage 41A and the air passage 44. By depressurizing the inside of the mold 30, the air mixed in the molten resin R in the subsequent resin mold is removed, and the generation of voids in the molded product can be prevented.
  • the movable lower die 32 is further raised to bring the upper surface of the lower clamper 35 into contact with the outer peripheral portion of the substrate 10 via the release film F.
  • the elastic member 42 is weaker than the elastic member 50, the elastic member 42 is compressed via the upper clamper 40 by the elevation of the lower die 32 (lower clamper 35).
  • the work W is clamped by the upper mold insert 37 (upper mold 31) and the lower mold clamper 35 (lower mold 32), and the surface of the substrate 10 and the lower surface of the upper mold clamper 40 become horizontal.
  • the work W can be clamped at a uniform height position regardless of the thickness of the work W.
  • the movable lower die 32 is further raised to immerse the chip part 11 in the resin R melted at the mold temperature, and then the cavity C (cavity recess 33) is filled.
  • the molten resin R thus obtained is heat-cured to resin-mold the workpiece W.
  • the elastic member 50 is compressed by the rise of the lower mold 32 (lower mold base 46).
  • the workpiece W (molded product) is held by the upper mold 31 by the workpiece holding unit, and the release film F is held open by the lower mold 32 by the suction units 53 and 55. At this time, by using the release film F, the work W can be easily released. Then, as described above, the workpiece W is stored in the workpiece storage unit 160 through the inspection unit / cooling unit 140 and the curing unit 150.
  • the release film F can be deformed following the shape of the cavity recess 33 after the release film F is disposed in a flat state.
  • the release film F is not supplied to the mold 30 in a wrinkled or overlapped state. Therefore, the transfer of the release film F to the appearance of the molded product due to wrinkles or the like can be prevented, or the resin leakage from the overlapping portion can be prevented, and the quality of the molded product can be improved.
  • the resin R supplied to the entire surface of the cavity recess 33 and melted is, for example, immersing the chip component 11 and the bonding wire (not shown), the resin R
  • the resin R By minimizing the flow of the resin, it is possible to reduce the quality defects of the molded articles such as voids and wire sweeps.
  • the work loader 56 arranges (sets) the work W together with the jig (the lower portion of the upper mold insert 37) in the upper mold 31, and the film loader 57 serves as a heating unit and cooling
  • the unit and the shutter unit are provided.
  • this difference will be mainly described with reference to FIGS. 10 to 14.
  • 10 to 14 are schematic cross-sectional views of the press unit 130 in the present embodiment.
  • the work loader 56 (supporting portion only at the outer surface of the substrate 10)
  • the substrate 10 is bent by its own weight, making it difficult to hold the substrate in the mold, or causing problems such as dropping during transport. Therefore, in the present embodiment, a plate-like jig 37A (member) is placed against the back surface of the large-sized substrate 10 to prevent the occurrence of bending, and the work W is transported by the work loader 56 together with the jig 37A.
  • the jig 37A is made of, for example, the same material (stainless steel) as the upper mold insert 37. For this reason, the jig 37A can be regarded as one in which the lower portion of the upper mold insert 37 is provided in a detachable manner.
  • the film loader 57 is provided with a plurality of recesses 66 as in the first embodiment, the region of the outer periphery of the recesses 66 (the air passage 65 communicating with the holding surface 64 is provided).
  • the resin R can not be mounted on the release film F.
  • the shutter part 70 which can hold
  • the film loader 57 in the present embodiment will be specifically described.
  • the film loader 57 includes a roll-shaped shutter unit 70 capable of opening and closing the holding surface 64.
  • the shutter portion 70 is wound up and retracted from the holding surface 64 in a state (open state) in which the holding surface 64 is opened by a driving unit (not shown), and in a state (closed state) in which the holding surface 64 is closed. It is delivered to the holding surface 64. Therefore, the film loader 57 can support and convey the release film F by the shutter unit 70 in the closed state of the shutter unit 70, and can arrange the release film F on the lower mold 32 in the open state of the shutter unit 70.
  • the shutter unit 70 is made of, for example, a thin sheet metal or a resin material capable of being wound up. Further, the material of the shutter portion 70 is preferably one having a material or a shape with low frictional resistance to the release film F. Thereby, the release film F can be wound without distortion.
  • the shutter 70 preferably has a core 71 such as a support bar extending in a direction perpendicular to the winding direction, in order to keep the release film F flat.
  • the release film F is held flat by the shutter unit 70 so that the weight of the resin R in the recess 66 mounted on the release film F does not bend ( Support).
  • the shutter portion 70 can be rolled up to save space.
  • the shutter unit 70 does not necessarily have to be configured to be able to be wound up, and can hold the release film F (that is, the resin R) even if it is configured to be able to open and close a plate-like member.
  • the film loader 57 includes a cooling unit 72 and a heating unit 73. According to this, it becomes easy to assist heating or cool the release film F and the resin R mounted thereon.
  • the heating portion in the shutter portion 70 the release film F can be preheated so that the release film F can be made to conform more reliably to the shape of the cavity recess 33.
  • a heating unit provided in the shutter unit 70 can be obtained.
  • the workpiece W is carried in together with the jig 37A by the work loader 56 from the outside of the mold.
  • the film loader 57 carries in the resin R and the release film F.
  • the cooling section 72 is turned on (or off) and the heating section 73 is turned off to release the release film F or resin. It is also possible to prevent R from being heated.
  • the resin R loaded on the release film F is held in the mold 30 by the shutter unit 70 in the closed state.
  • the release film F is sucked by the suction unit 67 and sucked by the holding surface 64 and carried in a flat state.
  • the work loader 56 is raised, and the work W is delivered to the upper die 31 together with the jig 37A.
  • the positioning portion 62 is made to abut on the inner peripheral surface of the through hole 41 of the upper clamper 40 by raising the work loader 56
  • the jig 37A holding the workpiece W is inserted into the upper mold insert 37. Abut the lower surface of the Next, the workpiece W and the jig 37A are held on the lower surface of the upper mold insert 37 by the workpiece holding portion (not shown).
  • the work W is delivered from the work loader 56 to the upper mold 31.
  • the film loader 57 is lowered. Specifically, first, the holding surface 64 is abutted against the upper surface of the lower clamper 35 via the release film F and the shutter portion 70 by lowering the film loader 57, and then the elastic member 50 is compressed (movable portion Move). That is, the lower clamper 35 is pushed down by lowering the film loader 57. Next, the film loader 57 is lowered until the upper surface of the lower mold cavity piece 34 and the upper surface of the lower clamper 35 become horizontal. When the cooling unit 72 is in the on state, it is preferable that the cooling unit 72 be in the off state in the process illustrated in FIG. 11 so as not to lower the temperature of the mold 30.
  • the work loader 56 is lowered. Thereby, the work loader 56 is separated from the work W. Then, the workpiece W is held by the upper die 31.
