WO2014015610A1 - 柔性基板处理装置 - Google Patents

柔性基板处理装置 Download PDF

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Publication number
WO2014015610A1
WO2014015610A1 PCT/CN2012/085771 CN2012085771W WO2014015610A1 WO 2014015610 A1 WO2014015610 A1 WO 2014015610A1 CN 2012085771 W CN2012085771 W CN 2012085771W WO 2014015610 A1 WO2014015610 A1 WO 2014015610A1
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WO
WIPO (PCT)
Prior art keywords
flexible substrate
liquid
substrate processing
roller
processing device
Prior art date
Application number
PCT/CN2012/085771
Other languages
English (en)
French (fr)
Inventor
周伟峰
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to JP2015523367A priority Critical patent/JP6133985B2/ja
Priority to EP12880725.2A priority patent/EP2879170B1/en
Priority to US14/127,189 priority patent/US10315233B2/en
Priority to KR1020147000993A priority patent/KR101621629B1/ko
Publication of WO2014015610A1 publication Critical patent/WO2014015610A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/041—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G3/00—Apparatus for cleaning or pickling metallic material
    • C23G3/02—Apparatus for cleaning or pickling metallic material for cleaning wires, strips, filaments continuously
    • C23G3/021—Apparatus for cleaning or pickling metallic material for cleaning wires, strips, filaments continuously by dipping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials

Definitions

  • Embodiments of the present invention relate to a flexible substrate processing apparatus. Background technique
  • FIG. 1 is a schematic view of a roll-to-roll etching apparatus used in the prior art, comprising: an etching bath 12 containing an etching liquid 11; a winding roller located above the etching groove, including a driving roller 13 and The driven roller 14; the positioning roller 15 located in the etching liquid 11; the flexible substrate 16 sequentially bypasses the driven roller 14, the positioning roller 15, and the driving roller 13 in the moving direction thereof.
  • Embodiments of the present invention provide a flexible substrate processing apparatus that solves the problem that the processing time existing in the conventional roll-to-roll etching apparatus when processing a flexible substrate varies with the diameter of the winding roller.
  • An embodiment of the present invention provides a flexible substrate processing apparatus, comprising: at least one groove containing a treatment liquid; a winding roller located above the treatment liquid, including a driving roller and a driven roller; a positioning roller in the processing liquid of each of the grooves; a detecting unit configured to detect a radius or a diameter of the at least one winding roller; and a moving drain fixed to a sidewall of each of the grooves
  • the assembly includes a moving liquid discharge port for discharging the treatment liquid, and a liquid discharge port position control mechanism, wherein the position control mechanism is configured to control the corresponding mobile liquid discharge port according to the detection result of the detection unit Moving in a direction perpendicular to the bottom wall of the slot.
  • the detecting unit can notify the liquid discharge port position control mechanism and the liquid replacement component after detecting the change of the radius or diameter of the winding roller, and move the liquid discharge port position to a high position. Adjusting and replenishing the treatment liquid, or adjusting the position of the liquid discharge port to a low position to discharge part of the treatment liquid. Therefore, the length of the flexible substrate immersed in the treatment liquid can be adjusted according to a certain ratio by the lifting and lowering of the liquid level of the treatment liquid.
  • the change of the radius or diameter of the roller varies, so that the time during which the flexible substrate is processed in the processing liquid is kept constant, thereby ensuring the uniformity of the device size on the flexible substrate, and improving the quality of the flexible display product.
  • FIG. 1 is a schematic view of a roll-to-roll etching apparatus used in the prior art
  • FIG. 2 is a schematic diagram of a flexible substrate processing apparatus having a single slot according to an embodiment of the present invention
  • FIG. 3 is a schematic diagram of a flexible substrate processing apparatus having a dual slot according to an embodiment of the present invention
  • Schematic diagram of the liquid port position control mechanism
  • FIG. 2 shows a case where there is only one groove
  • the apparatus includes: at least one groove 22 containing the processing liquid 21; a winding roller located above the processing liquid 21, comprising a driving roller 23 and a driven roller 24; a positioning roller 25 located in each of the processing liquids 21; and a detecting unit 26 for detecting the at least a radius or diameter of a winding roller; a moving liquid discharge assembly 27 fixed to a side wall of each of the grooves 22; wherein the moving liquid discharge port 271 for discharging the processing liquid 21 and the liquid discharge port position control mechanism 272, wherein the moving liquid discharge port 271 is movable in a direction X perpendicular to the bottom wall of the groove 22; the position control mechanism 272 is configured to control the corresponding movement row according to the detection result of the detecting unit 26
  • the liquid port 271 moves in a direction X perpendicular to the bottom wall of the groove 22. For example, moving to the high
  • the flexible substrate processing apparatus may further include a processing liquid injected into the groove 22 as shown in FIG.
