WO2014192168A1 - 電子回路部品実装システム - Google Patents
電子回路部品実装システム Download PDFInfo
- Publication number
- WO2014192168A1 WO2014192168A1 PCT/JP2013/072145 JP2013072145W WO2014192168A1 WO 2014192168 A1 WO2014192168 A1 WO 2014192168A1 JP 2013072145 W JP2013072145 W JP 2013072145W WO 2014192168 A1 WO2014192168 A1 WO 2014192168A1
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- WIPO (PCT)
- Prior art keywords
- component
- mounting
- head
- electronic circuit
- main body
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/028—Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
Definitions
- the invention of the present application is supplied to the head body, which is held by the mounting machine main body and is moved in the mounting machine main body by the head moving device, together with the mounting apparatus for mounting electronic circuit components by a plurality of component holders.
- the present invention relates to an electronic circuit component mounting system including at least one or more head-side feeders and a mounting device that holds and mounts electronic circuit components supplied by the head-side feeder.
- Patent Document 1 describes an electronic circuit component mounting machine including a plurality of mounting machine body side feeders 26 and a plurality of bulk feeders 18 as head side feeders, and an electronic circuit component mounting method using the same. Yes. Further, in Patent Document 2 below, electronic circuit components are taken out from a plurality of tape feeders 4a serving as mounting machine main body side feeders by a plurality of mounting heads 16 having a plurality of suction nozzles 16a and mounted on a substrate W. In the electronic circuit component mounting machine, it is described that the conveyance from the standby position of the substrate W to the mounting work execution position and the mounting preparation by the mounting head 16 are performed in parallel.
- Patent Document 1 According to the electronic circuit component mounting machine and the electronic circuit component mounting method described in Patent Document 1, it is necessary to move the mounting apparatus to the mounting machine body side feeder in order to take out the electronic circuit components from the plurality of bulk feeders 18. Therefore, in the electronic circuit component mounting machine described in Patent Document 2, the mounting preparation by the mounting head 16 and the loading of the substrate W are performed in parallel. Can be performed efficiently. Further, Patent Document 3 described below describes that a magnetic material provided on the surface of a chip capacitor is attracted to an electromagnet by a magnetic force and then the chip capacitor is mechanically held by an arm portion.
- the present invention has been made with the background described above as an object of further improving the electronic circuit component mounting machine and the electronic circuit component mounting method described in Patent Documents 1 to 3.
- the above-mentioned problems include a mounting machine main body, (a) a circuit base material transport and holding device that is held by the mounting machine main body and transports and fixes the circuit base material, and (b) the mounting machine main body.
- a head body that can be moved by the head moving device to an arbitrary position within a moving plane in the mounting machine body, and (c) at least one or more of the electronic circuit components that are held by the head body and supply electronic circuit components
- a head-side feeder and (d) the head body is provided with a plurality of component holders, and the plurality of component holders receive the electronic circuit components from the head-side feeder to receive the circuit base material transport and holding device.
- a mounting device for mounting on a circuit substrate held on the substrate (e) a control device for controlling the circuit substrate transport holding device, the head moving device, the head side feeder and the mounting device, and (f) component mounting.
- a control device for controlling the circuit substrate transport holding device, the head moving device, the head side feeder and the mounting device (f) component mounting.
- component mounting system includes the electronic circuit component and a control device that performs control so that the head-side feeder is in contact with the electronic circuit component.
- the component holder and the electronic circuit component positioned at the component mounting position, and the component positioned at the component suction position supplied by the head side feeder while the electronic circuit component and the circuit substrate are in contact with each other Since the control is performed so that the holder and the electronic circuit component and the electronic circuit component and the head-side feeder are in contact with each other, an effect of improving the efficiency of the mounting work can be obtained.
- FIG. 1 It is a perspective view which shows the electronic circuit component mounting system which is one Embodiment of claimable invention. It is a perspective view which removes the ceiling panel of one cover, and shows two mounting modules which are a part of the said electronic circuit component mounting system. It is a perspective view which shows the mounting head and head movement apparatus of the mounting apparatus of the said mounting module. It is a perspective view which shows the said mounting head, (a) is a figure which shows the mounting head provided with one nozzle holder, (b) is a figure which shows the mounting head provided with 12 nozzle holders. It is a perspective view which removes a cover and shows the mounting head provided with 12 said nozzle holders.
- FIG. 12 It is a perspective view which shows the nozzle holder of the mounting head provided with the said 12 nozzle holders, a suction nozzle, a raising / lowering apparatus, a valve switching apparatus, etc.
- FIG. 12 It is a perspective view which shows the nozzle holder of the mounting head provided with the said 12 nozzle holders, a suction nozzle, another raising / lowering apparatus, another valve switching apparatus, etc.