  • a release film F in which the resin R is mounted on the lower mold 32 is delivered. Specifically, first, the lower portion of the resin R is formed by the film loader 57 in the lower mold 32 in which the shutter portion 70 is wound up and the upper surface of the lower mold cavity piece 34 and the upper surface of the lower clamper 35 are held horizontally. A flat release film F is disposed to be positioned on the cavity piece 34. Next, the release film F in a flat state is adsorbed and held on the parting surface of the lower mold 32 in which the upper surface of the lower mold cavity piece 34 and the upper surface of the lower clamper 35 are horizontal by the suction portions 53 and 55.
  • the resin R and the release film F are delivered from the film loader 57 to the lower mold 32.
  • the resin R can also be heated from above, and the time for melting can be shortened. it can. This can improve the productivity.
  • the film loader 57 is lifted to extend the elastic member 50 (movable Move the part). Then, the lower mold cavity piece 34 is moved relative to the lower mold clamper 35 by the elastic member 50 to form the cavity recess 33. At this time, the outer peripheral portion of the release film F is adsorbed by the adsorption portion 55, and the portion corresponding to the corner portion of the cavity recess 33 of the release film F is adsorbed by the adsorption portion 53. While the release film F is deformed. As a result, the release film F follows the inner surface of the cavity recess 33 and is held by suction.
  • the resin R is supplied to the cavity recess 33 as it is by suction-holding the release film F while making the inner surface of the cavity recess 33 follow.
  • the resin R since the resin R is disposed on the lower mold cavity piece 34 via the release film F by the film loader 57, the lower mold cavity piece 34 moves relative to the lower mold clamper 35 and the cavity Even if the recess 33 is formed, the resin R is supplied to the cavity recess 33 while maintaining the state as it is. Therefore, the shape of the resin R does not collapse, and the resin R can be supplied to the bottom of the cavity recess 33 without changing the position.
  • the work loader 56 and the film loader 57 are retracted from the inside of the mold 30. Thereafter, through the steps described with reference to FIGS. 7 to 9 in the first embodiment, the molded article is substantially completed.
  • the case of using 70 has been described.
  • the present embodiment is different in that, as the film loader 57, a jig (member) which supports the resin R and the release film F and which is disposed (set) as it is on the lower mold 32 is used. In the following, this difference will be mainly described with reference to FIGS. 15 to 19 are schematic cross-sectional views of the press unit 130 in the present embodiment.
  • the shutter unit 70 supporting the release film F when arranging the release film F on the lower mold 32, it is necessary to wind up (remove) the shutter unit 70. At this time, the distribution of the resin R on the release film F may be biased due to breakage or the like. Therefore, in the present embodiment, a flat jig 34A is placed under the release film F to hold the flat release film F, and the release film F is transported by the film loader 57 together with the jig 34A, and the release film F is arranged.
  • the jig 34A as it is is used as the lower mold 32. That is, since the jig 34A is made of, for example, the same material (stainless steel) as the lower mold cavity piece 34, the upper portion of the lower mold cavity piece 34 can be regarded as being separable.
  • the film loader 57 includes a jig 34A in which the upper part of the lower mold cavity piece 34 is provided so as to be separated, and a jig 35A in which the upper part of the lower mold clamper 35 is provided so as to be separated. Further, the jig 34A is disposed in the through hole of the jig 35A, and the outer peripheral surface of the jig 34A and the inner peripheral surface of the jig 35A are connected by a plurality of connection members 74 so as to lift and support the jig 34A. ing.
  • the connection member 74 is also used as a movable portion which can move the jig 35A in the vertical direction with respect to the jig 34A like a leaf spring.
  • the thickness of the jig 34A is different from that of the jig 35, and the jig 34A is thinner than the jig 35A. And in the state where it has not received the influence from the outside, the end face of jig 34A and the end face of jig 35A are held horizontally by connecting member 74. Further, in the press unit 130, the lower upper surface of the lower mold cavity piece 34 and the lower surface thereof are not pressed in a state where the elastic member 50 is not biased as in the case of mold opening (state not affected by the outside). The lower upper surface of the mold clamper 35 can be at the same height position.
  • the jig 34A (upper part of the lower mold cavity piece 34) is attached to the jig 35A (upper part of the lower mold clamper 35) by providing such thickness difference (height difference) of the jigs 34A, 35A. Can be moved relatively to change the depth of the cavity recess 33 (volume of the cavity C).
  • the press unit 130 in the present embodiment is provided with pressing units 75 and 76 that press the release film F from the upper surface (the surface on which the resin R is mounted).
  • the pressing portion 75 is formed in a flange shape in which two square annular members having different outer shapes are combined so that the release film F can be pressed around the resin R, and faces the end face of the outer peripheral portion of the jig 34A.
  • the pressing portion 76 is provided so as to face the end face of the jig 35A so as to face the end face of the lower mold clamper 35 in the release film F to press the outer peripheral portion.
  • the release film F is conveyed flat by holding the release film F on these end faces. According to this, it is possible to arrange the release film F and the resin R mounted thereon in the mold 30 in a stable state.
  • the workpiece W is carried in by the work loader 56 from the outside of the mold. Further, in a state where the mold 30 is opened, the film loader 57 carries in the resin R and the release film F.
  • the roll-shaped release film F is sent out. Resin R is mounted (supplied). Then, the release film F is cut into a predetermined shape (for example, a strip shape) (see FIG. 2), and the release film F is disposed on the jig 34A and the jig 35A because the end faces are horizontal. The situation when being done is also flat. This is supplied to the press unit 130 via the robot mechanism unit 180 and the loader 190.
  • the work loader 56 is raised, and the work W is delivered to the upper die 31.
  • the film loader 57 is lowered. Specifically, the jig 35A is brought into contact with the upper surface of the lower clamper 35 by lowering the film loader 57.
  • the release film F is a film loader 57 in which the end face of the jig 34A (upper part of the lower mold cavity piece 34) and the end face of the jig 35A (upper part of the lower mold clamper 35) are held horizontally. Arranged flat by. At this time, the jig 34A is not in contact with the upper surface of the lower mold cavity piece 34.
  • the release film F is suctioned by the suction units 53 and 55. Specifically, the outer peripheral portion of the release film F is adsorbed by the adsorption portion 55, and the central portion of the release film F is adsorbed by the adsorption portion 53, and the jig 35A is vertically movable. The tool 34A is lowered by the connection member 74 (moves the movable portion).
  • the lower mold cavity piece 34 is moved relative to the lower mold clamper 35 by the connection member 74 to form the cavity recess 33.
  • the outer peripheral portion of the release film F is adsorbed by the adsorption portion 55, and the portion corresponding to the corner portion of the cavity recess 33 of the release film F is adsorbed by the adsorption portion 53.
  • the release film F is deformed. As a result, the release film F follows the inner surface of the cavity recess 33 and is held by suction.
  • the release film F is adsorbed and held while following the inner surface of the cavity recess 33, and the resin R is supplied to the cavity recess 33 as it is. Since the resin R is disposed on the jig 34A via the release film F by the film loader 57, even if the cavity recess 33 is formed, the resin R is supplied to the cavity recess 33 while maintaining the state as it is. . Therefore, the shape of the resin R does not collapse, and the resin R can be supplied to the bottom of the cavity recess 33 without changing the position.