  • the flexible substrate 29 is processed, the driving roller 23 rotates to drive the flexible substrate 29, and the flexible substrate 29 is pulled from the driven roller 24 through the positioning roller 25 in the processing liquid 21.
  • the flexible substrate 29 is processed in the process of immersing in the etching liquid 21.
  • the detecting unit 26 is disposed in the radial direction of the driving roller 23 as shown in Fig. 2, and is used to detect the radius or diameter of the driving roller 23.
  • the radius or diameter of the driving roller 23 changes with the number of the wound flexible substrates 29, and after detecting the radius or diameter change, the detecting unit 26 notifies the liquid discharge port position control mechanism 272 and the liquid replacement assembly 28, the liquid discharge port
  • the position control mechanism 272 can control the moving liquid discharge port 271 to move in the direction X of the bottom wall perpendicular to the groove 22 according to the detection result of the detecting unit 26, so that the moving liquid discharge port 271 has a height in the direction X perpendicular to the bottom wall of the groove 22.
  • the fluid replacement assembly 28 can replenish the treatment fluid into the tank 22.
  • V w * r (where V is the linear velocity, w is the angular velocity, and r is the radius), it can be seen that when the driving roller 23 rotates at a constant speed, the angular velocity w is a constant value, so the linear velocity V is proportional to the radius r, When the radius of the driving roller 23 is increased, the conveying speed of the flexible substrate 29 wound thereon is increased, and if the prior art is used, the time during which the flexible substrate 29 is processed in the processing liquid is reduced.
  • the liquid discharge port position control mechanism 272 can adjust the moving liquid discharge port 271 to the high position H, and the liquid replacement port 28 can be used to replenish the liquid in the groove 22, and the liquid discharge port is moved. Adjust to the position where the treatment fluid does not flow out of the moving drain. Therefore, the liquid level of the treatment liquid is increased during this process.
  • the liquid discharge port position control mechanism 272 can adjust the moving liquid discharge port 271 to the low position L so that the processing liquid in the tank 22 is discharged. During this process, the liquid level of the treatment liquid is lowered.
  • the detecting unit 26 is configured to detect the radius or diameter of the driving roller 23, and when it is detected that the radius or diameter of the driving roller 23 is increased, the liquid discharge port position control mechanism 272 controls the moving liquid discharge port 271. Moving downward to lower the liquid level of the treatment liquid 21; when detecting that the radius or diameter of the driving roller 23 is reduced, the liquid discharge port position control mechanism 272 controls the moving liquid discharge port 271 to move upward, and the liquid replacement assembly 28 is moved into the groove The treatment liquid is injected to increase the liquid level of the treatment liquid.
  • the drain port position control mechanism 272 is configured to control the height of the moving drain port 271 such that the length of the portion of the flexible substrate immersed in the process liquid in the direction in which the flexible substrate is transported is opposite to the length of the drive roller 23
  • the radius or diameter is inversely proportional.
  • the detecting unit can notify the liquid discharge port position control mechanism and the liquid replacement component after detecting the change of the radius or diameter of the winding roller, and move the liquid discharge port position to a high position. Adjusting and replenishing the treatment liquid, or adjusting the position of the liquid discharge port to a low position to discharge part of the treatment liquid. Therefore, the length of the flexible substrate immersed in the treatment liquid can be adjusted according to a certain ratio by the lifting and lowering of the liquid level of the treatment liquid.
  • the change of the radius or diameter of the roller varies, so that the time during which the flexible substrate is processed in the processing liquid is kept constant, thereby ensuring the uniformity of the device size on the flexible substrate, and improving the quality of the flexible display product.
