WO2014024455A1 - 表示パネル - Google Patents
表示パネル Download PDFInfo
- Publication number
- WO2014024455A1 WO2014024455A1 PCT/JP2013/004705 JP2013004705W WO2014024455A1 WO 2014024455 A1 WO2014024455 A1 WO 2014024455A1 JP 2013004705 W JP2013004705 W JP 2013004705W WO 2014024455 A1 WO2014024455 A1 WO 2014024455A1
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- WIPO (PCT)
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- sealing material
- frame region
- display panel
- dummy structure
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
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- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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- G02F1/1339—Gaskets; Spacers; Sealing of cells
- G02F1/13394—Gaskets; Spacers; Sealing of cells spacers regularly patterned on the cell subtrate, e.g. walls, pillars
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- G—PHYSICS
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/28—Adhesive materials or arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
Definitions
- the present invention relates to a display panel such as a liquid crystal display panel in which a pair of substrates are overlapped at a predetermined interval and liquid crystal is sealed in a gap between the pair of substrates.
- a liquid crystal display panel includes a pair of substrates disposed opposite to each other (that is, a TFT (Thin Film Transistor) substrate and a CF (Color Filter) substrate), a liquid crystal layer provided between the pair of substrates, A pair of substrates are bonded to each other, and a sealing material provided in a frame shape is provided between the substrates to enclose liquid crystal.
- a TFT Thin Film Transistor
- CF Color Filter
- Such a liquid crystal display panel is used in mobile devices such as mobile phone devices, portable information terminal devices, and portable game devices.
- this mobile device is strongly required to expand the pixel area with respect to the liquid crystal display panel from the viewpoint of easy carrying, miniaturization and thinning. Therefore, in order to achieve such enlargement of the pixel area with respect to the liquid crystal display panel, it is necessary to make the outer portion (that is, the frame area) of the display area of the liquid crystal display panel as narrow as possible. That is, it is necessary to narrow the frame of the liquid crystal display panel.
- the most effective method for forming the sealing material is to form a sealing material having the same width so as to surround the display area. Therefore, the sealing material for a wide frame area adjacent to the terminal area is also a narrow frame. It is formed with the same width as the region sealant.
- a terminal area in which a plurality of terminals for receiving signals from the outside are formed, a display area for displaying an image, and a frame area provided around the display area, and a sealing material is provided so as to surround the display area
- a liquid crystal display panel that is formed in a frame shape and in which a sealing material having a certain height is formed in a wide frame region adjacent to a terminal region and a narrow frame region (see, for example, Patent Document 1).
- liquid crystal display panel formed by linearly applying a sealing material having a certain width so as to surround the display region on the surface of either the TFT substrate or the CF substrate (for example, , See Patent Document 2).
- the sealing material in the wide frame region is formed with the same width as the sealing material in the narrow frame region as in the display panels described in Patent Documents 1 and 2, in the display panel having the narrow frame region, the wide frame region
- the width of the sealing material at is limited to the width of the sealing material in the narrow frame region, and the sealing material having the same width as the width in the narrow frame region is formed in the wide frame region. It is the same in the wide frame area and the narrow frame area. However, since the wide frame region is adjacent to the terminal region, it is necessary to make the adhesive strength stronger than the narrow frame region.
- the present invention has been made in view of the above-described problems, and an object thereof is to provide a display panel capable of realizing a narrow frame by preventing a decrease in adhesive strength due to a sealing material.
- a display panel of the present invention includes a first substrate, a second substrate disposed opposite to the first substrate, and a display element provided between the first substrate and the second substrate. And a terminal area defined along one side of the first substrate, a display area for displaying an image, a first frame area that is defined around the display area and is adjacent to the terminal area, and is wider than the first frame area.
- a dummy structure that overlaps with the sealing material in a plan view is provided on at least one of the first substrate side and the second substrate side of the first frame region.
- the first substrate and the second substrate are bonded to each other using the sealing material by sandwiching the sealing material between the first substrate and the second substrate and performing the pressure treatment.
- the sealing material in the first frame region is compressed by the dummy structure, so that the width of the sealing material is increased in the first frame region.
- the width can be increased (that is, the thickness can be increased).
- the sealing material having an optimum width can be formed to form the sealing material having a width sufficient to ensure the adhesive strength.
- a wide sealing material can be formed without being restricted by the width of the sealing material in the second frame region.
- the dummy structure may be provided on the first substrate side of the first frame region, and the sealing material may be provided so as to cover the dummy structure.
- the first substrate includes a first insulating substrate and a first planarization film provided on the first insulating substrate, and a through groove is formed in the dummy structure,
- the dummy structure may be provided on the surface of the first planarization film, and the sealing material may be in contact with the first planarization film via the through groove.
- the contact area between the sealing material provided so as to cover the dummy structure and the first planarization film is increased, so that the dummy structure formed on the first planarization film is the first planarization. It is possible to prevent peeling from the chemical film.
- the first substrate may have a photo spacer provided on the first planarization film, and the dummy structure may be formed of the same material as the photo spacer.
- the dummy structure can be formed simultaneously with the photo spacer, so that the dummy structure can be provided without increasing the number of manufacturing steps.
- the dummy structure is provided on the second substrate side of the first frame region, and the second substrate is provided so as to cover the dummy structure in the first frame region, You may have the 2nd planarization film
- the seal material in the first frame region is compressed by the dummy structure and the second planarization film.
- the width of the material can be further increased.
- the second substrate has a second insulating substrate and a black matrix provided on the second insulating substrate, the through-groove is formed in the dummy structure, and the first frame In the region, the dummy structure is provided on the surface of the black matrix, and the second planarization film is provided so as to cover the dummy structure and the black matrix, and is in contact with the black matrix through the through groove. May be.
- the second substrate may have a colored layer provided on the second insulating substrate, and the dummy structure may be formed of the same material as the colored layer.
- the dummy structure can be formed at the same time as the colored layer. Therefore, the dummy structure can be provided without increasing the number of manufacturing steps.
- Another display panel of the present invention includes a first substrate, a second substrate disposed opposite to the first substrate, a display element provided between the first substrate and the second substrate, and a first substrate.
- the first substrate and the second substrate are bonded to each other using the sealing material by sandwiching the sealing material between the first substrate and the second substrate and performing the pressure treatment.
- the sealing material in the second frame region is hardly compressed by the first planarization film (or the second planarization film).
- the width of the sealing material can be reduced (that is, the thickness can be reduced).
- the first frame region has a width sufficient to ensure adhesive strength by forming a seal material having an optimum width (that is, having a wide width) when forming the seal material.
- a sealing material can be formed, and in the second frame region, a narrow sealing material that can cope with the narrowing of the frame is formed without being restricted by the width of the sealing material in the first frame region. can do.
- the groove may be a through groove.
- the compressive force of the first planarizing film (or the second planarizing film) on the sealing material in the second frame region can be further reduced. Therefore, the width of the sealing material can be further reduced in the second frame region.
- the groove may be a concave groove.
- the concave groove is formed in the first planarization film
- the first substrate has a first insulating substrate and an insulating film provided on the first insulating substrate
- the first planarizing film may be provided on the surface of the insulating film so as to cover the insulating film, and the concave groove may be disposed between the sealing material and the insulating film.
- the concave groove is formed in the second planarization film
- the second substrate has a second insulating substrate, and a black matrix provided on the second insulating substrate
- the second planarizing film may be provided on the surface of the black matrix so as to cover the black matrix, and a concave groove may be disposed between the sealing material and the black matrix.
- the display panel of the present invention and other display panels have an excellent characteristic that a narrow-frame display panel that can prevent a decrease in adhesive strength due to the sealing material can be obtained. Therefore, the present invention can be suitably used for a display panel in which the display element is a liquid crystal display element or an organic EL display element.
- FIG. 2 is a cross-sectional view taken along the line AA in FIG.
- FIG. 3 is a cross-sectional view taken along the line BB in FIG. 1 is a plan view showing a mother substrate for a TFT substrate of a liquid crystal display panel according to a first embodiment of the present invention.
