WO2009008294A1 - 大型ペリクルの枠体及び該枠体の把持方法 - Google Patents

大型ペリクルの枠体及び該枠体の把持方法 Download PDF

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Publication number
WO2009008294A1
WO2009008294A1 PCT/JP2008/061945 JP2008061945W WO2009008294A1 WO 2009008294 A1 WO2009008294 A1 WO 2009008294A1 JP 2008061945 W JP2008061945 W JP 2008061945W WO 2009008294 A1 WO2009008294 A1 WO 2009008294A1
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WO
WIPO (PCT)
Prior art keywords
frame
grasping
pellicle
large pellicle
protrusions
Prior art date
Application number
PCT/JP2008/061945
Other languages
English (en)
French (fr)
Inventor
Akihiro Tanimura
Takuro Maeda
Original Assignee
Asahi Kasei E-Materials Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E-Materials Corporation filed Critical Asahi Kasei E-Materials Corporation
Priority to KR1020127015729A priority Critical patent/KR101264571B1/ko
Priority to KR1020097026229A priority patent/KR101191055B1/ko
Priority to CN200880023582.8A priority patent/CN101689018B/zh
Publication of WO2009008294A1 publication Critical patent/WO2009008294A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Sustainable Development (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

　複数の辺からなる多角形形状を有する枠体と、該枠体の上縁面に接着されたペリクル膜と、該枠体の下縁面に塗着された粘着材とからなり、前記枠体の最も長い辺の長さが１ｍ以上である大型ペリクルの前記枠体を把持するにあたって、前記枠体はすべての辺部にそれぞれ把持用の凸部または凹部を有する枠体であって、前記枠体の各辺部においてそれぞれ少なくとも１箇所以上の把持用の凸部または凹部を同時に把持することによって、枠体を確実に把持し、かつ、フォトマスク等に貼り付ける際には歪みやたわみを発生させることなく収納容器からペリクルを簡単に取り出すことを可能にする。
PCT/JP2008/061945 2007-07-06 2008-07-02 大型ペリクルの枠体及び該枠体の把持方法 WO2009008294A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020127015729A KR101264571B1 (ko) 2007-07-06 2008-07-02 대형 펠리클 프레임체 및 그 프레임체의 파지 방법
KR1020097026229A KR101191055B1 (ko) 2007-07-06 2008-07-02 대형 펠리클 프레임체 및 그 프레임체의 파지 방법
CN200880023582.8A CN101689018B (zh) 2007-07-06 2008-07-02 大型表膜构件的框体及该框体的把持方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007179041 2007-07-06
JP2007179054 2007-07-06
JP2007-179054 2007-07-06
JP2007-179041 2007-07-06

Publications (1)

Publication Number Publication Date
WO2009008294A1 true WO2009008294A1 (ja) 2009-01-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/061945 WO2009008294A1 (ja) 2007-07-06 2008-07-02 大型ペリクルの枠体及び該枠体の把持方法

Country Status (5)

Country Link
JP (2) JP2010102357A (ja)
KR (2) KR101264571B1 (ja)
CN (2) CN102681334B (ja)
TW (2) TWI498671B (ja)
WO (1) WO2009008294A1 (ja)

Cited By (21)

