WO2014013884A1 - Film de démoulage - Google Patents

Film de démoulage Download PDF

Info

Publication number
WO2014013884A1
WO2014013884A1 PCT/JP2013/068396 JP2013068396W WO2014013884A1 WO 2014013884 A1 WO2014013884 A1 WO 2014013884A1 JP 2013068396 W JP2013068396 W JP 2013068396W WO 2014013884 A1 WO2014013884 A1 WO 2014013884A1
Authority
WO
WIPO (PCT)
Prior art keywords
release film
release
base layer
layer
resin
Prior art date
Application number
PCT/JP2013/068396
Other languages
English (en)
Japanese (ja)
Inventor
裕人 谷口
Original Assignee
住友ベークライト株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友ベークライト株式会社 filed Critical 住友ベークライト株式会社
Priority to KR20147034756A priority Critical patent/KR20150035596A/ko
Priority to CN201380037570.1A priority patent/CN104507680B/zh
Publication of WO2014013884A1 publication Critical patent/WO2014013884A1/fr
Priority to PH12015500100A priority patent/PH12015500100A1/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/51—Elastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2425/00—Presence of styrenic polymer
    • C09J2425/005—Presence of styrenic polymer in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2425/00—Presence of styrenic polymer
    • C09J2425/006—Presence of styrenic polymer in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)

Abstract

La présente invention concerne un film de démoulage ayant à la fois des propriétés de démoulage et une performance d'incorporation. Le film de démoulage (1) selon la présente invention comprend : une couche de base (2) qui comprend une résine de polyoléfine et une résine de polystyrène ayant une structure syndiotactique ; et une première couche de démoulage (3) qui est disposée sur la surface supérieure de la couche de base (2) et est composée d'une matière de résine contenant une résine de polystyrène ayant une structure syndiotactique comme composant principal. Le film de démoulage (1) a un module élastique de stockage à la traction (E') de 1,0 × 106 à 5,0 × 108 Pa à 120°C et 1,0 x 107 à 1,0 × 109 Pa à 170°C tel que mesuré par une méthode d'essai conformément à JIS K 7244 dans des conditions telles que la longueur d'une pièce d'essai est de 40 mm, la largeur de la pièce d'essai est de 4 mm, la longueur de la pièce d'essai entre des pinces est de 20 mm, la température de départ de mesure est de 25°C, la température de fin de mesure est de 250°C, la vitesse d'élévation de température est de 5°C/min, et la fréquence de mesure est de 1 Hz.
PCT/JP2013/068396 2012-07-17 2013-07-04 Film de démoulage WO2014013884A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR20147034756A KR20150035596A (ko) 2012-07-17 2013-07-04 이형 필름
CN201380037570.1A CN104507680B (zh) 2012-07-17 2013-07-04 脱模膜
PH12015500100A PH12015500100A1 (en) 2012-07-17 2015-01-14 Mold release film

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012158584A JP5895755B2 (ja) 2012-07-17 2012-07-17 離型フィルム
JP2012-158584 2012-07-17

Publications (1)

Publication Number Publication Date
WO2014013884A1 true WO2014013884A1 (fr) 2014-01-23

Family

ID=49948714

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/068396 WO2014013884A1 (fr) 2012-07-17 2013-07-04 Film de démoulage

Country Status (6)

Country Link
JP (1) JP5895755B2 (fr)
KR (1) KR20150035596A (fr)
CN (1) CN104507680B (fr)
PH (1) PH12015500100A1 (fr)
TW (1) TWI554375B (fr)
WO (1) WO2014013884A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6398221B2 (ja) * 2014-02-26 2018-10-03 住友ベークライト株式会社 樹脂封止半導体装置製造用離型フィルム、樹脂封止半導体装置製造用離型フィルムの製造方法及び樹脂封止半導体装置の製造方法
JP6303727B2 (ja) * 2014-03-31 2018-04-04 住友ベークライト株式会社 離型フィルム
JP6467800B2 (ja) * 2014-07-30 2019-02-13 住友ベークライト株式会社 離型フィルム
JP6648400B2 (ja) * 2014-11-10 2020-02-14 凸版印刷株式会社 端子用樹脂フィルム、それを用いたタブ及び蓄電デバイス
WO2018173683A1 (fr) * 2017-03-22 2018-09-27 住友ベークライト株式会社 Film de démoulage et procédé de production de carte de circuit imprimé souple
WO2020138498A1 (fr) * 2018-12-28 2020-07-02 株式会社クラレ Film de base pour film décoratif et film décoratif le comprenant
JP7281381B2 (ja) * 2019-10-04 2023-05-25 出光興産株式会社 低誘電材用樹脂積層体
CN113924825B (zh) * 2020-10-21 2022-10-25 住友电木株式会社 脱模膜及成型品的制造方法
CN114080866B (zh) * 2020-10-21 2022-09-16 住友电木株式会社 脱模膜及成型品的制造方法
JP6870775B1 (ja) * 2020-10-21 2021-05-12 住友ベークライト株式会社 離型フィルムおよび成型品の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004082502A (ja) * 2002-08-27 2004-03-18 Mitsubishi Plastics Ind Ltd 離型用フィルム
JP2010058295A (ja) * 2008-09-01 2010-03-18 Sumitomo Bakelite Co Ltd 離型フィルム
JP2010137434A (ja) * 2008-12-11 2010-06-24 Sumitomo Bakelite Co Ltd 離型フィルム並びにそれを用いた接着方法及び回路基板の製造方法
JP2011088387A (ja) * 2009-10-23 2011-05-06 Idemitsu Kosan Co Ltd フレキシブルプリント基盤製造用積層体
JP2011161747A (ja) * 2010-02-09 2011-08-25 Sumitomo Bakelite Co Ltd 積層フィルム
JP2011161748A (ja) * 2010-02-09 2011-08-25 Sumitomo Bakelite Co Ltd 積層フィルム
WO2011152045A1 (fr) * 2010-06-02 2011-12-08 三井化学東セロ株式会社 Feuille de protection de surface pour tranches de semiconducteurs, procédé de fabrication de dispositifs à semiconducteurs et procédé de protection de tranches de semiconducteurs utilisant la feuille

