CN111993731B - 一种发泡型离型膜及其制备方法 - Google Patents

一种发泡型离型膜及其制备方法 Download PDF

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CN111993731B
CN111993731B CN201910419974.6A CN201910419974A CN111993731B CN 111993731 B CN111993731 B CN 111993731B CN 201910419974 A CN201910419974 A CN 201910419974A CN 111993731 B CN111993731 B CN 111993731B
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金亚东
杨承翰
周玉波
朱正平
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Ningbo Solartron Technology Co Ltd
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Abstract

本发明提供一种柔性线路板用的发泡型复合离型膜。其由三层结构组成，内层发泡型聚酯薄膜作为阻胶层，其含有聚酯树脂、聚烯烃和苯乙烯‑乙烯‑丁烯‑苯乙烯嵌段共聚物接枝甲基丙烯酸缩水甘油酯。外层为聚‑4甲基戊烯作为离型层。内外层材料按照配比分别进入双螺杆挤出机，进行熔融塑化，接着铸片、纵向拉伸、横向拉伸、热定型、收卷、分切和包装。这种离型膜具有高离型性、高挺度和高阻胶性。

Description

一种发泡型离型膜及其制备方法
技术领域
本发明涉及一种高分子材料薄膜，主要应用在柔性印刷线路板(FPC)压合过程中的离型膜，其具有高离型性、高挺度和高阻胶性。
背景技术
柔性线路板具有(1)可以自由弯曲、卷绕、折叠，可依照空间布局要求任意安排，并在三维空间任意移动和伸缩，从而达到元器件装配和导线连接的一体化；(2)利用FPC可大大缩小电子产品的体积和重量；(3)FPC还具有良好的散热性和可焊性以及易于装连、综合成本较低等优点，软硬结合的设计也在一定程度上弥补了柔性基材在元件承载能力上的略微不足等三大优点，目前已经成为发展最快的内部线路。主要应用于各类电子材料中，如电脑、手机等。
柔性线路板有单面、双面和多层板之分。多层板的制备过程和材料选择均高于单层板。但是多层板的高效性，应用越来越广泛，因此需要对离型膜提出更高的要求，如高阻胶性和高挺度性。
本发明提供了一种发泡型离型膜以及制备方法，由于中间层采用泡孔结构，取代常规的软层，其具有更优秀的阻胶性，且本发明制备方法简单。
发明内容
本发明的目的在于提供一种适用于柔性线路板热压的无硅离型膜，该离型膜在加热和加压过程中可有效避免PI膜与金属板的贴合，且不会在非印刷部分形成空隙，不会因粘结剂熔融流出而使电路的端子部分等暴露部分受到污染。其具有很高的挺度，因此热压中不会产生褶皱现象。
本发明的内容是：一种发泡型的离型膜，其特征在于总厚度为100-300μm，由ABA三层结构组成，其中A层为离型层，厚度为15-30μm；B层为阻胶层，厚度为40-270μm。该离型膜①离型力11-19g/in；②溢胶量32-38μm；③挺度1.2-2.2mN.m；④密度0.5-0.7g/cm3。
进一步的，所述的发泡型离型膜，其特征在于所述的A层为聚4-甲基戊烯(PMP)。
进一步的，所述的PMP材料，优选为日本三井化学株式会社TPXTM的高硬度产品，维卡软化点168-178℃。如RT18、RT31、DX845、DX231、DX820。
进一步的，所述的发泡型离型膜，其特征在于所述的B层为聚酯树脂、聚烯烃和苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物接枝甲基丙烯酸缩水甘油酯聚乙烯(SEBS-g-GMA)的混合物。聚酯树脂占75-88％，聚烯烃占10-20％，SEBS-g-GMA占2-15％。
进一步的，所述的B层聚酯树脂选为聚对苯二甲酸二甲酯(PET)，特性粘度优选为0.6-0.8dL/g。
进一步的，所述的B层聚烯烃选为聚丙烯(PP)、PMP、环烯烃类共聚物(COC)的一种。
进一步的，所述的B层PP，熔融指数(MFR)为2-5g/10min(2.16kg，230℃).
进一步的，所述的PMP的MFR为10-40g/10min(5kg，260℃)，优选为日本三井化学株式会社TPXTM，如RT18、RT31、MX004、MX002、MX0020；
进一步的，所述的COC的体积流动指数(MVR)为4-48ml/10min(2.16kg，260℃)，优选为Topas AdvancedPolymers公司制备的TOPASTM，如6015、6013、8007、5013。
进一步的，所述的B层SEBS-g-GMA的接枝率大于0.5％。
本发明的发泡型离型膜是采用三层共挤成形法得到的。包括如下步骤：将A单螺杆挤出机中投入PMP，B双螺杆挤出机按照配比投入PET、聚烯烃和POE-g-GMA的混合物。AB层材料熔融塑化、过滤，并使用ABA三层的T型模头，冷却成膜、回火、收卷、分切和包装。
进一步的，所述的制备过程，所述的A单螺杆挤出机各区温度为270-310℃。过滤器滤网孔径为10-15μm。B双螺杆挤出机各区温度为260-290℃，过滤器滤网孔径为15-25μm。T型衣架式模头温度为260-280℃，铸片冷辊温度20-25℃，纵向拉伸温度60-80℃，横向拉伸温度100-120℃，热定型温度190-220℃。与现有的离型膜相比，具有高离型性、高挺度和高阻胶性。
附图说明
图1为是本专利结构示意图。
A为外层、B为内层。
具体实施方式
本发明提供的离型膜的制备方法包括如下步骤：
