WO2011162362A1 - Sonde de contact et unité de sonde - Google Patents

Sonde de contact et unité de sonde Download PDF

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Publication number
WO2011162362A1
WO2011162362A1 PCT/JP2011/064485 JP2011064485W WO2011162362A1 WO 2011162362 A1 WO2011162362 A1 WO 2011162362A1 JP 2011064485 W JP2011064485 W JP 2011064485W WO 2011162362 A1 WO2011162362 A1 WO 2011162362A1
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WO
WIPO (PCT)
Prior art keywords
diameter
probe
flange
contact
wound
Prior art date
Application number
PCT/JP2011/064485
Other languages
English (en)
Japanese (ja)
Inventor
風間　俊男
一也 相馬
暁洋 松井
Original Assignee
日本発條株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本発條株式会社 filed Critical 日本発條株式会社
Priority to EP11798243.9A priority Critical patent/EP2587267B1/fr
Priority to SG2012094405A priority patent/SG186433A1/en
Priority to JP2012521543A priority patent/JP6116903B2/ja
Priority to KR1020127033411A priority patent/KR101415722B1/ko
Priority to US13/806,444 priority patent/US9404941B2/en
Priority to CN201180030709.0A priority patent/CN102959406B/zh
Publication of WO2011162362A1 publication Critical patent/WO2011162362A1/fr
Priority to HK13109489.4A priority patent/HK1182176A1/xx

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces

Definitions

  • the present invention relates to a contact probe and a probe unit used for a conduction state inspection or an operation characteristic inspection of an inspection target such as a semiconductor integrated circuit or a liquid crystal panel.
  • an electrical connection is made between the inspection target and a signal processing device that outputs an inspection signal.
  • a probe unit that accommodates a plurality of contact probes is used.
  • the probe unit can be applied to highly integrated and miniaturized inspection objects by narrowing the pitch between contact probes with the progress of high integration and miniaturization of semiconductor integrated circuits and liquid crystal panels in recent years. Possible technologies are progressing.
  • the base portion not in contact with the external electrode is used as a noble metal to ensure electrical stability, and the tip portion in contact with the external electrode is made of a different metal or As a metal alloy, a contact probe that suppresses adhesion of an external electrode material and an increase in contact resistance due to an oxide film of the external electrode material is disclosed (for example, see Patent Document 1).
  • the contact probe shown in Patent Document 1 has a plunger that comes into contact with each contact object at the distal end portion, and a compression spring that forms a coil shape that connects the base end portions of the plunger and is electrically conductive. .
  • a wire is wound at a predetermined pitch, and an electrical signal conducts the wire.
  • the present invention has been made in view of the above, and an object of the present invention is to provide a contact probe and a probe unit capable of obtaining reliable conduction with a contact target.
  • a contact probe includes a first tip portion having a tapered tip shape, and a first tip portion extending from a proximal end side of the first tip portion.
  • a first flange portion having a larger diameter than the diameter of the portion, and an end portion of the first flange portion, the end extending from a different end from the connecting side of the first tip portion,
  • a first boss portion having a diameter smaller than the diameter, and an end portion of the first boss portion, extending from an end portion different from the connecting side of the first flange portion, and the diameter of the first boss portion
  • a conductive first contact member coaxially having a first base end portion having a smaller diameter, a second tip end portion having a tapered tip end shape, and extending from the base end side of the second tip end portion.
  • a conductive second contact member coaxially having a second boss portion having a diameter substantially the same as the diameter of the first base end portion.
  • a coarsely wound portion wound at a predetermined pitch with an inner diameter larger than the diameter of the first base end portion, and a tightly wound portion wound around the closely wound winding with an inner diameter substantially equal to the diameter of the second boss portion.
  • the end of the coarsely wound portion is attached to the first boss portion, and the end of the tightly wound portion is attached to the second boss portion to coaxially connect the first and second contact members.
  • a coil spring, and the first base end portion is parallel to the axial direction, and contacts with the tightly wound portion when receiving a load of a predetermined magnitude or more in a direction approaching at least the second contact member. It is characterized by doing.
  • the contact probe according to the present invention is characterized in that, in the above-mentioned invention, the first base end portion is chamfered at a tip end portion different from a connection side with the first boss portion.
  • the contact probe according to the present invention is characterized in that, in the above-mentioned invention, the first flange portion has an end portion on the side connected to the first tip portion having a tapered shape.