  • the flexible substrate processing apparatus may further include a control unit (not shown in FIG. 2), It is used to transmit the detection result of the detecting unit 26 to the liquid discharge port position control mechanism 272.
  • the detecting unit 26 is disposed close to the driving roller 23, and the measurement of the radius of the driving roller 23 is realized.
  • the detecting unit can also be arranged close to the driven roller to realize the measurement of the radius of the driven roller, and the control mechanism and the rehydration assembly of the drain port according to the radius of the driven roller are controlled in the same manner as described above. I will not repeat them here.
  • the detecting unit may also be two (32' and 32 ⁇ ), respectively, close to the driving roller 33 and driven. Rollers 34 are provided for detecting the radius of the drive roller 33 and the radius of the driven roller 34, respectively.
  • the detection signals generated by the two detection units (32' and 32 ⁇ ) can be used to control the liquid level of the treatment liquids (35' and 35 ⁇ ) in the different tanks (tank 3 and tank 3), respectively.
  • the detecting unit 32' detects a change in the radius of the driving roller 33, it notifies the liquid discharge port position control mechanism 36' corresponding to the groove 31' and the liquid replacement assembly 37' to realize the liquid for the treatment liquid 35' in the tank 3.
  • the height of the surface is adjusted; the detecting unit 32 detects the change of the radius of the driven roller 34, and notifies the liquid discharge port position control mechanism 36A corresponding to the groove 31 ⁇ and the liquid replacement assembly 37 ⁇ to realize the processing in the groove 31 ⁇ . Adjustment of the liquid level of liquid 35 ⁇ .
  • the signal generated by the detecting unit 32' can also be used to control the liquid level of the processing liquid 35 / r in the tank 31, and the signal generated by the detecting unit 32 ⁇ can also be used to control the liquid level of the processing liquid 35' in the tank 3. height.
  • the moving liquid discharge port 38' of the groove 31' is located at the high position H, and the moving liquid discharge port 38" of the groove 31' is located at the low position L.
  • the position of the moving liquid discharge port is not limited to the figure.
  • the limit roller D is used to define the position of the flexible substrate 39 that is transferred between the adjacent two grooves (31' and 3).
  • the treatment liquid may be an etching liquid, a cleaning liquid, or a stripping liquid, thereby respectively performing etching, cleaning or stripping treatment on the flexible substrate.
  • the liquid discharge port position control mechanism may include a stepping motor 41 and a lead screw 42 as shown in Fig. 4.
  • the stepping motor 41 drives the lead screw 42, so that the moving liquid discharge port 43 moves up and down on the lead screw 42.
  • the drain port position control mechanism can also be other mechanical structures known to those skilled in the art such that when combined with the mobile drain port, the mobile drain port can be moved in a direction perpendicular to the bottom wall of the slot. .
  • the liquid replacement assembly may be any form of the structure capable of supplying the treatment liquid known to those skilled in the art, and is not limited to the form shown in FIGS. 2 and 3.
  • the rehydration assembly may be partially located in its corresponding slot and the other portion being located outside its corresponding slot; or the entire rehydration assembly may be located outside its corresponding slot.
  • the above detection unit may be a distance sensor or other means known to those skilled in the art for knowing the radius or diameter of the winding roller.
