WO2011099563A1 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
WO2011099563A1
WO2011099563A1 PCT/JP2011/052879 JP2011052879W WO2011099563A1 WO 2011099563 A1 WO2011099563 A1 WO 2011099563A1 JP 2011052879 W JP2011052879 W JP 2011052879W WO 2011099563 A1 WO2011099563 A1 WO 2011099563A1
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WO
WIPO (PCT)
Prior art keywords
substrate
processing apparatus
sheet substrate
sheet
stage
Prior art date
Application number
PCT/JP2011/052879
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
智也 鈴木
Original Assignee
株式会社ニコン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ニコン filed Critical 株式会社ニコン
Priority to JP2011553890A priority Critical patent/JP5761034B2/ja
Priority to KR1020127021746A priority patent/KR101816327B1/ko
Priority to CN201180007819.5A priority patent/CN102741754B/zh
Priority to KR1020177037335A priority patent/KR101948467B1/ko
Publication of WO2011099563A1 publication Critical patent/WO2011099563A1/ja
Priority to HK12112554.9A priority patent/HK1171820A1/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum

Definitions

  • the present invention relates to a substrate processing apparatus.
  • display elements constituting display devices such as display devices, for example, liquid crystal display elements, organic electroluminescence (organic EL) elements, electrophoretic elements used in electronic paper, and the like are known.
  • organic EL organic electroluminescence
  • electrophoretic elements used in electronic paper, and the like.
  • a switching element called a thin film transistor (TFT) is formed on a substrate surface, and then an active element (active device) for forming each display device has become a mainstream. ing.
  • TFT thin film transistor
  • a technique for forming a display element on a sheet-like substrate for example, a film member
  • a technique called a roll-to-roll system for example, a technique called a roll-to-roll system (hereinafter simply referred to as “roll system”) is known (see, for example, Patent Document 1).
  • roll system a technique called a roll-to-roll system
  • a single sheet-like substrate for example, a belt-like film member wound around a substrate supply-side supply roller is sent out, and the sent-out substrate is wound up with a recovery roller on the substrate recovery side. Transport.
  • the gate electrode constituting the TFT, the gate oxide film, A semiconductor film, source / drain electrodes, and the like are formed, and components of the display element are sequentially formed on the surface to be processed of the substrate.
  • a light emitting layer, an anode, a cathode, an electric circuit, and the like are sequentially formed on the substrate.
  • a large display element is often required, it is necessary to use a substrate having a larger size.
  • the substrate may be bent in the width direction during transport. Such bending of the substrate may cause, for example, a decrease in alignment accuracy of each component of the display element formed on the surface to be processed of the substrate.
  • An object of an aspect of the present invention is to provide a substrate processing apparatus that can perform processing accuracy on a surface to be processed of a substrate with high accuracy regardless of the size of the substrate.
  • a transport unit that transports the belt-shaped sheet substrate in the first direction and a plurality of sections that respectively perform processing on a plurality of sections in the second direction intersecting the first direction among the sheet substrates.
  • a substrate processing apparatus includes a processing unit and a stage device that is provided corresponding to each of the plurality of processing units and supports a sheet substrate.
  • processing can be performed on the substrate with high accuracy regardless of the size of the substrate.
  • FIG. 2 is a view showing the arrangements of an exposure apparatus and a stage apparatus according to the present embodiment.
  • FIG. 2 is a view showing the arrangements of an exposure apparatus and a stage apparatus according to the present embodiment.
  • FIG. 2 is a view showing the arrangements of an exposure apparatus and a stage apparatus according to the present embodiment.
  • FIG. 2 is a view showing the arrangements of an exposure apparatus and a stage apparatus according to the present embodiment.
  • FIG. 1 is a diagram showing a configuration of a substrate processing apparatus FPA according to an embodiment.
  • the substrate processing apparatus FPA performs processing on a substrate supply unit SU that supplies a sheet substrate (for example, a strip-shaped film member) FB, and a surface (surface to be processed) of the sheet substrate FB. It includes a part PR, a substrate recovery part CL for recovering the sheet substrate FB, and a control part CONT for controlling these parts.
  • the substrate processing apparatus FPA is installed in a factory, for example.
  • the substrate processing apparatus FPA is a roll toe that performs various processes on the surface of the sheet substrate FB from when the sheet substrate FB is sent out from the substrate supply unit SU to when the sheet substrate FB is recovered by the substrate recovery unit CL.
  • a device of a roll method hereinafter simply referred to as “roll method”.
  • the substrate processing apparatus FPA can be used when forming a display element (electronic device) such as an organic EL element or a liquid crystal display element on the sheet substrate FB.
