WO2013125563A1 - 複合タングステン酸化物微粒子分散ポリカーボネート樹脂組成物およびそれを用いた熱線遮蔽成形体並びに熱線遮蔽積層体 - Google Patents
複合タングステン酸化物微粒子分散ポリカーボネート樹脂組成物およびそれを用いた熱線遮蔽成形体並びに熱線遮蔽積層体 Download PDFInfo
- Publication number
- WO2013125563A1 WO2013125563A1 PCT/JP2013/054135 JP2013054135W WO2013125563A1 WO 2013125563 A1 WO2013125563 A1 WO 2013125563A1 JP 2013054135 W JP2013054135 W JP 2013054135W WO 2013125563 A1 WO2013125563 A1 WO 2013125563A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polycarbonate resin
- tungsten oxide
- heat ray
- ray shielding
- composite tungsten
- Prior art date
Links
- 229910001930 tungsten oxide Inorganic materials 0.000 title claims abstract description 83
- 239000004431 polycarbonate resin Substances 0.000 title claims abstract description 76
- 229920005668 polycarbonate resin Polymers 0.000 title claims abstract description 76
- 239000000203 mixture Substances 0.000 title claims abstract description 36
- 239000011859 microparticle Substances 0.000 title abstract 3
- 229910052751 metal Inorganic materials 0.000 claims abstract description 58
- 150000003839 salts Chemical class 0.000 claims abstract description 57
- 239000002184 metal Substances 0.000 claims abstract description 56
- 229910052738 indium Inorganic materials 0.000 claims abstract description 9
- 229910052718 tin Inorganic materials 0.000 claims abstract description 9
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 8
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 8
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 7
- 239000011342 resin composition Substances 0.000 claims abstract description 4
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 claims description 80
- 239000002131 composite material Substances 0.000 claims description 75
- 239000010419 fine particle Substances 0.000 claims description 75
- 239000006185 dispersion Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 229920000515 polycarbonate Polymers 0.000 claims description 9
- 239000004417 polycarbonate Substances 0.000 claims description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 8
- 229910052760 oxygen Inorganic materials 0.000 claims description 8
- 239000001301 oxygen Substances 0.000 claims description 8
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical group [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 8
- 229920005992 thermoplastic resin Polymers 0.000 claims description 7
- 229910052721 tungsten Inorganic materials 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 229910052716 thallium Inorganic materials 0.000 claims description 5
- 239000010937 tungsten Substances 0.000 claims description 5
- 229910052726 zirconium Inorganic materials 0.000 claims description 5
- XTEGARKTQYYJKE-UHFFFAOYSA-M Chlorate Chemical class [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 claims description 4
- 229910052783 alkali metal Inorganic materials 0.000 claims description 4
- 150000001340 alkali metals Chemical class 0.000 claims description 4
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 4
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 4
- 229910052787 antimony Inorganic materials 0.000 claims description 4
- 229910052790 beryllium Inorganic materials 0.000 claims description 4
- 229910052796 boron Inorganic materials 0.000 claims description 4
- 229910052794 bromium Inorganic materials 0.000 claims description 4
- 229910052793 cadmium Inorganic materials 0.000 claims description 4
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 4
- 150000007942 carboxylates Chemical class 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052731 fluorine Inorganic materials 0.000 claims description 4
- 229910052733 gallium Inorganic materials 0.000 claims description 4
- 229910052732 germanium Inorganic materials 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 229910052735 hafnium Inorganic materials 0.000 claims description 4
- 229910052734 helium Inorganic materials 0.000 claims description 4
- WQYVRQLZKVEZGA-UHFFFAOYSA-N hypochlorite Chemical class Cl[O-] WQYVRQLZKVEZGA-UHFFFAOYSA-N 0.000 claims description 4
- 229910052740 iodine Inorganic materials 0.000 claims description 4
- 229910052741 iridium Inorganic materials 0.000 claims description 4
- 229910052745 lead Inorganic materials 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 229910052758 niobium Inorganic materials 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 4
- 229910052702 rhenium Inorganic materials 0.000 claims description 4
- 229910052703 rhodium Inorganic materials 0.000 claims description 4
- 229910052707 ruthenium Inorganic materials 0.000 claims description 4
- 229910052711 selenium Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 229910052717 sulfur Inorganic materials 0.000 claims description 4
- 229910052720 vanadium Inorganic materials 0.000 claims description 4
- 229910019142 PO4 Inorganic materials 0.000 claims description 3
- QBWCMBCROVPCKQ-UHFFFAOYSA-N chlorous acid Chemical class OCl=O QBWCMBCROVPCKQ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical class OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 claims description 3
- 235000021317 phosphate Nutrition 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- 150000004649 carbonic acid derivatives Chemical class 0.000 claims description 2
- 150000003840 hydrochlorides Chemical class 0.000 claims description 2
- 150000003013 phosphoric acid derivatives Chemical class 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 abstract description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 239000011701 zinc Substances 0.000 abstract 1
- 239000002270 dispersing agent Substances 0.000 description 33
- 239000000843 powder Substances 0.000 description 26
- 238000000034 method Methods 0.000 description 20
- 239000000463 material Substances 0.000 description 17
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 17
- 239000002245 particle Substances 0.000 description 17
- -1 phthalocyanine compound Chemical class 0.000 description 17
- 239000008188 pellet Substances 0.000 description 16
- 239000012778 molding material Substances 0.000 description 15
- 238000002834 transmittance Methods 0.000 description 15
- 239000012298 atmosphere Substances 0.000 description 14
- 230000003287 optical effect Effects 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 12
- 239000007789 gas Substances 0.000 description 11
- 238000004898 kneading Methods 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 9
- 125000000524 functional group Chemical group 0.000 description 9
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 8
- 229960001755 resorcinol Drugs 0.000 description 8
- 239000007858 starting material Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000005855 radiation Effects 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000004305 biphenyl Substances 0.000 description 6
- 235000010290 biphenyl Nutrition 0.000 description 6
- 125000003700 epoxy group Chemical group 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 239000011261 inert gas Substances 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 6
- 238000005979 thermal decomposition reaction Methods 0.000 description 6
- 150000003658 tungsten compounds Chemical class 0.000 description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 238000000149 argon plasma sintering Methods 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Natural products OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- CXMXRPHRNRROMY-UHFFFAOYSA-N n-Decanedioic acid Natural products OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 3
- CXKGGJDGRUUNKU-UHFFFAOYSA-N oxotungsten;hydrate Chemical compound O.[W]=O CXKGGJDGRUUNKU-UHFFFAOYSA-N 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- KPGXUAIFQMJJFB-UHFFFAOYSA-H tungsten hexachloride Chemical compound Cl[W](Cl)(Cl)(Cl)(Cl)Cl KPGXUAIFQMJJFB-UHFFFAOYSA-H 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 239000004594 Masterbatch (MB) Substances 0.000 description 2
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- LCTONWCANYUPML-UHFFFAOYSA-N Pyruvic acid Chemical compound CC(=O)C(O)=O LCTONWCANYUPML-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- MBMBGCFOFBJSGT-KUBAVDMBSA-N all-cis-docosa-4,7,10,13,16,19-hexaenoic acid Chemical compound CC\C=C/C\C=C/C\C=C/C\C=C/C\C=C/C\C=C/CCC(O)=O MBMBGCFOFBJSGT-KUBAVDMBSA-N 0.000 description 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 2
- YZXBAPSDXZZRGB-DOFZRALJSA-N arachidonic acid Chemical compound CCCCC\C=C/C\C=C/C\C=C/C\C=C/CCCC(O)=O YZXBAPSDXZZRGB-DOFZRALJSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 2
- HUCVOHYBFXVBRW-UHFFFAOYSA-M caesium hydroxide Chemical compound [OH-].[Cs+] HUCVOHYBFXVBRW-UHFFFAOYSA-M 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- FDKLLWKMYAMLIF-UHFFFAOYSA-N cyclopropane-1,1-dicarboxylic acid Chemical compound OC(=O)C1(C(O)=O)CC1 FDKLLWKMYAMLIF-UHFFFAOYSA-N 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- ODVYFOLTLWONHF-UHFFFAOYSA-N diphenyl decanedioate Chemical compound C=1C=CC=CC=1OC(=O)CCCCCCCCC(=O)OC1=CC=CC=C1 ODVYFOLTLWONHF-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 description 2
- KEMQGTRYUADPNZ-UHFFFAOYSA-N heptadecanoic acid Chemical compound CCCCCCCCCCCCCCCCC(O)=O KEMQGTRYUADPNZ-UHFFFAOYSA-N 0.000 description 2
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid Chemical compound CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 125000005027 hydroxyaryl group Chemical group 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- YDSWCNNOKPMOTP-UHFFFAOYSA-N mellitic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(O)=O)=C(C(O)=O)C(C(O)=O)=C1C(O)=O YDSWCNNOKPMOTP-UHFFFAOYSA-N 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- FBUKVWPVBMHYJY-UHFFFAOYSA-N nonanoic acid Chemical compound CCCCCCCCC(O)=O FBUKVWPVBMHYJY-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- ZNOKGRXACCSDPY-UHFFFAOYSA-N tungsten trioxide Chemical compound O=[W](=O)=O ZNOKGRXACCSDPY-UHFFFAOYSA-N 0.000 description 2
- DZKDPOPGYFUOGI-UHFFFAOYSA-N tungsten(iv) oxide Chemical compound O=[W]=O DZKDPOPGYFUOGI-UHFFFAOYSA-N 0.000 description 2
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 2
- GPFJHNSSBHPYJK-UHFFFAOYSA-N (3-methylphenyl) hydrogen carbonate Chemical compound CC1=CC=CC(OC(O)=O)=C1 GPFJHNSSBHPYJK-UHFFFAOYSA-N 0.000 description 1
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- 239000001124 (E)-prop-1-ene-1,2,3-tricarboxylic acid Substances 0.000 description 1
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- ZKIOSCVVLXTVDG-UHFFFAOYSA-N 1,2,4,6-tetrabromocyclohexa-3,5-diene-1,3-diol Chemical compound OC1=C(Br)C=C(Br)C(O)(Br)C1Br ZKIOSCVVLXTVDG-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- 150000005208 1,4-dihydroxybenzenes Chemical class 0.000 description 1
- CVBUKMMMRLOKQR-UHFFFAOYSA-N 1-phenylbutane-1,3-dione Chemical compound CC(=O)CC(=O)C1=CC=CC=C1 CVBUKMMMRLOKQR-UHFFFAOYSA-N 0.000 description 1
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 1
- GFZYRCFPKBWWEK-UHFFFAOYSA-N 2,3,5,6-tetratert-butylbenzene-1,4-diol Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=C(C(C)(C)C)C(O)=C1C(C)(C)C GFZYRCFPKBWWEK-UHFFFAOYSA-N 0.000 description 1
- LUELYTMQTXRXOI-UHFFFAOYSA-N 2-(2-phenylpropan-2-yl)benzene-1,4-diol Chemical compound C=1C(O)=CC=C(O)C=1C(C)(C)C1=CC=CC=C1 LUELYTMQTXRXOI-UHFFFAOYSA-N 0.000 description 1
- XRCRJFOGPCJKPF-UHFFFAOYSA-N 2-butylbenzene-1,4-diol Chemical compound CCCCC1=CC(O)=CC=C1O XRCRJFOGPCJKPF-UHFFFAOYSA-N 0.000 description 1
- VJIDDJAKLVOBSE-UHFFFAOYSA-N 2-ethylbenzene-1,4-diol Chemical compound CCC1=CC(O)=CC=C1O VJIDDJAKLVOBSE-UHFFFAOYSA-N 0.000 description 1