  • the communication means of the detecting unit and the position control mechanism may be any suitable communication means in the art, and is not specifically limited according to the embodiment of the present invention, and details are not described herein again.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Infusion, Injection, And Reservoir Apparatuses (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

一种柔性基板处理装置，包括：盛有处理液（21）的至少一个槽（22）；位于处理液（21）上方的卷绕辊轮，包括主动辊轮（23）和从动辊轮（24）；位于每一个槽（22）的处理液（21）中的定位辊轮（25）；检测单元（26），被构造为检测至少一个卷绕辊轮的半径或直径；固定于每一个槽（22）的侧壁上的移动排液组件（27），移动排液组件（27）包括排除处理液（21）的移动排液口（271）以及排液口位置控制机构（272），移动排液口（271）能够在垂直于槽（22）的底壁方向上移动。

Description

柔性基板处理装置 技术领域
本发明的实施例涉及柔性基板处理装置。 背景技术
随着柔性显示产品的不断开发， 卷对卷（Roll to Roll ) 工艺凭借其低成 本、 高效率生产的特性， 将逐步替代目前制造非柔性显示产品所使用的逐张 生产模式， 成为未来显示产品生产的主流。
图 1为现有技术使用的卷对卷刻蚀装置的示意图， 其中包括： 盛放有刻 蚀液 11的刻蚀槽 12; 位于刻蚀槽上方的卷绕辊轮， 包括主动辊轮 13和从动 辊轮 14;位于刻蚀液 11中的定位辊轮 15; 柔性基板 16沿其运动方向依次绕 过从动辊轮 14、 定位辊轮 15及主动辊轮 13。
图 1所示的装置运行时，对柔性基板 16执行卷对卷刻蚀工艺，主动辊轮
13转动带动柔性基板 16, 将柔性基板 16通过刻蚀液 11中的定位辊轮 15从 从动辊轮 14拉至主动辊轮 13 , 柔性基板 16在刻蚀液 11中浸泡的过程中被 刻蚀。
在上述现有的卷对卷刻蚀工艺中， 由于主动辊轮 13和从动辊轮 14的直 径随着柔性基板 16 缠绕层数的变化而变化， 这就使得匀速转动的主动辊轮 13和从动辊轮 14上柔性基板 16的移动线速度在不停变化。从而导致柔性基 板 16的刻蚀时间会随着主动辊轮 13和从动辊轮 14的直径变化而变化，进而 导致柔性基板上的器件尺寸不均勾， 影响柔性显示产品的品质。 发明内容
本发明的实施例提供一种柔性基板处理装置， 解决了现有的卷对卷刻蚀 装置在处理柔性基板时存在的处理时间随着卷绕辊轮直径的变化而变化的问 题。
本发明的实施例提供一种柔性基板处理装置， 包括： 盛放有处理液的至 少一个槽； 位于所述处理液上方的卷绕辊轮， 包括主动辊轮和从动辊轮； 位 于每一个所述槽的处理液中的定位辊轮； 检测单元， 被构造为检测所述至少 一个卷绕辊轮的半径或直径；固定于每一个所述槽的侧壁上的移动排液组件； 其中包括排出所述处理液的移动排液口， 以及排液口位置控制机构 , 其中所 述位置控制机构被构造为根据所述检测单元的检测结果， 控制相应的所述移 动排液口在垂直于所述槽的底壁方向上移动。
本发明实施例提供的柔性基板处理装置中 , 由于检测单元能够在检测到 卷绕辊轮的半径或直径变化后， 通知排液口位置控制机构及补液组件， 将移 动排液口位置向高位置调整并补入处理液， 或者将排液口位置向低位置调整 以排出部分处理液， 因此， 通过处理液液面的升降能使得浸入处理液的柔性 基板的长度能按照一定的比例随着卷绕辊轮半径或直径的变化而变化， 从而 使得柔性基板在处理液中被处理的时间保持恒定,进而保证了柔性基板上器 件尺寸的均匀性， 可提高柔性显示产品的品质。 附图说明
为了更清楚地说明本发明实施例的技术方案， 下面将对实施例的附图作 简单地介绍，显而易见地， 下面描述中的附图仅仅涉及本发明的一些实施例， 而非对本发明的限制。
图 1为现有技术使用的卷对卷刻蚀装置的示意图；