  • the work loader 56 and the film loader 57 are retracted from the inside of the mold 30. Thereafter, through the steps described with reference to FIGS. 7 to 9 in the first embodiment, the molded article is substantially completed.
  • FIGS. 20 to 24 are schematic cross-sectional views of the press unit 130 in the present embodiment.
  • FIG. 21 is an exploded cross-sectional view of the film loader 57 (film plate portion) shown in FIG.
  • the film loader 57 is provided with a ring-shaped upper plate 80 and a lower plate 81, and is configured to be able to hold the release film F in a pulled state from the entire circumference by being sandwiched from above and below (in particular, refer to FIG. 21).
  • the lower plate 81 is formed with a stepped portion 82 extending in the circumferential direction, recessed from the surface on the upper plate 80 side at the peripheral edge end so as to be flange-like.
  • the upper plate 80 With the release film F interposed between the upper plate 80 and the lower plate 81, the upper plate 80 is fitted such that the inner diameter portion 80a of the upper plate 80 corresponds to the stepped portion 82 (small diameter portion) of the lower plate 81.
  • the plate portion (film loader 57) is configured (in particular, refer to FIG. 20). Then, the release film F is stretched so as to be flat on the inner peripheries of the upper plate 80 and the lower plate 81.
  • the holes penetrating at the peripheral portion thereof are fixed with bolts or the like (avoid release film F position) to configure the film plate portion
  • the lower clamper 35 is formed with a stepped portion 83 which is recessed in the end face at the peripheral edge end and extends in the circumferential direction. Then, the inner diameter portion 81a of the lower plate 81 is made to correspond to the stepped portion 83 of the lower clamper 35, and the film plate portion (film loader 57) is fitted and fixed.
  • the release film F can be held flat with a simple configuration, and the release film F can be disposed on the lower mold 32 in a flat state.
  • the workpiece W is carried in by the work loader 56 from the outside of the mold. Further, in a state where the mold 30 is opened, the film loader 57 carries in the resin R and the release film F.
  • a film plate portion is formed by sandwiching the release film F between the upper plate 80 and the lower plate 81, and the resin R is mounted on the release film F of the film plate portion. (Supplied).
  • the work loader 56 is raised and the work W is delivered to the upper die 31.
  • the film loader 57 is lowered, and the release film F having the resin R mounted on the lower mold 32 is delivered. Specifically, first, the lower surface of the lower plate 81 is brought into contact with and fixed to the upper surface of the stepped portion 83 of the lower clamper 35 by lowering the film loader 57, and then the elastic member 50 is compressed (moving the movable portion ). That is, the lower clamper 35 is pushed down by lowering the film loader 57. Next, the film loader 57 is lowered until the upper surface (upper end surface) of the lower mold cavity piece 34 and the upper surface (upper end surface) of the lower mold clamper 35 become horizontal.
  • the film loader 57 stretches and holds the flat release film F. That is, in the lower mold 32 in which the upper surface of the lower mold cavity piece 34 and the upper surface of the lower clamper 35 are held horizontally, a flat release film so that the resin R is positioned on the lower mold cavity piece 34 by the film loader 57. Place F.
  • the release film in a flat state is disposed to cover the upper surface of the lower mold cavity piece 34 and the upper surface of the lower mold clamper 35.
  • F is adsorbed and held by the adsorption unit 53.
  • the work loader 56 is lowered. Thereby, the work loader 56 is separated from the work W. Then, the work W is held only by the upper mold 31. Next, the work loader 56 is retracted from the inside of the mold 30.
  • the film loader 57 is lifted to extend the elastic member 50 (move the movable portion). .
  • the lower mold cavity piece 34 is moved relative to the lower mold clamper 35 by the elastic member 50 to form the cavity recess 33.
  • the outer peripheral portion of the release film F is fixed by the inner diameter portion 81a of the lower plate 81 and the stepped portion 83 of the lower clamper 35 being fitted, and the suction portion 53 fixes the corner of the cavity recess 33 of the release film F. Since the corresponding portion is adsorbed, the release film F deforms while making the inner surface of the cavity recess 33 follow. As a result, the release film F follows the inner surface of the cavity recess 33 and is held by suction.
  • the resin R is supplied to the cavity recess 33 as it is by suction-holding the release film F while making the inner surface of the cavity recess 33 follow.
  • the resin R since the resin R is disposed on the lower mold cavity piece 34 via the release film F by the film loader 57, the lower mold cavity piece 34 moves relative to the lower mold clamper 35 and the cavity Even if the recess 33 is formed, the resin R is supplied to the cavity recess 33 while maintaining the state as it is. Therefore, the shape of the resin R does not collapse, and the resin R can be supplied to the bottom of the cavity recess 33 without changing the position.
  • supplying the resin R to the cavity recess 33 in a desired state works to reduce the quality defects of the molded product due to the void and the wire sweep.
  • the movable lower die 32 is raised to close the mold 30 (clamping).
  • the release film F is clamped, that is, the film plate portion (film loader 57) is sandwiched between the upper mold 31 and the lower mold 32.
  • the molded article is substantially completed.
  • the press unit 130 in the present embodiment will be specifically described.
  • the press unit 130 includes a plate-like jig 34A in which the upper portion of the lower mold cavity piece 34 is provided so as to be separated.
  • the press unit 130 also includes a plurality of support pins 84 that support, for example, the four corners of the plate-like jig 34A. Further, the press unit 130 is assembled such that the support pin 84 is movable in the vertical direction with respect to the lower mold base 46, and includes the same number of elastic members 85 (for example, springs) as the support pin 84.
  • the support pin 84 and the elastic member 85 constituting the movable portion are arranged such that the upper surface of the jig 34A (the upper portion of the lower mold cavity piece 34) and the upper surface of the lower clamper 35 become horizontal in the mold open state.
  • the jig 34A is floatingly supported by this.
  • the plate-like jig 34A may be configured to be movable up and down using a drive mechanism such as an air cylinder or a servomotor without using the elastic member 85.
  • the resin R and the release film F are carried in and delivered to the lower mold 32 in a state where the mold 30 is opened.
  • the release film F is disposed flat by the film loader 57 on the lower mold 32 in which the upper surface of the jig 34A (the upper portion of the lower mold cavity piece 34) and the upper surface of the lower clamper 35 are held horizontally.
  • the suction unit 53, 55 starts to suck the release film F.
  • the release film F is sucked by the suction units 53 and 55. Specifically, the outer peripheral portion of the release film F is adsorbed by the adsorption portion 55, and the air in the space below the release film F is adsorbed by the adsorption portion 53, and is provided movably in the vertical direction with respect to the lower clamper 35.
  • the jig 34A is lowered while pressing the elastic member 85 (moving the movable portion).
  • the elastic member 85 moves the jig 34A (the upper portion of the lower mold cavity piece 34) relative to the lower mold clamper 35 to form the cavity recess 33.
  • the outer peripheral portion of the release film F is adsorbed by the adsorption portion 55, and the portion corresponding to the corner portion of the cavity recess 33 of the release film F is adsorbed by the adsorption portion 53.
