CN106304623B - 一种透明玻璃基双层电路板 - Google Patents
一种透明玻璃基双层电路板 Download PDFInfo
- Publication number
- CN106304623B CN106304623B CN201610694485.8A CN201610694485A CN106304623B CN 106304623 B CN106304623 B CN 106304623B CN 201610694485 A CN201610694485 A CN 201610694485A CN 106304623 B CN106304623 B CN 106304623B
- Authority
- CN
- China
- Prior art keywords
- glass substrate
- layer
- circuit board
- glass
- mortise
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610694485.8A CN106304623B (zh) | 2016-08-18 | 2016-08-18 | 一种透明玻璃基双层电路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610694485.8A CN106304623B (zh) | 2016-08-18 | 2016-08-18 | 一种透明玻璃基双层电路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106304623A CN106304623A (zh) | 2017-01-04 |
CN106304623B true CN106304623B (zh) | 2018-04-17 |
Family
ID=57661609
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610694485.8A Active CN106304623B (zh) | 2016-08-18 | 2016-08-18 | 一种透明玻璃基双层电路板 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106304623B (zh) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69412952T2 (de) * | 1993-09-21 | 1999-05-12 | Matsushita Electric Ind Co Ltd | Verbindungsteil eines Schaltungssubstrats und Verfahren zur Herstellung mehrschichtiger Schaltungssubstrate unter Verwendung dieses Teils |
JP2005243911A (ja) * | 2004-02-26 | 2005-09-08 | Mitsui Mining & Smelting Co Ltd | 多層積層配線板 |
TWI459436B (zh) * | 2008-10-27 | 2014-11-01 | Tpk Touch Solutions Inc | The Method of Making Double - sided Graphic Structure of Touch Circuit |
CN203215600U (zh) * | 2013-04-17 | 2013-09-25 | 浙江俊尔新材料股份有限公司 | 一种led灯灯座串联装置 |
CN105555023B (zh) * | 2016-02-03 | 2016-11-09 | 武汉华尚绿能科技股份有限公司 | 高导通透明玻璃基电路板 |
-
2016
- 2016-08-18 CN CN201610694485.8A patent/CN106304623B/zh active Active
Also Published As
Publication number | Publication date |
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CN106304623A (zh) | 2017-01-04 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220914 Address after: Unit 401, Building 1, Qingdao World Financial Center Building, No. 19, Qinling Road, Laoshan District, Qingdao City, Shandong Province, 266100 Patentee after: Huashang Optoelectronics Technology Co.,Ltd. Address before: Room 4901, Minsheng Bank Building, No. 396, Qushui Building, Xinhua Road, Jianghan District, Wuhan City, Hubei Province 430000 Patentee before: WUHAN HUASHANG GREEN TECHNOLOGY Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230830 Address after: Room 325, Building 2, Smart Building, Block 0601, Jianghan Economic Development Zone, Jianghan District, Wuhan City, Hubei Province, 430000 Patentee after: WUHAN HUASHANG GREEN TECHNOLOGY Co.,Ltd. Address before: Unit 401, Building 1, Qingdao World Financial Center Building, No. 19, Qinling Road, Laoshan District, Qingdao City, Shandong Province, 266100 Patentee before: Huashang Optoelectronics Technology Co.,Ltd. |
|
TR01 | Transfer of patent right |