WO2014083718A1 - 配線基板 - Google Patents
配線基板 Download PDFInfo
- Publication number
- WO2014083718A1 WO2014083718A1 PCT/JP2013/003341 JP2013003341W WO2014083718A1 WO 2014083718 A1 WO2014083718 A1 WO 2014083718A1 JP 2013003341 W JP2013003341 W JP 2013003341W WO 2014083718 A1 WO2014083718 A1 WO 2014083718A1
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- WO
- WIPO (PCT)
- Prior art keywords
- wiring
- connection terminal
- layer
- solder resist
- resist layer
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
- H01L23/49844—Geometry or layout for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0594—Insulating resist or coating with special shaped edges
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0597—Resist applied over the edges or sides of conductors, e.g. for protection during etching or plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
前記接続端子と前記配線との材料が同じであることを特徴とする。
本発明によれば、接続端子の材料と、配線の材料が同じであるため、接続端子と配線との接続信頼性がさらに向上する。
め形成しておく。そして、従来公知の手法に従って無電解銅めっき及び電解銅めっきを行うことでスルーホール23内壁にスルーホール導体24を形成し、銅張積層板の両面に銅めっき層を形成する(図5(a)参照)。
~図13を参照して説明した実施形態に係る配線基板100では、配線L2は、直線形状であったが、接続端子T1を、配線L2に配線幅が太くなった幅太部L2a(図14(a)参照)又は配線幅が細くなった幅細部L2b(図14(b)参照)を形成し、該幅太部L2a又は幅細部l2bを含む位置に接続端子T1を形成するようにしてもよい。このような位置に接続端子T1を形成することで、接続端子T1と配線L2とが当接する面積が大きくなる。その結果、接続端子T1と配線L2との接続信頼性がより向上する。
Claims (5)
- 絶縁層及び導体層がそれぞれ1層以上積層された積層体と、
前記積層体上に形成された配線と、
前記配線上に直接形成され、前記配線の両側面のうち少なくとも一方の側面と当接する柱状の接続端子と、
前記配線を覆い、前記接続端子の少なくとも一部を露出させるソルダーレジスト層と、 を備え、
前記接続端子が形成される位置における前記配線の幅は、前記接続端子の前記幅方向における長さ未満であることを特徴とする配線基板。 - 前記接続端子と前記配線との材料が同じであることを特徴とする請求項1に記載の配線基板。
- 前記配線の上面に対向する前記接続端子の下面は、前記配線の上面と当接する当接面と前記配線の上面と当接しない離間面とを有し、前記離間面と前記配線の上面との間が前記ソルダーレジスト層により充填されていることを特徴とする請求項1又は請求項2に記載の配線基板。
- 前記接続端子は、前記配線の一部をなす配線幅が太くなった幅太部又は配線幅が細くなった幅細部を含む位置に形成されていることを特徴とする請求項1乃至請求項3のいずれかに記載の配線基板。
- 前記接続端子は、前記配線の両側面と当接していることを特徴とする請求項1乃至請求項4のいずれかに記載の配線基板。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/647,212 US20150313015A1 (en) | 2012-11-27 | 2013-05-27 | Wiring board |
EP13858236.6A EP2927950B1 (en) | 2012-11-27 | 2013-05-27 | Wiring board |
CN201380061988.6A CN104823275B (zh) | 2012-11-27 | 2013-05-27 | 布线基板 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012258279A JP5913063B2 (ja) | 2012-11-27 | 2012-11-27 | 配線基板 |
JP2012-258279 | 2012-11-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014083718A1 true WO2014083718A1 (ja) | 2014-06-05 |
Family
ID=50827385
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2013/003341 WO2014083718A1 (ja) | 2012-11-27 | 2013-05-27 | 配線基板 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20150313015A1 (ja) |
EP (1) | EP2927950B1 (ja) |
JP (1) | JP5913063B2 (ja) |
KR (1) | KR20150087298A (ja) |
CN (1) | CN104823275B (ja) |
TW (1) | TWI566649B (ja) |
WO (1) | WO2014083718A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5795415B1 (ja) * | 2014-08-29 | 2015-10-14 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
US10431533B2 (en) * | 2014-10-31 | 2019-10-01 | Ati Technologies Ulc | Circuit board with constrained solder interconnect pads |
US9520352B2 (en) * | 2014-12-10 | 2016-12-13 | Shinko Electric Industries Co., Ltd. | Wiring board and semiconductor device |
KR102312314B1 (ko) * | 2015-01-28 | 2021-10-13 | 삼성디스플레이 주식회사 | 터치 센서 장치 및 그 제조 방법 |
KR102320639B1 (ko) * | 2015-02-04 | 2021-11-02 | 삼성디스플레이 주식회사 | 터치 스크린 패널 및 이의 제조 방법 |
US10039185B2 (en) * | 2016-04-15 | 2018-07-31 | Kinsus Interconnect Technology Corp. | Manufacturing method of landless multilayer circuit board |
CN106102303B (zh) * | 2016-06-28 | 2019-09-13 | Oppo广东移动通信有限公司 | Pcb板及具有其的移动终端 |
JP7034677B2 (ja) * | 2017-11-17 | 2022-03-14 | ソニー・オリンパスメディカルソリューションズ株式会社 | 医療用回路基板及び医療機器 |
JP2022015755A (ja) * | 2020-07-09 | 2022-01-21 | イビデン株式会社 | 配線基板 |
US20220199503A1 (en) * | 2020-12-21 | 2022-06-23 | Intel Corporation | Novel lga architecture for improving reliability performance of metal defined pads |
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2012
- 2012-11-27 JP JP2012258279A patent/JP5913063B2/ja not_active Expired - Fee Related
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2013
- 2013-05-27 US US14/647,212 patent/US20150313015A1/en not_active Abandoned
- 2013-05-27 WO PCT/JP2013/003341 patent/WO2014083718A1/ja active Application Filing
- 2013-05-27 KR KR1020157015843A patent/KR20150087298A/ko active IP Right Grant
- 2013-05-27 CN CN201380061988.6A patent/CN104823275B/zh active Active
- 2013-05-27 EP EP13858236.6A patent/EP2927950B1/en active Active
- 2013-09-10 TW TW102132521A patent/TWI566649B/zh active
Patent Citations (12)
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JPH09306952A (ja) * | 1996-03-13 | 1997-11-28 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
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Publication number | Publication date |
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TW201424482A (zh) | 2014-06-16 |
EP2927950B1 (en) | 2022-02-16 |
TWI566649B (zh) | 2017-01-11 |
US20150313015A1 (en) | 2015-10-29 |
JP5913063B2 (ja) | 2016-04-27 |
CN104823275A (zh) | 2015-08-05 |
EP2927950A4 (en) | 2016-07-27 |
JP2014107371A (ja) | 2014-06-09 |
CN104823275B (zh) | 2018-04-06 |
EP2927950A1 (en) | 2015-10-07 |
KR20150087298A (ko) | 2015-07-29 |
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