- 1 is a plan view showing a mother substrate for a CF substrate of a liquid crystal display panel according to a first embodiment of the present invention. It is a top view for demonstrating the formation method of the sealing material of the liquid crystal display panel which concerns on the 1st Embodiment of this invention.
- FIG. 13 is a cross-sectional view taken along line EE in FIG. 12. It is a top view of the liquid crystal display panel which concerns on the 5th Embodiment of this invention.
- FIG. 15 is a cross-sectional view taken along line LL in FIG. 14. It is a top view of the liquid crystal display panel which concerns on the 6th Embodiment of this invention. It is GG sectional drawing of FIG. It is a top view of the liquid crystal display panel which concerns on the 7th Embodiment of this invention. It is HH sectional drawing of FIG. It is a top view of the liquid crystal display panel which concerns on the 8th Embodiment of this invention. It is II sectional drawing of FIG. It is a top view of the liquid crystal display panel which concerns on the modification of this invention. It is sectional drawing of the liquid crystal display panel which concerns on the modification of this invention. It is sectional drawing of the liquid crystal display panel which concerns on the modification of this invention. It is sectional drawing of the liquid crystal display panel which concerns on the modification of this invention.
- FIG. 1 is a plan view of a liquid crystal display panel according to the first embodiment of the present invention
- FIG. 2 is a cross-sectional view taken along the line AA of FIG.
- FIG. 3 is a cross-sectional view taken along the line BB of FIG.
- the liquid crystal display panel 1 includes a TFT substrate 10 that is a first substrate, a CF substrate 20 that is a second substrate facing the TFT substrate 10, and the TFT substrate 10 and the CF substrate 20.
- a liquid crystal layer 25 provided therebetween, and a sealing material 26 provided in a frame shape for adhering the TFT substrate 10 and the CF substrate 20 to each other and enclosing the liquid crystal layer 25 are provided.
- the sealing material 26 is formed so as to go around the liquid crystal layer 25, and the TFT substrate 10 and the CF substrate 20 are bonded to each other via the sealing material 26.
- the seal material 26 has a cell gap (that is, between the TFT substrate 10 and the CF substrate 20) in the frame region (the wide frame region F 1 and the narrow frame region F 2 ).
- the spacer 35 is provided for regulating the distance.
- the TFT substrate 10 protrudes from the CF substrate 20 on the upper side, and a plurality of displays such as gate lines and source lines to be described later are formed in the protruding region.
- a plurality of displays such as gate lines and source lines to be described later are formed in the protruding region.
- pads for receiving signals and pads for mounting ICs are formed, and terminal regions T for mounting FPCs and ICs for receiving control signals are formed.
- the liquid crystal display panel 1 has a so-called “three-side free structure” in which the terminal region T is defined along one side (that is, the upper side Ef) of the TFT substrate 10 and the terminal region T is arranged only on the one side. It has become.
- a display area D for displaying an image is defined in an area where the TFT substrate 10 and the CF substrate 20 overlap.
- the display area D is configured by arranging a plurality of pixels, which are the minimum unit of an image, in a matrix.
- a frame area of four sides on which the sealing material 26 is arranged is defined. As shown in FIGS. 1 to 3, one side of this frame area is located on the terminal area T side. a defined wide wide frame area F 1 width, the other three sides, has a narrow narrow frame region F 2 width than the wide frame region F 1.
- the widths of the three narrow frame regions F 2 other than the wide frame region F 1 do not have to be the same width, for example, one narrow frame region of the three side narrow frame regions F 2.
- the width of F 2 may be narrower than the width of the narrow frame region F 2 of the other two sides.
- one side of the width of a narrow frame region F 2 may be wider than the width of the narrow frame region F 2 of the other two sides.
- the TFT substrate 10 includes, for example, an insulating substrate 51 such as a glass substrate or a plastic substrate, a base coat film (not shown) provided on the insulating substrate 51, and a semiconductor provided on the base coat film.
- a film and a gate insulating film (both not shown) and a plurality of gate lines (not shown) provided so as to extend in parallel to each other are provided.
- the TFT substrate 10 includes an interlayer insulating film (not shown) provided so as to cover each gate line, and a plurality of TFT substrates 10 provided on the interlayer insulating film so as to extend in parallel to each other in a direction orthogonal to each gate line.
- a source line (not shown) and a plurality of TFTs (not shown) provided for each gate line of the display region D and each intersection of the source lines, that is, for each pixel are provided.
- the TFT substrate 10 includes a gate driver circuit (not shown) mounted in the above-described frame region, a planarizing film 52 provided so as to cover each TFT and each source line, and a matrix on the planarizing film 52. And a plurality of pixel electrodes 27 (see FIG. 2) connected to each TFT, and an alignment film (not shown) provided so as to cover each pixel electrode 27.
- the CF substrate 20 is provided between an insulating substrate 53 such as a glass substrate or a plastic substrate, a black matrix 54 provided on the insulating substrate 53, and each lattice of the black matrix 54. And a color filter 56 including a colored layer 55 such as a red layer R, a green layer G, and a blue layer B.
- the CF substrate 20 includes a planarizing film 57 provided so as to cover the black matrix 54 and the color filter 56, a common electrode 29 (see FIG. 2) provided on the planarizing film 57, and the planarizing film 57.
- a photo spacer 58 provided in a columnar shape on the top and an alignment film (not shown) provided so as to cover the common electrode 29 are provided.
- the photo spacer 58 may be provided on the TFT substrate 1 side.
- a color filter 56 composed of a black matrix 54 and a colored layer 55 is provided in the display region D.
- the colored layer 55 is formed of, for example, an acrylic photosensitive resin. After applying the photosensitive resin on the insulating substrate 53 on which the black matrix 54 is formed, the colored layer 55 is exposed through a photomask, and then developed. Then, it is formed by patterning.
- the black matrix 54 is provided between the adjacent colored layers 55 in the display region D, and has a role of partitioning the plurality of types of colored layers 55.
- the black matrix 54 is made of a metal material such as Ta (tantalum), Cr (chromium), Mo (molybdenum), Ni (nickel), Ti (titanium), Cu (copper), Al (aluminum), or a black pigment such as carbon. Are dispersed or a resin material in which a plurality of colored layers having light transmittance are laminated.
- the flattening films 52 and 57 are formed of a material having excellent adhesion to the material forming the black matrix 54 and the sealing material 26, such as an acrylic resin, and the flattening films 52 and 57 are generally formed by spin coating. It is formed by the method and the slit coat method.
- the photo spacer 58 is made of, for example, an acrylic photosensitive resin, and is formed by a photolithography method.
- the liquid crystal layer 25 is made of, for example, a nematic liquid crystal material having electro-optical characteristics.
- the pixel electrode 27, the liquid crystal layer 25 formed on the pixel electrode 27, and the common electrode 29 formed on the liquid crystal layer 25 The liquid crystal display element 22 comprised by is provided.
- the sealing material 26 has a rectangular shape surrounding the entire periphery of the display area D as shown in FIG. Although the width
- the width of the sealing material 26 provided in the wide frame area F 1 is wider than the width of the sealing material 26 provided in a narrow frame region F 2, provided in the wide frame region F 1 seal the width of timber 26 can be set to 0.4mm or more 1.6mm or less, the width of the sealing material 26 provided in a narrow frame region F 2 may be set to 0.2mm or more 0.8mm or less.
- sealing material for forming the sealing material 26 for example, an acrylic resin, a urethane resin, a polyester resin, an ultraviolet curable resin such as an epoxy resin, a thermosetting resin such as an epoxy resin, and the like
- a photocurable resin such as a visible light curable resin that is cured by irradiation with visible light energy such as an acrylic resin, a methacrylic resin, an epoxy resin, and a silicon resin can be suitably used.
- these resin may be used independently and may use 2 or more types simultaneously.