图 2为本发明实施例提供的具有单槽的柔性基板处理装置的示意图； 图 3为本发明实施例提供的具有双槽的柔性基板处理装置的示意图； 图 4为本发明实施例提供的排液口位置控制机构的示意图。 具体实施方式
为使本发明实施例的目的、 技术方案和优点更加清楚， 下面将结合本发 明实施例的附图， 对本发明实施例的技术方案进行清楚、 完整地描述。显然， 所描述的实施例是本发明的一部分实施例， 而不是全部的实施例。 基于所描 述的本发明的实施例， 本领域普通技术人员在无需创造性劳动的前提下所获 得的所有其他实施例， 都属于本发明保护的范围。
本发明的实施例提供了一种柔性基板处理装置， 如图 2所示 （图 2示出 了只有一个槽的情况） ， 该装置包括： 盛放有处理液 21的至少一个槽 22; 位于所述处理液 21上方的卷绕辊轮， 包括主动辊轮 23和从动辊轮 24; 位于 每一个所述处理液 21中的定位辊轮 25; 检测单元 26, 用于检测所述至少一 个卷绕辊轮的半径或直径；固定于每一个所述槽 22的侧壁上的移动排液组件 27;其中包括排出所述处理液 21的移动排液口 271以及排液口位置控制机构 272, 其中移动排液口 271能够在垂直于所述槽 22的底壁方向 X上移动； 所 述位置控制机构 272, 用于根据所述检测单元 26的检测结果， 控制相应的所 述移动排液口 271在垂直于所述槽 22的底壁方向 X上移动。 例如， 移动至 高位置 H、 低位置 L, 或者移动至所述高位置 H与所述低位置 L之间的中间 位置， 图 中的移动排液口 271处于低位置 L。
该柔性基板处理装置还可以如图 2所示 ,包括向所述槽 22内注入处理液
21的补液组件 28。
图 2所示的柔性基板处理装置运行时，对柔性基板 29进行处理，主动辊 轮 23转动带动柔性基板 29, 将柔性基板 29通过处理液 21中的定位辊轮 25 从从动辊轮 24拉至主动辊轮 23 , 柔性基板 29在刻蚀液 21中浸泡的过程中 被处理。
检测单元 26如图 2所示沿主动辊轮 23的径向设置， 并用来检测主动辊 轮 23的半径或直径。主动辊轮 23的半径或直径随着卷绕的柔性基板 29的多 少而发生变化，检测单元 26检测到半径或直径变化后，通知排液口位置控制 机构 272及补液组件 28, 该排液口位置控制机构 272可根据检测单元 26的 检测结果控制移动排液口 271在垂直于槽 22的底壁方向 X上移动， 使得移 动排液口 271在垂直于槽 22的底壁方向 X上具有高位置 H、 低位置 L以及 高位置 H与低位置 L之间的中间位置。补液组件 28可向槽 22中补充处理液。
根据公式V=w*r (其中， V为线速度， w为角速度， r为半径）可知： 当 主动辊轮 23匀速转动时， 角速度 w是恒定值， 因此线速度 V与半径 r成正 比， 使得当主动棍轮 23的半径增大时， 其上卷绕的柔性基板 29的传送速度 增加，如果釆用现有技术，会导致柔性基板 29在处理液中被处理的时间减少。
而在本发明的实施例中， 此时可利于排液口位置控制机构 272将移动排 液口 271向高位置 H调整， 并利用补液组件 28向槽 22中补充处理液， 移动 排液口被调整至处理液不会从移动排液口流出的位置。 因此， 在此过程中会 增加处理液的液面高度。 由于槽 22中处理液的量增加， 使得浸入处理液的柔性基板 29的长度增 加， 根据公式8=¥ （S为位移， V为线速度， t为时间） ， 当浸入处理液的柔 性基板 29的长度除以柔性基板 29的传送速度为恒定值时， 能保证柔性基板 29在处理液中被处理的时间保持恒定， 不会因柔性基板 29的传送速度的变 化而变化。
当主动辊轮 23的半径减小时，其上卷绕的柔性基板 29的传送速度减小， 如果采用现有技术， 会导致柔性基板 29在处理液中被处理的时间增加。
而在本发明的实施例中， 此时可利于排液口位置控制机构 272将移动排 液口 271向低位置 L调整， 使得槽 22中的处理液被排出。 在此过程中， 处 理液的液面高度会降低。
由于槽 22中处理液的量减少 , 使得浸入处理液的柔性基板 29的长度减 少， 根据公式 s=v*t, 当浸入处理液的柔性基板 29 的长度除以柔性基板 29 的传送速度为恒定值时，能保证柔性基板 29在处理液中被处理的时间保持恒 定， 不会因柔性基板 29的传送速度的变化而变化。
在一个实施例中，检测单元 26被构造为检测主动辊轮 23的半径或直径， 当检测到主动辊轮 23的半径或直径增大时，排液口位置控制机构 272控制移 动排液口 271向下移动以降低处理液 21的液面高度； 当检测到主动辊轮 23 的半径或直径减小时， 排液口位置控制机构 272控制移动排液口 271向上移 动， 且补液组件 28向槽内注入处理液以增加处理液的液面高度。
