HK1182176A1 - Contact probe and probe unit - Google Patents

Contact probe and probe unit

Info

Publication number
HK1182176A1
HK1182176A1 HK13109489.4A HK13109489A HK1182176A1 HK 1182176 A1 HK1182176 A1 HK 1182176A1 HK 13109489 A HK13109489 A HK 13109489A HK 1182176 A1 HK1182176 A1 HK 1182176A1
Authority
HK
Hong Kong
Prior art keywords
probe
contact
unit
probe unit
contact probe
Prior art date
Application number
HK13109489.4A
Other languages
English (en)
Chinese (zh)
Inventor
風間俊男
相馬也
松井曉洋
Original Assignee
日本發條株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本發條株式會社 filed Critical 日本發條株式會社
Publication of HK1182176A1 publication Critical patent/HK1182176A1/xx

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Leads Or Probes (AREA)
HK13109489.4A 2010-06-25 2013-08-13 Contact probe and probe unit HK1182176A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010145639 2010-06-25
JP2010254784 2010-11-15
PCT/JP2011/064485 WO2011162362A1 (ja) 2010-06-25 2011-06-23 コンタクトプローブおよびプローブユニット

Publications (1)

Publication Number Publication Date
HK1182176A1 true HK1182176A1 (en) 2013-11-22

Family

ID=45371528

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13109489.4A HK1182176A1 (en) 2010-06-25 2013-08-13 Contact probe and probe unit

Country Status (9)

Country Link
US (1) US9404941B2 (xx)
EP (1) EP2587267B1 (xx)
JP (1) JP6116903B2 (xx)
KR (1) KR101415722B1 (xx)
CN (1) CN102959406B (xx)
HK (1) HK1182176A1 (xx)
SG (1) SG186433A1 (xx)
TW (1) TWI445962B (xx)
WO (1) WO2011162362A1 (xx)

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KR101582432B1 (ko) * 2011-10-07 2016-01-04 닛폰 하츠죠 가부시키가이샤 프로브 유닛
CN103439542A (zh) * 2013-08-30 2013-12-11 渭南高新区木王科技有限公司 一种pcb测试专用机用弹簧连线
KR102016427B1 (ko) 2013-09-10 2019-09-02 삼성전자주식회사 포고 핀 및 이를 포함하는 프로브 카드
US10088503B2 (en) 2014-02-27 2018-10-02 Taiwan Semiconductor Manufacturing Co., Ltd. Probe card
TWI645193B (zh) * 2014-07-29 2018-12-21 日商日置電機股份有限公司 Probe unit, probe unit manufacturing method and detection method
JP6522634B2 (ja) * 2014-09-19 2019-05-29 日本発條株式会社 プローブユニット
KR101704710B1 (ko) * 2015-02-06 2017-02-08 리노공업주식회사 검사장치용 프로브
CN105044405B (zh) * 2015-08-26 2017-11-17 深圳市精实机电科技有限公司 一种自动找正探针组件
CN106505333B (zh) * 2015-09-07 2018-12-25 京元电子股份有限公司 改良式连接装置以及使用改良式连接装置的测试接口
GB2547684A (en) * 2016-02-26 2017-08-30 Delphi Int Operations Luxembourg Sarl Fuel injector for a combustion engine
JP6837283B2 (ja) * 2016-02-29 2021-03-03 株式会社ヨコオ ソケット
CN106569088A (zh) * 2016-09-13 2017-04-19 北京映翰通网络技术股份有限公司 配电网线路故障指示及定位装置
JP6642359B2 (ja) * 2016-09-21 2020-02-05 オムロン株式会社 プローブピンおよび検査ユニット
JP2018084438A (ja) * 2016-11-21 2018-05-31 株式会社エンプラス 電気接触子及び電気部品用ソケット
KR20180060565A (ko) * 2016-11-29 2018-06-07 주식회사 파인디앤씨 계측용 프로브핀
WO2018101232A1 (ja) * 2016-11-30 2018-06-07 日本電産リード株式会社 接触端子、検査治具、及び検査装置
JP2018107011A (ja) * 2016-12-27 2018-07-05 株式会社エンプラス 電気接触子及び電気部品用ソケット
JP6892277B2 (ja) * 2017-02-10 2021-06-23 株式会社日本マイクロニクス プローブ及び電気的接続装置
US11346859B2 (en) 2017-03-30 2022-05-31 Nhk Spring Co., Ltd. Contact probe and probe unit
CN106849285A (zh) * 2017-04-14 2017-06-13 成都锐奕信息技术有限公司 便于充电弹针安装的座式充电器
JP7021874B2 (ja) * 2017-06-28 2022-02-17 株式会社ヨコオ コンタクトプローブ及び検査治具
JP7098886B2 (ja) * 2017-07-04 2022-07-12 日本電産リード株式会社 接触端子、検査治具、及び検査装置
CN109304731B (zh) * 2017-07-28 2021-09-07 深圳先进技术研究院 一种机器人坐标系标定工具
WO2019069576A1 (ja) * 2017-10-06 2019-04-11 株式会社村田製作所 プローブ
JP7017373B2 (ja) * 2017-11-01 2022-02-08 株式会社日本マイクロニクス プローブ及びその製造方法
JP7220524B2 (ja) * 2018-06-08 2023-02-10 株式会社エンプラス Ｉｃソケット
KR102094618B1 (ko) * 2018-11-13 2020-03-30 주식회사 새한마이크로텍 마이크로 접촉 핀
JP7040641B2 (ja) * 2018-11-19 2022-03-23 株式会社村田製作所 プローブ
CN113614899B (zh) * 2019-03-13 2023-10-24 日本发条株式会社 接触式探针及信号传送方法
JP7372194B2 (ja) * 2020-04-06 2023-10-31 株式会社日本マイクロニクス プローブおよび電気的接続装置
CN118382811A (zh) * 2021-12-21 2024-07-23 株式会社友华 探头
US20240003938A1 (en) * 2022-07-01 2024-01-04 LST Co., Ltd Contact pin and test socket having the same