  • the processing apparatus FPA can also be used when forming elements other than these elements.
  • the sheet substrate FB to be processed in the substrate processing apparatus FPA for example, a foil such as a resin film or stainless steel can be used.
  • the resin film is made of polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate resin, etc. Can be used.
  • the dimension of the sheet substrate FB in the Y direction is, for example, about 1 m to 2 m
  • the dimension in the X direction (long direction) is, for example, 10 m or more.
  • this dimension is only an example and is not limited thereto.
  • the dimension of the sheet substrate FB in the Y direction may be 1 m or less, 50 cm or less, or 2 m or more. In the present embodiment, even the sheet substrate FB having a dimension in the Y direction exceeding 2 m is preferably used.
  • substrate FB may be 10 m or less.
  • the sheet substrate FB is formed to have flexibility, for example.
  • the term “flexibility” refers to the property that the substrate can be bent without being broken or broken even when a predetermined force of at least its own weight is applied to the substrate. Further, for example, the property of bending by the predetermined force is also included in the flexibility.
  • the flexibility varies depending on the material, size, thickness, environment such as temperature, etc. of the substrate.
  • substrate FB you may use the sheet
  • the sheet substrate FB preferably has a relatively small coefficient of thermal expansion so that its dimensions do not substantially change even when it receives heat at a relatively high temperature (eg, about 200 ° C.) (thermal deformation is small).
  • a relatively high temperature eg, about 200 ° C.
  • an inorganic filler can be mixed with a resin film to reduce the thermal expansion coefficient.
  • the inorganic filler include titanium oxide, zinc oxide, alumina, silicon oxide and the like.
  • the substrate supply unit SU sends out the sheet substrate FB wound in a roll shape to the substrate processing unit PR, for example.
  • the substrate supply unit SU is provided with, for example, a shaft around which the sheet substrate FB is wound, a rotation drive source that rotates the shaft, and the like.
  • the substrate supply unit SU may have a configuration in which, for example, a cover unit that covers the sheet substrate FB wound in a roll shape is provided.
  • the substrate collecting unit CL collects the sheet substrate FB from the substrate processing unit PR in a roll shape, for example.
  • the substrate recovery unit CL is provided with a shaft portion for winding the sheet substrate FB, a rotational drive source for rotating the shaft portion, a cover portion for covering the recovered sheet substrate FB, and the like. Yes.
  • the substrate recovery unit CL is in the form of a roll.
  • the sheet substrate FB may be collected in a state different from the state wound around the sheet.
  • the substrate processing unit PR transports the sheet substrate FB supplied from the substrate supply unit SU to the substrate recovery unit CL, and processes the surface Fp to be processed of the sheet substrate FB in the course of transport.
  • the substrate processing unit PR includes, for example, a processing apparatus 10, a transfer apparatus 30, an alignment apparatus 50, and the like.
  • the processing apparatus 10 includes various processing units for forming, for example, organic EL elements on the processing surface Fp of the sheet substrate FB.
  • a processing section for example, a partition forming apparatus for forming a partition on the processing surface Fp, an electrode forming apparatus for forming an electrode for driving an organic EL element, and a light emitting layer Examples thereof include a light emitting layer forming apparatus.
  • film forming apparatuses such as droplet coating apparatuses (for example, ink jet type coating apparatuses, spin coating type coating apparatuses, etc.), vapor deposition apparatuses, sputtering apparatuses, exposure apparatuses, developing apparatuses, surface modification apparatuses, and cleaning apparatuses. Etc.
  • Each of these apparatuses is appropriately provided, for example, on the conveyance path of the sheet substrate FB.
  • two or more processing apparatuses can be arranged along the transport direction.
  • the transport device 30 includes a roller device R that transports, for example, the sheet substrate FB toward the substrate recovery unit CL in the substrate processing unit PR.
  • a plurality of roller devices R are provided along the conveyance path of the sheet substrate FB.
  • a drive mechanism (not shown) is attached to at least some of the plurality of roller devices R. By rotating such a roller device R, the sheet substrate FB is conveyed in the X-axis direction.
  • a part of the plurality of roller devices R may be configured to be movable in a direction orthogonal to the transport direction.
  • a pair of roller devices R are provided on the downstream side of the processing apparatus 10 in the conveyance direction of the sheet substrate FB. The pair of roller devices R are configured to contact the front and back surfaces of the sheet substrate FB and sandwich at least a part of the sheet substrate FB.
  • the alignment apparatus 50 detects alignment marks (substrate marks) provided at both ends of the sheet substrate FB, and performs an alignment operation of the sheet substrate FB with respect to the processing apparatus 10 based on the detection result.