  • the coil spring includes a connecting portion having a tapered shape that is wound with a diameter reduced gradually from the rough winding portion toward the tight winding portion. It is characterized by having.
  • a probe unit according to the present invention is characterized by comprising a plurality of contact probes according to the above-described invention and a holding portion for holding the contact probes.
  • the first flange portion has a tapered end on the side connected to the first tip portion, and the holding portion is the first flange portion. It has the 1st taper part which makes the shape corresponding to the said taper shape, It is characterized by the above-mentioned.
  • the holding portion is larger in diameter than the diameter of the rough winding portion, smaller than the diameter of the rough winding portion, and larger than the diameter of the tight winding portion. And a large small-diameter portion.
  • the coil spring has a tapered shape in which the diameter of the coil spring is gradually reduced from the rough winding portion toward the tightly wound portion, and the holding is performed.
  • the portion includes a second tapered portion having a tapered shape corresponding to the tapered shape of the coil spring between the large diameter portion and the small diameter portion.
  • the second tip portion has a second flange having a diameter larger than a tip side diameter on an end portion side connected to the second boss portion.
  • the second flange portion has a tapered end portion on the distal end side, and the holding portion has a third tapered portion having a shape corresponding to the tapered shape of the second flange portion. It is characterized by that.
  • the proximal end portion of the first plunger and the tightly wound portion of the coil spring are brought into contact with each other only when the inner diameter of the coil spring is changed, and the coarsely wound portion and the proximal end portion are contacted. As a result, it is possible to obtain more reliable conduction.
  • FIG. 1 is a perspective view showing the configuration of the probe unit according to the first embodiment of the present invention.
  • FIG. 2 is a partial cross-sectional view showing a configuration of a main part of the probe unit according to the first embodiment of the present invention.
  • FIG. 3 is a partial cross-sectional view showing the configuration of the main part of the probe unit at the time of inspection of the semiconductor integrated circuit according to the first embodiment of the present invention.
  • FIG. 4 is a partial cross-sectional view showing the configuration of the main part of the probe unit according to the second embodiment of the present invention.
  • FIG. 5 is a partial cross-sectional view showing the configuration of the main part of the probe unit during the inspection of the semiconductor integrated circuit according to the second embodiment of the present invention.
  • FIG. 1 is a perspective view showing the configuration of the probe unit according to the first embodiment of the present invention.
  • a probe unit 1 shown in FIG. 1 is a device used when an electrical characteristic test is performed on a semiconductor integrated circuit 100 that is an object to be tested, and a circuit that outputs a test signal to the semiconductor integrated circuit 100 and the semiconductor integrated circuit 100. This is an apparatus for electrically connecting the substrate 200.
  • the probe unit 1 includes a conductive contact probe 2 (hereinafter simply referred to as “probe 2”) that contacts two different objects to be contacted at both ends in the longitudinal direction and the semiconductor integrated circuit 100 and the circuit board 200.
  • the probe holder 3 that accommodates and holds the probe 2 according to a predetermined pattern, and the semiconductor integrated circuit 100 that is provided around the probe holder 3 and contacts the plurality of probes 2 during inspection are prevented from being displaced. And a holder member 4 to be used.
  • FIG. 2 is a diagram showing a detailed configuration of the probe 2 accommodated in the probe holder 3.
  • the probe 2 shown in FIG. 2 is formed using a conductive material.
  • the probe 2 is connected to the first plunger 21 (first contact member) that contacts the connection electrode of the semiconductor integrated circuit 100 and the electrode of the circuit board 200 provided with the inspection circuit.
  • a contacted second plunger 22 (second contact member), and a coil spring 23 provided between the first plunger 21 and the second plunger 22 to connect the two first plungers 21 and the second plunger 22 in a telescopic manner.
  • the first plunger 21 and the second plunger 22 and the coil spring 23 constituting the probe 2 have the same axis.
  • the coil spring 23 expands and contracts in the axial direction, so that the impact on the connection electrode of the semiconductor integrated circuit 100 is reduced, and the semiconductor integrated circuit 100 and the circuit board 200 are reduced. Apply load.
  • the first plunger 21 has a tapered tip shape, extends from a tip end portion 21a (first tip portion) having a plurality of claw portions 21b, and a proximal end side of the tip portion 21a, and is compared with the diameter of the tip portion 21a.
  • the flange 21c has a tapered end at the tip 21a side.