  • the release film F is deformed. As a result, the release film F follows the inner surface of the cavity recess 33 and is held by suction.
  • the release film F is adsorbed and held while following the inner surface of the cavity recess 33, and the resin R is supplied to the cavity recess 33 as it is. Since the resin R is disposed on the jig 34A via the release film F by the film loader 57, even if the cavity recess 33 is formed, the resin R is supplied to the cavity recess 33 while maintaining the state as it is. . Therefore, the shape of the resin R does not collapse, and the resin R can be supplied to the bottom of the cavity recess 33 without changing the position. Thereafter, through the steps described with reference to FIGS. 7 to 9 in the first embodiment, the molded article is substantially completed.
  • the operation and configuration of the film loader 57 (for example, , The output of the drive motor, and the reduction of the stroke) can be simplified.
  • the jig 34A upper part of the lower mold cavity piece 34
  • the thermal contraction of the release film F can be prevented. It becomes easy to prevent overheating of the resin R mounted on the release film F and to perform heating adjustment.
  • the inside of the mold 30 is depressurized (degassed) in a state in which the inside of the mold 30 including the cavity recess 33 is closed by closing the mold.
  • the case was described.
  • the suction force for pressure reduction causes the substrate to be suctioned.
  • the suction force is reduced, and the substrate 10 may fall.
  • the lower clamper 35 is made to support a plurality of pins in a floating manner, and the substrate 10 is supported so as to be pressed against the upper die 31 in the formation state of the decompression space.
  • the difference is in the configuration. In the following, this difference will be mainly described with reference to FIG.
  • FIG. 27 is a schematic cross-sectional view of the press unit 130 in the present embodiment.
  • the press unit 130 includes a plurality of pins 86 provided inside the lower clamper 35 along the periphery of the through hole 47 of the lower clamper 35.
  • the press portion 130 is assembled to the inside of the lower mold clamper 35 so that the pin 86 can be moved in the vertical direction with respect to the lower mold clamper 35, and includes the same number of elastic members 87 (for example, springs) as the pins 86. .
  • an elastic member which constitutes the movable portion so as to support the work W by coming into contact with the surface of the substrate 10 via the release film F so as to project from the end face of the lower clamper 35 in a state of forming a decompression space.
  • a pin 86 is supported floating by 87. Then, in a state where the work W is clamped (see FIG. 8), the pin 86 is accommodated inside the lower clamper 35. Therefore, it is possible to prevent the workpiece W held by the upper die 31 from falling before clamping.
  • FIGS. 33 to 36 are schematic cross-sectional views of the press unit 130 during the resin molding process in the present embodiment.
  • the workpiece W in the present embodiment includes a substrate 10 having one surface 10 a and the other surface 10 b opposite thereto, and a plurality of ball-shaped bumps 11 A and 11 A provided on both surfaces 10 a and 10 b (first components, A second part) and is configured, for example, in a wafer shape (plate shape).
  • the respective bumps 11A and 11A of both surfaces 10a and 10b are resin-molded, and resin molded portions 14 and 15 are formed on both surfaces 10a and 10b (see FIG. 36), and the work W is a resin molded product (molded product) It will be almost complete.
  • the resin mold of such a wafer-like workpiece W is WLP (Wafer Level). It is called Package).
  • the parts provided on the work W are not limited to the bumps 11A, which are wiring parts, and may be chip parts (for example, semiconductor chips, MEMS chips, chip capacitors, etc.), or both of wiring parts and chip parts.
  • the substrate 10 not only a general substrate but also a plate-like member may be used, such as a carrier or a semiconductor wafer on which components are temporarily mounted.
  • the workpiece W is not resin-molded, and the parts (bumps 11A) on both sides are exposed (see FIG. 33), and only one side is resin-molded and the parts on the other side (bumps 11A) ) (See FIG. 35) are separately supplied by the robot mechanism unit 180 (see FIG. 1).
  • the press part 130 in this embodiment will be equipped with the plate-shaped 1st jig 12 (refer FIG. 33) and the 2nd jig 13 (refer FIG. 35).
  • the jigs 12 and 13 are provided so as to be replaced on the lower surface of the upper mold insert 37 when the workpiece W is clamped by the upper mold 31 and the lower mold 32.
  • the jig 12 has a first opening 12a (a plurality of which is shown in FIG. 33) larger than the mounting area of the bumps 11A mounted on the semiconductor chip manufactured as a product on the surface 10a.
  • the first opening 12a is formed so that the workpiece W and the jig 12 can be overlapped while avoiding the parts provided as the bumps 11A.
  • the jig 13 has a second opening 13a (one shown in FIG. 35) larger than the opening 12a.
  • the bump 11A is mounted on the surface 10a of the work W such that the bump 11A is accommodated in the opening 12a (that is, escape is secured to the bump 11A by the opening 12a). (See FIG. 33). Further, when using the jig 13, the work W is made such that the resin mold portion 15 is accommodated in the opening 13 a (that is, the escape is secured to the resin mold portion 15 by the opening 13 a). Is mounted on the face 10b of (see FIG. 35). In the present embodiment, by using the jigs 12 and 13, the work W can be clamped by avoiding (avoiding) the bumps 11A and the resin mold portion 15 (see FIGS. 34 and 36).
  • the mold 30 can be shared and another jig can be used.
  • the jigs 12 and 13 may be fixed to the upper mold 31 or may be used.
  • the loader 190 superimposes the jig 12 or the jig 13 on the workpiece W delivered from the robot mechanism unit 180 and then loads the same into the press unit 130. Further, the loader 190 removes the jig 12 or the jig 13 from the top of the resin-molded workpiece W delivered from the press unit 130 and carries it out to the robot mechanism unit 180. As described above, by preparing the jig 12 or the jig 13 in the loader 190, the workpiece W is delivered to the inside of the press unit 130 together with the jig 12 or the jig 13.
  • the jig 12 is mounted on one surface 10 a of the workpiece W so that the bumps 11 A are accommodated in the openings 12 a in the loader 190, with the workpiece W transported by the robot mechanism unit 180.
  • the robot mechanism unit 180 may transport only the work W, and the robot mechanism unit 180 having a small payload can be used, thereby reducing the manufacturing cost of the apparatus. be able to.
  • the work W and the jig 12 are carried in from the outside of the mold by the work loader 56 (see FIG. 3), and the work 12 is delivered to the upper mold 31 together with the jig 12 ( See Figure 33). Thereby, the work W is held by the mold surface of the upper mold 31.
  • the jig 12 is brought into contact with the lower surface of the upper mold insert 37 in a state in which the surface 10b of the workpiece W faces the lower mold 32, and the upper mold 31 (upper The workpiece W (substrate 10) is held by suction via the jig 12 on the mold surface of the mold insert 37).
  • the jig 12 is provided with the opening 12a for releasing the bump 11A mounted on the surface 10a of the workpiece W (substrate 10), so that the bump 11A can be protected, for example.
  • a recess may be engraved on the lower surface of the upper mold insert 37 without using the jig 12 to release the bump 11A.
  • the film loader 57 (see FIG. 3) carries in the resin R and the release film F, and delivers the resin R and the release film F from the film loader 57 to the lower mold 32 (see FIG. See 33).