  • the alignment apparatus 50 includes, for example, an alignment camera 51 provided on the sheet substrate FB for detecting an alignment mark, and the sheet substrate FB based on the detection result of the alignment camera 51, for example, the X direction, the Y direction, the Z direction, the ⁇ X direction, and the ⁇ Y direction. And an adjusting mechanism 52 that finely adjusts in at least one of the ⁇ Z directions.
  • the processing apparatus 10 (exposure apparatuses 10A and 10B) is arranged in a space on the front surface (surface to be processed) side of the sheet substrate FB, and a stage apparatus FST is provided in the space on the back surface side of the sheet substrate FB.
  • the stage apparatus FST supports the back surface of the sheet substrate FB and guides the processing surface of the sheet substrate FB processed by the exposure apparatuses 10A and 10B.
  • FIG. 2 is a perspective view showing the configuration of the stage apparatus FST.
  • the stage device FST includes a main body portion 70, concave rollers 71 and 72, suction rollers 73 and 74, and a support table 75.
  • the main body 70 is formed on a rectangular lower layer 70a that is fixed to a base (not shown) of the transport device 30, a pair of columnar portions 70b that are spaced apart from each other on the upper surface of the lower layer 70a, and the columnar portions 70b. It has the upper layer part 70c fixed.
  • a space 70d is formed between the upper surface of the lower layer portion 70a, the upper layer portion 70c, and the pair of columnar portions 70b.
  • the concave rollers 71 and 72, the suction rollers 73 and 74, and the support table 75 are provided on the upper layer part 70 c of the main body part 70.
  • the concave rollers 71 and 72, the suction rollers 73 and 74, and the support table 75 are arranged in the order of the concave roller 71, the suction roller 73, the support table 75, the suction roller 74, and the concave roller 72 in the transport direction of the sheet substrate FB. ing. That is, the support table 75 is disposed between the suction roller 73 and the suction roller 74.
  • the concave rollers 71 and 72 are disposed at both ends in the X direction, for example, on the upper layer portion 70c.
  • the concave rollers 71 and 72 are provided so as to be rotatable in the ⁇ Y direction with the Y axis as a central axis, for example.
  • the concave rollers 71 and 72 are formed such that the diameter gradually decreases from, for example, both ends in the Y direction to the center. By forming the diameter distribution in the rotation axis direction in this way, it is difficult to form wrinkles on the sheet substrate FB.
  • the support table 75 is disposed, for example, at the center in the X direction on the upper layer 70c.
  • the support table 75 is formed in a rectangular shape when viewed in the ⁇ Z direction, for example.
  • the support table 75 is divided into, for example, three support surfaces 75a to 75c in the width direction (Y direction) of the sheet substrate FB.
  • Each of the support surfaces 75a to 75c is formed flat, for example, and is formed parallel to the XY plane, for example.
  • the sheet substrate FB is supported by these three support surfaces 75a to 75c.
  • stage reference mark SFM is provided on each of the exposed portions 75d of the upper layer portion 70c.
  • the two stage reference marks SFM are arranged so that the positions in the X direction are aligned, for example.
  • stage reference marks SFM are shown in FIG. 2, only two stage reference marks SFM are shown. However, a pair of stage reference marks SFM is provided so as to sandwich the support surfaces 75a, 75b, and 75c, that is, the support surfaces with respect to the Y direction. May be provided.
  • the stage reference mark SFM provided between the support surface 75a and the support surface 75b is used as a common mark on the support surface 75a and the support surface 75b, and the stage reference provided between the support surface 75b and the support surface 75c.
  • the mark SFM may be used as a common mark on the support surface 75b and the support surface 75c.
  • a detection camera DC for detecting the stage reference mark SFM is provided in a space 70d formed by the upper layer portion 70c, the lower layer portion 70a, and the columnar portion 70b.
  • the detection camera DC is provided, for example, at a position overlapping each stage reference mark SFM as viewed in the Z direction.
  • the upper layer part 70c at least the ⁇ Z side of the part where the stage reference mark SFM is provided is provided with an opening so that the detection light from the detection camera DC can pass through.
  • the detection result of each detection camera DC is transmitted to, for example, the control unit CONT and processed.
  • the suction roller 73 is disposed between the support table 75 and the concave roller 71 on the upper layer portion 70c. As with the concave rollers 71 and 72, the suction rollers 73 and 74 are provided so as to be rotatable about the Y axis as a central axis, for example.
  • the suction rollers 73 and 74 each have a divided structure and are divided into a plurality of parts in the rotation axis direction (Y direction).
  • the suction roller 73 has roller portions 73a to 73c divided into three parts.
