WO2009057332A1 - 回路接続方法 - Google Patents

回路接続方法 Download PDF

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Publication number
WO2009057332A1
WO2009057332A1 PCT/JP2008/051960 JP2008051960W WO2009057332A1 WO 2009057332 A1 WO2009057332 A1 WO 2009057332A1 JP 2008051960 W JP2008051960 W JP 2008051960W WO 2009057332 A1 WO2009057332 A1 WO 2009057332A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
conductive film
anisotropic conductive
electrode
connection
Prior art date
Application number
PCT/JP2008/051960
Other languages
English (en)
French (fr)
Inventor
Motohiro Arifuku
Kazuyoshi Kojima
Kouji Kobayashi
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to US12/740,801 priority Critical patent/US8132319B2/en
Priority to JP2009538956A priority patent/JP5131279B2/ja
Priority to CN2008800113074A priority patent/CN101653052B/zh
Priority to EP08710856A priority patent/EP2205052A4/en
Publication of WO2009057332A1 publication Critical patent/WO2009057332A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0594—Insulating resist or coating with special shaped edges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

　回路接続用異方導電フィルムを介して電気的に接続された回路電極間の接続抵抗を十分に低減することが可能な回路接続方法を提供する。 　回路接続方法は、ガラス基板１２ａ上に回路電極１２ｂが形成された回路部材１２を用意する工程と、基材１４ａ上に回路電極１４ｂが形成されると共に、回路電極１４ｂのうち回路電極１２ｂと接続される部分以外にソルダーレジスト１８が設けられたフレキシブル配線板１４を用意する工程と、回路接続用異方導電フィルム１６の一部がソルダーレジスト１８の一部と重なるように回路接続用異方導電フィルム１６を介して回路部材１２とフレキシブル配線板１４とを接合する工程とを備える。回路接続用異方導電フィルム１６の厚みｈ３は、回路電極１２ｂの高さｈ１と回路電極１４ｂの高さｈ２との合計以下である。
PCT/JP2008/051960 2007-10-30 2008-02-06 回路接続方法 WO2009057332A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/740,801 US8132319B2 (en) 2007-10-30 2008-02-06 Circuit connecting method
JP2009538956A JP5131279B2 (ja) 2007-10-30 2008-02-06 回路接続方法、回路接続構造体、及び回路接続構造体の製造方法
CN2008800113074A CN101653052B (zh) 2007-10-30 2008-02-06 电路连接方法
EP08710856A EP2205052A4 (en) 2007-10-30 2008-02-06 CIRCUIT CONNECTION METHOD

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007281611 2007-10-30
JP2007-281611 2007-10-30

Publications (1)

Publication Number Publication Date
WO2009057332A1 true WO2009057332A1 (ja) 2009-05-07

Family

ID=40590736

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051960 WO2009057332A1 (ja) 2007-10-30 2008-02-06 回路接続方法

Country Status (7)

Country Link
US (1) US8132319B2 (ja)
EP (1) EP2205052A4 (ja)
JP (2) JP2009135388A (ja)
KR (1) KR101151200B1 (ja)
CN (1) CN101653052B (ja)
TW (1) TW200919057A (ja)
WO (1) WO2009057332A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011059149A (ja) * 2009-09-07 2011-03-24 Hitachi Displays Ltd 電子機器
JP2012033597A (ja) * 2010-07-29 2012-02-16 Tokai Rubber Ind Ltd 配線体接続構造体