- XCZKKZXWDBOGPA-UHFFFAOYSA-N 2-phenylbenzene-1,4-diol Chemical compound OC1=CC=C(O)C(C=2C=CC=CC=2)=C1 XCZKKZXWDBOGPA-UHFFFAOYSA-N 0.000 description 1
- NJRNUAVVFBHIPT-UHFFFAOYSA-N 2-propylbenzene-1,4-diol Chemical compound CCCC1=CC(O)=CC=C1O NJRNUAVVFBHIPT-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- HNNQYHFROJDYHQ-UHFFFAOYSA-N 3-(4-ethylcyclohexyl)propanoic acid 3-(3-ethylcyclopentyl)propanoic acid Chemical compound CCC1CCC(CCC(O)=O)C1.CCC1CCC(CCC(O)=O)CC1 HNNQYHFROJDYHQ-UHFFFAOYSA-N 0.000 description 1
- YNNMNWHCQGBNFH-UHFFFAOYSA-N 3-tert-butyl-4-[1-(2-tert-butyl-4-hydroxyphenyl)propyl]phenol Chemical compound C=1C=C(O)C=C(C(C)(C)C)C=1C(CC)C1=CC=C(O)C=C1C(C)(C)C YNNMNWHCQGBNFH-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- VVXLFFIFNVKFBD-UHFFFAOYSA-N 4,4,4-trifluoro-1-phenylbutane-1,3-dione Chemical compound FC(F)(F)C(=O)CC(=O)C1=CC=CC=C1 VVXLFFIFNVKFBD-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- IBNFPRMKLZDANU-UHFFFAOYSA-N 4-(4-hydroxy-3-methylphenyl)sulfanyl-2-methylphenol Chemical compound C1=C(O)C(C)=CC(SC=2C=C(C)C(O)=CC=2)=C1 IBNFPRMKLZDANU-UHFFFAOYSA-N 0.000 description 1
- JWXGVUCKVZVSQE-UHFFFAOYSA-N 4-(4-hydroxy-3-methylphenyl)sulfinyl-2-methylphenol Chemical compound C1=C(O)C(C)=CC(S(=O)C=2C=C(C)C(O)=CC=2)=C1 JWXGVUCKVZVSQE-UHFFFAOYSA-N 0.000 description 1
- XTEGBRKTHOUETR-UHFFFAOYSA-N 4-(4-hydroxy-3-methylphenyl)sulfonyl-2-methylphenol Chemical compound C1=C(O)C(C)=CC(S(=O)(=O)C=2C=C(C)C(O)=CC=2)=C1 XTEGBRKTHOUETR-UHFFFAOYSA-N 0.000 description 1
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 1
- RSSGMIIGVQRGDS-UHFFFAOYSA-N 4-[(4-hydroxyphenyl)-phenylmethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C1=CC=CC=C1 RSSGMIIGVQRGDS-UHFFFAOYSA-N 0.000 description 1
- OVVCSFQRAXVPGT-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)cyclopentyl]phenol Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCC1 OVVCSFQRAXVPGT-UHFFFAOYSA-N 0.000 description 1
- QHJPJZROUNGTRJ-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)octan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(CCCCCC)C1=CC=C(O)C=C1 QHJPJZROUNGTRJ-UHFFFAOYSA-N 0.000 description 1
- CYYZDBDROVLTJU-UHFFFAOYSA-N 4-n-Butylphenol Chemical compound CCCCC1=CC=C(O)C=C1 CYYZDBDROVLTJU-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 1
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 1
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- JJHHIJFTHRNPIK-UHFFFAOYSA-N Diphenyl sulfoxide Chemical compound C=1C=CC=CC=1S(=O)C1=CC=CC=C1 JJHHIJFTHRNPIK-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000012695 Interfacial polymerization Methods 0.000 description 1
- 229920004142 LEXAN™ Polymers 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- 239000004418 Lexan Substances 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- QVRLJSJRWZSQKU-UHFFFAOYSA-N OC1=C(C=C(C=C1C)C(C)(C)C1=CC(=C(C(=C1)C)O)C)C.OC1=C(C=C(C=C1)C(C)(C)C1=CC(=C(C=C1)O)C)C Chemical compound OC1=C(C=C(C=C1C)C(C)(C)C1=CC(=C(C(=C1)C)O)C)C.OC1=C(C=C(C=C1)C(C)(C)C1=CC(=C(C=C1)O)C)C QVRLJSJRWZSQKU-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- 239000005643 Pelargonic acid Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 1
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 229940091181 aconitic acid Drugs 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- JAZBEHYOTPTENJ-JLNKQSITSA-N all-cis-5,8,11,14,17-icosapentaenoic acid Chemical compound CC\C=C/C\C=C/C\C=C/C\C=C/C\C=C/CCCC(O)=O JAZBEHYOTPTENJ-JLNKQSITSA-N 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 1
- 235000020661 alpha-linolenic acid Nutrition 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229940114079 arachidonic acid Drugs 0.000 description 1
- 235000021342 arachidonic acid Nutrition 0.000 description 1
- 125000005362 aryl sulfone group Chemical group 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical compound C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- MUCRFDZUHPMASM-UHFFFAOYSA-N bis(2-chlorophenyl) carbonate Chemical compound ClC1=CC=CC=C1OC(=O)OC1=CC=CC=C1Cl MUCRFDZUHPMASM-UHFFFAOYSA-N 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 229910001919 chlorite Inorganic materials 0.000 description 1
- 229910052619 chlorite group Inorganic materials 0.000 description 1
- 229930016911 cinnamic acid Natural products 0.000 description 1
- 235000013985 cinnamic acid Nutrition 0.000 description 1
- GTZCVFVGUGFEME-IWQZZHSRSA-N cis-aconitic acid Chemical compound OC(=O)C\C(C(O)=O)=C\C(O)=O GTZCVFVGUGFEME-IWQZZHSRSA-N 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 150000001924 cycloalkanes Chemical class 0.000 description 1
- SUSAGCZZQKACKE-UHFFFAOYSA-N cyclobutane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC1C(O)=O SUSAGCZZQKACKE-UHFFFAOYSA-N 0.000 description 1
- WYHYNUWZLKTEEY-UHFFFAOYSA-N cyclobutane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CC(C(O)=O)C1 WYHYNUWZLKTEEY-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- XBZSBBLNHFMTEB-UHFFFAOYSA-N cyclohexane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCCC(C(O)=O)C1 XBZSBBLNHFMTEB-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 150000004790 diaryl sulfoxides Chemical class 0.000 description 1
- QLVWOKQMDLQXNN-UHFFFAOYSA-N dibutyl carbonate Chemical compound CCCCOC(=O)OCCCC QLVWOKQMDLQXNN-UHFFFAOYSA-N 0.000 description 1
- FYIBPWZEZWVDQB-UHFFFAOYSA-N dicyclohexyl carbonate Chemical compound C1CCCCC1OC(=O)OC1CCCCC1 FYIBPWZEZWVDQB-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- FHESUNXRPBHDQM-UHFFFAOYSA-N diphenyl benzene-1,3-dicarboxylate Chemical compound C=1C=CC(C(=O)OC=2C=CC=CC=2)=CC=1C(=O)OC1=CC=CC=C1 FHESUNXRPBHDQM-UHFFFAOYSA-N 0.000 description 1
- HPGJOUYGWKFYQW-UHFFFAOYSA-N diphenyl benzene-1,4-dicarboxylate Chemical compound C=1C=C(C(=O)OC=2C=CC=CC=2)C=CC=1C(=O)OC1=CC=CC=C1 HPGJOUYGWKFYQW-UHFFFAOYSA-N 0.000 description 1
- ZFZAVLIRCWVCJS-UHFFFAOYSA-N diphenyl dodecanedioate Chemical compound C=1C=CC=CC=1OC(=O)CCCCCCCCCCC(=O)OC1=CC=CC=C1 ZFZAVLIRCWVCJS-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 235000020669 docosahexaenoic acid Nutrition 0.000 description 1
- 229940090949 docosahexaenoic acid Drugs 0.000 description 1
- SUNVJLYYDZCIIK-UHFFFAOYSA-N durohydroquinone Chemical compound CC1=C(C)C(O)=C(C)C(C)=C1O SUNVJLYYDZCIIK-UHFFFAOYSA-N 0.000 description 1
- 235000020673 eicosapentaenoic acid Nutrition 0.000 description 1
- 229960005135 eicosapentaenoic acid Drugs 0.000 description 1
- JAZBEHYOTPTENJ-UHFFFAOYSA-N eicosapentaenoic acid Natural products CCC=CCC=CCC=CCC=CCC=CCCCC(O)=O JAZBEHYOTPTENJ-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000005338 frosted glass Substances 0.000 description 1
- 229940074391 gallic acid Drugs 0.000 description 1
- 235000004515 gallic acid Nutrition 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- QAMFBRUWYYMMGJ-UHFFFAOYSA-N hexafluoroacetylacetone Chemical compound FC(F)(F)C(=O)CC(=O)C(F)(F)F QAMFBRUWYYMMGJ-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- YAQXGBBDJYBXKL-UHFFFAOYSA-N iron(2+);1,10-phenanthroline;dicyanide Chemical compound [Fe+2].N#[C-].N#[C-].C1=CN=C2C3=NC=CC=C3C=CC2=C1.C1=CN=C2C3=NC=CC=C3C=CC2=C1 YAQXGBBDJYBXKL-UHFFFAOYSA-N 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229960004488 linolenic acid Drugs 0.000 description 1
- KQQKGWQCNNTQJW-UHFFFAOYSA-N linolenic acid Natural products CC=CCCC=CCC=CCCCCCCCC(O)=O KQQKGWQCNNTQJW-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 229960002969 oleic acid Drugs 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 229940116315 oxalic acid Drugs 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 229940107700 pyruvic acid Drugs 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000001175 rotational moulding Methods 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229960004274 stearic acid Drugs 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- TXBBUSUXYMIVOS-UHFFFAOYSA-N thenoyltrifluoroacetone Chemical compound FC(F)(F)C(=O)CC(=O)C1=CC=CS1 TXBBUSUXYMIVOS-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 1
- GTZCVFVGUGFEME-UHFFFAOYSA-N trans-aconitic acid Natural products OC(=O)CC(C(O)=O)=CC(O)=O GTZCVFVGUGFEME-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- PBYZMCDFOULPGH-UHFFFAOYSA-N tungstate Chemical compound [O-][W]([O-])(=O)=O PBYZMCDFOULPGH-UHFFFAOYSA-N 0.000 description 1
- 238000001132 ultrasonic dispersion Methods 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
- C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
- C08J3/226—Compounding polymers with additives, e.g. colouring using masterbatch techniques using a polymer as a carrier
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/098—Metal salts of carboxylic acids
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/208—Filters for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/304—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2369/00—Polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2469/00—Characterised by the use of polycarbonates; Derivatives of polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2258—Oxides; Hydroxides of metals of tungsten
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31507—Of polycarbonate
Definitions
- the present invention relates to a composite tungsten oxide fine particle-dispersed polycarbonate resin composition, a heat ray shielding molded article using the same, and a heat ray shielding laminate, and more particularly, a roofing material or wall material of a building, an automobile, etc.
- the present invention relates to a composite tungsten oxide fine particle-dispersed polycarbonate resin composition, which is widely applied to window materials and the like, with improved loss of heat ray shielding function, a heat ray shielding molded article using the same, and a heat ray shielding laminate.
- Sunlight that enters through so-called opening parts such as windows and doors provided in roof materials, wall materials, automobiles, railway cars, aircraft, ships, etc. of various buildings includes ultraviolet rays and infrared rays in addition to visible rays. ing.
- infrared rays contained in the sunlight near infrared rays having a wavelength of 800 to 2500 nm are called heat rays, and cause the temperature to rise by entering the room through the opening.
- heat rays are shielded while sufficiently absorbing visible light to maintain brightness.
- a heat ray shielding plate in which a heat ray reflective film formed by vapor-depositing a metal or metal oxide on a transparent resin film is bonded to a transparent molded body such as glass, an acrylic plate, or a polycarbonate plate has been proposed (for example, Patent Document 1). 2 and 3).
- this heat ray reflective film itself is very expensive.
- the manufacture of a heat ray shielding plate in which the heat ray reflective film is adhered to a transparent molded body requires complicated steps such as an adhesion step. For this reason, the said heat ray shielding board will become further expensive.
- the heat ray shielding plate has a drawback in that the transparent molded body and the film are peeled off due to a change with time because the adhesiveness between the transparent molded body and the heat ray reflective film is not good.
- heat ray shielding in which an organic near-infrared absorber typified by a phthalocyanine compound or an anthraquinone compound is incorporated into a thermoplastic transparent resin such as a polyethylene terephthalate resin, a polycarbonate resin, an acrylic resin, a polyethylene resin, or a polystyrene resin. Plates and films have been proposed (see, for example, Patent Documents 4 and 5). However, in order to give sufficient heat ray shielding capability to the heat ray shielding plate and film, a large amount of near infrared absorber must be blended.