在一个实施例中，排液口位置控制机构 272被构造为控制移动排液口 271 的高度， 以使得柔性基板浸入处理液的部分沿所述柔性基板传送的方向的长 度与主动辊轮 23的半径或直径成反比。
本发明实施例提供的柔性基板处理装置中， 由于检测单元能够在检测到 卷绕辊轮的半径或直径变化后， 通知排液口位置控制机构及补液组件， 将移 动排液口位置向高位置调整并补入处理液， 或者将排液口位置向低位置调整 以排出部分处理液， 因此， 通过处理液液面的升降能使得浸入处理液的柔性 基板的长度能按照一定的比例随着卷绕辊轮半径或直径的变化而变化， 从而 使得柔性基板在处理液中被处理的时间保持恒定,进而保证了柔性基板上器 件尺寸的均匀性， 可提高柔性显示产品的品质。
上述实施例中， 柔性基板处理装置还可包括控制单元（图 2中未示出）， 用于将所述检测单元 26的检测结果传送给所述排液口位置控制机构 272。 图 2所示的柔性基板处理装置中， 检测单元 26靠近主动辊轮 23设置， 实现对主动辊轮 23半径的测量。 当然， 检测单元还可以靠近从动辊轮设置， 以实现对从动辊轮半径的测量， 根据从动辊轮半径控制排液口位置控制机构 及补液组件， 控制方式与上述描述的方式相同， 在此不再赘述。
当柔性基板处理装置中具有多个槽（槽 3 和槽 31〃 ）时，如图 3所示， 检测单元还可以为两个（32' 和 32〃 ） ， 分别靠近主动辊轮 33和从动辊轮 34设置， 分别用于检测主动辊轮 33的半径和从动辊轮 34的半径。 两个检测 单元（32' 和 32〃 ）产生的检测信号可以分别用来控制不同槽（槽 3 和槽 3 ) 内处理液（35' 和 35〃 ）的液面高度。 例如， 检测单元 32' 检测到主 动辊轮 33的半径变化时 , 通知对应于槽 31 ' 的排液口位置控制机构 36' 及 补液组件 37' , 以实现对槽 3 内处理液 35' 的液面高度的调整； 检测单 元 32〃 检测到从动辊轮 34的半径变化时， 通知对应于槽 31〃 的排液口位置 控制机构 36〃 及补液组件 37〃 ， 以实现对槽 31〃 内处理液 35〃 的液面高度 的调整。 当然， 检测单元 32' 产生的信号也可以用来控制槽 31 内处理液 35/r 的液面高度，而检测单元 32〃 产生的信号也可以用来控制槽 3 内处理 液 35' 的液面高度。
图 3中， 槽 31' 的移动排液口 38' 位于高位置 H,而槽 31〃 的移动排液 口 38" 位于低位置 L,在实际应用中，移动排液口的位置并不限于图 3所示。 限位辊轮 D用于将在相邻的两个槽 （31' 与 3 )之间传送的柔性基板 39 的位置进行限定。
上述处理液可以为刻蚀液、 清洗液、 或剥离液， 从而分别实现对柔性基 板的刻蚀、 清洗或剥离处理。
上述排液口位置控制机构可如图 4所示包括步进电机 41及丝杠 42， 步 进电机 41带动丝杠 42, 使得移动排液口 43在丝杠 42上作上下移动。 当然， 排液口位置控制机构也可以是本领域技术人员所知的其它机械结构， 使得其 与移动排液口组合在一起时能实现移动排液口在垂直于槽的底壁的方向上移 动。
另外， 上述的柔性基板处理装置中， 补液组件可以是本领域技术人员所 知的任何形式的能供给处理液的结构， 并不限于图 2、 图 3 中所示的形式， 该补液组件可以是一部分位于其所对应的槽内， 另一部分位于其所对应的槽 外； 也可以是整个补液组件都位于其所对应的槽外。
上述检测单元可以为距离传感器， 或是本领域技术人员所知的其它能获 知卷绕辊轮半径或直径的装置。 另外， 检测单元和位置控制机构的通信手段 可以采用本领域中任何合适的通信手段， 根据本发明的实施例对此不作具体 限制， 在这里不再赘述。
以上所述仅是本发明的示范性实施方式， 而非用于限制本发明的保护范 围， 本发明的保护范围由所附的权利要求确定。

Claims

权利要求书
1、 一种柔性基板处理装置， 包括：
盛放有处理液的至少一个槽；
位于所述处理液上方的卷绕辊轮， 包括主动辊轮和从动辊轮； 位于每一个所述槽的处理液中的定位辊轮；
检测单元 , 被构造为检测所述至少一个卷绕辊轮的半径或直径； 固定于每一个所述槽的侧壁上的移动排液组件， 该移动排液组件包括排 出所述处理液的移动排液口以及排液口位置控制机构；
其中所述位置控制机构被构造为根据所述检测单元的检测结果， 控制相 应的所述移动排液口在垂直于所述槽的底壁方向上移动。