  • the shape of the release film F is made to follow the deformation of the lower mold cavity recessed portion 33 from the flat, and the release film F is adsorbed and held on the mold surface of the lower mold 32 including the lower mold cavity recessed portion 33 It supplies to lower mold cavity crevice 33 as it is.
  • the release film F By using the release film F, resin leakage from the gap between the lower mold insert 34 and the lower mold clamper 35 can be prevented. However, when the resin R can be transported as it is without the influence of such a resin leak, the release film F may not be used.
  • the movable lower die 32 is raised to immerse all the bumps 11A provided on the surface 10b in the resin R melted at the die temperature, and then the upper die 31 and The lower mold insert 34 is moved to the forming position while clamping the work W with the lower mold 32. Then, the resin R filled in the lower mold cavity C is heated and cured, and the workpiece W is resin-molded. Thus, the resin mold portion 15 is formed on the surface 10 b of the workpiece W.
  • the workpiece W (molded product) is held by the upper mold 31 by the workpiece holding unit, and the release film F is held open by the lower mold 32 by the suction units 53 and 55. At this time, by using the release film F, the work W can be easily released. Then, as described above, the workpiece W is stored in the workpiece storage unit 160 through the inspection unit / cooling unit 140 and the curing unit 150 (see FIG. 1).
  • the magazine is moved to the work supply unit 110.
  • the process similar to the process which replaced the jig
  • the jig 13 is mounted on one surface 10 b of the work W such that the resin mold portion 15 of the work W carried into the loader 190 by the robot mechanism unit 180 fits in the opening 13 a.
  • the opening 13 a of the jig 13 is larger than the flat area of the resin mold portion 15, in other words, larger than the upper surface of the lower mold insert 34 constituting the lower mold cavity C forming the resin mold portion 15.
  • the work W and the jig 13 are carried in from the outside of the mold by the work loader 56 (see FIG. 3), and the work 13 is delivered to the upper mold 31 together with the jig 13 (See Figure 35).
  • the jig 13 is provided with the opening 13a for releasing the resin mold portion 15 mounted on the surface 10b of the workpiece W (substrate 10), so that the resin mold portion 15 can be protected, for example.
  • the resin mold portion 15 may be released by engraving a recess on the lower surface of the upper mold insert 37 without using the jig 13.
  • the film loader 57 (see FIG. 3) carries in the resin R and the release film F, and delivers the resin R and the release film F from the film loader 57 to the lower mold 32 (see FIG. See 35).
  • the shape of the release film F is made to follow the deformation of the lower mold cavity recessed portion 33 from the flat, and the release film F is adsorbed and held on the mold surface of the lower mold 32 including the lower mold cavity recessed portion 33 It supplies to lower mold cavity crevice 33 as it is.
  • the resin R forms the resin mold portion 14, and by making the same amount and the same quality as the resin mold portion 15 formed previously, the bumps 11 A can be sealed in the same shape.
  • the heights of the components mounted on the substrate 10 shown as the bumps 11A are different, it is also possible to use an amount of resin R suitable for each. In this case, it is also possible to use a resin R having different properties depending on the purpose of preventing warpage due to the difference in thickness of resin molding and the function of the mounted component.
  • the lower die 32 which is a movable die, is raised to immerse all the bumps 11A provided on the surface 10a in the resin R melted at the die temperature.
  • the lower mold insert 34 is moved to the forming position while clamping the work W with the lower mold 32.
  • the resin R filled in the lower mold cavity C is heated and cured, and the workpiece W is resin-molded.
  • the resin mold portion 14 is formed on the surface 10 a of the work W.
  • the workpiece W (molded product) is held by the upper mold 31 by the workpiece holding unit, and the release film F is held open by the lower mold 32 by the suction units 53 and 55. At this time, by using the release film F, the work W can be easily released. Then, as described above, the workpiece W is stored in the workpiece storage unit 160 through the inspection unit / cooling unit 140 and the curing unit 150 (see FIG. 1).
  • connection terminal surfaces are formed on both surfaces by singulating each area equivalent to one chip.
  • One package resin mold product
  • the workpiece 10 is used as the work W by bonding one surface of the substrate 10 on one side of which the bumps 11A are disposed on one surface, the substrate 10 is separated and then singulated into an area corresponding to one chip.
  • a package having a connection terminal surface formed on one side can be formed efficiently.
  • both surfaces 10a and 10b of the plate-like work W can be resin-molded by the compression molding method. Further, since the resin R can be supplied to the lower mold cavity recess 33 (lower mold cavity C) for resin molding, even a large-sized work W can be efficiently molded.
  • the resin mold portion 14 is formed by carrying the work W into the press portion 130 without storing the work W in the work storage portion 160, It is also possible to mold 15 continuously.
  • the plate member for resin holding is used to hold the resin R flat.
  • the release film F may be conveyed while being sandwiched between the release film F and the release film F.
  • the plate-like member for resin retention may be, for example, various plate materials such as a metal plate, a glass plate, or a silicon wafer, or may be a structure such as a lead frame or a substrate.
  • the plate-like member for holding the resin may be peeled off after molding or left as it is in the package, whereby the heat dissipation layer, the electromagnetic shield layer, the filter layer, the lens layer, the wavelength conversion layer, the gas permeation preventing layer, Alternatively, it can be used as a functional layer such as a wiring layer.
  • a plate-shaped member for holding resin it is possible to perform flat conveyance of the resin R and the release film F with a plate-like member capable of achieving high functionality by being attached to the work W, and high Functional products can be easily manufactured.
  • the resin holding plate member and the shutter unit 70 may be used in combination.
  • the press portion of the resin mold apparatus in the first embodiment the case where mold opening and closing of the mold is performed by a known clamp mechanism has been described.
  • a resin mold apparatus provided with a clamp mechanism corresponding to the increase in size (WLP) of the workpiece W in the press portion will be described.
  • the molding quality can be enhanced by performing mold closing with high accuracy while maintaining the parallelism of the movable platen in the mold closing operation and by making the final resin pressure high.
  • the resin mold apparatus 201 includes a mold 204 having an upper mold 202 and a lower mold 203 and a clamp mechanism 205 for opening and closing the mold 204.
  • the clamp mechanism 205 is provided on a rectangular base portion 206.
  • the base portion 206 and the fixed platen 207 are connected by tie bars 208 disposed at each corner portion (four places; see FIG. 38).
  • the upper mold 202 is supported by the fixed platen 207, and the lower mold 203 is supported on the front (upper surface) side of the movable platen 209.
  • the movable platen 209 is guided by an associated tie bar 208 to move up and down.
  • a ball screw mechanism 210 (first type opening / closing mechanism) which cooperates with the movable platen 209 to mold-close the mold 204 to the first mold clamping force with the fixed platen 207. It is done.
  • screw shafts 211 are provided on the base portion 206 at four positions on the inner side of the tie bar 208, and first drive motors 212 (servo motors) for rotationally driving the screw shafts 211 are provided at four positions. There is.
  • the first drive motor 212 is driven in synchronization among the plurality of motors, and can perform speed control with high accuracy by servo control.