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101193757B1 (ko) * 2007-09-20 2012-10-23 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 이방성 도전막 및 그 제조 방법, 및 그 이방성 도전막을 이용한 접합체
JP5140816B2 (ja) * 2009-03-31 2013-02-13 デクセリアルズ株式会社 接合体及びその製造方法
JP5695881B2 (ja) * 2010-10-28 2015-04-08 デクセリアルズ株式会社 電子部品の接続方法及び接続構造体
JP5779931B2 (ja) * 2011-03-24 2015-09-16 富士通株式会社 半導体装置の製造方法
JP6119718B2 (ja) * 2013-11-19 2017-04-26 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体
CN110499119B (zh) * 2013-11-19 2023-07-18 迪睿合株式会社 各向异性导电性膜及连接构造体
JP2016178225A (ja) 2015-03-20 2016-10-06 デクセリアルズ株式会社 異方性導電接続構造体、異方性導電接続方法、及び異方性導電接着剤
CN105555023B (zh) * 2016-02-03 2016-11-09 武汉华尚绿能科技股份有限公司 高导通透明玻璃基电路板
JP6778585B2 (ja) * 2016-11-02 2020-11-04 日東電工株式会社 配線回路基板およびその製造方法
CN108366487A (zh) * 2018-01-30 2018-08-03 业成科技（成都）有限公司 电路板接合结构及电路板接合方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05303107A (ja) * 1992-04-28 1993-11-16 Nec Kagoshima Ltd 液晶表示装置の製造方法
JPH11148058A (ja) * 1997-11-17 1999-06-02 Seiko Epson Corp 異方導電性接着剤、それを用いた液晶表示装置および電子機器
JP2002358026A (ja) * 2001-03-26 2002-12-13 Sharp Corp 表示モジュール並びにフレキシブル配線板及びフレキシブル配線板の接続方法
JP2005310905A (ja) * 2004-04-19 2005-11-04 Sharp Corp 電子部品の接続構造

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4554033A (en) * 1984-10-04 1985-11-19 Amp Incorporated Method of forming an electrical interconnection means
US5502889A (en) * 1988-06-10 1996-04-02 Sheldahl, Inc. Method for electrically and mechanically connecting at least two conductive layers
US5235741A (en) * 1989-08-18 1993-08-17 Semiconductor Energy Laboratory Co., Ltd. Electrical connection and method for making the same
JP2657429B2 (ja) * 1990-04-09 1997-09-24 株式会社ミクロ技術研究所 基板の回路実装方法及びその方法に使用する回路基板
JPH04301817A (ja) * 1991-03-29 1992-10-26 Rohm Co Ltd 液晶表示装置とその製造方法
JPH09148731A (ja) * 1995-11-17 1997-06-06 Fujitsu Ltd 配線基板間の接続構造の製造方法
US5839188A (en) * 1996-01-05 1998-11-24 Alliedsignal Inc. Method of manufacturing a printed circuit assembly
US5903056A (en) * 1997-04-21 1999-05-11 Lucent Technologies Inc. Conductive polymer film bonding technique
JP3678547B2 (ja) * 1997-07-24 2005-08-03 ソニーケミカル株式会社 多層異方導電性接着剤およびその製造方法
JP3804269B2 (ja) 1998-03-31 2006-08-02 カシオ計算機株式会社 フレキシブル配線基板の接合構造
JP2001031929A (ja) * 1999-07-21 2001-02-06 Sony Chem Corp 接続構造体
JP4492148B2 (ja) 2004-02-18 2010-06-30 日立化成工業株式会社 回路接続方法
JP2006012992A (ja) * 2004-06-23 2006-01-12 Sharp Corp 回路基板の電極接続構造
JP4968665B2 (ja) * 2006-04-18 2012-07-04 Ｎｌｔテクノロジー株式会社 フラットディスプレイパネル及び接続構造

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05303107A (ja) * 1992-04-28 1993-11-16 Nec Kagoshima Ltd 液晶表示装置の製造方法
JPH11148058A (ja) * 1997-11-17 1999-06-02 Seiko Epson Corp 異方導電性接着剤、それを用いた液晶表示装置および電子機器
JP2002358026A (ja) * 2001-03-26 2002-12-13 Sharp Corp 表示モジュール並びにフレキシブル配線板及びフレキシブル配線板の接続方法
JP2005310905A (ja) * 2004-04-19 2005-11-04 Sharp Corp 電子部品の接続構造

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2205052A4 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011059149A (ja) * 2009-09-07 2011-03-24 Hitachi Displays Ltd 電子機器
JP2012033597A (ja) * 2010-07-29 2012-02-16 Tokai Rubber Ind Ltd 配線体接続構造体

Also Published As

Publication number Publication date
TWI372935B (ja) 2012-09-21
CN101653052B (zh) 2012-11-14
JPWO2009057332A1 (ja) 2011-03-10
JP5131279B2 (ja) 2013-01-30
CN101653052A (zh) 2010-02-17
KR101151200B1 (ko) 2012-06-08
US8132319B2 (en) 2012-03-13
EP2205052A4 (en) 2011-03-09
KR20090122282A (ko) 2009-11-26
JP2009135388A (ja) 2009-06-18
US20100263208A1 (en) 2010-10-21
TW200919057A (en) 2009-05-01
EP2205052A1 (en) 2010-07-07

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