- FIG. It is a perspective view which shows the mounting head provided with the said 12 nozzle holders from the side in which the bulk feeder was provided. It is a figure which illustrates roughly the stop position of the suction nozzle by rotation of a rotation holding body in the mounting head provided with the said 12 nozzle holders.
- FIG. It is a block diagram which shows roughly the control part of the electronic circuit component mounting system shown in FIG. It is a top view which shows roughly the relative positional relationship of the electronic circuit and tape feeder which should be assembled in one of the said mounting modules.
- a mounting module 10 as an example of an electronic circuit component mounting machine includes a plurality of units that constitute a component mounting line 12.
- Each mounting module 10 includes an operation device 14, a display device (display) 16, and an individual control device.
- the individual control device is further controlled by the overall control device 22.
- the overall control device 22 also includes an operation device 24 and a display device (display) 26.
- the component mounting line 12 and the overall control device 22 constitute an electronic circuit component mounting system.
- FIG. 2 shows one structural unit of the component mounting line 12.
- two mounting modules 10 are supported by a common support base 28, and each mounting module 10 is close to each other in the width direction. However, it is supported by the support base 28 so as to be movable in the front-rear direction, and is pulled out forward one by one so that the worker can access the inside of each mounting module 10.
- Each mounting module 10 includes two front and rear substrate conveyors 32 and 34 supported by the main body frame 30, and a substrate support device that can be moved up and down individually is provided with respect to each substrate conveyor 32 and 34.
- the substrate holding devices 42 and 44 for holding the circuit board 46 in a fixed manner together with each part 34 are configured.
- Each mounting module 10 includes a plurality of tape feeders 48 that are detachably held on the main body frame 30 and supply one type of electronic circuit components (hereinafter, abbreviated as components), and one from each of the tape feeders 48. And a mounting device 54 for taking out the components and mounting them on the circuit board 46 held by the substrate holding devices 42 and 44.
- the mounting device 54 includes a mounting head 56 and a head moving device 58 that moves the mounting head 56 in the X-axis direction (left-right direction) and the Y-axis direction (front-back direction), as shown in an enlarged view in FIG. .
- the mounting head 56b includes a rotation holding body 68 that is rotated by a fixed angle by a holding body rotation motor 66.
- the rotation holding body 68 has a plurality of mounting units 70 that are movable in the axial direction at intervals of the fixed angle. Is held rotatably. Accordingly, each mounting unit 70 can be rotated about the rotation axis of the rotation holding body 68 by the rotation of the rotation holding body 68 and can rotate about its own axis.
- the absolute phase of the mounting unit 70 is controlled by the related control between the rotation of the unit rotation motor 72 and the rotation of the holder rotation motor 66.
- the plurality of mounting units 70 are lifted and lowered in the axial direction by lift drive members 76 and 77 (see FIGS. 6 and 7) that are lifted and lowered by the two unit lift motors 74 and 75, respectively.
- a suction nozzle 80 is detachably held at the lower end of each of the plurality of mounting units 70, and each suction nozzle 80 is lifted and lowered as each mounting unit 70 is lifted and lowered as the feeder main body side feeder.
- Components are held and taken out from the tape feeder 48 and a bulk feeder 90 (see FIGS. 7 and 8) as a head-side feeder, which will be described later, and mounted on the circuit board 46 held by the board holding devices 42 and 44.
- the rotary holding body 68 and the motors 66, 72, 74, 75, etc. are held by the head main body 82 shown in FIG. 5, and are attached and detached all at once by attaching / detaching the head main body 82 to / from the adapter 60 (see FIG. 3).
- the mounting module 10 can be divided into the mounting head 56 side and the mounting machine main body side to which it is attached / detached.
- the mounting machine main body side is supported by the main body frame 30 of the mounting module 10 and the main body frame 30.
- the electric control device of the mounting module 10 is installed in the support base 28. Therefore, it is appropriate to consider the portion of the support base 28 containing the electric control device as the mounting machine main body side.
- the holding and releasing of the components by the suction nozzle 80 are controlled by a negative pressure supply device and a positive pressure supply device (not shown) provided on the mounting machine main body side, and FIGS. 6 and 7 provided on the mounting head 56.
- the pressure switching units 84 and 85 hold and release parts by selectively supplying negative pressure and positive pressure to the suction nozzle 80 and releasing the suction nozzle 80 to the atmosphere by moving the valve spool 86 in the axial direction. To control.
- the plurality of tape feeders 48 supply the parts held on the part holding tape one by one, and the bulk feeder 90 receives the parts accommodated in the part accommodation chamber 92 shown in FIG. These are supplied from the component supply unit 96 at the tip of the guide passage 94 in a line.