- the present applicants applied a coating solution for heat ray shielding containing hexaboride fine particles in various binders as a heat ray shielding component, and applied the coating solution to various molded bodies, followed by curing.
- a masterbatch obtained by melt kneading and dispersing hexaboride fine particles in a heat ray shielding film and a thermoplastic resin is proposed (see, for example, Patent Documents 8, 9, and 10).
- the present applicant expresses the fine particles having solar radiation shielding function as a fine particle having solar radiation shielding function by the general formula WyOz (W is tungsten, O is oxygen, 2.0 ⁇ z / y ⁇ 3.0). Tungsten oxide fine particles and / or general formula MxWyOz (W is tungsten, O is oxygen, 0.001 ⁇ x / y ⁇ 1, 2.0 ⁇ z / y ⁇ 3.0)
- W is tungsten, O is oxygen, 0.001 ⁇ x / y ⁇ 1, 2.0 ⁇ z / y ⁇ 3.0
- the present applicant has proposed a master batch obtained by melt-kneading and dispersing fine particles of composite tungsten oxide in a thermoplastic resin (for example, see Patent Document 12).
- JP-A 61-277437 JP 10-146919 A Japanese Patent Laid-Open No. 2001-179887 JP-A-6-256541 JP-A-6-264050 JP-A-2-173060 JP-A-5-78544 JP 2000-96034 A JP 2000-169765 A JP 2004-59875 A International Publication No. WO2005 / 87680A1 Pumplet JP 2008-24902 A
- the molded body described above is basically used outdoors because of its characteristics, and high weather resistance is often required.
- some optical members film, resin sheet, etc.
- heat generated when receiving sunlight when used outdoors for a long period of time The problem that the heat ray shielding function deteriorates due to the influence of water, oxygen in the air, and oxygen was found.
- a polycarbonate resin composition is often desired as a transparent substrate for a heat ray shielding molded body or a heat ray shielding laminate.
- the problem to be solved by the present invention is to provide a composite tungsten oxide fine particle-dispersed polycarbonate resin composition improved in loss of the heat ray shielding function when used outdoors for a long period of time.
- An object of the present invention is to provide a heat ray shielding molded body and a heat ray shielding laminate.
- the present inventors have intensively studied for the purpose of solving the above problems. As a result, the inventors have found that the above problem can be solved by adding a predetermined amount of a metal salt containing a specific metal to the composite tungsten oxide fine particle-dispersed polycarbonate resin composition, and the present invention has been completed.
- the first invention for solving the above problems is General formula MxWyOz (where M is H, He, alkali metal, alkaline earth metal, rare earth element, Mg, Zr, Cr, Mn, Fe, Ru, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Al, Ga, In, Tl, Si, Ge, Sn, Pb, Sb, B, F, P, S, Se, Br, Te, Ti, Nb, V, Mo, Ta, One or more elements selected from Re, Be, Hf, Os, Bi, and I, W is tungsten, O is oxygen, 0.001 ⁇ x / y ⁇ 1, 2.2 ⁇ z / y ⁇ 3 .0), a resin composition comprising fine particles of a composite tungsten oxide represented by a metal salt, a polycarbonate salt resin, A composite tungsten oxide fine particle-dispersed polycarbonate resin composition, wherein the metal salt is a salt of one or
- the second invention is The metal salt is at least one selected from carboxylates, carbonyl complexes, carbonates, phosphates, perchlorates, hypochlorites, chlorites, chlorates, and hydrochlorides.
- the composite tungsten oxide fine particle-dispersed polycarbonate resin composition according to the first invention characterized by being a salt of
- the third invention is The composite tungsten oxide according to the first or second invention, wherein the addition amount of the metal salt is 0.1 to 50 parts by weight with respect to 100 parts by weight of the fine particles of the composite tungsten oxide. It is a fine particle-dispersed polycarbonate resin composition.
- the fourth invention is:
- the composite tungsten oxide fine particle-dispersed polycarbonate resin composition according to any one of the first to third inventions is diluted, melt-kneaded with a polycarbonate resin or a different kind of thermoplastic resin compatible with the polycarbonate resin, It is a heat ray shielding molded body characterized by being molded into a shape.
- the fifth invention is:
- the heat ray shielding molded article according to the fourth invention is a heat ray shielding laminate characterized by being laminated on another transparent molded article.
- the composite tungsten oxide fine particle-dispersed polycarbonate resin composition according to the present invention is diluted and melt-kneaded with a polycarbonate resin or a different type of thermoplastic resin compatible with the polycarbonate resin to form a molded body, thereby forming an optical component of the polycarbonate resin.
- Composite tungsten oxide fine particle-dispersed polycarbonate resin composition improved in loss of heat ray shielding function when used outdoors for a long time while guaranteeing mechanical properties and mechanical properties, and heat ray shielding molded article using the same
- a heat ray shielding laminate could be obtained.
- Composite tungsten oxide fine particles (For convenience, the symbol “(A)” may be added in the present invention.)
- the composite tungsten oxide fine particles (A) used in the present invention are components that exhibit a heat ray shielding effect, and have a general formula MxWyOz (where M element is H, He, alkali metal, alkaline earth metal, rare earth element, Mg) , Zr, Cr, Mn, Fe, Ru, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Al, Ga, In, Tl, Si, Ge, Sn, Pb, Sb , B, F, P, S, Se, Br, Te, Ti, Nb, V, Mo, Ta, Re, Be, Hf, Os, Bi, I, one or more elements, W is Tungsten and O are fine particles of composite tungsten oxide represented by oxygen, 0.001 ⁇ x / y ⁇ 1.1, 2.2 ⁇ z / y ⁇ 3.
- the composite tungsten oxide fine particles (A) represented by the general formula MxWyOz have a hexagonal, tetragonal, and cubic crystal structure, they are excellent in durability. It preferably includes one or more crystal structures selected from:
- M elements include Cs, Rb, K, Tl, In, Ba, Li, Ca, Sr, Fe, and Sn. Examples thereof include fine particles of composite tungsten oxide containing one or more elements selected from these elements.
- the addition amount x of M element to be added is preferably 0.001 or more and 1.1 or less in x / y, and more preferably around 0.33. This is because the value of x / y calculated theoretically from the hexagonal crystal structure is 0.33, and preferable optical characteristics can be obtained with the addition amount before and after this.
- the abundance Z of oxygen is preferably 2.2 or more and 3.0 or less in z / y. Typical examples include Cs 0.33 WO 3 , Rb 0.33 WO 3 , K 0.33 WO 3 , Ba 0.33 WO 3, etc., but useful if x, y and z are within the above ranges. Near infrared absorption characteristics can be obtained.
- the dispersed particle diameter of the composite tungsten oxide fine particles is 200 nm or less, preferably 100 nm or less. The reason is that if the dispersed particle diameter of the dispersed particles is small, light scattering in the visible light region having a wavelength of 400 nm to 780 nm due to geometric scattering or Mie scattering is reduced. As a result of the light scattering being reduced, it can be avoided that the heat ray shielding film becomes like frosted glass and clear transparency cannot be obtained. That is, when the dispersed particle diameter of the dispersed particles is 200 nm or less, the geometric scattering or Mie scattering is reduced and a Rayleigh scattering region is obtained.
- the scattered light is reduced in inverse proportion to the sixth power of the particle diameter, so that the scattering is reduced and the transparency is improved as the dispersed particle diameter is reduced. Furthermore, when the dispersed particle size is 100 nm or less, the scattered light is preferably extremely small. From the viewpoint of avoiding light scattering, it is preferable that the dispersed particle size is small. If the dispersed particle size is 1 nm or more, industrial production is easy.
- the composite tungsten oxide fine particles (A) according to the present invention are obtained by heat-treating a tungsten compound starting material in an inert gas atmosphere or a reducing gas atmosphere. be able to.
- Tungsten compound starting materials include tungsten trioxide powder, tungsten dioxide powder, or tungsten oxide hydrate, tungsten hexachloride powder, ammonium tungstate powder, or tungsten hexachloride dissolved in alcohol Tungsten oxide hydrate powder obtained by drying, or tungsten oxide hydrate powder obtained by dissolving tungsten hexachloride in alcohol and then adding water to precipitate and drying it. Or it is preferable that it is any 1 or more types selected from the tungsten compound powder obtained by drying ammonium tungstate aqueous solution and metal tungsten powder.
- the element M H, He, alkali metal, alkaline earth metal, rare earth element, Mg, Zr, Cr, Mn, Fe, Ru, Co, Rh, Ir, Ni, Pd, Pt is added to the tungsten compound starting material.
- Cu, Ag, Au, Zn, Cd, Al, Ga, In, Tl, Si, Ge, Sn, Pb, Sb, B, F, P, S, Se, Br, Te, Ti, Nb, V, Mo , Ta, Re, Be, Hf, Os, Bi, and I) are added in the form of a single element or a compound, and used as a starting material for the composite tungsten compound.
- the tungsten compound starting material containing the element M is soluble in a solvent such as water or an organic solvent.
- a solvent such as water or an organic solvent. Examples thereof include tungstate, chloride, nitrate, sulfate, oxalate, oxide, carbonate, hydroxide and the like containing the element M.
- any solution may be used.
- a temperature of 650 ° C. or higher is preferable.
- the starting material heat-treated at 650 ° C. or higher has a sufficient near-infrared absorbing power and is efficient as heat ray shielding fine particles.
- an inert gas such as Ar or N 2 can be used.
- the starting material is heat-treated at a temperature of 100 ° C. or more and 650 ° C. or less in a reducing gas atmosphere, and then at a temperature of 650 ° C. or more and 1200 ° C. or less in an inert gas atmosphere. It is preferable to heat-treat.
- the reducing gas at this time is not particularly limited, but H 2 is preferable.
- H 2 is used as the reducing gas
- the composition of the reducing gas atmosphere e.g., Ar
- the composition of the reducing gas atmosphere e.g., Ar
- the composition of the reducing gas atmosphere e.g., Ar
- the composition of the reducing gas atmosphere e.g., Ar
- the composition of the reducing gas atmosphere e.g., Ar
- the composition of the reducing gas atmosphere e.g., Ar
- the composition of the reducing gas atmosphere e.g., Ar
- the composition of the reducing gas atmosphere e.g., Ar
- the raw material powder reduced by heat treatment in a reducing gas atmosphere containing H 2 contains a magnetic phase and exhibits good heat ray shielding properties. Even in this state, it can be used as heat ray shielding fine particles.
- the weather resistance of the reduced raw material powder can be improved by stabilizing hydrogen contained in the tungsten oxide of the reduced raw material powder. Therefore, as described above, the reduced raw material powder is heat-treated in an inert atmosphere at a temperature of 650 ° C. or higher and 1200 ° C. or lower to obtain composite tungsten oxide fine particles (A) that are stable heat ray shielding fine particles. Can do.
- the inert atmosphere during the heat treatment is not particularly limited, but N 2 and Ar are preferable from an industrial viewpoint.
- the obtained composite tungsten oxide fine particles (A) are surface-treated with at least one selected from a silane compound, a titanium compound, a zirconia compound, and an aluminum compound, and the surface of the fine particles is 1 of Si, Ti, Zr, Al. Covering with an oxide containing more than one type is preferable because the weather resistance is further improved.
- the powder color of the composite tungsten oxide fine particles (A) is recommended by the International Commission on Illumination (CIE).
- CIE International Commission on Illumination
- L * is 25 to 80
- a * is -10 to 10
- b * is -15 to 15.
- High heat-resistant dispersant (For convenience, the symbol “(B)” may be added in the present invention.)
- a dispersant generally used for coating is used for the purpose of uniformly dispersing various oxide fine particles in an organic solvent.
- these dispersants are not designed on the assumption that they are used at a high temperature of 200 ° C. or higher.
- the functional group in the dispersant is decomposed by heat, and the dispersibility decreases. At the same time, problems such as yellow to brown discoloration occurred.
- a high heat-resistant dispersant (B) having a thermal decomposition temperature measured by TG-DTA of 230 ° C. or higher, preferably 250 ° C. or higher is used.
- the high heat resistant dispersant (B) there is a dispersant having an acrylic main chain as a main chain and a hydroxyl group or an epoxy group as a functional group.
