CN105555023B - 高导通透明玻璃基电路板 - Google Patents
高导通透明玻璃基电路板 Download PDFInfo
- Publication number
- CN105555023B CN105555023B CN201610076820.8A CN201610076820A CN105555023B CN 105555023 B CN105555023 B CN 105555023B CN 201610076820 A CN201610076820 A CN 201610076820A CN 105555023 B CN105555023 B CN 105555023B
- Authority
- CN
- China
- Prior art keywords
- glass substrate
- conducting
- powder
- conducting wire
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
- H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0511—Diffusion patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1194—Thermal treatment leading to a different chemical state of a material, e.g. annealing for stress-relief, aging
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Dispersion Chemistry (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Surface Treatment Of Glass (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
Claims (3)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610076820.8A CN105555023B (zh) | 2016-02-03 | 2016-02-03 | 高导通透明玻璃基电路板 |
US16/073,459 US10512170B2 (en) | 2016-02-03 | 2016-12-29 | Highly conductive transparent glass-based circuit board |
EP16889168.7A EP3413693B1 (en) | 2016-02-03 | 2016-12-29 | Highly conductive transparent glass-based circuit board |
PCT/CN2016/113186 WO2017133362A1 (zh) | 2016-02-03 | 2016-12-29 | 高导通透明玻璃基电路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610076820.8A CN105555023B (zh) | 2016-02-03 | 2016-02-03 | 高导通透明玻璃基电路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105555023A CN105555023A (zh) | 2016-05-04 |
CN105555023B true CN105555023B (zh) | 2016-11-09 |
Family
ID=55833878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610076820.8A Active CN105555023B (zh) | 2016-02-03 | 2016-02-03 | 高导通透明玻璃基电路板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10512170B2 (zh) |
EP (1) | EP3413693B1 (zh) |
CN (1) | CN105555023B (zh) |
WO (1) | WO2017133362A1 (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105555023B (zh) * | 2016-02-03 | 2016-11-09 | 武汉华尚绿能科技股份有限公司 | 高导通透明玻璃基电路板 |
CN107492528A (zh) * | 2016-06-13 | 2017-12-19 | 恩智浦美国有限公司 | 具有石墨烯条带的柔性半导体装置 |
CN106097913A (zh) * | 2016-08-18 | 2016-11-09 | 武汉华尚绿能科技股份有限公司 | 一种透明玻璃基显示屏及其制备工艺 |
CN106304623B (zh) * | 2016-08-18 | 2018-04-17 | 武汉华尚绿能科技股份有限公司 | 一种透明玻璃基双层电路板 |
CN108541135B (zh) * | 2018-04-11 | 2019-08-27 | 重庆市中光电显示技术有限公司 | 耐腐蚀高导电的铜基导电线路及其成型工艺 |
CN109982516A (zh) * | 2019-03-15 | 2019-07-05 | 广东石油化工学院 | 真空烧结沉淀分离玻璃基板电路板及其制备方法 |
CN111613709A (zh) * | 2020-05-27 | 2020-09-01 | 深圳市华星光电半导体显示技术有限公司 | 迷你发光二极管背光模组、其制作方法及显示装置 |
CN112908200B (zh) * | 2021-04-13 | 2023-05-09 | 珠海华萃科技有限公司 | 柔性透明led显示屏制作工艺 |
CN113594340A (zh) * | 2021-07-30 | 2021-11-02 | 巨晶(广东)新材料科技有限公司 | 一种灯珠焊盘与玻璃屏的电性连接工艺 |
CN113873788A (zh) * | 2021-10-09 | 2021-12-31 | 深圳市百柔新材料技术有限公司 | 一种多层玻璃基板的制备方法、玻璃基板及Mini-LED玻璃基板 |
CN114716158A (zh) * | 2022-02-22 | 2022-07-08 | 上海沚明电子材料有限公司 | 导电玻璃基板及其制备方法、玻璃显示装置 |
CN115637428A (zh) * | 2022-10-28 | 2023-01-24 | 东莞仁海科技股份有限公司 | 玻璃基pcb板制备工艺 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101330088A (zh) * | 2007-06-21 | 2008-12-24 | 精材科技股份有限公司 | 集成电路封装体及其制作方法 |
CN202514157U (zh) * | 2012-03-28 | 2012-10-31 | 成都多吉昌新材料有限公司 | 一种环保led软灯条线路板结构 |
