WO2008132212A3 - Elektrisches bauelement - Google Patents

Elektrisches bauelement Download PDF

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Publication number
WO2008132212A3
WO2008132212A3 PCT/EP2008/055255 EP2008055255W WO2008132212A3 WO 2008132212 A3 WO2008132212 A3 WO 2008132212A3 EP 2008055255 W EP2008055255 W EP 2008055255W WO 2008132212 A3 WO2008132212 A3 WO 2008132212A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrical component
component
carrier substrate
transmission line
chip
Prior art date
Application number
PCT/EP2008/055255
Other languages
English (en)
French (fr)
Other versions
WO2008132212A2 (de
Inventor
Juergen Kiwitt
Maximilian Pitschi
Christian Bauer
Robert Koch
Original Assignee
Epcos Ag
Juergen Kiwitt
Maximilian Pitschi
Christian Bauer
Robert Koch
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos Ag, Juergen Kiwitt, Maximilian Pitschi, Christian Bauer, Robert Koch filed Critical Epcos Ag
Priority to JP2010504733A priority Critical patent/JP5156825B2/ja
Priority to KR1020097024503A priority patent/KR101531723B1/ko
Publication of WO2008132212A2 publication Critical patent/WO2008132212A2/de
Publication of WO2008132212A3 publication Critical patent/WO2008132212A3/de
Priority to US12/606,417 priority patent/US8558356B2/en

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H03H9/0561—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement consisting of a multilayered structure
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
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    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H03H9/0557—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the other elements being buried in the substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
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    • H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

Es wird ein stabiles, elektrisches Bauelement mit einem Trägersubstrat (1) und einem auf diesem montierten Chip (2) angegeben. Das Bauelement weist ein Reaktanzelement und ein Stützelement auf, die zumindest teilweise zwischen dem Trägersubstrat (1) und dem Chip (2) angeordnet sind. Das Reaktanzelement ist zumindest teilweise mittels mindestens einer Leiterbahn (31) realisiert. Das Reaktanzelement umfasst mindestens ein Element, ausgewählt aus mindestens einer Spule, mindestens einem Kondensator und mindestens einer Übertragungsleitung. Als Übertragungsleitung wird eine Leitung bezeichnet, die bei einer Durchlassfrequenz des Bauelements eine Phasendrehung von mindestens 30 Grad bewirkt.
PCT/EP2008/055255 2007-04-30 2008-04-29 Elektrisches bauelement WO2008132212A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010504733A JP5156825B2 (ja) 2007-04-30 2008-04-29 電気部品
KR1020097024503A KR101531723B1 (ko) 2007-04-30 2008-04-29 전기 구성요소
US12/606,417 US8558356B2 (en) 2007-04-30 2009-10-27 Electrical Component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007020288.3 2007-04-30
DE102007020288A DE102007020288B4 (de) 2007-04-30 2007-04-30 Elektrisches Bauelement

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/606,417 Continuation US8558356B2 (en) 2007-04-30 2009-10-27 Electrical Component

Publications (2)

Publication Number Publication Date
WO2008132212A2 WO2008132212A2 (de) 2008-11-06
WO2008132212A3 true WO2008132212A3 (de) 2009-02-05

Family

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PCT/EP2008/055255 WO2008132212A2 (de) 2007-04-30 2008-04-29 Elektrisches bauelement

Country Status (5)

Country Link
US (1) US8558356B2 (de)
JP (1) JP5156825B2 (de)
KR (1) KR101531723B1 (de)
DE (1) DE102007020288B4 (de)
WO (1) WO2008132212A2 (de)

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JP6669429B2 (ja) * 2014-12-25 2020-03-18 京セラ株式会社 弾性波素子および通信装置
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Citations (3)

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WO2008132212A2 (de) 2008-11-06
KR101531723B1 (ko) 2015-06-25
JP5156825B2 (ja) 2013-03-06
DE102007020288B4 (de) 2013-12-12
US20100091473A1 (en) 2010-04-15
DE102007020288A1 (de) 2008-11-06
KR20100023816A (ko) 2010-03-04
JP2010526456A (ja) 2010-07-29

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