将A单螺杆挤出机中投入PMP，B双螺杆挤出机按照配比投入PET、聚烯烃和POE-g-GMA的混合物。AB层材料熔融塑化、过滤，并使用ABA三层的T型模头，冷却成膜、回火、收卷、分切和包装。
所述的制备过程，所述的A单螺杆挤出机各区温度为270-310℃。过滤器滤网孔径为10-15μm。B双螺杆挤出机各区温度为260-290℃，过滤器滤网孔径为15-25μm。T型衣架式模头温度为260-280℃，铸片冷辊温度20-25℃，纵向拉伸温度60-80℃，横向拉伸温度100-120℃，热定型温度190-220℃。
离型膜的结构图见图1，A为离型层，B为阻胶层。
本发明提供的离型膜的性能测试方法如下：
MFR：使用熔体流速仪，PMP材料在260℃、5Kg压力下，600s内标准口模压出的质量；PP材料在230℃、2.16Kg压力下，600s内标准口模压出的质量。测试三次，取平均值。
MVR：使用熔体流速仪，COC材料在260℃、2.16Kg压力下，600s内标准口模压出的体积。测试三次，取平均值。
离型力：将TESA7475胶带贴于测试的离型面，用压辊来回压三次使胶带和离型面充分接触，放置24h后，以180°剥离角度剥离，记录离型力的测试结果。离型力越小剥离越容易，离型膜的离型性越好。
溢胶量：将离型膜、保护膜、挠性电路板按压合放置顺序堆叠，在180℃、120Kgf/cm3的压力下，压合2min，在显微镜下观察测定压合剥离后离型膜中间层溢出量。溢胶量越小，代表阻胶性越好。
挺度：按照GB/T 22364-2008标准，采用苏州高品检测仪器有限公司生产的微电脑挺度试验机，型号为GP-50B，测试离型膜的挺度。数值越大代表挺度越好。
密度：取100mm*100mm的试样，首先称取试样质量，用千分尺测量试样四周9个不同点厚度，用钢尺测量试样的四个边长，体积＝长×宽×高(取9个点的平均值)的公式计算试样的体积，密度＝质量/体积计算试样的密度。测试三次，取平均值。
实施例1
A层配比为100％RT18。B层配比80％PET(0.68dL/g)，15％PP(MFR＝4g/10min),5％SEBS-g-GMA(接枝率＞0.5％)。离型膜总厚度200μm，A层厚度为15μm，B层厚度为170μm。相关性能如表1所示。
实施例2
A层配比为100％RT31。B层配比75％PET(0.65dL/g)，18％PP(MFR＝5g/10min)，7％SEBS-g-GMA(接枝率＞0.5％)。离型膜总厚度190μm，A层厚度为20μm，B层厚度为150μm。相关性能如表1所示。
实施例3
A层配比为100％DX845。B层配比82％PET(0.75dL/g)，16％PP(MFR＝2g/10min)，2％SEBS-g-GMA(接枝率＞0.5％)。离型膜总厚度250μm，A层厚度为25μm，B层厚度为200μm。相关性能如表1所示。
实施例4
A层配比为100％DX231。B层配比80％PET(0.68dL/g)，18％RT18，2％SEBS-g-GMA(接枝率＞0.5％)。离型膜总厚度240μm，A层厚度为20μm，B层厚度为200μm。相关性能如表1所示。
实施例5
A层配比为100％DX820。B层配比88％PET(0.68dL/g)，10％RT31，2％SEBS-g-GMA(接枝率＞0.5％)。离型膜总厚度300μm，A层厚度为30μm，B层厚度为240μm。相关性能如表1所示。
实施例6
A层配比为100％DX820。B层配比76％PET(0.80dL/g)，16％MX004，8％SEBS-g-GMA(接枝率＞0.5％)。离型膜总厚度200μm，A层厚度为20μm，B层厚度为160μm。相关性能如表1所示。
实施例7
A层配比为100％RT18。B层配比75％PET(0.70dL/g)，12％MX002，13％SEBS-g-GMA(接枝率＞0.5％)。离型膜总厚度250μm，A层厚度为25μm，B层厚度为200μm。相关性能如表2所示。
实施例8
A层配比为100％RT31。B层配比80％PET(0.68dL/g)，16％MX0020，4％SEBS-g-GMA(接枝率＞0.5％)。离型膜总厚度180μm，A层厚度为15μm，B层厚度为150μm。相关性能如表2所示。
实施例9
A层配比为100％RT18。B层配比76％PET(0.65dL/g)，18％6013，6％SEBS-g-GMA(接枝率＞0.5％)。离型膜总厚度240μm，A层厚度为20μm，B层厚度为200μm。相关性能如表2所示。
实施例10
A层配比为100％DX845。B层配比82％PET(0.72dL/g)，16％6015，2％SEBS-g-GMA(接枝率＞0.5％)。离型膜总厚度300μm，A层厚度为25μm，B层厚度为250μm。相关性能如表2所示。
实施例11
A层配比为100％DX231。B层配比75％PET(0.70dL/g)，20％5013，5％SEBS-g-GMA(接枝率＞0.5％)。离型膜总厚度100μm，A层厚度为15μm，B层厚度为70μm。相关性能如表2所示。
实施例12
A层配比为100％DX820。B层配比82％PET(0.72dL/g)，15％8007，3％SEBS-g-GMA(接枝率＞0.5％)。离型膜总厚度180μm，A层厚度为15μm，B层厚度为150μm。相关性能如表2所示。
对比例1
日本三井株式会社PMP离型膜，牌号为CR2031MT6，厚度为130μm。相关性能如表3所示。
对比例2
日本住友株式会社PMP离型膜，牌号为E920C，厚度为130μm。相关性能如表3所示。
对比例3
苏州市新广益电子有限公司FPC用阻胶膜，牌号为CR-700#3T，厚度为140μm。相关性能如表3所示。
表1实施例1-6提供的离型膜性能测试结果
表2实施例7-12提供的离型膜性能测试结果
表3对比例的离型膜性能测试结果
以上所述，仅为本发明的较佳实施例而已，并非用于限定本发明的保护范围。凡是根据本发明内容所做的均等变化与修饰，均涵盖在本发明的专利范围内。

