JP5761034B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP5761034B2
JP5761034B2 JP2011553890A JP2011553890A JP5761034B2 JP 5761034 B2 JP5761034 B2 JP 5761034B2 JP 2011553890 A JP2011553890 A JP 2011553890A JP 2011553890 A JP2011553890 A JP 2011553890A JP 5761034 B2 JP5761034 B2 JP 5761034B2
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Japan
Prior art keywords
substrate
sheet substrate
exposure
processing
roller
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JP2011553890A
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English (en)
Japanese (ja)
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JPWO2011099563A1 (ja
Inventor
鈴木 智也
智也 鈴木
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Nikon Corp
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Nikon Corp
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70791Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70775Position control, e.g. interferometers or encoders for determining the stage position
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2011553890A 2010-02-12 2011-02-10 基板処理装置 Active JP5761034B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US30398610P 2010-02-12 2010-02-12
US61/303,986 2010-02-12
PCT/JP2011/052879 WO2011099563A1 (ja) 2010-02-12 2011-02-10 基板処理装置

Publications (2)

Publication Number Publication Date
JPWO2011099563A1 JPWO2011099563A1 (ja) 2013-06-17
JP5761034B2 true JP5761034B2 (ja) 2015-08-12

Family

ID=44367833

Family Applications (1)

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JP2011553890A Active JP5761034B2 (ja) 2010-02-12 2011-02-10 基板処理装置

Country Status (6)

Country Link
JP (1) JP5761034B2 (zh)
KR (2) KR101948467B1 (zh)
CN (1) CN102741754B (zh)
HK (1) HK1171820A1 (zh)
TW (2) TWI492326B (zh)
WO (1) WO2011099563A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104203785B (zh) * 2012-04-13 2016-08-24 株式会社尼康 盒装置、基板搬送装置、基板处理装置和基板处理方法
TWI611996B (zh) * 2012-05-18 2018-01-21 尼康股份有限公司 基板處理裝置
CN102790002B (zh) * 2012-07-27 2015-02-11 京东方科技集团股份有限公司 柔性基板处理装置
KR101984360B1 (ko) * 2013-07-08 2019-05-30 가부시키가이샤 니콘 기판 처리 장치, 디바이스 제조 시스템, 디바이스 제조 방법, 및 패턴 형성 장치
JP6459234B2 (ja) * 2014-06-16 2019-01-30 株式会社ニコン 基板処理装置
EP3124649A4 (en) * 2014-03-25 2017-08-16 ULVAC, Inc. Film-formation device and film-formation method
CN106164779B (zh) * 2014-04-01 2019-01-22 株式会社尼康 基板处理装置
TWI695235B (zh) * 2014-04-01 2020-06-01 日商尼康股份有限公司 圖案描繪裝置及元件製造方法
TW201732444A (zh) * 2015-11-30 2017-09-16 Nippon Kogaku Kk 曝光裝置、曝光系統、基板處理方法、以及元件製造裝置
JP6723831B2 (ja) * 2016-06-01 2020-07-15 株式会社オーク製作所 露光装置
JP7023620B2 (ja) * 2017-05-30 2022-02-22 株式会社オーク製作所 露光装置及び基板載置方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11340120A (ja) * 1998-05-26 1999-12-10 Ushio Inc 裏面アライメント機能を備えた露光装置
JP2001235877A (ja) * 1999-12-14 2001-08-31 Sony Chem Corp 露光方法
JP2006235533A (ja) * 2005-02-28 2006-09-07 Nikon Corp 露光装置及びマイクロデバイスの製造方法
JP2007067355A (ja) * 2005-09-02 2007-03-15 Sharp Corp 基板表面処理装置および基板表面処理方法
JP2010014939A (ja) * 2008-07-03 2010-01-21 Nikon Corp 回路素子の製造装置及び製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5198857A (en) * 1990-03-30 1993-03-30 Ushio Denski Kabushiki Kaisha Film exposure apparatus and method of exposure using the same
US5743931A (en) * 1995-08-14 1998-04-28 Libbey-Owens-Ford Co. Glass sheet conveying and bending apparatus
JP3201233B2 (ja) * 1995-10-20 2001-08-20 ウシオ電機株式会社 裏面にアライメント・マークが設けられたワークの投影露光方法
JP2006102991A (ja) * 2004-09-30 2006-04-20 Fuji Photo Film Co Ltd 画像記録装置及び画像記録方法
JP2006106505A (ja) * 2004-10-07 2006-04-20 Fuji Photo Film Co Ltd 画像記録装置及び画像記録方法
JP5157440B2 (ja) * 2005-03-18 2013-03-06 コニカミノルタホールディングス株式会社 有機el素子の製造方法
JP4224479B2 (ja) * 2005-09-07 2009-02-12 富士フイルム株式会社 パターン露光方法及び装置
JP5104107B2 (ja) * 2007-08-02 2012-12-19 ウシオ電機株式会社 帯状ワークの露光装置及び帯状ワークの露光装置におけるフォーカス調整方法
JP5117243B2 (ja) * 2008-03-27 2013-01-16 株式会社オーク製作所 露光装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11340120A (ja) * 1998-05-26 1999-12-10 Ushio Inc 裏面アライメント機能を備えた露光装置
JP2001235877A (ja) * 1999-12-14 2001-08-31 Sony Chem Corp 露光方法
JP2006235533A (ja) * 2005-02-28 2006-09-07 Nikon Corp 露光装置及びマイクロデバイスの製造方法
JP2007067355A (ja) * 2005-09-02 2007-03-15 Sharp Corp 基板表面処理装置および基板表面処理方法
JP2010014939A (ja) * 2008-07-03 2010-01-21 Nikon Corp 回路素子の製造装置及び製造方法

Also Published As

Publication number Publication date
CN102741754B (zh) 2015-12-02
TW201207980A (en) 2012-02-16
HK1171820A1 (zh) 2013-04-05
TW201535576A (zh) 2015-09-16
WO2011099563A1 (ja) 2011-08-18
JPWO2011099563A1 (ja) 2013-06-17
TWI557840B (zh) 2016-11-11
KR20180004833A (ko) 2018-01-12
KR101816327B1 (ko) 2018-01-08
CN102741754A (zh) 2012-10-17
KR101948467B1 (ko) 2019-02-14
TWI492326B (zh) 2015-07-11
KR20120138751A (ko) 2012-12-26

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