- a dispersant having this structure is preferable because of its high heat resistance.
- the heat ray shielding fine particles are sufficiently dispersed, so that the visible light transmittance is ensured and good optical characteristics can be obtained, and the heat ray shielding is performed.
- the molded body is not colored yellow.
- the kneaded product is made of only polycarbonate. It was confirmed that it had exactly the same appearance as when kneaded, was colorless and transparent and was not colored at all.
- the high heat resistant dispersant (B) used in the present invention has an acrylic main chain
- a dispersant having a hydroxyl group or an epoxy group as a functional group is preferable. This is because these functional groups are adsorbed on the surface of the tungsten oxide fine particles to prevent the aggregation of the tungsten oxide fine particles and have an effect of uniformly dispersing the tungsten oxide fine particles in the heat ray shielding molded body.
- preferred examples include a dispersant having an epoxy group as a functional group and an acrylic main chain, and a dispersant having a hydroxyl group as a functional group and an acrylic main chain.
- the polycarbonate resin has a high melt-kneading temperature
- the effect of using the high heat-resistant dispersant (B) having an acrylic main chain and a hydroxyl group or an epoxy group having a thermal decomposition temperature of 250 ° C. or higher is remarkably exhibited. .
- the weight ratio between the high heat resistant dispersant (B) and the composite tungsten oxide fine particles (A) is 10 ⁇ [weight of the high heat resistant dispersant / (weight of the composite tungsten oxide fine particles)] ⁇ 0.5.
- a range is preferable. If the weight ratio is 0.5 or more, the composite tungsten oxide fine particles (A) can be sufficiently dispersed, so that the fine particles do not aggregate and sufficient optical characteristics can be obtained in the heat ray shielding molded article. Because. Moreover, if the said weight ratio is 10 or less, the mechanical characteristics (bending strength, surface hardness) of heat ray shielding molded object itself will not be impaired.
- Metal salt (For convenience in the present invention, the symbol “(C)” may be added.) By adding the metal salt (C) to the composite tungsten oxide fine particles (A), polycarbonate resin, and high heat-resistant dispersant (B) and kneading them, the reduction in infrared shielding properties over time is reduced. Thus, the composite tungsten oxide fine particle-dispersed polycarbonate resin composition according to the present invention can be obtained.
- the metal salt (C) contained in the composite tungsten oxide fine particle-dispersed polycarbonate resin composition according to the present discovery acts on the composite tungsten oxide fine particle-dispersed polycarbonate resin composition to reduce the deterioration of the infrared shielding property over time. As a reason, the present inventors infer as follows.
- the metal salt is present in the vicinity or / and on the surface of the infrared shielding material fine particles composed of the composite tungsten oxide fine particles (A). Sufficiently captures moisture that has entered from the air, etc., and also sufficiently captures radicals generated by ultraviolet rays and the like, and suppresses the generation of harmful radicals in a chain. It is inferred that the decrease is reduced.
- the action of the metal salt there are many unclear points about the action of the metal salt, and there is a possibility that actions other than those described above are working, so the action is not limited to the above actions.
- the metal salt (C) applied to the present invention is a salt composed of a metal selected from Mg, Ni, Zn, In, and Sn and an inorganic acid or an organic acid, and one or more of these are used. It is preferable. Specifically, it is a salt of the above metal, which is a carboxylate, carbonyl complex, carbonate, phosphate, perchlorate, hypochlorite, chlorite, chlorate or hydrochloride. It is preferable to select from the above.
- carboxylic acid constituting the carboxylate examples include formic acid, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, octylic acid, naphthenic acid, enanthic acid, caprylic acid, pelargonic acid, capric acid, lauric acid.
- Acid myristic acid, pentadecanoic acid, palmitic acid, margaric acid, stearic acid, oleic acid, linoleic acid, linolenic acid, arachidonic acid, docosahexaenoic acid, eicosapentaenoic acid, oxalic acid, malonic acid, succinic acid, benzoic acid, phthalic acid,
- examples include isophthalic acid, terephthalic acid, salicylic acid, gallic acid, mellitic acid, cinnamic acid, pyruvic acid, lactic acid, malic acid, citric acid, maleic acid, aconitic acid, glutaric acid, adipic acid, and amino acids.
- Examples of the ⁇ -diketone constituting the carbonyl complex salt include acetylacetone, benzoylacetone, benzoyltrifluoroacetone, hexafluoroacetylacetone, 2-thenoyltrifluoroacetone and the like.
- the content of the metal salt (C) in the composite tungsten oxide fine particle-dispersed polycarbonate resin composition is 0.1 parts by weight with respect to 100 parts by weight of the infrared shielding material fine particles composed of the composite tungsten oxide fine particles (A).
- the amount is preferably 50 parts by weight or less. If the content is 0.1 parts by weight or more, moisture that has entered from the air or the like can be sufficiently captured, and radicals generated by ultraviolet rays or the like can also be sufficiently captured. Generation
- linkage can be suppressed and the effect of reducing the time-dependent fall of an infrared shielding characteristic can fully be acquired.
- the content of the metal salt (C) in the composite tungsten oxide fine particle-dispersed polycarbonate resin composition is 0.1 to 50 parts by weight with respect to 100 parts by weight of the composite tungsten oxide fine particles (A). Preferably there is.
- Polycarbonate resin molding material (D) (For convenience in the present invention, the symbol “(D)” may be added.)
- the polycarbonate resin molding material (D) used in the present invention is not particularly limited as long as it is a polycarbonate resin used in this field.
- a particularly preferred polycarbonate resin in the present invention is polycarbonate.
- the polycarbonate one or more divalent phenolic compounds represented by 2,2-bis (4-hydroxyphenyl) propane and 2,2-bis (3,5-dibromo-4-hydroxyphenyl) propane, It is synthesized using a carbonate precursor typified by phosgene or diphenyl carbonate.
- the synthesis method can be a known method such as interfacial polymerization, melt polymerization, or solid phase polymerization.
- examples of the divalent phenol compound include bis (4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) ethane, 2,2-bis (4-hydroxyphenyl) propane, , 2bis (4-hydroxyphenyl) butane, 2,2-bis (4-hydroxyphenyl) octane, bis (4-hydroxyphenyl) phenylmethane, 2,2-bis (4-hydroxy-3-methylphenyl) propane 2,2-bis (4-hydroxy-3,5-dimethylphenyl) propane, 1,1-bis (4-hydroxy-t-butylphenyl) propane, 2,2-bis (4-hydroxy-3-bromophenyl) ) Bis (hydroxyaryl) al such as propane, 2,2-bis (4-hydroxy-3,5-dibromophenyl) propane Bis (hydroxyaryl) cycloalkanes such as 1,1-bis (4-hydroxyphenyl) cyclopentane and 1,1- (4-hydroxyphenyl) cyclohexane; 4,4′-d
- Substituted resorcins such as 4,6-tetrafluororesorcin, 2,3,4,6-tetrabromoresorcin; catechol; hydroquinone, and 3-methylhydroquinone, 3-ethylhydroquinone, 3-propylhydroquinone, 3-butylhydroquinone, 3 -T-butylhydroquinone, 3-phenylhydroquinone, 3-cumylhydroquinone, 2,3,5,6-tetramethylhydroquinone, 2,3,5,6-tetra-t-butylhydroquinone, 2,3,
- carbonate precursors represented by phosgene or diphenyl carbonate to be reacted with these divalent phenol compounds, for example, ditolyl carbonate, bis (chlorophenyl) carbonate, m-cresyl carbonate, dinaphthyl carbonate. , Bis (diphenyl) carbonate, diethyl carbonate, dimethyl carbonate, dibutyl carbonate, dicyclohexyl carbonate and the like, but are not limited thereto.
- diphenyl carbonate is used.
- These carbonate precursors may also be used alone or in combination of two or more.
- dicarboxylic acid or dicarboxylic acid ester When manufacturing a polycarbonate, you may contain dicarboxylic acid or dicarboxylic acid ester as an acid component.
- dicarboxylic acids and dicarboxylic acid esters include aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, diphenyl terephthalate, diphenyl isophthalate; succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid Aliphatic dicarboxylic acids such as acid, decanedioic acid, dodecanedioic acid, diphenyl sebacate, diphenyl decanedioate, diphenyl dodecanedioate; cyclopropanedicarboxylic acid, 1,2-cyclobutanedicarboxylic acid, 1,3-cyclobutanedicarboxylic acid 1,2′-cyclopen
- dicarboxylic acids or dicarboxylic acid esters may be used alone or in combination of two or more.
- the dicarboxylic acid or dicarboxylic acid ester is contained in the carbonate precursor in an amount of preferably 50 mol% or less, more preferably 30 mol% or less.
- a polyfunctional compound having 3 or more functional groups in one molecule can be used.
- compounds having a phenolic hydroxyl group or carboxyl are preferred, and compounds containing three phenolic hydroxyl groups are particularly preferred.
- a dispersion liquid in which the composite tungsten oxide fine particles (A) are dispersed in an arbitrary solvent is prepared using a method such as a bead mill, a ball mill, a sand mill, or an ultrasonic dispersion.
- the dispersion, the high heat resistant dispersant (B), the metal salt (C), the granular material or pellet of the polycarbonate resin molding material (D), and other additives as necessary. , Ribbon blenders, tumblers, nauter mixers, Henschel mixers, super mixers, planetary mixers, etc.
- the high heat-resistant dispersant (B) is added to the dispersion of the composite tungsten oxide fine particles (A), the solvent is removed by a known method, and the obtained powder and polycarbonate resin particles A mixture in which the composite tungsten oxide fine particles (A) are uniformly dispersed in the polycarbonate resin molding material (D) by uniformly melting and mixing the body or pellets and the metal salt (C) and other additives as required.
- the method of obtaining is also mentioned.
- the powder of the composite tungsten oxide fine particles (A) not subjected to the dispersion treatment, the high heat resistant dispersant (B), and the metal salt (C) are directly added to the polycarbonate resin molding material (D).
- a method of uniformly melting and mixing can also be used.
- the composite tungsten oxide fine particles (A) and other additives such as the high heat resistant dispersant (B) and the metal salt (C) are added.
- the composite tungsten oxide fine particles (A) and other additives such as the high heat resistant dispersant (B), the metal salt (C)
- the polycarbonate resin molding material (D) is in a solid state, such as pellets, composite tungsten oxide fine particles (A) and other additives, a high heat resistant dispersant (B), a metal salt
- Examples thereof include a method of melting and kneading with an extruder after mixing C).
- the dispersion method is not limited to these methods as long as the composite tungsten oxide fine particles (A) and the like are uniformly dispersed in the polycarbonate resin molding material (D).
- Heat ray shielding molded body The heat ray shielding molded body according to the present invention is obtained by diluting and melting the resin composition containing the composite tungsten oxide fine particle dispersed polycarbonate resin composition with the polycarbonate resin molding material (D) or a different kind of thermoplastic resin. A molded body that is kneaded and then molded into a predetermined shape.
- injection molding methods such as injection molding, extrusion molding, compression molding, or rotational molding can be used.
- injection molding and extrusion molding are preferable because they can be efficiently molded into a desired shape.
- a method for obtaining a plate-shaped (sheet-shaped) or film-shaped heat ray shielding molded article by extrusion molding a method is adopted in which a molten acrylic resin extruded using an extruder such as a T-die is taken out while being cooled by a cooling roll. .
- the molding temperature varies depending on the composition of the polycarbonate resin molding material to be used, but is heated to a temperature 50 to 150 ° C. higher than the melting point or glass transition temperature of the resin so that sufficient fluidity can be obtained.
- the temperature is 200 ° C. or higher, preferably 240 ° C. to 330 ° C. If the molding temperature is 200 ° C. or higher, the viscosity specific to the polymer can be lowered, and therefore, the surface-coated composite tungsten oxide fine particles can be uniformly dispersed in the polycarbonate resin, which is preferable.
- the molding temperature is 350 ° C. or lower, deterioration due to decomposition of the polycarbonate resin can be avoided.
- the heat ray shielding laminate according to the present invention is a laminate in which the above-described heat ray shielding molded article is laminated on a transparent molded article.
- This heat ray shielding laminate can be used for window materials, arcades, ceiling domes, carports, and the like used for openings of building roof materials, wall materials, automobiles, trains, airplanes and the like.