- the component supply units 96 of the plurality of bulk feeders 90 are arranged in the Y-axis direction, and the component feeders 96 are selectively moved one by one by moving the bulk feeder 90 in the Y-axis direction by the feeder moving device 98. To the position facing the mounting unit 70.
- the mounting head 56 has a bulk component receiving position corresponding to the component supply unit 96 of the bulk feeder 90 and a tape component receiving position corresponding to the tip of the tape feeder 48, as shown in FIG.
- the tape component receiving position is also a component mounting position common to the tape component and the bulk component.
- the mounting head 56b includes a component imaging position between the bulk component receiving position and the tape component receiving position (component mounting position).
- the mounting head 56 b is configured such that the distance from the substrate holding devices 42 and 44 is changed by the cam 100 as the suction nozzle 80 rotates.
- the component imaging device 110 is provided at the maximum distance position farthest from 42 and 44.
- the component imaging device 110 includes a CCD camera 112 and a light guide device 114 which are imaging devices.
- the minimum distance stop position is the component mounting position where the electronic circuit component is mounted on the circuit board, and the component in the rotation direction (direction indicated by the arrow in FIG. 9) of the rotation holder 68 at the time of mounting.
- the distance maximum stop position that is located downstream from the mounting position and is closest to the component mounting position is the bulk component receiving position, and the downstream stop position that is 180 degrees away from the component mounting position is the component imaging position. ing.
- lift devices 120 and 122 are provided at positions corresponding to the component mounting position (tape component receiving position) and the bulk component receiving position of the head main body 82, respectively, and rotate the mounting unit 70.
- the body holding body 68 is moved back and forth in the axial direction and moved up and down.
- the elevating device 120 includes an elevating drive member 76 that is moved up and down by the unit elevating motor 74, and a circuit board in which the mounting unit 70 is held by the substrate holding devices 42 and 44 at the component mounting position. It is lowered toward 46 or toward the component feeder of the tape feeder 48. Further, as shown in FIG.
- the lifting device 122 includes a lifting drive member 77 that is lifted and lowered by the unit lifting motor 75, and lowers the mounting unit 70 toward the component supply unit 96 of the bulk feeder 90.
- the aforementioned pressure switching units 84 and 85 are provided, and the negative pressure and the positive pressure are selectively supplied to the suction nozzle 80 in accordance with the lifting and lowering of the mounting unit 70.
- the suction nozzle 80 is opened to the atmosphere, and the holding and releasing of parts are controlled.
- the stroke of the elevating device 120 is larger than that of the elevating device 122, when the suction nozzle 80 is lowered from the height at the component imaging position to the plane of the circuit board 46, there is a deviation in the plane direction of the circuit board 46. May occur. Accordingly, the deviation may be measured in advance by the image processing device 41 and the position of the suction nozzle 80 may be corrected when holding or mounting the component.
- the operations of the holder rotating motor 66, the unit rotating motor 72, the unit lifting motors 74 and 75, the pressure switching units 84 and 85, and the like are controlled by the individual control device 130 of each mounting module 10 shown in FIG.
- the individual control device 130 includes a head side control unit 132 and a main body side control unit 134, and the head side control unit 132 exchanges information and commands through communication with the communication unit 138 of the main body side control unit 134 in the communication unit 136.
- power is supplied from the main body side control unit 134 to the head side control unit 132 by a power line (not shown).
- the main body side control unit 134 can exchange information and commands with the overall control device 22 through its own communication unit 138 and communication unit 140.
- the configuration of the main body side control unit 134 shows only the parts necessary for the description of the claimable invention.
- each mounting module 10 can mount components supplied from either the tape feeder 48 or the bulk feeder 90 on the circuit board 46, but the components can be taken out from the feeders 48 and 90.
- a tape component 150 supplied from a tape feeder 48 indicated by a square mark and a bulk component 152 supplied from a bulk feeder 90 indicated by a circle mark on one circuit board 46 When it is necessary to mix the two, the difference in the circumstances of both feeders 48 and 90 is considered from the viewpoint of improving the efficiency of the mounting work. This will be described below.
- FIG. 12 shows a tape component 150 and a bulk component by a plurality of suction nozzles 80 (mounting units 70) that are sequentially rotated to a plurality of positions shown in FIG. 15 is a flowchart showing a part receiving order determination routine for determining a receiving order with 152.
- the component receiving order determination routine may be executed in any mounting module 10, but is executed by the overall control device 22 in this embodiment. Therefore, the overall control device 22 is provided with an electronic circuit board data storage unit 160 and a component receiving order determination unit 162 as shown in FIG.
- the electronic circuit board data storage unit 160 stores the types of tape components 150 and bulk components 152 (hereinafter abbreviated as components 150 and 152 unless otherwise specified) to be mounted by the component mounting line 12 and the coordinates of their mounting positions.
