JP5761034B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

Info

Publication number
JP5761034B2
JP5761034B2 JP2011553890A JP2011553890A JP5761034B2 JP 5761034 B2 JP5761034 B2 JP 5761034B2 JP 2011553890 A JP2011553890 A JP 2011553890A JP 2011553890 A JP2011553890 A JP 2011553890A JP 5761034 B2 JP5761034 B2 JP 5761034B2
Authority
JP
Japan
Prior art keywords
substrate
sheet substrate
exposure
processing
roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011553890A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2011099563A1 (ja
Inventor
鈴木　智也
智也 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of JPWO2011099563A1 publication Critical patent/JPWO2011099563A1/ja
Application granted granted Critical
Publication of JP5761034B2 publication Critical patent/JP5761034B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2011553890A 2010-02-12 2011-02-10 基板処理装置 Active JP5761034B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US30398610P 2010-02-12 2010-02-12
US61/303,986 2010-02-12
PCT/JP2011/052879 WO2011099563A1 (ja) 2010-02-12 2011-02-10 基板処理装置

Publications (2)

Publication Number Publication Date
JPWO2011099563A1 JPWO2011099563A1 (ja) 2013-06-17
JP5761034B2 true JP5761034B2 (ja) 2015-08-12

Family

ID=44367833

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011553890A Active JP5761034B2 (ja) 2010-02-12 2011-02-10 基板処理装置

Country Status (6)

Country Link
JP (1) JP5761034B2 (zh)
KR (2) KR101948467B1 (zh)
CN (1) CN102741754B (zh)
HK (1) HK1171820A1 (zh)
TW (2) TWI492326B (zh)
WO (1) WO2011099563A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104203785B (zh) * 2012-04-13 2016-08-24 株式会社尼康 盒装置、基板搬送装置、基板处理装置和基板处理方法
TWI611996B (zh) * 2012-05-18 2018-01-21 尼康股份有限公司 基板處理裝置
CN102790002B (zh) * 2012-07-27 2015-02-11 京东方科技集团股份有限公司 柔性基板处理装置
KR101984360B1 (ko) * 2013-07-08 2019-05-30 가부시키가이샤 니콘 기판 처리 장치, 디바이스 제조 시스템, 디바이스 제조 방법, 및 패턴 형성 장치
JP6459234B2 (ja) * 2014-06-16 2019-01-30 株式会社ニコン 基板処理装置
EP3124649A4 (en) * 2014-03-25 2017-08-16 ULVAC, Inc. Film-formation device and film-formation method
CN106164779B (zh) * 2014-04-01 2019-01-22 株式会社尼康 基板处理装置
TWI695235B (zh) * 2014-04-01 2020-06-01 日商尼康股份有限公司 圖案描繪裝置及元件製造方法
TW201732444A (zh) * 2015-11-30 2017-09-16 Nippon Kogaku Kk 曝光裝置、曝光系統、基板處理方法、以及元件製造裝置
JP6723831B2 (ja) * 2016-06-01 2020-07-15 株式会社オーク製作所 露光装置
JP7023620B2 (ja) * 2017-05-30 2022-02-22 株式会社オーク製作所 露光装置及び基板載置方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11340120A (ja) * 1998-05-26 1999-12-10 Ushio Inc 裏面アライメント機能を備えた露光装置
JP2001235877A (ja) * 1999-12-14 2001-08-31 Sony Chem Corp 露光方法
JP2006235533A (ja) * 2005-02-28 2006-09-07 Nikon Corp 露光装置及びマイクロデバイスの製造方法
JP2007067355A (ja) * 2005-09-02 2007-03-15 Sharp Corp 基板表面処理装置および基板表面処理方法
JP2010014939A (ja) * 2008-07-03 2010-01-21 Nikon Corp 回路素子の製造装置及び製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5198857A (en) * 1990-03-30 1993-03-30 Ushio Denski Kabushiki Kaisha Film exposure apparatus and method of exposure using the same
US5743931A (en) * 1995-08-14 1998-04-28 Libbey-Owens-Ford Co. Glass sheet conveying and bending apparatus
JP3201233B2 (ja) * 1995-10-20 2001-08-20 ウシオ電機株式会社 裏面にアライメント・マークが設けられたワークの投影露光方法
JP2006102991A (ja) * 2004-09-30 2006-04-20 Fuji Photo Film Co Ltd 画像記録装置及び画像記録方法
JP2006106505A (ja) * 2004-10-07 2006-04-20 Fuji Photo Film Co Ltd 画像記録装置及び画像記録方法
JP5157440B2 (ja) * 2005-03-18 2013-03-06 コニカミノルタホールディングス株式会社 有機ｅｌ素子の製造方法
JP4224479B2 (ja) * 2005-09-07 2009-02-12 富士フイルム株式会社 パターン露光方法及び装置
JP5104107B2 (ja) * 2007-08-02 2012-12-19 ウシオ電機株式会社 帯状ワークの露光装置及び帯状ワークの露光装置におけるフォーカス調整方法
JP5117243B2 (ja) * 2008-03-27 2013-01-16 株式会社オーク製作所 露光装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11340120A (ja) * 1998-05-26 1999-12-10 Ushio Inc 裏面アライメント機能を備えた露光装置
JP2001235877A (ja) * 1999-12-14 2001-08-31 Sony Chem Corp 露光方法
JP2006235533A (ja) * 2005-02-28 2006-09-07 Nikon Corp 露光装置及びマイクロデバイスの製造方法
JP2007067355A (ja) * 2005-09-02 2007-03-15 Sharp Corp 基板表面処理装置および基板表面処理方法
JP2010014939A (ja) * 2008-07-03 2010-01-21 Nikon Corp 回路素子の製造装置及び製造方法

Also Published As

Publication number Publication date
CN102741754B (zh) 2015-12-02
TW201207980A (en) 2012-02-16
HK1171820A1 (zh) 2013-04-05
TW201535576A (zh) 2015-09-16
WO2011099563A1 (ja) 2011-08-18
JPWO2011099563A1 (ja) 2013-06-17
TWI557840B (zh) 2016-11-11
KR20180004833A (ko) 2018-01-12
KR101816327B1 (ko) 2018-01-08
CN102741754A (zh) 2012-10-17
KR101948467B1 (ko) 2019-02-14
TWI492326B (zh) 2015-07-11
KR20120138751A (ko) 2012-12-26

Similar Documents

Publication Publication Date Title
JP5761034B2 (ja) 基板処理装置
JP6308247B2 (ja) パターン形成方法
TWI503632B (zh) A conveyance method and apparatus, and an exposure method and apparatus
JP5765240B2 (ja) 帯状のシート基板のための搬送装置及び処理装置、デバイス製造方法
JP6115473B2 (ja) 基板処理装置、基板処理方法、及び電子回路の製造方法
JP6601541B2 (ja) パターン露光方法、及びパターン形成方法
JP2011203311A (ja) マスクホルダ、円筒型マスク、露光装置、基板処理装置及びデバイス製造方法
TWI598696B (zh) 光罩單元、基板處理裝置及光罩單元製造方法、以及基板處理方法
WO2013065451A1 (ja) 基板処理装置および基板処理方法
JP2013218157A (ja) 露光装置、露光方法及び基板処理装置
WO2013150898A1 (ja) マスク移動装置、マスク保持装置、露光装置及び基板処理装置
JP2013218156A (ja) 露光装置及び基板処理装置
JP2014086449A (ja) 搬送装置及び基板処理装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140106

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20141014

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20141212

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150512

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150525

R150 Certificate of patent or registration of utility model

Ref document number: 5761034

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250