  • the suction roller 74 has roller portions 74a to 74c divided into three parts.
  • the roller portions 73a to 73c of the suction roller 73 and the roller portions 74a to 74c of the suction roller a74 are detachably connected to each other, and each roller portion is provided to be replaceable.
  • roller portions can be removed one by one from the upper layer portion 70c, and other roller portions can be mounted. Therefore, for example, it can be exchanged for a roller portion having a different dimension in the Y direction, or for example, a roller portion having a different shape, a roller portion having a different diameter, or the like.
  • all the roller parts can also be replaced
  • grooves 76 and 77 are formed in the circumferential direction on the surface of the roller portion 73 c of the suction roller 73, for example, disposed at the center in the Y direction.
  • the groove portions 76 are respectively formed at both ends in the Y direction of the roller portion 73c.
  • a plurality of groove portions 77 are formed between the two groove portions 76 in the roller portion 73c.
  • the groove part 76 and the groove part 77 are each formed over one circumference of the roller part 73c.
  • the widths of the grooves 76 and 77 are formed with different dimensions.
  • the dimension in the Y direction of the groove part 76 is formed to be several mm or more, and the dimension in the Y direction of the groove part 77 is formed to be about several ⁇ m.
  • substrate FB in the part between the bending parts Fa, ie, the groove part 76, will increase, and the flatness of the sheet
  • the groove 77 serves as an air escape path between the sheet substrate FB and the roller portion 73c when the roller portion 73c rotates around the Y axis. For this reason, the sheet
  • FIG. 4 is a diagram of the configuration of the processing apparatus 10 (exposure apparatus 10A and exposure apparatus 10B) and the stage apparatus FST when viewed from the side (+ Y direction) of the transport apparatus 30.
  • FIG. 5 is a view of the configuration of the processing apparatus 10 and the stage apparatus FST as viewed from above (+ Z direction).
  • the exposure apparatus 10A and the exposure apparatus 10B each include a mask stage MST that holds a mask M having a predetermined pattern, an illumination optical system IL that illuminates the mask M with exposure light EL, and exposure light. And a projection optical system PL that projects an image of a pattern in a predetermined illumination area of the mask M illuminated with EL onto a surface to be processed of the sheet substrate FB.
  • This projection optical system PL passes through a telecentric projection optical system PL on both sides (or one side to the sheet substrate FB), and a predetermined projection magnification (for example, equal magnification, 1 / (4 times, 1/5 times, etc.).
  • the operations of the mask stage MST, the illumination optical system IL, and the projection optical system PL are controlled by, for example, the control unit CONT.
  • the exposure apparatus 10A and the exposure apparatus 10B each have a mask stage MST that is movable while holding a mask M having a predetermined pattern, and an illumination optical system IL that illuminates the mask M with exposure light EL. And a projection optical system PL that projects an image of the pattern of the mask M illuminated by the exposure light EL onto the sheet substrate FB.
  • the operations of the mask stage MST, the illumination optical system IL, and the projection optical system PL are controlled by, for example, the control unit CONT.
  • the illumination optical system IL illuminates a predetermined illumination area on the mask M with exposure light EL having a uniform illuminance distribution.
  • exposure light EL for example, bright lines (g line, h line, i line) emitted from a mercury lamp are used.
  • the mask stage MST can be moved at a constant speed in the X direction on the upper surface (surface parallel to the XY plane) of the mask base (not shown) by the stage driving unit 11 and at least moved in the Y direction, Z direction, and ⁇ z direction. It is provided as possible.
  • the two-dimensional position of the mask stage MST is measured by a laser interferometer (not shown), and the control unit CONT controls the position and speed of the mask stage MST via the stage driving unit 11 based on this measurement information.
  • Projection optical system PL is arranged between illumination optical system IL and support table 75, that is, on the ⁇ Z side of mask stage MST.
  • Projection optical system PL is fixed to a fixing member (not shown), for example.
  • the projection optical system PL is arranged so that the pattern image of the mask M is projected onto the processing surface of the sheet substrate FB on the support table 75 in the stage device FST, for example.
  • the exposure apparatuses 10A and 10B project an image formed by the projection optical system PL, which is a part of the pattern of the mask M, onto the sheet substrate FB using the exposure light EL emitted from the illumination optical system IL, and in the X direction. Further, by moving the mask stage MST and the sheet substrate FB synchronously with the projection magnification as the speed ratio, the exposure area in the processing area Fp of the sheet substrate FB can be exposed.
  • the mask stage is exposed before the next processing region is exposed. Move MST in the -X direction. Then, the mask stage MST and the sheet substrate FB are again synchronized in the X direction to perform exposure of the exposure area in the next process area.