- the electronic circuit board data including the mounting posture (rotation position), and the component reception order determination unit 162 executes the component reception order determination routine shown in FIG. 12 for each of the plurality of mounting modules 10. It is a part to do. Based on the electronic circuit board data stored in the electronic circuit board data storage unit 160, the components 150 and 152 to be mounted by each mounting module 10 are determined, and the determined components 150 and 152 in each mounting module 10 are determined. The order of receipt is determined.
- the electronic circuit board data is transmitted from the host computer that manages information necessary for the work of the entire factory including the mounting line 12 by the operator controlling the operation device 24 while viewing the display on the display device 26, for example. 140 is stored in the electronic circuit board data storage unit 160.
- the components 150 and 152 to be mounted by each mounting module 10 are determined in principle so that the plurality of suction nozzles 80 held by the rotation holding body 68 of one mounting module 10 can be all the same. Done. This is because the work efficiency becomes higher.
- S21 to S26 are repeatedly executed, and the mounting of the tape component 150 and the receiving of the bulk component 152 are performed in parallel.
- S21 it is determined whether or not the component (the tape component 150 at this time) held by the suction nozzle 80 has reached the component mounting position in FIG. 9, but initially this determination is NO, and S23 It is determined whether or not the empty nozzle has reached the bulk component receiving position. If the determination is YES, one bulk component 12 is held in S24, but until the empty suction nozzle located at the component mounting position (tape component receiving position) reaches the bulk component receiving position S23. This determination is not YES, and it is determined whether or not the scheduled bulk part 152 has been received in S25.
- the rotation holding body 68 is rotated by one pitch in S26, and S21 and subsequent steps are executed again. If the determination in S21 is YES during the repetition of the above execution, one component is mounted in S22. If the determination in S23 is YES, one bulk component 152 is held in S24. Although it takes time to mount the components in S22 and hold the bulk component 152 in S24, the YES determination in S21 and S23 only triggers the start of execution of S22 and S24, and the execution of S22 and S24 ends. Since the next determination is not made after waiting, the mounting operation in S22 and the holding operation in S24 are performed substantially in parallel after the determinations in S21 and S23 are both YES.
- the tape component 150 While the tape component 150 reaches the component mounting position, the mounting of the tape component 150 and the holding of the bulk component 152 are performed in parallel, but the bulk component 152 reaches the component mounting position. If it arrives after that, it will be in the state in which reception and mounting of the bulk component 152 are performed in parallel. 15, the suction nozzle 80 (mounting unit 70) located at the component mounting position and the tape component 150 or the bulk component 152, and the tape component 150 or the bulk component 152 and the circuit board 46 are in contact with each other. In the meantime, control is performed so that the suction nozzle 80 (mounting unit 70) located at the bulk component receiving position and the bulk component 152, and the bulk component 152 and the bulk feeder 90 are in contact with each other.
- the suction nozzle 80 (mounting unit 70) positioned at the bulk component receiving position and the bulk component 152, and the suction nozzle 80 (mounting) positioned at the component mounting position while the bulk component 152 and the bulk feeder 90 are in contact with each other.
- the unit 70) and the tape component 150 or the bulk component 152, and the tape component 150 or the bulk component 152 and the circuit board 46 may be in contact with each other.
- the present invention can be applied when the holding of the tape part 150 and the holding of the bulk part 152 are performed simultaneously.
- the circuit board 46 referred to here includes solder printed on the circuit board, flux applied, and the like.
- the efficiency of the mounting operation is improved, and holding or mounting is performed in a state where the tape component 150 or the bulk component 152 is held, and therefore the suction nozzle 80 (mounting unit 70) Misalignment due to vibrations caused by raising and lowering is difficult.
- the execution of the component mounting routine proceeds to S27.
- S27, 28 mounting of one component 150, 152 (in many cases is a bulk component 152, but may be a tape component 150 when the number of bulk components 152 to be mounted is small).
- step S29 the presence / absence of the first re-reception bulk component 152 required is determined.
- S44 of the suction error detection routine it is determined whether or not there is a first stored one for each of the bulk parts 152.
- the re-reception part memory that is required also stores the parts 150 and 152 that require re-reception after the second time.
- S31 it is determined whether or not the mounting of all the components 150 and 152 held by the mounting head 56b is completed, but the initial determination is of course NO, and S27 and subsequent steps are repeatedly executed.
- the determination in S31 becomes YES
- S32 it is determined whether or not there are the parts 150 and 152 that are held in the suction nozzle 80 in an abnormal posture and stored in S43 of the aforementioned suction error detection routine as the parts to be discarded. If the determination is YES, all the parts that need to be discarded are discarded in S33. In many cases, the bulk component 152 is discarded, but the tape component 150 may also be discarded.