2、根据权利要求 1所述的柔性基板处理装置，还包括： 向所述槽内注入 处理液的补液组件。
3、根据权利要求 1或 2所述的柔性基板处理装置， 其中， 所述处理液为 刻蚀液、 清洗液或剥离液。
4、 根据权利要求 1-3中任一项所述的柔性基板处理装置， 其中， 所述排 液口位置控制机构包括步进电机及丝杠。
5、根据权利要求 2所述的柔性基板处理装置， 其中， 所述补液组件的一 部分位于其所对应的所述槽内 , 另一部分位于其所对应的所述槽外。
6、 根据权利要求 1-5中任一项所述的柔性基板处理装置， 其中， 所述检 测单元为距离传感器。
7、根据权利要求 1-6中任一项所述的柔性基板处理装置， 还包括控制单 元， 被构造为将所述检测单元的检测结果传送给所述排液口位置控制机构。
8、 根据权利要求 1-7中任一项所述的柔性基板处理装置， 其中， 所述检 测单元为两个， 分别用于检测所述主动辊轮的半径或直径和所述从动棍轮的 半径或直径。
9、 根据权利要求 1-8所述的柔性基板处理装置， 还包括限位辊轮， 被构 造为将在相邻的两个所述槽之间传送的柔性基板的位置进行限定。
10、 根据权利要求 2所述的柔性基板处理装置， 其中所述检测单元被构 造为检测所述主动辊轮的半径或直径， 当检测到所述主动辊轮的半径或直径 增大时， 所述排液口位置控制机构控制所述移动排液口向下移动以降低所述 处理液的液面高度； 当检测到所述主动辊轮的半径或直径减小时， 所述排液 口位置控制机构控制所述移动排液口向上移动， 且所述补液組件向所述槽内 注入所述处理液以增加所述处理液的液面高度。
11、 根据权利要求 1-10中任一项所述的柔性基板处理装置， 其中所述排 液口位置控制机构被构造为控制所述移动排液口的高度， 以使得柔性基板浸 入所述处理液的部分沿所述柔性基板传送的方向的长度与所述主动辊轮的半 径或直径成反比。
12、 根据权利要求 1-11中任一项所述的柔性基板处理装置， 其中所述主 动辊轮以恒定的角速度转动。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016219744A (ja) * 2015-05-26 2016-12-22 株式会社ニコン 湿式処理装置および湿式処理方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102790002B (zh) * 2012-07-27 2015-02-11 京东方科技集团股份有限公司 柔性基板处理装置
CN103456689B (zh) * 2013-08-13 2015-02-25 京东方科技集团股份有限公司 用于将柔性基板与玻璃基板分离的装置及生产设备
KR20160073415A (ko) * 2013-10-22 2016-06-24 어플라이드 머티어리얼스, 인코포레이티드 능동 정렬을 이용하는 롤 투 롤 마스크-없는 리소그래피
JP6558624B2 (ja) * 2015-02-13 2019-08-14 大日本印刷株式会社 洗浄装置
CN107442503A (zh) * 2017-09-11 2017-12-08 东莞市观卓新能源科技有限公司 一种应用在清洗设备上的水箱

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1304183A (zh) * 1999-11-29 2001-07-18 佳能株式会社 形成氧化锌膜的方法和设备以及制造光生伏打器件的方法和设备、
CN101871109A (zh) * 2009-04-21 2010-10-27 广州力加电子有限公司 一种双卷连续电沉积加厚装置
JP2011154303A (ja) * 2010-01-28 2011-08-11 Asahi Kasei E-Materials Corp ワイヤグリッド偏光子の製造方法
WO2011099563A1 (ja) * 2010-02-12 2011-08-18 株式会社ニコン 基板処理装置
CN102790002A (zh) * 2012-07-27 2012-11-21 京东方科技集团股份有限公司 柔性基板处理装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3310062A (en) * 1965-05-27 1967-03-21 Ibm Web tensioning device