  • the base end portion 21e has a shape with a chamfered tip.
  • the second plunger 22 has a distal end portion 22a having a tapered distal end shape, a flange portion 22b extending from the proximal end side of the distal end portion 22a and having a diameter larger than the diameter of the distal end portion 22a, and the distal end of the flange portion 22b.
  • a boss portion 22c (second boss portion) that extends from an end different from the side continuous with the portion 22a and has a diameter substantially the same as the diameter of the base end portion 21e is coaxially provided.
  • the flange 22b has a tapered end at the tip 22a side.
  • the second plunger 22 can move in the axial direction by the expansion and contraction action of the coil spring 23, is urged toward the circuit board 200 by the elastic force of the coil spring 23, and contacts the electrode of the circuit board 200.
  • the second tip portion corresponds to the tip portion 22a and the flange portion 22b.
  • the coil spring 23 is a coarsely wound portion 23a wound at a predetermined pitch on the first plunger 21 side with an inner diameter larger than the diameter of the base end portion 21e, while the second plunger 22 side has an inner diameter substantially the same as the diameter of the boss portion 22c. It is the contact
  • the connecting portion 23c that connects the rough winding portion 23a and the tightly wound portion 23b has a shape in which the inner diameter gradually decreases from the coarsely wound portion 23a toward the tightly wound portion 23b. For example, when the inner diameter of the rough winding portion 23a has an inner diameter substantially equal to that of the boss portion 21d, the end portion is pressed into the boss portion 21d and is in contact with the flange portion 21c.
  • the end portion of the tightly wound portion 23b is press-fitted into the boss portion 22c and is in contact with the flange portion 22b.
  • the inner diameter of the coarsely wound portion 23a may be a length that can contact the flange portion 21c.
  • the 1st plunger 21, the 2nd plunger 22, and the coil spring 23 may be joined by soldering.
  • the connecting part 23c may be wound by close winding or may be wound at a predetermined pitch.
  • the wire used for the coil spring 23 is a state in which the amount of contraction of the rough winding portion 23a when a predetermined load is applied is, for example, when the probe 2 is accommodated in the probe holder 3 when the initial load is applied (see FIG. 1).
  • a conductive metal having a spring characteristic (stroke) that is larger than the shortest distance between the base end portion 21e and the tightly wound portion 23b is used.
  • the probe holder 3 is formed using an insulating material such as resin, machinable ceramic, silicon, etc., and a first member 31 located on the upper surface side and a second member 32 located on the lower surface side in FIG. 2 are laminated. Become.
  • the first member 31 and the second member 32 are formed with the same number of holder holes 33 and 34 as holding parts for receiving the plurality of probes 2, and the holder holes 33 and 34 for receiving the probes 2 are mutually connected.
  • the axes are formed so as to coincide with each other.
  • the formation positions of the holder holes 33 and 34 are determined according to the wiring pattern of the semiconductor integrated circuit 100.
  • Both holder holes 33 and 34 have stepped hole shapes with different diameters along the penetration direction. That is, the holder hole 33 connects the small diameter portion 33a having an opening on the upper end surface of the probe holder 3, the large diameter portion 33b having a diameter larger than the small diameter portion 33a, and the small diameter portion 33a and the large diameter portion 33b. It consists of the taper part 33c (1st taper part) which makes the shape corresponding to the taper shape of the flange part 21c.
  • the small-diameter portion 33a is smaller in diameter than the large-diameter portion 33b and slightly larger in diameter than the tip portion 21a.
  • the large diameter portion 33b has a slightly larger diameter than the coarsely wound portion 23a and / or the flange portion 21c of the coil spring 23.
  • the holder hole 34 has a small diameter portion 34a having an opening at the lower end surface of the probe holder 3, a medium diameter portion 34b having a diameter larger than the small diameter portion 34a, and a diameter larger than the medium diameter portion 34b.
  • a large diameter portion 34c having the same diameter as the portion 33b, a small diameter portion 34a and a medium diameter portion 34b, and a taper portion 34d (third taper portion) having a taper shape corresponding to the taper shape of the second flange portion 22b;
  • the intermediate diameter portion 34b and the large diameter portion 34c are connected to each other, and a tapered portion 34e (second tapered portion) having a shape corresponding to the tapered shape of the connecting portion 23c of the coil spring 23 is formed.