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001161747A (ja) * 1999-12-08 2001-06-19 Kao Corp 吸収性物品
CN101778887A (zh) * 2007-07-31 2010-07-14 住友电木株式会社 脱模膜
TWI451959B (zh) * 2009-10-19 2014-09-11 Kureha Corp Solvent release film and laminates made of polyphenylene sulfide resin
JP2011088287A (ja) * 2009-10-20 2011-05-06 Pilot Ink Co Ltd 多芯筆記具
KR101745038B1 (ko) * 2010-02-09 2017-06-08 스미또모 베이크라이트 가부시키가이샤 적층 필름

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004082502A (ja) * 2002-08-27 2004-03-18 Mitsubishi Plastics Ind Ltd 離型用フィルム
JP2010058295A (ja) * 2008-09-01 2010-03-18 Sumitomo Bakelite Co Ltd 離型フィルム
JP2010137434A (ja) * 2008-12-11 2010-06-24 Sumitomo Bakelite Co Ltd 離型フィルム並びにそれを用いた接着方法及び回路基板の製造方法
JP2011088387A (ja) * 2009-10-23 2011-05-06 Idemitsu Kosan Co Ltd フレキシブルプリント基盤製造用積層体
JP2011161747A (ja) * 2010-02-09 2011-08-25 Sumitomo Bakelite Co Ltd 積層フィルム
JP2011161748A (ja) * 2010-02-09 2011-08-25 Sumitomo Bakelite Co Ltd 積層フィルム
WO2011152045A1 (fr) * 2010-06-02 2011-12-08 三井化学東セロ株式会社 Feuille de protection de surface pour tranches de semiconducteurs, procédé de fabrication de dispositifs à semiconducteurs et procédé de protection de tranches de semiconducteurs utilisant la feuille

Also Published As

Publication number Publication date
JP2014019017A (ja) 2014-02-03
TW201406518A (zh) 2014-02-16
CN104507680B (zh) 2016-10-19
JP5895755B2 (ja) 2016-03-30
CN104507680A (zh) 2015-04-08
KR20150035596A (ko) 2015-04-06
PH12015500100A1 (en) 2015-03-02
TWI554375B (zh) 2016-10-21

Similar Documents

Publication Publication Date Title
WO2014013884A1 (fr) Film de démoulage
JP4965216B2 (ja) ４−メチル−１−ペンテン系重合体離型フィルム
TWI449735B (zh) Demoulding film
JP2021079697A (ja) 多層離型フィルム
US20090133911A1 (en) Release film for use in manufacture of printed circuit boards
JP2019043135A (ja) 離型フィルム
JP2023164538A (ja) 離型フィルム
JP6126368B2 (ja) Ｌｅｄ封止体用金型離型フィルムおよびそれを用いたｌｅｄ封止体の製造方法
CN109070556B (zh) 半透明性拉伸膜
JP2010194841A (ja) 離型フィルム及びその製造方法
JP4489699B2 (ja) 延伸フィルムおよびその製造方法
JP6303727B2 (ja) 離型フィルム
JP2016198950A (ja) 樹脂積層板及び樹脂積層板成形品
JP2002137231A (ja) 離型フィルムおよびその製造方法
JP6561857B2 (ja) 延伸フィルム
CN111993731B (zh) 一种发泡型离型膜及其制备方法
JP6467800B2 (ja) 離型フィルム
JP6221790B2 (ja) フィルム
JP2021054071A (ja) 離型フィルム
JPH0361011A (ja) 離型フィルム及びその製造方法
JP2015182380A (ja) 離型フィルム
JP2019098546A (ja) 積層延伸フィルム
KR20110121981A (ko) 인쇄회로기판 제조용 이형필름
WO2021060154A1 (fr) Film de démoulage et procédé de fabrication de film de démoulage
TW202222566A (zh) 電子電路基板用積層體

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13819456

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20147034756

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 12015500100

Country of ref document: PH

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13819456

Country of ref document: EP

Kind code of ref document: A1