- the heat ray shielding molded body according to the present invention is laminated on other transparent molded bodies such as inorganic glass, resin glass, and resin film by an arbitrary method, and the heat ray shielding laminated body is transparent to the integrated visible light. As a structural material.
- a heat ray shielding molded body previously formed into a film shape is laminated and integrated with inorganic glass by a heat laminating method to obtain a heat ray shielding laminated body transparent to visible light having a heat ray shielding function and a scattering prevention function. be able to.
- heat ray shielding that is transparent to visible light by heat lamination method, coextrusion method, press molding method, injection molding method, etc. It is also possible to obtain a laminate.
- the heat ray-shielding laminate transparent to visible light can be used as a more useful structural material by complementing each other's drawbacks while effectively exhibiting the advantages of each molded body.
- the composite tungsten oxide fine particle dispersion according to Example 1 has a high heat resistance dispersant having an acrylic main chain as a main chain, an epoxy group as a functional group, a thermal decomposition temperature of 255 ° C., and a molecular weight of about 20000. And a weight ratio of the high heat-resistant dispersant and the composite tungsten oxide fine particles [high heat-resistant dispersant / composite tungsten oxide fine particles] was adjusted to be 4. Then, toluene was removed using the vacuum dryer and the composite tungsten oxide fine particle dispersion powder which concerns on Example 1 was obtained.
- the optical properties (visible light transmittance T (%), solar radiation transmittance ST (%), haze H (%)) of the heat ray shielding molded article according to Example 1 obtained were evaluated. The evaluation results are shown in Table 1. Subsequently, after holding the heat ray shielding molded article according to Example 1 in an 85 ° C. ⁇ 90% RH bath for 7 days, optical properties (visible light transmittance T (%), solar light transmittance ST (%), haze H (%)). The evaluation results are shown in Table 1.
- Examples 2 to 7 As shown in Table 1, the same operation as in Example 1 except that 100 parts by weight of polycarbonate resin pellets, 0.15 part by weight of A powder, and 0.0015 part by weight of Mg octylate as a metal salt were uniformly mixed. The heat ray shielding molded object which concerns on Example 2 was obtained. Similarly, the same operation as in Example 1 was performed except that 100 parts by weight of polycarbonate resin pellets, 0.15 parts by weight of A powder, and 0.075 parts by weight of magnesium stearate as a metal salt were uniformly mixed. The heat ray shielding molded object which concerns on Example 3 was obtained.
- Example 2 the same operation as in Example 1 was performed except that 100 parts by weight of polycarbonate resin pellets, 0.15 part by weight of A powder, and 0.03 part by weight of Ni octylate as a metal salt were uniformly mixed. The heat ray shielding molded object which concerns on Example 4 was obtained. Similarly, except that 100 parts by weight of polycarbonate resin pellets, 0.15 parts by weight of A powder, and 0.03 part by weight of Zn octylate as a metal salt were uniformly mixed, the same operation as in Example 1 was performed, The heat ray shielding molded object which concerns on Example 5 was obtained.
- Example 7 the same operation as in Example 1 was performed except that 100 parts by weight of polycarbonate resin pellets, 0.15 part by weight of A powder, and 0.03 part by weight of octylate In as a metal salt were uniformly mixed. The heat ray shielding molded object which concerns on Example 6 was obtained. Similarly, except that 100 parts by weight of polycarbonate resin pellets, 0.15 parts by weight of A powder, and 0.03 parts by weight of octylic acid Sn as a metal salt were uniformly mixed, the same operation as in Example 1 was performed, The heat ray shielding molded object which concerns on Example 7 was obtained.
- the optical properties (visible light transmittance T (%), solar radiation transmittance ST (%), haze H (%)) of the heat ray shielding molded articles according to Examples 2 to 7 obtained were evaluated. The evaluation results are shown in Table 1. Subsequently, after holding the heat ray shielding molded bodies according to Examples 2 to 7 in an 85 ° C. ⁇ 90% RH bath for 7 days, optical characteristics (visible light transmittance T (%), solar light transmittance ST (%), Haze H (%)) was evaluated. The evaluation results are shown in Table 1.
- Example 3 Except that 100 parts by weight of polycarbonate resin pellets, 0.15 part by weight of A powder, and 0.03 part by weight of Mn octylate as a metal salt were uniformly mixed, the same operation as in Example 1 was performed, The heat ray shielding molded object which concerns on the comparative example 3 was obtained.
- the optical properties (visible light transmittance T (%), solar radiation transmittance ST (%), haze H (%)) of the heat ray shielding molded articles according to Comparative Examples 1 to 3 obtained were evaluated. The evaluation results are shown in Table 1. Subsequently, after holding the heat ray shielding molded bodies according to Comparative Examples 1 to 3 in an 85 ° C. ⁇ 90% RH bath for 7 days, optical characteristics (visible light transmittance T (%), solar light transmittance ST (%), Haze H (%)) was evaluated. The evaluation results are shown in Table 1.
- Example 4 the metal salt to be added is Ni octylate, in Example 5, the metal salt to be added is Zn octylate, in Example 6, the metal salt to be added is In octylate, and in Example 7 is added
- the metal salt to be used is octylic acid Sn.
- Examples 4 to 7 using the metal salt as can be seen from Table 1, compared with the heat ray shielding molded body according to Comparative Example 1 according to the prior art, the stability over time of the infrared shielding characteristics is excellent. You can see that it works.
- Comparative Example 2 is a comparative example in which the metal salt to be added is Al octylate, and in Comparative Example 3, the metal salt to be added is Mn octylate.
- Comparative Example 2 in which the metal element was changed to Al
- Comparative Example 3 in which the metal element was changed to Mn, the deterioration of the near-infrared shielding characteristics in the accelerated test by heating and humidification of holding at 85 ° C. ⁇ 90% RH for 7 days was compared. The effect to be suppressed as compared with Example 1 was not confirmed.
- the heat ray shielding molded body and the heat ray shielding laminate obtained by using the composite tungsten oxide fine particle dispersed polycarbonate resin composition of the present invention to which a metal salt is added have unprecedented stability over time, various buildings and vehicles Industrial applicability that can be applied to other window materials.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Toxicology (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Abstract
Description
一方、光学的特性および機械的特性の観点から、熱線遮蔽成形体や熱線遮蔽積層体用の透明基材としてポリカーボネート樹脂組成物が望まれる場合が多い。