  • the small diameter portion 34a has a diameter that is smaller than the diameter of the medium diameter portion 34b and slightly larger than the tip portion 22a.
  • the medium diameter portion 34b is smaller in diameter than the large diameter portion 34c and slightly larger in diameter than the tightly wound portion 23b and / or the flange portion 22b of the coil spring 23.
  • the large diameter portion 34c has the same diameter as the large diameter portion 33b.
  • the flange portion 21c of the first plunger 21 has a function of preventing the probe 2 from being removed from the probe holder 3 by contacting the tapered portion 33c of the holder hole 33.
  • the flange portion 22 b of the second plunger 22 has a function of preventing the probe 2 from being removed from the probe holder 3 by contacting the tapered portion 34 d of the holder hole 34.
  • Each boundary wall surface of the holder holes 33 and 34 may have a stepped shape corresponding to the diameters of the flange portions 21 c and 22 b and the coil spring 23.
  • FIG. 3 is a diagram showing a state when the semiconductor integrated circuit 100 using the probe holder 3 is inspected.
  • the coil spring 23 is compressed along the longitudinal direction due to the contact load from the semiconductor integrated circuit 100.
  • the base end portion 21e of the first plunger 21 enters the tightly wound portion 23b and is in sliding contact with the inner peripheral side of the tightly wound portion 23b.
  • the axis of the first plunger 21 is not greatly shaken, the sliding contact between the base end portion 21e and the inner periphery of the tightly wound portion 23b is stabilized, and the tightly wound portion 23b is slightly meandered.
  • the contact resistance between the base end portion 21e and the coil spring 23 is stabilized, and reliable conduction is obtained.
  • the tip of the claw portion 21b is tapered, even if an oxide film is formed on the surface of the connection electrode 101, the oxide film is pierced and the tip of the claw portion 21b is connected to the connection electrode 101. Can be in direct contact with.
  • a test signal supplied from the circuit board 200 to the semiconductor integrated circuit 100 at the time of inspection is transmitted from the electrode 201 of the circuit board 200 to the semiconductor integrated circuit via the second plunger 22, the tightly wound portion 23 b, and the first plunger 21 of the probe 2.
  • 100 connection electrodes 101 are reached.
  • the 1st plunger 21 and the 2nd plunger 22 conduct
  • the proximal end portion having a small diameter with respect to the inner diameter of the coarse winding portion and the tightly wound portion wound with an inner diameter substantially equal to or smaller than the proximal end portion are in contact with each other.
  • the coarse winding portion is configured such that signals are difficult to conduct, an electrical signal can be reliably passed between the circuit board and the semiconductor integrated circuit, and inspection accuracy can be maintained.
  • the tip of the first base end chamfered in a rounded shape, the base end is inserted into the tightly wound portion without being obstructed in the advancing direction when contacting the connecting portion of the coil spring. can do.
  • the end wall of each flange and the boundary wall surface between the large-diameter portion (medium-diameter portion) and the small-diameter portion of the holder hole are tapered. The effect of positioning in the direction perpendicular to the axial direction of the 1 plunger 21 is produced.
  • the proximal end portion 21e has a diameter gradually or continuously increased near the boss portion 21d in the vicinity of the connection portion with the boss portion 21d, and the end portion on the connection side is equal to the diameter of the boss portion 21d. It may become connected with a boss
  • tip part demonstrated as what has a some nail
  • tip part demonstrated as what was the front-end
  • the structure which does not have may be sufficient, and you may make the contact
  • FIG. 4 is a partial cross-sectional view showing the configuration of the main part of the probe unit according to the second embodiment of the present invention.
  • symbol is attached
  • a probe 5 shown in FIG. 4 is held by a probe holder 6 and is formed using a conductive material as in the first embodiment.
  • the probe 5 includes a first plunger 21 (first contact member) that comes into contact with a connection electrode of the semiconductor integrated circuit 100 when the semiconductor integrated circuit 100 shown in FIG. 1 is inspected, and a circuit board 200 including the inspection circuit.
  • the second plunger 51 (second contact member) that contacts the electrodes of the first plunger 21 and the second plunger 51 is provided between the first plunger 21 and the second plunger 51 so that the two first plungers 21 and the second plunger 51 can be extended and contracted.
  • a coil spring 23 The first plunger 21 and the second plunger 51 that constitute the probe 5 and the coil spring 23 have the same axis.