  • the mask M is synchronously moved in the X direction with respect to the sheet substrate FB continuously conveyed in the X direction, and the operation of moving the mask M in the ⁇ X direction after one processing target region is completed is repeated.
  • the pattern image of the mask M can be exposed to a plurality of regions to be processed of the sheet substrate FB.
  • the exposure apparatus 10A has two projection optical systems PL1 and PL2.
  • the two projection optical systems PL1 and PL2 of the exposure apparatus 10A are arranged, for example, at an interval in the Y direction.
  • the exposure apparatus 10A can project a pattern image on two projection areas EA1 and EA2 that are separated in the width direction (Y direction) of the surface to be processed of the sheet substrate FB.
  • the two projection areas EA1 and EA2 are formed in a trapezoidal shape.
  • the exposure apparatus 10A exposes both ends (two horizontal sections) of the surface to be processed of the sheet substrate FB except for the center (center section) in the width direction.
  • the projection optical systems PL1 and PL2 are arranged so that the positions in the X direction are aligned. For this reason, the projection optical systems PL1 and PL2 are arranged along the Y direction.
  • the exposure apparatus 10B has one projection optical system PL3.
  • Projection optical system PL3 of exposure apparatus 10B is arranged at a position between two projection optical systems PL1 and PL2 of exposure apparatus 10A in the Y direction. Therefore, the projection area EA3 of the exposure apparatus 10B is provided between the projection area EA1 and the projection area EA2 of the exposure apparatus 10A.
  • the projection area EA3 is formed in a trapezoidal shape.
  • the center part regarding the width direction is exposed among the to-be-processed surfaces of the sheet
  • the roller portions of the suction rollers 73 and 74 in the stage apparatus FST corresponding to the exposure apparatus 10A are sheet substrates with respect to the projection area EA1 and the projection area EA2 of the processing target surface of the sheet substrate FB.
  • the FB is configured to be flat. This configuration is different from the configuration of the roller portions of the suction rollers 73 and 74 shown in FIG.
  • the suction roller 73 includes roller portions 73d and 73e in which grooves 76 and 77 are formed, like the roller portion 73c shown in FIG.
  • the suction roller 73 is provided with the two roller portions 73d and 73e coupled to each other in the Y direction.
  • the roller portion 73d is provided with a pair of groove portions 76 at a position sandwiching the projection area EA1 in the Y direction.
  • the roller portion 73e is provided with a pair of groove portions 76 at a position sandwiching the projection area EA2 in the Y direction.
  • the suction roller 74 includes roller portions 74d and 74e in which grooves 76 and 77 are formed, like the roller portion 73c shown in FIG.
  • the suction roller 74 includes the two roller portions 74d and 74e connected to each other in the Y direction.
  • the roller portion 74d is provided with a pair of grooves 76 at a position that sandwiches the projection area EA1 in the Y direction.
  • the roller portion 74e is provided with a pair of grooves 76 at a position sandwiching the projection area EA2 in the Y direction.
  • the configuration of the stage apparatus FST corresponding to the exposure apparatus 10B is the same as that in FIG.
  • Stage reference marks (stage position detection reference marks, reference marks) SFM are provided so as to face the projection optical systems PL1 to PL3, respectively.
  • the stage reference mark SFM is installed on the upstream side of the illumination area of the projection optical system PL of the exposure apparatuses 10A and 10B with respect to the transport direction of the sheet substrate FB.
  • the stage apparatus FST corresponding to the exposure apparatus 10A is provided with a detection camera 12 that detects an exposure state on the downstream side of the projection areas EA1 and EA2 in the sheet substrate FB.
  • the detection result by the detection camera 12 is transmitted to the control unit CONT, for example.
  • the substrate processing apparatus FPA configured as described above manufactures display elements (electronic devices) such as organic EL elements and liquid crystal display elements by a roll method under the control of the control unit CONT.
  • display elements electronic devices
  • CONT control unit
  • the belt-like sheet substrate FB wound around the roller is attached to the substrate supply unit SU.
  • the controller CONT rotates the roller so that the sheet substrate FB is sent out from the substrate supply unit SU from this state.
  • substrate process part PR is wound up with the roller of the board
  • the control unit CONT transfers the sheet substrate FB to the inside of the substrate processing unit PR by the transfer device 30 of the substrate processing unit PR after the sheet substrate FB is sent out from the substrate supply unit SU until it is wound up by the substrate recovery unit CL. Then, the components of the display element are sequentially formed on the sheet substrate FB by the processing apparatus 10 while being appropriately conveyed.