- S34 it is determined whether or not there is a tape component 150 stored as a re-reception required component in S44 of the suction error detection routine. If the determination is YES, all re-reception tape components required in S35 and 36 are determined. Re-acquisition and implementation are performed. As described above, the bulk component 152 is re-received in parallel with the mounting of the components 150 and 152, whereas the tape component 150 is re-received with the substrate holding devices 42 and 44 of the mounting head 56b and the tape feeder. In order to reduce the number of times of movement between the number 48 and the number of times as much as possible, they are collectively executed at the end.
- S37 and 38 are executed after re-receiving and mounting of the tape part 150 or when the determination in S34 is NO. It is determined whether or not any of the components 150 and 152 is stored in the re-reception required component memory as being required to be re-received for the second and subsequent times. Is displayed on the display device 16. The fact that one of the parts 150 and 152 is re-received once but the same parts 150 and 152 need to be received again is not a coincidence. Therefore, it is highly likely that it is necessary to investigate the cause, and the display device 16 displays that the cause should be investigated. This display is performed while clearly indicating which mounting module 10 is displayed on the display device 26 of the overall control device 22 together with or instead of the display of the mounting module 10 on the display device 16. Is also possible.
- each mounting module 10 has a portion that stores the change of the turning position, and determination at each step in the component mounting routine is executed based on the stored data of this portion.
- the holding and release of the components by the suction nozzle 80 are provided by the control of the negative pressure supply device and the positive pressure supply device (not shown) provided on the mounting machine main body side and the mounting head 56.
- Some head-side feeders supply components by magnetic force (FIG. 17), and electronic circuit components are often magnetic materials.
- the diameter of the hole for supplying the pressure of the suction nozzle 80 becomes small and it may be difficult to hold a stable electronic circuit component, and holding or separating by magnetic force is advantageous.
- the head-side feeder has an advantage that the component can supply only a magnetic material, that is, an appropriate component, by supplying the component by magnetic force.
- FIG. 17 will be described.
- the component case with passage 252 is positioned in the horizontal direction with respect to the head main body 82 by positioning the positioning pins 320 and 322 in the positioning holes 360 and 362.
- the clamp claws 376 of the clamp devices 372 and 374 are engaged with the engagement surfaces 324 and 326, so that the passage forming body 310 is brought into contact with the head main body 82, and the component case 252 with passage is used as the head main body 82.
- the turntable 340 is fitted into the recess 268, and the center of the circle defining the arc of the guide groove 266 coincides with the rotation axis of the turntable 340.
- the component 294 in the storage chamber 272 is attracted by the permanent magnet 346 and moved from the bottom to the top, and a part of the guide groove 266. And enters the guide passage 270 from the guide groove 266.
- the parts 294 that move as the permanent magnet 346 turns can fit into the guide groove 266, and the parts 294 that have moved near the boundary between the guide groove 266 and the guide passage 270 without fitting into the guide groove 266. Is scraped off by the scraping part 283 and falls into the storage chamber 272.
- the part 294 that has entered the guide passage 270 eventually enters the part passage 258 and moves to the part supply unit 316 in a state of being aligned in a row.
- illustration is omitted, the air in the component passage 258 is sucked by the air suction device and assists the movement of the component 294 to the component supply unit 316.
- the bulk part rolling device 392 is configured by the guide groove 266 and the scraping-off portion 283 to squeeze the parts 294, align them in a line, and enter the guide passage 270.
- the whirling device 392 cooperates with the bulk component driving device 338 configured by the rotating disk 340 and the rotating disk driving device 342 described above, and transfers the component 294 to the component channel 258 via the guide channel 270.
- a bulk component feeding device 254 is constructed.
- the component case 252 with a passage is separable from the bulk component driving device 338 and is detachably attached to the head body 82 by the component case attachment device 370 with a passage.
- the part case 252 with another passage is attached to the head main body 82 and is replaceable.
- the discarding of the components 150 and 152 is executed in S32 and 33 after the mounting of the components 150 and 152 is completed. This is because it is necessary to move the mounting head 56b to the component disposal position in order to discard the component, and in order to avoid a decrease in the efficiency of the mounting operation for the time required for the movement, it should be discarded.
- the suction nozzle 80 holding the part 150.152 cannot be used to hold another part. Further, the parts 150 and 152 held in an abnormal posture may fall in the middle. In order to avoid these disadvantages, it is possible to discard the components in the middle of receiving and mounting the components 150 and 152 repeatedly.
- the rotary holding body 68 is For example, when the rotation is greater than the set amount (set rotation angle), the discarding operation is executed.