一般式MxWyOz(但し、Mは、H、He、アルカリ金属、アルカリ土類金属、希土類元素、Mg、Zr、Cr、Mn、Fe、Ru、Co、Rh、Ir、Ni、Pd、Pt、Cu、Ag、Au、Zn、Cd、Al、Ga、In、Tl、Si、Ge、Sn、Pb、Sb、B、F、P、S、Se、Br、Te、Ti、Nb、V、Mo、Ta、Re、Be、Hf、Os、Bi、Iの内から選択される1種以上の元素、Wはタングステン、Oは酸素、0.001≦x/y≦1、2.2≦z/y≦3.0)で表される複合タングステン酸化物の微粒子と、金属塩と、ポリカーボネート樹脂とを含む樹脂組成物であって、
当該金属塩が、Mg、Ni、Zn、In、Snの内から選択される1種類以上の金属元素の塩であることを特徴とする複合タングステン酸化物微粒子分散ポリカーボネート樹脂組成物である。
前記金属塩が、カルボン酸塩、カルボニル錯塩、炭酸塩、リン酸塩、過塩素酸塩、次亜塩素酸塩、亜塩素酸塩、塩素酸塩、塩酸塩の内から選択される1種類以上の塩であることを特徴とする第1の発明に記載の複合タングステン酸化物微粒子分散ポリカーボネート樹脂組成物である。
前記金属塩の添加量が、前記複合タングステン酸化物の微粒子100重量部に対して、0.1~50重量部であることを特徴とする第1または第2の発明に記載の複合タングステン酸化物微粒子分散ポリカーボネート樹脂組成物である。
第1~第3の発明のいずれかに記載の複合タングステン酸化物微粒子分散ポリカーボネート樹脂組成物が、ポリカーボネート樹脂またはポリカーボネート樹脂と相溶性を有する異種の熱可塑性樹脂により希釈・溶融混練され、かつ所定の形状に成形されたものであることを特徴とする熱線遮蔽成形体である。
第4の発明に記載の熱線遮蔽成形体が、他の透明成形体上に積層されていることを特徴とする熱線遮蔽積層体である。
本発明に用いる複合タングステン酸化物微粒子(A)は、熱線遮蔽効果を発現する成分であり、一般式MxWyOz(但し、M元素は、H、He、アルカリ金属、アルカリ土類金属、希土類元素、Mg、Zr、Cr、Mn、Fe、Ru、Co、Rh、Ir、Ni、Pd、Pt、Cu、Ag、Au、Zn、Cd、Al、Ga、In、Tl、Si、Ge、Sn、Pb、Sb、B、F、P、S、Se、Br、Te、Ti、Nb、V、Mo、Ta、Re、Be、Hf、Os、Bi、Iのうちから選択される1種類以上の元素、Wはタングステン、Oは酸素、0.001≦x/y≦1.1、2.2≦z/y≦3.0)で示される複合タングステン酸化物の微粒子である。
本発明に係る複合タングステン酸化物微粒子(A)は、タングステン化合物出発原料を、不活性ガス雰囲気または還元性ガス雰囲気中で熱処理して得ることができる。
従来、塗料用として一般的に使用されている分散剤は、様々な酸化物微粒子を有機溶剤中に均一に分散する目的で使用されている。しかし本発明者らの検討によれば、これらの分散剤は200℃以上の高温で使用されることを想定されて設計されていない。具体的には、本実施形態において、熱線遮蔽微粒子と熱可塑性樹脂とを溶融混練する際に従来の分散剤を使用すると、当該分散剤中の官能基が熱により分解され、分散能が低下すると伴に黄~茶色に変色する等の不具合を起こしていたのである。
分散剤の熱分解温度が230℃以上であれば、成形時に当該分散剤が熱分解することなく分散能を維持すると伴に、当該分散剤自体が、黄~茶色に変色することもない。この結果、製造される熱線遮蔽成形体において、熱線遮蔽微粒子が十分に分散される結果、可視光透過率が良好に確保されて、良好な光学特性を得ることができると伴に、当該熱線遮蔽成形体が黄色に着色することもない。
具体的には、エポキシ基を官能基として有しアクリル主鎖を有する分散剤、水酸基を官能基として有しアクリル主鎖を有する分散剤が、好ましい例として挙げられる。
ポリカーボネート樹脂は溶融混練温度が高いので、熱分解温度が250℃以上であるアクリル主鎖と水酸基またはエポキシ基とを有する高耐熱性分散剤(B)を使用することの効果が顕著に発揮される。
上述した複合タングステン酸化物の微粒子(A)とポリカーボネート樹脂と高耐熱性分散剤(B)とへ、金属塩(C)を添加して混練することで、赤外線遮蔽特性の経時的な低下が低減された、本発明に係る複合タングステン酸化物微粒子分散ポリカーボネート樹脂組成物を得ることが出来る。
本発見に係る複合タングステン酸化物微粒子分散ポリカーボネート樹脂組成物に含まれる金属塩(C)が、複合タングステン酸化物微粒子分散ポリカーボネート樹脂組成物に作用してその赤外線遮蔽特性の経時的な低下を低減させる理由として、本発明者等は、以下のように推察している。
具体的には、上記金属の塩であって、カルボン酸塩、カルボニル錯塩、炭酸塩、リン酸塩、過塩素酸塩、次亜塩素酸塩、亜塩素酸塩、塩素酸塩、塩酸塩の内から選択されることが好ましい。
そして、上記カルボン酸塩を構成するカルボン酸としては、例えば、ギ酸、酢酸、プロピオン酸、酪酸、吉草酸、カプロン酸、オクチル酸、ナフテン酸、エナント酸、カプリル酸、ペラルゴン酸、カプリン酸、ラウリン酸、ミリスチン酸、ペンタデカン酸、パルミチン酸、マルガリン酸、ステアリン酸、オレイン酸、リノール酸、リノレン酸、アラキドン酸、ドコサヘキサエン酸、エイコサペンタ酸、シュウ酸、マロン酸、コハク酸、安息香酸、フタル酸、イソフタル酸、テレフタル酸、サリチル酸、没食子酸、メリト酸、ケイ皮酸、ピルビン酸、乳酸、リンゴ酸、クエン酸、マレイン酸、アコニット酸、グルタル酸、アジピン酸、アミノ酸等が挙げられる。また、上記カルボニル錯塩を構成するβ-ジケトンとしては、アセチルアセトン、ベンゾイルアセトン、ベンゾイルトリフルオロアセトン、ヘキサフルオロアセチルアセトン、2-テノイルトリフルオロアセトン等が例示される。
上記含有量が0.1重量部以上あれば、空気中等から浸入してきた水分を十分に捕捉することが出来、また、紫外線等によって発生したラジカルも十分に捕捉することが出来るので、有害ラジカルが連鎖的に発生するのを抑制出来、赤外線遮蔽特性の経時的な低下を低減させる効果を十分に得ることが出来る。他方、上記含有量が50重量部以下であれば、複合タングステン酸化物微粒子分散ポリカーボネート樹脂組成物を用いて得られる熱線遮蔽成形体中における複合タングステン酸化物微粒子(A)の分散性を担保することが出来、ヘイズの悪化が起こらない。
従って、複合タングステン酸化物微粒子分散ポリカーボネート樹脂組成物における上記金属塩(C)の含有量は、上記複合タングステン酸化物微粒子(A)100重量部に対して0.1重量部以上50重量部以下であることが好ましい。
本発明に用いるポリカーボネート樹脂成形材料(D)としては、この分野で使用されているポリカーボネート樹脂であれば特に制限されない。
本発明において特に好ましいポリカーボネート樹脂は、ポリカーボネートである。ポリカーボネートとしては、2,2-ビス(4-ヒドロキシフェニル)プロパン、2,2-ビス(3,5-ジブロモ-4-ヒドロキシフェニル)プロパンに代表される二価のフェノール系化合物の一種以上と、ホスゲンまたはジフェニルカーボネート等で代表されるカーボネート前駆体を用いて合成される。合成方法は、界面重合、溶融重合または固相重合等の公知の方法によることができる。
ポリカーボネートを製造する際に、1分子中に3個以上の官能基を有する多官能性化合物を使用できる。これら多官能性化合物としては、フェノール性水酸基またはカルボキシルを有する化合物が好ましく、特にフェノール性水酸基を3個含有する化合物が好ましい。
複合タングステン酸化物微粒子(A)、高耐熱性分散剤(B)、金属塩(C)をポリカーボネート樹脂成形材料(D)へ分散して、複合タングステン酸化物微粒子分散ポリカーボネート樹脂組成物を得る。
当該複合タングステン酸化物微粒子(A)、高耐熱性分散剤(B)、金属塩(C)のポリカーボネート樹脂への分散方法は、複合タングステン酸化物微粒子(A)等の微粒子が、均一にポリカーボネート樹脂成形材料(D)へ分散できる方法であれば任意に選択できる。
分散方法は、ポリカーボネート樹脂成形材料(D)中に、複合タングステン酸化物微粒子(A)等が均一に分散されていればよく、これらの方法に限定されない。
本発明に係る熱線遮蔽成形体は、上記複合タングステン酸化物微粒子分散ポリカーボネート樹脂組成物を含む樹脂組成物が、ポリカーボネート樹脂成形材料(D)、または異種の熱可塑性樹脂により希釈・溶融混練され、その後、所定の形状に成形されてなる成形体である。
本発明に係る熱線遮蔽積層体は、上述した熱線遮蔽成形体が、透明成形体に積層されてなる積層体である。この熱線遮蔽積層体は、それ自体で建築物の屋根材、壁材、自動車、電車、航空機などの開口部に使用される窓材、アーケード、天井ドーム、カーポート等に使用することができる。
また、本発明に係る熱線遮蔽成形体を、無機ガラス、樹脂ガラス、樹脂フィルムなどの他の透明成形体に任意の方法で積層し、一体化された可視光線に対して透明な熱線遮蔽積層体として、構造材に使用することもできる。例えば、予めフィルム状に成形した熱線遮蔽成形体を、無機ガラスに熱ラミネート法により積層一体化することで、熱線遮蔽機能、飛散防止機能を有する可視光線に対して透明な熱線遮蔽積層体を得ることができる。
また、熱ラミネート法、共押出法、プレス成形法、射出成形法等により、熱線遮蔽成形体の成形と同時に他の透明成形体に積層一体化することで、可視光線に対して透明な熱線遮蔽積層体を得ることも可能である。上記可視光線に対して透明な熱線遮蔽積層体は、相互の成形体の持つ利点を有効に発揮させつつ、相互の欠点を補完することで、より有用な構造材として使用することができる。
[原料]
(1)複合タングステン酸化物微粒子:Cs0.33WO3微粒子分散物
(2)ポリカーボネート樹脂成形材料:ポリカーボネート樹脂ペレット(Sabic社製、商品名レキサンML9103R-112)
[評価方法]
また、本実施例において得られた熱線遮蔽成形体の光学特性評価に関し、可視光透過率VLT(単位:%)、日射透過率ST(単位:%)は、分光光度計U-4100(日立製作所製)を使用して測定した。また、ヘイズ(H)(単位:%)は、ヘイズメーター(村上色彩研究所製)を使用し、JIS K 7136に準拠して測定した。
(実施例1)
H2WO450gとCsOH17.0g(Cs/W=0.3相当)とを秤量し、メノウ乳鉢で十分混合した。得られた混合粉末を、N2ガスをキャリアとした5%H2ガスを供給する雰囲気下で加熱して、600℃の温度で1時間の還元処理を行った。その後、N2ガスを供給する雰囲気下で800℃の温度で30分間加熱して焼成し、微粒子(組成式はCs0.33WO3、粉体色はL*が35.2745、a*が1.4918、b*が-5.3118)を得た。
得られた微粒子を5重量%と、主鎖としてアクリル主鎖を有し、官能基としてエポキシ基を有し熱分解温度255℃で、分子量が約20000の高耐熱性分散剤を5重量%と、トルエンを90重量%とを秤量し、0.3mmφZrO2ビ-ズを入れたペイントシェーカーに装填し、6時間粉砕・分散処理することによって、実施例1に係る複合タングステン酸化物微粒子分散液を調製した。
ここで、実施例1に係る複合タングステン酸化物微粒子分散液内におけるタングステン酸化物微粒子の分散粒子径を測定したところ75nmであった。
次に、当該ペレットとポリカーボネート樹脂ペレットとを、複合タングステン酸化物微粒子の含有量が0.05重量%となるように、均一に混合した。当該混合物を、射出成形機を使用して10cm×5cm、厚さ2.0mmのシート状として、実施例1に係る熱線遮蔽成形体を得た。
続けて、実施例1に係る熱線遮蔽成形体を85℃×90%RH浴中に7日間保持した後、光学特性(可視光透過率T(%)、日射透過率ST(%)、ヘイズH(%))を評価した。評価結果を表1に示す。
表1に示すように、ポリカーボネート樹脂ペレット100重量部と、A粉0.15重量部と、金属塩としてオクチル酸Mg0.0015重量部とを均一に混合した以外は、実施例1と同様の操作をおこなって、実施例2に係る熱線遮蔽成形体を得た。
同様に、ポリカーボネート樹脂ペレット100重量部と、A粉0.15重量部と、金属塩としてステアリン酸Mg0.075重量部とを均一に混合した以外は、実施例1と同様の操作をおこなって、実施例3に係る熱線遮蔽成形体を得た。
同様に、ポリカーボネート樹脂ペレット100重量部と、A粉0.15重量部と、金属塩としてオクチル酸Ni0.03重量部とを均一に混合した以外は、実施例1と同様の操作をおこなって、実施例4に係る熱線遮蔽成形体を得た。
同様に、ポリカーボネート樹脂ペレット100重量部と、A粉0.15重量部と、金属塩としてオクチル酸Zn0.03重量部とを均一に混合した以外は、実施例1と同様の操作をおこなって、実施例5に係る熱線遮蔽成形体を得た。
同様に、ポリカーボネート樹脂ペレット100重量部と、A粉0.15重量部と、金属塩としてオクチル酸In0.03重量部とを均一に混合した以外は、実施例1と同様の操作をおこなって、実施例6に係る熱線遮蔽成形体を得た。
同様に、ポリカーボネート樹脂ペレット100重量部と、A粉0.15重量部と、金属塩としてオクチル酸Sn0.03重量部とを均一に混合した以外は、実施例1と同様の操作をおこなって、実施例7に係る熱線遮蔽成形体を得た。
続けて、実施例2~7に係る熱線遮蔽成形体を85℃×90%RH浴中に7日間保持した後、光学特性(可視光透過率T(%)、日射透過率ST(%)、ヘイズH(%))を評価した。評価結果を表1に示す。
表1に示すように、ポリカーボネート樹脂ペレット100重量部と、A粉0.15重量部とを均一に混合し、金属塩を添加しない以外は、実施例1と同様の操作をおこなって、比較例1に係る熱線遮蔽成形体を得た。
また、ポリカーボネート樹脂ペレット100重量部と、A粉0.15重量部と、金属塩としてオクチル酸Al0.03重量部とを均一に混合した以外は、実施例1と同様の操作をおこなって、比較例2に係る熱線遮蔽成形体を得た。
同様に、ポリカーボネート樹脂ペレット100重量部と、A粉0.15重量部と、金属塩としてオクチル酸Mn0.03重量部とを均一に混合した以外は、実施例1と同様の操作をおこなって、比較例3に係る熱線遮蔽成形体を得た。
続けて、比較例1~3に係る熱線遮蔽成形体を85℃×90%RH浴中に7日間保持した後、光学特性(可視光透過率T(%)、日射透過率ST(%)、ヘイズH(%))を評価した。評価結果を表1に示す。
(1)実施例1~3においては、金属塩としてMg塩を添加している。この為、金属塩が添加されていない比較例1と較べて、85℃×90%RH7日間保持という加熱・加湿による加速試験での近赤外線遮蔽特性の劣化が抑制されていることが、表1から確認される。すなわち、実施例1~3に係る熱線遮蔽成形体は、従来技術に係る比較例1に係る熱線遮蔽成形体に較べて、優れた赤外線遮蔽特性の経時安定性を発揮することが分かる。
(2)実施例4は添加する金属塩をオクチル酸Niとし、実施例5は添加する金属塩をオクチル酸Znとし、実施例6は添加する金属塩をオクチル酸Inとし、実施例7は添加する金属塩をオクチル酸Snとした実施例である。当該金属塩を用いた実施例4~7においても、表1から確認されるように、従来技術に係る比較例1に係る熱線遮蔽成形体に較べて、優れた赤外線遮蔽特性の経時安定性を発揮することが分かる。
(3)比較例2は添加する金属塩をオクチル酸Alとし、比較例3では添加する金属塩をオクチル酸Mnとした比較例である。金属元素がAlへ変更された比較例2や、Mnへ変更された比較例3においては、85℃×90%RH7日間保持という加熱・加湿による加速試験での近赤外線遮蔽特性の劣化が、比較例1に較べて抑制される効果は確認されなかった。
Claims (5)
- 一般式MxWyOz(但し、Mは、H、He、アルカリ金属、アルカリ土類金属、希土類元素、Mg、Zr、Cr、Mn、Fe、Ru、Co、Rh、Ir、Ni、Pd、Pt、Cu、Ag、Au、Zn、Cd、Al、Ga、In、Tl、Si、Ge、Sn、Pb、Sb、B、F、P、S、Se、Br、Te、Ti、Nb、V、Mo、Ta、Re、Be、Hf、Os、Bi、Iの内から選択される1種以上の元素、Wはタングステン、Oは酸素、0.001≦x/y≦1、2.2≦z/y≦3.0)で表される複合タングステン酸化物の微粒子と、金属塩と、ポリカーボネート樹脂とを含む樹脂組成物であって、
当該金属塩が、Mg、Ni、Zn、In、Snの内から選択される1種類以上の金属元素の塩であることを特徴とする複合タングステン酸化物微粒子分散ポリカーボネート樹脂組成物。 - 前記金属塩が、カルボン酸塩、カルボニル錯塩、炭酸塩、リン酸塩、過塩素酸塩、次亜塩素酸塩、亜塩素酸塩、塩素酸塩、塩酸塩の内から選択される1種類以上の塩であることを特徴とする請求項1に記載の複合タングステン酸化物微粒子分散ポリカーボネート樹脂組成物。