  • the second plunger 51 has a distal end portion 51a having a tapered distal end shape, and a boss portion 51b (second boss portion) extending from the proximal end side of the distal end portion 51a and having a diameter substantially the same as the diameter of the proximal end portion 21e. On the same axis.
  • the second plunger 51 can move in the axial direction by the expansion and contraction action of the coil spring 23, is urged toward the circuit board 200 by the elastic force of the coil spring 23, and comes into contact with the electrode of the circuit board 200.
  • the coil spring 23 is a coarsely wound portion 23a wound at a predetermined pitch with an inner diameter greater than the diameter of the boss portion 21d on the first plunger 21 side, while the second plunger 51 side has an inner diameter substantially the same as the diameter of the boss portion 51b. This is a wound tightly wound portion 23b.
  • the connecting portion 23c that connects the rough winding portion 23a and the tightly wound portion 23b has a shape in which the inner diameter gradually decreases from the coarsely wound portion 23a toward the tightly wound portion 23b.
  • the end of the coarsely wound portion 23a is press-fitted into the boss portion 21d and is in contact with the flange portion 21c.
  • the end portion of the tightly wound portion 23b is press-fitted into the boss portion 51b and is in contact with the tip portion 51a.
  • the inner diameter of the coarsely wound portion 23a may be a length that can contact the flange portion 21c.
  • the 1st plunger 21, the 2nd plunger 51, and the coil spring 23 may be joined by soldering.
  • the probe holder 6 is formed using an insulating material such as resin, machinable ceramic, or silicon, and a first member 31 located on the upper surface side and a second member 61 located on the lower surface side in FIG. 4 are laminated. Become.
  • the first member 31 and the second member 61 are formed with the same number of holder holes 33 and 62 as holding parts for accommodating the plurality of probes 5, and the holder holes 33 and 62 for accommodating the probes 5 are mutually connected.
  • the axes are formed so as to coincide with each other.
  • the formation positions of the holder holes 33 and 62 are determined according to the wiring pattern of the semiconductor integrated circuit 100.
  • the holder hole 62 connects a small diameter portion 62a having an opening at the lower end surface of the probe holder 6, a large diameter portion 62b having a diameter larger than the small diameter portion 62a, and the small diameter portion 62a and the large diameter portion 62b. And a taper portion 62c (second taper portion) having a taper shape corresponding to the taper shape of the connection portion 23c.
  • the small diameter portion 62a is a diameter that is smaller than the diameter of the coarsely wound portion 23a (large diameter portion 62b) and slightly larger than the diameter of the distal end portion 51a or the tightly wound portion 23b.
  • the large diameter part 62b has the same diameter as the large diameter part 33b.
  • the flange portion 21 c of the first plunger 21 has a function of preventing the probe 5 from being removed from the probe holder 6 by contacting the tapered portion 33 c of the holder hole 33.
  • the probe 5 has a function of preventing the probe 5 from being removed from the probe holder 6 when the connecting portion 23 c of the coil spring 23 abuts on the tapered portion 62 c of the holder hole 62.
  • Each boundary wall surface of the holder holes 33 and 62 may have a stepped shape corresponding to the diameter of the flange portion 21 c and the coil spring 23.
  • FIG. 5 is a diagram showing a state when the semiconductor integrated circuit 100 using the probe holder 6 is inspected.
  • the coil spring 23 is compressed along the longitudinal direction due to the contact load from the semiconductor integrated circuit 100.
  • the proximal end portion 21e of the first plunger 21 enters the tightly wound portion 23b and is in sliding contact with the inner peripheral side of the tightly wound portion 23b.
  • the contact resistance between the base end portion 21e and the coil spring 23 is stabilized, and reliable electrical conduction is obtained.
  • An inspection signal supplied from the circuit board 200 to the semiconductor integrated circuit 100 at the time of inspection is transmitted from the electrode 201 of the circuit board 200 to the semiconductor integrated circuit via the second plunger 51 of the probe 5, the tightly wound portion 23b, and the first plunger 21. 100 connection electrodes 101 are reached.
  • the conduction path of the electric signal can be minimized. Therefore, it is possible to prevent a signal from flowing through the coarse winding portion 23a during inspection, and to reduce and stabilize the inductance and resistance.
  • the proximal end portion having a small diameter with respect to the inner diameter of the rough winding portion, and the tight winding wound with the inner diameter substantially equal to the inner diameter of the proximal end portion.