- the mounting line 12 includes a plurality of mounting modules 10, and as described above, the determination of the components 150 and 152 to be mounted by one mounting module 10 is basically one mounting module. This is because the plurality of suction nozzles 80 held by the ten rotation holding bodies 68 are all the same, but there may be a mounting module 10 where this premise does not apply.
- the mounting operation on one circuit board 46 is performed by only one electronic circuit component mounting machine, a plurality of types of suction nozzles 80 are often attached. Even in such a case, the claimable invention can be applied.
- the tape component 150 if the tape component 150 is mounted first, the tape component 150 that requires a relatively long time is received and the circuit board 46 is carried into the mounting module 10 in parallel. It is possible and desirable. This feature is that “the component receiving order is determined so that the number of movements between the board holding devices 42 and 44 of the mounting head 56 b and the feeder main body side feeder such as the tape feeder 48 is minimized”. Can also be adopted separately. However, if the mounting of the tape component 150 and the mounting of the bulk component 152 are performed together, the number of times the mounting head 56b is moved between the substrate holding devices 42 and 44 and the tape feeder 48 which is the main body side feeder. From this point of view, the bulk component 152 may be mounted first.
- the receiving order of the tape component 150 and the bulk component 152 is not limited to that in the above embodiment, and the substrate holding devices 42 and 44 of the head main body 82 (mounting head 56b) by the head moving device 58 and the tape feeder.
- the order of receiving the tape component 150 and the bulk component 152 may be determined so that the number of movements between the tape component 150 and the bulk component 152 is as small as possible.
- the number of mounted tape components 150 is 25, and the number of mounted bulk components 152 is 10, for example, (1) receiving 12 tape components ⁇ mounting ⁇ Receiving 12 tape parts ⁇ Mounting ⁇ Receiving 1 tape part ⁇ Mounting ⁇ Receiving 10 bulk parts ⁇ Mounting (2) Receiving 12 tape parts ⁇ Mounting ⁇ Receiving 1 tape part ⁇ Mounting ⁇ Bulk part 10
- the receiving order of the first type and bulk parts is different, but the number of movements of the mounting head 56b for receiving the tape parts 150 is the same.
- the number of received tape parts 150 is set to the suction nozzle 80
- the number of movements of the mounting head 56b is the same even if it is not the same as the number of (4), or (4) receiving 8 tape parts ⁇ mounting and receiving 3 bulk parts ⁇ mounting ⁇ receiving 8 tape parts ⁇ mounting and bulk parts If the bulk parts 152 are received during the mounting of the tape parts 150, such as receiving three pieces ⁇ mounting ⁇ receiving nine tape parts ⁇ mounting and receiving four bulk parts ⁇ mounting, the bulk parts 152 are collected together.
- the number of movements of the mounting head 56b is the same, and there is no significant difference in the total time required for the mounting operation. Rather, for example, in the case of (4) above, if the receiving of the bulk part is performed together with the receiving of the tape part whose mounting position is close to the mounting position of the bulk part, the effect of improving the efficiency of the mounting work can be obtained. .
- the plurality of bulk feeders 90 are moved by the feeder moving device 98 so that the component supply units 96 are selectively moved to a common tape component receiving position.
- a plurality of bulk feeders are mounted on the head main body so that their respective component supply sections correspond to the plurality of swiveling positions of the suction nozzle 80, respectively. It is also possible to adopt a fixed aspect.
- the mounting head including the plurality of suction nozzles 80 has the rotation holding body 68.
- the plurality of suction nozzles are held along a straight line, and the suction nozzles Electronic circuit component mounting machine equipped with a non-rotating type mounting head, or an electronic circuit component mounting system including such an electronic circuit component mounting machine, etc.
- the claimable invention can be applied to an electronic circuit component mounting method using a mounting machine or a mounting system.