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US2916723A (en) * 1955-08-31 1959-12-08 Gen Electric Low voltage outlet bushing
US6150616A (en) 1996-04-12 2000-11-21 Nhk Spring Co., Ltd. Electroconductive contact unit system
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EP1113275B1 (en) 1998-07-10 2006-08-30 Nhk Spring Co.Ltd. Conductive contact
JP3527724B2 (ja) 1999-11-17 2004-05-17 株式会社アドバンテスト Ｉｃソケット及びｉｃ試験装置
CN1267733C (zh) * 2000-05-01 2006-08-02 日本发条株式会社 导电性探针及电探测装置
US20030006787A1 (en) * 2000-06-28 2003-01-09 Toshio Kazama Conductive contact
CN100543474C (zh) * 2002-04-16 2009-09-23 日本发条株式会社 导电接触探头保持器
US6844749B2 (en) * 2002-07-18 2005-01-18 Aries Electronics, Inc. Integrated circuit test probe
JP4721637B2 (ja) * 2003-12-25 2011-07-13 日本発條株式会社 導電性接触子ホルダ、導電性接触子ユニット、導電性接触子ホルダの製造方法および検査方法
JP4414828B2 (ja) * 2004-07-07 2010-02-10 日本電子材料株式会社 プローブカード
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JP4685694B2 (ja) * 2006-04-14 2011-05-18 株式会社エンプラス コンタクトピン及び電気部品用ソケット
US7362118B2 (en) 2006-08-25 2008-04-22 Interconnect Devices, Inc. Probe with contact ring
CN101563617A (zh) * 2006-12-19 2009-10-21 日本发条株式会社 导电性接触件单元
US8149008B2 (en) * 2007-07-19 2012-04-03 Nhk Spring Co., Ltd. Probe card electrically connectable with a semiconductor wafer
JP5394264B2 (ja) * 2008-02-14 2014-01-22 日本発條株式会社 プローブユニット
JP4808794B2 (ja) 2008-03-28 2011-11-02 パナソニック株式会社 半導体検査装置
EP2322943A4 (en) * 2008-08-08 2014-06-25 Nhk Spring Co Ltd ELECTRICAL CONTACT ELEMENT AND CONTACT PROBE
JP5166176B2 (ja) 2008-09-04 2013-03-21 スリーエム イノベイティブ プロパティズ カンパニー 電子デバイス用ソケット

Also Published As

Publication number Publication date
EP2587267B1 (en) 2016-12-07
CN102959406B (zh) 2015-08-12
TW201213813A (en) 2012-04-01
WO2011162362A1 (ja) 2011-12-29
TWI445962B (zh) 2014-07-21
EP2587267A1 (en) 2013-05-01
SG186433A1 (en) 2013-01-30
CN102959406A (zh) 2013-03-06
KR101415722B1 (ko) 2014-07-25
US20130099814A1 (en) 2013-04-25
US9404941B2 (en) 2016-08-02
JP6116903B2 (ja) 2017-04-19
KR20130018939A (ko) 2013-02-25
JPWO2011162362A1 (ja) 2013-08-22
EP2587267A4 (en) 2015-09-02

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