Claims (2)

1.一种中间层发泡型的FPC离型膜，其特征在于总厚度为100-300μm，由ABA三层结构组成，其中A层为离型层，厚度为15-30μm；B层为阻胶层，厚度为40-270μm；该离型膜①离型力11-19g/in；②挺度1.2-2.2mN.m；③密度0.5-0.7g/cm3；
所述中间层发泡型的FPC离型膜，A层为聚4-甲基戊烯(PMP)；所述PMP为日本三井化学株式会社TPXTM的高硬度产品，维卡软化点168-178℃，所述TPXTM的高硬度产品为RT18、RT31、DX845、DX231、DX820；
所述中间层发泡型的FPC离型膜，B层为聚酯树脂、聚烯烃和苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物接枝甲基丙烯酸缩水甘油酯聚乙烯(SEBS-g-GMA)的混合物；聚酯树脂占75-88％，聚烯烃占10-20％，SEBS-g-GMA占2-15％；其中聚酯选为聚对苯二甲酸二甲酯(PET)，特性粘度为0.6-0.8dL/g；聚烯烃为聚丙烯(PP)、PMP、环烯烃类共聚物(COC)的一种；
所述中间层发泡型的FPC离型膜，该膜是采用三层共挤成形法得到的，包括如下步骤：将A单螺杆挤出机中投入PMP，B双螺杆挤出机按照配比投入PET、聚烯烃和POE-g-GMA的混合物；AB层材料熔融塑化、过滤，并使用ABA三层的T型模头，冷却成膜、回火、收卷、分切和包装；
所述中间层发泡型的FPC离型膜，A单螺杆挤出机各区温度为270-310℃；过滤器滤网孔径为10-15μm；B双螺杆挤出机各区温度为260-290℃，过滤器滤网孔径为15-25μm；T型衣架式模头温度为260-280℃，铸片冷辊温度20-25℃，纵向拉伸温度60-80℃，横向拉伸温度100-120℃，热定型温度190-220℃。
2.根据权利要求1所述中间层发泡型的FPC离型膜，所述B层中SEBS-g-GMA的接枝率大于0.5％。
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