- the liquid crystal display panel 1 includes one pixel for each pixel electrode 27, and a voltage having a predetermined magnitude is applied to the liquid crystal layer 25 in each pixel.
- transmission of light incident from the backlight is utilized by utilizing the change in the alignment state of the liquid crystal molecules according to the magnitude of the voltage applied to the liquid crystal layer 25 (that is, lines of electric force).
- An image is displayed by adjusting the rate.
- the seal material 26 is superimposed on the wide frame region F 1 on the CF substrate 20 side in plan view (that is, overlapped with the seal material 26). It is characterized in that the dummy structure 2 is provided.
- the dummy structure 2 as shown in FIG. 3, in a wide frame area F 1, is provided on the surface of the black matrix 54, CF substrate 20 is in the wide frame area F 1, the dummy structure 2
- a planarizing film 57 is provided so as to cover it.
- the planarizing film 57 is disposed between the sealing material 26 and the dummy structure 2.
- the sealing material 26 is sandwiched between the TFT substrate 10 and the CF substrate 20, and pressure treatment is performed, so that the TFT substrate 10 and the CF substrate 20 are bonded to each other using the sealing material 26.
- the sealing material 26 in the wide frame region F 1 covers the dummy structure 2 and the dummy structure 2. because it is compressed by the planarization film 57, in a wide frame area F 1, the width W 1 of the sealing material 26 wide (i.e., a thickness large) can be.
- the sealing material forming step by forming a sealing material 26 having the optimum width, to form a sealing material 26 having a width sufficient to ensure the adhesion strength it can. Further, in the wide frame region F 1 of the terminal region T side, without being restricted to the width of the sealing material 26 in the narrow frame region F 2, it is possible to form a wide seal material 26 width. As a result, can control the finished width of the sealant 26, it is possible to obtain a liquid crystal display panel 1 narrow frame that can ensure optimal adhesion strength in both the wide frame area F 1 and a narrow frame region F 2.
- the dummy structure 2 is formed of a material for forming the colored layer 28. Then, for example, on the surface of the black matrix 54 in the wide frame region F 1, red, green or colored acrylic photosensitive resin is applied to the blue, the applied photosensitive resin through a photomask After the exposure, patterning is performed by developing to form the dummy structure 2 and the colored layer 28 at the same time. Therefore, it becomes possible to provide the dummy structure 2 without increasing the number of manufacturing steps.
- the planarization film 57 has a protrusion due to the thickness of the dummy structure 2 in a portion overlapping the dummy structure 2 in plan view.
- a protrusion having a thickness about half that of the dummy structure 2 that is, a thickness of about 0.5 micron
- the spacer is made small by the protrusion in the sealing material 26. 35 will be provided.
- the distance and the planarization layer 52 in the narrow frame region F 2 with the planarization film 57 between the planarizing film 52 in the wide frame region F 1 with the planarization film 57 is used. It may be provided. For example, it is possible to provide a small dummy structure than the dummy structure 2 provided in the wide frame area F 1.
- FIG. 4 is a plan view showing a mother substrate for the TFT substrate of the liquid crystal display panel according to the first embodiment of the present invention
- FIG. 5 is a CF of the liquid crystal display panel according to the first embodiment of the present invention. It is a top view which shows the mother board
- FIG. 6 is a plan view for explaining a method for forming a sealing material for a liquid crystal display panel according to the first embodiment of the present invention.
- FIG. 7 is a plan view for a mother substrate for a TFT substrate and a CF substrate. It is a top view which shows the bonding body which bonded the mother board
- the manufacturing method in this embodiment is provided with a mother board
- ⁇ Mother substrate manufacturing process> For example, the TFT, the planarization film 52, the pixel electrode 27, and the like are patterned on the substrate body 11 made of alkali-free glass, and a plurality of active element layers each forming the display region D are formed.
- a photo spacer 58 is formed by photolithography. More specifically, an acrylic photosensitive resin is applied to the entire substrate on which the planarizing film 52 and the like are formed by a spin coating method or a slit coating method, and the applied photosensitive resin is applied to a photomask. After the exposure, the photo spacer 58 is formed by developing. In the case of the vertical alignment type liquid crystal display panel 1, an alignment group is formed at the center of the pixel simultaneously with the photo spacer 58.
- a polyimide-based resin is applied to the entire substrate on which the photo spacers 58 are formed by a printing method. After that, in the case of the liquid crystal display panel 1 of the horizontal alignment type, it is aligned by performing a rubbing process, as shown in FIG. A TFT mother substrate 60 in which a plurality of display areas D and terminal areas T are defined in a matrix is manufactured. In the present embodiment, as shown in FIG. 4, ten TFT substrates 10 are manufactured from one mother substrate 60.
- the black matrix 54, the colored layer 55, the dummy structure 2, the planarization film 57, the common electrode 29, and the like are patterned on the substrate body 12 made of alkali-free glass, and each constitutes the display region D.
- an alignment film is formed on the surface thereof, and a mother for a CF substrate in which a plurality of display regions D are defined in a matrix and provided with dummy structures 2 shown in FIG. A substrate 70 is produced.
- ten CF substrates 20 are manufactured from one mother substrate 70.
- a sealing material 26 having a width of, for example, 0.6 mm is drawn in a frame shape on the four frame regions of the TFT substrate 10. At this time, the sealing material 26 is formed in a frame shape along the four sides of the TFT substrate 10 as shown in FIG.
- a liquid crystal material injection process is performed, for example, by dropping a liquid crystal material while a dropping device having a function of dropping the liquid crystal material moves over the entire substrate surface.
- the TFT substrate 10 onto which the liquid crystal material has been dropped in the liquid crystal material injecting step and the CF substrate 20 are bonded together so that the display regions D overlap each other under reduced pressure.
- the sealing member 26 in plan view, it is arranged so as to overlap with the dummy structure 2 in the wide frame region F 1.
- the liquid crystal material is diffused to form the liquid crystal layer 25 and at a predetermined condition (for example, at a pressure of 2.5 MPa and a temperature of 150 ° C.). 30 minutes), the sealing material 26 and the CF substrate 20 are bonded to each other by performing heat and pressure treatment, and the TFT substrate 10 and the CF substrate 20 are pasted through the sealing material 26 as shown in FIG. Match.
- a predetermined condition for example, at a pressure of 2.5 MPa and a temperature of 150 ° C.
- the CF substrate 20 side of the wide frame area F 1 in a plan view, the dummy structure 2 overlapping the sealing material 26 is provided, the sealing member 26 in the wide frame region F 1 Since the dummy structure 2 and the planarizing film 57 covering the dummy structure 2 are compressed, the width W 1 of the sealing material 26 can be increased in the wide frame region F 1 .
- the sealing material forming step by forming a sealing material 26 having the optimum width, to form a sealing material 26 having a width sufficient to ensure the adhesion strength it can. Further, in the wide frame area F 1, without being restricted to the width of the sealing material 26 in the narrow frame region F 2, it is possible to form a wide seal material 26 width.
- the frame region of the bonded body is irradiated with UV light to temporarily cure the sealing material 26, and then heated to fully cure the sealing material 26, whereby a mother substrate as shown in FIG. 60 and the mother substrate 70 are bonded together to form a bonded body 30 in which the liquid crystal layer 25 is sealed.
- the width of the sealing material 26 in the wide frame region F 1 is, for example, can be set to 1.0 mm.
- the super steel wheel used for the cutting is a disk-shaped cutting blade made of a cemented carbide such as tungsten carbide, and the side surface of the disk protrudes in a tapered shape toward the center in the thickness direction. It is configured. Further, the super steel wheel may have a protrusion formed on its tapered blade edge.
- FIG. 8 is a plan view of a liquid crystal display panel according to the second embodiment of the present invention
- FIG. 9 is a cross-sectional view taken along the line CC of FIG.
- the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
- the overall configuration and the manufacturing method of the liquid crystal display panel are the same as those described in the first embodiment, and thus detailed description thereof is omitted here.