  • the processing surface of the sheet substrate FB has a plurality of processing regions (a plurality of sections, exposure regions) F1 to F5.
  • the process is performed by dividing into two.
  • the exposure area F1 is a portion (section) exposed only by the image projected on the projection area EA1.
  • the exposure area F2 is a part (section) exposed by a part of the image projected on the projection area EA1 and a part of the image projected on the projection area EA3.
  • the exposure area F3 is a portion (section) exposed only by the image projected on the projection area EA3.
  • the exposure area F4 is a part (section) exposed by a part of the image projected on the projection area EA2 and a part of the image projected on the projection area EA3.
  • the exposure area F5 is a portion (section) exposed only by the image projected on the projection area EA2.
  • each stage device FST has the pair of groove portions 76 formed in the suction rollers 73 and 74 so as to correspond to the respective projection regions.
  • the portion of the sheet substrate FB sandwiched between the groove portions 76 is provided.
  • the exposure process is performed in a state where the flatness is maintained with high accuracy. For this reason, in this embodiment, it is not necessary to maintain the flatness of the sheet substrate FB over the entire Y direction.
  • a portion with a high flatness is formed on a part of the sheet substrate FB, and Exposure is performed so that the exposure areas are superimposed. As a result, the entire Y-direction of the sheet substrate FB is exposed with high accuracy.
  • the alignment operation is performed between the stage apparatus FST and the sheet substrate FB, and then the alignment is performed between the stage apparatus FST and the exposure apparatus 10A. Perform the action.
  • an alignment operation is performed between the stage apparatus FST and the sheet substrate FB, and the stage apparatus FST and the exposure apparatus 10B are performed. Alignment operation is performed between
  • the alignment operation will be described by taking the case of the exposure apparatus 10B as an example.
  • alignment is performed so that the alignment apparatus 50 performs rough alignment of the sheet substrate FB with respect to the exposure apparatus 10A and fine alignment with respect to the exposure apparatus 10A or the exposure apparatus 10B using the stage apparatus FST.
  • the alignment accuracy of the apparatus 50 and the stage apparatus FST can be made different.
  • FIG. 7 is a perspective view showing a positional relationship among the stage apparatus FST, the sheet substrate FB, and the exposure apparatus 10B.
  • a substrate reference mark substrate position detection reference mark, first reference mark, substrate mark
  • the substrate reference mark FFM is formed in the width direction of the sheet substrate FB so as to correspond to the interval between the stage reference marks SFM of the stage apparatus FST, for example.
  • An image of a pair of mask reference marks (processing position detection reference marks, second reference marks) MFM provided on the mask M of the exposure apparatus 10B is projected onto the sheet substrate FB via the projection optical system PL3.
  • the pair of reference marks in the present embodiment are end portions in the Y direction with respect to the mask M, and the projection position of the image of the mask reference mark MFM is, for example, in the vicinity of the stage reference mark SFM of the stage apparatus FST.
  • a mask reference mark MFM is formed.
  • the two masks M used in the exposure apparatus 10A are also end portions in the Y direction so that the projection position of the image of the mask reference mark MFM is, for example, near the stage reference mark SFM of the stage device FST.
  • a mask reference mark MFM may be formed.
  • the stage reference mark SFM may be provided on the Y direction side of the support surface 75a and on the ⁇ Y direction side of the support surface 75c.
  • FIG. 8 is a diagram illustrating an alignment operation between the stage apparatus FST and the sheet substrate FB.
  • the sheet substrate FB has a processing region Fpa in which, for example, a display element is formed, on the surface (surface to be processed).
  • the substrate reference mark FFM is formed, for example, in a region Fpb out of the processing target region Fpa in the sheet substrate FB.
  • the control unit CONT operates the detection camera DC at a timing at which the exposure process by the exposure apparatus 10B is not performed (for example, the time before the exposure process by the exposure apparatus 10A ends and the exposure process by the exposure apparatus 10B).
  • the stage reference mark SFM and the substrate reference mark FFM are detected.
  • the control unit CONT Based on the detection result, the control unit CONT obtains a deviation amount and a direction (first positional relationship) between the stage reference mark SFM and the substrate reference mark FFM.
  • the control unit CONT moves the sheet substrate FB in the X direction or the Y direction based on the first positional relationship between the stage reference mark SFM and the substrate reference mark FFM.
  • the suction rollers 73 and 74 may be moved using the adjustment mechanism 52, or the stage device FST itself may be moved.
  • the alignment operation by forming, for example, a reference scale in a portion corresponding to the stage reference mark SFM on the back surface of the sheet substrate FB.
  • the position and moving speed of the mask M or the illuminance of the illumination optical system IL can be adjusted in accordance with the conveyance speed of the sheet substrate FB. it can.