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JP2009128635A (ja) * 2007-11-22 2009-06-11 Shin Etsu Chem Co Ltd ペリクル、ペリクルを収納するペリクル収納容器ならびにペリクル収納容器内にペリクルを保管する方法
JP2009288265A (ja) * 2008-05-27 2009-12-10 Shin-Etsu Chemical Co Ltd リソグラフィ用ペリクル
WO2010029997A1 (ja) * 2008-09-12 2010-03-18 旭化成イーマテリアルズ株式会社 ペリクル枠体、ペリクル及びペリクル枠体の使用方法
CN101930166A (zh) * 2009-06-24 2010-12-29 信越化学工业株式会社 防护膜框架及光刻用防护膜
CN101995764A (zh) * 2009-08-06 2011-03-30 信越化学工业株式会社 防尘薄膜组件收纳容器
CN102053483A (zh) * 2009-10-30 2011-05-11 信越化学工业株式会社 防尘薄膜组件框架及防尘薄膜组件
JP2012093595A (ja) * 2010-10-28 2012-05-17 Shin Etsu Chem Co Ltd ペリクルフレームおよびペリクル
EP2267527A3 (en) * 2009-06-24 2013-04-03 Shin-Etsu Chemical Co., Ltd. Pellicle frame and lithographic pellicle
US8685598B2 (en) 2009-10-07 2014-04-01 Mitsui Chemicals, Inc. Pellicle and mask adhesive therefor
JP2014211591A (ja) * 2013-04-22 2014-11-13 信越化学工業株式会社 ペリクルおよびこのペリクルを装着するフォトマスク
JP2015036791A (ja) * 2013-08-15 2015-02-23 旭化成イーマテリアルズ株式会社 ペリクル枠体及びペリクル
CN104471479A (zh) * 2012-08-02 2015-03-25 三井化学株式会社 防护膜组件
JP2016062055A (ja) * 2014-09-22 2016-04-25 信越化学工業株式会社 ペリクルフレームおよびペリクル
JP2017151130A (ja) * 2016-02-22 2017-08-31 信越化学工業株式会社 ペリクル収納容器
EP3249467A1 (en) * 2016-05-26 2017-11-29 Shin-Etsu Chemical Co., Ltd. A pellicle
EP3470922A1 (en) * 2017-10-10 2019-04-17 Shin-Etsu Chemical Co., Ltd. Pellicle frame, pellicle, and method for peeling pellicle
US10488751B2 (en) * 2014-09-19 2019-11-26 Mitsui Chemicals, Inc. Pellicle, production method thereof, exposure method
US10585348B2 (en) 2014-09-19 2020-03-10 Mitsui Chemicals, Inc. Pellicle, pellicle production method and exposure method using pellicle
EP3690546A1 (en) * 2019-02-01 2020-08-05 Shin-Etsu Chemical Co., Ltd. Pellicle frame and pellicle
US20210173298A1 (en) * 2017-12-12 2021-06-10 Nippon Light Metal Company, Ltd. Pellicle frame body for flat panel display (fpd) and manufacturing method therefor
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JP5618888B2 (ja) * 2011-04-04 2014-11-05 信越化学工業株式会社 ペリクル及びペリクル膜の製造方法
JP5663376B2 (ja) * 2011-04-04 2015-02-04 信越化学工業株式会社 ペリクルフレーム、その製造方法、及びペリクル
JP5940283B2 (ja) * 2011-11-04 2016-06-29 信越化学工業株式会社 ペリクル
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JP5864399B2 (ja) * 2012-10-22 2016-02-17 信越化学工業株式会社 ペリクル収納容器
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KR101918687B1 (ko) 2014-01-28 2018-11-14 삼성전자주식회사 펠리클
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JP6706575B2 (ja) * 2016-12-22 2020-06-10 信越化学工業株式会社 ペリクルフレーム及びこれを用いたペリクル
JP6968259B2 (ja) * 2018-03-05 2021-11-17 三井化学株式会社 ペリクル、露光原版、露光装置、及び半導体装置の製造方法
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JP2009128635A (ja) * 2007-11-22 2009-06-11 Shin Etsu Chem Co Ltd ペリクル、ペリクルを収納するペリクル収納容器ならびにペリクル収納容器内にペリクルを保管する方法
JP2009288265A (ja) * 2008-05-27 2009-12-10 Shin-Etsu Chemical Co Ltd リソグラフィ用ペリクル
JP4886070B2 (ja) * 2008-09-12 2012-02-29 旭化成イーマテリアルズ株式会社 ペリクル枠体、ペリクル及びペリクル枠体の使用方法
WO2010029997A1 (ja) * 2008-09-12 2010-03-18 旭化成イーマテリアルズ株式会社 ペリクル枠体、ペリクル及びペリクル枠体の使用方法
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CN101930166A (zh) * 2009-06-24 2010-12-29 信越化学工业株式会社 防护膜框架及光刻用防护膜
EP2267527A3 (en) * 2009-06-24 2013-04-03 Shin-Etsu Chemical Co., Ltd. Pellicle frame and lithographic pellicle
CN101995764A (zh) * 2009-08-06 2011-03-30 信越化学工业株式会社 防尘薄膜组件收纳容器
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KR20120074334A (ko) 2012-07-05
CN101689018A (zh) 2010-03-31
TWI641904B (zh) 2018-11-21
KR101191055B1 (ko) 2012-10-15
JP5792274B2 (ja) 2015-10-07
TW201523125A (zh) 2015-06-16
CN102681334A (zh) 2012-09-19
CN102681334B (zh) 2015-09-30
TWI498671B (zh) 2015-09-01
JP2014098913A (ja) 2014-05-29
CN101689018B (zh) 2013-03-20
KR20100028040A (ko) 2010-03-11
JP2010102357A (ja) 2010-05-06

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