- the dummy structure 2 is provided with a through groove 3 that divides the dummy structure 2, and the planarizing film is formed through the through groove 3. It is characterized in that 57 is in contact with the black matrix 54.
- planarization film 57 is provided so as to cover the dummy structure 2 and the black matrix 54, and the black matrix 54 is interposed through the through-groove 3 formed so as to divide the dummy structure 2. In contact with.
- the dummy structure 2 is formed of a material for forming the colored layer 28 such as an acrylic photosensitive resin, and a material for forming the black matrix 54 (a metal material such as Cr (chrome), a black pigment such as carbon) is used.
- a metal material such as Cr (chrome)
- a black pigment such as carbon
- the adhesiveness with a dispersed resin material, a resin material in which a plurality of colored layers having light transmittance are laminated, etc. is high.
- the dummy structure 2 and the black matrix 54 and the planarization film 57 Since the adhesiveness is low, the dummy structure 2 formed on the black matrix 54 may be peeled off from the black matrix 54.
- the planarizing film 57 is formed of a material (for example, acrylic resin) having high adhesion to the material forming the black matrix 54 and penetrates the dummy structure 2.
- a groove 3 is formed, and the planarizing film 57 is brought into contact with the black matrix 54 through the through groove 3.
- the dummy structure 2 is constituted by a plurality of linear dummy structures 2a, and the linear dummy structures 2a are separated at a predetermined interval. By arranging them, the through grooves 3 are provided between the linear dummy structures 2a.
- FIG. 10 is a plan view of a liquid crystal display panel according to the third embodiment of the present invention
- FIG. 11 is a cross-sectional view taken along the line KK of FIG.
- the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
- the overall configuration of the liquid crystal display panel is the same as that described in the first embodiment, and a detailed description thereof is omitted here.
- the TFT substrate 10 side of the wide frame area F 1 characterized in a plan view, in that the dummy structure 4 that overlaps the sealing material 26 is provided There is.
- the dummy structures 4, as shown in FIG. 11, in a wide frame area F 1, is provided on the surface of the planarization film 52, the TFT substrate 10, the dummy structure bodies 4 A sealing material 26 is provided so as to cover the surface.
- the sealing material forming step by forming a sealing material 26 having the optimum width, to form a sealing material 26 having a width sufficient to ensure the adhesion strength it can. Further, in the wide frame region F 1 of the terminal region T side, without being restricted to the width of the sealing material 26 in the narrow frame region F 2, it is possible to form a wide seal material 26 width. As a result, can control the finished width of the sealant 26, it is possible to obtain a liquid crystal display panel 1 narrow frame that can ensure optimal adhesion strength in both the wide frame area F 1 and a narrow frame region F 2.
- the dummy structure 4 is formed of a material (for example, acrylic photosensitive resin) forming the photo spacer 58, and the photo spacer 58 and the dummy structure 4 are formed at the same time. The Therefore, it is possible to provide the dummy structure 4 without increasing the number of manufacturing steps.
- the dummy structure 4 has a stable thickness and a designed thickness compared to the case where the dummy structure 4 is formed of the same material as the colored layer 28.
- the body 4 can be formed.
- the thickness of the dummy structure 2 varies depending on the formation conditions of the planarization film 57.
- the dummy structure 4 is provided on the planarization film 52 similarly to the photo spacer 58, the dummy structure 4 of the dummy structure 4 due to the formation conditions of the planarization film 52 is provided. This is because the occurrence of variations in thickness can be prevented.
- an acrylic photosensitive resin is applied to the entire substrate on which the planarizing film 52 and the like are formed by spin coating.
- the photosensitive resin thus applied is exposed through a photomask and then developed to form the photo spacer 58 and the dummy structure 4 at the same time, thereby producing a mother substrate 60 for TFT. .
- the sealing material 26 is formed so as to cover the dummy structure 4 in the above-described sealing material forming step. , a sealing material 26 in plan view, arranged so as to overlap with the dummy structures 4 in the wide frame region F 1.
- a concave groove 36 that accommodates the sealing material 26 is formed in the planarizing film 57.
- the concave groove 36 is formed by performing an exposure process on the planarizing film 57 formed on the substrate body 12 in the step of manufacturing the mother substrate 70 for the CF substrate described above. More specifically, for example, the exposure amount irradiated to the acrylic resin applied to form the planarizing film 57 using a photomask set so that the aperture ratio becomes half or less. It can be formed by controlling the exposure.
- the liquid crystal display panel 1 shown in FIGS. 10 and 11 is manufactured by performing the liquid crystal material injecting step, the bonded body forming step, and the dividing step.
- FIG. 12 is a plan view of a liquid crystal display panel according to the fourth embodiment of the present invention
- FIG. 13 is a sectional view taken along line EE of FIG.
- the same components as those in the first and third embodiments are denoted by the same reference numerals, and the description thereof is omitted.
- the overall configuration and the manufacturing method of the liquid crystal display panel are the same as those described in the third embodiment, and a detailed description thereof will be omitted here.
- the dummy structure 4 is formed with a through groove 5 that divides the dummy structure 4, and the sealing material 26 is interposed through the through groove 5. Is in contact with the planarization film 52.
- the dummy structure 4 is formed of a material that forms the photo spacer 58 such as an acrylic photosensitive resin, but the adhesion between the insulating substrate 51 such as a glass substrate and the planarization film 52, and Since the adhesion between the dummy structure 4 and the planarization film 52 is lower than the adhesion between the sealing material 26 and the planarization film 52, the dummy structure 2 formed on the planarization film 52 is not a planarization film. The case where it peels from 52 is considered.
- the planarizing film 52 is formed of a material (for example, acrylic resin) having high adhesion to the material (for example, acrylic resin or epoxy resin) that forms the sealing material 26, and a dummy.
- a through groove 5 that divides the structure 4 is formed, and the sealing material 26 is brought into contact with the planarizing film 52 through the through groove 5.
- the dummy structure 4 is constituted by a plurality of linear dummy structures 4a, and the linear dummy structures 4a are separated at a predetermined interval. By arranging them, the through grooves 5 are provided between the linear dummy structures 4a.
- FIG. 14 is a plan view of a liquid crystal display panel according to the fifth embodiment of the present invention
- FIG. 15 is a cross-sectional view taken on line LL of FIG.
- the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
- the overall configuration and the manufacturing method of the liquid crystal display panel are the same as those described in the first embodiment, and thus detailed description thereof is omitted here.
- the planarizing film 57 of the CF substrate 20 is formed with a through groove 66 that overlaps with the sealing material 26 in plan view. There is a feature in that.
- a through groove 66 is formed in the flattening film 57 so as to divide the flattened film 57, and the sealing material 26 (that is, the CF of the sealing material 26 is inserted through the through groove 66.
- the entire surface 26 a on the substrate 20 side is in contact with the black matrix 54.
- the sealing material 26 is sandwiched between the TFT substrate 10 and the CF substrate 20, and pressure treatment is performed, so that the TFT substrate 10 and the CF substrate 20 are bonded to each other using the sealing material 26.
- the sealing material 26 in the narrow frame region F 2 may further reduce compression by the planarization film 57. can therefore, in the narrow frame region F 2, the width W 2 of the sealant 26 narrow (i.e., a thickness less) can be.
- the sealing material forming step by forming a sealing material 26 having the optimum width, to form a sealing material 26 having a width sufficient to ensure the adhesion strength it can.
- the narrow frame region F 2 it is possible to form a narrow sealing material 26 width that can not correspond to the narrow frame being restricted to the width of the sealing material 26 in the wide frame region F 1.
- the finished width of the sealant 26 it is possible to obtain a liquid crystal display panel 1 narrow frame that can ensure optimal adhesion strength in both the wide frame area F 1 and a narrow frame region F 2.
- the mother substrate 60 for the TFT substrate is manufactured as in the case of the first embodiment described above. Thereafter, an acrylic resin is applied to the entire insulating substrate 53 on which the color filter 56 is formed by spin coating or slit coating, and the applied acrylic resin is exposed through a photomask. by patterning developed and, in the narrow frame region F 2, to form a planarizing film 57 having a through groove 66, to prepare a mother substrate 70 for CF substrate.