  • fixed nuts 213 screw-fitted to the screw shaft 211 are provided at four places.
  • the tie bars 208 and the screw shafts 211 are equally spaced from each other at diagonal positions of the base portion 206 (movable platen 209).
  • any number may be provided.
  • a toggle link mechanism 214 (second type opening and closing mechanism) is provided at the center on the back side of the movable platen 209.
  • the toggle link mechanism 214 cooperates with the movable platen 209 to close the mold to a second mold clamping force that further intensifies the clamping force than the first clamping force to maintain the final resin pressure.
  • a screw shaft 215 and a second drive motor 216 (servo motor) for rotationally driving the screw shaft 215 are provided at the central portion of the base portion 206.
  • a movable nut 217 is screwed on the screw shaft 215.
  • the link connection portion 218 is integrally provided on the movable nut 217.
  • the drive motors 216 and 212 may be arranged on the side of the base portion 206 by using a belt mechanism.
  • the toggle link mechanism 214 is a so-called power boosting mechanism, and is configured to increase (amplify) the output from the second drive motor 216 by the toggle link structure constituted by the following link members, and to be able to output to the movable platen 209 Be done.
  • one end of the connection link 219 is rotatably connected to the link connection portion 218.
  • the other end of the connection link 219 is rotatably connected to the apex portion of the triangular link 220.
  • One base corner portion of the triangular link 220 is pivotally connected to the base portion 206, and the other base corner portion is pivotally connected to one end of the slide link 221.
  • the other end of the slide link 221 is rotatably connected to a connecting portion 209 a provided on the back surface of the movable platen 209.
  • the connecting portion 209a provided on the back surface of the movable platen 209 is driven by the second drive motor 216 in which the movable nut 217 is screwed.
  • the first drive motor 212 and the second drive motor 216 are driven and controlled by the controller 222.
  • Each tie bar 208 is also provided with a pressure sensor 223.
  • the control unit 222 detects the clamp pressure of the mold die 204 from the pressure sensor 223 and controls the driving of the first drive motor 212 and the second drive motor 216 to thereby obtain a mold by the ball screw mechanism 210 and the toggle link mechanism 214. Control the clamping operation.
  • the control unit 222 synchronously drives the first drive motor 212 and the second drive motor 216 to supply the mold screw 204 from the ball screw mechanism 210 through the movable platen 209.
  • the clamped work is clamped with the first mold clamping force, and then the pressurized state of the ball screw mechanism 210 is transferred to the pressurized state by the toggle link mechanism 214, and the movable platen 209 is clamped with the first mold clamping force by the toggle link mechanism 214. Clamp to a larger second mold clamping force.
  • the upper mold base 202 a of the upper mold 202 is supported by the solid platen 7.
  • the upper mold insert 202b is assembled to the upper mold base 202a.
  • a work holding portion 202c is formed, which suctions and holds the work W of the upper mold insert 202b flush with the clamp surface.
  • the lower mold base 203 a of the lower mold 203 is supported by the movable platen 209.
  • a recess is formed in the clamp surface of the lower mold base 203a, and the lower mold cavity piece 203b is supported in the recess, and the lower clamper 203c is supported by being biased by a coil spring 203d around it.
  • the lower mold clamper 203c protrudes upward from the upper surface of the lower mold cavity piece 203b, and a lower mold cavity recess 203e is formed.
  • the release film F is held by suction so as to cover the lower mold cavity recess 203e.
  • the release film F is held by suction on the upper mold clamping surface.
  • the release film F has a heat resistance of about 0.5 mm in thickness and can be easily peeled from the mold surface, and has flexibility and extensibility, for example, PTFE, ETFE, PET, FEP
  • a film, a fluorine-impregnated glass cloth, a polypropylene film, a single layer or a multilayer film mainly composed of polyvinylidene chloride or the like is preferably used.
  • FIGS. 37, 39A and 39B, and FIGS. 40A to 40C An example of the opening / closing operation of the clamp mechanism 205 and the resin molding operation will be described with reference to FIGS. 37, 39A and 39B, and FIGS. 40A to 40C.
  • the mold die 204 when the mold die 204 is in the mold open state, the workpiece W is supplied to the mold die 204 by a supply device (not shown).
  • the lower mold cavity recess 203e of the lower mold 203 is covered with the release film F in advance and held by suction.
  • the workpiece W for example, a substrate on which a semiconductor chip is mounted, a semiconductor wafer, etc.
  • Mold resin R liquid resin, granular resin, granular resin (powder resin), sheet resin, tablet resin, etc.
  • the mold resin R may be supplied to the lower mold cavity recess 203e together with the release film F.
  • the control unit 222 drives the first drive motor 212 and the second drive motor 216 in synchronization with each other.
  • the screw shaft 211 of the ball screw mechanism 210 is rotated at four points by the drive of the first drive motor 212, and the movable platen 209 screw-engages with the fixed nut 213 with the rotation of the screw shaft 211. It rises while maintaining the parallelism with respect to the fixed platen 207. That is, the lower die 203 (specifically, the parting surface thereof) rises while maintaining parallelism with the upper die 202 (specifically, the parting surface thereof).
  • connection link 219 connected to both sides of the link connection portion 218 is horizontal. Tilting to both sides in the direction, the triangular link 220 rotates so as to stand up, and pushes up the slide link 221. At this time, the toggle link mechanism 214 does not receive the load through the movable platen 209 due to the gap provided between the slide link 221 and the connecting portion 209a.
  • the coil spring 203d is compressed while the lower clamper 203c is in contact with the work W (substrate) and the upper insert 202b via the release film F.
  • a sealed space (reduced pressure space, closed space) is formed in the mold die 204, and the resin R is filled in the cavity recess 203e (cavity).
  • the movable platen 209 rises while maintaining the parallelism, the movable platen 209 approaches the stationary platen 207 while maintaining the parallelism. Therefore, the clamping of the upper mold 202 and the lower mold 203 can also be performed while maintaining the parallelism.
  • FIG. 40B the coil spring 203d is compressed while the lower clamper 203c is in contact with the work W (substrate) and the upper insert 202b via the release film F.
  • the resin R is spread toward the outside of the lower mold cavity recess 203e as in the case of supplying the resin R to the center of the lower mold cavity recess 203e, thereby filling the inside of the cavity recess 203e (cavity).
  • the ball screw mechanism 210 can properly control the clamping speed.
  • the clamping is continued as it is, and when the four pressure sensors 223 detect the first clamping pressure (for example, a total of 36 tons; the resin pressure of the mold resin R), the driving of the first drive motor 212 is stopped and the second drive is performed. The driving of the motor 216 is continued. Thereby, the toggle link mechanism 214 takes over the pressurized state of the movable platen 209 by the ball screw mechanism 210, and each pressure sensor 223 has a second mold clamping force higher than the first mold clamping pressure (for example, 125 tons in total; final resin pressure). Pressurize until it detects. As a result, in FIG.
  • the movable nut 217 further moves upward along the screw shaft 215, and the slide link 221 coupled through the coupling portion 209a of the movable platen 209 is in an upright state with the triangular link 220.