Abstract
Description
電子回路部品実装機の一例としての実装モジュール10は、図1に示すように、複数台が並べられて部品実装ライン12を構成する。各実装モジュール10はそれぞれ操作装置14,表示装置(ディスプレイ)16および個別制御装置を備えているが、個別制御装置はさらに統括制御装置22により統括制御される。統括制御装置22も操作装置24および表示装置(ディスプレイ)26を備えている。上記部品実装ライン12と統括制御装置22とにより電子回路部品実装システムが構成されている。
上記吸着ノズル80による部品の保持,解放は、上記実装機本体側に設けられた負圧供給装置および正圧供給装置(図示省略)の制御と、実装ヘッド56に設けられた図6および図7に示す圧力切換ユニット84,85の制御とにより行われる。圧力切換ユニット84,85はバルブスプール86を軸方向に移動させることにより、吸着ノズル80への負圧,正圧の選択的な供給と吸着ノズル80の大気への開放とにより部品の保持,解放を制御する。
なお、昇降装置120のストロークは,昇降装置122に比較して大きいため、吸着ノズル80を部品撮像位置での高さから回路基板46の平面まで下降させるときに回路基板46の平面方向にズレが生じることがある。したがって、そのズレをあらかじめ画像処理装置41により測定しておき部品の保持又は実装の際に吸着ノズル80の位置を補正してもよい。
なお、電子回路板データは、例えば、オペレータが表示装置26の表示を見つつ操作装置24を制御することにより、実装ライン12を含む工場全体の作業に必要な情報を管理するホストコンピュータから通信部140を経て電子回路板データ記憶部160に記憶させられる。また、各実装モジュール10により実装されるべき部品150,152の決定は、原則的に、1つの実装モジュール10の回転保持体68に保持される複数の吸着ノズル80が全て同じもので済むように行われる。その方が、作業能率が高くなるからである。
さらに、図15により詳細に説明すると、部品実装位置に位置する吸着ノズル80(実装ユニット70)とテープ部品150若しくはバルク部品152、かつ、テープ部品150若しくはバルク部品152と回路基板46が接している間に、バルク部品受取位置に位置する吸着ノズル80(実装ユニット70)とバルク部品152、かつ、バルク部品152とバルクフィーダ90が接するように制御を行う。この制御はバルク部品受取位置に位置する吸着ノズル80(実装ユニット70)とバルク部品152、かつ、バルク部品152とバルクフィーダ90が接している間に、部品実装位置に位置する吸着ノズル80(実装ユニット70)とテープ部品150若しくはバルク部品152、かつ、テープ部品150若しくはバルク部品152と回路基板46が接するようにしてもよい。加えて、テープ部品150の保持とバルク部品152の保持が同時に行われるときにも適用することができる。なお、ここで言う回路基板46には、回路基板上に印刷される半田や塗布されるフラックス等が含まれる。
このような制御を行うことにより、実装作業の能率が向上し、テープ部品150若しくはバルク部品152が狭持されている状態にて保持又は実装が行われるため、吸着ノズル80(実装ユニット70)の昇降などを起因とする振動等によるズレが生じにくい。
このような実施態様においては、ヘッド側フィーダは磁力により部品供給を行うことによって、部品が磁性材料つまり適切な部品のみを供給できるという利点がある。
しかし、テープ部品150の実装とバルク部品152の実装とがそれぞれまとめて行われるようにすれば、実装ヘッド56bを基板保持装置42,44と本体側フィーダたるテープフィーダ48との間で移動させる回数を少なくできて望ましく、その観点からすればバルク部品152の実装が先に行われるようにしてもよい。
なお、バルク部品152の実装がテープ部品150の実装より前に行われる場合には、テープ部品150の実装開始時に、回転保持体68の複数の吸着ノズル80の一部のものが既にバルク部品152を保持していることがあり、その状態では受け取り得るテープ部品150の数が、回転保持体68の吸着ノズル80の全数より少なくなり、そのために回転保持体68のテープフィーダ48への移動回数が増加してしまう可能性がある。しかし既に保持されているバルク部品の実装終了後に、回転保持体68がテープ部品150を受け取るべくテープフィーダ48群に向かって移動させられるようにすればそのような事態を回避し得る。
例えば、実装ヘッド56bの吸着ノズル80が12個、テープ部品150の実装数が25個、バルク部品152の実装数が10個の場合を例にとれば、(1)テープ部品12個受取り→実装→テープ部品12個受取り→実装→テープ部品1個受取り→実装→バルク部品10個受取り→実装の場合と、(2)テープ部品12個受取り→実装→テープ部品1個受取り→実装→バルク部品10個受取り→実装→テープ部品12個受取り→実装の場合とでは、第1種,バルク部品の受取順序は異なるが、実装ヘッド56bのテープ部品150受取りのための移動回数は同じである。また、(3)テープ部品8個受取り→実装→テープ部品8個受取り→実装→テープ部品9個受取り→実装→バルク部品10個受取り→実装のように、テープ部品150の受取り数を吸着ノズル80の数と同じにしなくても、実装ヘッド56bの移動回数は同じであり、あるいは(4)テープ部品8個受取り→実装およびバルク部品3個受取り→実装→テープ部品8個受取り→実装およびバルク部品3個受取り→実装→テープ部品9個受取り→実装およびバルク部品4個受取り→実装というように、テープ部品150の実装中にバルク部品152の受取りを行わせるのであれば、バルク部品152をまとめて受け取らせなくても実装ヘッド56bの移動回数は同じであって、実装作業に要する総時間に大きな差は生じない。