- the TFT substrate 10 on which the liquid crystal material was dropped in the liquid crystal material injecting step is dropped in the liquid crystal material injecting step.
- the CF substrate 20 is bonded so that the display areas D overlap each other under reduced pressure.
- the seal member 26, in plan view are arranged so as to overlap with the through-grooves 66 formed on the planarization film 57.
- the liquid crystal material is diffused to form the liquid crystal layer 25 and at a predetermined condition (for example, at a pressure of 2.5 MPa and a temperature of 150 ° C.). 30 minutes), the sealing material 26 and the CF substrate 20 are bonded to each other by performing a heat and pressure treatment, and the TFT substrate 10 and the CF substrate 20 are bonded to each other through the sealing material 26.
- a predetermined condition for example, at a pressure of 2.5 MPa and a temperature of 150 ° C.
- the sealing material forming step by forming a sealing material 26 having the optimum width, to form a sealing material 26 having a width sufficient to ensure the adhesion strength it can.
- the narrow frame region F 2 it is possible to form a narrow sealing material 26 width that can not correspond to the narrow frame being restricted to the width of the sealing material 26 in the wide frame region F 1.
- the frame region of the bonded body is irradiated with UV light to temporarily cure the sealing material 26, and then the sealing material 26 is fully cured by heating to bond the mother substrate 60 and the mother substrate 70, A bonded body 30 in which the liquid crystal layer 25 is sealed is formed.
- the liquid crystal display panel 50 shown in FIGS. 14 and 15 is manufactured by performing the dividing step.
- FIG. 16 is a plan view of a liquid crystal display panel according to the sixth embodiment of the present invention
- FIG. 17 is a cross-sectional view taken along the line GG of FIG.
- the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
- the overall configuration and the manufacturing method of the liquid crystal display panel are the same as those described in the first embodiment, and thus detailed description thereof is omitted here.
- a concave groove 65 is formed in the planarizing film 57 of the CF substrate 20 so as to overlap the sealing material 26 in plan view. There is a feature in that.
- the sealing material 26 in the narrow frame region F 2 is hardly compressed by the planarizing film 57 in the bonded body forming step, and therefore, the width W 2 of the sealing material 26 is narrowed in the narrow frame region F 2 . can do.
- the sealing material forming step by forming a sealing material 26 having the optimum width, to form a sealing material 26 having a width sufficient to ensure the adhesion strength it can.
- the narrow frame region F 2 it is possible to form a narrow sealing material 26 width that can not correspond to the narrow frame being restricted to the width of the sealing material 26 in the wide frame region F 1.
- the finished width of the sealant 26 it is possible to obtain a liquid crystal display panel 1 narrow frame that can ensure optimal adhesion strength in both the wide frame area F 1 and a narrow frame region F 2.
- the planarization film 57 is provided on the surface of the black matrix 54 so as to cover the black matrix 54, and the sealing material. 26 and the black matrix 54.
- the sealing material 26 is in contact with the black matrix 54 through the through groove 66 formed in the planarizing film 57.
- the black matrix 54 has a peel strength. Therefore, when the sealing material 26 is formed on the black matrix 54, panel peeling due to peeling of the black matrix 54 may occur.
- the planarizing film 57 of the CF substrate 20 is formed with a concave groove 65 that overlaps with the sealing material 26 in plan view so that the sealing material 26 and the planarizing film 57 are brought into contact with each other. Therefore, contact between the sealing material 26 and the black matrix 54 can be prevented, and panel peeling due to peeling of the black matrix 54 can be prevented.
- the mother substrate 60 for the TFT substrate is manufactured as in the case of the first embodiment described above. Thereafter, an acrylic resin is applied to the entire insulating substrate 53 on which the color filter 56 is formed by spin coating or slit coating. Next, using a half-tone mask or a gray-tone mask, the amount of light applied to the applied acrylic resin is controlled and exposed, and then developed to reduce the film thickness to several tens of percent. by patterning, in the narrow frame region F 2, to form a planarizing film 57 having a groove 65, to prepare a mother substrate 70 for CF substrate.
- the thickness of the flattening film 57 in the narrow frame region F 2 becomes about half of the thickness of the flattening film 57 in the display region D
- the exposure amount is controlled.
- the TFT substrate 10 on which the liquid crystal material was dropped in the liquid crystal material injecting step is dropped in the liquid crystal material injecting step.
- the CF substrate 20 is bonded so that the display areas D overlap each other under reduced pressure.
- the sealing member 26 is, in plan view, are arranged so as to overlap with the grooves 65 formed on the planarization film 57.
- the liquid crystal material is diffused to form the liquid crystal layer 25 and at a predetermined condition (for example, at a pressure of 2.5 MPa and a temperature of 150 ° C.). 30 minutes), the sealing material 26 and the CF substrate 20 are bonded to each other by performing a heat and pressure treatment, and the TFT substrate 10 and the CF substrate 20 are bonded to each other through the sealing material 26.
- a predetermined condition for example, at a pressure of 2.5 MPa and a temperature of 150 ° C.
- the frame region of the bonded body is irradiated with UV light to temporarily cure the sealing material 26, and then the sealing material 26 is fully cured by heating to bond the mother substrate 60 and the mother substrate 70, A bonded body 30 in which the liquid crystal layer 25 is sealed is formed.
- the liquid crystal display panel 50 shown in FIGS. 16 and 17 is manufactured by performing the dividing step.
- FIG. 18 is a plan view of a liquid crystal display panel according to the seventh embodiment of the present invention
- FIG. 19 is a cross-sectional view taken along line HH in FIG.
- the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
- the overall configuration and the manufacturing method of the liquid crystal display panel are the same as those described in the first embodiment, and thus detailed description thereof is omitted here.
- the planarizing film 52 of the TFT substrate 10 is formed with a through groove 67 overlapping the sealing material 26 in plan view. There is a feature in that.
- the insulating film 68 is a drive circuit provided in the narrow frame region F 2 (drive circuit region) (that is, a gate driver that drives the gate line in the display region D or a source that drives the source line in the display region D). This is to prevent the driver) from being damaged due to contact with the sealing material 26 and the drive circuit being exposed from the through groove 67 and being corroded.
- driver a drive circuit provided in the narrow frame region F 2 (drive circuit region) (that is, a gate driver that drives the gate line in the display region D or a source that drives the source line in the display region D). This is to prevent the driver) from being damaged due to contact with the sealing material 26 and the drive circuit being exposed from the through groove 67 and being corroded.
- the sealing material forming step by forming a sealing material 26 having the optimum width, to form a sealing material 26 having a width sufficient to ensure the adhesion strength it can.
- the narrow frame region F 2 it is possible to form a narrow sealing material 26 width that can not correspond to the narrow frame being restricted to the width of the sealing material 26 in the wide frame region F 1.
- the finished width of the sealant 26 it is possible to obtain a liquid crystal display panel 1 narrow frame that can ensure optimal adhesion strength in both the wide frame area F 1 and a narrow frame region F 2.
- a silicon nitride film or the like is formed on the entire insulating substrate 51 by a plasma CVD method to form an insulating film. 68 is formed.
- an acrylic resin is applied to the entire insulating substrate 51 on which the insulating film 68 is formed by a spin coat method or a slit coat method, and the applied acrylic resin is exposed through a photomask, and thereafter , by patterning and developing, in a narrow frame region F 2, to form a planarizing film 52 having a through groove 67, to prepare a mother substrate 60 for TFT substrate.
- the mother substrate 60 for the TFT substrate is manufactured, and after performing the sealing material forming step and the liquid crystal material injecting step, the liquid crystal material injecting in the bonding body forming step
- the TFT substrate 10 onto which the liquid crystal material has been dropped in the process and the CF substrate 20 are bonded to each other so that the display regions D overlap each other under reduced pressure.