CN103508759A (zh) * | 2012-06-26 | 2014-01-15 | 比亚迪股份有限公司 | 一种大功率led底座的制备方法和大功率led底座 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3910527B2 (ja) * | 2002-03-13 | 2007-04-25 | シャープ株式会社 | 液晶表示装置およびその製造方法 |
JP2009135388A (ja) * | 2007-10-30 | 2009-06-18 | Hitachi Chem Co Ltd | 回路接続方法 |
CN102760934B (zh) * | 2012-07-26 | 2015-08-05 | 深圳市圣龙特电子有限公司 | 厚膜电路用导体浆料、应用该浆料的厚膜电路板及其制造方法 |
CN203149521U (zh) * | 2013-03-01 | 2013-08-21 | 南昌欧菲光科技有限公司 | 导电玻璃基板 |
US10672531B2 (en) * | 2014-07-22 | 2020-06-02 | Alpha Assembly Solutions Inc. | Stretchable interconnects for flexible electronic surfaces |
CN104464883B (zh) * | 2014-12-26 | 2017-02-22 | 苏州格瑞丰纳米科技有限公司 | 表面吸附分散剂的石墨烯导电浆料、其制备方法及应用 |
CN105047255B (zh) * | 2015-07-30 | 2017-03-22 | 江苏国瓷泓源光电科技有限公司 | 一种含高分散石墨烯的晶硅太阳能电池铝浆及其制备方法 |
CN105555023B (zh) * | 2016-02-03 | 2016-11-09 | 武汉华尚绿能科技股份有限公司 | 高导通透明玻璃基电路板 |
CN205430773U (zh) * | 2016-02-03 | 2016-08-03 | 武汉华尚绿能科技股份有限公司 | 一种高导通透明玻璃基电路板 |
-
2016
- 2016-02-03 CN CN201610076820.8A patent/CN105555023B/zh active Active
- 2016-12-29 EP EP16889168.7A patent/EP3413693B1/en active Active
- 2016-12-29 WO PCT/CN2016/113186 patent/WO2017133362A1/zh active Application Filing
- 2016-12-29 US US16/073,459 patent/US10512170B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101330088A (zh) * | 2007-06-21 | 2008-12-24 | 精材科技股份有限公司 | 集成电路封装体及其制作方法 |
CN202514157U (zh) * | 2012-03-28 | 2012-10-31 | 成都多吉昌新材料有限公司 | 一种环保led软灯条线路板结构 |
CN103508759A (zh) * | 2012-06-26 | 2014-01-15 | 比亚迪股份有限公司 | 一种大功率led底座的制备方法和大功率led底座 |
Also Published As
Publication number | Publication date |
---|---|
US10512170B2 (en) | 2019-12-17 |
CN105555023A (zh) | 2016-05-04 |
US20190327839A1 (en) | 2019-10-24 |
EP3413693A1 (en) | 2018-12-12 |
EP3413693A4 (en) | 2019-10-16 |
EP3413693B1 (en) | 2022-03-16 |
WO2017133362A1 (zh) | 2017-08-10 |
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C06 | Publication | ||
PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information |
Inventor after: Liu Lianjia Inventor after: Gai Qingliang Inventor after: You Xiaojiang Inventor before: You Xiaojiang |
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COR | Change of bibliographic data | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220919 Address after: Unit 401, Building 1, Qingdao World Financial Center Building, No. 19, Qinling Road, Laoshan District, Qingdao City, Shandong Province, 266100 Patentee after: Huashang Optoelectronics Technology Co.,Ltd. Address before: Room 325, Building 2, Smart Building, Block 0601, Jianghan Economic Development Zone, Jianghan District, Wuhan City, Hubei Province, 430000 Patentee before: WUHAN HUASHANG GREEN TECHNOLOGY Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230817 Address after: Room 325, Building 2, Smart Building, Block 0601, Jianghan Economic Development Zone, Jianghan District, Wuhan City, Hubei Province, 430000 Patentee after: WUHAN HUASHANG GREEN TECHNOLOGY Co.,Ltd. Address before: Unit 401, Building 1, Qingdao World Financial Center Building, No. 19, Qinling Road, Laoshan District, Qingdao City, Shandong Province, 266100 Patentee before: Huashang Optoelectronics Technology Co.,Ltd. |
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TR01 | Transfer of patent right |