むしろ、例えば上記(4)の場合に、バルク部品の受取りを、バルク部品の実装位置と実装位置が近いテープ部品の受取りと共に行われるようにすれば、実装作業の能率が向上する効果が得られる。
また、前記実施形態においては、複数の吸着ノズル80を備えた実装ヘッドが回転保持体68を有するものとされていたが、例えば、複数の吸着ノズルを一直線に沿って保持し、それら吸着ノズルから選定されるものに部品の受取りおよび実装を行わせるもの等、非回転型の実装ヘッドを備えた電子回路部品実装機、あるいはそのような電子回路部品実装機を含む電子回路部品実装システム、あるいはそれら実装機または実装システムを用いた電子回路部品実装方法に本請求可能発明を適用することも可能である。
Claims (7)
- 実装機本体と、(a)その実装機本体に保持され、回路基材を搬送するとともに固定して保持する回路基材搬送保持装置と、(b)前記実装機本体に対して、ヘッド移動装置により、前記実装機本体内の移動平面内の任意の位置へ移動させられ得るヘッド本体と、(c)そのヘッド本体に保持され、電子回路部品を供給する少なくとも1つ以上のヘッド側フィーダと、(d)前記ヘッド本体には、複数の部品保持具が備えられ、それら複数の部品保持具により、前記ヘッド側フィーダから前記電子回路部品を受け取って前記回路基材搬送保持装置に保持された回路基材に実装する実装装置と、(e)前記回路基材搬送保持装置,前記ヘッド移動装置,前記ヘッド側フィーダおよび前記実装装置を制御する制御装置と、(f) 部品実装位置に位置する部品保持具と電子回路部品、かつ、該電子回路部品と前記回路基材が接している間に、前記ヘッド側フィーダにより供給される部品吸着位置に位置する部品保持具と電子回路部品、かつ、該電子回路部品と前記ヘッド側フィーダが接するように制御を行う制御装置とを含む電子回路部品実装システム。
- 請求項1に記載の電子回路部品実装システムにおいて、前記部品実装位置と前記ヘッド側フィーダにより供給される部品吸着位置はヘッド本体上において前記実装機本体内の移動平面上の異なる位置に設けられることを特徴とする電子回路部品実装システム。
- 請求項1又は請求項2に記載の電子回路部品実装システムにおいて、前記実装機本体内に設けられる実装機側フィーダから電子回路部品を受け取って前記回路基材搬送保持装置に保持された回路基材に実装する実装装置が備えられ、前記部品実装位置に位置する前記部品保持具が前記実装機側フィーダから電子回路部品を受け取ることを特徴とする電子回路部品実装システム。
- 請求項1乃至請求項3に記載の電子回路部品実装システムにおいて、前記部品実装位置に位置する前記部品保持具が、前記回路基材搬送保持装置に保持された回路基材に実装する際、又は、前記実装機側フィーダから電子回路部品を受け取る際に、昇降軸傾き補正を行う制御装置を備えたこと特徴とする電子回路部品実装システム。
- 請求項1乃至請求項4に記載の電子回路部品実装システムにおいて、前記部品保持具は電気的に磁力を制御することにより電子回路部品を保持、又は、離間することを特徴とする電子回路部品実装システム。
- 請求項5に記載の電子部品回路実装システムにおいて、前記ヘッド側フィーダは磁力により部品供給を行うことを特徴とする電子回路部品実装システム。
- 実装機本体と、(a)その実装機本体に保持され、回路基材を搬送するとともに固定して保持する回路基材搬送保持装置と、(b)前記実装機本体に対して、ヘッド移動装置により、前記実装機本体内の移動平面内の任意の位置へ移動させられ得るヘッド本体と、(c)そのヘッド本体に保持され、電子回路部品を供給する少なくとも1つ以上のヘッド側フィーダと、(d)前記ヘッド本体には、複数の部品保持具が備えられ、それら複数の部品保持具により、前記ヘッド側フィーダから前記電子回路部品を受け取って前記回路基材搬送保持装置に保持された回路基材に実装する実装装置と、(e)前記回路基材搬送保持装置,前記ヘッド移動装置,前記ヘッド側フィーダおよび実装装置を制御する制御装置と、(f) 前記ヘッド側フィーダにより供給される部品吸着位置に位置する部品保持具と電子回路部品、かつ、該電子回路部品と前記ヘッド側フィーダが接している間に、部品実装位置に位置する部品保持具と電子回路部品、かつ、該電子回路部品と前記回路基材が接するように制御を行う制御装置とを含む電子回路部品実装システム。
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US10039218B2 (en) | 2018-07-31 |
EP3007534A4 (en) | 2017-01-18 |
EP3007534B1 (en) | 2020-12-30 |
CN105247976B (zh) | 2018-12-21 |
CN105247976A (zh) | 2016-01-13 |
EP3007534A1 (en) | 2016-04-13 |
US20160128246A1 (en) | 2016-05-05 |
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