- the seal member 26, in plan view are arranged so as to overlap with the through-grooves 67 formed in the planarization layer 52.
- the liquid crystal material is diffused to form the liquid crystal layer 25 and at a predetermined condition (for example, at a pressure of 2.5 MPa and a temperature of 150 ° C.). 30 minutes), the sealing material 26 and the CF substrate 20 are bonded to each other by performing a heat and pressure treatment, and the TFT substrate 10 and the CF substrate 20 are bonded to each other through the sealing material 26.
- a predetermined condition for example, at a pressure of 2.5 MPa and a temperature of 150 ° C.
- the frame region of the bonded body is irradiated with UV light to temporarily cure the sealing material 26, and then the sealing material 26 is fully cured by heating to bond the mother substrate 60 and the mother substrate 70, A bonded body 30 in which the liquid crystal layer 25 is sealed is formed.
- the liquid crystal display panel 50 shown in FIGS. 18 and 19 is manufactured by performing the dividing step.
- FIG. 20 is a plan view of a liquid crystal display panel according to the eighth embodiment of the present invention
- FIG. 21 is a cross-sectional view taken along the line II of FIG.
- the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
- the overall configuration and the manufacturing method of the liquid crystal display panel are the same as those described in the first embodiment, and thus detailed description thereof is omitted here.
- a concave groove 69 is formed in the planarizing film 52 of the TFT substrate 10 so as to overlap the sealing material 26 in plan view. There is a feature in that.
- the planarizing film 52 is provided on the surface of the insulating film 68 so as to cover the insulating film 68, and the concave groove 69 is formed between the sealing material 26 and the insulating film 68. It is the composition arranged between.
- the sealing material 26 in the narrow frame region F 2 is difficult to be compressed by the planarizing film 52 in the bonded body forming step. Therefore, the width W 2 of the sealing material 26 is narrowed in the narrow frame region F 2 . can do.
- the sealing material forming step by forming a sealing material 26 having the optimum width, to form a sealing material 26 having a width sufficient to ensure the adhesion strength it can.
- the narrow frame region F 2 it is possible to form a narrow sealing material 26 width that can not correspond to the narrow frame being restricted to the width of the sealing material 26 in the wide frame region F 1.
- the finished width of the sealant 26 it is possible to obtain a liquid crystal display panel 1 narrow frame that can ensure optimal adhesion strength in both the wide frame area F 1 and a narrow frame region F 2.
- the entire insulating substrate 51 on which the insulating film 68 is formed is coated with an acrylic resin by spin coating or slit coating. Apply resin.
- the amount of light applied to the applied acrylic resin is controlled and exposed, and then developed to reduce the film thickness to several tens of percent. by patterning, in the narrow frame region F 2, to form a planarizing film 52 having a groove 69, to prepare a mother substrate 60 for TFT substrate.
- the thickness of the flattening film 52 in the narrow frame region F 2 becomes about half of the thickness of the flattening film 52 in the display region D
- the exposure amount is controlled.
- the sealing material forming step and the liquid crystal material injection step are performed as in the case of the first embodiment described above. I do.
- the TFT substrate 10 onto which the liquid crystal material is dropped in the liquid crystal material injecting step and the CF substrate 20 are bonded so that the display regions D overlap each other under reduced pressure.
- the sealing member 26 is, in plan view, are arranged so as to overlap with the grooves 69 formed on the planarization layer 52.
- the liquid crystal material is diffused to form the liquid crystal layer 25 and at a predetermined condition (for example, at a pressure of 2.5 MPa and a temperature of 150 ° C.). 30 minutes), the sealing material 26 and the CF substrate 20 are bonded to each other by performing a heat and pressure treatment, and the TFT substrate 10 and the CF substrate 20 are bonded to each other through the sealing material 26.
- a predetermined condition for example, at a pressure of 2.5 MPa and a temperature of 150 ° C.
- the concave groove 69 that overlaps with the seal material 26 is formed. Therefore, the seal material 26 in the narrow frame region F 2 is hardly compressed by the planarizing film 52. , in the narrow frame region F 2, it is possible to narrow the width W 2 of the sealant 26.
- the frame region of the bonded body is irradiated with UV light to temporarily cure the sealing material 26, and then the sealing material 26 is fully cured by heating to bond the mother substrate 60 and the mother substrate 70, A bonded body 30 in which the liquid crystal layer 25 is sealed is formed.
- the liquid crystal display panel 50 shown in FIGS. 20 and 21 is manufactured by performing the dividing step.
- the dummy structure 2 is formed of the material for forming the colored layer 28 such as an acrylic photosensitive resin in the wide frame region F 1 .
- a transparent layer formed of an acrylic photosensitive resin may be provided on the color filter 56 described above, and a dummy structure may be formed using a material for forming the transparent layer.
- an acrylic photosensitive resin is applied to the entire substrate on which the color filter 56 and the like are formed on the CF substrate 20 by a spin coating method or a slit coating method, and the applied photosensitive resin is applied to a photomask.
- the transparent layer and the dummy structure 2 are formed at the same time by developing after exposure through the film.
- the dummy structure 2 is provided on the surface of the black matrix 54 of the CF substrate 20, a planarizing film 57 is provided so as to cover the dummy structure 2, and the TFT substrate 10
- the dummy structure 4 may be provided on the surface of the planarizing film 52 and the sealing material 26 may be provided so as to cover the dummy structure 4.
- the dummy structures may be provided that overlaps the sealing material 26.
- the dummy structure 2 is constituted by a plurality of linear dummy structures 2a, and the linear dummy structures 2a are arranged at a predetermined interval so that a line is formed.
- the through-groove 3 is provided between the dotted dummy structures 2a.
- the dummy structure 2 is constituted by a plurality of dotted dummy structures 2b, and the dotted dummy structures 2b are It is good also as a structure which provides the through-groove 3 by arrange
- the planarization film provided so as to cover the dummy structure 2 can be further increased. Therefore, it is possible to further prevent the dummy structure 2 formed on the black matrix 54 from being separated from the black matrix 54.
- the entire surface 26 a of the sealing material 26 on the CF substrate 20 side is connected to the black matrix 54 through the through groove 66 formed in the planarizing film 57.
- the width W 3 of the through groove 66 is set to be smaller than the width W 2 of the sealing material 26 (that is, W 2 > W 3 ) and is flattened.
- a part of the surface 26 a of the sealing material 26 on the CF substrate 20 side may be in contact with the black matrix 54 through the through groove 66 formed in the film 57.
- the entire surface 26 b on the TFT substrate 10 side of the sealing material 26 is insulated through the through groove 67 formed in the planarizing film 52. it is configured to contact with the membrane 68, as shown in FIG. 24, the width W 4 of the through groove 67 smaller than the width W 2 of the sealant 26 (i.e., such that W 2> W 4) set A part of the surface 26 b of the sealing material 26 on the CF substrate 20 side may be in contact with the insulating film 68 through the through groove 67 formed in the planarizing film 52.
- the spacer 35 can be provided in a portion other than the through grooves 66 and 67 inside the sealing material 26. In comparison, the size of the spacer 35 can be reduced. Therefore, even when provided with through grooves 66 and 67, the distance between the planarizing film 52 in the narrow frame region F 2 with the planarization film 57 is flat with the planarization film 52 in the wide frame region F 1 The distance can be controlled to be the same value as the distance to the chemical film 57.
- the width W 3 of the through groove 66 is set to be smaller than the width W 2 of the sealing material 26 (that is, W 2 > W 3 ). Therefore, the working surface with respect to the stress increases at the end of the sealing material 26, and the stress can be dispersed. Accordingly, it is possible to suppress the occurrence of peeling of the black matrix 54.
- the width W 4 of the through groove 67 is set to be smaller than the width W 2 of the sealing material 26 (that is, W 2 > W 4 ), Since the through-groove 67 is configured to be settled inside the sealing material 26, the working surface against stress increases at the end of the sealing material 26, and the stress can be dispersed. Accordingly, it is possible to suppress the occurrence of peeling of the insulating film 68.