  • the imaging characteristics of the projection optical system PL1 and projection optical system PL2 provided in the exposure apparatus 10A and the projection optical system PL provided in the exposure apparatus 10B can be individually adjusted.
  • the conveyance speed of the sheet substrate FB is not constant, the position and moving speed of the mask M, the illuminance of the illumination optical system IL, the imaging characteristics of the projection optical system (image position, image surface shape), etc.
  • the configuration for detecting the position of the sheet substrate FB is not limited to the above configuration, and a position detection sensor or the like may be provided separately.
  • FIG. 9 is a diagram showing an alignment operation between the stage apparatus FST and the exposure apparatus 10B.
  • the control unit CONT operates the detection camera DC to detect the stage reference mark SFM and the mask reference mark MFM. Based on the detection result, the control unit CONT obtains a deviation amount and a direction (second positional relationship) between the stage reference mark SFM and the substrate reference mark FFM. Based on the second positional relationship between the stage reference mark SFM and the mask reference mark MFM, the control unit CONT moves, for example, the mask stage MST in the X direction or the Y direction.
  • the control unit CONT uses the detection camera 12 to downstream of the projection areas EA1 and EA2 on the sheet substrate FB.
  • the exposure state on the side can be detected, and the exposure processing by the exposure apparatus 10B can be performed using the detection result.
  • the mask stage MST may be moved after reflecting the detection result of the detection camera 12 in the alignment result.
  • the transport apparatus 30 that transports the sheet substrate FB in the X direction and a plurality of processing regions (exposure regions) divided in the Y direction that intersects the X direction among the sheet substrates FB.
  • a plurality of sections) a plurality of exposure apparatuses 10A and 10B that individually process each of F1 to F5, and a stage apparatus that is provided corresponding to each of the exposure apparatuses 10A and 10B and supports the sheet substrate FB Since the sheet substrate FB is not bent in the Y direction during conveyance of the sheet substrate FB, it is possible to perform processing on the sheet substrate FB with high accuracy.
  • the alignment between the stage apparatus FST and the sheet substrate FB is performed. Since the alignment between the stage apparatus FST and the exposure apparatus 10B can be performed, the conveyance direction of the sheet substrate FB is shifted during the conveyance of the sheet substrate FB between the exposure apparatus 10A and the exposure apparatus 10B. Even if it bends in the Y direction, the exposure process can be performed in a state where the influence thereof is reduced.
  • the sheet substrate FB is supported by the support table 75 having a flat surface parallel to the XY plane in the stage device FST.
  • the present invention is not limited to this.
  • a roller stage RST may be used as a stage corresponding to the exposure apparatuses 10A and 10B.
  • the roller stage RST can guide the sheet substrate FB while conveying it.
  • the diameter of a part of the rollers may be changed.
  • the roller RR when the roller RR is divided into a plurality of roller portions Ra to Rc (when having a plurality of divided peripheral surfaces), the roller portions Ra to Rc can be deformed. It doesn't matter. Further, the roller RR may be configured to be deformable so that the diameter increases as it reaches the central portion as a whole.
  • a flexible member is used as the surface of the roller (guide surface for guiding the sheet substrate FB), and the roller surface can be deformed.
  • the roller surface is deformed by adjusting, for example, heat, hydraulic pressure, pneumatic pressure, or the like inside the roller.
  • the roller RR or the roller portions Ra to Rc can be deformed into a desired shape.
  • wrinkles that are locally formed on the sheet substrate FB are extended, or the guide speed of the sheet substrate FB is changed to change the sheet substrate FB. It is possible to adjust the traveling direction and the positional deviation.
  • the distance between the suction roller 73 and the suction roller 74 is made closer to each other with respect to the transport direction of the sheet substrate FB.
  • the substrate FB may be slackened. By sagging the sheet substrate FB, the sheet substrate FB can be supported on the support surfaces 75a, 75b, and 75c of the stage device FST without tension. Further, the support surfaces 75a, 75b, and 75c may be configured to adsorb the back surface of the sheet substrate FB.
  • the exposure apparatus 10A is configured to include the two projection optical systems PL1 and PL2.
  • the present invention is not limited to this, and one projection optical system (one projection optical system) is provided for each exposure apparatus.
  • a configuration having an area EA) may be used.
  • FIG. 12 shows a configuration in which each of the exposure apparatuses 10A to 10D has one projection optical system PL, and these projection optical systems PL are arranged so as to be shifted in the Y direction.
  • two adjacent ones of the projection areas EL4 to EL7 by each projection optical system PL are arranged so as to overlap each other at the end in the Y direction.