- 前記金属塩の添加量が、前記複合タングステン酸化物の微粒子100重量部に対して、0.1~50重量部であることを特徴とする請求項1または2に記載の複合タングステン酸化物微粒子分散ポリカーボネート樹脂組成物。
- 請求項1~3のいずれかに記載の複合タングステン酸化物微粒子分散ポリカーボネート樹脂組成物が、ポリカーボネート樹脂またはポリカーボネート樹脂と相溶性を有する異種の熱可塑性樹脂により希釈・溶融混練され、かつ所定の形状に成形されたものであることを特徴とする熱線遮蔽成形体。
- 請求項4に記載の熱線遮蔽成形体が、他の透明成形体上に積層されていることを特徴とする熱線遮蔽積層体。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IN7007DEN2014 IN2014DN07007A (ja) | 2012-02-22 | 2013-02-20 | |
US14/380,538 US9612366B2 (en) | 2012-02-22 | 2013-02-20 | Composite tungsten oxide particle dispersion polycarbonate resin composition and heat-ray shielding sintered compact and heat-ray shielding laminate using the composition |
KR1020147026129A KR101967018B1 (ko) | 2012-02-22 | 2013-02-20 | 복합 텅스텐 산화물 미립자 분산 폴리카보네이트 수지 조성물, 및 이를 이용한 열선 차폐 성형체 및 열선 차폐 적층체 |
ES13752375.9T ES2674677T3 (es) | 2012-02-22 | 2013-02-20 | Composición de resina de policarbonato que contiene micropartículas dispersas de óxido de tungnsteno compuesto y cuerpo moldeado de bloqueo de calor radiado y laminado de bloqueo de calor radiado que utiliza dicha composición |
EP13752375.9A EP2818519B1 (en) | 2012-02-22 | 2013-02-20 | Polycarbonate resin composition containing dispersed composite-tungsten-oxide microparticles and radiated-heat-blocking molded body and radiated-heat-blocking laminate using said composition |
CN201380010598.6A CN104487511B (zh) | 2012-02-22 | 2013-02-20 | 分散有复合钨氧化物微粒的聚碳酸酯树脂组合物及使用其的热线屏蔽成形体以及热线屏蔽层叠体 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012-035856 | 2012-02-22 | ||
JP2012035856A JP5942466B2 (ja) | 2012-02-22 | 2012-02-22 | 複合タングステン酸化物微粒子分散ポリカーボネート樹脂組成物およびそれを用いた熱線遮蔽成形体並びに熱線遮蔽積層体 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013125563A1 true WO2013125563A1 (ja) | 2013-08-29 |
Family
ID=49005745
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2013/054135 WO2013125563A1 (ja) | 2012-02-22 | 2013-02-20 | 複合タングステン酸化物微粒子分散ポリカーボネート樹脂組成物およびそれを用いた熱線遮蔽成形体並びに熱線遮蔽積層体 |
Country Status (9)
Country | Link |
---|---|
US (1) | US9612366B2 (ja) |
EP (1) | EP2818519B1 (ja) |
JP (1) | JP5942466B2 (ja) |
KR (1) | KR101967018B1 (ja) |
CN (1) | CN104487511B (ja) |
ES (1) | ES2674677T3 (ja) |
IN (1) | IN2014DN07007A (ja) |
TW (1) | TWI589641B (ja) |
WO (1) | WO2013125563A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019054476A1 (ja) * | 2017-09-14 | 2019-03-21 | 住友金属鉱山株式会社 | 近赤外線吸収繊維およびこれを用いた繊維製品、並びにそれらの製造方法 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6136819B2 (ja) * | 2013-09-27 | 2017-05-31 | 住友金属鉱山株式会社 | 熱線遮蔽用合わせ構造体 |
TWI680946B (zh) * | 2014-02-07 | 2020-01-01 | 加美嘉華光電材料股份有限公司 | 紅外線遮蔽體及其紅外線吸收材料 |
TWI640479B (zh) * | 2014-02-07 | 2018-11-11 | 加美嘉華光電材料股份有限公司 | 複合氧化鎢奈米粒子之製造方法 |
US9145492B1 (en) * | 2014-04-01 | 2015-09-29 | King Fahd University Of Petroleum And Minerals | Method to produce ultra-high molecular weight polyethylene |
JP2017211399A (ja) * | 2014-10-09 | 2017-11-30 | コニカミノルタ株式会社 | 赤外線遮蔽膜及び赤外線遮蔽フィルム |
WO2017031345A1 (en) | 2015-08-18 | 2017-02-23 | Wisconsin Alumni Research Foundation | METHODS AND COMPOSITIONS FOR ON-DEMAND RELEASE OF ClO2 GAS FROM UV-ACTIVATED CHLORITE ION |
JP6704322B2 (ja) | 2015-09-30 | 2020-06-03 | 日東電工株式会社 | シートおよび複合シート |
JP2017066485A (ja) * | 2015-09-30 | 2017-04-06 | 日東電工株式会社 | シートおよび複合シート |
TWI726959B (zh) * | 2015-12-18 | 2021-05-11 | 日商住友金屬礦山股份有限公司 | 複合鎢氧化物超微粒子分散體、中間膜、夾層構造體及複合鎢氧化物超微粒子分散體之製造方法 |
CN108779000B (zh) * | 2015-12-18 | 2021-03-09 | 住友金属矿山株式会社 | 复合钨氧化物超微粒子及其分散液 |
JP7050046B2 (ja) * | 2017-02-23 | 2022-04-07 | 住友化学株式会社 | ランプカバー |
JP7067557B2 (ja) * | 2017-06-19 | 2022-05-16 | 住友金属鉱山株式会社 | 農園芸用覆土フィルムとその製造方法 |
CN110770310A (zh) * | 2017-06-19 | 2020-02-07 | 住友金属矿山株式会社 | 防伪油墨用组合物、防伪油墨、防伪用印刷物以及防伪油墨用组合物的制造方法 |
JP6854897B2 (ja) * | 2017-08-09 | 2021-04-07 | 帝人株式会社 | ヘッドアップディスプレイ表示装置およびそれに用いる透光部材 |
KR20200128038A (ko) * | 2018-03-05 | 2020-11-11 | 스미또모 가가꾸 가부시키가이샤 | 착색 경화성 수지 조성물, 컬러 필터 및 표시 장치 |
TWI727675B (zh) * | 2020-02-26 | 2021-05-11 | 南亞塑膠工業股份有限公司 | 紅外線遮蔽膜及其製造方法 |
JP7415890B2 (ja) * | 2020-06-05 | 2024-01-17 | 住友金属鉱山株式会社 | 暗色粉分散液、暗色粉分散体ならびに着色層付基材 |
CN115698205A (zh) * | 2020-06-05 | 2023-02-03 | 住友金属矿山株式会社 | 深色粉末分散液、深色粉末分散体和带有着色层的基材 |
JP2022100880A (ja) * | 2020-12-24 | 2022-07-06 | 住友金属鉱山株式会社 | 熱線遮蔽樹脂シート材 |
CN115746568B (zh) * | 2022-11-18 | 2023-07-28 | 北京工业大学 | 一种耐高温硅橡胶材料及其制备方法 |
Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61277437A (ja) | 1985-06-04 | 1986-12-08 | 豊田合成株式会社 | 熱線反射樹脂ガラス |
JPH02173060A (ja) | 1988-12-26 | 1990-07-04 | Teijin Chem Ltd | 熱線遮断板状体 |
JPH0578544A (ja) | 1991-09-18 | 1993-03-30 | Kuraray Co Ltd | 熱線反射板状体 |
JPH06256541A (ja) | 1993-03-05 | 1994-09-13 | Mitsui Toatsu Chem Inc | 近赤外線吸収フィルム及びそれを用いた熱線遮断シート |
JPH06264050A (ja) | 1993-01-13 | 1994-09-20 | Nippon Shokubai Co Ltd | 熱線遮蔽材 |
JPH10146919A (ja) | 1996-11-15 | 1998-06-02 | Teijin Ltd | グリーンハウス用ガラス積層体 |
JPH10298373A (ja) * | 1997-04-23 | 1998-11-10 | Asahi Chem Ind Co Ltd | 高衝撃性ポリカーボネート系樹脂組成物 |
JPH10298417A (ja) * | 1997-02-28 | 1998-11-10 | Asahi Chem Ind Co Ltd | 難燃性ポリカーボネート系樹脂組成物 |
JP2000096034A (ja) | 1998-09-22 | 2000-04-04 | Sumitomo Metal Mining Co Ltd | 日射遮蔽材料、日射遮蔽膜用塗布液、及び、日射遮蔽膜 |
JP2000169765A (ja) | 1998-12-10 | 2000-06-20 | Sumitomo Metal Mining Co Ltd | 日射遮蔽膜用塗布液及びこれを用いた日射遮蔽膜 |
JP2001179887A (ja) | 1999-12-27 | 2001-07-03 | Teijin Ltd | 窓貼用熱線反射フィルム |
JP2004059875A (ja) | 2002-07-31 | 2004-02-26 | Sumitomo Metal Mining Co Ltd | 熱線遮蔽成分含有マスターバッチとこのマスターバッチが適用された熱線遮蔽透明樹脂成形体並びに熱線遮蔽透明積層体 |
WO2005087680A1 (ja) | 2004-03-16 | 2005-09-22 | Sumitomo Metal Mining Co., Ltd. | 日射遮蔽用合わせ構造体 |
JP2008024902A (ja) | 2006-07-25 | 2008-02-07 | Sumitomo Metal Mining Co Ltd | 高耐熱性マスターバッチ、熱線遮蔽透明樹脂成形体、並びに熱線遮蔽透明積層体 |
JP2010519270A (ja) * | 2007-02-21 | 2010-06-03 | ビーエーエスエフ ソシエタス・ヨーロピア | 難燃性組成物における対称性アゾ化合物 |
JP2011012276A (ja) * | 2004-03-15 | 2011-01-20 | Honeywell Internatl Inc | セルロース強化樹脂組成物 |
JP2012025828A (ja) * | 2010-07-22 | 2012-02-09 | Shin-Etsu Chemical Co Ltd | 離型フィルム |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3477978A (en) * | 1967-01-04 | 1969-11-11 | Gen Electric | Heat moldable polycarbonate composition |
US3742085A (en) * | 1970-04-15 | 1973-06-26 | Gen Electric | Thermally stable polycarbonate composition |
US3647747A (en) * | 1970-04-15 | 1972-03-07 | Gen Electric | High temperature molding flame retardant polycarbonate composition |
AU452933B2 (en) * | 1970-12-28 | 1974-09-19 | Bayer Aktiengesellschaft | Thermoplastic moulding composition and mouldings of polycarbonate having improved ease of mould release when injection moulding |
US4154718A (en) * | 1976-09-02 | 1979-05-15 | Kyowa Chemical Industry Co. Ltd. | Fire-retardant thermoplastic resin composition |
JP3643586B2 (ja) | 1994-04-15 | 2005-04-27 | 株式会社東芝 | 磁気共鳴イメージング装置 |
DE60232603D1 (de) * | 2001-06-21 | 2009-07-23 | Teijin Ltd | Nahinfrarot-schutzfolie |
JP4478428B2 (ja) * | 2003-10-07 | 2010-06-09 | 出光興産株式会社 | ポリカーボネート系樹脂組成物及び光学部品 |
US8083847B2 (en) * | 2003-10-20 | 2011-12-27 | Sumitomo Metal Mining Co., Ltd. | Fine particle dispersion of infrared-shielding material, infrared-shielding body, and production method of fine particles of infrared-shielding material and fine particles of infrared-shielding material |
CN101023498B (zh) * | 2004-08-31 | 2012-02-29 | 住友金属矿山株式会社 | 导电性粒子、可见光透过型粒子分散导电体及其制造方法、透明导电薄膜及其制造方法、使用它的透明导电物品、红外线屏蔽物品 |