- the step member 71 may be covered with the sealing material 26.
- the step member 71 is provided on the surface of the black matrix 54, and the sealing material 26 is provided on the surface of the black matrix 54 so as to cover the step member 71.
- the step member 72 formed by the flattening film 52 may be covered with the sealing material 26.
- the step member 72 is provided on the surface of the insulating film 68, and the sealing material 26 is provided on the surface of the insulating film 68 so as to cover the step member 72.
- step members 71 and 72 serving as the reference of the cell gap are provided in the narrow frame region F 2 where the sealing material 26 is disposed, the control of the cell gap in the narrow frame region F 2 is easy. It becomes.
- a plurality of step members 71 may be provided at a predetermined interval.
- the contact area between the sealing material 26 and the stepped member 71 and the contact area between the sealing material 26 and the black matrix 54 are increased as compared with the structure shown in FIG. Can be made.
- a plurality of step members 72 may be provided at a predetermined interval.
- the contact area between the sealing material 26 and the step member 72 and the contact area between the sealing material 26 and the insulating film 68 are increased as compared with the structure shown in FIG. It is possible to prevent peeling from the insulating film 68. In addition, it is good also as a structure which provides tens of level
- a through groove 66 that overlaps with the sealing material 26 in plan view is formed in the planarizing film 57 of the CF substrate 20, and the TFT substrate 10 is planarized.
- the film 52 may be formed with a through groove 67 that overlaps with the sealing material 26 in plan view.
- the narrow TFT substrate 10 side of the frame region F 2 and at least one of CF substrate 20 side, in plan view, it is sufficient that the through grooves overlapping with the sealing material 26 is provided.
- the planarizing film 57 of the CF substrate 20 is formed with a concave groove 65 that overlaps with the sealing material 26 in plan view, and the TFT substrate 10 is planarized. It is good also as a structure which forms the groove
- the narrow TFT substrate 10 side of the frame region F 2 and at least one of CF substrate 20 side, in plan view, it is sufficient that recessed groove that overlaps the sealing material 26 is provided.
- liquid crystal display panel 1 has been described as an example of the display panel, but the present invention can be applied to other display panels such as an organic EL display panel.
- an element substrate 40 as a first substrate, a sealing substrate 41 as a second substrate facing the element substrate 40, and an element substrate 40 are formed on the element substrate 40.
- the present invention can be applied to an organic EL display panel 61 that includes a sealing material 43 that bonds the stop substrate 41.
- the sealing material 43 is formed in a frame shape so as to go around the organic EL display element 42, and the element substrate 40 and the sealing substrate 41 are bonded to each other via the sealing material 43.
- the element substrate 40 has a display region H in which the organic EL display elements 42 are arranged and surrounded by the sealing material 43.
- a frame area of four sides on which the sealing material 43 is arranged is defined. As shown in FIGS. 31 and 32, one side of the frame area is located on the terminal area K side. a defined wide wide frame area G 1 width, the other three sides, has a narrower frame width region G 2 width than the wide frame area G 1.
- the present invention is suitable for a display panel such as a liquid crystal display panel in which a pair of substrates are overlapped at a predetermined interval and the pair of substrates are bonded to each other via a sealant.
Abstract
Description
図1は、本発明の第1の実施形態に係る液晶表示パネルの平面図であり、図2は、図1のA-A断面図である。また、図3は、図1のB-B断面図である。
膜上に設けられた半導体膜及びゲート絶縁膜(いずれも不図示)と、その上に互いに平行に延びるように設けられた複数のゲート線(不図示)とを備えている。また、TFT基板10は、各ゲート線を覆うように設けられた層間絶縁膜(不図示)と、層間絶縁膜上に各ゲート線と直交する方向に互いに平行に延びるように設けられた複数のソース線(不図示)と、表示領域Dの各ゲート線及び各ソース線の交差部分毎、すなわち、各画素毎にそれぞれ設けられた複数のTFT(不図示)とを備えている。また、TFT基板10は、上述の額縁領域に実装されるゲートドライバ回路(不図示)と、各TFT及び各ソース線を覆うように設けられた平坦化膜52と、平坦化膜52上にマトリクス状に設けられ、各TFTに接続された複数の画素電極27(図2参照)と、各画素電極27を覆うように設けられた配向膜(不図示)とを備えている。
例えば、無アルカリガラスからなる基板本体11上に、TFT、平坦化膜52、画素電極27等をパターニングして、それぞれが表示領域Dを構成する複数のアクティブ素子層を形成する。次いで、フォトリソグラフィー法によりフォトスペーサ58を形成する。より具体的には、平坦化膜52等が形成された基板全体に、スピンコート法やスリットコート法により、アクリル系の感光性樹脂を塗布し、その塗布された感光性樹脂を、フォトマスクを介して露光した後に、現像することにより、フォトスペーサ58を形成する。なお、垂直配向型の液晶表示パネル1の場合は、このフォトスペーサ58と同時に、画素の中心に配向基を形成する。次いで、フォトスペーサ58が形成された基板全体に、印刷法によりポリイミド系樹脂を塗布し、その後、水平配向型の液晶表示パネル1の場合は、ラビング処理を行って配向し、図4に示す、マトリクス状に複数の表示領域D及び端子領域Tが規定されたTFT用のマザー基板60を作製する。なお、本実施形態においては、図4に示すように、1枚のマザー基板60から、10個のTFT基板10が作製される。