  • the movable platen 209 may be pressurized by both the ball screw mechanism 210 and the toggle link mechanism 214 without stopping the driving of the first drive motor 212. Further, the ball screw mechanism 210 may not be pressurized while being driven.
  • the pressure on the movable platen 209 is intensified while the upper mold insert 202b and the lower mold clamper 203c are in contact with each other, so the coil spring 203d of the lower mold clamper 203c is By being compressed, the mold resin R is filled in the lower mold cavity recess 203 e and maintained at the final resin pressure, and the mold resin R is heat-cured.
  • the sealed space can be formed in the mold die 204 by clamping the work W supplied to the mold die 204 through the movable platen 209 by the ball screw mechanism 210 with the first mold clamping force.
  • the toggle link mechanism 214 takes over the pressurized state by the ball screw mechanism 210, and the movable platen 209 is clamped by the toggle link mechanism 214 to the second mold clamping force which is larger than the first mold clamping force, so that the final resin pressure is achieved.
  • the mold resin R is heated and cured.
  • the molding quality can be enhanced by performing mold closing with high accuracy while maintaining the parallelism of the movable platen 209 in the mold closing operation and increasing the final resin pressure. That is, until the filling of the mold resin R where parallelism and mold clamping speed are particularly important, the mold is clamped while controlling the driving amount with high precision by the ball screw mechanism 210, and the pressing force is particularly important for the mold resin R. After filling, by pressing and pressing the mold with the toggle link mechanism 214 that increases the output of the second drive motor 216, it is possible to realize the required performance before and after the mold closing of the mold 204, respectively.
  • the toggle link mechanism 214 for increasing the output by the second drive motor 216 as the clamp mechanism 205 for opening and closing the mold die 204, for example, using only the linear movement mechanism without using the mechanism for increasing the output.
  • the servomotors (the first drive motor 212 and the second drive motor 216) for driving the mechanism can be smaller in output than in the case of performing the mold opening / closing operation, and the diameter of the screw shaft 211 is also reduced.
  • the size of the device can be reduced, the power consumption can be reduced, and the manufacturing cost can be reduced. Therefore, it is possible to cope with the increase in size of the work W more inexpensively.
  • the work W is held by the upper mold 202 of the molding die 204, and the mold resin R is supplied to the cavity formed in the lower mold 203, but the configuration may be reversed. Good.
  • the upper mold base 202 a of the upper mold 202 is supported by the fixed platen 207.
  • a recess is formed on the clamp surface of the upper mold base 202a, and the upper mold cavity piece 202d is supported in the recess, and the upper mold clamper 202e is biased and supported by a coil spring 202f around it.
  • the upper mold clamper 202e protrudes downward from the lower surface of the upper mold cavity piece 202d, and an upper mold cavity recess 202g is formed.
  • the release film F is held by suction so as to cover the upper mold cavity recess 202g.
  • the lower mold base 203 a of the lower mold 203 is supported by the movable platen 209.
  • a lower mold insert 203f is assembled to the lower mold base 203a.
  • the lower mold insert 203f is formed with a work holding portion 203g for attracting and holding the work W flush with the clamp surface.
  • a workpiece W for example, a substrate on which a semiconductor chip is mounted, a semiconductor wafer, etc.
  • a workpiece W for example, a substrate on which a semiconductor chip is mounted, a semiconductor wafer, etc.
  • mold resin R Liquid resin, granular resin, granular resin (powder resin), sheet resin, tablet resin, etc. are supplied.
  • the mold resin R may be supplied to the workpiece W in advance and then supplied to the workpiece holding unit 203g.
  • the upper mold cavity recess 202 g of the upper mold 202 is covered with the release film F and held by suction.
  • the upper clamper 202e remains in contact with the work W (substrate) and the lower insert 203f via the release film F.
  • the coil spring 202f is compressed.
  • the mold resin R is filled in the upper mold cavity recess 202g while the sealed space (reduced pressure space, closed space) is formed in the molding die 204.
  • the mold die 204 When the mold die 204 reaches the first mold clamping force and shifts from pressurization by the ball screw mechanism 210 to pressurization of the toggle link mechanism 214, as shown in FIG. 41C, the mold die 204 is inserted into the lower mold insert.
  • the pressure applied to the movable platen 209 is intensified while the upper clamper 202e is in contact with the upper clamper 202e, so that the coil spring 202f of the upper clamper 202e is compressed and the resin pressure in the cavity recess rises and the final clamp
  • a predetermined resin pressure is kept applied to the mold resin R, and the mold resin R is heat-cured.
  • the control unit 222 synchronously drives the ball screw mechanism 210 and the toggle link mechanism 214 and supplies the mold screw 204 via the movable platen 209 by the ball screw mechanism 210.
  • the mold die 204 can be closed and an enclosed space can be formed in the mold die 204.
  • the toggle link mechanism 214 takes over the pressurized state by the ball screw mechanism 210, and the movable platen 209 is clamped by the toggle link mechanism 214 to the second mold clamping force which is larger than the first mold clamping force, so that the final resin pressure is achieved.
  • the mold resin R can be heat-cured.
  • a resin mold device that can be compacted at low cost and at low cost while maintaining the parallelism and mold clamping speed of the mold 204 accurately in response to the increase in size of the work W 201 can be provided.
  • a hydraulic press mechanism may be provided instead of the toggle link mechanism 214.
  • the molding quality can be enhanced by performing mold closing with high accuracy while maintaining the parallelism of the movable platen 209 in the mold closing operation and by increasing the final resin pressure.
  • another boosting mechanism may be provided instead of the toggle link mechanism 214.
  • the movable platen 209 is driven by the ball screw mechanism 210 as described above to perform mold opening and closing operation to perform mold clamping, and the toggle link mechanism 214 described above applies pressure and drives only the lower mold cavity piece 203b shown in FIG. It may be configured to In this case, while providing a through hole in lower mold base 203a and movable platen 209, a pressing member for pressing lower mold cavity piece 203b penetrates the through hole and is connected to connecting portion 209a, thereby forming the lower mold cavity piece. 203 b can be driven separately.
  • the die clamping force can be suppressed while arbitrarily increasing the resin pressure, and the whole apparatus can It is also possible to mold without lowering the resin pressure even if the output of.
  • the drive state can be switched between the drive by the ball screw mechanism 210 alone and the drive by the ball screw mechanism 210 and the toggle link mechanism 214.
  • the lower mold cavity piece 203b may be raised alone and projected from the lower mold 203 to facilitate mold cleaning.
  • the case where granular resin was used as resin R was demonstrated.
  • a film-like resin may be used, or a film-like resin having different sizes may be laminated so as to form a mountain-like shape.
  • FIGS. 28 and 29 molding using a workpiece W and a resin R as shown in FIGS. 28 and 29 can be employed.
  • the work W one in which the chip component 11 is flip-chip mounted on the substrate 10 can be used.
  • the resin R it is possible to use a film-like resin formed in a middle-high shape, or a granular resin supplied in a middle-high position.
  • the resin R in which the chip part 11 is melted as shown in FIG.