WO2007049573A1 (ja) * | 2005-10-28 | 2007-05-03 | Sumitomo Osaka Cement Co., Ltd. | 無機酸化物透明分散液と無機酸化物粒子含有樹脂組成物、発光素子封止用組成物及び発光素子、ハードコート膜と光学機能膜及び光学部品、並びに無機酸化物粒子含有樹脂組成物の製造方法 |
EP1979414A1 (en) * | 2006-01-25 | 2008-10-15 | Basf Se | Low individual colour thermoplastic molding composition |
JP4853710B2 (ja) * | 2006-11-22 | 2012-01-11 | 住友金属鉱山株式会社 | レーザー溶着用光吸収樹脂組成物及び光吸収樹脂成形体、並びに光吸収樹脂成形体の製造方法 |
JP2008156386A (ja) * | 2006-12-20 | 2008-07-10 | Sumitomo Metal Mining Co Ltd | ポリカーボネート樹脂組成物および得られるペレット、並びにポリカーボネート樹脂成形体 |
JP5245284B2 (ja) * | 2007-04-26 | 2013-07-24 | 住友金属鉱山株式会社 | 熱線遮蔽ポリエステルフィルムおよび熱線遮蔽ポリエステルフィルム積層体 |
JP5245283B2 (ja) * | 2007-04-26 | 2013-07-24 | 住友金属鉱山株式会社 | 熱線遮蔽塩化ビニルフィルム製造用組成物およびその製造方法、並びに、熱線遮蔽塩化ビニルフィルム |
WO2008149974A1 (ja) * | 2007-06-08 | 2008-12-11 | Bridgestone Corporation | 近赤外線遮蔽体、これを用いた積層体及びディスプレイ用光学フィルタ |
US8216683B2 (en) * | 2007-08-03 | 2012-07-10 | Solutia Inc. | Interlayers comprising stabilized tungsten oxide agents |
US8202927B2 (en) * | 2007-08-09 | 2012-06-19 | Dai Nippon Printing Co., Ltd. | Near-infrared absorbing composition and near-infrared absorbing filter |
WO2009054051A1 (ja) * | 2007-10-23 | 2009-04-30 | Sumitomo Metal Mining Co., Ltd. | 車窓用日射遮蔽体及び車両用窓 |
BRPI0722164A8 (pt) * | 2007-10-25 | 2017-12-12 | Sumitomo Metal Mining Co | Mistura padrão de alta resistência ao calor, e, corpo de laminação transparente de bloqueio de radiação térmica. |
BRPI0818911A8 (pt) * | 2007-11-05 | 2018-12-11 | Basf Se | composição, processo para a preparação de bronze de hidrogênio e tungstênio ou de uma composição de bronze de hidrogênio e tungstênio, dispersão de partícula, e, uso de partículas de bronze de hidrogênio e tungstênio ou de partículas que contenham bronze de hidrogênio e tungstênio |
CN102282229B (zh) * | 2008-11-13 | 2015-05-06 | 住友金属矿山株式会社 | 红外线屏蔽用微粒及其制造方法、以及使用该红外线屏蔽用微粒的红外线屏蔽用微粒分散体、红外线屏蔽用基体材料 |
JP2011063740A (ja) * | 2009-09-18 | 2011-03-31 | Sumitomo Metal Mining Co Ltd | 熱線遮蔽樹脂シート材と熱線遮蔽樹脂シート材積層体およびこれ等を用いた建築構造体 |
JP5257626B2 (ja) * | 2010-07-14 | 2013-08-07 | 住友金属鉱山株式会社 | 高耐熱性マスターバッチ、熱線遮蔽透明樹脂成形体、並びに熱線遮蔽透明積層体 |
EP2643393A4 (en) * | 2010-11-24 | 2014-07-02 | Basf Se | THERMOPLASTIC MOLDING COMPOSITION USING MICROCAPED MATERIAL FOR LATENT HEAT ACCUMULATION |
-
2012
- 2012-02-22 JP JP2012035856A patent/JP5942466B2/ja active Active
-
2013
- 2013-02-20 US US14/380,538 patent/US9612366B2/en active Active
- 2013-02-20 ES ES13752375.9T patent/ES2674677T3/es active Active
- 2013-02-20 EP EP13752375.9A patent/EP2818519B1/en active Active
- 2013-02-20 IN IN7007DEN2014 patent/IN2014DN07007A/en unknown
- 2013-02-20 CN CN201380010598.6A patent/CN104487511B/zh active Active
- 2013-02-20 KR KR1020147026129A patent/KR101967018B1/ko active IP Right Grant
- 2013-02-20 WO PCT/JP2013/054135 patent/WO2013125563A1/ja active Application Filing
- 2013-02-22 TW TW102106177A patent/TWI589641B/zh active
Patent Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61277437A (ja) | 1985-06-04 | 1986-12-08 | 豊田合成株式会社 | 熱線反射樹脂ガラス |
JPH02173060A (ja) | 1988-12-26 | 1990-07-04 | Teijin Chem Ltd | 熱線遮断板状体 |
JPH0578544A (ja) | 1991-09-18 | 1993-03-30 | Kuraray Co Ltd | 熱線反射板状体 |
JPH06264050A (ja) | 1993-01-13 | 1994-09-20 | Nippon Shokubai Co Ltd | 熱線遮蔽材 |
JPH06256541A (ja) | 1993-03-05 | 1994-09-13 | Mitsui Toatsu Chem Inc | 近赤外線吸収フィルム及びそれを用いた熱線遮断シート |
JPH10146919A (ja) | 1996-11-15 | 1998-06-02 | Teijin Ltd | グリーンハウス用ガラス積層体 |
JPH10298417A (ja) * | 1997-02-28 | 1998-11-10 | Asahi Chem Ind Co Ltd | 難燃性ポリカーボネート系樹脂組成物 |
JPH10298373A (ja) * | 1997-04-23 | 1998-11-10 | Asahi Chem Ind Co Ltd | 高衝撃性ポリカーボネート系樹脂組成物 |
JP2000096034A (ja) | 1998-09-22 | 2000-04-04 | Sumitomo Metal Mining Co Ltd | 日射遮蔽材料、日射遮蔽膜用塗布液、及び、日射遮蔽膜 |
JP2000169765A (ja) | 1998-12-10 | 2000-06-20 | Sumitomo Metal Mining Co Ltd | 日射遮蔽膜用塗布液及びこれを用いた日射遮蔽膜 |
JP2001179887A (ja) | 1999-12-27 | 2001-07-03 | Teijin Ltd | 窓貼用熱線反射フィルム |
JP2004059875A (ja) | 2002-07-31 | 2004-02-26 | Sumitomo Metal Mining Co Ltd | 熱線遮蔽成分含有マスターバッチとこのマスターバッチが適用された熱線遮蔽透明樹脂成形体並びに熱線遮蔽透明積層体 |
JP2011012276A (ja) * | 2004-03-15 | 2011-01-20 | Honeywell Internatl Inc | セルロース強化樹脂組成物 |
WO2005087680A1 (ja) | 2004-03-16 | 2005-09-22 | Sumitomo Metal Mining Co., Ltd. | 日射遮蔽用合わせ構造体 |
JP2008024902A (ja) | 2006-07-25 | 2008-02-07 | Sumitomo Metal Mining Co Ltd | 高耐熱性マスターバッチ、熱線遮蔽透明樹脂成形体、並びに熱線遮蔽透明積層体 |
JP2010519270A (ja) * | 2007-02-21 | 2010-06-03 | ビーエーエスエフ ソシエタス・ヨーロピア | 難燃性組成物における対称性アゾ化合物 |
JP2012025828A (ja) * | 2010-07-22 | 2012-02-09 | Shin-Etsu Chemical Co Ltd | 離型フィルム |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019054476A1 (ja) * | 2017-09-14 | 2019-03-21 | 住友金属鉱山株式会社 | 近赤外線吸収繊維およびこれを用いた繊維製品、並びにそれらの製造方法 |
JPWO2019054476A1 (ja) * | 2017-09-14 | 2020-10-29 | 住友金属鉱山株式会社 | 近赤外線吸収繊維およびこれを用いた繊維製品、並びにそれらの製造方法 |
JP7226321B2 (ja) | 2017-09-14 | 2023-02-21 | 住友金属鉱山株式会社 | 近赤外線吸収繊維およびこれを用いた繊維製品、並びにそれらの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201343782A (zh) | 2013-11-01 |
CN104487511A (zh) | 2015-04-01 |
KR20140129210A (ko) | 2014-11-06 |
JP5942466B2 (ja) | 2016-06-29 |
EP2818519A4 (en) | 2015-10-07 |
US9612366B2 (en) | 2017-04-04 |
ES2674677T3 (es) | 2018-07-03 |
JP2013170239A (ja) | 2013-09-02 |
EP2818519B1 (en) | 2018-04-11 |
TWI589641B (zh) | 2017-07-01 |
IN2014DN07007A (ja) | 2015-04-10 |
KR101967018B1 (ko) | 2019-04-08 |
US20150024211A1 (en) | 2015-01-22 |
EP2818519A1 (en) | 2014-12-31 |
CN104487511B (zh) | 2019-01-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5942466B2 (ja) | 複合タングステン酸化物微粒子分散ポリカーボネート樹脂組成物およびそれを用いた熱線遮蔽成形体並びに熱線遮蔽積層体 | |
JP4632094B2 (ja) | 高耐熱性マスターバッチの製造方法、熱線遮蔽透明樹脂成形体、並びに熱線遮蔽透明積層体 | |
AU2007360455B2 (en) | Masterbatch with high heat resistance, heat-ray-shielding transparent molded resin, and heat-ray-shielding transparent layered product | |
JP5257626B2 (ja) | 高耐熱性マスターバッチ、熱線遮蔽透明樹脂成形体、並びに熱線遮蔽透明積層体 | |
JP3982466B2 (ja) | 熱線遮蔽成分分散体とその製造方法およびこの分散体を用いて得られる熱線遮蔽膜形成用塗布液と熱線遮蔽膜並びに熱線遮蔽樹脂成形体 | |
US7666930B2 (en) | Master batch containing heat radiation shielding component, and heat radiation shielding transparent resin form and heat radiation shielding transparent laminate for which the master batch has been used | |
JP4182357B2 (ja) | 熱線遮蔽樹脂シート材および熱線遮蔽樹脂シート材積層体、並びにそれらを用いた建築構造体 | |
JP2012082326A (ja) | 高耐熱性熱線遮蔽成分含有マスターバッチおよびその製造方法、高耐熱性熱線遮蔽透明樹脂成形体、並びに高耐熱性熱線遮蔽透明積層体 | |
JP2011063741A (ja) | 熱線遮蔽樹脂シート材と熱線遮蔽樹脂シート材積層体およびこれ等を用いた建築構造体 | |
JP5898397B2 (ja) | 近赤外線遮蔽ポリエステル樹脂組成物、近赤外線遮蔽ポリエステル樹脂積層体、および、成形体とその製造方法 | |
JP5423636B2 (ja) | 複合タングステン酸化物微粒子分散ポリカーボネート樹脂マスターバッチの製造方法、当該マスターバッチの製造方法により得られた複合タングステン酸化物微粒子分散ポリカーボネート樹脂マスターバッチ、および、当該マスターバッチを用いて得られた成形体並びに積層体 | |
JP5257381B2 (ja) | 近赤外線遮蔽ポリエステル樹脂組成物およびその成形体、並びに、その積層体 | |
JP2011063740A (ja) | 熱線遮蔽樹脂シート材と熱線遮蔽樹脂シート材積層体およびこれ等を用いた建築構造体 | |
JP5614586B2 (ja) | 熱線遮蔽ポリカーボネートシート、熱線遮蔽ポリカーボネートシート積層体および熱線遮蔽ポリカーボネートシートの製造方法 | |
JP7024608B2 (ja) | 近赤外線吸収微粒子分散液とその製造方法 | |
TWI535782B (zh) | 聚碳酸酯組成物及隔熱材 | |
JP2018118463A (ja) | 熱線遮蔽透明樹脂積層体 | |
JP2009144037A (ja) | 樹脂添加用タングステン酸化物微粒子分散体、タングステン酸化物微粒子分散塩化ビニル樹脂成形体およびタングステン酸化物微粒子分散塩化ビニル樹脂成形体の製造方法 | |
JPWO2019054493A1 (ja) | 日射遮蔽微粒子分散体およびその製造方法、日射遮蔽微粒子含有マスターバッチ、およびそれを用いた日射遮蔽樹脂成形体、日射遮蔽樹脂積層体 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13752375 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14380538 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2013752375 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 20147026129 Country of ref document: KR Kind code of ref document: A |