次に、ディスペンサを用いて、TFT基板10の4辺の額縁領域に、例えば、0.6mmの幅を有するシール材26を枠状に描画する。この際、シール材26は、図6に示すように、TFT基板10の4辺に沿って枠状に形成される。
次いで、真空雰囲気で、マザー基板60に作製されたTFT基板10の各々の表示領域Dの内側(即ち、シール材26の内側)に液晶材料を滴下して注入する。この液晶材料の滴下は、例えば、液晶材料を滴下する機能を有した滴下装置が基板面全体に亘って移動しながら液晶材料を滴下することにより行われる。
まず、上記液晶材料注入工程で液晶材料が滴下されたTFT基板10と、CF基板20とを、減圧下で互いの表示領域Dが重なり合うように貼り合わせる。この際、図7に示すように、シール材26は、平面視において、広額縁領域F1におけるダミー構造体2と重畳するように配置される。
次いで、貼合体30の表面及び裏面に超鋼ホイールの刃先を当接して、貼合体30の分断ラインに沿って、貼合体30を各表示領域D毎に分断することにより、図1~図3に示す液晶表示パネル1が製造される。
次に、本発明の第2の実施形態について説明する。図8は、本発明の第2の実施形態に係る液晶表示パネルの平面図であり、図9は、図8のC-C断面図である。なお、本実施形態においては、上記第1の実施形態と同様の構成部分については同一の符号を付してその説明を省略する。また、液晶表示パネルの全体構成、及び製造方法については、上述の第1の実施形態において説明したものと同様であるため、ここでは詳しい説明を省略する。
次に、本発明の第3の実施形態について説明する。図10は、本発明の第3の実施形態に係る液晶表示パネルの平面図であり、図11は、図10のK-K断面図である。なお、本実施形態においては、上記第1の実施形態と同様の構成部分については同一の符号を付してその説明を省略する。また、液晶表示パネルの全体構成については、上述の第1の実施形態において説明したものと同様であるため、ここでは詳しい説明を省略する。
次に、本発明の第4の実施形態について説明する。図12は、本発明の第4の実施形態に係る液晶表示パネルの平面図であり、図13は、図12のE-E断面図である。なお、本実施形態においては、上記第1及び第3実施形態と同様の構成部分については同一の符号を付してその説明を省略する。また、液晶表示パネルの全体構成、及び製造方法については、上述の第3の実施形態において説明したものと同様であるため、ここでは詳しい説明を省略する。
次に、本発明の第5の実施形態について説明する。図14は、本発明の第5の実施形態に係る液晶表示パネルの平面図であり、図15は、図14のL-L断面図である。なお、本実施形態においては、上記第1の実施形態と同様の構成部分については同一の符号を付してその説明を省略する。また、液晶表示パネルの全体構成、及び製造方法については、上述の第1の実施形態において説明したものと同様であるため、ここでは詳しい説明を省略する。
次に、本発明の第6の実施形態について説明する。図16は、本発明の第6の実施形態に係る液晶表示パネルの平面図であり、図17は、図16のG-G断面図である。なお、本実施形態においては、上記第1の実施形態と同様の構成部分については同一の符号を付してその説明を省略する。また、液晶表示パネルの全体構成、及び製造方法については、上述の第1の実施形態において説明したものと同様であるため、ここでは詳しい説明を省略する。
次に、本発明の第7の実施形態について説明する。図18は、本発明の第7の実施形態に係る液晶表示パネルの平面図であり、図19は、図18のH-H断面図である。なお、本実施形態においては、上記第1の実施形態と同様の構成部分については同一の符号を付してその説明を省略する。また、液晶表示パネルの全体構成、及び製造方法については、上述の第1の実施形態において説明したものと同様であるため、ここでは詳しい説明を省略する。
次に、本発明の第8の実施形態について説明する。図20は、本発明の第8の実施形態に係る液晶表示パネルの平面図であり、図21は、図20のI-I断面図である。なお、本実施形態においては、上記第1の実施形態と同様の構成部分については同一の符号を付してその説明を省略する。また、液晶表示パネルの全体構成、及び製造方法については、上述の第1の実施形態において説明したものと同様であるため、ここでは詳しい説明を省略する。
2 ダミー構造体
2a 線状ダミー構造体
2b 点状ダミー構造体
3 貫通溝
4 ダミー構造体
4a 線状ダミー構造体
5 貫通溝
10 TFT基板(第1基板)
20 CF基板(第2基板)
22 液晶表示素子(表示素子)
25 液晶層
26 シール材
27 画素電極
28 着色層
29 共通電極
30 貼合体
35 スペーサ
40 素子基板(第1基板)
41 封止基板(第2基板)
42 有機EL表示素子(表示素子)
43 シール材
44 ダミー構造体
45 溝
50 液晶表示パネル(表示パネル)
51 絶縁基板(第1絶縁基板)
52 平坦化膜(第1平坦化膜)
53 絶縁基板(第2絶縁基板)
54 ブラックマトリクス
55 着色層
56 カラーフィルタ
57 平坦化膜(第2平坦化膜)
58 フォトスペーサ
61 有機EL表示パネル(表示パネル)
62 有機EL表示パネル(表示パネル)
65 凹溝(溝)
66 貫通溝(溝)
67 貫通溝(溝)
68 絶縁膜
69 凹溝(溝)
71 段差部材
72 段差部材
F1 広額縁領域(第1額縁領域)
F2 狭額縁領域(第2額縁領域)
G1 広額縁領域(第1額縁領域)
G2 狭額縁領域(第2額縁領域)
T 端子領域
Claims (14)
- 第1基板と、
前記第1基板に対向して配置された第2基板と、
前記第1基板及び前記第2基板の間に設けられた表示素子と、
前記第1基板の1辺に沿って規定された端子領域と、
前記表示素子が設けられ、画像表示を行う表示領域と、
前記表示領域の周囲に規定され、前記端子領域に隣接する第1額縁領域と前記第1額縁領域より幅の狭い第2額縁領域とにより構成された額縁領域と、
前記額縁領域に設けられ、前記第1基板と前記第2基板との間に挟持されるとともに、前記第1基板及び前記第2基板を互いに接着するシール材と
を備えた表示パネルであって、
前記第1額縁領域の前記第1基板側及び前記第2基板側の少なくとも一方に、平面視において、前記シール材と重畳するダミー構造体が設けられていることを特徴とする表示パネル。 - 前記ダミー構造体は、前記第1額縁領域の前記第1基板側に設けられ、
前記シール材は、前記ダミー構造体を覆うように設けられていることを特徴とする請求項1に記載の表示パネル。 - 前記第1基板は、第1絶縁基板と、該第1絶縁基板上に設けられた第1平坦化膜とを有し、
前記ダミー構造体に貫通溝が形成されるとともに、前記第1額縁領域において、前記ダミー構造体は、前記第1平坦化膜の表面上に設けられ、
前記シール材は、前記貫通溝を介して、前記第1平坦化膜と接触していることを特徴とする請求項2に記載の表示パネル。 - 前記第1基板は、前記第1平坦化膜上に設けられたフォトスペーサを有し、
前記ダミー構造体は、前記フォトスペーサと同一の材料により形成されていることを特徴とする請求項3に記載の表示パネル。 - 前記ダミー構造体は、前記第1額縁領域の前記第2基板側に設けられ、
前記第2基板は、前記第1額縁領域において、前記ダミー構造体を覆うように設けられ、前記シール材と前記ダミー構造体との間に配置された第2平坦化膜を有することを特徴とする請求項1に記載の表示パネル。 - 前記第2基板は、第2絶縁基板と、該第2絶縁基板上に設けられたブラックマトリクスとを有し、
前記ダミー構造体に貫通溝が形成されるとともに、前記第1額縁領域において、前記ダミー構造体は、前記ブラックマトリクスの表面上に設けられ、
前記第2平坦化膜は、前記ダミー構造体と前記ブラックマトリクスを覆うように設けられるとともに、前記貫通溝を介して、前記ブラックマトリクスと接触していることを特徴とする請求項5に記載の表示パネル。 - 前記第2基板は、前記第2絶縁基板上に設けられた着色層を有し、
前記ダミー構造体は、前記着色層と同一の材料により形成されていることを特徴とする請求項6に記載の表示パネル。 - 第1基板と、
前記第1基板に対向して配置された第2基板と、
前記第1基板及び前記第2基板の間に設けられた表示素子と、
前記第1基板の1辺に沿って規定された端子領域と、
前記表示素子が設けられ、画像表示を行う表示領域と、
前記表示領域の周囲に規定され、前記端子領域側に隣接する第1額縁領域と前記第1額縁領域より幅の狭い第2額縁領域とにより構成された額縁領域と、
前記額縁領域に設けられ、前記第1基板と前記第2基板との間に挟持されるとともに、前記第1基板及び前記第2基板を互いに接着するシール材と、
前記第1基板の前記シール材側に設けられた第1平坦化膜と、
前記第2基板の前記シール材側に設けられた第2平坦化膜と
を備えた表示パネルであって、
前記第2額縁領域において、前記第1及び第2平坦化膜の少なくとも一方に、平面視において、前記シール材と重畳する溝が形成されていることを特徴とする表示パネル。 - 前記溝が貫通溝であることを特徴とする請求項8に記載の表示パネル。
- 前記溝が凹溝であることを特徴とする請求項8に記載の表示パネル。
- 前記凹溝は前記第1平坦化膜に形成され、
前記第1基板は、第1絶縁基板と、該第1絶縁基板上に設けられた絶縁膜とを有し、
前記第2額縁領域において、前記第1平坦化膜は、前記絶縁膜の表面上に該絶縁膜を覆うように設けられ、前記凹溝は、前記シール材と前記絶縁膜との間に配置されていることを特徴とする請求項10に記載の表示パネル。 - 前記凹溝は前記第2平坦化膜に形成され、
前記第2基板は、第2絶縁基板と、該第2絶縁基板上に設けられたブラックマトリクスとを有し、
前記第2額縁領域において、前記第2平坦化膜は、前記ブラックマトリクスの表面上に該ブラックマトリクスを覆うように設けられ、前記凹溝は、前記シール材と前記ブラックマトリクスとの間に配置されていることを特徴とする請求項10に記載の表示パネル。 - 前記表示素子が、液晶表示素子であることを特徴とする請求項1~請求項12のいずれか1項に記載の表示パネル。
- 前記表示素子が、有機EL表示素子であることを特徴とする請求項1~請求項12のいずれか1項に記載の表示パネル。
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