  • the resin R is dipped sequentially from the chip component 11 on the center side.
  • the melted resin R flows from the center of the substrate 10 to the outer peripheral side. Therefore, when the chip part 11 seals the work W on which the flip chip mounting is performed, the underfill between the chip part 11 and the substrate 10 becomes easy.
  • the resin supply unit 120 simultaneously supplies (mounts) the resin R of the same amount on the release film F which is the resin supply region by using the plurality of troughs 123 .
  • a dispenser having multiple nozzles capable of supplying a flowable resin such as granular resin or liquid resin may be used. According to this, it is possible to prevent an increase in the supply time caused by the increase in the resin supply amount (the enlargement of the resin supply region).
  • the nozzles can be distributed and arranged in the resin supply region so that the resin supply can be uniformly performed, whereby the resin can be uniformly supplied.
  • the case where the lower mold cavity piece 34 is moved relative to the lower mold clamper 35 by expanding and contracting the elastic member 50 with the mold opening and closing of the mold clamping mechanism has been described.
  • the invention is not limited to this, and a mechanism for varying the height of the lower clamper 35 which is driven separately from the mold clamping mechanism may be used.
  • the lower mold cavity piece 34 is connected to a drive source and movably assembled to the lower mold base 46 of the mold 30 and the lower mold clamper 35 is fixed to the lower mold base 46 It may be configured to be assembled.
  • a plate thickness adjustment block (taper block) having an interface formed on a tapered surface (inclined surface) is superimposed between the lower mold cavity piece 34 and the lower mold base 46
  • a wedge portion may be provided, and one of the plate thickness adjustment blocks may be slidable by a drive source such as an air cylinder or a motor.
  • the film loader 57 is connected to the suction unit 67 only from the holding surface 64 to perform air suction (see FIG. 3).
  • the film loader 57a may be configured to be capable of air suction in the recess 66, or may be configured to be capable of being filled with air and pressurizing it.
  • a film loader 57a as shown in FIGS. 30 to 32 can be used. In FIGS. 30 to 32, the upper mold 31 (see FIG. 3) is omitted.
  • an air channel 65a having the same function as the air channel 65 shown in FIG. Suction or pressurization is performed from an air passage 65 b connecting the suction / pressurization unit 67 b of another system and the recess 66. Specifically, the deflection of the release film F is prevented by the weight of the resin R by equalizing the pressure on the release film F by the weight of the resin R and the suction force (negative pressure) by the adsorbing portion 67a. it can.
  • the film loader 57a when the release film F is disposed in the cavity recess 33, air is supplied from the suction / pressurizing portion 67b and air is supplied into the recess 66. It is also possible to stretch the wrinkles of the release film F by filling and pressing. According to this, while making the release film F conform to the shape of the cavity recess 33 by suction from a position corresponding to the corner of the cavity recess 33, the wrinkles of the release film F are pushed while pushing outward on the end face of the cavity piece 34 Since it can also be crushed, the occurrence of wrinkles can be prevented more reliably.
  • heated air can be used as air to be filled in the concave portion 66, and generation of wrinkles can be prevented without lowering the mold temperature. Further, since the release film F is also heated, the release film F can be made to conform more reliably to the shape of the cavity recess 33.
  • the film loader 57 has described the example in which the release film F on which the resin R is mounted is disposed on the lower mold 32.
  • the present invention is not limited thereto, and is disposed on the upper mold 31. It can also be done.
  • the mold 30 in the resin molding apparatus 100 is configured such that the lower mold 32 and the upper mold 31 are vertically inverted, and the lower mold (corresponding to the first mold in the present invention) and the cavity recess are formed.
  • the upper mold (corresponding to the second mold in the present invention) is closed and the work W can be resin-molded with the resin filled in the cavity recess.
  • this upper mold has a cavity piece constituting the bottom of the cavity recess, a clamper constituting the side portion of the cavity recess, and a cavity piece relative to the clamper.
  • a configuration may be employed that includes a movable portion to be moved, and a suction portion that sucks and sucks the release film F disposed so as to cover the end face of the cavity piece and the end face of the clamper.
  • the film loader conveys the release film F in a flat state as well as the film loader 57 in the first embodiment, and the release film is positioned while the end face of the cavity piece and the end face of the clamper are positioned at the same height.
  • the F is placed flat on the end face of the cavity piece and the end face of the clamper. According to such a resin mold apparatus 100, even when the resin R and the resin R are not carried into the press unit 130, the resin mold apparatus 100 can be disposed while preventing the occurrence of wrinkles.
  • the resin supply unit 120 can also supply a liquid resin R.
  • the robot mechanism unit 180 may carry the workpiece W into the press unit 130.
  • the resin supply unit 120 can also supply a sheet-like resin R. In this case, even if the robot mechanism unit 180 superposes the sheet-like resin R supplied by the resin supply unit 120 on the release film F or the work W, or carries it into the press unit 130 with only this resin R. Good.
  • the work W may be a plate-like member such as a wafer itself on which the chip parts 11 and the bumps 11A are not mounted as long as there is a surface to be protected.
  • the surface of such a plate-like member may have a concavo-convex shape or may be a flat surface.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
PCT/JP2014/061014 2013-05-29 2014-04-18 樹脂モールド装置および樹脂モールド方法 WO2014192456A1 (ja)

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CN201480029820.1A CN105283294B (zh) 2013-05-29 2014-04-18 树脂模制装置和树脂模制方法
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JP2013115783A JP2014233882A (ja) 2013-05-31 2013-05-31 樹脂モールド装置及び樹脂モールド方法
JP2013-115783 2013-05-31
JP2013139424A JP6180206B2 (ja) 2013-07-03 2013-07-03 樹脂封止方法および圧縮成形装置
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JP6640003B2 (ja) * 2016-04-05 2020-02-05 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP6723185B2 (ja) * 2017-03-29 2020-07-15 Ｔｏｗａ株式会社 成形型、樹脂成形装置、樹脂成形方法、及び樹脂成形品の製造方法
JP6342566B1 (ja) * 2017-11-16 2018-06-13 アルファーデザイン株式会社 部品保持装置及び部品接合システム
JP6923423B2 (ja) * 2017-11-21 2021-08-18 Ｔｏｗａ株式会社 搬送装置、樹脂成形装置及び樹脂成形品の製造方法
JP6876637B2 (ja) * 2018-01-22 2021-05-26 Ｔｏｗａ株式会社 成形型、樹脂成形装置及び樹脂成形品の製造方法
JP7102238B2 (ja) * 2018-06-08 2022-07-19 Ｔｏｗａ株式会社 樹脂成形装置および樹脂成形品の製造方法
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NL2021845B1 (en) * 2018-10-22 2020-05-13 Besi Netherlands Bv Mould half and mould method for encapsulating electronic components mounted on a carrier including a dual support surface and a method for using such
JP7203414B2 (ja) * 2018-12-27 2023-01-13 アピックヤマダ株式会社 樹脂供給取出装置、ワーク搬送装置及び樹脂モールド装置
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KR102203781B1 (ko) 2021-01-15
SG11201508166RA (en) 2015-12-30
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