JPH0575219A (ja) 1991-07-25 1993-03-26 Sharp Corp フレキシブル回路基板及びフレキシブル回路基板の製造方法
JPH0734544U (ja) 1993-12-10 1995-06-23 株式会社富士通ゼネラル プラズマディスプレイ装置
JPH1177435A (ja) 1997-09-09 1999-03-23 Sodick Co Ltd 放電加工装置
US6864186B1 (en) * 1998-07-28 2005-03-08 Micron Technology, Inc. Method of reducing surface contamination in semiconductor wet-processing vessels
JP2001158986A (ja) 1999-12-01 2001-06-12 Dainippon Screen Mfg Co Ltd 帯状金属薄板の処理装置および処理方法
JP3608469B2 (ja) 2000-03-24 2005-01-12 Ｊｆｅスチール株式会社 金属帯の脱脂装置
JP3738834B2 (ja) 2001-12-28 2006-01-25 セイコーエプソン株式会社 配線基板の製造方法及び製造装置
AU2003254011A1 (en) * 2002-07-19 2004-02-09 Mykrolis Corporation Fluid flow measuring and proportional fluid flow control device
JP4313284B2 (ja) 2004-11-15 2009-08-12 大日本スクリーン製造株式会社 基板処理装置
KR101204089B1 (ko) 2007-12-24 2012-11-22 삼성테크윈 주식회사 롤투롤 기판 이송 장치, 이를 포함하는 습식 식각 장치 및회로 기판 제조 장치
KR20100061035A (ko) 2008-11-28 2010-06-07 세메스 주식회사 기판 처리 장치 및 방법
CN201372137Y (zh) * 2009-03-18 2009-12-30 北京中科远恒科技有限公司 一种卷绕装置以及具有该卷绕装置的纺织机
JP2011074416A (ja) * 2009-09-29 2011-04-14 Toppan Printing Co Ltd 帯状被処理物の置換めっき処理装置、及び置換めっき処理方法
KR20110045701A (ko) 2009-10-27 2011-05-04 주식회사 케이씨텍 기판의 경사이송시스템
KR101141723B1 (ko) * 2010-01-13 2012-05-04 신양에너지 주식회사 구리금속판에 저방사율 및 고흡수율의 친환경 블랙황산크롬 도금 연속 자동 전착방법
CN202090088U (zh) * 2011-03-29 2011-12-28 湖南师范大学 一种连续电镀液面高度自动控制装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1304183A (zh) * 1999-11-29 2001-07-18 佳能株式会社 形成氧化锌膜的方法和设备以及制造光生伏打器件的方法和设备、
CN101871109A (zh) * 2009-04-21 2010-10-27 广州力加电子有限公司 一种双卷连续电沉积加厚装置
JP2011154303A (ja) * 2010-01-28 2011-08-11 Asahi Kasei E-Materials Corp ワイヤグリッド偏光子の製造方法
WO2011099563A1 (ja) * 2010-02-12 2011-08-18 株式会社ニコン 基板処理装置
CN102790002A (zh) * 2012-07-27 2012-11-21 京东方科技集团股份有限公司 柔性基板处理装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2879170A4 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016219744A (ja) * 2015-05-26 2016-12-22 株式会社ニコン 湿式処理装置および湿式処理方法

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