  • the electrical contact between the circuit board and the semiconductor integrated circuit is ensured, and the inspection accuracy is maintained, because the signal is not easily conducted to the coarse winding part. be able to.
  • the tip of the first base end chamfered in a rounded shape, the base end is inserted into the tightly wound portion without being obstructed in the advancing direction when contacting the connecting portion of the coil spring. can do.
  • connection portion of the coil spring abuts against the taper portion of the probe holder, thereby having a function of preventing the probe from being removed from the probe holder and simplifying the configuration of the second plunger, compared with the configuration of the first embodiment.
  • the step of forming the stepped shape of the holder hole can be reduced, and the manufacturing cost can be reduced.
  • the first member has a tapered portion (stepped shape) as long as the taper portion formed on the second member of the probe holder has a probe retaining function. It is also possible to have a configuration with only a large-diameter portion.
  • the contact probe and the probe unit according to the present invention are useful for connecting to an electrode and conducting an electrical signal.
  • Probe unit 2 5 Contact probe (probe) 3,6 Probe holder 21 First plunger 21a, 22a Tip portion 21b Claw portion 21c, 22b Flange portion 21d, 22c Boss portion 21e Base end portion 22, 51 Second plunger 23 Coil spring 23a Coarse winding portion 23b Adhesion winding portion 23c Connection Part 31 First member 32, 61 Second member 33, 34, 62 Holder hole 33a, 34a, 62a Small diameter part 33b, 34c, 62b Large diameter part 33c, 34d, 34e, 62c Tapered part 34b Medium diameter part 100 Semiconductor integrated circuit 101 connection electrode 200 circuit board

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

La sonde de contact de l'invention comprend un premier boudin conducteur (21) comportant co-axialement une partie d'extrémité (21a) à pointe biseautée, une partie boudin (21c) partant de l'extrémité de base de la partie d'extrémité (21a) et dont le diamètre est plus important que celui de la partie d'extrémité (21a), une partie bossage (21d) dont le diamètre est plus faible que celui de la partie boudin (21c), et une section de base (21e) dont le diamètre est plus faibles que celui de la partie bossage (21d) ; un boudin conducteur (22) comportant co-axialement une seconde partie d'extrémité dont la pointe va en biseau et une partie bossage (22c) présentant quasiment le même diamètre que celui de la section de base (21e) ; et un ressort hélicoïdal (23) qui relie de manière coaxiale le premier boudin (21) au second boudin (22), qui présente une partie à enroulement lâche (23a) selon un pas prédéterminé et un diamètre intérieur au moins égal à celui de la partie bossage (21d) du premier boudin (21) et une partie à enroulement serré (32b) dont le diamètre intérieur est proche de celui de la partie bossage (22c) du second boudin (22).
PCT/JP2011/064485 2010-06-25 2011-06-23 Sonde de contact et unité de sonde WO2011162362A1 (fr)

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EP11798243.9A EP2587267B1 (fr) 2010-06-25 2011-06-23 Sonde de contact et unité de sonde
SG2012094405A SG186433A1 (en) 2010-06-25 2011-06-23 Contact probe and probe unit
JP2012521543A JP6116903B2 (ja) 2010-06-25 2011-06-23 コンタクトプローブおよびプローブユニット
KR1020127033411A KR101415722B1 (ko) 2010-06-25 2011-06-23 콘택트 프로브 및 프로브 유닛
US13/806,444 US9404941B2 (en) 2010-06-25 2011-06-23 Contact probe and probe unit
CN201180030709.0A CN102959406B (zh) 2010-06-25 2011-06-23 接触探针及探针单元
HK13109489.4A HK1182176A1 (en) 2010-06-25 2013-08-13 Contact probe and probe unit

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EP2587267A1 (fr) 2013-05-01
KR101415722B1 (ko) 2014-07-25
TW201213813A (en) 2012-04-01
KR20130018939A (ko) 2013-02-25
SG186433A1 (en) 2013-01-30
JP6116903B2 (ja) 2017-04-19
EP2587267A4 (fr) 2015-09-02
HK1182176A1 (en) 2013-11-22
US9404941B2 (en) 2016-08-02
EP2587267B1 (fr) 2016-12-07
CN102959406B (zh) 2015-08-12
CN102959406A (zh) 2013-03-06
JPWO2011162362A1 (ja) 2013-08-22
US20130099814A1 (en) 2013-04-25
TWI445962B (zh) 2014-07-21

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