  • the projection areas EA11, 12, 21, and 22 by the exposure apparatuses 10A and 10B and the projection areas EA31, 32, 41, and 42 by the exposure apparatuses 10C and 10D overlap each other.
  • the projection area of the exposure apparatus arranged on the upstream side in the conveyance direction of the sheet substrate FB may overlap with the projection area of the exposure apparatus arranged on the downstream side.
  • a pair of the groove portions 76 of the suction rollers 73 and 74 is provided for each projection region, for example.
  • the present invention is not limited to this.
  • a pair of groove portions 76 may be provided so as to sandwich a plurality of projection areas EA.
  • the first detection mechanism and the second detection mechanism are provided in all the stage apparatuses FST arranged corresponding to the plurality of exposure apparatuses.
  • the present invention is not limited to this.
  • only a part of the stage devices FST may be provided with the first detection mechanism and the second detection mechanism.
  • the processing apparatus 10 may be another apparatus described in the above embodiment, for example, a partition wall forming apparatus, an electrode forming apparatus, or a light emitting layer forming apparatus.
  • the alignment apparatus 50 detects alignment marks provided at both ends of the sheet substrate FB.
  • the alignment apparatus 50 may detect the substrate reference mark FFM, or may detect both sides of the sheet substrate FB parallel to the transport direction (edges of the substrate FB).
  • an alignment mark can be provided for each of a plurality of regions to be processed (a plurality of sections), or associated with one or more of the plurality of sections. Can do.
  • FPA ... substrate processing apparatus FB ... sheet substrate PR ... substrate processing unit CONT ... control unit Fp ... surface to be processed FST ... stage device DC ... detection camera M ... mask MST ... mask stage IL ... illumination optical system PL ... projection optical system CA ... Detection camera SFM ... Stage reference mark FFM ... Substrate reference mark MFM ... Mask reference mark F1-F5 ... Exposure area PL (PL1-PL3) ... Projection optical system EA (EA1-EA42) ... Projection area 10 ... Processing devices 10A-10D ... Exposure device 11 ... Stage drive unit 30 ... Transfer device 50 ... Alignment device 52 ... Adjustment mechanism 71, 72 ... Concave roller 73, 74 ... Suction roller 73a-73e, 74a-74e, Ra-Rc ... Roller part 75 ... Support table 76 ... Groove

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
PCT/JP2011/052879 2010-02-12 2011-02-10 基板処理装置 WO2011099563A1 (ja)

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JP2011553890A JP5761034B2 (ja) 2010-02-12 2011-02-10 基板処理装置
KR1020127021746A KR101816327B1 (ko) 2010-02-12 2011-02-10 기판 처리 장치
CN201180007819.5A CN102741754B (zh) 2010-02-12 2011-02-10 基板处理装置
KR1020177037335A KR101948467B1 (ko) 2010-02-12 2011-02-10 기판 처리 장치 및 기판 처리 방법
HK12112554.9A HK1171820A1 (zh) 2010-02-12 2012-12-05 基板處理裝置

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WO2015005118A1 (ja) * 2013-07-08 2015-01-15 株式会社ニコン 基板処理装置、デバイス製造システム、デバイス製造方法、および、パターン形成装置
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WO2015152217A1 (ja) * 2014-04-01 2015-10-08 株式会社ニコン 基板処理装置、デバイス製造方法及び基板処理装置の調整方法
JP2016004100A (ja) * 2014-06-16 2016-01-12 株式会社ニコン 基板処理装置、デバイス製造システム、デバイス製造方法、および、パターン形成装置
WO2017094770A1 (ja) * 2015-11-30 2017-06-08 株式会社ニコン 露光装置、露光システム、基板処理方法、および、デバイス製造装置
JP2017215535A (ja) * 2016-06-01 2017-12-07 株式会社オーク製作所 露光装置
JP2018205330A (ja) * 2017-05-30 2018-12-27 株式会社オーク製作所 露光装置及び基板載置方法
TWI695445B (zh) * 2012-04-13 2020-06-01 日商尼康股份有限公司 元件製造方法

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KR101948467B1 (ko) 2019-02-14
TWI492326B (zh) 2015-07-11
KR101816327B1 (ko) 2018-01-08
TW201207980A (en) 2012-02-16
JP5761034B2 (ja) 2015-08-12
KR20120138751A (ko) 2012-12-26
KR20180004833A (ko) 2018-01-12
TW201535576A (zh) 2015-09-16
CN102741754B (zh) 2015-12-02
TWI557840B (zh) 2016-11-11
CN102741754A (zh) 2012-10-17
HK1171820A1 (zh) 2013-04-05

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